CN212486512U

CN212486512U - Optical module

Info

Publication number: CN212486512U
Application number: CN202021096787.3U
Authority: CN
Inventors: 胥嫏
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2021-02-05
Anticipated expiration: 2030-06-12

Abstract

The application discloses an optical module, which comprises a lower shell, a circuit board, an optical receiving assembly and a flexible board, wherein the optical receiving assembly is arranged on the upper surface of the lower shell, comprises a bottom plate, a photoelectric detector, a trans-impedance amplifier and an arrayed waveguide grating arranged on the bottom plate and is used for receiving an optical signal from the outside of the optical module; the lower surface of one end of the flexible board is connected to the upper surface of the bottom board, the transimpedance amplifier is arranged on the upper surface of the flexible board, and the upper surface of the other end of the transimpedance amplifier is connected to the lower surface of the circuit board and used for connecting the light receiving assembly and the circuit board. The trans-impedance amplifier of the light receiving assembly is arranged on the flexible board and connected with the circuit board through the flexible board, the space requirement of the circuit board is not increased, and more optical elements are distributed in a smaller optical module shell; and the flexible board and the array waveguide grating are respectively arranged on the bottom plate, so that heat generated by the light receiving device can be directly led out and dissipated through the flexible board and the bottom plate, and the heat dissipation efficiency is improved.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

Mobile communication is changing people's lives deeply, 4G networks have been deployed on a global scale in order to cope with explosive mobile data traffic growth, various new services and application scenarios that are emerging continuously, and 5G network architectures and wireless technologies are becoming a new round of research hotspots since 2015. In order to adapt to the trend of high-speed development of the communication market, the transmission speed of the optical module is also rapidly improved, and 100G, 200G and even 400G optical modules appear at present.

Optical modules have higher and higher speed, but the requirements for the volume of the optical modules are smaller and smaller, which brings problems such as heat dissipation and miniaturization to the optical module design, and it becomes a great challenge in the industry to arrange more optical elements in a smaller optical module housing and also consider the heat dissipation problem.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module to solve the problems that an existing high-speed optical module is large in size and difficult in heat dissipation.

In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:

in a first aspect, an embodiment of the present application discloses an optical module, including:

the lower shell is combined with the upper shell to form a cavity;

the circuit board is arranged in the cavity and used for providing electric connection;

the optical receiving assembly is arranged on the upper surface of the lower shell, comprises a bottom plate, a photoelectric detector, a trans-impedance amplifier and an array waveguide grating arranged on the bottom plate, and is used for receiving an optical signal from the outside of the optical module;

and the lower surface of one end of the flexible board is connected to the upper surface of the bottom board, the transimpedance amplifier is arranged on the upper surface of the flexible board, and the upper surface of the other end of the flexible board is connected to the lower surface of the circuit board and is used for connecting the light receiving component and the circuit board.

In a second aspect, an embodiment of the present application further discloses an optical module, including:

the lower shell is combined with the upper shell to form a cavity;

a flexible plate, one end of which is connected to the upper surface of the bottom plate at the lower surface, and one end of which above the bottom plate is provided with a mounting hole, wherein the transimpedance amplifier is mounted on the upper surface of the bottom plate through the mounting hole; the upper surface of the other end of the light receiving module is connected to the lower surface of the circuit board and used for connecting the light receiving assembly and the circuit board.

The optical module comprises a lower shell, a circuit board, an optical receiving assembly and a flexible board, wherein the optical receiving assembly is arranged on the upper surface of the lower shell and comprises a bottom plate, a photoelectric detector, a trans-impedance amplifier and an array waveguide grating arranged on the bottom plate; the lower surface of gentle template one end is connected to the upper surface of bottom plate, and the transimpedance amplifier sets up in the upper surface of flexbile plate, and the upper surface of its other end is connected to the lower surface of circuit board, makes things convenient for light receiving component's installation and dismantlement. The application provides a light receiving component in optical module passes through the flexbile plate and is connected with the circuit board electricity, rather than setting up it on the circuit board surface, can not increase circuit board space demand, so can be at the more optical component of less optical module internal layout, in addition with devices such as transimpedance amplifier set up on the flexbile plate, array waveguide grating sets up on the bottom plate, support flexbile plate and array waveguide grating through the bottom plate, the heat that light receiving device produced can directly pass through the flexbile plate, the bottom plate, the heat dissipation is derived to the casing down, can improve its radiating efficiency.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

fig. 2 is a schematic structural diagram of an optical network terminal;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is an exploded schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 5 is a diagram illustrating a structure of a circuit board according to an embodiment of the present invention;

