JPS63223723A - Structure for fixing photosemiconductor collimator - Google Patents
Structure for fixing photosemiconductor collimatorInfo
- Publication number
- JPS63223723A JPS63223723A JP62056818A JP5681887A JPS63223723A JP S63223723 A JPS63223723 A JP S63223723A JP 62056818 A JP62056818 A JP 62056818A JP 5681887 A JP5681887 A JP 5681887A JP S63223723 A JPS63223723 A JP S63223723A
- Authority
- JP
- Japan
- Prior art keywords
- lens assembly
- solder
- grooves
- optical semiconductor
- collimator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 32
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000155 melt Substances 0.000 abstract description 2
- 235000011837 pasties Nutrition 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
本発明は、レンズを内蔵したレンズアッセンブリに光半
導体素子をレーザ光で半田接合して光半導体コリメータ
を調整・組立する場合において、半田が均一にならずに
盛り上がり、光半導体コリメータの基板面への取付が行
い難い、という問題を解決するために、レンズアッセン
ブリと光半導体素子の接合面周囲に半田を収容する溝を
形成したものである。[Detailed Description of the Invention] [Summary] The present invention solves the problem that when adjusting and assembling an optical semiconductor collimator by soldering an optical semiconductor element to a lens assembly containing a built-in lens using a laser beam, the solder is not uniform. In order to solve the problem that it is difficult to attach the optical semiconductor collimator to the substrate surface due to the swelling, a groove for accommodating the solder is formed around the joint surface of the lens assembly and the optical semiconductor element.
本発明は光半導体コリメータの固定構造に関する。 The present invention relates to a fixing structure for an optical semiconductor collimator.
光半導体コリメータは、発光素子から発光した光を平行
光としたり、受光素子へ平行に入射した光を素子に集光
させたりするもので、素子とレンズとの間の光軸ズレ等
が生じたりすると、特性劣化となってしまう。このため
、半導体素子とレンズアッセンブリとを正確に光軸が一
致するように調整しかつ固定することが必要である。Optical semiconductor collimators convert light emitted from a light-emitting element into parallel light, or converge light incident parallel to a light-receiving element onto the element, which may cause misalignment of the optical axis between the element and the lens. This results in deterioration of characteristics. For this reason, it is necessary to adjust and fix the semiconductor element and the lens assembly so that their optical axes are accurately aligned.
第７図及び第８図に従来の光半導体コリメータの固定構
造を示す。これらの図において、１は光半導体素子であ
る発光素子又は受光素子、２はこの発光又は受光素子を
固定する保持体（金具）、３はレンズ４を内蔵したレン
ズアッセンブリである。発光又は受光素子１を固定した
保持体２をレンズアッセンブリ３に挿入し、レンズ４と
発光又は受光素子１との光軸を調整する。そして、レン
ズアッセンブリ３と保持体２の接合部外周に２〜４カ所
ペースト状半田を塗布し、これらの半田部分にレーザ光
を照射して半田接合による固定を行なっていた。FIGS. 7 and 8 show the fixing structure of a conventional optical semiconductor collimator. In these figures, 1 is a light-emitting element or a light-receiving element which is an optical semiconductor element, 2 is a holder (metal fitting) for fixing this light-emitting or light-receiving element, and 3 is a lens assembly containing a lens 4. The holder 2 to which the light-emitting or light-receiving element 1 is fixed is inserted into the lens assembly 3, and the optical axis between the lens 4 and the light-emitting or light-receiving element 1 is adjusted. Then, paste-like solder is applied to the outer periphery of the joint between the lens assembly 3 and the holder 2 at two to four places, and these solder parts are irradiated with a laser beam to perform fixation by soldering.
このような従来の光半導体コリメータの固定構造による
と、レーザ光の照射の際、溶融した半田の流れる溝等が
無く、レンズアッセンブリ３や保持体２の外周部に流れ
出し、接合部の半田が均一にならずに一部が盛り上がっ
たりバリの状態となる。従って、半田付は性が良好でな
く、固定強度も弱かった。また、このようにして組付け
た従来の光半導体コリメータをセラミック基板（第９図
、第１０図には示していない）に実装する際は、外周部
の盛り上がった半田の部分をカッター等で取り除いたり
しなければならない、という問題があった。According to such a conventional fixing structure of an optical semiconductor collimator, there are no grooves for the melted solder to flow during laser beam irradiation, and the solder flows out to the outer periphery of the lens assembly 3 and the holder 2, so that the solder at the joint is uniform. Some parts may bulge or become burred instead of being flattened. Therefore, the soldering properties were not good and the fixing strength was also weak. Also, when mounting the conventional optical semiconductor collimator assembled in this way on a ceramic substrate (not shown in Figures 9 and 10), remove the raised solder part on the outer periphery with a cutter, etc. The problem was that it had to be done.
