JPH05323158A - Laser diode coupler and its assembling method - Google Patents

Abstract

PURPOSE:To provide the package which improves coupling efficiency in order to increase the fiber output of a laser diode package for optical communication and improves the heat radiation from the laser diode. CONSTITUTION:A pedestal 9 is fixed to a sub-stem 4 and an aspherical lens 7 is fixed to a metallic ring 8 in order to facilitate the adjustment of the optical axes of the laser diode 1 and the aspherical lens 7. A metallic plate 19 is previously brazed by Ag to the surface of a thermoelectric cooling element 3 in order to join the sub-stem 4, the thermoelectric cooling element 3 and a case 2 by soldering. These parts are then joined by using solder, such as In-Ag. joining of a heat insulating material into the case 2 is equally good.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser diode coupling device for optically coupling a laser diode and an optical fiber through a lens and a method for assembling the same.

[0002]

2. Description of the Related Art In an optical communication system using an optical fiber as a transmission line, high fiber output is required for long-distance transmission. That is, there is a need for an optical coupling device that takes in light oscillated from a laser diode element into an optical fiber as efficiently as possible and with a high output.

In order to improve the coupling efficiency, a method of optically coupling with a spherical fiber having a lens effect at the end of the optical fiber,
Alternatively, a method of coupling to an optical fiber via a plurality of lenses is used.

In the method using the spherical fiber, the relative allowable positional deviation amount (1d) between the laser diode and the spherical fiber is set.
The amount by which the light output of B fluctuates) is only about ± 2 μm, while the method using a lens allows a larger relative permissible positional deviation amount than coupling with a spherical fiber, and therefore, the assembly is performed. It's easy.

In order to increase the fiber output, the operating current to the laser diode element is increased or the laser diode element is mounted based on the high output characteristics, but the heat generated from the laser diode increases accordingly.

Since the light emission output decreases as the temperature of the laser diode element rises, it is desirable that the coupling device should have a structure for quickly radiating heat from the laser diode.

A conventional technique of this kind is disclosed in JP-A-63-11.
As disclosed in Japanese Patent No. 8706, the laser diode is bonded and fixed to the side wall of the case through a thermoelectric cooling element and a sub-stem.

The sub-stem has a T-shape so that the laser diode can be emitted upward. Therefore, by mounting the laser diode on the thermoelectric cooling element which is joined and fixed to the side wall with a low melting point solder or the like, the laser light is emitted in the direction perpendicular to the side wall.

The laser light is emitted from the front and the rear with the same output, and the rear light is received by the monitor diode to control the front output. The forward light used for optical transmission is collected by a spherical lens. The spherical lens is aligned with the emitting part of the laser diode, and then Pb-S
n Solder or low melting point glass is used for joining and fixing.

Assembly of the coupling device is performed as follows.

A laser diode is previously provided on the sub-stem,
Assemble the ball lens, monitor photodiode, and thermoelectric cooling element. The light of the laser diode passes through the spherical lens, is condensed by the cylindrical rod lens, and enters the fiber. Therefore, the rod lens is fixed in a hole provided on the side wall of the case with Pb-Sn solder, and then the laser diode-equipped sub-stem is aligned so that the optical axis of the rod lens and the optical axis of the spherical lens coincide with each other. The bottom surface of the cooling element and the side wall of the case are joined and fixed.

The light from the rod lens is finally coupled into a single mode fiber. The fiber is composed of a fiber with a ferrule and a ferrule guide so that the light from the rod lens can be adjusted in the X, Y, and Z axis directions.

Regarding the optical axis, first, the fiber with a ferrule is aligned so that the light from the rod lens is maximized, and then the entire circumference of the ferrule guide is fixed.

Next, the ferrule guide and the ferrule-attached fiber are adjusted in the Z-axis direction and then fixed with solder such as Pb-Sn.

[0015]

In the above-mentioned prior art, in order to obtain a coupling efficiency with a single mode fiber, optical coupling is performed by a lens structure in which a spherical lens and a rod lens are combined, but a laser diode and a spherical lens are combined. Since they are arranged on the same plane, they can be aligned on the plane but cannot be adjusted out-of-plane, so the optical axis is inclined with respect to the deviation in the height direction and enters the rod lens, reducing the coupling efficiency. was there.

