JPH01133009A - Optical element module - Google Patents
Optical element moduleInfo
- Publication number
- JPH01133009A JPH01133009A JP28936287A JP28936287A JPH01133009A JP H01133009 A JPH01133009 A JP H01133009A JP 28936287 A JP28936287 A JP 28936287A JP 28936287 A JP28936287 A JP 28936287A JP H01133009 A JPH01133009 A JP H01133009A
- Authority
- JP
- Japan
- Prior art keywords
- stem
- housing
- gold
- filler metal
- brazing filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 27
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000005219 brazing Methods 0.000 claims abstract description 42
- 239000010931 gold Substances 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims abstract description 6
- 238000002844 melting Methods 0.000 abstract description 12
- 230000008018 melting Effects 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 238000007747 plating Methods 0.000 abstract description 10
- 238000009792 diffusion process Methods 0.000 abstract description 3
- 239000000945 filler Substances 0.000 abstract 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 5
- 238000005336 cracking Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010953 base metal Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、発光素子と光ファイバとを、レンズを用いて
安定に光結合させる光素子モジュール。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an optical element module that stably optically couples a light emitting element and an optical fiber using a lens.
受光素子モジュールに関するものである。The present invention relates to a light receiving element module.
光ファイバを用いる通信方式においては、発光□ 素子
の光を効率良く光ファイバへ結合させる光素子モジュー
ルが必要となる。従来、この種の装置においては、発光
素子から出射された光を、光ファイバに取り込む（光結
合）方法として、レンズを用いた光学系が広く用いられ
ている。これは、レンズを用いることにより光を集光で
き、この集光した光を、光ファイバに比較的容易に取り
込むことができるからである。この種の装置として。A communication system using optical fibers requires an optical element module that efficiently couples light from a light emitting element to an optical fiber. Conventionally, in this type of device, an optical system using a lens has been widely used as a method of taking in light emitted from a light emitting element into an optical fiber (optical coupling). This is because by using a lens, light can be focused, and this focused light can be taken into an optical fiber relatively easily. As this kind of device.
第６図に示す結合装置では、発光素子７は、ステム１上
面に突出したヒートシンク５にサブマウントを介して着
座され、このステム１は、ベース１１に固着されている
。またこのステム１には、球レンズ９が着座された球レ
ンズ保持部材１２が発光素子７を覆うように固着され、
フェルール１４を装着したフェルール支持部材１３が、
球レンズ保持部材１２を覆うようにベース１１上に保持
されている。この状態で、光出力の最大となるところに
位置合せを行い、ベース１１とフェルール支持部材１３
をＹＡＧレーザで溶接固定するものである。この従来技
術は、特開昭５９−１６６９０６に開示されている。In the coupling device shown in FIG. 6, a light emitting element 7 is seated via a submount on a heat sink 5 protruding from the upper surface of a stem 1, and this stem 1 is fixed to a base 11. Further, a ball lens holding member 12 on which a ball lens 9 is seated is fixed to the stem 1 so as to cover the light emitting element 7.
The ferrule support member 13 equipped with the ferrule 14 is
It is held on the base 11 so as to cover the ball lens holding member 12. In this state, the base 11 and the ferrule support member 13 are aligned to the point where the light output is maximum.
are welded and fixed using a YAG laser. This prior art is disclosed in Japanese Patent Laid-Open No. 59-166906.
上記従来技術は、ベースとフェルール支持部材とが最大
光出力を受光する点に位置合せした後、ＹＡＧレーザで
溶接固定するものであるが、金メツキを被覆したベース
をレーザ照射すると、レーザ光が金メツキで反射され、
溶接することが困難であった。また反射を防止し溶接す
ることができても、メツキ材料の金が母材に拡散し、溶
接部に割れが生じるという問題点があった。また上記溶
接方法では、ベースとフェルール支持部材の接触部の金
属を溶かし、（鉄材料：融点１５００°Ｃ）溶接するた
め、熱変形が生じ、位置ズレが起きやすかった。In the above conventional technology, after the base and the ferrule support member are aligned at the point where the maximum light output is received, they are welded and fixed using a YAG laser. However, when the base coated with gold plating is irradiated with the laser, the laser beam is emitted. Reflected by gold plating,
It was difficult to weld. Further, even if it is possible to weld while preventing reflection, there is a problem in that the gold of the plating material diffuses into the base metal, causing cracks in the welded part. Further, in the above welding method, since the metal at the contact portion between the base and the ferrule support member is melted and welded (iron material: melting point 1500°C), thermal deformation occurs and misalignment is likely to occur.
