JPH0682660A - Optical semiconductor module - Google Patents

Abstract

PURPOSE:To obtain the optical semiconductor module which can secure the life of an IC wherein a light emitting and receiving element and a circuit driving the light emitting and receiving element are constituted and also prevent them from corroding. CONSTITUTION:Laser light emitted by a semiconductor laser array 1 is coupled with a lens array arranged in optical transmission relation with a semiconductor laser array 1, coupled with an optical fiber array ferrule incorporated in an optical fiber array holder 8 in optical transmission relation, and propagated in the optical fiber array 9. A multi-core semiconductor laser package has the IC 3 and semiconductor laser array 1 housed in a case 4 and is airtightly sealed in the case 4 with a low-fusion-point glass, solder, etc., so that the lens array fitted to the lens array holder has optical transmission relation with an optical fiber array ferrule, and the top surface of the case 4 is constituted by airtightly sealing its lid 5 by seam welding or solder fixation. The package and array holder 8 are positioned and arranged on a substrate 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module, and more particularly to the field of various optical communication devices, that is, trunk line communication using an optical fiber as a transmission line, factory automation (FA), office automation (O).
A), a local area network (LAN), a CATV system, a wireless analog transmission system, an optical interconnect system for connecting devices with a multi-core optical fiber, and a B-ISDN service for future broadband services. The present invention relates to an optical semiconductor module suitable for use in a subscriber system or the like for providing to a home.

[0002]

2. Description of the Related Art As a conventional technique relating to an optical semiconductor module, for example, a technique described in Japanese Patent Application Laid-Open No. 2-220010 is known. Hereinafter, this type of conventional technique will be described with reference to the drawings.

FIG. 9 is a perspective view showing the structure of an optical semiconductor module according to the prior art. In FIG. 9, 30 is an electrode pattern, 31 is an optical fiber, 32 is a fiber support,
33 is an insulating film, 34 is a guide, and 35 is a substrate.

The illustrated prior art shows a structure for coupling a plurality of light emitting / receiving elements and an optical fiber. This parallel transmission optical semiconductor module has a substrate 35 that supports a plurality of light emitting or light receiving elements (not shown) arranged in an array.
And an optical fiber support portion 32 for holding an array-shaped optical fiber 31 having an array pitch equal to that of the element, the end surface of which side is optically coupled to the element being obliquely cut at about 45 degrees. An insulating film 33 and a guide 34 are provided between the substrate 35 and the optical fiber supporting portion 32 in order to make the optical axes substantially coincide with each other and superimpose the optical fibers.

In this prior art, optical elements are arranged in an array on a flat substrate, and the optical elements and the optical fibers whose light entering and exiting directions are the vertical direction and whose end faces are obliquely cut at about 45 degrees are provided. It is configured to combine and.

In the prior art, since the optical axis can be adjusted by the size of the guide of the optical fiber supporting portion, the guide is made to have a desired size in advance.
The pitch of the optical fiber and the positional relationship between the guide provided on the optical fiber support and the optical fiber are configured to match the array pitch of the optical element and the positional relationship between the guide groove provided on the substrate and the optical element, respectively. Has been done.

Therefore, in the prior art, the optical axis can be adjusted only by sliding the optical fiber supporting portion along the guide groove, and the clearance between the members for adjusting the optical axis can be adjusted.
It is characterized in that it does not require a space for fixing members and can reduce its size.

[0008]

However, since the prior art described above is a pigtail type module with an optical fiber array, the joint portion between the optical fiber array and the optical fiber support portion becomes an obstacle to hermetically seal the entire module. Is difficult, and as a result, the life of the light emitting / receiving element or IC mounted in the module cannot be secured,
In addition, there is a problem that corrosion cannot be prevented.

An object of the present invention is to solve the above-mentioned problems of the prior art and to secure the life of an IC including a light emitting / receiving element and a circuit for driving the light emitting / receiving element, and
An object of the present invention is to provide an optical semiconductor module capable of preventing such corrosion.

[0010]

According to the present invention, the object is to connect a plurality of light emitting and receiving elements and a plurality of optical fibers through a lens array instead of the conventional direct connection. This is achieved by arranging and fixing a plurality of light emitting / receiving elements and a lens array in the same case so as to have a light transmission relationship, and forming a package in which the entire case is hermetically sealed.