In order to increase the fiber output, the operating current of the laser diode may be increased or an element capable of high-power operation of the laser diode may be mounted, but with this, the heat generation of the element increases. There was a problem that it did not have a corresponding laser diode heat dissipation structure.

Further, the sub-stem, the thermoelectric cooling element, and the case are bonded and fixed using In-Ag (melting point 141 ° C.) and In-Sn (melting point 117 ° C.), respectively, but sufficient wetting cannot be obtained and thermal resistance is increased. As a result of the increase, there is a problem that the fiber output is reduced or the life of the laser diode element is reduced.

The object of the present invention is to accurately align the optical axes of the lens and the laser diode and to ensure the wettability of the joint between the constituent members even if the heat generated from the laser diode becomes large. It is intended to obtain a high fiber output by providing a structure and an assembling method in which the heat generated in 1 is quickly radiated to the outside of the case and the heat outside the case does not return to the laser diode again.

[0019]

In order to achieve the above object, the laser diode coupling device of the present invention is joined and fixed to one side wall of a package case through a thermoelectric cooling element and a substem. A laser diode element, a first lens joined and fixed on the sub-stem in the vicinity of the front emission end of the laser diode element, and a lens holder on the other side wall of the package case which faces the laser diode element. A second lens that is joined and fixed via a ferrule, and a ferrule-equipped fiber that is fixed via a ferrule holder at one end of the lens holder. After the optical axis is aligned with the one lens, the pedestal and the metal ring are joined and fixed. The material of the pedestal of the sub-stem and the metal ring for the first lens is preferably Fe-45Ni or Fe-50Ni fixed by soldering using YAG welding or high frequency heating.

Another embodiment of the laser diode coupling device of the present invention is a laser diode which is joined and fixed to one side wall of a package case through a thermoelectric cooling element and a sub-stem.
A laser diode element, a first lens fixed on the sub-stem in the vicinity of the front emission end of the laser diode element, and a second lens fixed on the other side wall of the package case via a lens holder. A second lens and a fiber with a ferrule fixed at one end of the lens holder via a ferrule holder, wherein an Al ₂ O ₃ plate or Si ₃ N ₄ is provided on the upper and lower surfaces in the package case. , MgO-S
It is characterized in that an iO ₂ plate is bonded and fixed.

On the surface of the thermoelectric cooling element, metal materials made of the same or similar material as the package case are joined,
It is preferable that the joining surface of the thermoelectric cooling element and the sub-stem or the package case are joined and fixed via the surface of the metal material. Further, the materials of the sub-stem and the package case are Mo, Cu- (80 to 90) W, and Cu / 32Ni-.
It is preferably a 4Co-Fe / Cu clad material.

Further, the metal material bonded to the surface of the thermoelectric cooling element is Mo, Cu- (80 to 90) W, or Cu / 32.
This metal material is a Ni-Co-Fe / Cu clad material, and is bonded and fixed to the surface of the thermoelectric cooling element with a bonding material such as Ag-, Au-Si, Au-Ge, Au-Sn. In-Sn, In-Ag, In-Pb-A
It is preferable that the sub-stem, the thermoelectric cooling element with the metal material, and the package case are fixed by a solder material such as g, In-Pb-Sn, or Pb-Sn, or by resistance welding or YAG welding.

Also, the method for assembling the laser diode coupling device of the present invention comprises a laser diode element joined and fixed to one side wall of the package case through a thermoelectric cooling element and a sub-stem, and a laser diode element. A first lens fixed near the front emission end of the diode element, a second lens fixed on the other side wall of the package case facing the other side, and a ferrule holder at one end of the lens holder. In a laser diode coupling device equipped with a fiber with a ferrule fixed via a metal case made of the same or similar material as the sub-stem on the cooling surface of the thermoelectric cooling element and the package case on the heating surface of the thermoelectric cooling element in advance. The same or the same type of sub-stem and the first lens-equipped sub-stem aligned with the laser diode and the optical axis The surface of the thermoelectric cooling element with metal material is joined and fixed by soldering or welding, and then the optical axis of the thermoelectric cooling element with sub-stem and the second lens is aligned and then joined and fixed by soldering or welding to the package case, Finally, the fiber with ferrule is characterized by adjusting and fixing the optical axis.

