JPH07151943A - Optical integrated circuit package and its assembly method - Google Patents

Abstract

PURPOSE:To provide an optical integrated circuit package which is an optical integrated circuit constituted to optically couple a semiconductor light emitting element and optical fibers via an optical integrated circuit substrate, stably and easily executes the optical coupling and does not generate a change in the output light of the optical fibers even in long-term use and an assembly method therefor. CONSTITUTION:The optical integrated circuit substrate 1 is fixed at the center in the package 3 previously provided with through-holes 4 at side walls in order to stably and easily optically couple an LD 10 and the optical fiber 2b via an optical waveguide. A stem 13 mounted with the LD 10 and a spherical lens 11 for coupling and a ferrule supporting member 15 holding and fixing two pieces of the optical fibers 2b for emission are installed into the through-holes 4 on the side walls of the package 3. The stem 13 and the ferrule supporting member 15 are positionally adjusted and fixed in such a manner that the optical axes of the LD 10 and the optical fibers 2b are aligned via the optical waveguide. As a result, the optical coupling of the LD 10 and the optical fibers 2b is stably and easily executed. Mispositioning does not arise and always the stable output light is obtd. in spite of the long-term use.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling method for an optical integrated circuit, a semiconductor light emitting device and an optical fiber, and more particularly to an optical integrated circuit for stably and easily performing optical coupling and hermetically sealing the optical coupling portion. The present invention relates to a circuit package and a method of assembling the same.

[0002]

2. Description of the Related Art As a method for connecting an optical integrated circuit substrate and a semiconductor light emitting element, there is a connection structure shown in FIG. 9 as described in JP-A-62-17712. In this method, first, a groove 29 for installing a lens 28 at the end of the optical integrated circuit board 1 is formed.
To form a lens 2 for the optical waveguide 18 by etching.
Install 8 in the optimum position. Next, the position of the semiconductor light emitting device 10 is adjusted so as to be optically coupled to the optical waveguide 18 on which the lens 28 is installed.

As a method for connecting the optical integrated circuit board and the optical fiber, there is a connecting method shown in FIG. 10 as described in Japanese Patent Publication No. 4-69923. In this method, first, two optical integrated circuit boards 1 are bonded to each other with an adhesive,
A cylindrical groove 23 is formed by a drill so that the optical fiber 2a for incidence and the optical fiber 2b for emission are fitted to both end surfaces of the circuit board 1. Next, the two laminated optical integrated circuit boards 1 are separated, and the optical waveguide 18 is formed at the position of the cylindrical groove 23 previously provided. Then, the cylindrical groove 23
The optical fibers 2a and 2b are fixed in the inside with an adhesive 24 and optically coupled with the optical waveguide 18.

[0004]

According to the above conventional method, the groove 29 shown in FIG. 9 is formed by photolithography, and the optical axes of the optical integrated circuit substrate 1 and the optical waveguide 18 in the plane direction are The heights of the optical waveguides 18 do not necessarily coincide with each other in the thickness direction of the optical waveguides 18, although they coincide with each other with high accuracy. Further, in the structure shown in FIG. 10, when the optical fibers 2a and 2b are fixed in the groove 23, the optical coupling with the optical integrated circuit board 1 cannot be adjusted, and the coupling efficiency becomes low. Furthermore, in these structures,
This increases the number of processing processes for forming the grooves 29 and 23 in the optical integrated circuit board 1, which is problematic in terms of mass productivity. Further, the lens 28 or the optical fibers 2a and 2b bonded to the optical integrated circuit board 1 is fixed only on the lower side. Therefore, when the adhesive 24 is used as the bonding member, the adhesive 24 cures and shrinks or deteriorates with age. As a result, the lens 28 and the optical fibers 2a and 2b are lifted from the inside of the grooves 29 and 23 and cause deterioration of optical coupling.

An object of the present invention is to stably and easily perform optical coupling between an optical integrated circuit, a semiconductor light emitting element and an optical fiber.
Moreover, it is an object of the present invention to provide an optical integrated circuit package that hermetically seals an optical coupling portion and an assembling method thereof.

