JP2004029161A - Optical semiconductor device module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device module the optical axis of which is aligned with good reproducibility. <P>SOLUTION: An optical fiber collimator 22 having a 2nd lens 3 and an optical fiber 4 mounted is connected to the external liner 18 of a positioning liner 17 which reaches a mount 6 by penetrating from the outside to the inside of a package 8, and a first lens is arranged in the internal liners 19a and 19b. Since the internal liner 19 is fitted into an annular guide groove 20 on the mount 6 while adopting the optical axis B of the optical semiconductor device 1 mounted on the mount 6 as the center, the central axis C of the positioning liner 17 is easily aligned with the optical axis B with good reproducibility. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical semiconductor element module used for optical communication and the like.
[0002]
[Prior art]
In optical communication, an optical semiconductor element module in which an optical semiconductor element such as a semiconductor laser and an optical fiber are optically coupled is used. There are various methods for coupling an optical semiconductor element and an optical fiber to be mounted as an optical semiconductor element module, but a coupling method using a two-lens system is preferred because positioning accuracy is loose and assembly is relatively easy. Used.
[0003]
As shown in FIG. 9, in a conventional optical semiconductor element module using a two-lens system coupling method, a light emitted from an optical semiconductor element 101 is made parallel by a first lens 102 and condensed by a second lens 103. To be coupled to the core of the optical fiber 104. Here, the optical semiconductor element 101 is mounted via a submount 105 on a mount 106 which is arranged in close contact with a Peltier module 107 for temperature control. The lens holder 109 for holding the first lens 102 is installed in the emission side area of the mount 106 whose height is adjusted so that the light emission end face of the optical semiconductor element 101 and the optical axis of the first lens 102 coincide. I have. The optical semiconductor element 101 mounted on the mount 106 in this manner is disposed inside the package 108. A window 115 is provided on the optical axis of the optical semiconductor element 101 and the first lens 102 on the package side wall 113 on the light emission side of the package 108. Outside the package side wall 113, an optical fiber collimator 122 incorporating a second lens 103 for coupling light emitted from the window 115 to the optical fiber 104 is provided. The optical fiber 104 is connected to an optical fiber collimator 122 by a ferrule 111 provided at the tip. The position of the second lens 103 is adjusted in the optical fiber collimator 122 so that the optical fiber 104 can obtain the maximum intensity light output. Further, the package 108 is provided with a lid 114 and hermetically sealed with dry nitrogen gas or the like.
[0004]
In such an optical semiconductor device module, it is necessary to precisely couple the optical axes of the optical semiconductor device 101, the first and second lenses 102 and 103, the optical fiber 104, and the like. When the optical axes of the respective optical components are adjusted in parallel, assuming that the allowable value of the coupling efficiency degradation caused by the displacement from the optimal coupling state is, for example, 0.5 dB, the optical semiconductor element 101 and the first lens 102 The optical axis direction: ± 20 μm, the orthogonal direction of the optical axis: ± 10 μm, the optical axis direction: ± 1000 μm, and the orthogonal direction of the optical axis: ± 100 μm between the first lens 102 and the second lens 103. . Since high precision is required for optical axis alignment between the optical semiconductor element 101 and the first lens 102, the optical semiconductor element 101 and the first lens 102 are precisely positioned on the mount 106.
[0005]
[Problems to be solved by the invention]
In the optical semiconductor element module, the mount 106 is tightly fixed on the Peltier module 107 for controlling the temperature of the optical semiconductor element 101. By the way, the Peltier module 107 has a structure in which a plurality of Peltier elements are stacked, and is not an optical component. In the Peltier module 107, not only the height but also the inclination of the surface on which the mount 106 is mounted varies greatly. Therefore, the optical axis of the optical semiconductor element 101 on the mount 106 and the optical axis of the first lens 102 are determined by the shape of the Peltier module 107, and the optical axis of the second lens 103 and the optical axis of the optical fiber 104 are vertically displaced. In addition, a shift in the parallelism of the optical axis, that is, an angle shift easily occurs. In order to correct such a deviation of the optical axis, the position of the second lens 103 and the optical fiber 104 or the position of the mount 106 is adjusted when assembling the optical semiconductor element module. Degradation of the coupling efficiency of the optical fiber 104 is inevitable. Further, if the position of the mount 106 deviates from the design position, for example, the connection with the drive circuit of the optical semiconductor element 101 mounted in the package 108 may be hindered. As described above, in the conventional optical semiconductor element module, there is a problem that the manufacturing yield is reduced due to the deterioration of the coupling efficiency between the optical semiconductor element 101 and the optical fiber 104, and the manufacturing cost is increased due to the optical axis adjustment step.
