JPS59166907A - Semiconductor laser coupling device - Google Patents

Semiconductor laser coupling device

Info

Publication number
JPS59166907A
JPS59166907A JP58040545A JP4054583A JPS59166907A JP S59166907 A JPS59166907 A JP S59166907A JP 58040545 A JP58040545 A JP 58040545A JP 4054583 A JP4054583 A JP 4054583A JP S59166907 A JPS59166907 A JP S59166907A
Authority
JP
Japan
Prior art keywords
lens
semiconductor laser
holding member
optical fiber
ferrule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58040545A
Other languages
Japanese (ja)
Other versions
JPH0363044B2 (en
Inventor
Yoshiaki Tachikawa
吉明 立川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP58040545A priority Critical patent/JPS59166907A/en
Publication of JPS59166907A publication Critical patent/JPS59166907A/en
Publication of JPH0363044B2 publication Critical patent/JPH0363044B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To reduce the number of parts and the adjusting places of a coupling device by providing a supporting member of a ferrule to which an optical fiber is installed so as to cover a spherical lens, on a holding member of the spherical lens which is used for an airtight sealing window, too. CONSTITUTION:A comparatively large spherical lens 43 which is used for a window, too is provided on a spherical lens holding member 42 for sealing airtightly a semiconductor laser element chip 1. On the other hand, a ferrule supporting member 44 for fixing a ferrule 45 to which an optical fiber strand 14, etc. are installed so as to cover the lens 43, by a cylindrical part is attached to this member 42, and optical axes of the lens 43 and the strand 14 coincide with each other. When this member 42 is adjusted as to its position and fixed to a package stem 41, a laser beam from the chip 1 and the optical axis of the lens 43 coincide with each other. According to the constitution by which this spherical lens is used for a window, too, and the optical axis is adjusted only through the member 42, the number of parts and the adjusting places of a semiconductor laser coupling device are reduced.

Description

【発明の詳細な説明】 (技術分野) 本発明は、半導体レーザと光ファイバとを球レンズを用
いて安定に結合させた簡易構成の半導体レーザ結合装置
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a semiconductor laser coupling device with a simple configuration in which a semiconductor laser and an optical fiber are stably coupled using a ball lens.

(従来技術) 光フアイバ通信方式においては、半導体レーザの光を効
率良く光ファイバへ結合させる半導体レーザ結合装置を
開発する必要がある。特に、かかる装置の加入者系等へ
の導入を考えると、製造工程の簡略化ならびに低コスト
化を図ったLD結合装置を開発する必要がある。
(Prior Art) In optical fiber communication systems, it is necessary to develop a semiconductor laser coupling device that efficiently couples semiconductor laser light to an optical fiber. In particular, when considering the introduction of such a device into a subscriber system, it is necessary to develop an LD coupling device with a simplified manufacturing process and low cost.

従来のこの種の装置においては、半導体レーザ、例えば
レーザダイオード(以下、LDとも略記)と光ファイバ
とを結合するにあたって、光ファイバのコア径が5θμ
m以下と小さいので、微動台等を使用して微細な位置合
わせを行うことが必要であ)、シかも位置合わせが完了
してから、各部品を接着剤等で固定しなければガらず、
組立時間が長くかかり、製造性や歩留シ等が上らず、低
コスト化が難しかった。
In conventional devices of this kind, when coupling a semiconductor laser, for example, a laser diode (hereinafter also abbreviated as LD) to an optical fiber, the core diameter of the optical fiber is 5θμ.
Since it is small (less than m), it is necessary to perform fine alignment using a fine adjustment table, etc.), and it may not come off unless you fix each part with adhesive etc. after alignment is completed. ,
It took a long time to assemble, did not improve manufacturability or yield, and made it difficult to reduce costs.

および第3図 この種の従来装置を第1図、徒※び電丁酉7T1゜第1
図に示すLD結合装置では、LD、すなわちレーザチッ
プ/ −i LDパッケージステム2の突起JA上に固
着し、電極3からレーザチップlへの給電を行う。突起
2人には球レンズ保持部材lを固着し、この保持部材q
上の所定位置に球レンズjを調整してから固着する。レ
ーザチップ/および球レンズ!を覆うようにして、ガラ
ス窓付きキャップごをステム2に被せ、その端縁乙Aお
よび6Bを溶接によシステムコに固着し、以てキャップ
乙内を気密に封止する。。7はキャップ乙にあけた窓6
Cに固着した気密封止用窓ガラスである。
and Figure 3 shows this kind of conventional equipment.
In the LD coupling device shown in the figure, the LD, that is, the laser chip/-i is fixed onto the protrusion JA of the LD package stem 2, and power is supplied from the electrode 3 to the laser chip l. A ball lens holding member l is fixed to the two protrusions, and this holding member q
Adjust the ball lens j to the specified position above and fix it. Laser chip/and ball lens! A cap with a glass window is placed over the stem 2 so as to cover the stem 2, and its edges A and 6B are fixed to the system co by welding, thereby airtightly sealing the inside of the cap B. . 7 is the window 6 opened in the cap O
This is a window glass for airtight sealing fixed to C.

