CN115657229B - Optical module and co-packaged optical system - Google Patents
Optical module and co-packaged optical system Download PDFInfo
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- CN115657229B CN115657229B CN202211706500.8A CN202211706500A CN115657229B CN 115657229 B CN115657229 B CN 115657229B CN 202211706500 A CN202211706500 A CN 202211706500A CN 115657229 B CN115657229 B CN 115657229B
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Abstract
The invention discloses an optical module and a co-packaged optical system, wherein the optical module comprises a first circuit substrate, a grating coupling photoelectric chip and an optical coupling assembly; the first circuit substrate comprises a first opening, the back surface of the first circuit substrate comprises a bonding pad area and a non-bonding pad area, and the first opening is arranged corresponding to the non-bonding pad area and penetrates through the first circuit substrate; the grating coupling photoelectric chip is reversely mounted on the back of the first circuit substrate and is electrically connected with the first circuit substrate; the grating coupling photoelectric chip comprises an optical signal output area, and the first opening exposes the optical signal output area; the optical coupling assembly comprises an optical signal receiving end, wherein the optical signal receiving end is positioned in the first opening and is opposite to the optical signal output area. The technical scheme of the embodiment of the invention can reduce the insertion loss of the high-frequency circuit and improve the high-frequency performance.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an optical module and a co-packaged optical system.
Background
A Co-packaged optical (Co-packaged optical, abbreviated as CPO) system packages a CPO module and an ASIC (Application Specific Integrated Circuit) of a switch together, and brings the distance between the CPO module and the ASIC closer, so that the power consumption of the whole system can be effectively reduced, the signal density is improved, the time delay is reduced, and the minimum signal distortion is ensured. The CPO module may also be referred to as an optical module/an optical transceiver module/a photoelectric conversion module, and is specifically configured to perform photoelectric conversion, so as to implement data communication between chips by using an optical signal carrying information.
Currently, most Electronic and photonic Integrated circuits (Electronic and photonic Integrated circuits, EPICs, referred to as optoelectronic chips) of CPO modules integrate an end-face coupler (edge coupler), that is, the coupler is located at the edge of the optoelectronic chip (hereinafter referred to as an end-face coupled optoelectronic chip) to couple an optical signal carrying information to an optical waveguide (such as an optical fiber) for data transmission. However, this design requires electrical connection between the optoelectronic chip and the circuit board through a lead wire, which increases the insertion loss of the high-frequency circuit and affects the high-frequency performance in the application of the high-speed optical module.
Disclosure of Invention
The invention provides an optical module and a co-packaged optical system, which are used for reducing the insertion loss of a high-frequency circuit and improving the high-frequency performance.
In a first aspect, an embodiment of the present invention provides an optical module, including:
a first circuit substrate; the first circuit substrate comprises a first opening, the back surface of the first circuit substrate comprises a bonding pad area and a non-bonding pad area, and the first opening is arranged corresponding to the non-bonding pad area and penetrates through the first circuit substrate;
a grating coupling photoelectric chip; the grating coupling photoelectric chip is reversely mounted on the back of the first circuit substrate and is electrically connected with the first circuit substrate; the grating coupling photoelectric chip comprises an optical signal output area, and the first opening exposes the optical signal output area;
an optical coupling assembly; the optical coupling assembly comprises an optical signal receiving end, wherein the optical signal receiving end is positioned in the first opening and is opposite to the optical signal output area.
Optionally, the optical coupling assembly comprises an array of optical fibers and at least one connector;
the optical fiber array comprises an optical coupling substrate and a plurality of optical fibers, wherein first end parts of the optical fibers are positioned in the optical coupling substrate, and second end parts of the optical fibers are connected with the connector;
the first cross section of the optical coupling substrate is L-shaped, and the first cross section is vertical to the plane of the first circuit substrate; the first end part comprises a first optical fiber section, a second optical fiber section and a third optical fiber section which is connected with the first optical fiber section and the second optical fiber section, the extension direction of the first optical fiber section is perpendicular to the plane of the first circuit substrate and opposite to the optical signal output area, the second optical fiber section is positioned on one side of the first optical fiber section, which is far away from the first circuit substrate, and the extension direction of the second optical fiber section is parallel to the plane of the first circuit substrate.