[0006]
SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned problems of the conventional optical semiconductor element module, and an object of the present invention is to provide an optical semiconductor in which the optical axes of the optical fiber and the optical semiconductor element can be aligned easily and with good reproducibility. It is to provide an element module.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the features of the present invention include (a) an optical semiconductor element, (b) a mount for mounting the optical semiconductor element, (c) a package for housing the optical semiconductor element and the mount, A) an end fitted to a part of the mount, extending to the outside of the package, accommodating the end of the optical fiber, and including a positioning liner for positioning the optical axis of the optical semiconductor element and the central axis of the optical fiber; The gist is an optical semiconductor element module.
[0008]
In the optical semiconductor element module of the present invention, the positioning liner extends inside the package, and is partially left so that the upper surface is parallel to the central axis and is a horizontal plane or less passing through the central axis. Preferably, the inner liner has a cylindrical outer liner extending outside the package. Preferably, the positioning liner is made of stainless steel. Further, it is preferable that the positioning liner is formed by cutting the inner liner after gold plating a stainless steel cylinder. Further, it is preferable that the mount has an annular shape centered on the optical axis of the optical semiconductor element and has a guide groove into which an end of the internal liner fits. Furthermore, it is preferable to further mount a wiring board provided on the mount and a drive circuit board on which an electronic circuit 85 arranged on the wiring board and supplying a high-speed signal to the optical semiconductor element is mounted.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and shapes and dimensions are different from actual ones. Therefore, specific shapes and dimensions should be determined in consideration of the following description. Also, it goes without saying that the drawings include portions having different dimensional relationships and ratios.
[0010]
As shown in FIG. 1, an optical semiconductor device module according to an embodiment of the present invention includes an optical semiconductor device 1, a mount 6 for mounting the optical semiconductor device 1, and a package 8 for housing the optical semiconductor device 1 and the mount 6. The end is fitted to a part of the mount 6, extends to the outside of the package 8 and accommodates the end of the optical fiber 4, and the optical axis B of the optical semiconductor element 1 and the central axis of the optical fiber 4 are aligned. And a positioning liner 17 for positioning. The optical semiconductor device 1 is, for example, a semiconductor laser, and is mounted via a submount 5 on a mount 6 arranged on a Peltier module 7 for temperature control. The submount 5 and the mount 6 are made of Kovar (Fe-Ni-Co alloy), but may be made of another metal having high thermal conductivity, for example, copper (Cu). Here, the optical semiconductor element 1 is mounted on the mount 6 via the submount 5, but may be mounted directly on the mount 6 without the submount 5. The positioning liner 17 is made of stainless steel (SUS), and has a cylindrical external liner 18 inserted from the outside of the package 8 through the side wall hole 24 of the package side wall 13, and the inside of the package 8 from the external liner 18 to the mount 6. , And is formed integrally with the inner liners 19a and 19b extending in a partially cylindrical shape. The two inner liners 19a, 19b consist of partially cylindrical beams 19a, 19b, respectively. Each of the two beams 19a and 19b is disposed below the central axis C. Here, the internal liners 19a and 19b have a two-beam configuration, but may have a semi-cylindrical shape. In this case, the semi-cylindrical portion may be provided below the central axis. A window 15 provided inside the package 8 and an isolator 21 facing the window 15 for preventing return light are inserted into the cylinder of the external liner 18. Accordingly, the center axis C is automatically set at the center of the window 15 and the isolator 21. Although the sapphire is used for the window 15 in the embodiment of the present invention, quartz or glass or the like can be used as long as it has a sufficient transmittance for the light emitted from the optical semiconductor element 1. An optical fiber collimator 22 containing the second lens 3 fitted to the flange 37 is joined to the outer liner end 23 of the outer liner 18. The optical fiber 4 is connected to an optical fiber collimator 22 by a ferrule 11 provided at the tip. The optical fiber collimator 22 has a cylindrical shape, and is centered by the flange 37 and the ferrule 11 so that the center axis of the optical fiber collimator 22 is aligned with the center of the second lens 3 and the optical fiber 4. On the other hand, a lens holder 32 that holds the first lens 2 fitted to the flange 33 is disposed on the inner liners 19a and 19b. Since the bottom surface of the lens holder 32 is adjusted to the cylindrical inner diameter of the positioning liner, it can be stably installed on the internal liners 19a and 19b. The ends of the partially cylindrical inner liners 19 a and 19 b are fitted in guide grooves 20 provided in the mount 6. Further, the package 8 is provided with a lid 14 and hermetically sealed with dry nitrogen gas or the like.