[0024]

In general, the light from the laser diode is 30 to 4
It oscillates with a spread of 0 °. A lens is used to efficiently inject this light into the fiber. When focusing with the first lens, a pedestal is provided on the sub-stem for fixing the laser diode, the first lens is fixed to the metal ring in advance, and the pedestal and the lens with the ring are rubbed together to adjust and fix the optical axis.

Further, in order to quickly dissipate the heat from the laser diode to the outside of the case, a metal plate is fixed in advance on the surface of the thermoelectric cooling element with Ag solder or the like. The metal plate is made of, for example, the same material as the subcarrier and has good wettability with In-Pb-Ag or the like. Therefore, the subcarrier, the thermoelectric cooling element, and the package case are fixed to each other with In-Pb-Ag to improve the bondability, and Al2 is formed on the upper and lower surfaces of the package case.
O3 is joined to block the heat transferred from the outside of the package case to the laser diode through the gas inside the case during operation of the thermoelectric cooling element, thereby improving heat dissipation.

The laser diode coupling device thus assembled can increase the coupling efficiency and can keep the temperature of the laser diode element low, so that a stable high fiber output can be obtained.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.

The laser diode 1 is joined and fixed to the side wall of the case 2 via the thermoelectric cooling element 3, the sub-stem 4, and the base 5. The sub-stem 4 has a T-shape so that the laser diode 1 can be emitted upward (Z direction in FIG. 1). The laser diode 1 has a property that the optical output and the wavelength fluctuate depending on the temperature change.

Therefore, in order to keep the temperature of the laser diode 1 constant, the temperature of the sub-stem 4 is controlled by the thermoelectric cooling element 3. The heat from the thermoelectric cooling element 3 is Mo, Cu- (80 to 90) W, or Cu having a good thermal conductivity as the material of the base 5 so that it can be quickly released to the outside of the case 2.
A / 32Ni-4Co-Fe / Cu material is suitable. The material of the case 2 is the same as that of the base 5.

Further, as a method of mounting the base 5 in the case 2, the side wall and the lower surface of the case 2 are made of Ag material (for example, 72Ag-Cu, 85A) so as to enhance heat dissipation.
g-Cu) or a method in which the base 5 and the case 2 are integrally formed by rolling the same material without interruption.

FIG. 2 shows an assembling process of the case 2. Figure 2
-A is a front view of the case 2 as seen from above. Case 2
One side and bottom are integrated into a T shape, and the base 5
Is formed in the central portion. When this plate is bent,
-B. Further, a square pipe 2 '(Fig. 2d) which becomes the four side surfaces of the case 2 is formed in advance and is combined with Fig. 2b to obtain Fig. 2c. It is suitable that the T-shaped plate and the square pipe 2 ′ have Ag brazing.

Oscillation light from the laser diode 1 is emitted simultaneously before and after the diode. A photodiode 6 for monitoring the light from the rear is provided in the sub-stem 4 in order to control the output of the front light used for transmission.
The light emitted from the laser diode 1 has a spread of about 40 ° in the direction perpendicular to the diode and about 30 ° in the horizontal direction. The aspherical lens 7 and the rod lens 10 are used to make this light efficiently enter the fiber.

The aspherical lens 7 is preliminarily fixed on the metal ring 8 made of Fe-45Ni or Fe-50Ni with low melting point glass, Au-Sn or the like, or the lens is directly formed on the metal ring 8 by glass molding. .. On the other hand, a ring-shaped pedestal 9 is fixed to the end face of the sub-stem 4 by Ag low.

The material of the pedestal 9 is preferably the same as that of the metal ring 8. The metal ring 8 with an aspherical lens is placed on the pedestal 9, and the optical axis is adjusted so that the light emitted from the laser diode is parallel to the right angle, and then the pedestal 9 and the metal ring 8 are fixed. As a fixing method, there is a method of fixing with Au-Sn or the like using YAG welding or high frequency heating.

