JP2010135688A - Method for manufacturing optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical module capable of accurately preventing shift of an optical axis of an optical element when a mounted component including the optical element such as a light emitting element is mounted on a stem in order to assemble the optical module. <P>SOLUTION: The method for manufacturing the optical module includes a step of attaching a mount member 23 disposed on a main surface of the stem 22 and having a mounting surface crossing the main surface to the stem 22 or integrally forming the mount member 23 with the stem 22, a step of attaching a plurality of lead terminals 10a-10i so as to penetrate the stem 22, and a substrate mounting step of mounting a substrate 12 on which the optical element (LD 13) is mounted on the mounting surface of the mount member 23. In the substrate mounting step, an end face of the substrate 12 on the stem 22 side and ends of at least two of the lead terminals (in this example, the lead terminal 10g and another lead terminal) are positioned, and the substrate 12 is slid to the optical axis direction of the LD 13, and then, is fixed to the mount member 23. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an optical module for connection to an optical cable.

  The optical cable includes an optical fiber, and an optical module is used for optical communication using the optical fiber. In this optical module, the optical signal emitted from the light emitting element is transmitted to the optical fiber, or the light transmitted through the optical fiber is condensed on the light receiving element. Light from a light emitting element (mainly Laser Diode: LD) is condensed and transmitted to a core which is a waveguide of an optical fiber. In addition, a light receiving element (mainly Photo Diode: PD) collects light transmitted through the core of the optical fiber with a lens or the like, receives the light, and converts it into an electrical signal.

  The optical module is mounted with such optical devices such as LD and PD and other mounting components. Also, since it is desirable to control the temperature of the LD in order to stabilize its oscillation wavelength, a thermoelectric cooling module (TEC) having a Peltier element is also mounted when mounting the LD. There are many. The LD is mounted on this Peltier element.

  When manufacturing such an optical module, it is necessary to mount a circuit board (LD carrier) on which an LD is mounted on a stem. At this time, the optical axis of light emitted from the LD may be shifted.

Patent Document 1 discloses a technique for adjusting an optical axis according to an insertion angle of a refracting plate provided in an optical path. Further, in Patent Document 2, the outer peripheral portion of the base body (stem) located outside the input / output terminal is provided with a thick portion so as to protrude from the upper main surface of the base body over the entire periphery, thereby A technique is disclosed in which it is difficult for thermal stress to be applied to the terminals, and breakage such as cracks is less likely to occur in the input / output terminals. In this technique, even if a thermal contraction difference occurs between the base and the lid after the lid (cap) is joined to the base, the thick-walled portion provides a reinforcing action, so that the base is not easily distorted and is provided on the base. It is possible to suppress the deviation of the optical axis of the produced LD.
JP 2007-10854 A JP 2007-150276 A

  However, in the technique described in Patent Document 1, it is necessary to add a refracting plate on the optical path, and there is a size restriction when mounting an LD carrier on which an end surface light emitting LD is directly mounted on a package stem. Difficult to mount a refracting plate. In addition, the technique described in Patent Document 2 needs to provide a thick portion on the stem, and has only an effect of reducing external force applied from the outside after mounting and distortion due to heat, and has no effect on the mounting accuracy itself.

  Further, in an optical module including a thermoelectric cooling module (TEC), even if such a conventional technique is adopted, the TEC itself has dimensional variations. Therefore, when an LD carrier is mounted on the TEC upper surface, the optical axis of the LD is further increased. The angle will vary.

  The present invention has been made in view of the above circumstances, and when an optical module is assembled by mounting a mounting component such as a light emitting element on a stem, an optical axis shift of the optical element is accurately determined. It is an object of the present invention to provide an optical module manufacturing method that can be well prevented.

  An optical module manufacturing method according to the present invention includes a mount member having a mounting surface that intersects the main surface of the stem, a plurality of lead terminals that penetrate the stem, and a substrate on which the optical element is mounted mounted on the mounting surface of the mount member. And a method of manufacturing an optical module having a sleeve for connecting to an optical cable, wherein mounting of the substrate is performed by positioning the end surface on the stem side of the substrate and at least two ends of the plurality of lead terminals, The positioned substrate is slid in the optical axis direction of the optical element and then fixed to the mount member.