Further, the object is to make ferrules of the tips of a plurality of optical fibers, and further to hermetically store the ferrule in a metallic package,
The case and the package are aligned so that they have a light transmission relationship on the same substrate, and further, by soldering or welding on the substrate while maintaining the light transmission relationship,
This is achieved by fixing these.

[0012]

According to the present invention, a package having a case in which a plurality of light emitting and receiving elements and a lens array are mounted and which is hermetically sealed,
Since the package that holds multiple optical fibers is separated, the entire module can be hermetically sealed even when multiple light emitting / receiving elements and multiple optical fibers are coupled. It is possible to secure the life of the IC that constitutes the circuit that drives the element or the light emitting / receiving element, prevent corrosion, and provide the optical semiconductor module with a stable function.

[0013]

Embodiments of an optical semiconductor module according to the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a perspective view of a simplified essential part showing the configuration of the first embodiment of the present invention, FIG. 2 is a perspective view showing the configuration of a multicore semiconductor laser package, and FIG. 3 is a multicore fiber array package. It is a perspective view which shows the structure of. 1 to 3, 1 is a semiconductor laser array, 2 is a semiconductor laser array submount, 3 is an IC array, 4 is a case, 5 is a lid, 6 is an alignment substrate, 7 is a lead terminal, 8 is a ferrule package. , 9 is a fiber array, 10 is a block, 11 is a lens array, 12 is a lens array holder,
13 is a fiber array ferrule. The first embodiment of the present invention shown in FIGS. 1 to 3 is a multicore semiconductor laser array module using a semiconductor laser array.

In FIGS. 1 and 2, the laser light emitted from the semiconductor laser array 1 is combined with the lens array 11 arranged in optical transmission relation with the semiconductor laser array 1, and as shown in FIG. The optical fiber array ferrule 13 incorporated in the ferrule package 8 as an optical fiber array holder is coupled so as to have an optical transmission relationship, and propagates through the optical fiber array 9.

In a multi-core semiconductor laser package containing the semiconductor laser array 1 and the like, as shown in FIG. 2, a lens array 11 and a lens array holder 12 are hermetically sealed with a low melting point glass or solder. Further, the lens array holder 12 and the case 4 made of metal or the like are hermetically sealed with solder or the like, while the upper surface of the case 4 is hermetically sealed with the lid 5 by seam welding or solder fixing. An electric signal is input to and output from the lead terminal 7.

Next, an example of a method of assembling the module configured as described above will be described.

First, the submount 2 having the IC 3 and the semiconductor laser array 1 mounted thereon is fixed to the upper surface of the block 10 by soldering and wire bonding is performed. In this case, a wiring pattern is formed on the upper surface of the block 10, and dummy lead terminals are formed on the patterns at both ends.

On the other hand, the lens array holder 1 to which the lens array 11 is fixed with a low melting point glass or solder or the like.
2 is fixed to the side of the case 4 opposite to the surface on which the lead terminals 7 are provided with solder or the like with a predetermined accuracy.

Next, the block 10 described above is placed inside the case 4, and power is supplied from the dummy lead terminals so that both ends of the semiconductor laser array 1 emit light. At this time,
The laser light passing through the lenses at both ends is observed by a vidicon camera, and the semiconductor laser array is aligned by the following procedure.

(1) The vidicon camera is focused on the end surface of the array lens.

(2) The position of the block 10 is adjusted so that the light intensity on the end surface of the array lens is uniform at both ends.

(3) After the completion of this adjustment, the block 10 and the inner surface of the case 4 are fixed to each other by soldering.

After the semiconductor laser array is aligned as described above, the dummy lead terminals are removed, and the lid 5 is seam-welded or solder-fixed onto the case 4 in an inert gas atmosphere to hermetically seal the package. Stop.

Next, the multi-core semiconductor laser package and the multi-core fiber array package shown in FIG. 3 (the tip of the optical fiber array is made into a ferrule, and the ferrule is further inserted into a metal housing and fixed at a predetermined position. Of the semiconductor laser array on the common substrate 6 while monitoring the light of the semiconductor laser array, and after the alignment is completed,
The two packages are fixed on the substrate 6 with solder or the like.