The rod lens 10 is fixed by previously fixing the lens guide 11 on the side wall of the case 2 and inserting the lens guide 11 therein. The fixing portion 12 between the lens guide 11 and the case 2 is a base portion for keeping the inside of the case airtight or fixing the lens, and is made of Ag low, low melting point glass, YAG welding, resistance welding. The lens guide 11 is fixed by using. As a material for the lens guide 11, iron materials such as SPCC and SS41 are suitable.

There are two types of methods for incorporating the laser diode 1 into the case 2. That is, when the lens guide 11 is fixed with Ag low, low melting point glass,
This is the case of fixing by welding or resistance welding.

When the lens guide 11 is attached to Ag low or low melting point glass, the structure is such that the lens guide 11 is fixed in advance in order to raise the temperature of the case 2.
In YAG welding and resistance welding, the lens guide 11 is fixed after the laser diode 1 is fixed in the case 2 in advance.

In the case of Ag low fixation, after fixing the lens guide in the case 2, the rod lens 10 is placed at a predetermined position of the lens guide 11 and fixed using a bonding material such as Au-Sn, Au-Ge. The inside is observed through the rod lens 10 with a microscope, and the optical axis of the sub-stem 4 with the aspherical lens 7 is aligned so that it is on the optical axis of the rod lens 10.
Fix the bottom surface of the sub-stem 4. The thermoelectric cooling element 3 is previously fixed to the sub-stem 4, and the bottom surface of the thermoelectric cooling element 3 and the base 5 are fixed.

Next, in the case of YAG welding fixation, the sub-stem 4 with an aspherical lens is first incorporated in the case 2. That is, a dummy lens guide with a rod lens is prepared on the side wall of the case 2 where the rod lens 10 is located.

Next, the optical axis of the sub-stem 4 with the aspherical lens and the lens guide with the rod lens is aligned under a microscope, and the sub-stem 4, the bottom surface of the thermoelectric cooling element 3 and the base 5 are joined and fixed, respectively. After incorporating the sub-stem 4, Au wire wiring is performed so that the laser diode 1 can oscillate. The lens guide with rod lens of the dummy is removed, and the lens guide 11 and the rod lens 10 fixed in advance are arranged on the side wall of the case 2.

While oscillating the laser diode 1, the lens guide 11 is adjusted in the X and Y directions so that the light from the aspherical lens 7 coincides with the optical axis of the rod lens 10, and the portion of the joint portion 12 is adjusted. Fix with YAG welding or resistance welding.
In the case of YAG welding, the end of the lens guide 11 is
It is preferable to provide a U-shaped or V-shaped groove over the entire circumference as shown in FIG.

At the time of welding, two or four diagonal positions around the lens guide are temporarily fixed and fixed, and then the entire circumference of the lens guide is fixed by welding. When resistance welding,
As shown in FIG. 3, the end portion of the lens guide 11 is provided with a projection 18 over the entire circumference in advance.

When current is applied while applying pressure between the case 2 and the lens guide 11, the protrusions melt and the case 2
However, if a slight groove into which the fusion protrusion flows is provided on the lens guide 11 side at this time, the case 2 and the lens guide 11 can be joined without a gap, and the lens can be fixed without tilting. can get.

When the laser diode 1 is installed in the case 2 in which the lens guide 11 is fixed to Ag low, the laser diode is adjusted while the optical axis is aligned with the rod lens 10 provided in the lens guide. It is necessary to fix the sub-stem 4 to which the case 1 is fixed to the case 2.

The space in the case 2 is limited. In the case of the case 2, for example, butterfly type, the outer shape 2 is used.
It is only 0.8 x 12.7 x 7.6, and it is a bonding work in a very narrow space, and it is important to remove the oxide film generated on the solder by rubbing the bonding surfaces in order to perform solder bonding. The thermoelectric cooling element 3 has a heat resistance of only about 150 ° C., and a soldering material having a melting point lower than this is used. The surface of the thermoelectric cooling element 3 is made of alumina. For example, Cu, Ni, Au However, problems such as insufficient solderability by performing a metallization process such as, but not sufficient wettability, heat dissipation from the sub-stem 4 to the outside of the case 2 with high output of the laser diode 1 and obtaining a high fiber output was there.

The first method for improving heat radiation from the laser diode 1 is to make the shape of the sub-stem 4 pyramidal. The heat from the laser diode 1 spreads and conducts. Therefore, when the laser diode 1 is mounted on the apex of the pyramid, the heat is radiated most efficiently.