[0011]
Here, since the outer liner end 23 of the outer liner 18 is a surface orthogonal to the center axis of the positioning liner 17, the centering is performed so that the center axes of the positioning liner 17 and the optical fiber collimator 22 coincide. You can do it easily. As a result, the centers of the second lens 3 and the optical fiber 4 are aligned with the center axis C of the positioning liner 17. The inner liners 19 a and 19 b are formed parallel to the lower part of the center axis of the positioning liner 17, and are fixed by the guide grooves 20 of the mount 6. The guide groove 20 of the mount 6 has an annular shape centered on the optical axis B of the optical semiconductor element 1 mounted via the submount 5 and whose groove inner diameter and outer diameter match the cylindrical inner diameter and outer diameter of the positioning liner 17. It has become. When the respective ends of the inner liners 19a and 19b of the positioning liner 17 are fitted into the guide grooves, the optical axis B of the optical semiconductor element 1 and the center axis C of the positioning liner 17 are automatically aligned. As described above, the first lens can be easily aligned with the optical axis of the optical semiconductor element 1 without being affected by the shape of the Peltier module 7 on which the mount 6 is mounted. Accordingly, the optical axis of the optical semiconductor element 1 can be easily and highly accurately optically coupled to the optical fiber 4 through the first and second lenses 2 and 3.
[0012]
A method for manufacturing an optical semiconductor element module according to an embodiment of the present invention will be described with reference to FIGS. The method of manufacturing an optical semiconductor element module described below is an example, and it is needless to say that the method can be realized by various other manufacturing methods.
[0013]
(A) As shown in FIG. 2, the positioning liner 17 according to the embodiment of the present invention is manufactured by processing a SUS cylinder whose surface is plated with gold. The outer liner end 23 of the SUS cylinder is cut so as to be orthogonal to the center axis C of the positioning liner 17. The upper and lower surfaces are cut at one end of the SUS cylinder to produce two internal liners 19a and 19b in a beam shape. The cut surfaces of the inner liners 19a and 19b are formed parallel to the central axis C, and are SUS surfaces without a gold plating layer. The line connecting the cutting surfaces above the two internal liners 19a and 19b is set to be lower than a horizontal line passing through the center axis C of the positioning liner 17. In the embodiment of the present invention, the inner liners 19a and 19b are also formed by cutting the lower surface of the SUS cylinder of the positioning liner 17 into two beams. Is also good. The positioning liner 17 thus processed is inserted into the side wall hole 24 of the package side wall 13, and the outer surface of the package side wall 13 and the gold plating surface of the outer liner 18 are silver-brazed. The silver brazing has not only the purpose of fixing the positioning liner 17 but also the purpose of hermetic sealing. Since the lens holder 32 and the window 15 are fixed to the positioning liner 17 as described later, it is necessary to perform a surface treatment according to the fixing method. Normally, the lens holder 32, the window 15 and the like are fixed by YAG laser welding or fixed by silver brazing. In the case of YAG laser welding fixed, the surface is SUS ground, and in the case of silver brazing, the surface is fixed. Gold plating is recommended. If YAG laser welding is required on the inner surface of the SUS cylinder, the gold layer plated on the inner surface is removed in advance. Alternatively, when gold plating is performed on the SUS cylinder, the SUS cylinder may be plugged so that the inner surface of the SUS cylinder is not plated with gold.
