CN113552678A - Wavelength division multiplexing 800G optical module - Google Patents
Wavelength division multiplexing 800G optical module Download PDFInfo
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- CN113552678A CN113552678A CN202110986186.2A CN202110986186A CN113552678A CN 113552678 A CN113552678 A CN 113552678A CN 202110986186 A CN202110986186 A CN 202110986186A CN 113552678 A CN113552678 A CN 113552678A
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- 241000218202 Coptis Species 0.000 claims description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 4
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Abstract
The invention provides a wavelength division multiplexing 800G optical module, which is compact and reasonable in board arrangement, leaves more space for arranging components and parts and meets the packaging requirement of the optical module, a transmitting end component and a receiving end component are respectively arranged on the same surface of a PCB (printed circuit board), the receiving end component is positioned at one side of the transmitting end component, the transmitting end component comprises a laser, an optical lens, a wave combiner, an optical isolator and a collimator which are arranged along a light path, the collimator is connected with an optical fiber, the transmitting end component also comprises a TEC refrigerator and a metal heat sink, the receiving end component comprises a wave separator, an electric chip and a wave separator which are arranged along the light path and connected with the optical fiber, the wave separator and the electric chip are respectively provided with two wave separators, the second wave separator and the second electric chip are respectively arranged at the rear sides of the first wave separator and the first electric chip, the lower ends of the first wave separator and the second wave separator are respectively provided with a slope cushion block, the first wave splitter and the second wave splitter are respectively arranged on the inclined surface of the slope cushion block.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a wavelength division multiplexing 800G optical module.
Background
With the continuous updating and upgrading of communication technology in China, the optical communication industry is continuously developing at a high speed, and the optical module is used as the basis for constructing a modern high-speed information network, plays a central role in the optical communication industry, and is a necessary trend in continuous development.
The development of the current optical module is mainly reflected in high speed and high density, and the number of the optical chips is increasing on the basis of speed improvement. Compared with a 400G optical module, the 800G optical module has a more complex matched circuit, the types and the number of electronic components are multiplied, and the difficulty in realizing the targets of higher integration level, lower power consumption, more board distribution space, better reliability and the like is higher.
Compared with an optical module of 800G in an OSFP packaging form disclosed in Chinese patent with the publication number of CN112711108A, the optical module of the collection wavelength division multiplexing technology has more used components, so how to reasonably arrange a transmitting end component and a receiving end component, and reserving more board distribution space on a PCB is a problem which needs to be solved urgently at present.
Disclosure of Invention
Aiming at the problems, the invention provides the wavelength division multiplexing 800G optical module which is compact and reasonable in board arrangement, leaves more space for arranging components and meets the packaging requirement of the wavelength division multiplexing optical module.
The technical scheme is as follows: the utility model provides a wavelength division multiplexing's 800G optical module, is in including last casing, lower casing and the setting that can splice together go up the PCB circuit board between casing and the lower casing, be provided with control chip, transmitting terminal subassembly, receiving terminal subassembly on the PCB circuit board, its characterized in that: the transmitting end component and the receiving end component are respectively arranged on the same surface of the PCB, the receiving end component is positioned at one side of the transmitting end component, the transmitting end component comprises a laser, an optical lens, a wave combiner, an optical isolator and a collimator which are arranged along a light path, the collimator is connected with the optical fiber, the transmitting end component also comprises a TEC refrigerator and a metal heat sink, the receiving end component comprises a wave separator and an electric chip which are arranged along a light path, the wave separator is connected with an optical fiber, the wave separator and the electric chip are respectively provided with two, the second wave separator and the second electric chip are respectively arranged at the rear sides of the first wave separator and the first electric chip, the lower ends of the first wave splitter and the second wave splitter are respectively provided with a slope cushion block, and the first wave splitter and the second wave splitter are respectively arranged on the inclined plane of the slope cushion block.
Furthermore, the first wave separator and the first electric chip and the second wave separator and the second electric chip are respectively connected through gold thread keys, and the first electric chip and the second electric chip are respectively welded on the PCB.
Furthermore, the length of the slope cushion block is smaller than that of the first wave splitter, and the second electric chip is arranged on the rear side of the slope cushion block below the first wave splitter and located at the lower end of the first wave splitter.
Furthermore, the metal heat sink is fixedly connected with the PCB in a viscose mode, the TEC refrigerator, the wave combiner, the optical isolator and the collimator are fixed on the metal heat sink in a viscose mode, the laser is fixed on the TEC refrigerator in a patch mode, and the optical lens is fixed on the TEC refrigerator in a viscose mode.
Furthermore, the PCB circuit board is provided with an installation abdicating groove corresponding to the transmitting end assembly, the metal heat sink is provided with an installation groove, the TEC refrigerator is installed in the installation groove, and the metal heat sink is provided with an installation boss corresponding to the combiner.