As described above, the multicore semiconductor laser module according to the first embodiment of the present invention shown in FIG. 1 can be formed.

According to the first embodiment of the present invention described above,
Since the step of hermetically sealing and the step of positioning can be performed separately, and the light emitting / receiving element or the IC that constitutes the circuit for driving the light receiving / receiving element can be securely sealed with these elements. It is possible to secure the life of the element and the IC and prevent corrosion.

FIG. 4 is a perspective view showing the configuration of the second embodiment of the present invention. In FIG. 4, 14 is a case integrated with the alignment substrate, and other reference numerals are the same as those in FIGS.

The second embodiment of the present invention is constructed by integrally forming the case 4 in which the multi-core semiconductor laser package is formed and the alignment substrate 6 in the first embodiment of the present invention described above. Other configurations are the same as those of the first aspect of the present invention described above.
The same as the embodiment of

The same effects as described above can be obtained by the second embodiment of the present invention as described above.

FIG. 5 is a perspective view showing the configuration of the third embodiment of the present invention, FIG. 6 is a sectional view of an optical fiber collimating package, and FIG. 7 is a perspective view showing the configuration of a block on which a light emitting / receiving element is mounted. FIG. 8 is a perspective view showing the structure of a case for a wavelength division multiplexing transmission / reception module in which a flat optical waveguide and a block are mounted. 5 to 8, 15 is a semiconductor laser, 16 is a semiconductor laser submount, 17 is a photodiode, 18 is a photodiode submount,
Reference numeral 19 is a block, 20 is a planar optical waveguide type multiplexer / demultiplexer, 21
Is a common waveguide, 22 is a multiplexing waveguide, 23 is a demultiplexing waveguide,
Reference numeral 24 is a wavelength multiplexing transmission / reception module case, 25 is an optical fiber holder, 26 is a single-core optical fiber, 27 is a lens,
28 is a single-core ferrule, 29 is a flat optical waveguide insertion port, and other reference numerals are the same as those in FIG.

The third embodiment of the present invention shown in FIGS. 5 to 8 is a wavelength division multiplexing transmission / reception module using a semiconductor laser, a photodiode and a planar optical waveguide.

In FIGS. 5 and 6, the light of wavelength λ1 emitted from the semiconductor laser 15 propagates through the combining waveguide 22 and the common waveguide 21, passes through the lens 27 built in the optical fiber holder 25, and the optical fiber. 26, and is propagated to the other module. On the other hand, the light of wavelength λ2 that has propagated through the optical fiber 26 passes through the lens 27, further passes through the common waveguide 21 and the demultiplexing waveguide 23, and the photodiode 1
It is incident on 7.

Next, an example of the method of assembling the module according to the third embodiment of the present invention will be described with reference to FIGS.

First, as shown in FIG. 7, the semiconductor laser 1
After the die 5 and the photodiode 17 are die-bonded to their dedicated submounts 16 and 18 by soldering, these are arranged so as to have a predetermined distance (distance between the multiplexing waveguide 22 and the demultiplexing waveguide 23). Submount 16, 1
8 is fixed to the block 19 by soldering, and a dummy electrode is provided so that power can be supplied to the semiconductor laser 15.

On the other hand, the ferrule 28 provided with the optical fiber 26 is inserted and fixed inside the optical fiber holder 25 containing the lens 27 until the tip thereof comes into contact with the lens.

Next, the planar optical waveguide type multiplexer / demultiplexer 20 having metallized Ni, Cu or the like so that both sides and side surfaces can be soldered in advance is used as a planar optical waveguide insertion port 29 shown in FIG. And fix with solder.

Finally, the block 19 is put in the case 24 to adjust the position. This position adjustment is block 1
9 is held by a dedicated jig, and while the semiconductor laser 15 is emitting light, the planar optical waveguide type multiplexer / demultiplexer 20 and the semiconductor laser 15
Are in optical transmission relationship with each other, and at the same time, the optical fiber holder 25 is in optical transmission relationship with the planar optical waveguide 20 on the substrate of the case 24. After this adjustment, the block 19 and the optical fiber holder are fixed in the case 24 and on the substrate of the case 24 by soldering while maintaining the above-mentioned optical transmission relationship. After the fixing, the lid 5 is covered with the case 24 in an inert gas atmosphere and sealed and fixed by seam welding or the like.