  Further, the mounting of the substrate may be performed by mounting and fixing the thermoelectric cooling module on the mounting surface of the mount member, and then placing the substrate on the thermoelectric cooling module for positioning. Alternatively, the mounting of the substrate may be performed by fixing the substrate on the thermoelectric cooling module and then placing the thermoelectric cooling module with the substrate on the mounting surface of the mount member for positioning.

  According to the present invention, when an optical module is assembled by mounting mounting components including optical elements such as a light emitting element and a light receiving element on a stem, it is possible to prevent optical axis misalignment of the optical element with high accuracy. .

  Embodiments of the present invention will be described with reference to the drawings. Hereinafter, a coaxial optical transmission module will be described as an example of an optical module for connecting to an optical cable manufactured by the optical module manufacturing method according to the present invention. However, the optical module is not limited to the coaxial type. Further, the present invention can be similarly applied to an optical transmission / reception module having an optical reception function. In addition, a plurality of mounting components are mounted on the optical module. However, the mounting components to be mounted are not limited to the mounting components exemplified below, and may be anything provided with an optical element exemplified by LD.

  FIG. 1 is a partial cross-sectional view showing a configuration example of an optical transmission module manufactured by an optical module manufacturing method according to the present invention. FIG. 2 is a partial cross-sectional view of the optical transmission module of FIG. 3 is a diagram of the optical transmission module of FIGS. 1 and 2 viewed from the Z direction, and FIG. 4 is a circuit diagram of the optical transmission module shown in FIGS. 3 shows only the inside of the cap, the view seen from the V direction in FIG. 3 (and FIG. 2) corresponds to FIG. 1, and the view seen from the H direction in FIG. 3 corresponds to FIG. To do.

  The optical transmission module 1 illustrated in FIGS. 1 to 3 is a coaxial optical module having a thermoelectric cooling module (TEC). 1 to 3, reference numerals 10a to 10i denote lead terminals (lead pins), 11 denotes a TEC electrode pad, 12 denotes a ceramic circuit board (LD carrier), 13 denotes an LD, 14 denotes an inductor, 15 denotes a resistor, 16 denotes a thermistor, 17 Is an edge-incident monitor PD, 18 is an electrode of the substrate 12, 19 is a heat absorption side ceramic substrate, 20 is a thermoelectric conversion element (Peltier element), 21 is a heat exhaust (heat dissipation) side ceramic substrate, 22 is a stem, and 23 is a mount member (Pedestal on stem main surface), 24 is a cap (CAN case), 25 is a lens, and the optical transmission module 1 includes these components.

  The stem 22 is usually formed in a disc shape with a metal having heat conductivity and conductivity, but may have other shapes. A plurality of lead terminals 10 a to 10 i are disposed in the stem 22 so as to penetrate the stem 22 and be perpendicular to the main surface of the stem 22. Among these, the signal transmission or power supply lead terminals 10a to 10d and 10f to 10i are fixed to the stem 22 in a state of being electrically insulated by a glass seal. On the other hand, the ground lead terminal 10 e is directly insulated from the stem 22 without being insulated from the stem 22.

  The lead terminals 10a to 10i attached in this way are a plurality of components (electronic elements or electronic components) necessary for power feeding, signal transmission or reception among a plurality of mounting components mounted on the optical transmission module 1, that is, A plurality of parts that require electrical connection (hereinafter referred to as connection-required parts) are bonded with wires from the V direction.

  It is assumed that at least one conductor connection surface (wire connection surface) is formed on each connection component. On the other hand, each of the plurality of lead terminals 10a to 10i is formed with a conductor connection surface (wire connection surface) for connecting with any one of the conductor connection surfaces formed in the connection required components by wire bonding. To do. In this example, all the wire connection surfaces formed on the plurality of lead terminals 10a to 10i and all the wire connection surfaces formed on the connection required components are parallel to each other. Lead terminals are arranged. As a result, all portions requiring wire bonding are parallel (not necessarily on a single plane), and wire bonding from one direction is possible at all locations.

