JPS5967678A - Laser diode device with optical fiber - Google Patents

Laser diode device with optical fiber

Info

Publication number
JPS5967678A
JPS5967678A JP57177654A JP17765482A JPS5967678A JP S5967678 A JPS5967678 A JP S5967678A JP 57177654 A JP57177654 A JP 57177654A JP 17765482 A JP17765482 A JP 17765482A JP S5967678 A JPS5967678 A JP S5967678A
Authority
JP
Japan
Prior art keywords
fiber
optical fiber
laser diode
stem
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57177654A
Other languages
Japanese (ja)
Inventor
Akira Ishii
暁 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57177654A priority Critical patent/JPS5967678A/en
Priority to KR1019830003149A priority patent/KR840006577A/en
Priority to FR8312880A priority patent/FR2534430B1/en
Priority to GB08323243A priority patent/GB2128768B/en
Priority to DE3336759A priority patent/DE3336759A1/en
Priority to IT23254/83A priority patent/IT1172418B/en
Publication of JPS5967678A publication Critical patent/JPS5967678A/en
Priority to SG416/87A priority patent/SG41687G/en
Priority to HK696/87A priority patent/HK69687A/en
Priority to MY638/87A priority patent/MY8700638A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Road Signs Or Road Markings (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To prevent the deviation of an optical axis after fixing by a method wherein an optical fiber is supported in the state that the total periphery of the optical fiber is surrounded by a fixing material in a groove or a hole provided in a supporting body. CONSTITUTION:A ring formed sealing wall 2 is formed at the center of a stem 1, the inside thereof is bored further deeper, and a pedestal 3 is formed at the center the bottom thereof. Then, a laser diode chip 5 is fixed on a submount 4 on this pedestal 3 by means of solder. A fiber guide 9 wherein the optical fiber 8 is inserted and fitted at the center is fitted into the guide hole 6, and is fixed on the stem 1 with an Ag paste 10. The tip (photo coupling end) of the optical fiber 8 penetrates the hole 20 provided in the supporting body 19 projected to the pedestal 3, and is fixed on the pedestal 3 of the stem 1 by means of the fixing material such as resin or solder.

Description

【発明の詳細な説明】 本発明は元ファイバー付レーザーダイオード装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser diode device with an original fiber.

光通（ｊにおける光通信装置の一つとして本願発明者ら
は、以前に第１図〜第３図に示すような構造の元ファイ
バー付レーザーダイオード装置を提案している。このレ
ーザーダイオード装置は、長方形板のステム１を基にし
又組み立子られている。The inventors of the present invention have previously proposed a laser diode device with an original fiber having the structure shown in FIGS. , is assembled based on the stem 1 of a rectangular plate.

すなわち、ステム１は長方形金属板σ）−面を切削力ロ
エして中央部にリング状封止壁２を形成するとともに、
このリング状封止壁２の内１１１１１をさらに深くくり
抜きかつその底面中央部に台座部３を形作っている。そ
し又、この台座部３士にソルダーを介して固定したサブ
マウント４十にソルダーによっ又レーザーダイオードチ
ップ（チップ）５を固定し又いる。また、ステム１の両
端には・ヲーノプ５のレーザー光を出射する出射面に向
がっ℃延在するガイド孔６．７がそれぞれ設けら第１℃
いる。−万のガイド孔６には光ファイバー８を中心部に
挿嵌固定したファイバーガイド９が嵌合され、銀ベース
ト１０によってステム１に固定され又いる。That is, the stem 1 is formed by cutting a rectangular metal plate σ)-plane with a cutting force to form a ring-shaped sealing wall 2 in the center, and
The inner part 11111 of this ring-shaped sealing wall 2 is hollowed out further and a pedestal part 3 is formed at the center of the bottom surface thereof. Furthermore, a laser diode chip (chip) 5 is also fixed by solder to a submount 40 which is fixed to the three pedestals via solder. In addition, guide holes 6 and 7 are provided at both ends of the stem 1 and extend toward the output surface of the Onop 5 for emitting the laser beam.
There is. - A fiber guide 9 having an optical fiber 8 inserted and fixed in the center thereof is fitted into the ten thousand guide holes 6, and is also fixed to the stem 1 by a silver base plate 10.