As described above, the semiconductor laser module according to the third embodiment of the present invention can be formed, and in this case, the same effect as that of the above-described first embodiment of the present invention can be obtained. it can.

In the above-mentioned third embodiment of the present invention,
As the planar optical waveguide 20, one having a light switching function, one having a light branching function, or light multiplexing,
It is also possible to use one having a function of branching and branching.

[0041]

As described above, according to the present invention, it is possible to secure the service life of an IC including a light emitting / receiving element and a circuit for driving the light emitting / receiving element, and prevent corrosion of these. It is possible to obtain an optical semiconductor module that can be manufactured.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a first exemplary embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a multi-core semiconductor laser package.

FIG. 3 is a perspective view showing a configuration of a multi-core fiber array package.

FIG. 4 is a perspective view showing a configuration of a second exemplary embodiment of the present invention.

FIG. 5 is a perspective view showing a configuration of a third exemplary embodiment of the present invention.

FIG. 6 is a cross-sectional view of an optical fiber collimated package.

FIG. 7 is a perspective view showing a configuration of a block on which a light emitting / receiving element is mounted.

FIG. 8 is a perspective view showing a configuration of a case for a wavelength division multiplexing transmission / reception module in which a planar optical waveguide and a block are mounted.

FIG. 9 is a perspective view showing a structure of an optical semiconductor module according to a conventional technique.

[Explanation of symbols]

 1 Semiconductor Laser Array 2 Submount for Semiconductor Laser Array 3 IC Array 4 Case 5 Lid 6 Positioning Substrate 7 Lead Terminal 8 Ferrule Package 9 Fiber Array 10 Block 11 Lens Array 12 Lens Array Holder 13 Fiber Array Ferrule 14 Integrated with Positioning Substrate Case 15 Semiconductor laser 16 Semiconductor laser submount 17 Photodiode 18 Photodiode submount 19 Block 20 Planar optical waveguide type multiplexer / demultiplexer 21 Common waveguide 22 Multiplexing waveguide 23 Demultiplexing waveguide 24 Wavelength multiplex transceiver module Case 25 Optical fiber holder 26 Single-core optical fiber 27 Lens 28 Single-core ferrule 29 Plane optical waveguide insertion hole 30 Electrode pattern 31 Optical fiber 32 Fiber support 33 Insulation 34 Guide 35 board

Claims (6)

[Claims] 1. An optical semiconductor module comprising a package having a light emitting / receiving element mounted therein, and having a function of transmitting, receiving, or transmitting / receiving an optical signal, wherein the package is
In the same case, a plurality of light emitting / receiving elements and a plurality of lenses are arranged in the same case so as to have a light transmission relationship in advance, and the entire case is hermetically sealed. Positioning of a plurality of optical fibers and the package that are coupled so as to have a light transmission relationship is performed on the same plane substrate, while maintaining the light transmission relationship between the plurality of lenses and the plurality of optical fibers, An optical semiconductor module, wherein the package and the plurality of optical fibers are fixed on the substrate. 2. The optical semiconductor module according to claim 1, wherein the substrate and a case forming the semiconductor package are integrated. 3. An optical semiconductor module having a package having a light emitting / receiving element mounted thereon, having a function of transmitting, receiving, or transmitting / receiving an optical signal, wherein the package is:
In the same case, the multiplexing optical waveguide of the planar optical waveguide having the multiplexing / demultiplexing function and the light emitting element, and the demultiplexing optical waveguide and the light receiving element are arranged and fixed so as to have an optical transmission relationship. , And the entire case is hermetically sealed,
The optical fiber holder to which the lens coupled to the common optical waveguide of the planar optical waveguide is fixed, and the package are aligned with each other on the substrate provided integrally with the case. The optical fiber holder is fixed on the substrate while maintaining the optical transmission relationship between the common optical waveguide of the planar optical waveguide and the lens fixed to the optical fiber holder. Semiconductor module. 4. The optical semiconductor module according to claim 3, wherein the planar optical waveguide has a light switching function. 5. The optical semiconductor module according to claim 3, wherein the planar optical waveguide has a light branching function. 6. The optical semiconductor module according to claim 3, wherein the planar optical waveguide has a function of multiplexing, demultiplexing, and branching light.