  Here, each of the lead terminals 10a to 10i is preferably installed on the stem 22 with at least a tip portion formed in a flat plate shape (flat shape) and with the flat plate portion serving as a wire connection surface toward the wire connection side. . With this configuration, wire bonding from the V direction is facilitated. However, each of the lead terminals 10a to 10i has a wire connection surface (this surface becomes a curved surface) as a wire connection surface (this surface becomes a curved surface) regardless of whether the tip portion is formed in a spherical shape or a cylindrical shape. Can be bonded.

  In addition, it is not necessary to be connected to the lead terminal by all wires, and there may be a connecting component that is directly connected by soldering. Also, as shown in the drawing, not all of the required connection parts are normally connected directly or by wire bonding to the lead terminals 10a to 10i. There are also parts that are electrically connected to. Moreover, it is desirable to use a wire having a small parasitic inductance, such as a ribbon wire, as the wire used here or a wire described later.

  On the main surface of the stem 22, a mount member 23 is provided in a convex shape. The mount member 23 has a mounting surface (mounting surface for mounting components) that intersects the main surface of the stem 22. That is, the mount member 23 is installed on the stem 22 so that the mounting surface intersects (preferably perpendicularly) the main surface of the stem 22. Of course, the mount member 23 does not have to be a separate member from the stem 22 and may be integrally formed.

  On the mounting surface of the mount member 23, a TEC composed of a heat exhaust side ceramic substrate 21, a plurality of thermoelectric conversion elements (Peltier elements) 20, and a heat absorption side ceramic substrate 19 is mounted as one of the required components. The TEC is mounted on the mounting surface of the mount member 23 so that the exhaust heat-side ceramic substrate 21 is in contact therewith, and the wiring exemplified in the ceramic circuit substrate 12 on the heat absorption-side ceramic substrate 19 mounted via the Peltier element 20. A board is mounted. It is possible to mount each member 21, 20, 19 on the mounting surface in order from the V direction, or after the TEC is configured by each member 19-21, mounting on the TEC mounting surface from the V direction. Is also possible.

  In the TEC, electrodes are formed in a predetermined pattern on opposing surfaces of the exhaust heat side ceramic substrate 21 and the heat absorption side ceramic substrate 19, and a plurality of Peltier elements 20 are connected in series (alternating P type and N type elements). Thus, the electrodes at both ends are connected to the power supply conductor. In this example, the length of the exhaust heat side ceramic substrate 21 (the length in the direction perpendicular to the stem main surface) is made longer than that of the heat absorption side ceramic substrate 19 and protrudes from the heat absorption side ceramic substrate 19 of the exhaust heat side ceramic substrate 21. A TEC electrode pad 11 is provided in the portion.

  The TEC electrode pad 11 and the power supply lead terminals 10a and 10i are bonded with a wire from the V direction as shown by a solid line in FIG. 1, and are electrically connected as shown in FIG. In order to facilitate such wire bonding and to shorten the wire length, the end portions of the lead terminals 10a and 10i penetrating the stem 22 and projecting from the main surface thereof are placed on the exhaust heat side ceramic substrate 21. It is preferable to design the protruding amount and arrangement after mounting so as to be located in the vicinity of the electrode of the provided TEC electrode pad 11.

  The ceramic circuit board 12 mounted on the heat absorption side ceramic substrate 19 is mounted with its LD 13 electrically connected to its electrode (wiring electrode) 18 by direct soldering, and is also referred to as an LD carrier. The LD carrier 12 can be mounted on the heat absorption side ceramic substrate 19 from the V direction. A differential line is formed at the LD mounting position in the wiring electrode 18 so as to supply a driving current to the LD 13. Lead terminals 10c and 10b are connected to one of the differential lines, and lead terminals 10g and 10h are bonded to each other by wires as shown by solid lines in FIG. 1, and are electrically connected as shown in FIG. .

