CN213302586U

CN213302586U - Optical module

Info

Publication number: CN213302586U
Application number: CN202021926035.5U
Authority: CN
Inventors: 杨世海; 姬景奇; 谢一帆; 张强; 赵其圣
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-09-04
Filing date: 2020-09-04
Publication date: 2021-05-28
Anticipated expiration: 2030-09-04

Abstract

The application provides an optical module which comprises a circuit board, a light emission submodule and a light receiving submodule, wherein a through hole is formed in the middle of the circuit board, the light emission submodule is embedded into the through hole, the light receiving submodule comprises a first light receiving submodule and a second light receiving submodule which are positioned on the same side of the circuit board, a notch is formed in one end, close to an optical fiber adapter, of the circuit board to avoid an optical fiber ribbon, one end of the emitted optical fiber ribbon is connected with the optical fiber adapter, and the other end of the emitted optical fiber ribbon is connected with the light emission submodule; correspondingly, the receiving optical fiber band comprises a first receiving optical fiber group and a second receiving optical fiber group, the first receiving optical fiber group and the second receiving optical fiber group penetrate through two sides of the light emission sub-module, the first receiving optical fiber group is connected with the first light receiving sub-module, and the second receiving optical fiber group is connected with the second light receiving sub-module. The optical module provided by the application fully and flexibly utilizes the area of the optical module, can obtain a multi-channel optical module, and meets the requirement of higher ground speed.

Description

Optical module

Technical Field

The application relates to the technical field of communication, in particular to an optical module.

Background

In the field of optical fiber communication, an optical module is a tool for realizing the interconversion of optical signals, and is one of key devices in optical communication equipment.

With the development and demand of emerging services such as cloud computing and mobile internet, the speed requirement on an optical module is higher and higher, and then the types of corresponding optical modules are more and more, while a 400G optical module cannot meet the requirement of higher transmission rate, how to design an optical module to meet the requirement of higher transmission rate becomes a technical problem to be solved urgently by technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module, which meets the requirement of higher transmission rate by designing the optical module.

The application provides an optical module including:

the middle of the circuit board is provided with a through hole, and one end of the circuit board close to the optical fiber adapter is provided with a notch, wherein the notch is used for avoiding transmitting optical fiber ribbons or receiving optical fiber ribbons;

the light emission secondary module is embedded in the through hole, connected with the circuit board and used for outputting signal light;

one part of the light emission sub-module is arranged on the first surface of the circuit board, and the other part of the light emission sub-module is arranged on the second surface of the circuit board;

the optical receiving sub-module is connected with the circuit board, comprises a first optical receiving sub-module and a second optical receiving sub-module which are arranged on the same side of the circuit board and is used for receiving signal light from the outside of the optical module;

one end of the transmitting optical fiber ribbon is connected with the optical fiber adapter, and the other end of the transmitting optical fiber ribbon is connected with the optical emission submodule;

the receiving optical fiber ribbon comprises a first receiving optical fiber group and a second receiving optical fiber group, the first receiving optical fiber group and the second receiving optical fiber group penetrate through two sides of the OSA, wherein:

one end of the first receiving optical fiber group is connected with the optical fiber adapter, and the other end of the first receiving optical fiber group is connected with the first light receiving sub-module;

one end of the second receiving optical fiber group is connected with the optical fiber adapter, and the other end of the second receiving optical fiber group is connected with the second light receiving sub-module.

Has the advantages that:

the application provides an optical module, which comprises a circuit board, a transmitter optical subassembly and a receiver optical subassembly, wherein a through hole is formed in the middle of the circuit board, the transmitter optical subassembly is embedded into the through hole, part of the transmitter optical subassembly is arranged on a first surface of the circuit board, and part of the transmitter optical subassembly is arranged on a second surface of the circuit board; meanwhile, in the embodiment of the application, one end of the circuit board, which is close to the optical fiber adapter, is provided with a notch, one end of the emitted optical fiber tape is connected with the optical fiber adapter, and the other end of the emitted optical fiber tape is connected with the light emission submodule; in order to correspond to the first light receiving sub-module and the second light receiving sub-module, the receiving optical fiber band comprises a first receiving optical fiber group and a second receiving optical fiber group, the first receiving optical fiber group and the second receiving optical fiber group penetrate through two sides of the light emitting sub-module, one end of the first receiving optical fiber group is connected with the optical fiber adapter, the other end of the first receiving optical fiber group is connected with the first light receiving sub-module, and similarly, one end of the second receiving optical fiber group is connected with the optical fiber adapter, and the other end of the second receiving optical fiber group is connected with the second light receiving sub-module.

