JP2001194561A - Laser diode module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a laser diode module itself and also to avoid that optical coupling between the tip end part of an optical fiber and the laser diode is affected by the change of an environmental temperature. SOLUTION: A clip 15 which fixes the tip end part of a coated optical fiber 11 to an optical coupling position to the laser diode 1 and a chip carrier 3 in which the laser diode 1 or the like is provided are inclined and fixed within a package 8, and the coated optical fiber 11 whose tip end part is fixed by the clip 15 and which is guided out at an angle according to the inclined angle of the chip carrier 3 is gently bent within the package 8 and is guided out to the outside of the package in parallel to the bottom plate 4 of the package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for optically coupling a laser diode and an optical fiber in a package,
The present invention relates to a laser diode module for extracting laser light emitted from the laser diode to the outside of the package through the optical fiber.

[0002]

2. Description of the Related Art FIG.
No. 9,609, “Fiberoptic”
FIG. 4A is a structural diagram specifically showing a form in which a laser diode and an optical fiber are incorporated in a rectangular parallelepiped package based on the structure of “support clip”, and FIG. 4A is a plan view of the laser diode module, and FIG. 3B is a front view showing a package section in cross section, in which 1 is a laser diode oscillating at a wavelength of 980 nm, 2 is a submount made of aluminum nitride (AlN) on which the laser diode 1 is mounted, 3 is an iron-cobalt-nickel alloy chip carrier on which the submount 2 is mounted, 4 is a package bottom plate on which the chip carrier 3 is mounted,
5 is a package side, 6 is a package penetration pipe attached to the package side 5, and 7 is a package seal ring with low thermal conductivity attached to the package side 5.

[0003] 8 is a package bottom plate 4 and a package side 5
And package through pipe 6 and package seal ring 7
A package made by brazing the space in advance,
9 is a lid attached to the package 8 by resistance welding,
10 is a jacketed optical fiber having a diameter of 400 μm,
Reference numeral 1 denotes an optical fiber core wire in which the UV jacket portion of the jacketed optical fiber 10 is peeled and exposed, 12 denotes a first pipe member of an iron-cobalt-nickel alloy surrounding the optical fiber core wire 11, and 13 denotes an optical fiber core wire 11. A second pipe member 14 made of an iron-cobalt-nickel alloy surrounding the first member 14 is a gold-tin solder fillet for fixing the optical fiber core wire 11 and the first pipe member 12 to each other.

[0005] Reference numeral 15 denotes a clip which is fixed at the upper portion of the first pipe member 12 fixed to the chip carrier 3 by YAG welding. The clip 15 has its lower portion welded to the chip carrier 3 on two sides.

Next, the operation will be described. The laser light having a wavelength of 980 nm emitted from the laser diode 1 is combined with the optical fiber core wire 11 and is extracted from the jacketed optical fiber 10 outside the package 8 and used as an excitation light source for an optical fiber amplifier. In the laser diode module configured as described above, it is necessary to hermetically seal the inside of the package 8 and fill the inside with dry nitrogen in order to improve reliability. Therefore, package 8
It is necessary to previously braze a package seal ring 7 made of metal having a low thermal conductivity and having a height of about 1 mm. The second pipe member 13 has a diameter of 1 mm,
The diameter of the package through pipe 6 is about 3 mm, and the distance between the package through pipe 6 and the package seal ring 7 is 1 mm.
Since a distance of about 3 mm is required, the height from the optical fiber emission portion to the top surface of the package must be at least about 3 mm.

In the manufacturing process, the first pipe member 12 is fixed in advance by YAG welding with the clip 15, and the laser diode 1 and the first pipe member 12 are inserted into the package 8. Since the distance between the first pipe member 12 and the second pipe member 13 is only a few mm, it is necessary to work so as not to break the optical fiber core wire 11 when passing the second pipe member 13 through the package through pipe 6.

[0007]

Since the conventional laser diode module is constructed as described above, the temperature around the laser diode module is -40.degree. C. to +8.
When the temperature fluctuates in the range of 5 ° C., the package bottom plate 4, the chip carrier 3, and the clip 1 are thermally expanded and contracted.
The mechanical stress is applied to the optical fiber core wire 11 connecting the first pipe member 12 fixed via the first pipe member 5 and the second pipe member 13 fixed to the package 8, and the laser diode 1 and the optical fiber core wire 11 are connected to each other. There is a problem that the optical coupling between the two may be out of order.

Further, since the clip 15 is also connected at the upper portion, the height cannot be reduced, and the height of the laser diode module itself cannot be reduced.

Furthermore, in the manufacturing process, the clip 15
Is welded to the chip carrier 3 on two surfaces, so that a floating occurs between the clip 15 and the chip carrier 3 and the optical axis between the laser diode 1 and the optical fiber core wire 11 shifts during YAG welding. there were.

Further, there is a problem that the first pipe member 12 needs an extra length in order to be held by the apparatus when adjusting the optical axis.

Further, the space between the first pipe member 12 and the optical fiber core wire 11 is fixed with gold-tin solder having a melting point of 280 ° C. However, since it is very hard, stress is applied to the optical fiber at the time of soldering. When a polarization maintaining fiber is used as an optical fiber, there is a problem that optical distortion due to solder stress leads to fluctuation of birefringence, and the polarization extinction ratio deteriorates.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a laser diode module capable of reducing the height of the laser diode module itself and reducing the size of the laser diode module itself. I do.