更に、 キャップ6を覆うようにしてセルフォックレン
ズ保持部材tをキャップ乙に被せる。保持部材rは、窓
乙Cと対向して貫通する孔IGを有し、この孔ICにセ
ルフォックレンズ9を挿入して接着剤により固着する。
Furthermore, the SELFOC lens holding member t is placed over the cap B so as to cover the cap 6. The holding member r has a hole IG that runs through the hole IG facing the window C, and the SELFOC lens 9 is inserted into this hole IC and fixed with an adhesive.

保持部材ざの端縁ざAおよヒgBは、球レンズよとセル
フォックレンズ9の光軸が合うように、パッケージステ
ム−を保持部材lに対して調整して後、接着剤によりス
テムコに固定する。
Edge edges A and B of the holding member are attached to the stem with adhesive after adjusting the package stem with respect to the holding member L so that the optical axes of the ball lens and Selfoc lens 9 are aligned. Fix it.

フェルール/θを7工ルール支持部材/lの貫通孔//
Aに固着する。フェルール10Kは、光フアイバコード
/2を除去したファイバ被覆/3を装着する。
Ferrule/θ to 7-work rule support member/l through hole//
Stick to A. The ferrule 10K is equipped with a fiber coating /3 from which the optical fiber cord /2 has been removed.

このファイバ被’71213の先端を除去して光フアイ
バ素線/lを露出させる。この光ファイバ14tの先端
をセルフォックレンズ9と対向させて、両者の光軸およ
びセルフオツクレンズタからの出射光の集束位置に光フ
ァイバ/lの端面がくるようにフェルール支持部材//
をセルフォックレンズ支持部材!rK対して調整してか
ら、両部材ざと//とを接着剤で固フ1゛1する。/S
は光フアイバ支持部材である。
The tip of this fiber sheath 71213 is removed to expose the optical fiber /l. The ferrule support member is arranged so that the tip of the optical fiber 14t faces the self-occurring lens 9, and the end face of the optical fiber /l is located at the optical axis of both and at the convergence position of the emitted light from the self-occurring lens.
Selfoc lens support member! After adjusting for rK, secure the edges of both parts with adhesive. /S
is an optical fiber support member.

本例は、球レンズSをパッケージステム2内に実装して
LD/からのレーザ光を平行ビームで取出シ、ソれを第
2レンズとしてのセルフオツクレンズタで光ファイバ/
(/に絞シ込むようにした単一モード光ファイバ用に開
発されたLD結合装置であるO このLD結合装置の組立にあたっては、まず、球しンズ
タをパッケージステムλの所定の位置に調整固定し、次
にそのLDパッケージステム2と82レンズのセルフォ
ックレンズ9を取付ケタ保持部材rおよびフェルール/
θを挿入した支持部材//を組み合わせて、微動台によ
シス中に矢印で示すように各部品のX、Y、Z方向の光
軸調整を行って最適な結合状態を実現してから各部品の
接着固定を行う。
In this example, a ball lens S is mounted inside the package stem 2 to extract the laser beam from the LD/ as a parallel beam, and a self-occurring lens is used as the second lens to connect the optical fiber/
(This is an LD coupling device developed for a single mode optical fiber that narrows down to Then, attach the LD package stem 2 and the SELFOC lens 9 of the 82 lens to the digit holding member r and the ferrule/
Combine the support member // into which θ has been inserted, and adjust the optical axis of each component in the X, Y, and Z directions as shown by the arrows while using the fine movement table to achieve the optimal bonding state. Glue and fix the parts.

第1図から明らかなように、この装置は部品点数が多い
ため、調整箇所が多く、組立工程の簡易化が難しい。ま
た、各部品を接着剤で固定するため、組立中に光軸ずれ
が生じ易く、しかも製作に時間を要する。
As is clear from FIG. 1, this device has many parts, so there are many adjustment points, making it difficult to simplify the assembly process. Furthermore, since each component is fixed with adhesive, the optical axis is likely to be misaligned during assembly, and furthermore, it takes time to manufacture.

第2図は従来の第2例を示し、ここでは、突起2/Aに
レーザチップlを固着したパッケージステムJに第1保
持部材nを溶接して固着する。この第1保持部材nに第
1保持部材nをインジウムJを介して気密に取シ付ける
。第2保持部材nはレーザチップlと対向する窓刀を有
し、この窓rに気密封止用窓ガラスIを固着する。この
窓ガラスぶ上に球レンズSを接着剤により固着する。窓
Δを覆ってフェルールlを接着剤により固着する。
FIG. 2 shows a second conventional example, in which a first holding member n is welded and fixed to a package stem J having a laser chip l fixed to a protrusion 2/A. A first holding member n is airtightly attached to this first holding member n via indium J. The second holding member n has a window blade facing the laser chip l, and the hermetic sealing window glass I is fixed to this window r. A ball lens S is fixed onto this window glass with an adhesive. A ferrule 1 is fixed with adhesive to cover the window Δ.