[0006]

SUMMARY OF THE INVENTION The above object is to provide a semiconductor light emitting element and an optical fiber in advance in a case in order to optically couple a semiconductor light emitting element and an optical fiber without processing a lens fixing or fiber fixing groove in an optical integrated circuit board. At the light incident end and the light emitting end of the fixed optical integrated circuit board, the position of the semiconductor light emitting element light source with a coupling lens and the emitting optical fiber supporting member supporting two optical fibers are adjusted, and the side wall of the rectangular case is adjusted. This is achieved by fixing the through hole provided. It can also be achieved by fixing the input and output optical fiber support members to the through holes provided in the side wall of the rectangular case.

[0007]

The stem on which the coupling lens and the semiconductor light emitting element are mounted, and the optical fiber support member holding and fixing the two outgoing optical fibers are respectively installed in the through holes provided on the side wall of the case. The position of the semiconductor light-emitting device light source with the coupling lens and the emission optical fiber is adjusted with respect to the light incident portion and the light emission portion of the optical integrated circuit substrate fixed in advance in the case.
At the position where the optical coupling efficiency between the semiconductor light emitting device and the optical fiber is maximized through the optical integrated circuit board, the stem and the optical fiber supporting member are connected to the through hole of the side wall of the case with a joining member such as Au-Sn solder or YAG. Weld and fix with laser.

According to this structure, the optical integrated circuit board can be optically coupled without processing, and the semiconductor light emitting device and the optical fiber optically coupled to the optical integrated circuit board are provided on the side wall of the case via the stem and the optical fiber supporting member. Since it can be securely fixed, there is no displacement. Further, since the light from the semiconductor light emitting element is incident on the optical integrated circuit substrate via the coupling lens, the optical coupling can be performed with high efficiency and easily. Further, since the optical integrated circuit board can be housed in the case, the optical coupling part can be hermetically sealed, and stable optical coupling can be obtained for long-term reliability.

[0009]

Embodiments of the present invention will be described below with reference to FIGS.

In the embodiments described below, a laser diode (hereinafter referred to as LD) is used as a semiconductor light emitting element, a polarization-maintaining optical fiber (hereinafter referred to as optical fiber) is used as an optical fiber, and a LiNbO ₃ material is used as an optical integrated circuit substrate. Is used.

In FIGS. 1 and 2, the LD 10 is mounted on the stem 13 at a predetermined position. The lens cap 12 to which the coupling spherical lens 11 is attached is adjusted in position so that the optical axis of the LD 10 and the optical axis of the LD 10 coincide with each other, and is fixed to the upper surface of the stem 13.
Two optical fibers 2b for emission are installed in a cylindrical ferrule 16, and the ferrule 16 is held and fixed by a ferrule support member 15. In advance, through holes 4 are provided on both side walls of the package 3 so that their centers coincide with the optical axis of the optical integrated circuit board 1 housed in the package 3. A Y-shaped optical waveguide 18 is formed on the upper surface of the optical integrated circuit board 1, and the optical integrated circuit board 1 is fixed at a predetermined position on a pedestal 9 provided in the lower portion of the package 3. After fixing the optical integrated circuit board 1 in the package 3, the stem 13 and the ferrule support member 15 are installed in the through hole 4 portion of the side wall of the package 3. LD1 via the optical waveguide 18 of the optical integrated circuit board 1
0 and the optical fiber 2b are optically coupled so that the stem 13
And the ferrule support member 15 is positionally adjusted in the XY directions at the through-hole 4 part. At the position where the optical coupling efficiency between the LD 10 and the optical fiber 2b is maximized, the stem 13 and the ferrule support member 15 are welded and fixed to the side wall of the package 3 by a joining member 7 such as Au-Sn solder or YAG welding.

FIG. 3 shows an embodiment of the optical coupling structure of the optical waveguide 18 formed on the optical integrated circuit substrate 1 and the two optical fibers 2b arranged in the ferrule 16. Optical integrated circuit board 1
A Y-shaped optical waveguide 18 is formed on the upper surface of the. The Y-shaped bifurcated optical waveguide 18 has an interval of 0.65 mm. The two optical fibers 2b arranged in the ferrule 16 are arranged at the same intervals as those of the two optical waveguides 18 which are branched.
The polarization directions of are aligned and fixed. Here, the outer diameter of the optical fiber 2b is 90 μm, a through hole of 92 μm is formed in the ferrule 16, and the optical fiber 2b is inserted and fixed in this hole.