The optical module design that provides in this application, the area of abundant and nimble optical module of utilizing, including a transmitter optical subassembly and two optical receiver optical subassembly, wherein the number of transmitter optical subassembly through adjusting the optical transmitter of transmitter optical subassembly, and optical receiver optical subassembly through adjusting the quantity of photoreceiver can obtain the optical module of multichannel, and then satisfies higher transmission rate demand.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded schematic view of an optical module structure according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an tosa according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram illustrating relative positions of an tosa and an rosa according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a rosa according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a circuit board according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of an internal portion of an tosa according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a heat sink provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical communication is the interconversion of optical and electrical signals. Optical communication uses optical signals carrying information to transmit in information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fiber/optical waveguide; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

The optical port of the optical module 200 is connected to the optical fiber 101, and establishes a bidirectional optical signal connection with the optical fiber. The electrical port of the optical module 200 is connected to the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit. The optical module realizes the interconversion between an optical signal and an electrical signal, thereby realizing the connection between the optical fiber 101 and the optical network unit 100.

Specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and in the photoelectric conversion process, the carrier of the information is converted between the light and the electricity, but the information itself is not changed.

The optical network unit 100 has an optical module interface 102 for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200. The optical network unit is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through an optical network unit. Specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit serves as an upper computer of the optical module to monitor the operation of the optical module.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device sequentially through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an Optical Line Terminal (OLT) and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector connected to the circuit board 105 is provided in the cage 106, and is used for connecting an electrical port of an optical module such as a gold finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board 105 of the optical network unit 100, and the electrical connectors on the circuit board 105 are wrapped in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is an optical module structure schematic diagram provided by the embodiment of the present application, and fig. 4 is an optical module structure explosion schematic diagram provided by the embodiment of the present application, as shown in fig. 3 and fig. 4, the embodiment of the present invention provides an optical module 200 including an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, a tosa 400, a tosa 500, and an optical fiber adapter 600, wherein a transmitting optical fiber ribbon of the tosa 400 and a receiving optical fiber ribbon of the tosa 500 are both connected to the optical fiber adapter 600, and the optical fiber adapter 600 is used for establishing optical connection between the transmitting optical fiber ribbon and the receiving optical fiber ribbon and an external optical fiber.

The upper shell 201 and the lower shell 202 form a wrapping shell with two ports, specifically two ports (204, 205) in the same direction, or two ports in different directions; one of the ports is an electrical port 204 which is used for being inserted into an upper computer such as an optical network unit; the other port is an optical port 205 for connecting an external optical fiber 101; the optoelectronic devices such as the circuit board 300, the transmitter sub-module 400 and the receiver sub-module 500 are disposed in the packaging housing formed by the upper and lower housings.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper housing, casing combination down is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating part, heat dissipation and electromagnetic shield structure are not convenient for install, are unfavorable for production automation.

The unlocking handle 203 is positioned on the outer wall of the wrapping shell/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the cage 106 is clamped by the unlocking handle 203, so that the optical module is fixed in the upper computer; by pulling the unlocking handle, the engagement between the optical module 200 and the cage 106 is released, and the optical module can be pulled out from the upper computer.