FIG. 6 is a sectional view of a circuit board and a lower case partially assembled in an embodiment of the present application;

FIG. 7 is an exploded view of a partially assembled circuit board and a lower housing according to an embodiment of the present invention;

FIG. 8 is a cross-sectional view of another partial assembly of the circuit board and the lower housing according to the embodiment of the present application;

FIG. 9 is a cross-sectional view of another angle sub-assembly of the circuit board and the lower housing according to the embodiment of the present application;

fig. 10 is an enlarged view of a portion a in fig. 9.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data information, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal. Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 via the optical network terminal 100. Specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, a circuit board 300, and an optical transceiver module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the packaging cavity generally presents a square body. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper shell 201 on the lower shell 202.

The two openings can be two end openings (204, 205) located at the same end of the optical module, or two openings located at different ends of the optical module; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver module 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver module 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver module 400 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form the outermost packaging protection shell of the module; the upper shell and the lower shell are made of metal materials generally, electromagnetic shielding and heat dissipation are achieved, the shell of the optical module cannot be made into an integral component generally, and therefore when devices such as a circuit board are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and production automation is not facilitated.

The optical module generally further includes an unlocking component, which is located on an outer wall of the package cavity/lower housing 202 and is used to realize a fixed connection between the optical module and the upper computer or release the fixed connection between the optical module and the upper computer.

The unlocking component is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver component is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver module by using the flexible circuit board.

The optical transceiver module comprises an optical transmitting module and an optical receiving module which are respectively used for transmitting optical signals and receiving the optical signals. Fig. 5 is a schematic structural diagram of a circuit board 300 according to an embodiment of the present disclosure. As shown in fig. 5, the optical module 200 includes at least two light emitting modules 401 and at least two light receiving modules 402, the at least two light emitting modules 401 may be electrically connected to the circuit board 300 through flexible boards, the at least two light receiving modules 402 are electrically connected to the circuit board 300 through flexible boards 500, and the light emitting modules 401 and the light receiving modules 402 are stacked instead of disposing the light emitting modules 401 and the light receiving modules 402 on the surface of the circuit board 300, so that the space requirement of the circuit board 300 is not increased, the size of the optical module is reduced, and the optical module is miniaturized.

The light emitting assembly generally includes a housing, a light emitter fixed inside the housing for emitting a light beam, and a lens assembly; the lens component is positioned on a light emitting path of the light emitter, is fixed inside the shell and is used for changing the transmission direction of the light beam so that the laser light beam enters the external optical fiber. That is, light emitted by the light emitter is reflected by the lens assembly and enters the optical fiber.

In this example, the optical transmitter module 401 may include 4 lasers to transmit 4 optical signals, so that the optical module may transmit 8 optical signals through two optical transmitter modules. The optical module can also comprise a third optical transmission assembly, a fourth optical transmission assembly and the like, so that multipath optical signal transmission of the optical module is realized, and the transmission speed of the optical module is provided, which all belong to the protection scope of the embodiment of the application.

When the light receiving module 402 is connected to the circuit board 300 through the flexible board 500, one end of the flexible board 500 is fixed to the lower surface of the circuit board 300, and the other end is connected to the light receiving module, so that the light receiving module 402 is not required to be integrated on the circuit board 300, and the space of the circuit board 300 is saved. That is, the flexible board 500 is a carrier for mounting components such as the light receiving module 402, and is generally made of a flexible material.

