KR20030094466A - Optical Module with Multiport - Google Patents

Abstract

PURPOSE: A multiport type optical module is provided to minimize the size of a module and maximize the capacity of optical transmission by integrating a plurality of transmitting modules or receiving modules. in a single package. CONSTITUTION: A multiport type optical transmitting module comprises an integrated module package(121), substrates, an optical waveguide(110), and an electrical connection unit(128). A condensing unit is installed at the front side of the integrated module package(121). The substrates is attached to the lower surface of the chamber of the integrated module package(121). The optical waveguide(110), located at the front of the substrates, is attached to the lower surface of the integrated module package(121). The electrical connection unit(128) is formed at the back of the integrated module package(121).

Description

Optical Module with Multiport

The present invention relates to a multi-port type optical module, and more particularly, to a multi-port type optical module implemented to integrate a plurality of transmitting modules or receiving modules in one package to reduce the size of the module and increase the optical transmission capacity. It is about.

With the advent of the information age, there is a need for an optical module using light capable of transmitting a large amount of information. Among them, the optical module using light is required to have a high reliability of not only having excellent characteristics of the module itself but also maintaining its characteristics for a long time. Low prices must be maintained to facilitate the dissemination of optical modules for the implementation of fiber to the home (FTTH). In particular, as the capacity of the optical transmission system increases, efforts are being made to increase the number of modules that can be mounted per unit area by reducing the size of the optical module mounted in the optical transmission system.

In general, active alignment methods (such as laser diodes and photodiodes) of optical modules and optical fibers for converting an electrical signal into an optical signal or an electrical signal are classified into an active alignment method and a passive alignment method. Two methods of passive alignment method are used.

In the process of aligning the active element and the optical fiber, the active alignment method is a method of finding the position where the light output is best while moving finely by using a device having a resolution of 占 퐉 unit or less, which requires a lot of time, resulting in poor productivity. In addition, it is difficult to reduce the cost of the optical module because additional components are required to perform the active alignment method.

Passive alignment is a method of accurately aligning the active element and the optical fiber without injecting current into the active element, where the position of the optical fiber is exactly aligned and the position of the active element is exactly aligned in the step before the process of aligning the optical fiber Only the best light output can be obtained.

Optical modules, which are mainly manufactured until now, are manufactured by active sorting method using expensive equipment that can control up to a unit of μm or less in the process of arranging optical fibers. This has the disadvantage of being expensive and lowering productivity.

In addition, in order to transmit a larger amount of information, existing systems had to continuously increase the number of optical transmission or optical reception modules. However, the module causes an increase in the area occupied by the system, and as a result, due to the limitations that the system can accommodate, continuous mounting is impossible, and thus, there is a problem in that no additional transmission capacity can be expected.

Accordingly, an object of the present invention is to provide a multi-port type optical module capable of miniaturizing module size and increasing optical transmission capacity by integrating a plurality of transmission modules or receiving modules in one package.

1A and 1B are diagrams showing the configuration of a substrate constituting an optical transmission module after and before attachment of an active element, respectively.

Figure 1c is a bottom view of the substrate constituting the optical transmission module

2A is a planar optical waveguide having a plurality of channels.

2B is a bottom view of the optical waveguide.

Figure 3a, 3b is a block diagram of the optical transmission module of the present invention before and after attaching the substrate, respectively

4A and 4B are schematic diagrams of substrates constituting the light receiving module before and after the active element is attached, respectively.

4C is a bottom view of a substrate constituting the light receiving module

5A and 5B are diagrams illustrating a light receiving module of the present invention before and after attaching a substrate, respectively.

Figure 6 is a block diagram of a first embodiment of the electrical connection means of the present invention

Figure 7 is a block diagram of a second embodiment of the electrical connection means of the present invention

8 is a configuration of a third embodiment of the electrical connection means of the present invention

* Description of Signs of Main Parts of Drawings *

101,131: substrate 102: light reflecting groove

103: light emitting element 104,133: light receiving element

109,138: groove 110: optical waveguide

111: waveguide 121,121 ': package

123,123 ': Peruvian 122,122': Guide pipe

124,124 ': optical fiber 126a, 126b, 146a, 146b: protrusion structure

128, 128 ', 145: electrical connection means 152: external circuit board

The present invention provides an optical transmission module including a substrate having an active element attached to a predetermined position, a light converging means for transmitting light generated from the light emitting element to an optical fiber, and a package including an electrical connection means between the active element and an external circuit board. To

At least two substrates attached in parallel to the bottom of the package,

An optical waveguide including a waveguide composed of an optical input terminal and a single optical output terminal provided in the same manner as the number of light emitting devices installed on the substrate is attached to the bottom surface of the package,

The optical input terminal is located in front of the light emitting unit of the light emitting device attached to the plurality of substrates, the optical output terminal includes a multi-port type optical transmission module, characterized in that located on the same axis as the optical fiber.