Actually, the lens 8 is provided on the sub-stem 4,
Since the components such as the photodiode 6 are mounted, the shape is stepwise. Also, considering the heat conduction to the thermoelectric cooling element 3,
The bottom surface of the pyramid is preferably aligned with the thermoelectric cooling element 3.

A second method for improving heat radiation from the laser diode 1 is to provide a step (groove) 21 on the joint surface of the sub-stem 4 as shown in FIG. There is a method of fixing with the solder bonding layer 17. The direction in which the solder joint is destroyed during assembly or use is toward the inside from the outer periphery of the joint surface.By increasing the solder thickness on the outer periphery, the force applied to the solder joint layer is dispersed and the joint joint is destroyed. Prevents deterioration of thermal resistance.

Further, as shown in FIG. 5, a metal material 19 made of the same or similar material as the sub-stem 4 is previously bonded to the surface of the thermoelectric cooling element 3, and the surface of the metal material 19 and the sub-stem 4 are bonded. It is a method to let.

A conventional bonded product was subjected to a temperature cycle test (-45
(° C. to 80 ° C.), the solder is peeled off from the ceramic surface of the thermoelectric cooling element 3, and there is no peeling on the sub-stem 4 side. This is because the wettability between the ceramics and the solder is not sufficient. Therefore, the metal plate 19 is attached to the surface of the thermoelectric cooling element 3 to improve the bonding.

Further, as shown in FIG. 5, if the grooves 21 and 22 are provided on the cooling surface and the heating surface of the sub-stem 4 or the thermoelectric cooling element 3, the joint can be further improved. Grooves 21, 22
20 to 30% of the bonding area is suitable.

The thickness of the metal plate 19 joined to the cooling surface is 1/5 to 1/2 that of the ceramic plate, and the material is Mo,
Cu- (80-90) W, Cu / 32Ni-4Co-F
An e / Cu clad material is preferable. For bonding to ceramics, Ag-based material such as 72Ag-Cu or 85Ag-Cu is used in advance.
Alternatively, they are fixed with a bonding material such as Au-Si, Au-Ge, Au-Sn, and then the thermoelectric cooling element 3 is assembled. A concrete example of the combination of the materials of the respective members is shown below.

(1) 72 Ag on an Al ₂ O ₃ alumina plate
-Braz the Mo plate with Cu.

(2) A Cu- (80 to 90) W plate is bonded to the alumina plate using Au-Sn.

(3) A Cu / 32Ni-4Co-Fe / Cu plate is bonded to the alumina plate using Au-Ge. The thickness of the metal plate 19 bonded to the heating surface is 1/5 to 1/2 of that of the ceramic plate, and the material is Mo, Cu- (80 to
90) W, Cu / 32Ni-4Co-Fe / Cu is preferable.

The heating surface of the thermoelectric cooling element thus formed and the sub-stem 4 surface are made of In-Sn, In-Ag, In.
-Fix with solder such as Pb-Ag or Pb-Sn.

Next, the rod lens 10 and the aspherical lens 7
The sub-stem 4 with a thermoelectric cooling element is bonded and fixed to the base 5 while adjusting the optical axis from. In-S as a bonding material
n, In-Ag, In-Pb-Ag, Pb-Sn, etc. are suitable. At the joining of this portion, the case 2 is mounted with the laser diode and the photo diode mounted after assembly.
It is difficult to clean the inside with flux.

Therefore, it is preferable to perform Ni and Au metallization on the metal surface and perform fluxless bonding in an atmosphere of N ₂ inert gas or inert gas.

A third method for improving heat radiation from the laser diode 1 is to bond the heat insulating material 20 to the upper and lower surfaces of the package case 2. As a material, Al ₂ O ₃ , Si
₃ N _4, MgO-SiO ₂ or the like is suitable.

As a bonding material for the package case 2, A
Solder such as u-Sn, Au-Ge, Au-Si is preferable. It is preferable that the width of the heat insulating material 20 covers the sub-stem 4 and the thermoelectric cooling element 3. Further, it is more preferable that the heat insulating material 20 is bonded to not only the upper and lower surfaces of the case 2 but also the left and right surfaces. These heat insulating materials 20
Are preferably bonded before mounting the laser diode 1 on the package.