Furthermore, the transmitting end assembly comprises two optical isolators and two collimators, and the optical paths of the first four lasers arranged in parallel are focused and transmitted to the combiner through the optical lenses respectively and then coupled into the optical fiber through the first optical isolator and the first collimator; the last four lasers arranged in parallel transmit the light path to the wave combiner through the optical lens respectively in a focusing manner, and then the light path is coupled into the optical fiber through the second optical isolator and the second collimator.
Furthermore, the component on the metal heat sink corresponding to the other side surface of the PCB board is provided with an avoiding groove.
Furthermore, a dispensing hole is formed in the avoiding groove.
Furthermore, one end of the upper shell is provided with a connecting clamping hook, the lower shell is provided with a connecting clamping groove corresponding to the connecting clamping hook, the other end of the upper shell is provided with an installation screw hole, and the lower shell is provided with an installation through hole corresponding to the installation screw hole.
The 800G optical module of the invention arranges the transmitting end component and the receiving end component on one surface of the PCB, the other surface is not provided with the transmitting end and the receiving end devices, more board distribution space is reserved for the PCB, when in specific arrangement, the receiving end component is positioned at one side of the transmitting end component, the board distribution space of the PCB is efficiently utilized, for the receiving end component, the receiving end component is divided into two groups, each group of receiving end component is respectively provided with a wave splitter and an electric chip, the two groups of wave splitters and the electric chips are arranged in front of each other and behind each other, thus, the narrow space reserved after the transmitting end component is arranged can be fully utilized after the arrangement, meanwhile, for the wave splitter with longer length, the wave splitters are arranged on the PCB by a certain inclination angle through the slope cushion blocks, the occupied space of the PCB is reduced, and the spacing distance between the front and back of the receiving ends is also shortened, make overall structure compacter, effectively improved the space utilization of PCB circuit board, after setting up the slope of wave separator, the longitudinal distance of optic fibre from PCB circuit board becomes far away to can set up electronic components in the position under corresponding optic fibre on PCB circuit board, it is less to the cloth board space influence on the PCB board.
Drawings
Fig. 1 is a schematic diagram of an embodiment of an upper case of a wavelength division multiplexing 800G optical module after separation;
FIG. 2 is a schematic side view of an embodiment of an 800G optical module with separated upper housings;
fig. 3 is a schematic diagram of a first view angle of an embodiment of a wavelength division multiplexing 800G optical module with a housing removed;
fig. 4 is a schematic diagram of a second view angle of the wavelength division multiplexing 800G optical module in the embodiment after the housing is removed;
FIG. 5 is a schematic diagram of a PCB circuit board in an embodiment;
fig. 6 is a schematic diagram of a metal heat sink in an embodiment.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, wherein the drawings provided in the present embodiments illustrate the basic idea of the invention only in a schematic way, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complex.
Referring to fig. 1 to 6, the wavelength division multiplexing 800G optical module of the present invention includes an upper housing 1, a lower housing 2 and a PCB 3 disposed between the upper housing 1 and the lower housing 2, the PCB 3 is provided with a control chip 4, a transmitting end module 5 and a receiving end module 6, the transmitting end module 5 and the receiving end module 6 are respectively disposed on the same surface of the PCB 3, the receiving end module 6 is disposed at one side of the transmitting end module 5, the transmitting end module includes a laser 501, an optical lens 502, a combiner 503, an optical isolator 504 and a collimator 505 disposed along an optical path, the collimator 505 is connected with an optical fiber 7, the transmitting end module further includes a TEC 506 and a metal heat sink 507, the receiving end module 6 includes a splitter, an electrical chip, and a splitter disposed along the optical path and connected with the optical fiber 7, the optical fiber connected with the transmitting end and the receiving end is connected to the outside through an optical fiber adapter, in this embodiment, two wave splitters and two electrical chips are respectively provided, a second wave splitter 601B and a second electrical chip 602B are respectively provided at the rear sides of the first wave splitter 601A and the first electrical chip 602A, the lower ends of the first wave splitter 601A and the second wave splitter 601B are respectively provided with a slope pad 603, the first wave splitter 601A and the second wave splitter 601B are respectively mounted on the inclined surface of the slope pad 603, the slope pad 603 is made of glass, the wave splitter is arranged on the inclined surface of the slope pad in an adhesive manner, the horizontal surface of the slope pad is fixed on the PCB in an adhesive manner, the space occupied by the wave splitter is reduced by arranging the wave splitter on the PCB in a certain inclined angle, after the wave splitter is obliquely arranged, the longitudinal distance of the optical fiber from the PCB is increased, so that electronic components can be arranged on the PCB at a position right below the corresponding optical fiber, the influence on the board distribution space on the PCB is small.