In another aspect, the present invention preferably has a protrusion structure having a predetermined shape for attachment of the substrate and the optical waveguide to the bottom surface of the package chamber, and has a recess to match the respective protrusion structures to the bottom of the substrate and the optical waveguide. It includes a multi-port type optical transmission module to achieve a manual alignment by the attachment of the negative.

Hereinafter, the contents of the present invention will be described in more detail with reference to preferred embodiments as shown in FIGS. 1A to 3B.

According to the drawing illustrated as a preferred embodiment of the present invention, the multi-port type optical transmission module includes an integrated module package 121 having a light collecting means on the front surface, and at least two substrates attached to an inner chamber bottom surface of the package ( 101, and an optical waveguide 110 positioned in front of the substrate and attached to the bottom of the package, and electrical connecting means 128 formed behind the package.

Condensing means constituting the embodiment is a lens insertion hole (not shown) and a transmission lens (not shown) formed in the front of the package, the hollow is installed in communication with the lens insertion hole and the transmission Peru wool 123 is inserted The transmission guide pipe 122 in which the part 122a was formed is included.

In general, the transmitting lens may be implemented as a ball lens, and the light from the output end O of the optical waveguide 110 may be pre-calculated in the lens insertion hole so that the light from the output terminal O is focused on the core of the optical fiber 124 in the transmitting Peru wool 123. It is fixed in position.

The transmission guide pipe 122 has a hollow portion 122a into which the Peru wool 123 in which the optical fiber 124 is mounted is inserted. The shape of the Peruvian wool is not particularly limited, but preferably, when the Peruvian wool has a cylindrical shape, the inner diameter of the hollow portion 122a substantially coincides with the outer diameter of the Peruvian wool even when the Peruvian wool is inserted in an arbitrary direction. Make sure the light is focused exactly on the core.

The package 121 is not particularly limited in terms of materials, but generally, ceramic materials, metals (including alloys), resins, and equivalent materials may be used. The bottom surface of the package chamber is preferably provided with protrusion structures 126a and 126b having a predetermined shape formed to fix the substrate 101 and the optical waveguide 110, and the upper surface of the package includes an opening and a cover for introduction of the substrate. 129 is provided.

The protrusion structure 126a formed on the bottom surface of the package inner compartment is a means for fixing the substrate having a height and a position adjusted in advance to an accurate position so that the light emitting device 103 can inject light into the input terminal I of the waveguide 111. Is provided.

In addition, the projection structure 126b is a means for fixing the optical waveguide in which the height and the position is pre-adjusted so that the light coming from the output end (O) of the waveguide 111 accurately enters the optical fiber 124 through the transmitting lens. Is provided.

The shape of the protrusion structures 126a and 126b is not particularly limited. Thus, a mesa structure having a V-groove or a sidewall inclined at a predetermined angle may be included to facilitate attachment of the substrate.

The substrate 101 is preferably a semiconductor substrate, for example, a silicon material may be used. The light emitting device 103 is attached to the front of the upper surface 101a of the substrate 101 whose height is adjusted in advance so that optimal light may be incident on the lens, and is attached by the solder 105 coated on the rear of the light emitting device. A monitor light receiving element 104 for sensing the intensity of light emitted from the rear surface is attached by the solder 106, and a light reflecting groove 102 having a predetermined shape is provided under the light receiving element. The light reflecting groove 102 reflects light irradiated from the rear surface of the light emitting element 103 and enters the surface of the light receiving element 104. Preferably, the light reflecting groove 102 includes a V-shaped groove having a predetermined width and depth determined by the crystallinity of the substrate, but is sufficient to perform the above function. It is not limited to this.

In addition, the substrate 101 has a predetermined shape such that the light emitting element 103 and the light receiving element 104 are electrically connected to an electrical connection means (a means for electrically connecting the active element and the external circuit board, which will be described later). Pattern 108 is provided. In addition, the active element is connected to the pattern by the gold wire 107.