  2 and 3, the wire is not shown for convenience. In addition, although the wiring electrode 18 is not shown in FIG. In order to facilitate such wire bonding and shorten the wire length, the end portions of the lead terminals 10b, 10c, 10g, and 10h penetrating the stem 22 and projecting from the main surface thereof are connected to the wiring electrodes 18, respectively. It is advisable to design the protruding amount and arrangement after mounting so as to be located near the connection position. In the optical module manufacturing method according to the present invention, positioning is performed using the lead terminals 10c and 10g in this example, and positioning will be described later.

  The differential line is provided with a thin film resistor (resistive element) 15 and an inductor 14 in the middle of one line and the other line. Since the resistor 15 and the inductor 14 are components that the LD 13 is driven at a particularly high speed as compared with other required components on the LD carrier 12, impedances are matched in the wiring connected to the LD 13 among the wirings on the LD carrier 12. To be provided.

  The LD carrier 12 is formed of a material having good thermal conductivity and is mounted on the TEC, and the temperature of the LD 13 is controlled by the TEC. Further, the main laser beam can be emitted from the end surface in the direction opposite to the main surface side of the stem 22 of the LD 13. The mounting position of the mount member 23 on the stem 22, the thickness of the TEC and the LD carrier 12, and the like are designed so that the LD 13 can be mounted at a position where the emitted light of the LD 13 is approximately at the center of the stem 22. With such a design, the main laser light emitted from the end face of the LD 13 travels in the direction opposite to the main face side of the stem 22, and the emitted light can enter the optical fiber positioned and held outside the package. .

  The LD carrier 12 is electrically connected directly to the wiring electrode 18 by soldering the thermistor 16 and the end-face incident type monitor PD 17 as required components other than the LD 13 and the inductor 14 and the resistor 15 which are impedance matching elements. It is mounted in the state. In this example, the structure and arrangement position of any of the above-described required components are designed so that they can be mounted from the V direction during the mounting operation.

  The LD 13 is configured to emit laser light also from an end surface on the main surface side of the stem 22 (that is, an end surface opposite to the end surface on the optical fiber side). The PD 17 is provided to detect such backward emitted light from the LD 13 and monitor the light output (emitted light intensity) of the LD 13. Accordingly, the PD 17 is disposed at a position where the light emitted from the LD 13 can be received. The PD 17 is preferably of the end-face incident type, and is mounted on the same surface as the surface on which the LD 13 and other electronic elements are mounted or on a surface along the surface. Further, a portion where one of the two PD electrodes of the PD 17 is connected (a portion of the wiring electrode 18) is bonded to the monitor lead terminal 10f with a wire from the V direction, and the other electrode is connected. Are bonded to the ground lead terminal 10e by a wire from the V direction and grounded, and are electrically connected as shown in FIG.

  The thermistor 16 is provided for measuring the operating temperature of the LD 13 and adjusting the temperature of the LD 13. In order to accurately detect the operating temperature and perform appropriate drive control, it is necessary to dispose as close to the LD 13 as possible. For this reason, the thermistor 16 is mounted on the LD carrier 12 on which the LD 13 is mounted. The portion of the thermistor 16 to which one electrode is connected is bonded to the lead terminal 10d from the V direction by a wire, and the portion to which the other electrode is connected is bonded to the grounding lead terminal 10e by a wire from the V direction. Connected and electrically connected as shown in FIG.

  In order to facilitate wire bonding related to the PD 17 and the thermistor 16 and to shorten the wire length, the end portions of the lead terminals 10 d to 10 f that penetrate the stem 22 and protrude from the main surface thereof are connected to the wiring electrode 18. It is advisable to design the protruding amount and arrangement after mounting so as to be located near each connection position.

  Then, the main surface of the stem 22 is formed by a cylindrical CAN case 24 provided with a lens 25 for condensing the light emitted from the LD 13 onto an optical fiber (not shown) so as to accommodate each of the above-described required components. Seal the side. The portion shown in FIGS. 1 to 3, that is, the portion constituted by the CAN case 24 and the stem 22 on which the mount member 23 on which the required component is mounted is disposed or attached and the lead terminal is attached is a package. (In this example, it is called a CAN type or coaxial type package).