[0014]
(B) In the mount 6 on which the optical semiconductor element 1 is mounted, as shown in FIG. 3, the guide groove 20 is formed in an annular shape around the optical axis B of the optical semiconductor element 1 die-bonded on the submount 5. Have been. The tips of the inner liners 19 a and 19 b of the positioning liner 17 are fitted into the guide grooves 20. Here, the outer and inner diameters of the arc of the guide groove 20 are obtained by providing clearance for fitting to the outer and inner diameters of the SUS cylinder used for the positioning liner 17. The depth of the guide groove 20 is such that the parallelism between the central axis C of the positioning liner 17 and the optical axis B of the optical semiconductor element 1 can be ensured, for example, 1 mm of the outer diameter of the SUS cylinder used for the positioning liner 17. / 2 or more. As described above, the optical axis B of the optical semiconductor element 1 which is the center of the guide groove and the central axis C of the positioning liner 17 are automatically aligned on substantially the same straight line. Since the guide groove 20 is an annular groove, the positioning liner 17 has a degree of freedom in the rotational direction along the annular groove, and it is conceivable that the mount 6 and the positioning liner 17 may be fixed at an angle to each other. Since the optical axis B of the semiconductor element 1 and the central axis C of the positioning liner 17 hardly move, there is no problem. Here, a gap is left between the bottom surface of the mount 6 and the surface of the Peltier module 7 in order to fit the internal liners 19a and 19b to the mount 6. This gap is filled with a conductive paste, for example, a silver paste. The mount 6 is fixed on the Peltier module 7 with the silver paste solidified, with the internal liners 19a and 19b of the positioning liner 17 fitted. The silver paste can be injected from the outer periphery of the mount 6, but can be efficiently provided by providing an injection hole in the central region of the mount 6.
[0015]
(C) Inside the package 8 of the outer liner 18 of the positioning liner 17, a window 15 in which a joint 15b made of Kovar is welded to a glass 15a is inserted as shown in FIG. The outer diameter of the joint 15b is smaller than the inner diameter of the outer liner 18 by the clearance for insertion. The joint 15b of the inserted window 15 is soldered or brazed inside the outer liner 18 for hermetic sealing. Further, the isolator 21 is inserted into and fixed to the outer liner end 23 of the positioning liner 17. As a method for fixing the isolator 21, there is a method of performing YAG laser welding through a horizontal hole provided in the external liner 18 in advance. Further, the optical fiber collimator 22 containing the second lens 3, the optical fiber 4, and the ferrule 11 whose position has been adjusted in advance is connected to the external liner end 23 and held by a jig. The input intensity to the monitor can be monitored.
[0016]
(D) As shown in FIG. 5, the lens holder 32 for holding the first lens 2 has a U-shaped opening 34 and a flange groove 35 formed inside an opposing wall. The U-shaped bottom has a width such that the opening 34 is opposed to the center axis C of the positioning liner 17 and can be stably installed on the internal liners 19a and 19b. Is formed to have a curvature approximately equal to the inner diameter of the SUS cylinder. As shown in FIG. 6, the flange groove 35 is formed with a clearance such that the flange 33 formed around the first lens 2 can slide. The lens holder 32 and the flange 33 are made of SUS. Here, the lens holder 32 is placed at an appropriate position on the inner liners 19 a and 19 b of the positioning liner 17, and the first lens 2 is inserted into the flange groove 35.
[0017]
(E) The package 8 is installed on the alignment machine, a voltage is applied to the optical semiconductor element 1 to cause laser oscillation, and the emitted light is monitored by the optical fiber 4. First, alignment of the first lens 2 is performed in a direction perpendicular to the optical axis B. The flange 33 of the first lens 2 is moved along the flange groove 35 of the lens holder 32 to find a position where the maximum intensity of the emitted light is obtained by the optical fiber 4, and the flange 33 is attached to the lens holder 32 at that position. Weld. Next, the optimum position of the first lens 2 in the direction along the optical axis B is determined. The lens holder 32 is moved on the inner liners 19a and 19b of the positioning liner 17, the position where the maximum output light is obtained is detected, and the lens holder 32 is fixed to the inner liners 19a and 19b of the positioning liner 17 by YAG laser welding. I do. At this time, since it is difficult to perform YAG laser welding of gold having high thermal conductivity, it is possible to use the upper surfaces of the inner liners 19a and 19b that have been cut and have the SUS surface. Thereafter, the alignment of the optical fiber collimator 22 is performed, and the optical fiber collimator 22 is fixed to the external liner end 23 of the positioning liner 17 by YAG laser welding at a position where the light having the maximum intensity is obtained.