元ファイバー８の先端はチップ５の一万の出射面に対面
し、レーザー光を元ファイバー８内に取り込むようにな
っ℃いる。この際、第３図にも示すよ５ｆＣ，元ファイ
バー８の先端音１ｉはレジンあるいはソルダ等の固定材
１１によってステム１の台座部３に固定され、撮動によ
っ又光ファイバー８への光敗込効率（光結合効率）が変
動り、　１ｘいように配慮されている。なお、光ファイ
バー８のコア径が８μｍφ程度σ）シングル・モード・
ファイバ〜にあっ又は、使用に耐える所望の光結合効率
を得るには、チップ５に対する元ファイバー８の先端の
相対的光軸合せ精度は、たとえは±０．２〜０．３μｍ
以内にしプｒければならない。The tip of the original fiber 8 faces the output surface of the chip 5, so that the laser beam is taken into the original fiber 8. At this time, as shown in FIG. 3, the tip sound 1i of the original fiber 8 at 5fC is fixed to the pedestal part 3 of the stem 1 with a fixing material 11 such as resin or solder, and the optical fiber 8 is also exposed to light loss by imaging. The coupling efficiency (optical coupling efficiency) fluctuates and is taken into consideration so that it is 1x. Note that the core diameter of the optical fiber 8 is about 8 μmφσ) single mode
In order to obtain a desired optical coupling efficiency suitable for use with the fiber, the relative optical axis alignment accuracy of the tip of the original fiber 8 with respect to the chip 5 should be, for example, ±0.2 to 0.3 μm.
must be within the range of

−万、前記他方のガイド孔７にはモニターファ４　バー
１２カ挿嵌固定されている。、このモニターフｒイノ仁
−１２の先端はブーツブ５σ）他方の出射面に対面し、
レーザー光の光強度ケモニターするようになっている。- 12 monitor bars 4 are inserted and fixed into the other guide hole 7. , the tip of this monitor fly 12 faces the other output surface of the boot tab 5σ),
It is designed to monitor the light intensity of the laser light.

また、ステム１には２不のり−ド１３，１４が配設され
又いる。−万のり一部１３はグランドリードであって、
ステムＩＫ溶接され、ステム１およびザブマウント４を
介し、又チップ５の下部電極に電気的に繋がっている。The stem 1 is also provided with two fixed boards 13 and 14. -Manori part 13 is the ground lead,
The stem is IK welded and is electrically connected to the lower electrode of the tip 5 via the stem 1 and sub mount 4.

また、他方のリード１３はステム１に図示しないガラス
（絶縁体）を介して固定されるとともに、内端はステム
１の端面からリング状封止壁２内の空間部に突出してい
る。そし゛〔、この内躊とチップ５の上部電極とは金線
からなる導線（ワイヤ）１５で［気的Ｖｒ、接続されて
いる。さらに、リング状封止壁２の上面にはシーム１ノ
エルドによって板状のキャンプ１６か気密的に取り１丁
けられ、ブーツブ５等を気密的に封正し１いろ。The other lead 13 is fixed to the stem 1 via a glass (insulator) not shown, and its inner end protrudes from the end surface of the stem 1 into the space inside the ring-shaped sealing wall 2. Then, this internal resistor and the upper electrode of the chip 5 are electrically connected by a conductor (wire) 15 made of gold wire. Further, a plate-shaped camp 16 is airtightly installed on the upper surface of the ring-shaped sealing wall 2 by seam 1 noelding, and the boot tab 5 and the like are airtightly sealed.