Optionally, the optical module further comprises a first housing and a second housing;
the first shell comprises a first shell subsection and a second shell subsection, the first shell subsection comprises a second opening and a frame part, and the frame part and the second shell subsection are of an integrated structure;
the first circuit substrate is positioned on the first side of the first shell and fixed on the frame part, and the second opening exposes the top surface of the first circuit substrate;
the optical coupling assembly is positioned on the second side of the first shell, and at least part of the optical coupling substrate is positioned in the second opening; a second housing section for supporting an optical fibre; the first side is opposite to the second side;
the second shell is positioned on one side of the optical coupling component far away from the first shell; the second shell comprises a groove, the optical coupling substrate, the first shell and the first circuit substrate are all embedded in the groove, and the connector and part of the optical fibers are located outside the second shell.
Optionally, the first housing and the second housing have correspondingly arranged screw holes for mounting screws.
Optionally, a plurality of first pads are disposed in the pad region of the first circuit substrate;
the grating coupling photoelectric chip comprises a plurality of second bonding pads, and the second bonding pads and the optical signal output area are positioned on the same side of the grating coupling photoelectric chip; the second pad is electrically connected to the first pad.
In a second aspect, the present invention provides a co-packaged optical system, including a switch chip, a second circuit substrate, and a plurality of optical modules according to any of the embodiments of the present invention;
the switch chip and the optical module are electrically connected through the second circuit substrate.
Optionally, the light module further includes a first light source chip;
the first light source chip is fixed on the grating coupling photoelectric chip and is communicated with the grating coupling photoelectric chip to form a light path, and the first light source chip is also electrically connected with the first circuit substrate through a lead and is used for sending a light source signal to the grating coupling photoelectric chip;
the grating coupling photoelectric chip is used for converting the high-frequency electric signal into a high-frequency optical signal based on the light source signal and the high-frequency electric signal sent by the switch chip, and coupling the high-frequency optical signal into the optical coupling assembly for transmission.
Optionally, the grating coupling photoelectric chip and the second light source chip form a light path communication through an optical fiber to receive a light source signal sent by the second light source chip;
the second light source chip is located outside the light module.
Optionally, the second circuit substrate includes a central area and an edge area surrounding the central area, the switch chip is located in the central area, and the optical module is located in the edge area.
Optionally, a plurality of electrical connectors are disposed in the edge region, and the electrical connectors are used for carrying the optical module and are electrically connected to the first circuit substrate and the second circuit substrate, respectively.
According to the technical scheme of the embodiment of the invention, the first opening is arranged in the first circuit substrate corresponding to the non-soldering area, the grating coupling photoelectric chip is inversely mounted on the back surface of the first circuit substrate and is electrically connected with the first circuit substrate, and the optical signal output area of the grating coupling photoelectric chip is exposed through the first opening, so that the optical coupling assembly can be coupled with the grating coupling photoelectric chip to realize signal transmission, the realizability is provided for the grating coupling photoelectric chip as a photoelectric engine to be applied to an optical module, and simultaneously, the loss of a high-frequency circuit can be reduced and the high-frequency performance of the high-speed optical module can be optimized due to the inversely mounted electrical connection mode of the grating coupling photoelectric chip.
