JPS59188183A - Light communication device and manufacture thereof - Google Patents

Abstract

PURPOSE:To accurately and simply mount a light receiving element and to enable to stably increase the laser light intensity against the vibration by securing the light receiving element to the end face of leads before a stem is secued to a stage and finishing the wire extending work to the electrode of the light receiving element. CONSTITUTION:A light receiving element 13 is secured to a mount 26 of the inner end of leads 18, and the electrodes of the element 13 and the inner end of the prescribed lead 17 are connected via wirings 14. Then, a stepped disclike stage 25 is engaged fixedly in a sealed state by using solder to the hole of the lower part of the punched portion of a stem 1. A semiconductor laser element 5 is secured by solder through a submount 4 on a pedestal 3, and the upper electrode and the inner end of the lead 19 are electrically connected via wirings 22. An optical fiber 7 is secured by a bonding material 28 bonded to the inner end of the fiber guide 6, and the airtightness in the bore of the fiber guide is maintained. Then, a disclike cap 27 is airtightly mounted to airtightly seal the element 5, thereby manufacturing a light communication device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to technology 1/ζ which is particularly effective when applied to optical communication technology, and relates, for example, to an optical communication device on the transmitting side in optical communication and a method for manufacturing the same.

[Dorsal Tract Technique] As one of the transmitting side optical communication devices in the photon Buddha, the present applicant has developed an optical fiber diode device with a structure as shown in FIG. This laser diode device has 4 rectangles! , stem 1? It is constructed on the basis of In other words, is stem 1 one side (top side) of a rectangular metal plate? Cut 7J + l T and form two ring-shaped sealing walls on -, and jump) Ring Soushi
The interior of the stop wall 2 is cut out deeper and three pedestals are formed in the center of the JK surface.

Also, is this pedestal part 3+ solder? Five semiconductor conductor elements are fixed by solder to the rib mount 4-H which is fixed through the mount 4-H. Sorry, there is a fiber guide 67'Ii on the peripheral wall of one end of the stem 1 facing one exit surface from which the laser light of the Lee element 5 is emitted.
W is fixed. Optical fiber 7 in the center of this fiber guide 6? ! 7 built-in optical fiber 70 The inner end of the optical fiber 70 faces one emission surface of the semiconductor laser element 5 and is adapted to take in laser light.

On the other hand, a lead stem 8 is disposed on the side facing the other emission surface of the semiconductor laser element ([/-Zarchisop) 5. This lead stem 8 is connected to the main body 9 of the The main surface of book #9 and the two books protruding from the edge of the main surface
It consists of auxiliary leads 10° and 11, which are recessed due to its nature. The inner end of one of the auxiliary leads 10 located on the main surface of the main body has a wide tip 1 and a tip holding portion 12, and this tip receiving portion 11 receives the laser beam emitted from the racer chip 5. The light-receiving element (light-receiving chip) 13 is not fixed.

Moreover, the electrode of this light receiving chip 13 and the other auxiliary lead 1
It is connected to the inner end of 1 via a wire (conductor) 14 on the mold side. In addition, these two auxiliary leads i 0 , i
The outer end of i passes through the circumferential wall of the stem 1 and is covered with an insulator 15, 16, such as glass. It is connected by welding, welding, etc. to the inner ends of two leads 17 and 18 which are fixed via r. These leads 17 and 18 serve as output terminals when detecting the light intensity chemical generated on the light receiving chip 13.

On the other hand, two leads 1920 are separately attached to the peripheral wall of the stem 1. One is directly attached to the stem 1 by welding and has an equipotential with the lower electrode of the laser chip 5 via four submounts, and the other one passes through the peripheral wall of the stem 1 and is made of an insulator such as glass. 21? The narrow end of a wire (conducting wire) 22 is fixed at its inner end to the top pole of the laser chip 5, and one end is fixed to the pole.

Therefore, when a predetermined voltage is applied to the pair of leads 19 and 20, laser oscillation occurs within the racer chip 5, and laser light is emitted from the emission surfaces at both ends of the racer chip 5. One laser beam is taken into the optical fiber 7 and emitted to the outside of the apparatus, and the other laser beam is reflected onto the light receiving chip 13.