  As described above, in the illustrated optical transmission module 1, the TEC is arranged perpendicular to the stem 22 of the coaxial package, and each connection component is mounted on the TEC from the V direction. Can be mounted and wired. This effect is the same even if it is a complicated structure equipped with a high frequency circuit. Since all of the required connection parts can be mounted and wire bonding can be performed from the same direction, it is not necessary to rotate the stem 22 of the package or the required connection parts, thereby simplifying the assembly work. Become.

  Moreover, in the above example, mounting parts other than a connection required component are not mentioned. However, when providing a carrier or the like for installing a connection required component, the carrier corresponds to a mounting component other than the connection required component. By mounting all mounting parts, including not only the connection required parts but also mounting parts other than such required connection parts, directly or indirectly from one direction on the mounting surface of the mount member 23, Since all wire bonding operations can be performed from the same direction, it is not necessary to rotate the stem 22 of the package or the mounted component, and the assembly operation is simplified.

  A structure for enabling connection with the optical cable in the optical transmission module 1 described above will be described with reference to FIGS. 5 and 6 are partial cross-sectional views showing an example in which a sleeve portion is attached to the optical transmission module of FIG. In addition, in each figure, 10 has shown the lead terminals 10a-10i, and the code | symbol is not attached | subjected to connection components other than the mount member 23 and LD13 for simplification of drawing.

  The optical transmission module 5 shown in FIG. 5 is an optical receptacle with an isolator 55. The optical transmission module 5 is a coaxial package including the stem 22, the lead terminal 10, the CAN case 24, the lens 25, and each connection component shown in FIG. It is attached by adjusting. The joint sleeve 50 is provided with a hole for allowing laser light to pass from the coaxial package to the sleeve portion. The isolator 55 is provided in the hole portion on the inner side (lens 25 side) of the joint sleeve 50. The isolator 55 includes a Faraday rotator, a polarizer, a permanent magnet, and the like.

  The sleeve portion has a structure in which an alignment sleeve 53 is attached to the inner wall of the sleeve holder 52, and a fiber stub 54 is provided in the alignment sleeve 53. The alignment sleeve 53 serves as a guide for optically coupling the ferrule of the optical connector, and has an inner wall shaped to fit the ferrule. The fiber stub 54 has basically the same structure as the ferrule of the optical connector, and has a structure in which an optical fiber such as a single mode optical fiber (SMF) is mounted in a minute hole provided in a central part of a ceramic component such as zirconia. Have. In order to fix the fiber stub 54 on the optical axis, a stub holder 51 is disposed on the optical reference surface on the emission side of the joint sleeve 50 as shown in the figure.

  With such a structure, the optical transmission module 5 is connected to the optical fiber in the optical connector, and the laser light emitted from the LD 13 can be collected by the lens 25 and coupled to the optical fiber. Although the optical receptacle with the isolator 55 has been described, the present invention can be similarly applied to a module having a structure in which the isolator 55 is removed from the optical transmission module 5.

  The optical transmission module 6 shown in FIG. 6 is a pigtail type optical receptacle with an isolator 65. The optical transmission module 6 is a coaxial package including the stem 22, the lead terminal 10, the CAN case 24, the lens 25, and each connection component shown in FIG. 1, and the joint sleeve 60 is axially positioned on the CAN case 24. It is attached by adjusting. The joint sleeve 60 is provided with a hole for allowing laser light to pass from the coaxial package to the sleeve portion. The isolator 65 is provided in the hole portion on the inner side (lens 25 side) of the joint sleeve 60. The isolator 65 includes a Faraday rotator, a polarizer, a permanent magnet, and the like.

  In order to fix the ferrule 63 on the optical axis, the sleeve portion is structured such that a ferrule holder 61 is disposed on the optical reference surface on the exit side of the joint sleeve 60 as shown in the figure, and the optical fiber 64 and the ferrule 63 are optically coupled. A protective cover 62 having a guide portion for coupling is provided around the ferrule 63 and the ferrule holder 61. The protective cover 62 has a pigtail type outer shape.