It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present invention, nor do they necessarily limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic back structure diagram of a first circuit substrate in an optical module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an optical module according to an embodiment of the present invention;
fig. 3 is an exploded view of an optical module according to an embodiment of the present invention;
fig. 4 and fig. 5 are schematic diagrams illustrating a design principle of an optical module according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a co-packaged optical system according to an embodiment of the present invention;
FIG. 7 is an enlarged partial schematic view of the co-packaged optical system of FIG. 6;
fig. 8 is a schematic structural diagram of another optical module according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic diagram of a back surface structure of a first circuit substrate in an optical module according to an embodiment of the present invention, fig. 2 is a schematic diagram of a structure of an optical module according to an embodiment of the present invention, and with reference to fig. 1 and fig. 2, an optical module 10 according to an embodiment of the present invention includes a first circuit substrate 1, a grating-coupled optoelectronic chip 2, and an optical coupling component 3; the first circuit substrate 1 comprises a first opening 11, the back surface F1 of the first circuit substrate 1 comprises a pad area S1 and a non-pad area S2, and the first opening 11 is arranged corresponding to the non-pad area S2 and penetrates through the first circuit substrate 1; the grating coupling photoelectric chip 2 is reversely mounted on the back surface F1 of the first circuit substrate 1 and is electrically connected with the first circuit substrate 1; the grating coupling photoelectric chip 2 comprises an optical signal output area S3, and the first opening 11 exposes the optical signal output area S3; the optical coupling module 3 includes an optical signal receiving end, which is located in the first opening 11 and opposite to the optical signal output region S3.
In short, the working principle of the optical module is as follows: the high-frequency transmission line is arranged in the first circuit substrate 1 and can transmit a high-frequency electric signal to the grating coupling photoelectric chip 2, the grating coupling photoelectric chip 2 can convert the high-frequency electric signal into a high-frequency optical signal (namely, an optical signal carrying information) after receiving the high-frequency electric signal and a light source signal, the high-frequency optical signal is coupled to the optical coupling component 3, the high-frequency optical signal is transmitted outwards through an optical fiber in the optical coupling component 3, and signal transmission of a data center is achieved.
The high-frequency electrical signal is provided by the switch chip, and is described in detail later based on the co-packaged optical system, which is not described herein again. The light source signal can be provided by an internal light source device, i.e. a light source device integrated inside the optical module, or an external light source device, i.e. a light source device arranged outside the optical module. Specifically, when the switch chip provides the high-frequency electrical signal to the grating coupling optoelectronic chip 2, the light source device provides the light source signal (simple optical signal) to the grating coupling optoelectronic chip 2, so, the grating coupling optoelectronic chip 2 can convert the high-frequency electrical signal into the high-frequency optical signal carrying information through photoelectric modulation according to the light source signal and the high-frequency electrical signal, realize photoelectric conversion, and then carry out the transmission of the high-frequency optical signal through the optical coupling component 3, and vice versa.
In this embodiment, the optical coupling component 3 may specifically be a Fiber Array (FA) based on a V-groove, and is configured to receive a high-frequency optical signal output by the grating-coupled optoelectronic chip 2, and a detailed description is subsequently made on a specific structure of the optical coupling component 3.
In this embodiment, the grating coupled optoelectronic chip 2 specifically refers to an electronic and photonic integrated circuit integrated with a grating coupler (grating coupler), and the grating coupled optoelectronic chip may be electrically connected to the first circuit substrate 1 in an inverted mounting manner, and the grating coupled optoelectronic chip is used as an optoelectronic engine of the optical module, so that loss of a high-frequency circuit caused by wire bonding of the existing end-face coupled optoelectronic chip can be effectively reduced, and high-frequency performance of the high-speed optical module is optimized.
Specifically, as shown in fig. 1 and fig. 2, a plurality of first pads 12 are disposed in a pad region S1 of the first circuit substrate 1, the grating-coupled optoelectronic chip 2 includes a plurality of second pads 22, the second pads 22 and the optical signal output region S3 are located on the same side of the grating-coupled optoelectronic chip 2, and the second pads 22 are electrically connected to the first pads 12, so that the grating-coupled optoelectronic chip 2 is inversely attached to the back surface F1 of the first circuit substrate 1, and the grating-coupled optoelectronic chip 2 is electrically connected to the high-frequency transmission line in the first circuit substrate 1.