[0018]
As described above, in the optical semiconductor element module according to the embodiment of the present invention, since the optical axis B of the optical semiconductor element 1 and the central axis C of the positioning liner 17 are automatically aligned on the same straight line by the positioning liner 17, Alignment work can be performed easily and with high accuracy.
[0019]
In the above description, the alignment of the second lens 3 and the optical fiber 4 has been completed in advance, but when the optical fiber collimator 22 capable of adjusting the position of the second lens 3 is used, the first lens 2 The alignment of the second lens 3 may be performed after the alignment. In that case, first, the position of the second lens 3 is adjusted, and the flange 37 is YAG-welded to the inner surface of the optical fiber collimator 22 at a position where the maximum intensity of the emitted light is obtained by the optical fiber 4. , And the ferrule 11 may be fixed to the optical fiber collimator 22. Although the lens holder 32 having the structure shown in FIG. 5 is used, there is a degree of freedom in the rotation direction in a plane orthogonal to the optical axis B on the inner liners 19 a and 19 b of the positioning liner 17. Adjustment of this rotation direction may be required. For example, as shown in FIG. 7, if notches 31 are provided on both outer sides of the lens holder 32a so as to match the upper end surfaces of the inner liners 19a and 19b of the positioning liner 17, the lens holder 32a can be positioned on the optical axis B. It can be installed with high accuracy. In FIG. 7, the notch 31 has a flat plate shape, but it is needless to say that a similar effect can be obtained even if it is a pin shape.
[0020]
(Modification)
The optical semiconductor device module according to the modification of the embodiment of the present invention has a built-in high-speed driving electronic circuit required for application to high-speed multiplexed optical communication and the like, as described in the first embodiment. And different. The other parts are the same as those of the first embodiment, and the duplicated description will be omitted.
[0021]
As shown in FIG. 8, the optical semiconductor device module according to the modification of the embodiment of the present invention includes a positioning liner 57 that penetrates the package 48 from the outside to the inside and reaches the mount 56. The optical semiconductor element 41 is mounted on a mount 56 arranged on a Peltier module 47 for temperature control. The positioning liner 57 includes a cylindrical external liner 58 joined from the outside of the package 48 by a side wall hole of the package side wall, and an internal liner 59 extending from the external liner 58 to the mount 56 inside the package 48. (See FIG. 2). An optical fiber collimator 62 containing a second lens is joined to the external liner end 63 of the external liner 58. The optical fiber 44 is connected to an optical fiber collimator 62 by a ferrule provided at the tip. On the other hand, a lens holder 72 that holds the first lens fitted to the flange 73 is disposed in the inner liner 59. The end of the inner liner 59 is fitted in a guide groove provided in the mount 56 (see FIG. 3). A drive circuit board 81 on which an electronic circuit 85 that modulates the intensity of output light of the optical semiconductor element 41 at high speed is mounted is mounted in the package 48. The drive circuit board 81 and the optical semiconductor element 41 are connected to the strip line 86 of the wiring board 82 by bonding wires 83a and 83b.
[0022]
The optical semiconductor element 41 is a distributed feedback semiconductor laser (EA-DFB laser) with an electroabsorption external modulator in which an electroabsorption external modulator (EA modulator) is integrated with a distributed feedback semiconductor laser (DFB laser). is there. The EA modulator utilizes a change in light absorption due to an electric field of a semiconductor, and is capable of high-speed light intensity modulation. The optical semiconductor element 41 modulates the light intensity of the excitation light of the DFB laser with the modulation signal applied to the EA modulator and emits the light. The optical semiconductor device module requires not only high-efficiency optical coupling between the optical semiconductor device 41 and the optical fiber 44 so that a high-quality optical signal can be transmitted over a long distance, but also a high-speed electric pulse modulation signal. Good transmission characteristics are also required.