ところで、このようなし／−ザーダイオード装同におけ
るファイバーとレーザーチップの元軸合わせは、固定さ
れたレーザーチップ５から出射されろレーザー光を）ｔ
ファイバー１３にｆ１″大眼に取り込めろ位置を元ファ
イバー８を移動させたから光検出器により′″ＣＩＵ：
、確に固定し、しかる後ファイバーを固定することによ
り行なわれろか、元ファイバーとデツプの元軸合ねすを
いくらｉＥ　（１ｍに行っ又も冗ファイバー固定後には
光軸がずｔｔ、−ｃシまい光結合効率が劣化ずろことが
判明した。By the way, alignment of the original axes of the fiber and the laser chip in such laser diode mounting is necessary to ensure that the laser light emitted from the fixed laser chip 5 is not
Since the original fiber 8 has been moved to the position where f1'' is taken into the large eye into the fiber 13, the photodetector detects ''' CIU:
How much iE (if you go to 1m and fix the redundant fiber, the optical axis will be tt, -c It was found that the optical coupling efficiency deteriorated as a result.

コ（＋）原因は固ｒｉａｌの硬化収縮によって）Ｃファ
イバー８の光結合端がＴ刀に引き下げられて元の位置２
よりずＪじ（しま５ことにある。(+) The reason for this is due to hardening and shrinkage of the hard real.) The optical coupling end of the C fiber 8 is pulled down to the T sword and returned to its original position 2.
Yorizu Jji (It is in Shima 5).

この様子を第４図に示す。第４図は第１図のＩ−■線に
沿う一部断面を模式的に示すもので、レシン等の固定材
１１は元ファイバー８の下方に末広がりし硬化の際にフ
ァイバーを引き下げることとなる（図中、引き下げの力
が１動く向きを矢印で示す）。この引き下げは最大で０
．３〜０．４μｍも生じることから、従来の構造では光
結合効率の悪さＫよる歩留の低下が生じてしまい、特に
コア径数μｍのシングルモールドファイバー９１合、は
とんど元がとりこめなくなるという欠点があった。This situation is shown in FIG. FIG. 4 schematically shows a partial cross section along line I-■ in FIG. 1, and the fixing material 11, such as resin, spreads below the original fiber 8 and pulls down the fiber during curing. (In the figure, the direction in which the pulling force moves by one is indicated by an arrow). This reduction can be up to 0
．． 3 to 0.4 μm, so in the conventional structure, the yield decreases due to the poor optical coupling efficiency, and in particular, single molded fibers with a core diameter of several μm are difficult to capture. The drawback was that it disappeared.

本発明は上記のような欠点をとりのぞくためになされた
ものであり、その目的は元ファイバーを取り付けたレー
ザーダイオード装置において、高い光結合効率を維持で
きる光フアイバー付レーザーダイオード装置を提供する
ことにある。The present invention has been made to eliminate the above-mentioned drawbacks, and its purpose is to provide a laser diode device with an optical fiber that can maintain high optical coupling efficiency in a laser diode device with an original fiber attached. .

このような目的を達成するために本発明は、レーザーダ
イオードチップの出射面から出射されるレーザー光に当
接するように配置された元ファイバーの光結合端を有す
る光フアイバー付レーザーダイオード装置におい又、前
記光ファイバーは支持体に設けた溝または孔中で充填硬
化させるレジンまたはろう材からなる固Ｗ材の中心部に
支持され、）“Ｃファイバーの全外周で半径方向に引っ
張られＩＩがら支持されるものであっ℃、以）、実施例
により本発明を説明する。In order to achieve such an object, the present invention provides a laser diode device with an optical fiber, which has an optical coupling end of the original fiber arranged so as to be in contact with the laser light emitted from the emission surface of the laser diode chip. The optical fiber is supported at the center of a solid W material made of resin or brazing material that is filled and hardened in a groove or hole provided in the support, and is supported while being pulled in the radial direction around the entire outer circumference of the C fiber. The present invention will be explained by way of examples.