  The optical transmission module 6 is connected to the optical fiber 64 with such a structure, and the laser light emitted from the LD 13 can be condensed by the lens 25 and coupled to the optical fiber 64. Although the optical receptacle with the isolator 65 has been described, the present invention can be similarly applied to a module having a structure in which the isolator 65 is removed from the optical transmission module 6.

  The optical transmission module 1 after being manufactured by the optical module manufacturing method according to the present invention has been described above, but the optical axis misalignment that may occur when the optical transmission module 1 is manufactured will be described with reference to FIGS. 7 and 8. . FIG. 7 is a partial cross-sectional view showing a state in which an optical axis shift has occurred in the optical transmission module of FIG. FIG. 8 is a partial cross-sectional view showing an example in which the sleeve portion is attached to the optical transmission module of FIG. 7 as it is, and is a diagram showing a state in which the optical axis is shifted in the optical transmission module of FIG.

  When manufacturing the optical transmission module 1, it is necessary to attach the LD carrier 12 on which the LD 13 is mounted to the mount member 23. In the structure with the TEC exemplified here, the TEC is mounted on the mount member 23 and the LD carrier is further provided thereon. 12 need to be installed. Therefore, as shown by the angle θ in FIG. 7, the center of the package and the center of the optical axis of the LD 13 may be misaligned. Then, as shown in FIG. 8, the laser beam is not emitted to the fiber stub 54 side.

  At this time, it is possible to fix the positional relationship with the optical fiber after the assembly of the package by adjusting the joint sleeve 50 or the like. However, when the inclination θ of the optical axis is large, such adjustment is also possible. An optimal bond cannot be obtained. In particular, the higher the magnification of the lens 25, the more pronounced deviation of the outgoing beam. Therefore, in the manufacturing method of the present invention, the following mounting method is adopted in order to suppress such an angle shift.

  The optical module manufacturing method according to the present invention includes an attachment / formation step, a terminal attachment step, and a substrate mounting step described below. In the mounting / forming process, as described in the structure of the optical module 1, a mounting surface (preferably a mounting surface perpendicular to the main surface) that is provided on the main surface of the stem 22 and intersects the main surface is provided on the stem 22. A mounting member 23 is attached, or such a mounting member 23 is formed integrally with the stem 22. Next, in the terminal attachment process to be executed, the plurality of lead terminals 10 a to 10 i are attached through the stem 22. In addition, when employ | adopting the process of attaching the mount member 23 in an attachment / formation process, you may perform after this terminal attachment process.

  The substrate mounting step is a step of mounting a substrate (illustrated by LD carrier 12) on which a light emitting element (illustrated by LD 13) is mounted on the mounting surface of mount member 23. More specifically, the substrate mounting process employed in the present invention includes at least two of the end surface of the LD carrier 12 on the stem 22 side and a plurality of lead terminals (in this example, the height from the LD carrier 12 and the mounting member 23 is substantially the same. Positioning is performed with the ends of the lead terminals 10c and 10g), and the positioned LD carrier 12 is slid in the optical axis direction of the emitted light emitted from the LD 13 and then fixed to the mount member 23. Note that it is preferable that the end portions of the lead terminals 10c and 10g (the end portion on the side where the CAN case 24 is attached) be a plane parallel to the main surface of the stem 22 because it can be positioned more accurately, but the present invention is not limited thereto. In addition, even when the tip portion is spherical, positioning at two points of each terminal is sufficiently possible.