このフェルール〃にはファイバ被覆13をはぎ取った光
フアイバ素線tを挿通する。光ファイバの被N/3は光
フアイバ支持部材Iにより支持し、この支持部材Jを第
1保持部材nに固着する。
An optical fiber t whose fiber coating 13 has been stripped off is inserted into this ferrule. N/3 of the optical fibers are supported by an optical fiber support member I, and this support member J is fixed to a first holding member n.

本例では、窓ガラスにに張シ付けだ球レンズ5の光軸方
向位置調整のために、λつの保持部材nと8により球レ
ンズ保持部材を構成する。そこで、光出力をモニタしな
がらLDパッケージステムIと球レンズ保持部材nおよ
びnとの相対位置をX。
In this example, in order to adjust the position in the optical axis direction of the spherical lens 5 attached to the window glass, a spherical lens holding member is constituted by λ holding members n and 8. Therefore, while monitoring the optical output, the relative position of the LD package stem I and the ball lens holding members n and n was adjusted by X.

Y、Z方向に最適調整して第λ保持部材nを第1保持部
材nに取り付ける。次いで、全体をパッケージステム〃
に固着する。本例ではセルフォックレンズがないので、
球レンズjの出力光を光ファイバ/llに入射させるだ
めの調整が難しく、しかも部品点数および調整箇所が多
く、組立作業の能率や製造上の歩留りが悪い。さらに、
LD/と微小球レンズSとの間隔が狭いため、実装精度
が厳しく、微小球レンズ5の接触によるLDチップ/の
破損のおそれもある。
The λ-th holding member n is attached to the first holding member n with optimal adjustment in the Y and Z directions. Next, the whole package stem
sticks to. In this example, there is no Selfoc lens, so
It is difficult to adjust how the output light from the ball lens j enters the optical fiber/ll, and the number of parts and adjustment points are large, resulting in poor assembly work efficiency and manufacturing yield. moreover,
Since the distance between the LD/ and the microball lens S is narrow, mounting accuracy is difficult, and there is a risk that the LD chip/ may be damaged due to contact with the microsphere lens 5.

第3図は従来の第3例を示し、この例では、レーザチッ
プ/をLDパッケージステム3/の突起31kに載置し
、このレーザチップ/には電極32より給電を行う。球
レンズjをガラス管による球レンズ保持部材33の先端
に接着剤によシ固着し、この保持部材33を光ファイバ
支持部材評にあけた貫通孔j4’Aに挿通し、以て、球
レンズjがレーザチップlと対向するように、光フアイ
バ支持部材341をステム3/に対して矢印のように調
整してから、両者を接着剤により固着する。球レンズ保
持部材33としてのガラス管には光ファイバ/’lを挿
入し、光ファイバフグを保持部材33に対して矢印のよ
うに調整して、球レンズSからの出方光が光ファイバl
lIの対向端面上に合焦するようにする。
FIG. 3 shows a third conventional example. In this example, a laser chip is placed on a protrusion 31k of an LD package stem 3, and power is supplied to the laser chip from an electrode 32. A ball lens j is fixed with adhesive to the tip of a ball lens holding member 33 made of a glass tube, and this holding member 33 is inserted into a through hole j4'A made in the optical fiber support member. After adjusting the optical fiber support member 341 with respect to the stem 3/ as shown by the arrow so that j faces the laser chip l, both are fixed with adhesive. An optical fiber /'l is inserted into the glass tube serving as the ball lens holding member 33, and the optical fiber puffer is adjusted as shown by the arrow with respect to the holding member 33, so that the light emitted from the ball lens S is connected to the optical fiber l.
It is made to focus on the opposite end face of lI.

ここでは、微小球レンズよと光ファイバ/4tとを、ガ
ラス管による保持部材33で一体化して構成し、球レン
ズSをガラス管33の内径よりやや大きく定めることに
よって、両者の光軸を自動的に一致させた状態で固定す
ることができる。しかし、球レンズjはLDチップ/の
端面に近いので、実装精度が厳しい。まだ、球レンズj
と保持部材33、およびステム31と支持部材3グの各
固着にあたシ、接着剤を使用しているので、LDチップ
/は完全に気密に封止されていない。加えて光ファイバ
/Il。
Here, the microsphere lens and the optical fiber/4t are integrated with a holding member 33 made of a glass tube, and by setting the ball lens S slightly larger than the inner diameter of the glass tube 33, the optical axis of both is automatically adjusted. It can be fixed in a state that matches the target. However, since the ball lens j is close to the end face of the LD chip, mounting accuracy is difficult. Still a ball lens
Since adhesive is used to fix the holding member 33 and the stem 31 to the supporting member 3, the LD chip is not completely hermetically sealed. In addition, optical fiber/Il.