To assemble the optical integrated circuit package, first, the optical integrated circuit board 1 is mounted on the pedestal 9 provided at the bottom of the package 3.
To fix. Before housing the optical integrated circuit board 1, the through holes 4 are formed on both side walls of the package 3 so that the centers of the optical waveguides 18 formed on the upper surface of the optical integrated circuit board 1 are aligned with each other. Every time, LD10
The stem 13 on which is mounted and the ferrule support member 15 holding the emitting optical fiber 2b are installed. The LD 10 and the tip of the emitting optical fiber 2b are adjusted in advance in the Z direction so as to maintain a predetermined distance from the end of the light incident portion 26 and the end of the emitting portion 27 of the optical waveguide 18. The laser light emitted from the LD 10 is condensed by the coupling spherical lens 11. The stem 13 is adjusted in the XY directions by the through holes 4 so that the condensed laser light is efficiently incident on the incident portion 26 of the optical waveguide 18.
The laser light incident on the optical waveguide 18 is the Y-shaped optical waveguide 18
The light is emitted from the emission unit 27. At the laser light emitting portion 27, the ends of the two optical fibers 2b fixed in the ferrule support member 15 are installed, and the ferrule support member 15 is penetrated through the ferrule support member 15 so as to take in the laser light emitted from the optical waveguide 18. Adjust in XY direction with 4 parts. LD10 and optical fiber 2
The stem 13 and the ferrule support member 15 are welded and fixed to the side wall of the package 3 by the joining member 7 or YAG welding at the position where the optical coupling efficiency with b is maximized. As the joining member 7 for joining the stem 13 and the ferrule support member 15, Au-Sn, Au-Ge or Pb-Sn is used,
It is melted and fixed by heating means by high frequency induction heating. Although the coupling spherical lens 11 is used for optical coupling between the semiconductor light emitting device 10 and the optical waveguide 18 here, the invention is not limited to this, and a rod lens or an aspherical lens may be used.

In the present invention, the stem 13 and the ferrule support member 15 are adjusted and fixed so as to optically couple the LD 10 and the optical fiber 2b via the optical waveguide 18 formed on the optical integrated circuit board 1. According to this structure, the stem 1 in which the LD 10 and the optical fiber 2b are installed on the side wall of the package 3
3 and the ferrule support member 15 are used to firmly fix the member 7 with high-strength joining member 7 or YAG welding, so that a stable optical coupling with the optical waveguide 18 can be maintained without causing positional displacement. Further, since the LD 10 and the optical fiber 2b adjust the Z direction in advance with respect to the optical waveguide 18, the ferrule support member 15 can be easily optically coupled only by adjusting the side wall of the package 3 in the XY directions. Also, LD
Since the optical coupling between the optical waveguide 10 and the optical waveguide 18 is performed via the coupling spherical lens 11, the optical coupling can be performed with high efficiency and easily. Further, since the stem 13 and the ferrule support member 15 are fixed to the side wall of the package 3 all around, the optical coupling part between the optical integrated circuit board 1 and the LD 10 and the optical fiber 2b can be hermetically sealed in the package 3 and stable. The optical coupling can be obtained. Therefore, the optical coupling of the optical integrated circuit package can be stably and easily performed.

Next, another embodiment of the present invention will be described with reference to FIGS.
Will be described.

The embodiment shown in FIG. 4 shows a structure of optical coupling between the optical waveguide 18 formed on the upper surface of the optical integrated circuit substrate 1 and the two optical fibers 2b arranged in the ferrule 16. The optical fiber 2b is fixed as follows. First, two semi-cylindrical ferrules 16 cut into upper and lower halves are prepared, and two rows of V-shaped grooves 20 are formed on each ferrule cutting surface 21. Two optical fibers 2b are installed in the V-shaped groove 20 of the ferrule 16 with their polarization directions aligned. Next, the cut surface 21 of the other ferrule 16 and the ferrule cut surface 21 on which the optical fiber 2b has already been installed are bonded together, and fixed so that the optical fiber 2b is sandwiched between the V-shaped grooves 20. The joining member 2 is provided in the gap between the optical fiber 2b and the V groove 20.
Fill 2. The interval between the V-shaped grooves 20 is 0.65 mm, which is equal to the interval between the Y-shaped optical waveguides 18 and is formed by etching or machining.