The light emitting device 103 may typically use a laser diode. Preferably, the bottom portion of the laser diode may be provided with a concave-convex structure (not shown) having a predetermined height and size due to the orientation determined by the crystallographic characteristics of the single crystal. In this case, a predetermined height and size are also given to a predetermined position of the substrate 101 to which the light emitting device 103 is attached, and a concavo-convex structure having a corresponding structure is given to the substrate 101 without introducing a special alignment method. The light emitting device 103 can be seated in the correct position.

The photodetector 104 for a monitor can typically use a photodiode. The light receiving element 104 is used to control the intensity of light irradiated from the front surface of the light emitting element 103 by sensing the intensity of light incident on the surface. In this case, a specific control circuit may be implemented on an external electronic circuit board, and details thereof will be omitted as will be apparent to those skilled in the art.

The substrate 101 is provided with a recess 109 that is matched in shape and size with the protrusion structure 126a provided at the bottom portion 101b of the package inner chamber bottom portion.

In front of the light emitting device 103, an optical waveguide 110 for attaching light emitted from the light emitting device is attached to the bottom surface of the package. The optical waveguide 110 includes a multi-channel waveguide 111 having an input terminal I and a single output terminal O having the same number of light emitting devices.

The optical input terminal I is positioned in front of the light emitting unit of the light emitting elements attached to the plurality of substrates, and the optical output terminal O is located at substantially the same axis as the optical fiber.

The optical waveguide shown as a preferred embodiment of the present invention is a planar four-channel wavelength division multiplexing (CWDM) filter, which is designed to transmit light of different wavelengths through each channel. Specific implementation procedures of these optical waveguides are already known and conventional silica based Planar lightwave circuit (PLC) processes such as flame hydrolysis deposition (FHD), photolithography, and reactive ion etching (RIE) processes are used. (Y. Inoue, M. Oguma, T. Kitoh, M. Ishii, T. Shibata and Y. Hibino, OFC 2002 conference, p. 75).

The optical waveguide 110 is preferably provided with a groove portion 112 that matches in shape and size with the protrusion structure 126b provided in the package inner chamber bottom portion at the bottom portion.

Specific methods for forming the recesses 109 and 112 of the substrate and the optical waveguide are as already known and are not particularly limited since all conventional etching methods known to date can be used.

As described above, manual alignment may be simply performed through mutual bonding between the recessed portions of the substrate and the optical waveguide and the protrusion structure of the bottom surface of the package. That is, the final position of the light emitting device is positioned on substantially the same axis so that light is optimally incident on the input terminal I of the waveguide, and the output terminal O of the waveguide is precisely positioned at the core of the optical fiber 124 in the Peru wool 123. Since it is implemented by calculating the height and position in advance so as to concentrate, it is possible to simply perform a manual alignment only by the one-step process of inserting and fixing the Peru wool 123 in the package.

The present invention relates to a light receiving module including a substrate having a light receiving element attached to a predetermined position, a light collecting means for transferring light from an optical fiber to the light receiving element, and a package including electrical connection means between the light receiving element and an external circuit board. In

At least two substrates attached in parallel to the bottom of the package,

An optical waveguide including a waveguide including an optical output terminal and a single optical input terminal provided in the same number of light receiving elements installed on the substrate is attached to the bottom surface of the package,

The optical output terminal is located in front of the light receiving portion of the light receiving element attached to the plurality of substrates, the optical input terminal includes a multi-port type optical receiving module, characterized in that located on the same axis as the optical fiber.

In another aspect, the present invention preferably has a protrusion structure having a predetermined shape for attachment of the substrate and the optical waveguide to the bottom surface of the package chamber, and has a recess to match the respective protrusion structures to the bottom of the substrate and the optical waveguide. It includes a multi-port type optical receiving module that forms a manual alignment by the attachment of the negative.

Hereinafter, with reference to a preferred embodiment of the optical receiving module shown in Figures 4a to 5b will be described in more detail.

According to the drawing shown as a preferred embodiment of the present invention, the multi-port type optical receiving module includes an integrated module package 121 'having a light collecting means on the front side and at least two or more substrates attached to an inner chamber bottom of the package. 131, an optical waveguide 110 positioned in front of the substrate and attached to the bottom of the package, and electrical connection means 128 formed at the rear of the package.

Condensing means constituting the embodiment is installed in communication with the lens insertion hole (not shown) and the receiving lens (not shown) formed in the front of the package, and the lens insertion hole is inserted into the receiving Peru wool 123 ' And a receiving guide pipe 122 'having a hollow portion 122a' formed therein.