  As described above, the package and the LD 13 are fixed to each other through the substrate mounting process in which the end portions of at least two lead terminals and one end surface of the LD carrier 12 are abutted and used as a reference for relative positioning. Positioning that achieves a positional relationship is possible, and the optical axis deviation (beam angle deviation) of the LD 13 can be accurately prevented. As a result, it is possible to improve the yield by reducing the problem that the optical coupling efficiency is lowered due to the optical axis misalignment in the post-process such as the assembling alignment of the ferrule with the isolator 55 or the fiber stub 54. Each of these processes can be realized regardless of whether the TEC is mounted or not. In addition, the optical module manufactured by the optical module manufacturing method according to the present invention has a structure and arrangement capable of performing mounting parts mounting and wire bonding operations from the same direction as exemplified in the optical transmission module 1. It is not limited to things.

  FIG. 9 is a diagram for explaining an example of an optical module manufacturing method according to an embodiment of the present invention. The manufacturing method illustrated in FIG. 9 is a method in which the LD carrier 12 is mounted at an appropriate position after the TEC is fixed to the mount member 23 in advance.

  More specifically, the substrate mounting step includes a step of mounting the TEC on the mounting surface of the mount member 23 and fixing the mounting surface and the TEC exhaust heat side ceramic substrate 21; and a TEC (TEC heat absorption side ceramic substrate). 19) A step of placing the LD carrier 12 on the surface and positioning the end surface of the LD carrier 12 on the stem 22 side and at least two of the plurality of lead terminals (in this example, the lead terminals 10c and 10g). (See the upper diagram in FIG. 9).

  As described above, in this embodiment, the LD carrier 12 is mounted in a state where the lower surface of the LD carrier 12 is in contact with the heat absorption surface side of the TEC fixed to the stem 22, and one end surface of the LD carrier 12 becomes the positioning surface, and the positioning surface. Abuts against the ends of the lead terminals 10c, 10g to perform relative positioning. For such positioning, the end portions of the lead terminals 10c and 10g are designed to protrude from the main surface of the stem 22 by a predetermined length. The surface including this end is a reference for relative positioning between the stem 22 (package) and the LD carrier 12 which is the LD mounted substrate.

  Further, in the substrate mounting step, the positioned LD carrier 12 is slid in the optical axis direction of the emitted light emitted from the LD 13 (see the lower diagram in FIG. 9), and then the LD carrier 12 and the TEC (TEC endothermic heat absorption). A step of fixing the side ceramic substrate 19). This sliding is performed to fix the lead terminals 10c and 10g and the LD carrier 12 at a position where they are not short-circuited. In other words, the positioned LD carrier 12 is moved in a predetermined direction to create a gap (insulation gap G) between the lead terminals 10c and 10g, and the LD carrier 12 is fixed to the heat absorption surface side of the TEC without short-circuiting. . In order to accurately slide in the optical axis direction, for example, the jig may be set from a direction parallel to the main surface of the stem 22 so as not to deviate from the optical axis and then slid.

  After performing such fixation, wire bonding is performed at a necessary portion, thereby completing the optical transmission module 1 as shown in FIG. Note that wire bonding between the LD carriers 12 such as wire bonding to the wiring electrode 18 of the LD carrier 12 may be performed before placing the LD carrier 12 on the TEC.

  FIG. 10 is a diagram for explaining an example of an optical module manufacturing method according to another embodiment of the present invention. The manufacturing method illustrated in FIG. 10 is a method of mounting an assembly of the LD carrier 12 and the TEC in advance at an appropriate position of the mount member 23.

  More specifically, in the substrate mounting step, the LD carrier 12 is fixed on the TEC (TEC heat absorption side ceramic substrate 19), and the TEC with the LD carrier 12 is placed on the mounting surface of the mount member 23. Then, the positioning step is performed between the end surface of the LD carrier 12 on the stem 22 side and the ends of at least two of the plurality of lead terminals (in this example, the lead terminals 10c and 10g) (see the upper diagram in FIG. 10). And have.

  Thus, in this embodiment, the TEC is mounted in a state where the upper surface (mounting surface) of the mount member 23 is in contact with the heat removal surface side of the TEC to which the LD carrier 12 is fixed, and one end surface of the LD carrier 12 is a positioning surface. Then, the positioning surface comes into contact with the end portions of the lead terminals 10c and 10g to perform relative positioning. For such positioning, the end portions of the lead terminals 10c and 10g are designed to protrude from the main surface of the stem 22 by a predetermined length. Also in this embodiment, the surface including this end becomes a reference for relative positioning between the stem 22 (package) and the LD carrier 12 which is an LD mounted substrate.