Another object of the present invention is to provide a laser diode module capable of maintaining stable optical coupling between a laser diode and an optical fiber against thermal expansion and thermal contraction due to a change in environmental temperature.

A further object of the present invention is to provide a laser diode module which can easily fine-tune the optical axis deviation during welding and can further facilitate the assembling work.

Further, even when a polarization maintaining fiber is used as an optical fiber, the present invention can maintain the characteristics of the polarization maintaining fiber, reduce the size of the laser diode module itself, and reduce thermal expansion due to changes in environmental temperature. It is an object of the present invention to obtain a laser diode module that can secure stable optical coupling between a laser diode and a polarization maintaining fiber against heat shrinkage, and can further fine-tune the optical axis deviation during welding and facilitate assembly work. .

[0016]

According to the present invention, there is provided a laser diode module comprising: a fixing structure for fixing an end of an optical fiber to an optical coupling position with respect to a laser diode; and a chip provided with the laser diode. A carrier, a concave portion formed on a bottom plate of the package, and having an inclined surface for inclining and fixing the chip carrier in the package; and the fixing structure provided on the chip carrier on the inclined surface of the concave portion. The tip is fixed by, the optical fiber led out of the fixed structure at an angle according to the angle of inclination of the inclined surface is gently bent, and led out of the package in parallel with the bottom plate of the package, An optical fiber lead-out structure formed below the side surface of the package.

A laser diode module according to the present invention is provided with a fixing structure for fixing the tip of an optical fiber at an optically coupled position to the laser diode and the laser diode, and a chip fixed to a bottom plate of a package. A carrier and the tip portion is fixed by the fixing structure provided on the chip carrier, and the optical fiber led out from the fixing structure is gently bent in parallel with the bottom plate of the package, and the bottom plate of the package is formed. At the angle intersecting with the outside of the package,
An optical fiber lead-out structure formed below the side surface of the package.

The laser diode module according to the present invention comprises a first pipe member holding the optical fiber for fixing the tip of the optical fiber at an optical coupling position with respect to the laser diode, and the first pipe member. A fixing structure portion made of an angle material bonded to a part of the first pipe member with a fixing force enabling fine adjustment of optical coupling to the laser diode at the tip portion of the held optical fiber; A tip portion is fixed by a chip carrier provided with the laser diode and the fixed structure portion provided on the chip carrier fixed on a bottom plate of a package, and the fixed structure portion is parallel to the bottom plate of the package. Is led out of the package in parallel with the bottom plate of the package. It is obtained by so and a fiber derived structure.

In the laser diode module according to the present invention, the front end of the core of the optical fiber whose jacket portion has been peeled off is fixed by a fixing structure at an optical coupling position with respect to the laser diode, and the optical fiber led out from the fixing structure. Of the core wire is led out of the package by an optical fiber lead-out structure.

The laser diode module according to the present invention has a configuration using a polarization maintaining fiber as the optical fiber.

The laser diode module according to the present invention comprises: a first pipe member holding a core of the optical fiber for fixing an end of the core of the optical fiber to an optical coupling position with respect to the laser diode; A part of the first pipe member is fixed to the angled material joined with a part of the first pipe member by a fixing force that enables fine adjustment of optical coupling to the laser diode at a core end of the optical fiber held by the pipe member. It is provided in the structural part.

The laser diode module according to the present invention comprises: a first pipe member holding an outer peripheral portion of the polarization maintaining fiber for fixing an end of the polarization maintaining fiber to an optically coupled position to the laser diode; The first
An angle member joined to a part of the first pipe member with a fixing force that enables fine adjustment of optical coupling to the laser diode at the tip of the polarization maintaining fiber held by the pipe member. Is provided in the fixed structure.

In the laser diode module according to the present invention, the side surface portion of the outer peripheral portion on the side where the stress applying portion is provided with respect to the core at the tip portion of the polarization maintaining fiber is
By fixing the polarization maintaining fiber to the end face thereof by a solder fillet, a first pipe member having a tip portion of the polarization preserving fiber fixed at an optically coupled position with respect to the laser diode is provided.

In the laser diode module according to the present invention, the first pipe member has a pipe extension for finely adjusting the optical coupling to the laser diode at the tip of the core of the optical fiber or at the tip of the polarization maintaining fiber. It is configured.

The laser diode module according to the present invention is provided with a flange at the end of the first pipe member on the side facing the laser diode.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. FIG. 1 is a structural diagram showing the configuration of the laser diode module according to the first embodiment, and FIG.
FIG. 1 is a plan view of the laser diode module, and FIG. 1B is a front view showing a package portion in cross section.
In these figures, 1 is a laser diode that oscillates at a wavelength of 980 nm, 2 is a submount made of aluminum nitride (AlN) on which the laser diode 1 is mounted, and 3 is iron-cobalt on which a submount 2 is mounted on its upper surface. A nickel alloy chip carrier 4 is a package bottom plate on which the chip carrier 3 is mounted.

Reference numeral 16 denotes a concave portion formed by pressing the package bottom plate 4. The concave portion 16 has a predetermined angle with respect to the surface of the package bottom plate 4 on the chip carrier 3 mounting side in a direction in which the jacketed optical fiber 10 is pulled out from the package 8. It has an inclined surface inclined downward. The chip carrier 3 is placed on this inclined surface.