It is worth emphasizing that the application of the grating coupled optoelectronic chip in the optical module is difficult to realize due to the limitations of the OIF protocol and the FA process at present, so that the end face coupled optoelectronic chip is mostly adopted, and the problems of the high-frequency circuit loss and the difficulty in optimizing the high-frequency performance are generated therewith. According to the technical scheme of the embodiment of the invention, the first opening 11 is arranged in the first circuit substrate 1 corresponding to the non-bonding pad area, the grating coupling photoelectric chip 2 is inversely mounted on the back surface F1 of the first circuit substrate 1 to be electrically connected with the first circuit substrate 1, and the optical signal output area S3 of the grating coupling photoelectric chip 2 is exposed through the first opening 11, so that the optical coupling component 3 can be coupled with the grating coupling photoelectric chip 2 to realize signal transmission, and therefore, the grating coupling photoelectric chip can be used as a photoelectric engine to be applied to an optical module, realizability is provided, and meanwhile, due to the inverse mounting electric connection mode of the grating coupling photoelectric chip, loss of a high-frequency circuit can be reduced, and high-frequency performance of a high-speed optical module is optimized.
The structure of the optical module is further described in detail below, and the design principle of the present invention is also explained in detail.
With continued reference to fig. 2, the optical coupling assembly 3 includes an optical fiber array 31 and at least one connector 32; the optical fiber array 31 includes an optical coupling substrate 311 and a plurality of optical fibers 312 (only one of the optical fibers is illustrated in fig. 2), wherein first ends of the optical fibers 312 are located in the optical coupling substrate 311, and second ends of the optical fibers 312 are connected to the connector 32.
The optical coupling substrate 311 may specifically include a substrate having a V-groove and a pressing plate opposite to the substrate. The first end of the optical fiber 312 is placed in a V-groove after removing the surface coating and exposing the bare optical fiber, and is pressed by a pressing plate and adhered by an adhesive to form the optical fiber array 31, and the optical fiber array 31 is coupled with the grating coupling photoelectric chip 2 to couple the high-frequency optical signal into the optical fiber 312 for transmission. The optical fiber 312 in the optical module can be connected with an external optical fiber through the connector 32, so that long-distance transmission of signals is realized.
As shown in fig. 2, the optical signal output region S3 of the grating-coupled optoelectronic chip 2 is usually disposed on the top surface of the chip, and therefore, the shape of the first cross section of the optical coupling substrate 311 needs to be L-shaped (the optical module is in an inverted L shape after being assembled), and the first cross section (the cross section shown in fig. 2) is perpendicular to the plane of the first circuit substrate 1; correspondingly, the first end portion of the optical fiber 312 includes a first optical fiber section 3121, a second optical fiber section 3122, and a third optical fiber section 3123 connecting the first optical fiber section 3121 and the second optical fiber section 3122, the extending direction of the first optical fiber section 3121 is perpendicular to the plane of the first circuit substrate 1 and is opposite to the optical signal output region S3, the second optical fiber section 3122 is located on the side of the first optical fiber section 3121 away from the first circuit substrate 1, and the extending direction is parallel to the plane of the first circuit substrate 1, so that the first end portion of the optical fiber 312 is bent by 90 ° in the optical coupling substrate 311, and the optical fiber 312 finally assumes a horizontally extending state.
Fig. 3 is an exploded view of an optical module according to an embodiment of the present invention, and referring to fig. 2 and 3, the optical module 10 further includes a first housing 5 and a second housing 6; the first housing 5 comprises a first housing subsection 51 and a second housing subsection 52, the first housing subsection 51 comprises a second opening 511 and a rim portion 512, the rim portion 512 and the second housing subsection 52 are of an integral structure; the first circuit substrate 1 is located on the first side F2 of the first casing 5 and fixed on the frame portion 512, and the second opening 511 exposes the top surface of the first circuit substrate 1; the optical coupling component 3 is located on the second side F3 of the first housing 5, and at least a portion of the optical coupling substrate 311 is located in the second opening 511; the second housing subsection 52 is for supporting the optical fiber 312; the first side F2 is opposite to the second side F3; the second housing 6 is located on a side of the optical coupling assembly 3 away from the first housing 5; the second housing 6 includes a groove (not shown in fig. 3), the optical coupling substrate 311, the first housing 5 and the first circuit substrate 1 are embedded in the groove, and the connector 32 and a portion of the optical fiber 312 are located outside the second housing 6. The first housing 5 and the second housing 6 have correspondingly arranged screw holes 7 for mounting screws (not shown in fig. 3) for fixing the light module.