ガイドとしても機能する球レンズ保持部材33が長りナ
ルノで、ファイバ支持部材3グの部分が大形になるなど
の欠点があった。
The ball lens holding member 33, which also functions as a guide, is long and narrow, and the fiber supporting member 3g is large in size.

(目 的) そこで、本発明の目的は、これら上述の欠点を除去する
ために、気密封止用窒を兼ねた比較的外形寸法の大きな
球レンズを使用して、部品点数と調整個所の削減および
製造時間の短縮化ならびに装置の低コスト化を図った簡
易な構成の半導体レーザ結合装置を提供することにある
(Purpose) Therefore, in order to eliminate these above-mentioned drawbacks, the purpose of the present invention is to reduce the number of parts and adjustment points by using a spherical lens with relatively large external dimensions that also serves as an airtight sealing nitrogen. Another object of the present invention is to provide a semiconductor laser coupling device with a simple configuration that reduces manufacturing time and costs of the device.

(発明の構成) かかる目的を達成するために、本発明では、半導体レー
ザ素子を配置したパッケージステムを有し、該パッケー
ジステムには前記半導体レーザ素子を覆うようにして円
筒形キャップの形態のレンズ保持部材を取シ付け、該レ
ンズ保持部材の上面の中心には孔をあけ、該孔には球レ
ンズを着座させて固着し、前記球レンズを、その光軸が
前記半導体レーザ素子からのレーザ光の光軸と合致する
ようになして、前記半導体レーザ素子に対向させ、前記
レンズ保持部材の上面には円筒孔を有するフェルール支
持部材を、前記球レンズを覆うようにして、固着し、前
記円筒孔には光ファイバを装着したフェルールを挿着し
、前記光ファイバの端面が前記球レンズと対向するよう
になし、前記球レンズの光軸が前記半導体レーザ素子か
らのレーザ光の光軸と合致するように前記レンズ保持部
材を前記パッケージステムに対して移動調整すると共に
、前記光ファイバの端面に前記球レンズからの出力光が
集束されるように前記フェルールを前記フェルール支持
部材に対して移動調整してから、前記レンズ保持部材を
前記パッケージステムに固着し、それにより前記半導体
レーザ素子を前艷レンズ保持部材内に気密封止し、前記
半導体レーザ素子からのレーザ光を前記球レンズを介し
て前記光ファイバに導くように構成する。
(Structure of the Invention) In order to achieve the above object, the present invention includes a package stem in which a semiconductor laser element is disposed, and a lens in the form of a cylindrical cap covering the semiconductor laser element. A holding member is attached to the lens holding member, a hole is made in the center of the upper surface of the lens holding member, a ball lens is seated and fixed in the hole, and the ball lens is attached so that its optical axis is aligned with the laser beam from the semiconductor laser element. A ferrule support member having a cylindrical hole is fixed to the upper surface of the lens holding member so as to face the semiconductor laser element so as to match the optical axis of the light, and covering the spherical lens. A ferrule equipped with an optical fiber is inserted into the cylindrical hole, so that the end face of the optical fiber faces the ball lens, and the optical axis of the ball lens is aligned with the optical axis of the laser beam from the semiconductor laser element. moving and adjusting the lens holding member relative to the package stem so that they match, and moving the ferrule relative to the ferrule supporting member so that the output light from the ball lens is focused on the end face of the optical fiber; After the adjustment, the lens holding member is fixed to the package stem, thereby hermetically sealing the semiconductor laser element within the front lens holding member, and transmitting laser light from the semiconductor laser element through the ball lens. and is configured to guide the optical fiber into the optical fiber.

ここで、前記球レンズの外周面を帯状にメタライズし、
その帯状メタライズ部分を前記レンズ保持部材の孔に着
座させてロウ付けするのが好適である。
Here, the outer circumferential surface of the spherical lens is metalized in a band shape,
It is preferable that the band-shaped metallized portion is seated in the hole of the lens holding member and brazed.

また、前記レンズ保持部材を前記パッケージステムに溶
接により固着することもできる。
Further, the lens holding member may be fixed to the package stem by welding.

その場合に、前記レンズ保持部材を前記パッケージステ
ムに仮固定してから前記溶接を行うのが好適である。
In that case, it is preferable to perform the welding after temporarily fixing the lens holding member to the package stem.

(実施例) 以下に図面を参照して本発明の詳細な説明する。(Example) The present invention will be described in detail below with reference to the drawings.