Reference numeral 5 denotes a package side surface. Reference numeral 6 denotes a package penetrating pipe (optical fiber lead-out structure) attached to the package side surface 5. The leading end is buried and attached to a bottomed hole formed in the package side surface 5 by a predetermined size. The central axis of the package through pipe 6 is perpendicular to the mounting surface of the package side surface 5. Reference numeral 7 denotes a package seal ring having low thermal conductivity attached to the package side surface 5, reference numeral 8 denotes a package manufactured by previously brazing the package bottom plate 4, package side surface 5, package through pipe 6, and package seal ring 7, and 9 Is an upper cover attached to the package seal ring 7 on the upper opening surface of the package 8 by resistance welding.

Reference numeral 10 denotes an optical fiber with a jacket having a diameter of 400 μm drawn out of the package 8, 11 denotes an optical fiber core wire obtained by removing the UV jacket portion of the optical fiber 10 with a jacket, and 12 denotes the exposed optical fiber. A first pipe member made of an iron-cobalt-nickel alloy is inserted into and penetrates the vicinity of the distal end of the core wire 11.

The outer peripheral surface near the distal end of the optical fiber core wire 11 and the distal end surface of the first pipe member 12 are plated with gold.

13 is the exposed optical fiber core wire 11
A second pipe member (optical fiber lead-out structure) made of an iron-cobalt-nickel alloy having a base portion penetrating the hollow portion thereof, 14 is a portion near the gold-plated end portion of the optical fiber core wire 11 and the first pipe member. A gold-tin solder fillet fixed to the gold-plated tip surface of the pipe member 12 is a clip (fixing structure) 15 for fixing the first pipe member 12 to the chip carrier 3 by YAG welding. is there. That is, the first pipe member 12 has its side surface fixed to the clip 15 by YAG welding at four points,
The base of the clip 15 is fixed to the surface of the chip carrier 3 by YAG welding at six points.

Next, the operation will be described. The laser light having a wavelength of 980 nm emitted from the laser diode 1 is coupled to the optical fiber core wire 11, taken out of the package 8 through the jacketed optical fiber 10, and used as an excitation light source for an optical fiber amplifier. In the laser diode module thus formed, the concave portion 16 having the inclined surface is formed in the package bottom plate 4 by press working, and the clip 15 and the first pipe member 1 are formed.
The tip end of the optical fiber core wire 11 is fixed at a predetermined position with respect to the laser diode 1 via the optical fiber 2, and the tip carrier 3 in which the tip end surface of the optical fiber core wire 11 and the laser diode 1 are optically coupled to each other is inclined. Place on top and fix. For this reason, the direction of the central axis of the first pipe member 12 is not parallel to the surface of the package bottom plate 4 on the chip carrier 3 mounting side, and is constant in the direction in which the jacketed optical fiber 10 is pulled out from the package 8. It is in a state of being inclined downward by an angle.

As a result, the optical fiber core wire 11 extending to the outside of the package 8 in the opposite direction to the laser diode 1 through the hollow portion of the first pipe member 12 and the package side surface 5
And the angle at which the slope has an angle,
From the tip of the optical fiber core wire 11 to the package side 5
Down to a position below the package side surface 5 according to the distance to.

Therefore, the mounting position of the package penetrating pipe 6 can be lowered to a position below the package side surface 5 where the outer peripheral surface is in contact with the surface of the package bottom plate 4 on the chip carrier 3 mounting side. Further, since the chip carrier 3 is placed and fixed on the inclined surface of the recess 16, the distance from the surface of the package bottom plate 4 on the chip carrier 3 placement side to the upper end of the clip 15 is reduced.
The chip carrier 3 is directly mounted on the surface of the package bottom plate 4 on the chip carrier 3 mounting side by the distance the chip carrier 3 sinks and the upper end of the clip 15 is inclined by the angle of the inclined surface. Thus, the height of the entire laser diode module can be reduced by about 1 mm or more than the conventional case.

The optical fiber core wire 11 passes through the hollow portion of the second pipe member 13 attached to the package side surface 5 via the package through pipe 6, and the package 8
Since the second pipe member 13 is attached to the package side surface 5 in parallel with the surface of the package bottom plate 4 on the chip carrier 3 mounting side, the second pipe member 13 is connected to the first pipe member 12 and the second pipe member 13. The optical fiber core wire 11 drawn out of the package 8 through the hollow portion of the second pipe member 13 has a gentle downwardly bent portion R for releasing the pulling force. For this reason, package 8
The mechanical stress applied to the optical fiber core 11 by the thermal expansion and contraction due to the change in the environmental temperature of each fixing member of the optical fiber core 11 such as the package bottom plate 4, the package side 5 and the second pipe member 13. The laser diode 1 and the optical fiber core 1 are absorbed by the bent portion R.
The optical coupling with the one end surface does not become out of order, and stable optical coupling can be maintained even with respect to thermal expansion and thermal contraction due to a change in environmental temperature.

As described above, according to the first embodiment, the package through pipe 6 is attached to the lower part of the package side surface 5 of the package 8 by lowering it.
Of the package bottom plate 4 on the chip carrier 3 mounting side and the vertical distance from the upper end of the clip 15 can be reduced by the amount of the inclination, so that the height of the upper end of the clip 15 can be reduced. This has the effect of obtaining a laser diode module that can be reduced in size and can be reduced in size.

Further, even if the above-mentioned fixing members of the optical fiber core wire 11 undergo thermal expansion and contraction due to a change in environmental temperature,
Since the mechanical stress applied to the optical fiber core wire 11 due to the change in the environmental temperature can be absorbed by the bent portion R, a laser capable of maintaining stable optical coupling between the laser diode 1 and the optical fiber core wire 11. There is an effect that a diode module can be obtained.