The light from the rod lens 10 is finally coupled to the single mode fiber 13. Fiber 13
The outer shape is φ125 μm, but the portion where the light is guided is the core portion φ10 μm. Therefore, it is necessary to collect the light from the rod lens 10 as much as possible and make it enter the core.

That is, in order to obtain a structure in which axes can be adjusted in the three directions of X, Y, and Z, first, the fiber 13 is bonded and fixed in a ferrule 14 of ceramics, zirconia, or the like, and then the end face is polished. Get the incoming core part.

The end surface polishing is inclined at an angle of 4 ° or more from a right angle. This is because when the light is focused on the end face of the fiber through the lens, if there is a part reflected on the end face, it will be re-incident on the laser diode 1, and even if a slight return light is re-incident on the laser diode 1. Along with this, the light is amplified and the oscillation of the laser diode becomes unstable. Therefore, a structure in which the reflected light does not return to the laser diode 1 is provided by providing the fiber end face with an inclination 23.

By providing the ferrule guide 15 for guiding the ferrule 14, the Z axis is adjusted between the ferrule 14 and the guide 15, and the X and Y axes are adjusted between the ferrule guide 15 and the lens guide 11.

According to the optical coupling experiment, the allowable relative positional deviation amount between the rod lens 10 and the fiber 13 is 1 from the maximum coupling.
When the dB is lowered, it is ± 3 μm in the X and Y directions and ± 150 μm in the Z direction. Therefore, first, after the optical axes of the X, Y, and Z axes are adjusted, the lens guide 11 and the ferrule guide 15 are fixed around the entire circumference. Fixed part 16
Has a groove on the side of the ferrule guide 15, and a ring-shaped Au-Sn, Au-Ge bonding material is placed on this portion, and the outer peripheral portion of the ferrule guide 15 is heated by a high frequency heating device to melt. Solidify.

Next, the space between the ferrule 14 and the ferrule guide 15 is fixed with Pb-Sn solder. Further, when the ferrule 14 material is Al ₂ O ₃ or zirconia material, the joining of the ferrule 14 and the ferrule guide 15 is more stable if the same method as the joining of the thermoelectric cooling element 3 and the sub-stem 4 is used. A bonded joint is obtained.

According to the above embodiment, the shape of the sub-stem 4 is pyramidal, the sub-stem 4, the thermoelectric cooling element 3,
A laser diode is provided by providing a groove for reducing the force applied to the joining interface for joining with the base 5 and joining a metal plate to the surface of the thermoelectric cooling element 4 to enhance joining properties, and by joining a heat insulating material in the case 2. It is possible to surely dissipate heat from the outside of the case to the laser diode 1 and the first lens 7
The optical axis can be accurately aligned with the metal ring, and the fiber output from the package can be increased.

[0068]

According to the present invention, the sub-stem for fixing the laser diode can be fixed to the thermoelectric cooling element with good wettability and with less force applied to the bonding interface, and further, the heat insulating material in the case is provided. As a result, it is possible to reliably dissipate heat from the laser diode.

Further, there is an effect that the coupling efficiency between the laser diode and the fiber can be increased. Furthermore, there is an effect that the reliability of the package can be increased.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a package according to an embodiment of the present invention.

FIG. 2 is a front view showing an assembly process of the package case of FIG.

3 is a cross-sectional view of the lens guide portion of FIG.

FIG. 4 is a sectional view of another embodiment of FIG.

FIG. 5 is a cross-sectional view of an embodiment of a joint portion between a sub-stem and a thermoelectric cooling element according to the present invention.

FIG. 6 is a cross-sectional view of another embodiment of the joint portion between the sub-stem and the thermoelectric cooling element according to the present invention.