Specifically, the first housing 5 and the second housing 6 are used for encapsulating, protecting and fixing the structures such as the first circuit substrate 1, the optical coupling component 3, the grating coupling optoelectronic chip 2 and the like, so that the optical module and the switch chip can be conveniently encapsulated in the following.
The first housing 5 is divided into a first housing subsection 51 and a second housing subsection 52, and the first housing subsection 51 is provided with a second opening 511 corresponding to the first circuit substrate 1, so that after the grating-coupled optoelectronic chip 2 is inversely mounted on the back surface of the first circuit substrate 1, the first circuit substrate 1 can be fixed on the bottom surface of the first housing 5, the second opening 511 is exposed on the top surface of the first circuit substrate 1, and the optical signal output region S3 of the grating-coupled optoelectronic chip 2 can also be exposed, and in addition, the optical coupling component 3 can be accommodated in the second opening 511 of the first housing 5, and the optical fiber 312 is supported by the second housing subsection 52. The second housing 6 is a protective housing having a recess for accommodating the optical coupling assembly 3, the first housing 5, and the first circuit board 1, and only a portion of the optical fiber 312, the connector 32, and the first pad 12 on the back surface F1 of the first circuit board 1 is exposed.
Fig. 4 and fig. 5 are schematic diagrams of a design principle of an optical module according to an embodiment of the present invention, and the reason why the grating-coupled optoelectronic chip is difficult to be well applied in the optical module is shown in fig. 4 is that: the OIF protocol specifies the height of the optical module, so that the internal height (H) of the first and second housings 5, 6 is limited; in addition, due to the limitation of the conventional FA process and the minimum bending radius of the optical fiber, in order to realize 90 ° bending of the optical fiber 312 in the optical coupling substrate 311, the optical coupling substrate 311 has a certain height (D) in the direction perpendicular to the plane of the first circuit substrate 1. In addition, according to the OIF protocol, the back surface of the circuit substrate of the optical module has a pad area and a non-pad area, the non-pad area generally needs to be provided with elements such as an MCU (Micro Control Unit), and the optoelectronic chip is generally provided on the top surface of the circuit substrate. As can be seen from fig. 4, based on the above OIF protocol and the limitation of the FA process, if the optical grating coupling optoelectronic chip is adopted and bonded to the top surface of the first circuit substrate 1, the internal height (H) of the optical module is difficult to accommodate the optical coupling assembly, in other words, the internal height of the optical module causes that the optical fiber 312 is difficult to bend by 90 ° in a limited height space, and further causes that the application of the optical grating coupling optoelectronic chip in the optical module is difficult to implement.
In the technical solution of the embodiment of the present invention, as shown in fig. 5, the first opening 11 is disposed on the first circuit substrate 1 corresponding to the non-pad area, and the grating-coupled optoelectronic chip 2 is mounted on the back of the first circuit substrate 1 in an inverted manner, so that the first opening 11 can be used to increase the available height space inside the optical module, and the optical fiber 312 can be bent by 90 ° in a limited height space, and thus the grating-coupled optoelectronic chip can be used as a photovoltaic engine in an optical module. In this embodiment, the MCU and other components originally disposed in the non-pad area can be adjusted to the top surface of the first circuit substrate 1.
Based on the same inventive concept, the embodiment of the invention also provides a co-packaged optical system. Fig. 6 is a schematic structural diagram of a co-packaged optical system according to an embodiment of the present invention, and as shown in fig. 6, the co-packaged optical system 100 includes a switch chip 20, a second circuit substrate 30, and a plurality of optical modules 10 according to any of the above embodiments; the switch chip 20 and the optical module 10 are electrically connected by the second circuit board 30. Since the co-packaged optical system 100 provided by the embodiment of the present invention includes the optical module 10 provided by any of the above embodiments, the same beneficial effects as those of the above optical module are obtained, the loss of the high-frequency circuit can be reduced, and the high-frequency performance of the system can be improved.