第1図は本発明のl実施例を示し、ここでグ/はパッケ
ージステム、!/Aはステムク/の突起であり、この突
起tlA上にレーザチップ/を載置して固着する。グ2
はレーザチップ/を覆うようにしてパッケージステム4
1’/に固着した円筒形キャップの形態の球レンズ保持
部材である。この保持部材グ2の上面の中心軸上にあけ
た窓L2Aには結合用球レンズ弘3を着座させて固着し
、この球レンズ偏によりレーザチップ/からのレーザ光
を受光するようにすると共に、窓11.2Aを気密封止
する。ここで、球しン、’l” L12は、その光軸が
LDチップ/からのレーザ光の光軸と合致するようにし
てLDチップ/と対向する。更に、球レンズ保持部材グ
ツには、球レンズpを覆うようにして中空円筒形状のフ
ェルール支持部材件を固着する。フェルール支持部材件
の中空部分にはフエルールグ5を接着剤により固着する
と共に、このフェルールf5には光フアイバ被覆/3お
よび光ファイバ素線/弘を装着する。それにより光ファ
イバフグの端面は球レンズy−3と対向し、かつ両者の
光軸が合致するようにすると共に、球レンズ弘3からの
光が光7アイバ/グの端面上に集束す持部材’12とは
、予めロウ付けや抵抗溶接等で一体化したものを使用す
る。従って、フェルール、すなわち元ファイバ/41の
面内位置は球レンズI13の保持部材グ2の位置で定ま
ってしまうので、光ファイバ/41の面内調整をするた
め釦は、保持部材グツとパッケージステムク/との相対
位置を調整することが必要であるが、本例では、球レン
ズ保持部材t12と一体化されているフェルール支持部
qttにフェルールaSを挿入した状態で、保持部材侵
を矢印で示すように移動させて面内調整すればよい。こ
のとき、速乾性接着剤で保持部材Qとステムl/および
フェルールグSを仮固定し、更に抵抗溶接で完全に固定
するのが好適である。これまでの抵抗溶接機を使ったキ
ャンシールのデータでは、瞬間接着剤による仮固定を行
なえば、高々10μmの軸ずれしが生じないので、光フ
アイバツクの光軸垂直方向の軸ずれによる結合効率の劣
化は十分小さく、十分に適用可能である。このような構
成によると、球レンズpをステム’l/に搭載する際に
、トレランスの大きな光ファイバlIlの光軸方向の位
置出しも併せて行うことができるので、組立て作業の能
率が極めて良い。
FIG. 1 shows an embodiment of the invention, where g/ is the package stem, ! /A is a protrusion of the stem /, and the laser chip / is placed and fixed on this protrusion tlA. Group 2
package stem 4 so as to cover the laser chip/
A ball lens holding member in the form of a cylindrical cap fixed to 1'/. A coupling ball lens 3 is seated and fixed in the window L2A formed on the central axis of the upper surface of the holding member tag 2, and the polarization of this ball lens allows it to receive laser light from the laser chip. , hermetically sealing window 11.2A. Here, the bulb 'l'' L12 faces the LD chip/ with its optical axis matching the optical axis of the laser beam from the LD chip/. A hollow cylindrical ferrule support member is fixed so as to cover the spherical lens p.A ferrule ring 5 is fixed to the hollow part of the ferrule support member with an adhesive, and an optical fiber coating /3 and Attach the optical fiber bare wire/Hiro.Thereby, the end face of the optical fiber puffer is opposed to the ball lens Y-3, and the optical axes of both are aligned, and the light from the ball lens Y-3 is directed to the light 7. The holding member '12 that focuses on the end face of the eyeglass lens is one that has been integrated in advance by brazing, resistance welding, etc. Therefore, the in-plane position of the ferrule, that is, the original fiber /41, is the same as that of the ball lens I13. Since the position of the holding member 2 is determined by the position of the holding member 2, it is necessary to adjust the relative position of the holding member 2 and the package stem in order to adjust the optical fiber 41 in the plane. Now, with the ferrule aS inserted into the ferrule support part qtt that is integrated with the ball lens holding member t12, in-plane adjustment can be made by moving the holding member in the direction shown by the arrow. It is preferable to temporarily fix the holding member Q, stem L/and ferrule S with adhesive, and then completely fix it with resistance welding.According to the data of CanSeal using a resistance welding machine, instant adhesive If temporary fixation is carried out with an agent, an axis misalignment of at most 10 μm will not occur, so the deterioration of the coupling efficiency due to an axis misalignment in the direction perpendicular to the optical axis of the optical fiber is sufficiently small, and it is fully applicable. When the ball lens p is mounted on the stem 'l/, the positioning of the optical fiber lIl with a large tolerance in the optical axis direction can also be performed, so the efficiency of the assembly work is extremely high.

球レンズ弘3の直径を大きくすると、一般に結合効率は
劣化するが、球レンズ弘3の実装精度はゆるくなる。こ
こで、球レンズ弘3の直径は、光ファイバ/llへの結
合効率および球レンズRの表面からの反射があるときの
LDチップlのC/N (キャリア対ノイズ比)特性の
両者を考え合わせて決めることが必要となる。
As the diameter of the ball lens 3 increases, the coupling efficiency generally deteriorates, but the mounting accuracy of the ball lens 3 becomes looser. Here, the diameter of the ball lens 3 is determined by considering both the coupling efficiency to the optical fiber/ll and the C/N (carrier-to-noise ratio) characteristics of the LD chip l when there is reflection from the surface of the ball lens R. It is necessary to decide together.