上述のように金メツキを被覆したベースと、フェルール
支持部を、反射や、割れを起さずに溶接することが困難
であり、また溶接できても、溶接前後で光軸ズレが起こ
り、光出力が低下する問題があった。As mentioned above, it is difficult to weld the gold-plated base and the ferrule support without causing reflections or cracks, and even if welding is possible, the optical axis will shift before and after welding, and the optical There was a problem with the output decreasing.
本発明の目的は、金メツキしたステムとハウジングを１
割れを発生させず、また位置ズレを起こさずに溶接し、
長期にわたって安定した光出力を得ることができる光素
子モジュールを提供することにある。The object of the present invention is to combine a gold-plated stem and housing into one
Welds without cracking or misalignment,
An object of the present invention is to provide an optical element module that can obtain stable optical output over a long period of time.
上記目的は、金メツキを被覆したステムとハウジングの
接触部に溝部を形成し、この溝部に、金になじみ易い低
融点のロウ材を導入して、ＹＡＧレーザで照射する。こ
のＹＡＧレーザ照射により溝部に導入したロウ材を溶か
して、ステムとハウジングを接合することにより達成さ
れる。The above purpose is to form a groove in the contact area between the gold-plated stem and the housing, introduce a low melting point brazing material that is compatible with gold into the groove, and irradiate it with a YAG laser. This is achieved by melting the brazing material introduced into the groove by this YAG laser irradiation and joining the stem and housing.
ステムとハウジングの接触部には、溝状のロウ材保持部
を設けており、このロウ材保持部にＡｕを含む低融点ロ
ウ材を供給する。A groove-shaped brazing material holding portion is provided at the contact portion between the stem and the housing, and a low melting point brazing material containing Au is supplied to this brazing material holding portion.
この状態の下で、ステムとハウジングの間のロウ材を、
ＹＡＧレーザで照射する。溶けたロウ材は、ロウ材保持
部内狭部まで行きわたり、ステムとハウジングを接合す
る。この接合では、低融点ロウ材を溶かして固定させて
いるため、固定後ロウ材が変形し、ハウジングに残留熱
ひずみを与えない、このため光軸ズレを防ぎ接合できる
。またステムとハウジングを強く押え付けた状態でレー
ザ照射しているため、光軸方向の位置変化を防ぐことが
できる。また、ロウ材は、Ａｕを含むもので金となじみ
が良いため、メツキ材料である金を、良く吸収し、ステ
ムやハウジング内への金の拡散を防止でき、この拡散に
よる割れを発生させない。Under this condition, the brazing material between the stem and the housing is
Irradiate with YAG laser. The melted brazing material spreads to the inner narrow part of the brazing material holding part and joins the stem and the housing. In this joining, since the low melting point brazing material is melted and fixed, the soldering material is deformed after fixing, and no residual thermal strain is imparted to the housing. Therefore, optical axis shift can be prevented and joining can be achieved. Furthermore, since the laser is irradiated with the stem and housing strongly pressed, positional changes in the optical axis direction can be prevented. Furthermore, since the brazing material contains Au and is compatible with gold, it can absorb gold as a plating material well and prevent the gold from diffusing into the stem and housing, thereby preventing cracks from occurring due to this diffusion.
このようにロウ材保持部を設け、ロウ材を用いて接合す
ることにより、接合部の割れや、ステムとハウジングの
位置ズレを起こさずに固定でき、長期にわたって安定し
た光出力を得ることができる。By providing a brazing material holding part and joining using brazing material in this way, it is possible to fix the joint without cracking or misaligning the stem and housing, and it is possible to obtain stable light output over a long period of time. .
以下、本発明の実施例を、第１図から第５図により説明
する。Embodiments of the present invention will be described below with reference to FIGS. 1 to 5.
〈実施例１〉
実施例１として、円板状ステムに接触するハウジング円
周部に０．２ＸＯ，２の段部を、全周に設け、ロウ材保
持部とした場合を示す。（第５図。<Example 1> As Example 1, a case is shown in which a 0.2XO. (Figure 5.