Fig. 6 is a cross-sectional view illustrating a partial assembly of a light receiving device 402 and a lower housing 202 according to an embodiment of the present disclosure, and fig. 7 is an exploded view illustrating the partial assembly of the light receiving device 402 and the lower housing 202 according to the embodiment of the present disclosure. As shown in fig. 6 and 7, the light receiving component 402 includes a base plate 702, a lens component (not shown in the figure) and a light receiving device, the light receiving device includes a photodetector, a transimpedance amplifier and an arrayed waveguide grating 4022, the devices such as the transimpedance amplifier are disposed on the flexible board 500, the photodetector may be disposed on the flexible board 500 or may not be disposed on the flexible board 500, the arrayed waveguide grating 4022 is disposed on the base plate 702 and is configured to receive an optical signal of an external optical fiber, that is, an output end of the arrayed waveguide grating 4022 is connected to the photodetector, and the optical signal transmitted in the external optical fiber is converted into an electrical signal through the arrayed waveguide grating 4022 and the photodetector. The lens assembly is arranged between the light receiving device and the external optical fiber and used for reflecting light from the external optical fiber through the lens assembly and then entering the light receiving device to convert an optical signal into an electric signal; the other end of the flexible board 500 is connected to the lower surface of the circuit board 300, and transmits the converted electrical signal to the circuit board 300, and the circuit board 300 performs subsequent processing on the electrical signal.

The lower surface of flexible board 500 one end is connected to the upper surface of bottom plate 702, and devices such as photoelectric detector and transimpedance amplifier set up on flexible board 500 and bottom plate 702 assorted part, and the heat that produces such as photoelectric detector and transimpedance amplifier can directly conduct away through flexible board 500, bottom plate 702, lower casing 202, has improved heat conduction efficiency.

The light receiving module 402 includes a base plate 702, and further includes a cover 701 covering the base plate 702, the cover 701 and the base plate 702 are combined to form a dust-proof housing, and the photodetector, the transimpedance amplifier, and the arrayed waveguide grating 4022 are all disposed in the dust-proof housing to protect the light receiving module 402.

Since the flexible board 500 is made of a flexible material and has high flexibility, in order to connect the flexible board 500 to the bottom board 702, the substrate 600 is disposed on the bottom board 702, and the substrate 600 is disposed between the flexible board 500 and the bottom board 702 and is used for supporting the flexible board 500 and reinforcing the strength of the flexible board 500.

The coverage area of the substrate 600 is the setting area of the photodetector and the transimpedance amplifier on the flexible board 500, that is, the substrate 600 is fixed below the area where the photodetector and the transimpedance amplifier are set on the flexible board 500, and the flexible board 500 provided with the photodetector, the transimpedance amplifier and other devices is supported by the substrate 600, so that the flexible board 500 is prevented from deforming and cannot support a receiving electric device.

For conveniently installing the substrate 600, a groove is formed in the bottom plate 702, a protrusion is arranged in the groove, a mounting groove corresponding to the protrusion is formed in the substrate 600, and the protrusion can be embedded in the mounting groove, so that the substrate 600 and the bottom plate 702 can be clamped.

In this example, the upper surface of the substrate 600 is attached to the lower surface of the flexible board 500, and when the flexible board 500 is connected to the bottom board 702, the mounting groove on the substrate 600 is aligned with the protrusion on the bottom board 702, and the flexible board 500 is pushed from left to right until the mounting groove on the substrate 600 and the protrusion on the bottom board 702 are assembled in place, so that the flexible board 500 is convenient to mount and dismount.

When the light receiving assembly is installed, the flexible board 500 integrated with the transimpedance amplifier and the photoelectric detector is inserted into the dustproof shell, namely, the flexible board 500 is connected to the bottom board 702, the flexible board 500 is fixed with the bottom board 702 through the substrate 600 and is connected with the arrayed waveguide grating 4022 fixed on the bottom board 702, and then the flexible board 500 is fixedly installed on the lower surface of the circuit board 300, so that the circuit board 300 and the light receiving assembly 402 are connected through the external flexible board, and the chip with large heat productivity of the transimpedance amplifier can be directly led out and dissipated through the metal shell.

The cover 701 may be composed of a top plate and four side plates, and the four side plates are respectively connected to the bottom plate 702 of the dust-proof housing. A first slot may be formed on one side plate of the cover 701, and the flexible board 500 and the substrate 600 may be inserted into the dust-proof housing through the first slot. A second slot may be opened on the side plate corresponding to the side plate where the first slot is located, after the arrayed waveguide grating 4022 is inserted into the dust-proof housing through the second slot, the arrayed waveguide grating 4022 is pushed until the end surface of the arrayed waveguide grating 4022 is close to the photodetector on the flexible board 500, and then the arrayed waveguide grating 4022 may be attached to the bottom plate 702 of the dust-proof housing, so as to fix the arrayed waveguide grating 4022 in the dust-proof housing.