Further, the first pipe member 12, the second pipe member 13
Therefore, the clip 15 and the package through pipe 6 can be reduced in size, the height of the laser diode module can be reduced, and the laser diode module itself can be reduced in size.

Embodiment 2 2A and 2B are structural views showing the configuration of the laser diode module according to the second embodiment. FIG. 2A is a plan view of the laser diode module, and FIG. 2B is a front view showing a package portion in cross section. FIG. 2, the same or corresponding parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

In the laser diode module of the first embodiment, the package through pipe 6 is mounted so that its central axis is perpendicular to the mounting surface of the package side surface 5, that is, parallel to the package bottom plate 4. In addition, the mounting position is such that the mounting position is lowered below the package side surface 5.

In the second embodiment, the package penetrating pipe 6 is mounted not only with its mounting position lowered below the package side surface 5, but also with its central axis set in the direction of the package bottom plate 4 from the direction perpendicular to the package side surface 5. To the package side surface 5 at a predetermined angle. Accordingly, the center axis of the second pipe member 13 which is attached to the package side surface 5 through the hollow portion of the package through pipe 6 is also set to the direction perpendicular to the mounting surface of the package through pipe 6 on the package side surface 5. At a predetermined angle toward the package bottom plate 4. Therefore, the direction in which the optical fiber is taken out of the package 8 is not parallel to the package bottom plate 4 but is inclined. The outer peripheral surface of the package through pipe 6 at one end in the optical fiber take-out direction is in contact with the surface of the package bottom plate 4 on the chip carrier 3 mounting side.

The recess 16 is not formed in the package bottom plate 4 as in the first embodiment, and the chip carrier 3 is fixed on the surface of the package bottom plate 4 on the chip carrier 3 mounting side. . Therefore, the chip carrier 3
The first pipe member 12 fixed by a clip 15 is also arranged in parallel with the package bottom plate 4.

Next, the operation will be described. In the laser diode module according to the second embodiment, the position of the bottomed hole into which the other end of the package through pipe 6 is embedded is lowered below the package side surface 5 while being lowered.
Without lowering to the bottom of the package side surface 5, the package penetrating pipe 6 is attached to the package side surface 5 in a state of being inclined at a predetermined angle from the direction perpendicular to the package side surface 5 toward the package bottom plate 4, and the second pipe member 13
Similarly, it is inclined at a predetermined angle in the direction of the package bottom plate 4. For this reason, the direction of taking out the optical fiber to the outside of the package 8 is not parallel to the package bottom plate 4 but is inclined toward the package bottom plate 4.

As a result, the optical fiber core wire 11 is connected to the first pipe member 1 arranged in parallel with the package bottom plate 4.
2 from the first pipe member 12 to the package bottom plate 4, and is led out of the package through the inclined hollow portion of the second pipe member 13. The optical fiber core wire 11 between the second pipe member 13 and the second pipe member 13 is gently bent upward, and the optical fiber core wire 11 is formed with a gentle bent portion for releasing the pulling force indicated by reference symbol S. For this reason, the influence of the thermal expansion and thermal contraction due to the change in the environmental temperature on the optical fiber core wire 11 can be absorbed by the bent portion S, and stable optical coupling between the laser diode 1 and the end face of the optical fiber core wire 11 can be maintained. .

The bottomed hole into which the other end of the package penetrating pipe 6 is buried is formed not at right angles to the surface of the package side surface 5 but at an oblique angle at a predetermined angle. The pipe 6 and the second pipe member 13 are attached to the package side surface 5 in a state where the pipe 6 and the second pipe member 13 are inclined at a predetermined angle from the direction perpendicular to the package side surface 5 toward the package bottom plate 4. Since the end protruding outside the package 8 comes close to the package bottom plate 4, the height from the bottom surface of the package bottom plate 4 to the end of the second pipe member 13 can be reduced. As a result, the height of the second pipe member 13 near the end protruding to the outside of the package 8 can be reduced by about 1 mm or more than the conventional one.

As described above, according to the second embodiment, not only the package penetrating pipe 6 is mounted on the lower portion of the package side surface 5 of the package 8 but also the package penetrating pipe 6 is attached to the package bottom plate 4 by the center axis. In this case, the height of the second pipe member 13 near the end protruding outside the package 8 can be reduced by about 1 mm or more because the second pipe member 13 is attached to the package side surface 5 at a predetermined angle. There is an effect that a laser diode module that can be downsized can be obtained.

Further, even if thermal expansion and contraction occur due to a change in environmental temperature in each fixing member of the optical fiber core wire 11, the tensile force applied to the optical fiber core wire 11 does not affect the bending force formed on the optical fiber core wire 11. The laser diode 1 is absorbed by the portion S, and there is an effect that a laser diode module that can maintain stable optical coupling between the laser diode 1 and the end face of the optical fiber core wire 11 is obtained.

Embodiment 3 FIG. 3 is a structural diagram showing the configuration of the laser diode module according to the third embodiment.
FIG. 9 is a perspective view of an angle member used in place of the clip in the third embodiment. 3, the same or corresponding parts as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 3, reference numeral 17 denotes the angle material (fixing structure) for fixing the first pipe member 12 on the chip carrier 3 by bending a single plate, flattening the bottom surface and processing the cross section into an L-shape. is there. The outer peripheral surface of the first pipe member (fixed structure portion) 12 is fixed to the angle member 17 by YAG welding in the vicinity of the distal end thereof.
Welding is performed on both ends of the angle member 17 that comes into contact with the outer peripheral surface of the first pipe member 12.
2 is fixed on the chip carrier 3. Reference numeral 18 denotes a pipe extension of the first pipe member 12.