The circuit board 300 is located in a casing formed by the upper casing and the casing, the circuit board 300 is electrically connected with the transmitter sub-module 400 and the receiver sub-module 500 respectively, and the circuit board is provided with chips, capacitors, resistors and other electric devices. The method comprises the following steps of selecting corresponding chips according to the requirements of products, wherein common chips comprise a microprocessor MCU, a clock data recovery chip CDR, a laser driving chip, a transimpedance amplifier TIA chip, a limiting amplifier LA chip, a power management chip and the like. The transimpedance amplifier is closely associated with the optical detection chip, and the transimpedance amplifier and the optical detection chip can be packaged together by a part of products, such as in the same TO (TO optical) tube shell or the same shell; the optical detection chip and the transimpedance amplifier can be separately packaged, and the transimpedance amplifier is arranged on the circuit board.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The surface of the end part of the circuit board 300 is provided with a golden finger, the golden finger consists of one pin which is mutually independent, the circuit board is inserted into an electric connector in the cage, and the golden finger is in conductive connection with a clamping elastic sheet in the electric connector; the golden fingers can be arranged on the surface of one side of the circuit board, and the golden fingers are generally arranged on the upper surface and the lower surface of the circuit board in consideration of the large requirement on the number of pins; the golden finger is used for establishing electrical connection with the upper computer, and the specific electrical connection can be power supply, grounding, I2C signals, communication data signals and the like.

The circuit board 300 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

Fig. 5 is a schematic structural diagram of the tosa 400, fig. 6 is a schematic positional diagram of the tosa 400 and the rosa 500, and fig. 7 is a schematic structural diagram of the rosa 500, the tosa 400 is used for emitting optical signals, and the rosa 500 is used for receiving optical signals, as can be seen from fig. 5, fig. 6 and fig. 7, the optical module of the present application includes one tosa 400, and the rosa 500 includes a first rosa 500a and a second rosa 500b, because the requirement for airtightness of optical emission is high, in the embodiment of the present application, the rosa is centrally disposed in the same cavity to ensure good airtightness; in order to flexibly and sufficiently utilize the available space of the circuit board, the rosa 500 includes a first rosa 500a and a second rosa 500b in the embodiment of the present application. The receiving optical fiber ribbon 501 includes a first receiving optical fiber group 501a and a second receiving optical fiber group 501b so as to correspond to the first receiving sub-module 500a and the second receiving sub-module 500b, one end of the first receiving optical fiber group 501a is connected to an optical fiber adapter, and the other end is connected to the first receiving sub-module 500a, and similarly, one end of the second receiving optical fiber group 501b is connected to an optical fiber adapter, and the other end is connected to the second receiving sub-module 500 b. Specifically, the first receiving fiber group 501a and the second receiving fiber group 501b pass through two sides of the tosa 400, so that the space of the circuit board can be flexibly utilized, and the receiving fiber band is prevented from being bent with too large radius; correspondingly, the first and second rosa 500a and 500b are respectively disposed at two sides of the rosa 400, and of course, the first and second rosa 500a and 500b can also be flexibly disposed at the same side of the rosa 400.

Fig. 8 is a schematic structural diagram of a circuit board according to an embodiment of the present application, as shown in fig. 8, a through hole 303 is provided at a middle position of the circuit board 300, a notch 305 is provided at one end of the circuit board 300 close to the optical fiber adapter 600, where the notch 305 is used for avoiding a transmitting optical fiber ribbon or a receiving optical fiber ribbon, and since an optical module provided by the present application includes a group of transmitting optical fiber ribbon and two groups of receiving optical fiber ribbon, in a specific arrangement process of the optical fiber ribbons, congestion and interference between the transmitting optical fiber ribbon and the receiving optical fiber ribbon may occur, and meanwhile, congestion contact between the transmitting optical fiber ribbon or the receiving optical fiber ribbon and the circuit board may also occur, in the present application, the transmitting optical fiber ribbon or the receiving optical fiber ribbon is avoided by providing the notch 305, and specifically, as shown in fig. 5, the first receiving optical fiber; of course, the transmitting optical fiber ribbon may be passed through the notch 305 according to actual conditions, and the transmitting optical fiber ribbon, the first receiving optical fiber group 501a and the second receiving optical fiber group 501b may be passed through the notch 305.