第5図はLD/と球レンズ弘3との間隔d〔μm〕と光
を用い、球レンズ杵として直径2間で反射率0.077
の球レンズ弘3を用いた場合について示す。
Figure 5 uses light and the distance d [μm] between the LD/ and the ball lens 3, and the reflectance is 0.077 between the diameters of the ball lens punch.
The case using the ball lens 3 is shown below.

この0/N特性より、間隔dとしてはSOOμm程度以
上が必要となることがわかる。
From this 0/N characteristic, it can be seen that the spacing d needs to be approximately SOO μm or more.

第6図は上記間隔d〔μm〕と結合効率(dB )との
関係を球レンズ13の直径をパラメータとして示すもの
であシ、球しンズク3の直径がそれぞれ八〇。
FIG. 6 shows the relationship between the distance d [μm] and the coupling efficiency (dB) using the diameter of the ball lens 13 as a parameter, and the diameter of the ball lens 3 is 80 mm.

2.0 、3.2およびlt、ざ〔關〕のときの測定結
果を×、e、○およびΔ印で示す。なお、間隔dを変え
たときに、光ファイバフグの端面の位置は効率が最も高
くなる位置にずらして測定した。この結果と第5図の結
果とを考慮すると、間隔dは500〜600μm程度に
設定し、球レンズ件の直径は2鵠程度に定めるのが好適
であることがわかる。
The measurement results at 2.0, 3.2, and lt are indicated by ×, e, ○, and Δ marks. In addition, when the distance d was changed, the position of the end face of the optical fiber puffer was shifted to the position where the efficiency was highest, and measurements were taken. Considering this result and the result shown in FIG. 5, it is found that it is preferable to set the distance d to about 500 to 600 μm and the diameter of the spherical lens to about 2 mm.

本発明における固定は、上物で示した抵抗溶接による固
定に限られるものでは々く、YAGレーザ。
Fixing in the present invention is not limited to fixing by resistance welding as shown above, but also by YAG laser.

C02レーザを使用した融着固定法、高周波加熱装置を
用いた金属ハンダ固定も用いることができる。
A fusion fixing method using a C02 laser and metal solder fixing using a high frequency heating device can also be used.

また、球しンズグ3の気密性を保証する手段はロウ付法
に限られるものではなく、ガラス半田やその他の方法を
使用してもよい。なお、本発明では通常のパッケージに
使用する気密用窓の代わりにLDチップ/との間隔dを
大きくとれる球レンズQを窓として使用しているので、
これまでアナログ光伝送用で問題となった気密窓からの
反射でLD自身の雑音特性が劣化することもない。従っ
て、アナログ伝送用半導体レーザ結合装置としても有効
である。
Further, the means for ensuring the airtightness of the bulb 3 is not limited to the brazing method, and glass soldering or other methods may also be used. In addition, in the present invention, instead of the airtight window used in a normal package, a ball lens Q is used as the window, which allows a large distance d between the LD chip and the LD chip.
The noise characteristics of the LD itself will not deteriorate due to reflection from the airtight window, which has been a problem for analog optical transmission. Therefore, it is also effective as a semiconductor laser coupling device for analog transmission.