このような問題点を解決するために、本発明によれば、
レンズと光半導体素子との位置関係を調整するように、
レンズを内蔵したレンズアッセンブリに、光半導体素子
を保持した保持体を接合し、該接合部に半田を塗布し、
レーザ光を照射してレンズアッセンブリと素子保持体と
を半田結合する光半導体コリメータの固定構造において
、レンズアッセンブリと素子保持体の少なくとも一方は
、接合面の周囲に半田を収容する溝が形成されているこ
とを特徴とする光半導体コリメータの固定構造が提供さ
れる。In order to solve such problems, according to the present invention,
In order to adjust the positional relationship between the lens and the optical semiconductor element,
A holder holding an optical semiconductor element is joined to a lens assembly containing a lens, and solder is applied to the joint,
In the fixing structure of an optical semiconductor collimator in which a lens assembly and an element holder are soldered together by irradiating a laser beam, at least one of the lens assembly and the element holder is formed with a groove for accommodating solder around a joint surface. A fixing structure for an optical semiconductor collimator is provided.
レンズアッセンブリに素子保持体を挿入・接合し、光軸
調整をした後、半田収容溝に半田を装着し、レーザ光を
照射してレンズアッセンブリと素子保持体とを結合する
。その場合において、半田は溝の中を流れ外周部に盛り
上がることが防止される。After inserting and bonding the element holder to the lens assembly and adjusting the optical axis, solder is attached to the solder receiving groove and laser light is irradiated to couple the lens assembly and the element holder. In this case, the solder is prevented from flowing in the groove and rising to the outer periphery.
以下、添付図面を参照して本発明の実施例を詳細に説明
する。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第１図〜第４図に本発明の光半導体コリメータの固定構
造を示す。これらの図において、１は光半導体素子であ
る発光素子又は受光素子、２はこの発光又は受光素子を
固定する保持体（金具）、３はレンズ４を内蔵したレン
ズアッセンブリである０発光又は受光素子１を固定した
保持体２（第３図）をレンズアッセンブリ３ （第４図
）に挿入し、レンズ４と発光又は受光素子１との光軸を
調整する（第１及び第２図）。以上は従来と回様である
。1 to 4 show the fixing structure of the optical semiconductor collimator of the present invention. In these figures, 1 is a light emitting element or a light receiving element which is an optical semiconductor element, 2 is a holder (metal fitting) for fixing this light emitting or light receiving element, and 3 is a lens assembly containing a lens 4 (0). The holder 2 (FIG. 3) to which the lens 1 is fixed is inserted into the lens assembly 3 (FIG. 4), and the optical axis between the lens 4 and the light emitting or light receiving element 1 is adjusted (FIGS. 1 and 2). The above is the conventional method.
本発明では、素子保持体２のレンズアッセンブリ側接合
面２ａの外周縁に等間隔に４つの溝５ａ（第３図）を形
成し、また、レンズアッセンブリ３の素子保持体側接合
面３ａの外周縁に、前記溝５ａの位置に対応して４つの
溝５ｂ（第４図）を形成し、更にレンズアッセンブリ３
の接合面３ａに前記溝５ｂに連通ずる円周溝６を形成す
る。In the present invention, four grooves 5a (FIG. 3) are formed at equal intervals on the outer periphery of the lens assembly side joint surface 2a of the element holder 2, and four grooves 5a (FIG. 3) are formed at equal intervals on the outer periphery of the lens assembly side joint surface 3a of the lens assembly 3. Then, four grooves 5b (FIG. 4) are formed corresponding to the positions of the grooves 5a, and further the lens assembly 3 is
A circumferential groove 6 communicating with the groove 5b is formed on the joint surface 3a of the groove 5b.