The installation process of the light receiving module 402 is as follows: firstly, the arrayed waveguide grating 4022 is inserted into the dustproof housing through the second slot, and then the arrayed waveguide grating 4022 is fixed on the bottom plate 702 of the dustproof housing; then fixing light receiving devices such as a transimpedance amplifier, a photodetector and the like on the surface of the flexible board 500; then, the flexible board 500 integrated with the devices such as the transimpedance amplifier, the photodetector and the like is inserted into the dustproof housing through the first slot until the photodetector abuts against the arrayed waveguide grating 4022, so that the devices such as the transimpedance amplifier, the photodetector and the arrayed waveguide grating 4022 are packaged in the dustproof housing.

The photodetector, the transimpedance amplifier, and the arrayed waveguide grating 4022 may form a set of light receiving devices, and the light receiving module 402 may include a plurality of sets of light receiving devices to complete reception of multiple optical paths. A plurality of trans-impedance amplifiers and photodetectors are arranged on the surface of the flexible board 500 inserted into the dustproof shell, the optical module is provided with a plurality of groups of light receiving devices and a plurality of groups of light emitting assemblies, the plurality of groups of light receiving devices are packaged in the same dustproof shell, and the plurality of groups of light emitting assemblies are respectively packaged.

When a plurality of transimpedance amplifiers and photodetectors are arranged, a plurality of second slots can be arranged on the side plate opposite to the side plate where the first slot is located in parallel, and the plurality of groups of arrayed waveguide gratings 4022 are inserted into the dustproof shell through the second slots so as to be suitable for a high-speed optical module.

When the transimpedance amplifier, the photodetector, and the like are placed on the flexible board 500, the transimpedance amplifier and the photodetector may be directly attached to the surface of the flexible board 500, or a hole may be bored in the flexible board 500, and the transimpedance amplifier may be embedded in the hole and mounted on the upper surface of the bottom plate 702 through the hole.

Fig. 8 is a cross-sectional view of a partially assembled light receiving module 402 and a lower housing according to an embodiment of the present disclosure; fig. 9 is a cross-sectional view of another angle partial assembly of another light receiving element 402 and a lower housing according to an embodiment of the present disclosure. As shown in fig. 8 and 9, since the flexible board 500 is made of a soft material, the flexible board 500 is easily deformed, and therefore, the substrate 600 is provided between the flexible board 500 and the bottom plate 702, and the substrate 600 can prevent the flexible board 500 from being deformed and support the flexible board 500.

In this example, a groove may be provided on the bottom plate 702, and a side wall of the groove may correspond to a front end surface of the transimpedance amplifier. When the flexible board 500 is mounted, the substrate 600 is adhered to the bottom surface of the flexible board 500 opposite to the transimpedance amplifier, and then the flexible board 500 and the substrate 600 are inserted into the dust-proof housing together through the first slot until the end surfaces of the flexible board 500 and the substrate 600 abut against the side wall of the bottom plate 702.

In this example, a mounting hole 501 may be provided on the flexible board 500, and the transimpedance amplifier 4021 is mounted on the surface of the substrate 600 through the mounting hole 501.

As shown in fig. 10, a mounting hole 501 may also be provided on the flexible board 500, a transimpedance amplifier 4021 is mounted on the surface of the base board 702 through the mounting hole 501, and the transimpedance amplifier 4021 mounted on the base board 702 is electrically connected to the photodetector and the arrayed waveguide grating 4022, and is electrically connected to the circuit board 300 through the flexible board 500, for transmitting an amplified electrical signal to the circuit board 300.

Compared with the case that the transimpedance amplifier 4021 is installed on the substrate 600 through the installation hole 501, heat generated by the transimpedance amplifier 4021 is conducted out for heat dissipation through the substrate, the bottom plate 702 and the lower shell 202, the transimpedance amplifier 4021 is installed on the bottom plate 702 through the installation hole 501 so that the transimpedance amplifier 4021 is directly contacted with the dustproof shell, the dustproof shell is directly installed on the upper surface of the lower shell 202, and therefore heat generated by the transimpedance amplifier 4021 can be directly conducted out for heat dissipation through the bottom plate 702 and the lower shell 202, and the heat dissipation efficiency is higher.