(効 果) 以上説明したように、本発明では、構成が簡単であり、
しかも部品点数が少なく位置調整を必要とする所も1個
所に限られ、通常の抵抗溶接により組立てることが可能
となるので、半導体レーザ結合器を極めて容易に構成で
きる。したがって、製造上の歩留シが向上し、大幅なコ
ストの低減が期待できるので、光加入者系や民需用の伝
送装置として広く用いる上で有効である。
(Effects) As explained above, the present invention has a simple configuration,
In addition, the number of parts is small, only one location requires position adjustment, and assembly can be performed by ordinary resistance welding, so the semiconductor laser coupler can be constructed extremely easily. Therefore, it is expected that the manufacturing yield will be improved and the cost will be significantly reduced, so that it is effective for wide use as a transmission device for optical subscriber systems and civilian use.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第3図は従来装置の3例を示す断面図、第弘図
は本発明の/実施例を示す断面図、第5図はC/N特性
の測定結果を示すグラフ、第2図は総合効率の測定結果
を示すグラフである。 (第1図) l・・レーザチップ(LD)、 コ・・・パッケージステム、 2人・・・突起、 3・・・電極、 l・・・球レンズ保持部材、 S・・・球レンズ、 乙・・・ガラス窓付きキャップ、 乙A、gB・・・キャップ端縁、 乙C・・・窓、 7・・・気密封止用窓ガラス、 と・・・セルフォックレンズ保持部材、どA、にB・・
・端縁、 IrC・・・窓、 ワ・・・セルフォックレンズ、 /θ ・・・ フ エ ル − ル、 //・・・フェルール支持部材、 //A・・・貫通孔1 /2・・−光フアイバコード、 /3・・・光フアイバ被覆、 /l・・・光フアイバ素線、 /S・・・光フアイバ支持部材、 (第2図) 2/・・・パッケージステム、 2/A−・・突起、 〃・・・第1保持部材、 n・・・第2保持部材、 2グ・・−インジウム、 Δ・・・窓、 パ・・・気密封止用窓、 〃・・・フェルール ト・・光フアイバ支持部材、 (第3図) 3/・・・パッケージステム1 、?/A・・・突起、 32・・・電極、 33・・・球レンズ保持部材、 3り・・・光フアイバ支持部材、 (第ゲ図) Il/・・・パッケージステム、 グ/A・−・突起、 F/B・・・段差部、 侵・・・球レンズ保持部材、 ’72A・・・窓、 弘3・・・球レンズ、 件・・・フェルール支持部材、 グS・・・フェルール。 特許出願人 日本電信電話公社 第2図 第3図 第4図
Figures 1 to 3 are cross-sectional views showing three examples of conventional devices, Figure 5 is a cross-sectional view showing an embodiment of the present invention, Figure 5 is a graph showing measurement results of C/N characteristics, and Figure 2 is a cross-sectional view showing three examples of conventional devices. The figure is a graph showing the measurement results of overall efficiency. (Fig. 1) L...Laser chip (LD), C...Package stem, 2 people...Protrusion, 3...Electrode, l...Ball lens holding member, S...Ball lens, B... Cap with glass window, Otsu A, gB... Edge of cap, Otsu C... Window, 7... Window glass for airtight sealing, and... SELFOC lens holding member, D , to B...
・Edge, IrC...window, water...selfoc lens, /θ...ferrule, //...ferrule support member, //A...through hole 1/2・- Optical fiber cord, /3... Optical fiber coating, /l... Optical fiber bare wire, /S... Optical fiber support member, (Fig. 2) 2/... Package stem, 2/ A--Protrusion, 〃--First holding member, n--Second holding member, 2--Indium, Δ...Window, P...Hermetic sealing window, 〃... - Ferrule...Optical fiber support member, (Fig. 3) 3/...Package stem 1,? /A...Protrusion, 32...Electrode, 33...Ball lens holding member, 3...Optical fiber support member, (Figure 1) Il/...Package stem, G/A--・Protrusion, F/B...Step part, Intrusion...Ball lens holding member, '72A...Window, Ko3...Ball lens, Matter...Ferrule support member, G...Ferrule . Patent applicant: Nippon Telegraph and Telephone Public Corporation Figure 2 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】 1)半導体レーザ素子を配置したパッケージステムを有
し、該パッケージステムには前記半導体レーザ素子を覆
うようにして円筒形キャップの形態のレンズ保持部材を
取り付け、該レンズ保持部材の上面の中心には孔をあけ
、該孔には球レンズを着座させて固着し、前記球レンズ
を、その光軸が前記半導体レーザ素子からのレーザ光の
光軸と合致するようになして、前記半導体レーザ素子に
対向させ、前記レンズ保持部材の上面には円筒孔を有す
るフェルール支持部材を、前記球レンズを覆うようにし
て、固着し、前記円筒孔には光ファイバを装着したフェ
ルールを挿着し、前記光ファイバの端面が前記球レンズ
と対向するようになし、前記球レンズの光軸が前記半導
体レーザ素子からのレーザ光の光軸と合致するように前
記レンズ保持部材を前記パッケージステムに対して移動
調整すると共に、前記光ファイバの端面に前記球レンズ
からの出力光が集束されるように前記フェルールを前記
フェルール支持部材に対して移動調整してから、前記レ
ンズ保持部材を前記パッケージステムに固着し、それに
より前記半導体レーザ素子を前記レンズ保持部材内に気
密封止し、前記半導体レーザ素子からのレーザ光を前記
球レンズを介して前記光ファイバに導くようにしたこと
を特徴とする半導体レーザ結合装置。 2、特許請求の範囲第1項記載の半導体レーザ結合装置
において、前記球レンズの外周面を帯状にメタライズし
、その帯状メタライズ部分を前記レンズ保持部材の孔に
着座させてロウ付けしたことを特徴とする半導体レーザ
結合装置。 3)特許請求の範囲第1項または第2項に記載の半導体
レーザ結合装置において、前記レンズ保持部材を前記パ
ッケージステムに溶接により固着したことを特徴とする
半導体レーザ結合装置。 4)特許請求の範囲第6項記載の半導体レーザ結合装置
において、前記レンズ保持部材を前記パッケージステム
に仮固定してから前記溶接を行うようにしたことを特徴
とする半導体レーザ結合装置。
[Scope of Claims] 1) A package stem having a semiconductor laser element arranged thereon, a lens holding member in the form of a cylindrical cap attached to the package stem so as to cover the semiconductor laser element, and the lens holding member A hole is made in the center of the upper surface, a ball lens is seated and fixed in the hole, and the ball lens is arranged such that its optical axis coincides with the optical axis of the laser beam from the semiconductor laser element. , a ferrule support member having a cylindrical hole facing the semiconductor laser element and having a cylindrical hole is fixed to the upper surface of the lens holding member so as to cover the spherical lens, and a ferrule with an optical fiber attached to the cylindrical hole is fixed. The lens holding member is attached to the package so that the end surface of the optical fiber faces the ball lens, and the optical axis of the ball lens matches the optical axis of the laser beam from the semiconductor laser element. After adjusting the movement relative to the stem and adjusting the movement of the ferrule relative to the ferrule support member so that the output light from the spherical lens is focused on the end face of the optical fiber, the lens holding member is The semiconductor laser device is fixed to the package stem, thereby hermetically sealing the semiconductor laser device within the lens holding member, and guiding laser light from the semiconductor laser device to the optical fiber via the ball lens. Semiconductor laser coupling device. 2. The semiconductor laser coupling device according to claim 1, characterized in that the outer circumferential surface of the spherical lens is metallized in a band shape, and the band-shaped metallized portion is seated in the hole of the lens holding member and brazed. Semiconductor laser coupling device. 3) A semiconductor laser coupling device according to claim 1 or 2, wherein the lens holding member is fixed to the package stem by welding. 4) The semiconductor laser coupling device according to claim 6, wherein the welding is performed after the lens holding member is temporarily fixed to the package stem.
JP58040545A 1983-03-14 1983-03-14 Semiconductor laser coupling device Granted JPS59166907A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58040545A JPS59166907A (en) 1983-03-14 1983-03-14 Semiconductor laser coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58040545A JPS59166907A (en) 1983-03-14 1983-03-14 Semiconductor laser coupling device