The mounting structure of the package through pipe 6 and the second pipe member 13 on the package side surface 5 in the laser diode module of the third embodiment is the same as that of the conventional laser diode module shown in FIG. It is.

Next, the operation will be described. In the third embodiment, instead of the clip 15 shown in FIGS. 1 and 2, an angle member 17 obtained by bending a single plate is used, and when the angle member 17 is fixed on the chip carrier 3, it stands upright. Only one side surface of the outer peripheral surface near the distal end of the first pipe member 12 into the side piece (vertical piece) is set at Y at both ends of the upright side piece of the angle material 17.
The first pipe member 12 is AG-welded so that the end face of the distal end of the optical fiber core wire 11 projecting from the end of the first pipe member 12 on the side of the laser diode 1 faces a predetermined position of the laser diode 1. Is fixed on the chip carrier 3 by the angle member 17.

In this case, since the first pipe member 12 is YAG-welded at both ends of the upright side piece of the angle member 17, the first pipe member 12
Is to be joined to the angle member 17 with such a fixing force as to enable fine adjustment of the tip of the optical fiber core wire 11 with respect to the optical coupling between the tip of the optical fiber core wire 11 and the laser diode 1. Become. Note that the height of the piece on the upright side of the angle member 17 is the first pipe member 1.
2 when the first pipe member 12 is located at a predetermined position
Should be about the height position of the center axis in.

By using the angle material 17 instead of the clip 15, the bottom surface of the angle material 17 is flat, so that the adhesion to the chip carrier 3 can be increased and the assembling work can be facilitated. . Also, the first pipe member 12 is attached to the angle material 17 having such high adhesion.
Is fixed to both ends of the angle member 17 by YAG welding, so that the optical axis deviation at the time of welding can be reduced and the assembling work can be facilitated. Further, only one side surface of the outer peripheral surface near the distal end of the first pipe member 12 is welded to the angle member 17, and the first pipe member 12 is connected to the angle member 17 by YAG welding at both ends of the angle member 17. Since the optical fiber is fixed and fixed on the chip carrier 3, the degree of freedom in finely adjusting the optical axis shift when fixing the optical fiber is increased.

That is, even if the first pipe member 12 is fixed to the angle member 17 by YAG welding, it can be easily applied by applying a force to the pipe extension indicated by reference numeral 18 which is a part of the first pipe member 12. Fine adjustment for optical axis adjustment of about 0.1 μm can be performed. Further, since the angle member 17 can be easily arranged in a stable state near the first pipe member 12, the assembling work can be made efficient and simplified. Further, the first pipe member 12 is fixed on the chip carrier 3 by an angle member 17, and the first pipe member 12 is provided above the first pipe member 12 like the laser diode modules of the first and second embodiments. Clip 1
Since members such as 5 do not protrude, the space inside the package 8 where the chip carrier 3 is placed can be effectively used.

As described above, according to the third embodiment, there is an effect that a fine adjustment of the optical axis deviation at the time of welding is easy, and a laser diode module which can make the assembling work more efficient and easier is obtained. .

The configuration using the angle member 17 described in the third embodiment can be applied to the first and second embodiments. Further, the present invention can be applied to laser diode modules according to Embodiments 4 and 5 described later.

Embodiment 4 FIG. 5 is a structural diagram showing the configuration of the laser diode module according to the fourth embodiment, and FIG.
Is a first pipe member 12 used for adjusting the optical axis.
FIG. 5 is a perspective view showing a flange formed at one end of the first embodiment. 5 and 6, the same or corresponding parts as those in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted. 5 and 6, reference numeral 19 denotes the flange formed at one end of the first pipe member 12;
Is a hole formed in the hole. In the fourth embodiment,
The first pipe member 12 is not provided with the extension 18 as shown in the third embodiment.

Next, the operation will be described. A flange 19 is attached to the end of the first pipe member 12 holding the optical fiber core wire 11 on the side of the laser diode 1,
The flange 19 has a hole 20 formed therein. The flange 19 is used for fine adjustment of the optical axis at the time of manufacturing the laser diode module, and by engaging a hook of an optical axis adjustment facility (not shown) with the hole 20 and applying a force from the outside, The optical axis between the laser diode 1 and the optical fiber core wire 11 is adjusted with an accuracy of about 0.1 μm.
In this case, as shown in FIG. 5, there is no need to provide the first pipe member 12 with the pipe extension 18 as shown in FIG. 3, and the length of the first pipe member 12 can be shortened. The size itself can be reduced.

As described above, according to the fourth embodiment, the adjustment of the optical axis between the laser diode 1 and the end face of the optical fiber core wire 11 is facilitated, and the pipe extension as shown in FIG. There is an effect that a laser diode module which does not need to be provided and which can be downsized can be obtained.

The structure of the flange 19 described in the fourth embodiment is different from the structure of the laser diode module using the angle material instead of the clip 15 in the first and second embodiments, and It can be applied to the configuration of the laser diode module using the polarization maintaining fiber according to the fifth embodiment to be described.