従って、本発明では、保持体２をレンズアッセンブリ３
に挿入して、レンズ４と素子１との光軸を調整する際、
素子保持体２の４つの溝５ａとレンズアッセンブリ３の
４つの溝５ｂとを合わせ、それぞれの溝５（第１図、第
２図）を規定するようにする。Therefore, in the present invention, the holder 2 is attached to the lens assembly 3.
When adjusting the optical axis between lens 4 and element 1 by inserting it into
The four grooves 5a of the element holder 2 and the four grooves 5b of the lens assembly 3 are aligned to define each groove 5 (FIGS. 1 and 2).
４つの溝５にペースト状半田１０を注入し、半田１０に
一定のパワーで所定時間レーザ光を照射する。これによ
り、溝５内の半田は溶融し、円周溝６へ流れ込み、硬化
して保持体２がレンズアッセンブリ３に固定される。こ
の実施例によると、半田１０はその多くの部分が円周溝
６へ流れ込むので、レンズアッセンブリ３や保持体２の
外周に漏れることはなく、盛り上りやパリが生ずること
はない。従って、信較性の高い光半導体コリメータを得
ることができる。Paste-like solder 10 is injected into the four grooves 5, and the solder 10 is irradiated with a laser beam at a constant power for a predetermined time. As a result, the solder in the groove 5 melts, flows into the circumferential groove 6, hardens, and fixes the holder 2 to the lens assembly 3. According to this embodiment, most of the solder 10 flows into the circumferential groove 6, so that it does not leak to the outer periphery of the lens assembly 3 or the holder 2, and no bulges or cracks occur. Therefore, a highly reliable optical semiconductor collimator can be obtained.
第５図及び第６図は上記のようにして固定した光半導体
コリメータをセラミック基板上に実装して、光半導体モ
ジュールを構成した平面図である。FIGS. 5 and 6 are plan views showing an optical semiconductor module in which the optical semiconductor collimator fixed as described above is mounted on a ceramic substrate.
第５図において、２０は表面をメタライズしたセラミッ
ク基板、２１は光フアイバコリメータ、２２は発光コリ
メータ、２３は受光コリメータ、２４はガラスブロック
、２５は光干渉フィルタである。光半導体コリメータで
ある発光コリメータ２２又は受光コリメータ２３は、セ
ラミック基板の溝２７ （例えば、■溝）に位置決めさ
れ、同様にしてレーザ光照射による半田２８にて結合さ
れる。なお、半田２８は半田１０の溶融温度よりも低い
溶融温度のものを使用する。In FIG. 5, 20 is a ceramic substrate whose surface is metallized, 21 is an optical fiber collimator, 22 is a light emitting collimator, 23 is a light receiving collimator, 24 is a glass block, and 25 is an optical interference filter. The light emitting collimator 22 or the light receiving collimator 23, which is an optical semiconductor collimator, is positioned in a groove 27 (for example, a ■groove) of the ceramic substrate, and similarly bonded with solder 28 by laser beam irradiation. Note that the solder 28 used has a melting temperature lower than that of the solder 10.
本発明では、レーザ光を照射する際に半田が溝の中を流
れ、レンズアッセンブリも保持体の外周部に流出して盛
り上がることが防止されるので、半田による接合強度が
高くなって信頼性のある光半導体コリメータが得られる
。また、セラミック基板への平面実装も容易且つ正確に
行うことができる。In the present invention, when laser light is irradiated, the solder flows in the groove, and the lens assembly is also prevented from flowing to the outer periphery of the holder and rising, increasing the solder joint strength and improving reliability. A certain optical semiconductor collimator is obtained. Furthermore, planar mounting on a ceramic substrate can be easily and accurately performed.