Publications (2)

Publication Number Publication Date
JPS59166907A true JPS59166907A (en) 1984-09-20
JPH0363044B2 JPH0363044B2 (en) 1991-09-27

Family

ID=12583415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58040545A Granted JPS59166907A (en) 1983-03-14 1983-03-14 Semiconductor laser coupling device

Country Status (1)

Country Link
JP (1) JPS59166907A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263906A (en) * 1985-09-17 1987-03-20 Matsushita Electric Ind Co Ltd Production of coupling device between semiconductor laser and optical fiber
JPH01187509A (en) * 1988-01-22 1989-07-26 Hitachi Ltd Optoelectronic device with optical coupling body and its manufacture
JPH01295711A (en) * 1988-05-20 1989-11-29 Amada Co Ltd Method and device for positioning point end of material in cutting machine
EP0369609A2 (en) * 1988-11-18 1990-05-23 Mitsubishi Denki Kabushiki Kaisha A semiconductor laser device and a method of producing same
JPH03237408A (en) * 1990-02-14 1991-10-23 Alps Electric Co Ltd Production of optical device
JPH03107127U (en) * 1989-11-08 1991-11-05
WO1998010319A1 (en) * 1996-09-02 1998-03-12 Siemens Aktiengesellschaft Optoelectric transmission and/or reception module and method for the production thereof
JP2010139872A (en) * 2008-12-12 2010-06-24 Sumitomo Electric Ind Ltd Optical module, and method of manufacturing the same
CN106443909A (en) * 2016-11-16 2017-02-22 中国电子科技集团公司第四十四研究所 Avalanche detector coupling packaging structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110703A (en) * 1974-02-06 1975-09-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110703A (en) * 1974-02-06 1975-09-01

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263906A (en) * 1985-09-17 1987-03-20 Matsushita Electric Ind Co Ltd Production of coupling device between semiconductor laser and optical fiber
JPH01187509A (en) * 1988-01-22 1989-07-26 Hitachi Ltd Optoelectronic device with optical coupling body and its manufacture
JPH01295711A (en) * 1988-05-20 1989-11-29 Amada Co Ltd Method and device for positioning point end of material in cutting machine
EP0369609A2 (en) * 1988-11-18 1990-05-23 Mitsubishi Denki Kabushiki Kaisha A semiconductor laser device and a method of producing same
JPH03107127U (en) * 1989-11-08 1991-11-05
JPH03237408A (en) * 1990-02-14 1991-10-23 Alps Electric Co Ltd Production of optical device
WO1998010319A1 (en) * 1996-09-02 1998-03-12 Siemens Aktiengesellschaft Optoelectric transmission and/or reception module and method for the production thereof
JP2010139872A (en) * 2008-12-12 2010-06-24 Sumitomo Electric Ind Ltd Optical module, and method of manufacturing the same
CN106443909A (en) * 2016-11-16 2017-02-22 中国电子科技集团公司第四十四研究所 Avalanche detector coupling packaging structure

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JPH0363044B2 (en) 1991-09-27

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