Embodiment 5 FIG. FIG. 7 is a structural diagram showing the configuration of the first pipe member and the polarization maintaining fiber in the laser diode module according to the fifth embodiment. Note that, as the configuration of the other parts of the laser diode module of the fifth embodiment that are not shown in FIG. 7, the configurations described in the first to fourth embodiments can be applied. Therefore, the description of these parts is basically omitted, and also in FIG. 7, the same or corresponding parts as those in FIGS. 1 to 6 are denoted by the same reference numerals, and the description is omitted. In the figure, reference numeral 23 denotes a polarization preserving fiber that is inserted into the hollow portion of the first pipe member 12 and whose distal end projects a predetermined length from the gold-plated distal end surface of the first pipe member 12.

The outer peripheral surface of the distal end portion of the polarization maintaining fiber 23 projecting from the distal end surface of the first pipe member 12 is plated with gold.

The polarization preserving fiber 23 is for maintaining the polarization of the laser light emitted from the laser diode 1 by the stress applied by the stress applying section 21.
There are two stress applying portions 21 and a core 22 in the middle. Reference numeral 24 denotes a cutout surface formed on the outer periphery of the distal end of the first pipe member 12, and the cutout surface 24 is not plated with gold. Reference numeral 14 denotes a gold-tin solder fillet fixed between a distal end surface of the first pipe member 12 and a predetermined portion of an outer peripheral surface of the polarization maintaining fiber 23 protruding from the distal end of the first pipe member 12. It is. The solder fillet 14 is mounted on the outer peripheral surface of the polarization maintaining fiber 23 on which the stress applying portion 21 is formed, and is fixed between the outer peripheral surface portion and the distal end surface of the first pipe member 12. are doing.

Next, the operation will be described. The polarization maintaining fiber 23 is for maintaining the polarization of the laser light emitted from the laser diode 1 by the stress applied by the stress applying section 21. When the polarization preserving fiber 23 is to be fixed to the front end surface of the first pipe member 12 with the solder fillet 14 using the first pipe member 12 not formed, the solder fillet 14 becomes polarized as shown in FIG. Fiber 23
Is applied over the entire circumference of the outer peripheral surface of the tip end, and the stress to be applied by the stress applying section 21 of the polarization preserving fiber 23 is canceled by the fixation by the solder fillet 14 provided over the entire circumference, The polarization extinction ratio deteriorates.

For this reason, a notch surface 24 is formed in the outer peripheral portion of the distal end of the first pipe member 12, and the direction in which the notch surface 24 is formed and the unevenness inserted into the hollow portion of the first pipe member 12. The tip of the first pipe member 12 and the stress applying portion 21 of the polarization preserving fiber 23 are shifted by 90 degrees so that the direction in which the stress applying portion 21 of the wave preserving fiber 23 is formed does not match. The outer peripheral surface of the polarization maintaining fiber 23 is fixed so that the solder fillet 14 does not flow over the entire outer peripheral surface of the polarization maintaining fiber 23 so that the stress acting on the polarization maintaining fiber 23 is not canceled. By doing so, a high polarization extinction ratio is maintained.

In the above description, the notch surface 24 is formed in the outer peripheral surface of the distal end of the first pipe member 12, and the stress of the polarization maintaining fiber 23 and the distal end surface of the first pipe member 12 is formed by the solder fillet 14. The configuration is such that the stress acting on the polarization preserving fiber 23 is prevented from being canceled by fixing the outer peripheral surface of the application portion 21 to the outer peripheral surface. By selectively removing the gold plating that has been performed, that is, leaving only the gold plating in the tip end surface region of the first pipe member 12 in the direction coinciding with the direction in which the stress applying portion 21 of the polarization maintaining fiber 23 is formed. In this manner, the configuration may be such that the solder fillet 14 is not provided on the entire outer peripheral surface of the polarization maintaining fiber 23, and the same effect is obtained.

As described above, according to the fifth embodiment, even when the polarization maintaining fiber 23 is used as the optical fiber, a laser diode module capable of preventing the deterioration of the polarization extinction ratio due to the fixation of the solder fillet 14 is provided. There is an effect that can be obtained.

[0067]

As described above, according to the present invention, a fixing structure for fixing the tip of an optical fiber to an optical coupling position with respect to a laser diode, and a chip carrier provided with the laser diode are provided. A concave portion formed on the bottom plate of the package and having an inclined surface for inclining and fixing the chip carrier in the package; and a tip formed by the fixing structure provided on the chip carrier on the inclined surface of the concave portion. Part is fixed, the optical fiber derived from the fixing structure is gently bent at an angle corresponding to the inclination angle of the inclined surface, and is led out of the package in parallel with the bottom plate of the package. Since it is configured to include an optical fiber lead-out structure configured below the side surface, the distance according to the depth to the inclined surface of the concave portion, It is possible to reduce the height of the fixed structure portion, and furthermore, by configuring the optical fiber lead-out structure below the side surface of the package, the height of the side surface of the package can be reduced and the height of the package can be reduced. The height of the laser diode module itself can be reduced, the size of the laser diode module itself can be reduced, and thermal expansion and contraction due to a change in environmental temperature give an optical coupling between the tip of the optical fiber and the laser diode. The influence can be avoided by the bent portion of the optical fiber that is gently bent, and there is an effect that stable optical coupling between the laser diode and the optical fiber can be maintained.