第１図）ステム１は、熱膨張率の低い鉄材料等からなり
、表面には、Ｎ１メツキを下地にして金メツキが約２μ
ｍの厚さで、全体に被覆されている。Figure 1) The stem 1 is made of iron material with a low coefficient of thermal expansion, and the surface is coated with gold plating of about 2 μm with N1 plating as the base.
The entire surface is coated with a thickness of m.
このステム１上面には、ヒートシンク５が突出しており
、このヒートシンク５にサブマウントを介して発光素子
７が着座され、ステム１に設けられたリード６で、この
発光索子７は給電駆動される。A heat sink 5 protrudes from the upper surface of the stem 1, and a light emitting element 7 is seated on the heat sink 5 via a submount, and the light emitting element 7 is powered and driven by a lead 6 provided on the stem 1. .
また、キャップ８には、発光索子７に対向させてレンズ
９が固定される。尚、この固定は、発光素子７が外気雰
囲気に触れないようキャップ８内を気密封止されている
。また、ハウジング３は、熱膨張率の低いステンレス鋼
等からなり１表面には。Further, a lens 9 is fixed to the cap 8 so as to face the light emitting cord 7 . Note that this fixation is done by hermetically sealing the inside of the cap 8 so that the light emitting element 7 does not come into contact with the outside atmosphere. Further, the housing 3 is made of stainless steel or the like having a low coefficient of thermal expansion, and one surface thereof is made of stainless steel or the like.
Ｎｉメツキを約３μｍの厚さで被覆した。このハウジン
グ３には、光コネクタ（シングルモードファイバ含む）
が固定されており、キャップ８が固定されたステム１を
、このハウジング３内へ挿入し、ステム１とハウジング
３を対向させる。次いて、レンズ９で集光された光を、
光コネクタで受光し、この光出力が最大のところに再位
置合せを行い、光出力が低下しないようにステム１とハ
ウジング３を接触させる。接触させた後、４ｋｇ以上の
力で押え付ける。第１図に示すようにステム１とハウジ
ング３の接触部全周に設けられた段部（溝）からなるロ
ウ材保持部４へは、ロウ材２として、形状がφ０．２ｍ
の低融点（３６０℃）の金を含有しているワイヤを、全
周にまき付ける。Ni plating was applied to a thickness of approximately 3 μm. This housing 3 includes an optical connector (including single mode fiber)
is fixed, and the stem 1 to which the cap 8 is fixed is inserted into the housing 3, and the stem 1 and the housing 3 are made to face each other. Next, the light focused by the lens 9 is
Light is received by the optical connector, realignment is performed at the point where the optical output is maximum, and the stem 1 and the housing 3 are brought into contact so that the optical output does not decrease. After making contact, press down with a force of 4 kg or more. As shown in FIG. 1, a brazing material 2 having a diameter of 0.2 mm is supplied to a brazing material holding portion 4 consisting of a step (groove) provided around the entire circumference of the contact area between the stem 1 and the housing 3.
A wire containing gold with a low melting point (360° C.) is wrapped around the entire circumference.
この日つ材２がまき付けられた接触部を、ＹＡＧレーザ
で照射する。このＹＡＧレーザ照射は、ステム１とハウ
ジング３の間のロウ材２を中心に、ステム１とハウジン
グ３にも照射される大きさで、φ０．３ ｎｔｎとし
、円周の対角方向に同時に２ケ所照射し、接触部は６点
の接合点で固定させる。この実施例でのＹＡＧレーザ照
射条件としては、パルス当りの出力、２．０ ジュー
ル、パルス幅６ｍＳ、繰返し数３００ｐｐｓ＋ 電圧３
００ Ｖ、 ５ｈｏｔ数ＩＱｓｈｏｔである。The contact area covered with the sunwood 2 is irradiated with a YAG laser. This YAG laser irradiation is centered on the brazing material 2 between the stem 1 and the housing 3, and has a size of φ0.3 ntn that also irradiates the stem 1 and the housing 3. The contact area is fixed at six joint points. The YAG laser irradiation conditions in this example are: output per pulse: 2.0 joules, pulse width: 6 mS, repetition rate: 300 pps + voltage: 3
00V, 5hot number IQshot.