Although not shown, a disk-shaped cap is attached to the upper end of the ring-shaped sealing wall 2 in an airtight manner. At the four corners of the stem 1, there are holes 1 (y sealing hole 2) that are used when mounting the bag tube.
3 are provided respectively.

However, the inventor of the present invention has revealed that such a technique causes the following problems.
When connecting to the inner end of slope 17', 1B, 0,
One of the auxiliary leads 11 should be bent at an appropriate position midway and
Lay it on the inner end of the door 17 and fix it by welding in that position.

There must be. At this time, it is also necessary to position the light receiving chip 13 with respect to the racer chip 5. Therefore, the work of connecting the auxiliary lead becomes troublesome, takes a lot of time, and has poor work efficiency.

(2\ Since the lead stem 8 is supported by the narrow T/-12 auxiliary leads 1011 and leads 17 and 18, the support length becomes long, and when an external force is applied to the entire device, it tends to vibrate, causing the light receiving chip to The stability of laser light intensity detection is poor and the reliability is low.

[Purpose of the invention]

An object of the present invention is to provide an optical communication device of excellent quality by providing a method for manufacturing an optical communication device that allows easy improvement in the yield and accuracy of the light receiving element and easy installation work. .

However, the main purpose of the present invention is to provide an optical communication device that can stably detect light intensity even in the face of vibration.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[A chest of inventions]

Representative aspects of the invention disclosed in this application are briefly explained below.

That is, the optical communication device of the embodiment has a hollowed out portion in the center of the stem, and a semiconductor laser element is provided on the main surface (inner surface) at the bottom of this hollowed out portion. A fixed stage is fitted and fixed, and a lead is fixed to the circumferential wall of the stem so as to protrude into the hollowed out part, and a noser emitted from the semiconductor laser element is attached to the inner end of the lead. It has a structure in which a light-receiving element that receives light is fixed, and the first thing to manufacture it is to fix the light-receiving element to the end face of the lead before fixing the stage to the stem, and to wire the electrodes of this light-receiving element. By completing the work, several light receiving elements can be assembled properly and easily, the desired purpose can be achieved, and the number of light receiving elements can be adjusted easily. By holding it with a lead with a short support length, stable detection of the laser source intensity can be achieved even when subjected to vibrations.

〔Example〕

FIG. 2 is a marine perspective view showing the main parts of a laser diode device according to an embodiment of the present invention, FIG. 3 is a sectional view taken along the line m-■ in FIG. 2, and FIG. 4 is an embodiment of the present invention. 1 is a cross-sectional view showing a method of manufacturing a laser diode device according to FIG.

This laser diode device is approximately similar in appearance to the device shown in Fig. 1. That is, this device is also assembled based on a rectangular stem 1. The ring-shaped blocking wall 2 is formed in the center by cutting.The inner side of the ring-shaped blocking wall 2 is hollowed out more deeply, and as shown in Fig. 3, the ring-shaped blocking wall 2 is cut in the center. is provided with a stepped hole 24 whose lower part has a larger diameter.The stepped hole 24 has a corresponding stepped metal disc-shaped stage 25.
are hermetically fitted and fixed. Further, a semicircular pedestal 3 is provided approximately in the center of the stage 25, and a semiconductor laser element (laser chip) 5 is fixed thereon via a submount 4 fixed by solder. ing. Further, a fiber guide 6 is fixedly inserted through the side wall of one end of the stem 1 facing one of the emission surfaces from which the laser beam of the semiconductor laser element 5 is emitted. This fiber guide 6 has seven optical fibers built in at its center, and the inner end of the optical fiber <-7 faces one exit surface of the laser chip 5. It is designed to be imported.

On the other hand, a lead 18 passes through the peripheral wall portion of the stem facing the other emission surface of the laser chip 5, and is fixed to the stem 1 through 16 insulators such as glass. The inner end of the lead 18 is formed into several plate-shaped portions 26, and a light receiving element (light receiving chip, tab) 13 is fixed to the inner end surface of the lead, which is the surface of the several portions 26. In addition, a first lead 17 is provided on the side of this lead 18 through the stem peripheral wall shell and through 15 insulators. Illustrated.

The other electrodes are connected with wires (conductor wires) 14. Therefore, these pair of leads 17 and 18 constitute an output terminal of the light receiving chip 13.