[0023]
The drive circuit board 81 on which the electronic circuit 85 for supplying the modulation signal is mounted is arranged in contact with the mount 56 on which the optical semiconductor element 41 is mounted. The connection between the drive circuit board 81 and the optical semiconductor element 41 is made via a strip line 86 on a wiring board 82 disposed on the mount 56 between the drive circuit board 81 and the optical semiconductor element 41. Since the optical semiconductor element 41 and the wiring board 82 are mounted on the same mount 56, the connection by the bonding wires 83a can be performed in an optimal arrangement. However, since the arrangement of the drive circuit board 81 is not fixed to the mount 56, there is a possibility that a displacement occurs and the bonding wire 83b becomes longer. In particular, in the conventional optical semiconductor element module, as shown in FIG. 9, the mount 106 is mounted in close contact with the Peltier module 107, so that when the optical coupling between the optical semiconductor element 101 and the optical fiber 104 is enhanced, Frequently, the position of the mount 106 is greatly deviated from a designed predetermined position. The modulation signal is, for example, from the current mainstream communication speed of 10 Gb / s in multiplex optical communication to 40 Gb / s which is being developed for practical use, or 100 Gb / s which is being researched and developed for the next generation. This is a high-speed pulse signal as shown in FIG. In a line transmitting such a high-speed electric pulse signal, the line length or the bending of the line increases the impedance, and causes a great deterioration in transmission characteristics due to impedance mismatch. A thin metal wire bonding wire has an inductance corresponding to its length. For example, a bonding wire having a diameter of 30 μm has an inductance of about 1 nH / mm. Therefore, in order to transmit a high-speed electric pulse modulation signal without deterioration, it is necessary that the wiring board 82 and the drive circuit board 81 on the mount 56 can be arranged at predetermined positions with good reproducibility.
[0024]
In the optical semiconductor device module according to the modified example of the embodiment of the present invention, since the outer liner end 63 of the outer liner 58 is a surface orthogonal to the center axis of the positioning liner 57, the positioning liner 57 and the optical Alignment can be easily performed so that the center axis of the fiber collimator 62 coincides. Further, since the inner liner 59 is formed parallel to the center axis of the positioning liner 57 and is fixed by the guide groove of the mount 56, the inner liner 59 is affected by the shape of the Peltier module 47 to which the mount 56 is mounted. In addition, the first lens can be aligned with the optical axis of the optical semiconductor element 41. Therefore, the optical semiconductor element 41 can be easily and accurately coupled to the optical fiber 44. Further, since the position of the mount 56 is fixed by the positioning liner 57, the wiring board 82 and the drive circuit board 81 on the mount 56 can be arranged at predetermined positions with good reproducibility. Therefore, the bonding wire 83b connecting the strip line 86 of the wiring board 82 and the electronic circuit 85 of the drive circuit board 81 can be made to have an optimum length.
[0025]
Furthermore, when an ultra-high-speed modulation signal is used, wire bonding cannot be applied, and the drive circuit board 81 and the wiring board 82 must be connected by soldering using a strip line board or the like having no flexibility. Even in such a case, according to the modified example of the embodiment of the present invention, since the arrangement of the drive circuit board 81 and the wiring board 82 can be performed with high reproducibility and high accuracy, an ultra-high-speed modulated signal can be transmitted efficiently.
[0026]
(Other embodiments)
As described above, the embodiments of the present invention have been described. However, it should not be understood that the description and drawings forming a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples, and operation techniques will be apparent to those skilled in the art.
[0027]
For example, as shown in FIG. 10, the window 15 is not installed inside the cylinder of the external liner 18 but is directly installed in the side wall hole 24 of the package 8, and only the inner liners 19 a and 19 b are mounted through the side wall of the package 8. 6 may be connected to the guide groove 20. The window 15 is preferably soldered to the package 6 in advance. When the diameter of the window 15 is considerably smaller than that of the positioning liner 17, this configuration is advantageous in that a portion to be hermetically sealed by silver brazing can be small, and the cost can be reduced.
[0028]
Further, as shown in FIG. 11, the window 15 may be omitted and the isolator 21 may have an airtight structure. The window 15 requiring airtightness becomes unnecessary, and the cost can be reduced. In this case, in order to adjust the polarization plane of the isolator 21, a YAG laser welding fixation is performed after the rotation directions are adjusted, and then the periphery is filled with solder or the like. Small lateral holes need to be drilled in the outer liner 18 for YAG laser welding. If this horizontal hole is formed after the gold plating step, the cut is made of SUS, so that the step of removing the gold plating layer can be omitted.