Specifically, a high-frequency transmission line is provided in the second circuit substrate 30, and the switch chip 20 can transmit a high-frequency electrical signal to the first circuit substrate 1 of the optical module 10 through the high-frequency transmission line on the second circuit substrate 30, and transmit the high-frequency electrical signal to the grating-coupled optoelectronic chip 2 through the high-frequency transmission line in the first circuit substrate 1.
With reference to fig. 6, optionally, the second circuit substrate 30 includes a central area and an edge area surrounding the central area, the switch chip 20 is located in the central area, and the optical module 10 is located in the edge area.
It should be noted that, fig. 6 only illustrates that four optical modules 10 are respectively disposed in four edge regions of the second circuit substrate 30, and those skilled in the art can reasonably set the number of the optical modules according to requirements, which is not limited in the embodiment of the present invention.
Fig. 7 is a schematic partial enlarged structural view of the co-packaged optical system shown in fig. 6, as shown in fig. 7, optionally, a plurality of electrical connectors 40 are disposed in the edge region, the electrical connectors 40 are used for carrying the optical module 10, and the electrical connectors 40 are electrically connected to the first circuit substrate and the second circuit substrate, respectively. Specifically, in this embodiment, the first circuit substrate and the second circuit substrate are electrically interconnected through the electrical connector 40, which is not limited to this arrangement, and in other embodiments, the first circuit substrate and the second circuit substrate may also be electrically interconnected through soldering, which is not limited in this embodiment of the present invention. Illustratively, the electrical connector 40 may be an electrical receptacle.
As described above, the grating-coupled optoelectronic chip needs to be provided with a light source signal by the light source device, so that the high-frequency electrical signal is converted into a high-frequency optical signal through optoelectronic modulation based on the light source signal and the high-frequency electrical signal provided by the switch chip 20 for subsequent data transmission. The light source device can be an internal light source device and an external light source device.
Exemplarily, fig. 8 is a schematic structural diagram of another optical module provided in the embodiment of the present invention, and as shown in fig. 3 and fig. 8, optionally, the optical module 10 further includes a first light source chip 4; the first light source chip 4 is fixed on the grating coupling photoelectric chip 2 and is communicated with the grating coupling photoelectric chip 2 to form a light path, and the first light source chip 4 is also electrically connected with the first circuit substrate 1 through a lead 41 and is used for sending a light source signal to the grating coupling photoelectric chip 2; the grating coupling photoelectric chip 2 is used for converting the high-frequency electric signal into a high-frequency optical signal based on the light source signal and the high-frequency electric signal sent by the switch chip, and coupling the high-frequency optical signal into the optical coupling component 3 for transmission. Illustratively, the first light source chip 4 may be an LMP light source chip. In the embodiment, the first light source chip 4 is arranged in the optical module 10, so that the difficulty in realizing optical path connection can be reduced, the optical energy loss can be reduced, and the product integration level can be improved.
In other embodiments, optionally, the grating coupled optoelectronic chip 2 and the second light source chip form an optical path communication through an optical fiber to receive a light source signal sent by the second light source chip; the second light source chip is located outside the light module 10. For example, the second light source chip may be located on the second circuit substrate, or may be located on another circuit substrate, which is not limited in this embodiment of the present invention. Exemplarily, since the second light source chip is located outside the optical module and the transmission of the optical signal needs to be realized through the optical fiber and the grating coupled optoelectronic chip, an ELS laser light source with high energy may be used.