[Explanation of symbols]

1 ... Laser diode, 2 ... Case, 3 ... Thermoelectric cooling element, 4 ... Substem, 5 ... Base, 6 ... Photodiode
Reference numeral 7 ... Aspherical lens, 10 ... Rod lens, 11 ... Lens guide, 13 ... Single mode fiber, 14 ... Feru, 15 ... Feru guide, 20 ... Heat insulating material.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tetsuo Kumazawa 502 Kintatemachi, Tsuchiura City, Ibaraki Prefecture Hiritsu Manufacturing Co., Ltd. Mechanical Research Laboratory

Claims (7)

[Claims] 1. A laser diode element joined and fixed to one side wall of a package case via a thermoelectric cooling element and a substem, and a substem in the vicinity of the front emission end of the laser diode element. The first lens fixed on the upper side, the second lens fixed on the other side wall of the package case facing the other side through the lens holder, and fixed on one end of the lens holder via the ferrule holder. In the laser diode coupling device including the fiber with a ferrule, the first lens is fixed to the ring-shaped metal in advance, and the first lens with the ring-shaped metal and the laser diode are mounted on the pedestal provided on the sub-stem. A laser diode coupling device characterized in that it is fixed after adjusting so that the optical axes of the elements coincide with each other. 2. The ring and pedestal are made of Fe-45Ni or Fe-50Ni according to claim 1, and the first lens with metal ring is fixed to the pedestal by soldering using YAG welding or high frequency heating. A laser diode coupling device characterized by: 3. A laser diode element joined and fixed to one side wall of a package case via a thermoelectric cooling element and a substem, and a substem in the vicinity of the front emission end of the laser diode element. The first lens fixed on the upper side, the second lens fixed on the other side wall of the package case facing the other side through the lens holder, and fixed on one end of the lens holder via the ferrule holder. In a laser diode coupling device provided with the above-mentioned ferruled fiber, Al _{2 is formed} on the upper surface and the lower surface in the package case.
O ₃ plate or Si ₃ N _4, a laser diode coupling device, characterized in that the MgO-SiO ₂ plate was bonded and fixed. 4. A laser diode element joined and fixed to one side wall of a package case via a thermoelectric cooling element and a substem, and a substem in the vicinity of the front emission end of the laser diode element. The first lens fixed on the upper side, the second lens fixed on the other side wall of the package case facing the other side through the lens holder, and fixed on one end of the lens holder via the ferrule holder. In the laser diode coupling device including the ferruled fiber described above, a metal material made of the same or similar material as the sub-stem is bonded to the surface of the thermoelectric cooling element in advance, and a thermoelectric material is formed through the surface of the metal material. A laser diode coupling device, wherein a cooling element bonding surface and a sub-stem bonding surface are bonded and fixed. 5. The material according to claim 1, wherein the material of the sub-stem and the package case is Mo, Cu--
(80-90) W, or Cu / 32Ni-4Co-F
A laser diode coupling device, which is a clad material of e / Cu. 6. The metal material according to claim 4, wherein the metal material bonded to the surface of the thermoelectric cooling element is Mo, Cu- (80 to 90).
W, Cu / 32Ni-4Co-Fe / Cu clad material, Ag-, Au-Si, Au-Ge, Au-S
The metal material is bonded and fixed to the surface of the thermoelectric cooling element with a bonding material such as n, and then In-Sn, In-Ag, I
A solder material such as n-Pb-Ag, In-Pb-Sn, Pb-Sn, or the like, or the resistance welding, YAG welding, and the sub-stem, the thermoelectric cooling element with a metal material, and the package case are fixed respectively. -The diode coupling device. 7. A laser diode element joined and fixed to one side wall of a package case via a thermoelectric cooling element and a substem, and a substem in the vicinity of the front emission end of the laser diode element. The first lens fixed on the upper side, the second lens fixed on the other side wall of the package case facing the other side through the lens holder, and fixed on one end of the lens holder via the ferrule holder. In a method for assembling a laser diode coupling device including the ferruled fiber, a metal case made of the same or similar material as the sub-stem on the cooling surface of the thermoelectric cooling element and a package case on the heating surface of the thermoelectric cooling element in advance. And a metal material made of the same or similar material as the above, respectively, are joined and fixed, and then a first stem with lens and an optical axis aligned with the laser diode,
The surface of the thermoelectric cooling element with the same or the same kind of metal of the sub-stem is bonded and fixed with a solder material or welding, and then the optical axis of the thermoelectric cooling element with the sub-stem is aligned with the second lens A method for assembling a laser diode coupling device, which comprises joining and fixing by welding, and finally adjusting and fixing the optical axis of a fiber with a ferrule.