第５図は本発明の一実施例によシ」）ｔファイバー付レ
ーザーダイオード装置の一部を切り欠いた状態の平面図
、＠６図は第４図のＶ−Ｖ線に沿う断面図、第７図は同
じく固定材による元ファイバーの固定状態を示す一部拡
大図、第８図、第９図は第５図の川−■線に沿う切断断
面図であり元ファイバー支持部を模式的に拡大し１こも
のである。Fig. 5 is a partially cutaway plan view of a laser diode device with t-fiber according to an embodiment of the present invention, and Fig. 6 is a sectional view taken along line V-V in Fig. 4. Figure 7 is a partially enlarged view showing how the original fiber is fixed by the fixing material, and Figures 8 and 9 are cross-sectional views taken along the river-■ line in Figure 5, which schematically shows the original fiber support part. It has expanded to 1 piece.

この実施例のレーザーダイオード装置、は、第１図〜第
３図に示す従来のレーザーダイオード装置と同様に、長
方形の金属ステム１を基にして組み立てられ℃いる。す
なわち、ステム１は長方形金属板の一面を切削加工して
中央部にリング状封止壁２を形成するとともに、このリ
ング状封止壁２の内側をさらに深くくり抜きかつその底
面の中央部に台座部３を形作っている。そし又、このむ
座部３上にソルダーを介して固定したサブマウント４上
にソルダーによりル−ザーダイオードチップ（チップ）
５を固定していイ）。また、ステム１０両端にはチップ
５のレーザー元を出射する出射面に向かっ−こ延在する
ガイド孔６，７がそれぞれ設けられている。−万のガイ
ド孔６には元ファイバー８を中心部に挿嵌固定し１こフ
ァイバーガイド９が嵌合され、銀ベース）１０にょっ℃
ステムｌに固定されている。光ファイバー８の先端はチ
ップ５の一部の出射面に対面し、レーザー元を元ファイ
バー８内に取り込むようになっている。The laser diode device of this embodiment is assembled based on a rectangular metal stem 1, similar to the conventional laser diode device shown in FIGS. 1-3. That is, the stem 1 is made by cutting one side of a rectangular metal plate to form a ring-shaped sealing wall 2 in the center, and further hollowing out the inside of the ring-shaped sealing wall 2 and installing a pedestal in the center of the bottom surface. Forming part 3. Furthermore, a loser diode chip (chip) is mounted by soldering on the submount 4 which is fixed on the seat part 3 via solder.
5 is fixed a). Furthermore, guide holes 6 and 7 are provided at both ends of the stem 10, respectively, and extend toward the emission surface from which the laser source of the chip 5 is emitted. - The original fiber 8 is inserted and fixed in the center of the guide hole 6, and the fiber guide 9 is fitted, and the silver base) is heated to 10℃.
It is fixed to the stem l. The tip of the optical fiber 8 faces a part of the output surface of the chip 5, and the laser source is introduced into the original fiber 8.

この際、第７図にも示すように、元ファイバー８の先端
部（光結合端）は、台座部３ＶＣ突出し１こ支持体１９
に設けられた孔２ｏを貫き、レジンあるいはソルダ等の
固定材によってステム１０台座部３に固定され、振動に
よって九ノアイパー８への元取込効率（光結合効率）が
変動しないように配慮さｔ１″′Ｃいる。また、この実
施例の元ファイバー８のコア径２１は５〜１０μｍの直
径となっ又いる。また、支持体１９の上部は斜面２２と
なり、０、５　ｍｍφ程ＩＷの孔２０内にレジンあるい
はろう材からなる固定材１１を供給し７易いように７ｒ
つ℃いる。さらに、支持体１９の内ｌＩＩ！ｌの台座部
分には孔２０から溢れ出した固定材１１を受けて流す０
．５ｍｍ幅の流出溝２３が設けられ又いる。このため、
孔２０から溢れ出した固定制１１によっ℃サブマウント
４やチップ５の瑞面を塞いだりすることはなく、レーザ
ー尤の受電に支障は生じない。At this time, as shown in FIG.
The stem 10 is fixed to the pedestal part 3 by a fixing material such as resin or solder, and is designed to prevent the original intake efficiency (light coupling efficiency) to the Kuno Iper 8 from changing due to vibration. In addition, the core diameter 21 of the original fiber 8 in this embodiment is 5 to 10 μm.The upper part of the support 19 becomes a slope 22, and the hole 20 of IW is about 0.5 mmφ. Supply the fixing material 11 made of resin or brazing material inside the 7r so that it is easy to
There's one. Furthermore, lII! of the support body 19! The pedestal part of l receives the fixing material 11 overflowing from the hole 20.
．． An outflow groove 23 with a width of 5 mm is also provided. For this reason,
The fixing system 11 overflowing from the hole 20 does not block the apertures of the C submount 4 or the chip 5, and there is no problem in receiving power from the laser.