〈実施例２〉
第２図に示す実施例では、ステム１に接触するハウジン
グ３部に、４５°０．２ｍｍの縁とリテーパ部を接触部
全周に設け、ロウ材保持部４としたものである。このロ
ウ材保持部４に、金を含んだ、形状がφ０．２ のワイ
ヤーの低融点ロウ材２を供給し、ＹＡＧレーザを照射し
て、溶かしたロウ材２で接合したものである。<Example 2> In the example shown in FIG. 2, a 45° 0.2 mm edge and a re-tapered part are provided around the entire circumference of the contact part on the housing 3 part that contacts the stem 1, and the brazing material holding part 4 is provided. It is. A low melting point brazing material 2 containing gold and having a wire shape of φ0.2 is supplied to the brazing material holding portion 4, and the soldering material 2 is bonded with the melted brazing material 2 by irradiation with a YAG laser.
〈実施例３〉
第３図に示す実施例では、接触点のステム１部ハウジン
グ３部それぞれに、０．２ＸＯ，２の段部を接触部全周
に設け、ロウ材保持部４とし、このコラ材保持部４に、
幅０ 、３ ｔｒｙ 、厚さ０．２ｍｍの板状のロウ材
２を接触部周囲にまき付け、ＹＡＧレーザでロウ材２の
中心を照射して接合したものである。<Embodiment 3> In the embodiment shown in FIG. 3, a 0.2XO. In the collage material holding part 4,
A plate-shaped brazing material 2 with a width of 0.3 mm and a thickness of 0.2 mm is wrapped around the contact portion, and the center of the brazing material 2 is irradiated with a YAG laser to join.
〈実施例４〉
第４図に示す実施例では、接触点のステム１部ハウジン
グ３部それぞれ対向して、４５’ ０．２円ｍの縁とリ
テーパ部を接触部全周に設け、ロウ材保持部４とし、こ
のロウ材保持部４に、φ０．２ のワイヤ状の低融点ロ
ウ材２を、接触部周囲にまき付けＹＡＧレーザを照射し
て接合したものである。<Embodiment 4> In the embodiment shown in Fig. 4, an edge of 45' 0.2 yen and a re-tapered part are provided around the entire circumference of the contact part, facing each other of the stem 1 and the housing 3 at the contact point. A wire-shaped low melting point brazing material 2 having a diameter of 0.2 mm is wrapped around the contact portion and irradiated with a YAG laser to join the brazing material holding portion 4 to the holding portion 4.
本発明によれば、溶かされた低融点ロウ材が、ロウ材保
持部内に充満し、ステムとハウジングを接合させている
。この接合により、メツキ材の金はロウ材に吸収される
ため、金の拡散による接合部の割れを解消する。また、
母材（鉄、融点１５００℃）を溶かして接合した場合に
比べ、ハウジングに生じる残留熱ひずみは少ない。また
、ステムとハウジングは面接触で強力な力で押え付けて
いるた′め、光軸方向の位置変化がない。これにより、
接合前後の光軸ズレを防ぎ固定できる。また１円周接触
部の対称位置からレーザ照射し接合するため、変形の非
対称性がなく固定できる。以上より。According to the present invention, the melted low melting point brazing material fills the brazing material holding portion and joins the stem and the housing. Through this bonding, the gold in the plating material is absorbed by the brazing material, eliminating cracks in the bonded portion due to gold diffusion. Also,
Compared to joining by melting the base material (iron, melting point 1500°C), the residual thermal strain generated in the housing is smaller. Furthermore, since the stem and housing are in surface contact and pressed together with strong force, there is no change in position in the optical axis direction. This results in
Prevents optical axis shift before and after joining and can be fixed. In addition, since the laser beam is irradiated from the symmetrical position of the one-circumferential contact portion for bonding, there is no asymmetry in deformation and the bonding can be fixed. From the above.
本発明の光素子モジュールでは、接合部の割れが無く、
また残留熱ひずみが少ないため、長期にわたって安定し
た光出力を得ることができるものである。In the optical element module of the present invention, there is no cracking at the joint,
Furthermore, since residual thermal distortion is small, stable light output can be obtained over a long period of time.