[0029]
Further, as the optical semiconductor element, various semiconductor lasers are presented in the embodiments of the present invention or the modifications thereof, but other optical semiconductor elements such as a light emitting diode and a light receiving element have the same configuration. Of course, the effect can be obtained. In addition, it is needless to say that the same effect can be obtained in an optical semiconductor element module without a Peltier module. In particular, when a high-speed response photodiode or an optical device having an optical waveguide input is used as an optical semiconductor element, even if a Peltier module is not particularly required, the area of light reception or light incidence is extremely small, and alignment becomes difficult. Even in such a case, according to the embodiment of the present invention, the optical axis can be easily adjusted with high accuracy.
[0030]
As described above, the present invention naturally includes various embodiments and the like not described herein. Therefore, the technical scope of the present invention is defined only by the matters specifying the invention according to the claims that are appropriate from the above description.
[0031]
【The invention's effect】
According to the present invention, it is possible to provide an optical semiconductor element module in which the optical axes are easily aligned with good reproducibility.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of an optical semiconductor element module according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a structure of a positioning liner according to the embodiment of the present invention.
FIG. 3 is a diagram showing a configuration of a mount according to the embodiment of the present invention.
FIG. 4 is a diagram showing a structure of a window used in the optical semiconductor element module according to the embodiment of the present invention.
FIG. 5 is a diagram showing a structure of a lens holder used for the optical semiconductor element module according to the embodiment of the present invention.
FIG. 6 is a diagram showing a structure of a first lens used in the optical semiconductor element module according to the embodiment of the present invention.
FIG. 7 is a view showing another example of the lens holder used for the optical semiconductor element module according to the embodiment of the present invention.
FIG. 8 is a diagram showing a configuration of an optical semiconductor element module according to a modification of the embodiment of the present invention.
FIG. 9 is a diagram showing a configuration of a conventional optical semiconductor element module.
FIG. 10 is a diagram showing a configuration of an optical semiconductor element module according to another embodiment of the present invention.
FIG. 11 is a diagram showing a configuration of an optical semiconductor element module according to still another embodiment of the present invention.
[Explanation of symbols]
1,41,101 Optical semiconductor device
2,102 First lens
3, 103 Second lens
4,44,104 Optical fiber
5, 105 submount
6, 56, 106 mount
7, 47, 107 Peltier module
8, 48, 108 packages
11,111 ferrule
12 Optical filter
13, 113 Package sidewall
14,114 lid
15, 115 windows
15a glass
15b fitting
17,57 Positioning liner
18, 58 External liner
19, 59 Internal liner
19a, 19b beam
20 Guide groove
21 Isolator
22, 62, 122 Optical fiber collimator
23, 63 External liner end
24 Side wall holes
31 notch
32, 32a, 72, 109 Lens holder
33, 37, 73 Flange
34 opening
35, 35a Flange groove
81 drive circuit board
82 Wiring board
83 bonding wire
B optical axis
C center axis

Claims (6)

An optical semiconductor element;
A mount for mounting the optical semiconductor element,
A package containing the optical semiconductor element and the mount;
A positioning liner whose end is fitted to a part of the mount, extends to the outside of the package, houses the end of the optical fiber, and positions the optical axis of the optical semiconductor element and the central axis of the optical fiber. An optical semiconductor device module comprising: The positioning liner extends inside the package, and has a partially cylindrical inner liner whose upper surface is parallel to the central axis and is disposed below the central axis, and extends outside the package. 2. The optical semiconductor element module according to claim 1, further comprising a cylindrical external liner that accommodates an end of the optical fiber. The optical semiconductor element module according to claim 1, wherein the positioning liner is made of stainless steel. The optical semiconductor element module according to claim 1, wherein the positioning liner is made of gold-plated stainless steel, and a part of the inner liner is made of stainless steel. 5. The mount according to claim 1, wherein the mount is a partial arc of a circle whose optical axis is the central axis of the optical semiconductor element, and has a guide groove into which an end of the internal liner fits. 6. 2. The optical semiconductor element module according to claim 1. 6. The semiconductor device according to claim 1, further comprising: a wiring board provided on the mount; and a drive circuit board mounted on the wiring board and mounted with an electronic circuit for supplying a high-speed signal to the optical semiconductor element. The optical semiconductor element module according to any one of the above.

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