In this embodiment, the receiving terminal assemblies are divided into two groups, each group of receiving terminal assemblies is respectively provided with a wave splitter and an electric chip, and the two groups of wave splitters and the electric chips are arranged in tandem, so that the long and narrow space left after the transmitting terminal assemblies are arranged can be fully utilized. The board distributing structure occupies less space of the PCB, increases the board distributing and wiring space of other electronic components, and has less subsequent design difficulty.
In this embodiment, the first electrical chip 601A and the first electrical chip 602A and the second electrical chip 601B and the second electrical chip 602B are respectively bonded by gold wires, and the first electrical chip 602A and the second electrical chip 602B are respectively soldered on the PCB circuit board 3, so as to shorten the gold wires, and the electrical chip 601 and the electrical chip 602 can be closer to each other, thereby ensuring the transmission performance of high-speed signals.
In addition, because the length of the slope cushion block 603 is smaller than that of the first wave splitter 601A, and the second electric chip 602B is arranged at the rear side of the slope cushion block 603 below the first wave splitter 601A and is positioned at the lower end of the first wave splitter 601A, the arrangement shortens the spacing distance between the front and rear arrangement of the two receiving end assemblies, so that the whole structure is more compact, and the space utilization rate of the PCB is effectively improved.
In this embodiment, the metal heat sink 507 is fixedly connected to the PCB 3 by means of adhesive, the TEC refrigerator 506, the wave combiner 503, the optical isolator 504 and the collimator 505 are fixed to the metal heat sink by means of adhesive, the laser 501 is fixed to the TEC refrigerator 506 by means of a patch, and the optical lens 502 is fixed to the TEC refrigerator 506 by means of adhesive; the corresponding transmitting end component on the PCB circuit board 3 is provided with an installation abdicating groove 301, the metal heat sink 507 is provided with an installation groove 508, the TEC refrigerator 506 is installed in the installation groove 508, and the metal heat sink 507 is provided with an installation boss 509 corresponding to the combiner. The installation grooves 508 and the installation bosses 509 are arranged to enable the light path formed by the laser 501, the optical lens 502, the wave combiner 503, the optical isolator 504 and the collimator 505 to be more collimated.
The material of the metal heat sink in this embodiment is a metal material with low thermal conductivity and thermal expansion coefficient. The metal heat sink is fixed on an installation abdicating groove arranged on the PCB in a gluing mode, the TEC is fixed in an installation groove arranged on the metal heat sink in a gluing mode, and the bottom of the TEC is coated with heat-conducting glue so as to ensure that good heat conductivity exists between the heat-radiating surface of the TEC and the metal heat sink. The laser is fixed on the TEC refrigerating surface in a surface mounting mode, the laser and the PCB realize transmission of electric signals in a gold wire bonding mode, and the laser bonding pad is closely aligned with the corresponding bonding pad on the PCB so as to ensure that the length of the gold wire is as short as possible and ensure the transmission performance of high-speed signals. The wave combiner, the optical isolator and the collimator are fixed on the metal heat sink in a gluing mode and keep a high-precision position relation with the laser.
Specifically, in this embodiment, the transmitting end component includes two optical isolators and two collimators, and the optical paths of the first four lasers 501 arranged in parallel are focused and transmitted to the combiner 503 through the optical lens 502, and then coupled into the optical fiber 7 through the first optical isolator 504 and the first collimator 505; the four lasers 501 arranged in parallel transmit the light path to the combiner 503 through the optical lens 502 respectively in a focusing manner, and then couple the light path into the optical fiber 7 through the second optical isolator 504 and the second collimator 505, and the combiner is used in the implementation, so that the design structure of the transmitting end is simplified, the patch difficulty is reduced, the convenience is brought during patch mounting, and the cost is reduced; of course, in other embodiments of the present invention, two combiners may be provided.
In the wavelength division multiplexing 800G optical module in this embodiment, a wavelength division multiplexing scheme is adopted, light emitted by a laser at a transmitting end is focused on a combiner through a lens, a convex lens structure is arranged at the front end of a collimator, light transmitted by the combiner is converted into parallel light, and a plurality of optical signals with different wavelengths are combined together at maximum efficiency and coupled to one optical fiber for transmission. And the receiving end separates the received optical signals with a plurality of wavelengths by adopting a wave splitter.
In addition, in this embodiment, the component corresponding to the other side surface of the PCB 3 on the metal heat sink 507 is provided with an avoiding groove 510, so that protection of the PCB is ensured, meanwhile, the encroachment of the board distribution space on the PCB is reduced, and the dispensing hole 511 is arranged on the avoiding groove, thereby facilitating the installation of the metal heat sink 507.