  Further, in the substrate mounting step, the TEC with the positioned LD carrier 12 is slid in the direction of the optical axis of the emitted light emitted from the LD 13 (see the lower diagram in FIG. 10), and then the TEC (discharge of the TEC) is performed. A step of fixing the heat-side ceramic substrate 21) and the mount member 23; This slide is also performed in order to fix the lead terminals 10c, 10g and the LD carrier 12 at a position where they are not short-circuited, as in the embodiment of FIG. That is, the TEC with the LD carrier 12 after positioning is moved in a predetermined direction to create a gap (insulation gap G) between the lead terminals 10c and 10g, and the mounting of the mount member 23 without short-circuiting the LD carrier 12 Secure to the surface. In order to accurately slide in the optical axis direction, for example, the jig may be set from a direction parallel to the main surface of the stem 22 so as not to deviate from the optical axis and then slid.

  After performing such fixing, the optical transmission module 1 as shown in FIG. 1 is completed by performing wire bonding of a necessary part like the embodiment of FIG. As in the embodiment of FIG. 9, the wire bonding between the LD carriers 12 may be performed before the TEC with the LD carrier 12 is placed on the mount member 23.

It is a partial cross section figure which shows the structural example of the optical transmission module manufactured with the optical module manufacturing method which concerns on this invention. FIG. 2 is a partial cross-sectional view of the optical transmission module of FIG. 1 viewed from the H direction. It is the figure which looked at the optical transmission module of FIG.1 and FIG.2 from the Z direction. FIG. 4 is a circuit diagram of the optical transmission module shown in FIGS. 1 to 3. It is a partial cross section figure which shows the example which attached the sleeve part to the optical transmission module of FIG. FIG. 6 is a partial cross-sectional view illustrating another example in which a sleeve portion is attached to the optical transmission module of FIG. 1. FIG. 2 is a partial cross-sectional view illustrating a state in which an optical axis shift has occurred in the optical transmission module of FIG. 1. FIG. 8 is a partial cross-sectional view illustrating an example in which a sleeve portion is directly attached to the optical transmission module of FIG. 7, and is a diagram illustrating a state in which an optical axis shift occurs in the optical transmission module of FIG. 5. It is a figure for demonstrating an example of the optical module manufacturing method which concerns on one Embodiment of this invention. It is a figure for demonstrating an example of the optical module manufacturing method which concerns on other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical transmission module, 10a-10i ... Lead terminal, 11 ... TEC electrode pad, 12 ... Ceramic circuit board (LD carrier), 13 ... LD, 14 ... Inductor, 15 ... Resistance, 16 ... Thermistor, 17 ... End face incident type Monitor PD, 18 ... Wiring electrode, 19 ... Heat absorption side ceramic substrate, 20 ... Peltier element, 21 ... Waste heat side ceramic substrate, 22 ... Stem, 23 ... Mount member, 24 ... CAN case, 25 ... Lens.

Claims (3)

A mounting member having a mounting surface intersecting with the main surface of the stem, a plurality of lead terminals penetrating the stem, a substrate mounted with the optical element mounted on the mounting surface of the mounting member, and an optical cable An optical module having a sleeve of
The mounting of the substrate is performed by positioning the end surface on the stem side of the substrate and at least two end portions of the plurality of lead terminals, and sliding the positioned substrate in the optical axis direction of the optical element. The optical module manufacturing method characterized by fixing to the said mounting member.   The optical module manufacturing method according to claim 1, wherein a thermoelectric cooling module is mounted and fixed on a mounting surface of the mount member, and then the substrate is placed on the thermoelectric cooling module for positioning. Method.   The light according to claim 1, wherein the substrate is fixed on a thermoelectric cooling module, and then the thermoelectric cooling module with the substrate is placed on a mounting surface of the mount member to perform positioning. Module manufacturing method.

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