−万、前記他方のガイド孔７にはモニターファイバー１
２が挿嵌固定されている。このモニターファイバー１２
の先端はチップ５の他方の出射面に対面し、レーザー元
の光強Ｉｆをモニターするようにプｆっている。また、
ステム１には２本のり一部１：（，１４が配設され又い
る。一方のり一部１３はグランドリードであって、ステ
ム１に溶接され、ステム１およびサブマウント４を介し
てチップ５の下部電極に電気的に繋がっている。また、
他方のリード１３はステム１に図示しないガラス（絶縁
体）を介し℃固定されるとともに、内端はステム１の端
面からリング状封止壁２内の空間部に突出している。そ
し又、この内端とチップ５の上部電極とは金心からなる
導１ＩＡ（ワイヤ）１５で電気的に接続されている。さ
らに、リング状封止壁２の土面にはシームウェルドによ
って板状のキャップ１６が気密的に取り付けられ、チッ
プ５等を気密的に封止している。- 10,000, monitor fiber 1 is installed in the other guide hole 7.
2 is inserted and fixed. This monitor fiber 12
The tip faces the other output surface of the chip 5 and is angled so as to monitor the light intensity If of the laser source. Also,
Two glue portions 1:(, 14) are disposed on the stem 1. One glue portion 13 is a ground lead and is welded to the stem 1, and is connected to the chip 5 via the stem 1 and the submount 4. It is electrically connected to the lower electrode of the
The other lead 13 is fixed to the stem 1 through a glass (insulator) (not shown) at a temperature of 0.degree. C., and its inner end protrudes from the end surface of the stem 1 into the space within the ring-shaped sealing wall 2. Furthermore, this inner end and the upper electrode of the chip 5 are electrically connected by a conductor 1IA (wire) 15 made of a metal core. Further, a plate-shaped cap 16 is airtightly attached to the soil surface of the ring-shaped sealing wall 2 by seam welding, and the chip 5 and the like are hermetically sealed.

このようなレーザータイオード装置は、その組立時、デ
ツプ５と元ファイバー８との光軸合せを行なつ１こ後に
、固定材１１を光ファイバー８が貫通する孔２０内に供
給Ｌ２固足材１１を硬化させるため光ファイバー８は第
８図で示すように、孔２０の中心を貫き、全外周部を固
定制１１で均一に支持されることとなる。この結果、固
定材１１の硬化収縮が始まっ王も、元ファイバー８は全
外周部を均一に半径方向に引っ張られることから、光軸
合せ時の位置を変えることなく固定され、チップ５との
光結合効率は最上の状態を維持することとなる。したが
って、光結合効率の良好なレーザーダイオード装置を歩
留よく製造することができる。When assembling such a laser diode device, after aligning the optical axes of the depth 5 and the original fiber 8, the fixing material 11 is supplied into the hole 20 through which the optical fiber 8 passes, and the L2 fixing material 11 is inserted into the hole 20 through which the optical fiber 8 passes. In order to harden the optical fiber 8, the optical fiber 8 passes through the center of the hole 20 and is uniformly supported by the fixing member 11 around the entire outer periphery, as shown in FIG. As a result, even though the fixing material 11 begins to harden and shrink, the entire outer circumference of the original fiber 8 is pulled uniformly in the radial direction, so it is fixed without changing its position when aligning the optical axis, and the optical fiber 8 with the chip 5 is The coupling efficiency will be maintained at its highest level. Therefore, a laser diode device with good optical coupling efficiency can be manufactured with high yield.