The above-described embodiments should not be construed as limiting the scope of the invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A light module, comprising:
a first circuit substrate; the first circuit substrate comprises a first opening, the back surface of the first circuit substrate comprises a bonding pad area and a non-bonding pad area, and the first opening is arranged corresponding to the non-bonding pad area and penetrates through the first circuit substrate;
the grating couples the photoelectric chip; the grating coupling photoelectric chip is reversely mounted on the back surface of the first circuit substrate and is electrically connected with the first circuit substrate; the grating coupling photoelectric chip comprises an optical signal output area, and the first opening exposes the optical signal output area;
an optical coupling assembly; the optical coupling assembly comprises an optical signal receiving end, wherein the optical signal receiving end is positioned in the first opening and is opposite to the optical signal output area;
a plurality of first bonding pads are arranged in the bonding pad area of the first circuit substrate; the grating coupling photoelectric chip comprises a plurality of second bonding pads, and the second bonding pads and the optical signal output area are positioned on the same side of the grating coupling photoelectric chip; the second bonding pad is electrically connected with part of the first bonding pad, and the other part of the first bonding pad is exposed;
the optical coupling assembly includes an array of optical fibers and at least one connector; the optical fiber array comprises an optical coupling substrate and a plurality of optical fibers, wherein first end parts of the optical fibers are positioned in the optical coupling substrate, and second end parts of the optical fibers are connected with the connector;
the optical module further comprises a first housing and a second housing;
the first shell comprises a first shell subsection and a second shell subsection, the first shell subsection comprises a second opening and a frame part, and the frame part and the second shell subsection are of an integral structure;
the first circuit substrate is positioned on the first side of the first shell and fixed on the frame part, and the second opening exposes the top surface of the first circuit substrate;
the optical coupling assembly is positioned on the second side of the first shell, and at least part of the optical coupling substrate is positioned in the second opening; the second housing section for supporting the optical fibre; the first side is opposite the second side;
the second shell is positioned on one side of the optical coupling component far away from the first shell; the second housing includes a groove, the optical coupling substrate, the first housing, and the first circuit substrate are all embedded in the groove, and the connector and a portion of the optical fiber are located outside the second housing.
2. The light module of claim 1,
the first cross section of the optical coupling substrate is L-shaped, and the first cross section is perpendicular to the plane of the first circuit substrate; the first end portion comprises a first optical fiber section, a second optical fiber section and a third optical fiber section which is connected with the first optical fiber section and the second optical fiber section, the extension direction of the first optical fiber section is perpendicular to the plane of the first circuit substrate and opposite to the optical signal output area, the second optical fiber section is located on one side, away from the first circuit substrate, of the first optical fiber section, and the extension direction of the second optical fiber section is parallel to the plane of the first circuit substrate.
3. The optical module of claim 1, wherein the first housing and the second housing have correspondingly disposed screw holes for mounting screws.
4. A co-packaged optical system comprising a switch chip, a second circuit substrate, and a plurality of optical modules according to any one of claims 1-3;
the switch chip and the optical module are electrically connected through the second circuit substrate.
5. A co-packaged optical system according to claim 4, wherein the light module further comprises a first light source chip;
the first light source chip is fixed on the grating coupling photoelectric chip and is communicated with the grating coupling photoelectric chip to form a light path, and the first light source chip is also electrically connected with the first circuit substrate through a lead and is used for sending a light source signal to the grating coupling photoelectric chip;
the grating coupling photoelectric chip is used for converting the high-frequency electric signal into a high-frequency optical signal based on the light source signal and the high-frequency electric signal sent by the switch chip, and coupling the high-frequency optical signal into the optical coupling assembly for transmission.
6. The co-packaged optical system according to claim 4, wherein the grating-coupled optoelectronic chip and the second light source chip are in optical path communication through an optical fiber to receive the light source signal sent by the second light source chip;
the second light source chip is located outside the light module.
7. A co-packaged optical system according to claim 4, wherein the second circuit substrate includes a central region in which the switch chip is located and an edge region surrounding the central region in which the optical module is located.
8. A co-packaged optical system according to claim 7, wherein the edge region is provided with a plurality of electrical connectors for carrying the optical module, and the electrical connectors are electrically connected to the first and second circuit substrates, respectively.
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| JP2004191396A (en) * | 2002-12-06 | 2004-07-08 | Sony Corp | Optical transmitter-receiver |
| FR2876191B1 (en) * | 2004-10-05 | 2007-05-25 | Intexys Sa | METHOD AND DEVICE FOR COUPLING OPTICAL COMPONENTS |
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