In the embodiment shown in FIG. 5, two optical fibers 2 are used.
The structure which fused and arranged the b strand is shown. The method of fusion-fixing the two optical fibers 2b is as follows.
b are aligned so that the polarization directions are aligned, and the optical fiber 2b
While heating and melting with a heating burner, pull to the left and right. The two optical fibers 2b are fused to each other at the heating portion to narrow the interval between the cores 19. When the distance between the cores 19 of the two fused optical fibers 2b becomes equal to that between the Y-shaped optical waveguides 18, heating and pulling are stopped. By supporting and fixing the two fused optical fibers 2b in the ferrule 16 and the optical fiber holding member 5, optical coupling with the optical waveguide 18 is performed in the same manner as in the embodiment shown in FIGS. 3 and 4. It can be performed.

In the embodiment shown in FIGS. 6 and 7, the stem 13 having the semiconductor light emitting element 10 and the coupling spherical lens 11 mounted thereon is installed on the pedestal 9 for fixing the optical integrated circuit substrate 1, and the optical waveguide 18 is provided. 2 shows a structure in which photocoupling is performed.

In FIG. 6, the LD 10 and the coupling spherical lens 11 are set at predetermined positions on the stem 13. The pedestal 9 for fixing the optical integrated circuit board 1 is provided with a stem installation portion 25 or a step portion for arranging the stem 13 in advance, and the stem 13 is fixed to this portion. The height of the stem installation portion 25 is the same as that of the optical integrated circuit board 1 fixed on the pedestal 9.
Optical axis of the optical waveguide 18 and LD1 mounted on the stem 13
The optical axis is adjusted so that it coincides with 0. For optical coupling between the LD 10 and the optical waveguide 18, the laser light oscillated from the LD 10 is focused by the coupling spherical lens 11, and the stem 13 is placed at a position where the laser light is efficiently focused on the incident portion 26 of the optical waveguide 18.
Adjust. After adjusting, place the stem 13 on the base 9 by Au-S.
n Secure with a joining member such as solder. Further, in FIG. 7, the stem 13 is fixed to the end surface of the pedestal 9 for fixing the optical integrated circuit board 1, and the stem 13 is adjusted in the XY direction at the end surface of the pedestal 9 to optically couple with the optical waveguide 18. , Fig. 6
The assembly is performed in the same manner as the embodiment shown in FIG. According to these structures, the optical integrated circuit board 1 and the stem 13 on which the LD 10 is mounted can be installed on the same pedestal 9, and can be firmly fixed by a high-strength joining member, so that no positional deviation occurs. Further, since the stem 13 is fixed on the pedestal 9, the shape of the stem 13 can be reduced, and the package 3 can be downsized.

The embodiment shown in FIG. 8 shows a structure in which the optical fibers 2a and 2b are installed in the entrance portion 26 and the exit portion 27 of the optical waveguide 18 to perform optical coupling. The input and output optical fibers 2a and 2b are held and fixed to an optical fiber support member 5 having an optical fiber guide 6. The optical fibers 2a and 2b are fixed in the fiber guide 6 by a joining member 8, and two optical fibers 2b are installed on the emitting optical fiber supporting member 5. The optical integrated circuit board 1 is fixed on a pedestal 9 in a package 3 having a through hole 4 in a side wall. The through hole 4 on the side wall of the package 3 is provided in alignment with the optical axis of the Y-shaped optical waveguide 18 formed on the upper surface of the optical integrated circuit substrate 1 housed in the package 3, and the through hole 4 is used for incidence and emission. The optical fiber supporting member 5 holding and fixing the optical fibers 2a and 2b is installed. The tips of the input and output optical fibers 2a and 2b are installed in advance by adjusting the Z direction so as to maintain a predetermined distance between the light incident portion 26 end and the light emitting portion 27 end of the optical waveguide 18. . Incident optical fiber support member 5
Is adjusted in the XY directions at the through-hole 4 so that the laser light emitted from the optical fiber 2a is introduced into the incident portion 26 of the optical waveguide 18. Similarly, the output optical fiber support member 5 is also adjusted in the XY directions at the through holes 4 so that the laser light emitted from the bifurcated optical waveguide 18 is introduced into the two optical fibers 2b. Each optical fiber support member 5 is attached to the side wall of the package 3 at a position where the optical coupling efficiency between the optical fiber 2a for incidence and the optical fiber 2b for emission is maximized.
Au-Sn solder or other high-strength joining member 7 or YAG
Weld the entire circumference by welding. According to this structure, since the optical fiber supporting member 5 can be firmly fixed to the side wall of the package 3, the optical fiber output can be prevented from being deteriorated without causing the positional deviation. As for the structure for holding the optical fiber for emission shown here, the optical fiber array structure of the embodiment shown in FIGS. 3, 4 and 5 may be used.