The optical fiber grooves 304 are communicated at the positions close to the through holes 303, in the embodiment of the application, the tosa 400 is embedded into the through holes 303, and in order to avoid the optical signal power attenuation caused by overlarge bending radius in the routing process of the optical fiber ribbon on the circuit board, a groove digging and fiber routing mode is adopted on the circuit board, and groove digging areas such as the notch 305 and the optical fiber grooves 304 are dug; specifically, one part of the tosa 400 is disposed on the first surface 301 of the circuit board, the other part of the tosa is disposed on the second surface 302 of the circuit board, and the first and second rosa 500a and 500b are disposed on the second surface 302 of the circuit board, such design not only can make full use of the space of the circuit board, but also can shorten the fiber length of the optical fiber to a certain extent, thereby avoiding the attenuation of the optical fiber signal.

Fig. 9 is a schematic structural diagram of the internal portion of the tosa according to the embodiment of the present invention, as shown in fig. 9, the tosa 400 includes a plurality of light emitting chips 401 and a plurality of focusing lenses 402, each of the light emitting chips is connected to a corresponding focusing lens in a one-to-one correspondence, the light emitting chips convert an electrical signal from an upper computer into an optical signal, and the optical signal emitted by the light emitting chips is in a divergent state and is a divergent light beam. In order to facilitate subsequent optical path design and optical coupling into the optical fiber, convergence processing is required. In the conventional convergence, a divergent light beam with a large divergence angle is converged into a parallel light beam and a divergent light beam with a small divergence angle by a focusing lens, and the divergent light beam and the parallel light beam are converged into a converged light beam. The converged light beam is transmitted to the external optical fiber through the transmitting optical fiber ribbon 403 and the optical fiber adapter 600 in sequence. The number of optical fibers in the transmission fiber ribbon 403 is the same as the number of light emitting chips 401 and focusing lenses 402, and each light emitting chip 401 and each focusing lens 402 correspond to each optical fiber in the transmission fiber ribbon one by one. The light emission secondary module is internally provided with at least 4 light emission chips and at least 4 focusing lenses, and the light emission optical fiber array comprises at least 4 light emission optical fibers arranged side by side, wherein the light emission chips are connected with the focusing lenses in a one-to-one correspondence manner. In the embodiment of the present application, 8 light emitting chips, 8 focusing lenses and 8 optical fibers are provided as an example; for better fixation of the transmission fiber ribbon, in the embodiment of the present application, the transmission fiber ribbon 403 further includes a ribbon holder 403a, and 8 fiber placement grooves are equidistantly formed in the ribbon holder 403a, through which the optical fibers pass. It should be noted that the tosa 400 in this embodiment may be configured with 8 optical paths, and the data transmission rate is increased by increasing the number of the optical paths, and may be configured with other numbers in other embodiments.

A common light emitting chip of the optical module is a laser chip, and laser becomes a preferred light source of the optical module and even optical fiber transmission by using a better single-wavelength characteristic and a better wavelength tuning characteristic; even if a special optical communication system adopts the light source, the characteristics and chip structure of the light source are greatly different from those of laser, so that the optical module adopting laser and the optical module adopting other light sources have great technical difference, and a person skilled in the art generally does not consider that the two types of optical modules can give technical inspiration to each other.

In order to fix the light emitting chips and the focusing lenses, the light emitting sub-module 400 is provided with a heat sink 404, the heat sink 404 is embedded in the inner wall of the through hole 303 and is attached to the circuit board 300, and in consideration of the heat dissipation effect, the processing precision, the thermal expansion and other factors, in this embodiment, the heat sink 404 is made of tungsten and copper, that is, an alloy composed of tungsten and copper, but in other embodiments, other materials may be used, such as ceramics and other materials, to mainly perform the heat dissipation and the bearing function, such as for bearing the optical fiber ribbon holder 403a, the plurality of light emitting chips 401, the plurality of focusing lenses 402 and assisting the heat dissipation of the optical fiber ribbon holder 403a, the plurality of light emitting chips 401, and the. Referring to fig. 10, as shown in fig. 10, the heat sink 404 includes a first surface 404a and a second surface 404b, the first surface 404a and the second surface 404b are arranged in a step shape, and the first surface 404a is higher than the second surface 404 b. Fixedly placing a ribbon fixture 403a on the first surface 404 a; the second surface 404b is provided with a plurality of light emitting chips 401 and a plurality of focusing lenses 402.