When a device such as a transimpedance amplifier is mounted on the base plate 702 through the mounting hole 501, the coverage area of the substrate 600 is smaller than or equal to the area between the front end surface of the mounting hole 501 on the flexible board 500 and the front end surface of the base plate 702, that is, a groove having a size equal to the distance between the front end surface of the base plate 702 and the front end surface of the mounting hole 501 on the flexible board 500 is provided on the base plate 702, and the substrate 600 is embedded in the groove to support the flexible board 500.

For a high-speed 200G optical module, there are multiple sets of optical receiving components and optical emitting components, that is, multiple transimpedance amplifiers 4021 are integrated on a flexible board 500, so that multiple mounting holes 501 may be provided on the flexible board 500 inserted into a dust-proof housing, and the multiple transimpedance amplifiers 4021 are mounted on the surface of the base plate 702 through the multiple mounting holes 501.

The number of the transimpedance amplifiers 4021 integrated on the flexible board 500 is not limited to one or two as described in the above embodiments, and a plurality of transimpedance amplifiers may be integrated according to actual requirements, so that the optical module has a plurality of receiving channels, which all belong to the protection scope of the embodiments of the present application.

Adopt the wiring structure that flexography and receiving chip transimpedance amplifier are integrated together, although the integrated electric core piece can be adopted on the flexography on coaxial packaging form, its purpose only is the passive selection under the not enough condition of wiring space, and only can integrate 1 receiving chip on the flexography, and this application adopts external flexography based on COB scheme initiative, with receiving electric chip integration on the flexography, avoid integrating receiving electric chip on the circuit board, and this application can be integrated two transimpedance amplifiers on the flexography, solve the problem that receiving chip is integrated on the circuit board, thereby save a large amount of spaces for the circuit board, realized laying out more optical elements in less optical module casing.

The optical module provided by the embodiment of the application, especially the high-speed 200G optical module, has 8 channels for receiving and transmitting, namely, the optical receiving assembly comprises two groups of receiving end tail end optical fiber connectors, an arrayed waveguide grating, a photoelectric detector and a transimpedance amplifier, each group of photoelectric detectors comprises 4 detectors, the electric connection between the optical transmitting assembly and the circuit board and the electric connection between the optical receiving assembly and the circuit board are respectively realized by adopting an external flexible board, the integration of transmitting and receiving electric chips on the circuit board is avoided, a large amount of space is saved for the circuit board, and more optical elements are distributed in a smaller optical module shell; and the light emitting component and the light receiving component are respectively subjected to SFP packaging, and the flexible plate is attached to the bottom plate of the dustproof shell, so that heat generated by the trans-impedance amplifier, the photoelectric detector and the like which are placed on the flexible plate can be directly led out through the dustproof shell for heat dissipation without heat dissipation through a circuit board, and the heat dissipation capability of the optical module is improved.

It should be noted that, in the present specification, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such circuit structure, article, or apparatus. Without further limitation, the presence of an element identified by the phrase "comprising an … …" does not exclude the presence of other like elements in a circuit structure, article or device comprising the element.

Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

The above-described embodiments of the present application do not limit the scope of the present application.

Claims

1. A light module, comprising:

the lower shell is combined with the upper shell to form a cavity;

2. The optical module of claim 1, wherein the light receiving module further comprises a cover body covering the bottom plate, the cover body and the bottom plate form a dust-proof housing, and the photodetector, the transimpedance amplifier and the arrayed waveguide grating are all disposed in the dust-proof housing.

3. The optical module of claim 1, wherein a substrate is disposed between the flexible board and the bottom plate for supporting the flexible board above the bottom plate.

4. The optical module according to claim 3, wherein the coverage area of the substrate is an area where the photodetector and the transimpedance amplifier are disposed on the flexible board.

5. The optical module of claim 3, wherein the substrate is snap-fit to the backplane.

6. The optical module of claim 5, wherein the base plate has a recess formed therein, and wherein a protrusion is formed in the recess; the base plate is provided with a mounting groove corresponding to the protrusion, and the base plate is mounted on the bottom plate through the mounting groove and the protrusion.

7. The optical module of claim 2, wherein the light receiving assembly comprises a plurality of sets of light receiving devices, each set of light receiving devices being disposed within the dust proof housing.

8. A light module, comprising:

the lower shell is combined with the upper shell to form a cavity;

9. The optical module according to claim 8, wherein a plurality of sets of mounting holes are disposed on the flexible board, and a plurality of sets of the transimpedance amplifiers are respectively mounted on the upper surface of the base plate through the plurality of sets of the mounting holes.