According to the present invention, the laser diode and the fixing structure for fixing the tip of the optical fiber to the optically coupled position to the laser diode are provided.
A tip carrier is fixed by a chip carrier fixed to a bottom plate of the package and the fixing structure provided on the chip carrier, and the optical fiber led out from the fixing structure in parallel with the bottom plate of the package is gradually loosened. Bent out of the package and led out of the package at an angle crossing the bottom plate of the package, and an optical fiber lead-out structure formed below the side surface of the package. Since the height of the side surface of the package can be reduced and the height of the package can be reduced by configuring the lower side of the package, the height of the laser diode module itself can be reduced, the size of the laser diode module itself can be reduced, and the environmental temperature can be reduced. Thermal expansion and thermal contraction due to the change in The influence on the optical coupling between the diode can be avoided by bending portions obtained by gently bending the optical fiber, there is an effect that can maintain a stable optical coupling between the optical fiber and the laser diode.

According to the present invention, the first pipe member holding the optical fiber for fixing the tip of the optical fiber at the optically coupled position with respect to the laser diode, and the first pipe member holds the optical fiber. A fixing structure portion made of an angle material joined to a part of the first pipe member with a fixing force capable of finely adjusting an optical coupling to the laser diode at the distal end portion of the optical fiber; The tip portion is fixed by the chip carrier provided with the chip carrier, and the fixing structure portion provided on the chip carrier fixed on the bottom plate of the package, and is led out of the fixing structure portion in parallel with the bottom plate of the package. An optical fiber guiding structure for guiding the optical fiber to the outside of the package in parallel with a bottom plate of the package. With this configuration, it is easy to finely adjust the optical axis deviation at the time of welding the tip of the optical fiber to the laser diode by applying a force to the angle member, and furthermore, the first pipe member of the angle member can be finely adjusted. Since the other piece of the angle material that is not joined to a part has a certain area and is flat, the effect is that the chip carrier has good stability with respect to the surface of the chip carrier and can facilitate the assembling work.

According to the present invention, the distal end of the core of the optical fiber whose jacket has been peeled off is fixed to the optical coupling position with respect to the laser diode by the fixing structure, and the core of the optical fiber led out from the fixing structure is connected to the optical fiber. Since the structure for leading out of the package by the optical fiber leading-out structure is provided, the fixing structure and the optical fiber leading-out structure can be reduced in size by removing the jacket portion, and the height of the laser diode module itself can be reduced. This has the effect that the laser diode module itself can be miniaturized.

According to the present invention, since the configuration using the polarization maintaining fiber as the optical fiber is provided, the height of the laser diode module itself can be reduced even when the polarization maintaining fiber is used as the optical fiber. The laser diode module itself can be miniaturized, and the influence of thermal expansion and thermal contraction due to environmental temperature changes on the optical coupling between the tip of the polarization maintaining fiber and the laser diode can be avoided. There is an effect that stable optical coupling with the wave storage fiber can be maintained.

According to the present invention, the first pipe member holding the core of the optical fiber for fixing the tip of the core of the optical fiber to the optically coupled position with respect to the laser diode, and the first pipe member The fixing structure portion includes an angle member bonded to a part of the first pipe member with a fixing force that enables fine adjustment of optical coupling to the laser diode at the core end of the held optical fiber. With such a configuration, fine adjustment of the optical axis deviation during welding is easy, and there is an effect that the assembling work can be further facilitated.

According to the present invention, the first pipe member holding the outer periphery of the polarization maintaining fiber for fixing the distal end of the polarization maintaining fiber to the optically coupled position with respect to the laser diode, With the fixing force that enables fine adjustment of the optical coupling to the laser diode at the tip of the polarization-maintaining fiber held by the pipe member, the angle member joined to a part of the first pipe member. Since the fixing structure is provided, the fine adjustment of the optical axis deviation at the time of welding is easy, and there is an effect that the assembling work can be further simplified.

According to the present invention, the side surface of the outer peripheral portion on the side where the stress applying portion is provided with respect to the core at the distal end portion of the polarization maintaining fiber is fixed to the end surface of the first pipe member by the solder fillet. By so doing, the polarization preserving fiber has a configuration in which the tip of the polarization preserving fiber is fixed at the optical coupling position with respect to the laser diode, so even when the polarization preserving fiber is used as an optical fiber, The height of the laser diode module itself can be reduced while maintaining the characteristics described above, the laser diode module itself can be miniaturized, and the thermal expansion and thermal shrinkage due to a change in environmental temperature cause the tip of the polarization preserving fiber and the laser diode to expand. The effect on the optical coupling with the laser diode can be avoided, and stable optical coupling between the laser diode and the polarization maintaining fiber can be maintained. There can be effectively.

According to the present invention, the first pipe member is provided with a pipe extension for finely adjusting the optical coupling to the laser diode at the tip of the core of the optical fiber or at the tip of the polarization maintaining fiber. With this configuration, there is an effect that fine adjustment of the optical coupling to the laser diode at the tip of the optical fiber or the polarization maintaining fiber can be easily performed by applying a force to the pipe extension.

According to the present invention, since the flange is provided at the end of the first pipe member on the side facing the laser diode, a force is applied to the flange so that the optical fiber or the polarization preserving fiber can be provided. There is an effect that the fine adjustment of the optical coupling to the laser diode at the tip can be easily performed.

[Brief description of the drawings]

FIG. 1 is a structural diagram showing a configuration of a laser diode module according to Embodiment 1 of the present invention.

FIG. 2 is a structural diagram showing a configuration of a laser diode module according to Embodiment 2 of the present invention.