As shown in fig. 9, in the embodiment of the present application, the tosa 400 further includes a thermoelectric cooler (TEC), one heat exchange surface of the TEC is directly attached to the second surface 404b of the heat sink 404, and the other heat exchange surface is directly in contact with the bottom surfaces of the light emitting chip 401 and the focusing lens 402, so as to ensure that the light emitting chip 401 and the focusing lens 402 can perform efficient heat transfer. In the embodiment of the present application, the TEC is disposed on the second surface 404b, the TEC is connected to the circuit board 300 through the second surface 404b, the plurality of light emitting chips 401 are arranged on the surface of the TEC, and the plurality of focusing lenses 402 are arranged on the surface of the TEC.

Further, as shown in fig. 9, in this embodiment of the application, the tosa 400 further includes an optical isolator 405, the optical isolator 405 is disposed between the focusing lens 402 and the optical fiber ribbon fixture 403a, the laser beam is collimated and converged by the focusing lens 402 to obtain a converged beam, the optical isolator 405 allows the converged beam to pass through in one direction based on the polarization principle of passing light, that is, allows the light from the tosa 401 to the fiber adapter 600 to pass through, prevents some reverse beams from passing through, and prevents the reflected light from returning to the tosa 401, thereby ensuring the quality of the light emission.

Can obtain the optical emission submodule of multichannel through setting up a plurality of optical emission chips and a plurality of lens, obtain 800G optical emission submodule through setting up 8 optical emission chips and 8 lens in this application embodiment, and then turn into optical signal with the electrical signal at a higher rate, go out optical signal transmission through outside optic fibre.

With continued reference to fig. 7, the rosa 500 is disposed on the surface of the circuit board 300, and in another common packaging method, the rosa is physically separated from the circuit board, and the electrical connection is realized through a flexible board. As shown in fig. 7, the optical receive sub-module includes a plurality of photodetectors 502; the photodetector 502 is a key device of the rosa 500, and is configured to convert an optical signal from an external optical fiber into an electrical signal; the optical receive sub-module is described below with reference to fig. 7. Specifically, the first sub-module 500a includes a first set 502a of photodetectors and a second set 502b of photodetectors, each of the photodetectors in the first set 502a of photodetectors is connected to the corresponding optical fiber in the first set 501a of receiving fibers, and each of the photodetectors in the second set 502b of photodetectors is connected to the corresponding optical fiber in the second set 501b of receiving fibers.

The first photodetector group 502a includes at least 4 first photodetectors, and the second photodetector group 502b includes at least 4 second photodetectors; the first receiving fiber set 501a comprises at least 4 first receiving fibers and the second receiving fiber set 501b comprises at least 4 second receiving fibers. In an embodiment of the present application, the first photodetector group comprises 4 first photodetectors, and the second photodetector group comprises 4 second photodetectors; the first receiving optical fiber group comprises at least 4 first receiving optical fibers, the second receiving optical fiber group comprises 4 second receiving optical fibers, and the 800G light receiving submodule is obtained.

Light emission chip 401 and first photoelectric detector group 502a and second photoelectric detector group 502b in this application are located the different surfaces of circuit board 300, that is, light emitter and light receiver layering in this application set up, because the channel quantity is more, the cavity volume of emission submodule is great, the space that this surface can supply to choose for use is less, in order to place the light reception submodule better, this application sets up emitter and light receiver in the different surfaces of circuit board, can see out, this application utilizes the circuit board space more in a flexible way.

The module can receive light of multiple channels by arranging a plurality of photoelectric detectors, and further convert external optical signals into electric signals at a higher speed.