第１図は本発明による光半導体コリメータの断面図、第
２図は第１図のｎ−ｎにおける断面図、第３図（ａ）及
び（ｂ）は本発明で用いる光半導体の側面図及び正面図
、第４図（ａ’）及び（ｂ）は本発明で用いるレンズア
ッセンブリの断面図及び正面図、第５図は本発明の光半
導体コリメータを用いて構成した光半導体モジュールの
平面図、第６図は第５図のｖｒ−ｖｒにおける断面図、
第７図は従来例における光半導体テラセンブリの組立断
面図、第８図は従来例における光半導体とレンズアッセ
ンブリの分解図である。
１・・・光半導体、 ２・・・保持体、３・・・レ
ンズアッセンブリ、
４・・・レンズ、 ５ （５ａ 、 ５ｂ）
・・・溝、６・・・円周溝、 １０・・・半田。FIG. 1 is a cross-sectional view of an optical semiconductor collimator according to the present invention, FIG. 2 is a cross-sectional view taken along line nn in FIG. 1, and FIGS. 3 (a) and (b) are side views and 4(a') and (b) are a sectional view and a front view of the lens assembly used in the present invention, and FIG. 5 is a plan view of an optical semiconductor module constructed using the optical semiconductor collimator of the present invention. FIG. 6 is a sectional view taken along vr-vr in FIG. 5,
FIG. 7 is an assembled sectional view of an optical semiconductor terra assembly in a conventional example, and FIG. 8 is an exploded view of an optical semiconductor and a lens assembly in a conventional example. DESCRIPTION OF SYMBOLS 1... Optical semiconductor, 2... Holder, 3... Lens assembly, 4... Lens, 5 (5a, 5b)
...Groove, 6...Circumferential groove, 10...Solder.
Claims (1)
に、レンズを内蔵したレンズアッセンブリに、光半導体
素子を保持した保持体を接合し、該接合部に半田を塗布
し、レーザ光を照射してレンズアッセンブリと素子保持
体とを半田結合する光半導体コリメータの固定構造にお
いて、レンズアッセンブリと素子保持体の少なくとも一
方は、接合面の周囲に半田を収容する溝が形成されてい
ることを特徴とする光半導体コリメータの固定構造。 ２、レンズアッセンブリと素子保持体の両者の接合面周
囲に、互いに対応する位置に複数の半田収容溝が円周方
向に等間隔に形成されている特許請求の範囲第１項記載
の構造。 ３、レンズアッセンブリと素子保持体の少なくとも一方
は、前記円周方向等間隔の溝の他に、これらの等間隔溝
に連通する円周溝が形成されている特許請求の範囲第２
項記載の構造。[Claims] 1. A holder holding an optical semiconductor element is joined to a lens assembly containing a lens so as to adjust the positional relationship between the lens and the optical semiconductor element, and solder is applied to the joint part. In the fixing structure of an optical semiconductor collimator in which a lens assembly and an element holder are soldered together by irradiating a laser beam, at least one of the lens assembly and the element holder is formed with a groove for accommodating solder around the joint surface. A fixed structure of an optical semiconductor collimator, characterized in that: 2. The structure according to claim 1, wherein a plurality of solder accommodating grooves are formed at equal intervals in the circumferential direction at mutually corresponding positions around the joint surfaces of both the lens assembly and the element holder. 3. At least one of the lens assembly and the element holder has, in addition to the circumferentially equally spaced grooves, a circumferential groove that communicates with these equally spaced grooves.
Structure described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62056818A JPS63223723A (en) | 1987-03-13 | 1987-03-13 | Structure for fixing photosemiconductor collimator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62056818A JPS63223723A (en) | 1987-03-13 | 1987-03-13 | Structure for fixing photosemiconductor collimator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63223723A true JPS63223723A (en) | 1988-09-19 |
Family
ID=13037954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62056818A Pending JPS63223723A (en) | 1987-03-13 | 1987-03-13 | Structure for fixing photosemiconductor collimator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63223723A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590415U (en) * | 1992-05-25 | 1993-12-10 | 株式会社ケンウッド | Structure of lens holding member |
| JP2007234637A (en) * | 2006-02-27 | 2007-09-13 | Kyocera Corp | Light emitting device and lighting system using same |
| CN109521541A (en) * | 2018-12-21 | 2019-03-26 | 广州立景创新科技有限公司 | A kind of processing technology of lens assembly, lens assembly and intelligent terminal |
-
1987
- 1987-03-13 JP JP62056818A patent/JPS63223723A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590415U (en) * | 1992-05-25 | 1993-12-10 | 株式会社ケンウッド | Structure of lens holding member |
| JP2007234637A (en) * | 2006-02-27 | 2007-09-13 | Kyocera Corp | Light emitting device and lighting system using same |
| CN109521541A (en) * | 2018-12-21 | 2019-03-26 | 广州立景创新科技有限公司 | A kind of processing technology of lens assembly, lens assembly and intelligent terminal |
| CN109521541B (en) * | 2018-12-21 | 2021-06-25 | 广州立景创新科技有限公司 | Processing technology of lens assembly, lens assembly and intelligent terminal |
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