FIG. 3 is a structural diagram showing a configuration of a laser diode module according to Embodiment 3 of the present invention.

FIG. 4 is a perspective view showing a configuration of an angle member used for a laser diode module according to Embodiment 3 of the present invention.

FIG. 5 is a structural diagram showing a configuration of a laser diode module according to Embodiment 4 of the present invention.

FIG. 6 is a perspective view showing a configuration of a flange used in a laser diode module according to Embodiment 4 of the present invention.

FIG. 7 is a structural diagram showing a configuration of a first pipe member and a polarization maintaining fiber in a laser diode module according to a fifth embodiment of the present invention.

FIG. 8 is a structural diagram showing a configuration of a conventional laser diode module.

[Explanation of symbols]

1 laser diode, 3 chip carrier, 4 package bottom plate, 5 package side, 6 package through pipe (optical fiber lead-out structure), 8 package, 10
Optical fiber with jacket, 11 Optical fiber core wire, 1
2 First pipe member (fixed structure), 13 Second pipe member (optical fiber lead-out structure), 14 solder fillet, 15 clip (fixed structure), 16 recess, 17
Angle material (fixed structure), 18 pipe extension, 1
9 Flange, 21 Stress applying part, 22 Core, 23
Polarization preserving fiber.

Claims (10)

[Claims] 1. A laser diode module in which a laser diode and an optical fiber are optically coupled in a package, and a laser beam emitted from the laser diode is taken out of the package by the optical fiber. A fixing structure for fixing a portion to an optical coupling position with respect to the laser diode; a chip carrier provided with the laser diode; and a chip carrier formed on a bottom plate of the package, wherein the chip carrier is inclined in the package. A concave portion having an inclined surface to be fixed and fixed, and a tip portion is fixed by the fixing structure portion provided on the chip carrier on the inclined surface of the concave portion, and the fixing is performed at an angle corresponding to an inclination angle of the inclined surface. The optical fiber led out of the structure is gently bent, and the An optical fiber lead-out structure configured to be led out of the package in parallel with the bottom plate and formed below a side surface of the package. 2. A laser diode module in which a laser diode and an optical fiber are optically coupled in a package, and a laser beam emitted from the laser diode is taken out of the package by the optical fiber. A chip carrier fixed to a bottom plate of the package, provided with a fixing structure portion for fixing a portion at an optical coupling position with respect to the laser diode, and the fixing structure portion provided on the chip carrier. Wherein the tip is fixed, and the optical fiber led out of the fixed structure portion is gently bent in parallel with the bottom plate of the package, and is led out of the package at an angle crossing the bottom plate of the package. Optical fiber lead-out structure below the side The laser diode module comprising the and. 3. A laser diode module in which a laser diode and an optical fiber are optically coupled in a package, and a laser emitted from the laser diode is taken out of the package by the optical fiber. A first pipe member holding the optical fiber for fixing the optical fiber at an optically coupled position with respect to the laser diode, and an optical axis for the laser diode at the distal end of the optical fiber held by the first pipe member A chip carrier provided with a fixing structure portion made of an angle material joined to a part of the first pipe member and a chip carrier provided with the laser diode, with a fixing force enabling fine adjustment of a mechanical connection; The fixing structure provided on the chip carrier fixed on a bottom plate A leading end portion is fixed by the portion, and an optical fiber leading-out structure for leading the optical fiber led out of the fixing structure portion in parallel with the bottom plate of the package to the outside of the package in parallel with the bottom plate of the package. A laser diode module characterized by the above-mentioned. 4. The fixing structure part fixes the core end of the optical fiber from which the jacket portion has been peeled to an optical coupling position with respect to a laser diode, and the optical fiber lead-out structure comprises the optical fiber led out from the fixing structure part. 2. A lead wire of the package is led out of the package.
The laser diode module according to any one of claims 1 to 3. 5. The laser diode module according to claim 1, wherein the optical fiber is a polarization maintaining fiber. 6. A fixing structure comprising: a first pipe member holding a core of the optical fiber for fixing an end of the core of the optical fiber to an optical coupling position with respect to a laser diode; and the first pipe member. An angle member joined to a part of the first pipe member with a fixing force enabling fine adjustment of optical coupling with respect to the laser diode at the tip end of the optical fiber held by the optical fiber. The laser diode module according to any one of claims 1 to 4, wherein: 7. A fixing structure comprising: a first pipe member holding an outer peripheral portion of the laser polarization preserving fiber for fixing an end of the polarization preserving fiber at an optical coupling position with respect to a laser diode; An angle joined to a part of the first pipe member by a fixing force that enables a fine adjustment of an optical coupling to the laser diode at a distal end of the polarization maintaining fiber held by the first pipe member. 6. The laser diode module according to claim 5, comprising a material. 8. A first pipe member, wherein a side surface portion of an outer peripheral portion on a side where a stress applying portion is provided with respect to a core at a distal end portion of the polarization maintaining fiber is fixed to the end surface by a solder fillet. 8. The laser diode module according to claim 7, wherein the tip of the polarization maintaining fiber is fixed at an optically coupled position with respect to the laser diode. 9. The first pipe member is provided with a pipe extension for fine adjustment of optical coupling to a laser diode at a tip of a core of an optical fiber or at a tip of a polarization maintaining fiber. The laser diode module according to any one of claims 6 to 8, wherein: 10. The apparatus according to claim 6, wherein the first pipe member includes a flange attached to an end on a side facing the laser diode. Laser diode module.