γｊお、本発明は前記実施列に駆足され７ｊい。たとえ
は、第９図に示すように、九ファイバー８を支持する支
持体１９には溝２４を設ｋｒ、元ファイバー８はこの？
１り２４の中心な只き、溝２４に充填される固定制１１
で光ファイバー８の外周全体を支持するようにしても、
前記実施例同様に元ファイバー８はツ（，１ｌｉｌｌ＋
　＠せ時の状態を維持し、つつ固定される。γj Oh, the present invention is driven by the above-mentioned implementation sequence. For example, as shown in FIG. 9, a support 19 supporting nine fibers 8 is provided with a groove 24, and the original fiber 8 is placed in this groove.
Fixed system 11 filled in the groove 24 at the center of the hole 24
Even if the entire outer circumference of the optical fiber 8 is supported by
As in the previous embodiment, the original fiber 8 is
＠It maintains its original state and is fixed.

本発明はウシファイバーのコア径が細いシングルモード
ファイバー付レーザーダイオード装置に適用してもっと
も効果がある。The present invention is most effective when applied to a laser diode device with a single mode fiber whose core diameter is small.

以十のように、本発明によれは、高い光結合効率なｉ（
１持できる）しファイバー付レーザーダイオード装置を
提供することができる。As described above, according to the present invention, i(
1) and can provide a fiber-attached laser diode device.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の尤ファイバー（；Ｊレーザーダイオード
装置の一部を切り欠いた状態の平面図、第２図は第１図
の１１−■線に沿う断面図、第３図は＠２図の一部を示
す孤大断面図、第４図は従来技術の欠点を説りＪするた
めの第１図におけるＩ−１線に沿う断面図、 第５図は本発明の一実施例による光フアイバー付レーザ
ーダイオード装置の一部を切り欠いた状態の平面図、 第６図は第４図のｖ−Ｖ糾に沿う断面図、第７図は第５
図の一部を示す拡大断面図、第８図は＠５図のｌｉｔ　
−Ｉｌｌ線に沿う光フアイバー支持部を示す拡大断面図
、 第９図は本発明の他の実施例による元ファイバー支持部
を示す拡大断面図である。 １・・・ステム、３・・・台座部、４・・・サブマウン
ト、５・・・チップ、８・・・ノＣ；ファイバー、１１
・・・固定材、１２・・・モニターファイバー、１３．
１４・・・リード、１５・・・ワイヤ、１６・・・キャ
ップ、１８・・・レーザー光、１９・・・支持体、２０
・・・孔、２１・・・コア径、２２・・・斜面、２３・
・・流出溝。 第　　１　　図 第　　２　図 第３１＝’４ ／ 第　４　図 第　　５　図 ７４ 第　　７　図 ２Figure 1 is a partially cutaway plan view of a conventional optical fiber (; FIG. 4 is a cross-sectional view taken along line I-1 in FIG. 1 for explaining the shortcomings of the prior art; FIG. A partially cutaway plan view of the fiber-equipped laser diode device, FIG. 6 is a sectional view taken along the v-V line in FIG. 4, and FIG.
An enlarged sectional view showing a part of the figure, Figure 8 is a lit of Figure @5
FIG. 9 is an enlarged cross-sectional view showing an optical fiber support section along line Ill. FIG. 9 is an enlarged cross-sectional view showing an original fiber support section according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Stem, 3... Pedestal part, 4... Submount, 5... Chip, 8... C; Fiber, 11
...Fixing material, 12...Monitor fiber, 13.
14... Lead, 15... Wire, 16... Cap, 18... Laser light, 19... Support, 20
... hole, 21 ... core diameter, 22 ... slope, 23.
・Outflow groove. Figure 1 Figure 2 Figure 31='4 / Figure 4 Figure 5 Figure 74 Figure 7 Figure 2

Claims (1)