On the other hand, there are two separate leads 19.20 on the peripheral wall of stem 1.
is installed. One is directly welded to the stem 1, and isoelectrically connected to the lower electrode of the V-zer tip 5 via the submount 4.

The other one passes through the same wall of the stem 1 and is fixed via a glass-like insulator 21, and its inner end is connected to the upper electrode of the laser chip 5. Fixed wire (conductor)
The other end of 22 is fixed.

Therefore, when a predetermined voltage is applied to these glue boards 1920, the laser beam 3. Laser oscillation occurs within the laser chip 5, and laser light is emitted from the emission surfaces at both ends of the laser chip 5. One laser beam is taken into the optical fiber 7 and taken out to the outside of the device, and the other laser beam is irradiated onto the light receiving chip 13.

Additionally, a metal cap 27 is airtightly attached to the upper end of the ring-shaped sealing wall 2, and the laser chip 5, the light receiving chip 13, etc. are hermetically sealed. In addition, the four corners of stem 1 are provided with first mounting holes 2 that can be used for mounting the device.
3 are provided respectively.

Next, a method for manufacturing an optical communication device having such a structure, particularly a method for assembling it, will be described with reference to FIGS. Prior to assembly, as shown in IRI of the same figure, the fiber guide 6 and four leads 17 to 20 (lead 18 is shown in the figure), although only some are shown, are assembled as shown in FIG. Fixed stem 1? Use, be used. At this stage, the stage has been moved 11 times by the stem, so the central part of the stem 1 is hollowed out and is in a recessed state, and the stepped hole 24 is exposed. Note that the fiber guide 6 is hermetically fixed to the stem 1 with silver solder 28. In addition, at the inner end of the fiber guide 6, only the core of the optical fiber 7 (the core diameter is 7 to 10 μmφ in the case of a single mode fiber, and about 50 pmφ in the case of a multimode fiber) is aligned along the center of the fiber guide 6. It just extends and is not fixed.

Next, 13 light receiving elements (light receiving chips) are fixed to the mounting portion 26 inside the lead 18 in the state shown in FIG. Connect with wire 14.

When doing this connection work, do you have to stand one stem upright so that the mounting surface of the mounting part 26 is up? Do it in the direction you are facing. Also, during this work, the center of the stem 1 is missing, so is it the light receiving chip 13 or the wire? A general bonding tool (not shown) held therein can perform bonding without being obstructed by the stem 1. Therefore, the bonding work can be performed not only manually, but also by using an automatic bonder used for assembling each semiconductor device. Incidentally, if the optical fiber 7 may become an obstacle during this bonding, the optical fiber 7 may be removed from the fiber tool 6 before bonding is performed.

Next, as shown in FIG. Is there a steel material in the hole 24 at the bottom of the hollowed out part of stem 1? Use them to fit and fix in an airtight state. The stage 25 has a semicircular barge 3 formed at the center of its upper surface as shown in FIG. Therefore, four submounts are mounted on this pedestal part 3, and a semiconductor laser element (laser chip) 5' is mounted on the pedestal part 3.
Ninluder? Use to fix. Note that, except for attaching the 25 stages to the stem 1, the stem 1 is placed horizontally as shown by the dot. Next, in this state, laser chip 5
It is electrically connected to the electrode of the earth part by the inner end wire (conductor #) 22 of the part 19 as shown in FIG.

At this time, the 1/- laser chip 5 is connected at a position 2 such that the internal optical waveguide coincides with a line connecting the optical axis of the light fiber 7 and the center of the light receiving chip and tube 13.

Next, a predetermined voltage is applied to the pair of leads 19 and 20 to cause the V-buchip 5 to emit light. Determine the position and insert it into the inner end of the fiber guide 6, +! :;i junction light 2 junction light 2
8 ibar 7? % at fixed and fiber guide inner diameter
jDensity? Hold it.

Next, a disk-shaped cap 27 is airtightly attached to a part of the ring-shaped sealing wall 2 of the stem 1 by welding or using a bonding material, and the laser chip 5 and the like are hermetically sealed.
An optical communication device as shown in 1 is manufactured.