Since the embodiment shown in FIGS. 4 to 8 has the same structure and assembly as the embodiment shown in FIGS. 1 and 2, the same effects as those of the embodiment shown in FIGS. 1 and 2 are obtained. Obtainable. Therefore, the optical coupling between the semiconductor light emitting device and the optical fiber can be stably and easily performed through the optical waveguide, the deterioration of the optical fiber output due to the positional deviation can be prevented, and the high reliability can be obtained even for long-term use. You can

[0022]

As described above, according to the present invention, the optical integrated circuit board can be installed in the package, and the optical coupling between the semiconductor light emitting element and the optical fiber can be easily performed through the optical integrated circuit board.

According to this structure, the optical coupling with the optical integrated circuit can be performed with high efficiency, and the semiconductor light emitting element and the optical fiber can be firmly fixed, so that the deterioration of the output of the optical fiber can be prevented. Further, since the semiconductor light emitting element and the optical fiber are adjusted in the Z direction with respect to the optical integrated circuit board in advance, optical coupling can be easily performed. Further, since the optical coupling portion with the optical integrated circuit can be hermetically sealed in the package, stable optical coupling can be obtained.

Therefore, the optical integrated circuit package of the present invention can facilitate optical coupling between the semiconductor light emitting device and the optical fiber via the optical integrated circuit substrate, and can obtain high reliability for long-term use.

[Brief description of drawings]

FIG. 1 is a structural top view of an optical coupling of an optical integrated circuit package according to an embodiment of the present invention.

FIG. 2 is a structural cross-sectional view of an optical integrated circuit package according to an embodiment of the present invention.

FIG. 3 is a structural perspective view showing optical coupling between an optical integrated circuit and an optical fiber.

FIG. 4 is a structural perspective view showing optical coupling between an optical integrated circuit and an optical fiber.

FIG. 5 is a structural perspective view in which two optical fibers are fused and arranged.

FIG. 6 is a structural cross-sectional view showing optical coupling between an optical integrated circuit and a semiconductor light emitting device.

FIG. 7 is a structural cross-sectional view showing optical coupling between an optical integrated circuit and a semiconductor light emitting device.

FIG. 8 is a structural cross-sectional view showing optical coupling between an optical integrated circuit and an optical fiber.

FIG. 9 is a structural top view showing a conventional method of connecting an optical integrated circuit and a semiconductor light emitting element.

FIG. 10 is a structural perspective view showing a conventional method for connecting an optical integrated circuit and an optical fiber.

[Explanation of symbols]

 1 Optical Integrated Circuit Board 2a Input Optical Fiber 2b Output Optical Fiber 3 Package 4 Through Hole 5 Optical Fiber Support Member 6 Optical Fiber Guide 7 Joining Member 8 Joining Member 9 Pedestal 10 Semiconductor Light Emitting Element 11 Coupling Ball Lens 12 Lens Cap 13 Stem 14 Photodiode for monitor 15 Ferrule support member 16 Ferrule 17 Joining member 18 Optical waveguide 19 Core part 20 V groove 21 Ferrule cut surface 22 Joining member 23 Cylindrical groove 24 Adhesive 25 Stem installation part 26 Optical waveguide entrance part 27 Optical waveguide Emitting part 28 Lens 29 Groove 30 Optical device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tetsuo Kumazawa 502 Jinritsucho, Tsuchiura-shi, Ibaraki Prefecture Machinery Research Institute, Hiritsu Manufacturing Co., Ltd. (72) Inventor Toshiya Yubara 5-1-1, Hidaka-cho, Hitachi, Ibaraki No. Hitachi Cable Co., Ltd. Hidaka Plant (72) Inventor Tatsuya Kumagai 5-1-1 Hidaka Town, Hitachi City, Ibaraki Prefecture Hitachi Cable Co., Ltd. Hidaka Plant (72) Inventor Hisao Iizuka Hitachi City, Hidaka, Ibaraki Prefecture 5-1-1, Machi, Hitachi Cable Co., Ltd. Hidaka Factory