In addition, one end of the upper shell 1 is provided with a connecting clamping groove 101, the lower shell 2 is provided with a connecting clamping hook 201 corresponding to the connecting clamping groove 101, the other end of the upper shell 1 is provided with an installation screw hole, the lower shell is provided with an installation through hole 202 corresponding to the installation screw hole, and the upper shell 1 and the lower shell 2 can be locked by screws, so that the packaging reliability of the optical module shell is ensured.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. The utility model provides a wavelength division multiplexing's 800G optical module, is in including last casing, lower casing and the setting that can splice together go up the PCB circuit board between casing and the lower casing, be provided with control chip, transmitting terminal subassembly, receiving terminal subassembly on the PCB circuit board, its characterized in that: the transmitting end component and the receiving end component are respectively arranged on the same surface of the PCB, the receiving end component is positioned at one side of the transmitting end component, the transmitting end component comprises a laser, an optical lens, a wave combiner, an optical isolator and a collimator which are arranged along a light path, the collimator is connected with the optical fiber, the transmitting end component also comprises a TEC refrigerator and a metal heat sink, the receiving end component comprises a wave separator and an electric chip which are arranged along a light path, the wave separator is connected with an optical fiber, the wave separator and the electric chip are respectively provided with two, the second wave separator and the second electric chip are respectively arranged at the rear sides of the first wave separator and the first electric chip, the lower ends of the first wave splitter and the second wave splitter are respectively provided with a slope cushion block, and the first wave splitter and the second wave splitter are respectively arranged on the inclined plane of the slope cushion block.
2. The wavelength division multiplexed 800G optical module according to claim 1, wherein: and the first wave separator and the first electric chip and the second wave separator and the second electric chip are respectively connected through gold thread keys, and the first electric chip and the second electric chip are respectively welded on a PCB (printed circuit board).
3. The wavelength division multiplexed 800G optical module according to claim 1, wherein: the length of the slope cushion block is smaller than that of the first wave splitter, and the second electric chip is arranged on the rear side of the slope cushion block below the first wave splitter and located at the lower end of the first wave splitter.
4. The wavelength division multiplexed 800G optical module according to claim 1, wherein: the metal heat sink is fixedly connected with the PCB in a viscose mode, the TEC refrigerator, the wave combiner, the optical isolator and the collimator are fixed on the metal heat sink in a viscose mode, the laser is fixed on the TEC refrigerator in a patch mode, and the optical lens is fixed on the TEC refrigerator in a viscose mode.
5. The wavelength division multiplexed 800G optical module according to claim 1, wherein: the PCB circuit board is provided with an installation abdicating groove corresponding to the transmitting end assembly, the metal heat sink is provided with an installation groove, the TEC refrigerator is installed in the installation groove, and the metal heat sink is provided with an installation boss corresponding to the combiner.
6. The wavelength division multiplexed 800G optical module according to claim 1, wherein: the transmitting end component comprises two optical isolators and two collimators, and the first four lasers arranged in parallel respectively transmit the light path to the wave combiner through focusing of an optical lens, and then couple the light path into the optical fiber through the first optical isolator and the first collimator; and are
The last four lasers arranged in the row transmit the light path to the wave combiner through the focusing of the optical lens respectively, and then couple the light path into the optical fiber through the second optical isolator and the second collimator.
7. The wavelength division multiplexed 800G optical module according to claim 1, wherein: and the component on the metal heat sink corresponding to the other side surface of the PCB board is provided with an avoidance groove.
8. The wavelength division multiplexed 800G optical module according to claim 1, wherein: and dispensing holes are formed in the avoiding grooves.
9. The wavelength division multiplexed 800G optical module according to claim 1, wherein: the improved structure of the automobile seat is characterized in that one end of the upper shell is provided with a connecting clamping hook, the lower shell is provided with a connecting clamping groove corresponding to the connecting clamping hook, the other end of the upper shell is provided with an installation screw hole, and the lower shell is provided with an installation through hole corresponding to the installation screw hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110986186.2A CN113552678A (en) | 2021-08-26 | 2021-08-26 | Wavelength division multiplexing 800G optical module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110986186.2A CN113552678A (en) | 2021-08-26 | 2021-08-26 | Wavelength division multiplexing 800G optical module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114815088A (en) * | 2022-04-06 | 2022-07-29 | 武汉电信器件有限公司 | Multi-channel optical module |
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| CN116413866A (en) * | 2021-12-30 | 2023-07-11 | 苏州旭创科技有限公司 | Optical module |
| CN217133428U (en) * | 2022-04-12 | 2022-08-05 | 苏州卓昱光子科技有限公司 | Wavelength division integrated CPO device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114815088A (en) * | 2022-04-06 | 2022-07-29 | 武汉电信器件有限公司 | Multi-channel optical module |
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