〔effect〕

(1) According to this embodiment, the light-receiving element is fixed to the inner end of the straight-extending lead, so that the support length of the lead from the light-receiving chip support point to the point where it is supported by the stem is approximately the same. Since it can be made shorter than the structure shown in Figure 1, the rigidity is increased and the light receiving tip and tip 2 portions are less likely to vibrate even if an external force is applied to the device. As a result, the V-zer light oscillated from the V-zer chip can always be stably captured, improving the reliability of monitoring the V-zer light intensity.

(2) According to this embodiment, when fixing the light receiving chip and connecting it with the wire, there is a stage in the center of the stem. By leaving the chips and wires unattached, the working space for connecting chips and wires can be made larger than when assembling the device having the structure shown in FIG. As a result, it becomes easier to bond both light receiving chips and wire connections, making it easier to make connections. 4'F is improved and the working time is reduced. In addition, in this 'J'Mli example, work such as connecting the lead and auxiliary lead is done in a small bag, so the work rI
The shrinkage between them is striking.

(3) As shown in item (2) of r'I'11, the connection work space is wide and the bonding tool that holds the wire can move freely, so the mounting position of the light receiving chip can be mounted with high precision. It becomes possible to properly receive the 1/- laser light emitted from the laser chip.

(4) According to this embodiment, since the laser chip is hermetically sealed, oxidation and the like are less likely to occur and the element is less likely to deteriorate. This woman has a long laser oscillation lifespan.

Although the invention made by the present inventor has been specifically explained above based on examples, it is to be understood that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist of the invention. Not even.

For example, a Beltier element for temperature detection may be incorporated in the stem portion sealed by the gap to indirectly detect the temperature of the laser chip, and the laser oscillation may be controlled based on this detection information. Also, what is the value of this light-transmitting individual packaging and this light-reversing individual device? Control circuit system? By attaching it to a mounted hybrid board, it is possible to make the optical communication device easier to use.

[Application field]

In the explanation of the field, the fCC meeting was mainly explained as applied to the optical communication technology, which is the field of application behind the invention made by the present inventor, but the present invention is not limited thereto. That is, it is applicable at least to a light-emitting device incorporating a conductor and a light-receiving element for detecting the intensity of light emitted from this element.

[Brief explanation of the drawing]

Figure 1 shows the main part of the laser diode equipment developed by the applicant? FIG. 2 is a perspective view showing essential parts of a laser diode device according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a method of manufacturing the laser diode device. DESCRIPTION OF SYMBOLS 1... Stem, 2... Ring-shaped sealing wall, 3... Pedestal part, 4... Sub mount, 5... Semiconductor laser element, 6... Fiber guide, 7... Optical fiber, 8 ... Lead stem, 9... Main body, 10.11.
...Auxiliary lead, 12...Several chips, 13...Light receiving element, 14...Wire, 15.16...Insulator,
17-2o...Lead, 21...Insulator, 22...
・Wire, 23...Mounting hole, 24...Hole, 25...
・Stage, 26... Take H part, 27... Gap, 2
8... Ginsen, 29... Bonding material.

Claims (1)

[Scope of Claims] l A stem having a hollowed-out center portion, a stage fitted and fixed to the hollowed-out portion of the stem, a semiconductor laser element fixed to the upper surface of the stage, and a semiconductor laser element supported by the stem and fixed to the hollowed-out portion of the stem. Inner end? The semiconductor laser element has an optical fiber having a lunar surface on one emission surface, and a lead supported by the stem and having a light receiving element fixed to the inner end surface, and the light receiving element is on the other side of the semiconductor laser element. An optical communication device characterized by having one plane intersecting the output plane. 2. The optical communication device according to claim 1, wherein the semiconductor laser element is tightly sealed. 3. A stem whose central part is hollowed out, a stage fitted and fixed to the hollowed out part of this stem, a semiconductor laser element fixed to the top surface of this stage, and an inner end supported by the stem in @11. An optical fiber having a lunar surface on one output surface of the semiconductor laser element, a lead supported by the stem and having a light receiving element fixed to the inner end surface;
, and Portrait 11 Light receiving Shigeko of the semiconductor laser element (
There is a text on the exit surface of the IIJ side. An optical communication device characterized in that a light-receiving element is fixed to the inner end surface of a predetermined lead before being fitted and fixed to the stem (and the electrode of the light-receiving element is electrically connected to the inner end of the predetermined lead with a wire. How to advance the rabbit.