Claims (11)

[Claims] 1. An optical integrated circuit board, a semiconductor light emitting device light source that enters the optical integrated circuit board, an optical fiber that transmits light emitted from the optical integrated circuit board, and a square case that houses these. In the optical integrated circuit package consisting of, the optical integrated circuit board is installed in the center of the square case, and the semiconductor light emitting device light source is mounted in the through hole of one side wall of the square case. The optical fiber support member holding and fixing the optical fiber is mounted in the through hole of the other side wall of the square case, and the semiconductor light emitting element and the optical fiber are connected via the optical integrated circuit board. An optical integrated circuit package, which is arranged and fixed so as to be optically coupled. 2. An optical integrated circuit board, a semiconductor light emitting device light source that enters the optical integrated circuit board, an optical fiber that transmits light emitted from the optical integrated circuit board, and a square case that houses these. In the optical integrated circuit package consisting of, the optical integrated circuit board and the semiconductor light-emitting device light source are installed on a pedestal provided in the center of the square case, and in the through hole of the side wall of the square case. An optical integrated circuit package, wherein an optical fiber supporting member supporting the optical fiber is attached, and the semiconductor light emitting device and the optical fiber are arranged and fixed so as to be optically coupled to each other via the optical integrated circuit substrate. . 3. The optical integrated circuit package according to claim 1, wherein the optical integrated circuit substrate and the semiconductor light emitting device light source are optically coupled through a lens. 4. An optical integrated circuit package comprising an optical integrated circuit board, an optical fiber for transmitting light entering and exiting the optical integrated circuit board, and a square case for housing these, wherein the square type The optical integrated circuit board is installed at the center of the case, and an incident optical fiber supporting member supporting an incident optical fiber is mounted in the through hole of one side wall of the rectangular case, An output optical fiber support member supporting an output optical fiber is mounted in the through hole of the other side wall of the case, and the input optical fiber and the output optical fiber are provided via the optical integrated circuit board. An optical integrated circuit package characterized in that it is arranged and fixed so as to be optically coupled. 5. The optical integrated circuit package according to claim 1, wherein there are a plurality of optical fibers for transmitting the light emitted from the optical integrated circuit board. 6. The optical integrated circuit package according to claim 1, wherein the optical fiber for transmitting the light emitted from the optical integrated circuit substrate is a polarization-maintaining optical fiber. 7. The optical integrated circuit package according to claim 5, wherein the optical fiber is installed by adhesion in holes and grooves arranged in a cylindrical optical fiber supporting member. 8. The optical integrated circuit package according to claim 1, wherein the inside of the rectangular case accommodating the optical integrated circuit board is hermetically sealed. 9. The material of the square case and the optical fiber supporting member according to claim 1, 2 or 4, is steel or cover.
Optical integrated circuit package characterized by being made of a stainless steel or a stainless alloy. 10. The optical axis of an optical integrated circuit substrate according to claim 1, wherein the semiconductor light emitting device light source and the optical fiber supporting member are installed in through holes provided in the side wall of the rectangular case in advance and fixed in the rectangular case. On the other hand, the position of the semiconductor light emitting element light source and the optical fiber supporting member is adjusted so that the optical axes of the semiconductor light emitting element and the optical fiber coincide with each other, and the semiconductor light emitting element light source and the optical fiber supporting member are attached to the square case side wall. Au-Sn,
A method for assembling an optical integrated circuit package, characterized by being fixed by Au-Ge or Pb-Sn solder or YAG welding. 11. The optical integrated circuit according to claim 4, wherein the incident optical fiber support member and the output optical fiber support member are installed in through holes provided in the side wall of the rectangular case in advance and fixed in the rectangular case. With respect to the optical axis of the substrate, so that the optical axis of the incident optical fiber and the optical axis of the output coincide,
Adjust the position of the optical fiber support member for incidence and emission,
An optical integrated circuit package characterized in that an input optical fiber support member and an output optical fiber support member are fixed to a square case by Au-Sn, Au-Ge, or Pb-Sn solder or YAG welding. How to assemble.