In this application embodiment, for preventing that the module from taking place to remove at the plug in-process circuit board, consequently when designing the module, set up 4 archs on the structure to set up 4 recesses on the relevant position on the circuit board, play the fixed action. Referring to fig. 4, in the embodiment of the present invention, a first side plate and a second side plate are disposed on two sides of the lower housing 202, and a plurality of protrusions 800 are disposed on inner sides of the first side plate and the second side plate; the circuit board 300 is provided with a plurality of grooves 700, the grooves 700 are in concave-convex matching connection with the protrusions 800, and then the circuit board is fixed, and the circuit board is prevented from moving.

The application provides an optical module, which comprises a circuit board, a transmitter optical subassembly and a receiver optical subassembly, wherein a through hole is formed in the middle of the circuit board, the transmitter optical subassembly is embedded into the through hole, part of the transmitter optical subassembly is arranged on a first surface of the circuit board, and part of the transmitter optical subassembly is arranged on a second surface of the circuit board; meanwhile, in the embodiment of the application, one end of the circuit board, which is close to the optical fiber adapter, is provided with a notch, one end of the emitted optical fiber tape is connected with the optical fiber adapter, and the other end of the emitted optical fiber tape is connected with the light emission submodule; the receiving optical fiber band comprises a first receiving optical fiber group and a second receiving optical fiber group, wherein one end of the first receiving optical fiber group is connected with the optical fiber adapter, the other end of the first receiving optical fiber group is connected with the first receiving optical fiber sub-module, similarly, one end of the second receiving optical fiber group is connected with the optical fiber adapter, and the other end of the second receiving optical fiber group is connected with the second receiving optical fiber sub-module.

The optical module provided in the application fully and flexibly utilizes the area of the optical module, and comprises the optical transmitter sub-module and the two optical receiver sub-modules, wherein the optical transmitter sub-module can obtain a multi-channel optical module by adjusting the number of optical transmitters and the optical receiver sub-modules by adjusting the number of optical receivers, so that the requirement of higher transmission rate is met.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

2. The optical module of claim 1, wherein the first rosa and the second rosa are respectively disposed on two sides of the rosa.

3. The light module of claim 1,

the light emission sub-module comprises a heat sink;

the heat sink is embedded in the inner wall of the through hole and connected with the circuit board, and comprises a first surface and a second surface;

the first surface is provided with a transmitting optical fiber ribbon fixing piece, and the transmitting optical fiber ribbon is connected with the light emission submodule through the transmitting optical fiber ribbon fixing piece;

the second surface is sequentially provided with a thermoelectric refrigerator, a plurality of light emitting chips and a plurality of focusing lenses from bottom to top;

each light emitting chip is connected with one focusing lens, and the focusing lenses connected with different light emitting chips are different.

4. The optical module of claim 1, wherein the first sub-module comprises a first set of photodetectors and a second set of photodetectors, each photodetector in the first set of photodetectors being connected to a corresponding optical fiber in the first set of receiving optical fibers, and each photodetector in the second set of photodetectors being connected to a corresponding optical fiber in the second set of receiving optical fibers.

5. The optical module according to claim 1, wherein one end of the through hole is communicated with an optical fiber groove.

6. The optical module of claim 1, wherein the emission optical fiber ribbon comprises at least 4 emission optical fibers arranged side by side, at least 4 light emission chips and at least 4 focusing lenses are arranged in the tosa, and the light emission chips are connected with the focusing lenses in a one-to-one correspondence.

7. The light module of claim 4, wherein the first set of photodetectors comprises at least 4 first photodetectors and the second set of photodetectors comprises at least 4 second photodetectors;

the first receiving fiber group comprises at least 4 first receiving fibers, and the second receiving fiber group comprises at least 4 second receiving fibers.

8. The light module of claim 1, further comprising:

the lower shell comprises a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are arranged on two sides of the bottom plate, and a plurality of bulges are arranged on the inner sides of the first side plate and the second side plate;

the circuit board is provided with a plurality of grooves, and the grooves are connected with the protrusions in a matched mode.