第１図〜第４図は、本発明の各実施例を示す接合部の断
面図、第５図は、本発明の光素子モジュールの全体図、
第６図は、従来装置を示す断面図である。
１・・・ステム、２・・・ロウ材、３・・・ハウジング
、４・・ロウ材保持部、５・・・ヒートシンク、６・・
・リード、７・・・発光素子、８・・・キャップ、９・
・レンズ、１０・・・光コネクタ挿入孔、１１・・・ベ
ース、１２・・・レンズ保持部材、１３・・・フェルー
ル支持部材、１４・・フェルール、１５・・・ＹＡＧレ
ーザ照射。1 to 4 are cross-sectional views of joints showing each embodiment of the present invention, and FIG. 5 is an overall view of the optical element module of the present invention.
FIG. 6 is a sectional view showing a conventional device. DESCRIPTION OF SYMBOLS 1... Stem, 2... Brazing material, 3... Housing, 4... Brazing material holding part, 5... Heat sink, 6...
・Lead, 7...Light emitting element, 8...Cap, 9・
- Lens, 10... Optical connector insertion hole, 11... Base, 12... Lens holding member, 13... Ferrule support member, 14... Ferrule, 15... YAG laser irradiation.
Claims (1)
クにサブマウントを介して着座されている発光素子と、
この発光素子には、キャップに取り付けられたレンズを
対向させ、前記キャップを、前記ステムに固定し、前記
レンズで集光された光をハウジングに装着された光コネ
クタで受光し、前記ステムの接触部を溶接固定する光素
子モジュールにおいて、前記ハウジングと前記ステムの
接触部に金を含むロウ材を導入して接合し、溶かされた
ロウ材が、前記ステムと前記ハウジングの間に入り込む
ロウ材保持部を設けたことを特徴とする光素子モジュー
ル。 ２、ロウ材保持部は、周囲３箇所、あるいはそれ以上全
周に設けた特許請求の範囲第１項記載の光素子モジュー
ル。 ３、接触部のロウ材保持部は、溝あるいは孔とした特許
請求の範囲第１項記載の光素子モジュール。 ４、ステムとハウジングの接触部は、互いに面で接触し
ている特許請求の範囲第１項記載の光素子モジュール。[Claims] 1. A disc-shaped stem, a light emitting element seated on a heat sink protruding from the stem via a submount,
A lens attached to a cap is opposed to the light emitting element, and the cap is fixed to the stem, and the light collected by the lens is received by an optical connector attached to the housing, and the stem is brought into contact with the light emitting element. In an optical element module in which parts are fixed by welding, a brazing material containing gold is introduced into a contacting part of the housing and the stem to join them, and the melted brazing material enters between the stem and the housing to hold the brazing material. An optical element module characterized in that an optical element module is provided with a section. 2. The optical element module according to claim 1, wherein the brazing material holding portion is provided at three or more locations around the entire circumference. 3. The optical element module according to claim 1, wherein the brazing material holding portion of the contact portion is a groove or a hole. 4. The optical element module according to claim 1, wherein the contact portions of the stem and the housing are in surface contact with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28936287A JPH01133009A (en) | 1987-11-18 | 1987-11-18 | Optical element module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28936287A JPH01133009A (en) | 1987-11-18 | 1987-11-18 | Optical element module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133009A true JPH01133009A (en) | 1989-05-25 |
Family
ID=17742221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28936287A Pending JPH01133009A (en) | 1987-11-18 | 1987-11-18 | Optical element module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133009A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0375708A (en) * | 1989-08-18 | 1991-03-29 | Nippon Telegr & Teleph Corp <Ntt> | Optical unit and optical coupling part thereof |
| US6053641A (en) * | 1996-12-30 | 2000-04-25 | Hyundai Electronics Industries Co. | Fiber pigtail for optical communication module |
| JP2013115149A (en) * | 2011-11-25 | 2013-06-10 | Kyocera Corp | Element housing package and optical semiconductor device |
-
1987
- 1987-11-18 JP JP28936287A patent/JPH01133009A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0375708A (en) * | 1989-08-18 | 1991-03-29 | Nippon Telegr & Teleph Corp <Ntt> | Optical unit and optical coupling part thereof |
| US6053641A (en) * | 1996-12-30 | 2000-04-25 | Hyundai Electronics Industries Co. | Fiber pigtail for optical communication module |
| JP2013115149A (en) * | 2011-11-25 | 2013-06-10 | Kyocera Corp | Element housing package and optical semiconductor device |
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