【特許請求の範囲】 １、　レーザーダイオードチップの出射面から出射され
るレーザー光に当接するように配置された光ファイバー
の光結合端を有する元ファイバー付レーザーダイオード
装置において、前記元ファイバーは、支持体に設けられ
た溝または孔において固定材に元ファイバー全周をとり
囲まれる状態で支持されていることを特徴とする光フア
イバー付レーザーダイオード装置。 ２、前記固定材はレジンまたはろう材からなっているこ
とを特徴とする特許請求の範囲＠１項記載の光フアイバ
ー付レーザーダイオード装置。[Claims] 1. In a laser diode device with an original fiber having an optical coupling end of an optical fiber arranged so as to come into contact with laser light emitted from an output surface of a laser diode chip, the original fiber is attached to a support body. 1. A laser diode device with an optical fiber, characterized in that the original fiber is supported by a fixing material in a groove or hole provided in the groove or hole in such a manner that the entire circumference of the original fiber is surrounded. 2. The laser diode device with an optical fiber according to claim 1, wherein the fixing material is made of resin or brazing material.
JP57177654A 1982-10-12 1982-10-12 Laser diode device with optical fiber Pending JPS5967678A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP57177654A JPS5967678A (en) 1982-10-12 1982-10-12 Laser diode device with optical fiber
KR1019830003149A KR840006577A (en) 1982-10-12 1983-07-11 Light emitting device
FR8312880A FR2534430B1 (en) 1982-10-12 1983-08-04 LIGHT EMITTING DEVICE
GB08323243A GB2128768B (en) 1982-10-12 1983-08-30 Connecting optical fibre to a light emitting device
DE3336759A DE3336759A1 (en) 1982-10-12 1983-10-10 LIGHT-EMITTING DEVICE
IT23254/83A IT1172418B (en) 1982-10-12 1983-10-11 LIGHT-EMITTING DEVICE
SG416/87A SG41687G (en) 1982-10-12 1987-05-06 A light emitting device
HK696/87A HK69687A (en) 1982-10-12 1987-09-24 A light emitting device
MY638/87A MY8700638A (en) 1982-10-12 1987-12-30 A light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177654A JPS5967678A (en) 1982-10-12 1982-10-12 Laser diode device with optical fiber

Publications (1)

Publication Number Publication Date
JPS5967678A true JPS5967678A (en) 1984-04-17

Family

ID=16034762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57177654A Pending JPS5967678A (en) 1982-10-12 1982-10-12 Laser diode device with optical fiber

Country Status (9)

Country Link
JP (1) JPS5967678A (en)
KR (1) KR840006577A (en)
DE (1) DE3336759A1 (en)
FR (1) FR2534430B1 (en)
GB (1) GB2128768B (en)
HK (1) HK69687A (en)
IT (1) IT1172418B (en)
MY (1) MY8700638A (en)
SG (1) SG41687G (en)

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US4702556A (en) * 1983-08-22 1987-10-27 Hitachi, Ltd. Method of assembling a light emitting device with an optical fiber
US4834492A (en) * 1983-08-22 1989-05-30 Hitachi, Ltd. Light emitting device with an optical fiber and a deformable support member for supporting the optical fiber
US4883342A (en) * 1983-08-22 1989-11-28 Hitachi, Ltd. Method of assembling a light emitting device with an optical fiber
US4756592A (en) * 1984-07-11 1988-07-12 Hitachi, Ltd Luminescent package device for coupling an optical fiber with a luminescent element
JPH0279805A (en) * 1988-09-16 1990-03-20 Nippon Telegr & Teleph Corp <Ntt> Method for connecting optical waveguide and optical fiber

Also Published As

Publication number Publication date
HK69687A (en) 1987-10-02
KR840006577A (en) 1984-11-30
MY8700638A (en) 1987-12-31
GB2128768B (en) 1986-07-30
IT8323254A0 (en) 1983-10-11
SG41687G (en) 1987-07-17
GB2128768A (en) 1984-05-02
FR2534430A1 (en) 1984-04-13
FR2534430B1 (en) 1988-01-15
DE3336759A1 (en) 1984-07-26
GB8323243D0 (en) 1983-09-28
IT1172418B (en) 1987-06-18
IT8323254A1 (en) 1985-04-11

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