In general, the receiving lens may be implemented as a ball lens, and the light from the optical fiber 124 ′ is fixed to a pre-calculated position in the lens insertion hole so that light is concentrated at the input terminal I of the optical waveguide 110.

The receiving guide pipe 122 'has a hollow portion 122a' into which the Peru wool 123 'into which the optical fiber 124' is mounted is inserted. The shape of the Peruvian wool is not particularly limited, but preferably, when the Peruvian wool has a cylindrical shape, the inner diameter of the hollow portion 122a 'is substantially coincident with the outer diameter of the Peruvian wool even when the Peruvian wool is inserted in an arbitrary direction. Light is concentrated precisely on the light receiving portion of 133.

The inner chamber bottom of the package 121 'is provided with protrusion structures 146a and 146b having a predetermined shape formed to fix the substrate 131 and the optical waveguide 110. An opening for introducing the substrate is provided on the upper surface of the package 121'. A cover 129 'is provided.

The protrusion structure 146a formed on the bottom surface of the package inner compartment is a means for accurately fixing the substrate whose position and height are adjusted in advance so that the light emitted from the output terminal O of the waveguide 111 is located at the light receiving portion of the light receiving element 133. Is provided.

In addition, the protrusion 146b accurately measures the optical waveguide whose height and position are preset so that light from the optical fiber 124 'inserted into the Peru wool 123' is incident on the input terminal I of the waveguide 111 accurately. It is provided as a means for fixing in position.

The protrusion structure is not particularly limited in shape. Therefore, a mesa structure having a V-groove or a sidewall inclined at a predetermined angle may be included therein so as to easily attach the substrate.

The substrate 131 is not particularly limited, but a ceramic material may be used. The substrate 131 has an N-electrode metal pattern 134 and a P-electrode metal pattern 136 on which a light receiving element 133 can be attached. The light receiving element 133 is attached by a pre-coated solder 135 and connected to the pattern 136 by a gold wire 137.

The light receiving element 133 is preferably a photodiode, and the light receiving element 133 is fixedly aligned at a predetermined position on the substrate 131 so as to substantially face the center axis of the output terminal O of the waveguide.

The substrate 131 is provided with a recess 138 on the bottom portion 131b to mate with the protrusion structure 146a provided on the bottom surface of the package interior chamber. The recess is not particularly limited because the recess may be manufactured through a mold or may be manufactured by performing a separate cutting process.

Since the configuration of the optical waveguide is substantially the same as in the case of the optical transmission module described above, it will be omitted below. In this case, however, the optical waveguide has a difference in that light of multiple wavelengths multiplexed to a single input terminal I is separated for each channel and transmitted to individual output terminals I.

As described above, manual alignment may be simply performed through mutual bonding between the recessed portions of the substrate and the optical waveguide and the protrusion structure of the bottom surface of the package. That is, the light receiving element 133 is pre-adjusted in position and height so that the light coming from the output end O of the waveguide at the front of the substrate is concentrated to the light receiving portion, and the input end I of the waveguide is formed of an optical fiber in the Peru wool 123 '. Since the height and the position of the light emitted from the 124 'are fixed in a predetermined way, the manual alignment is simply performed by only one step of inserting and fixing the Peru wool 123' into the package 121 '. It is possible.

The electrical connection means performs an interface function for electrically connecting the active element inside the package and the circuit board outside the package, and includes not only conventional fin structures but also structures as the following preferred embodiments.

The electrical connection means according to the first side of the present invention includes a connector 128 structure integrally formed on one surface of the package as shown in FIG. The connector 128 has contact portions C and C ′ electrically connecting the internal active elements 103 and 104 and the external circuit board 152 to both ends thereof. Preferably, the connector 128 has an active element between the two contacts. A matching circuit unit 143 for implementing impedance matching is provided. In addition, the contact portion C ′ with the external circuit board 152 is easily inserted into the groove 151 of the external circuit board by protruding horizontally from one surface of the package to the outside.

The matching circuit unit 143 may be implemented on the substrate 142 having a constant dielectric constant (not described with reference numerals 141 and 144, respectively, indicating upper and lower insulating plates). Preferably, a predetermined protection circuit capable of minimizing signal interference and the like is provided. It may be provided together. The detailed circuit structure of the matching circuit unit 143 may be appropriately selected by those skilled in the art according to required characteristics (for example, the circuit structure may be determined according to the permittivity of the substrate to be used). No.

In addition, the constant voltage circuit portion to the protection circuit portion can be implemented in a multilayer structure, of course. According to the configuration described above, problems such as signal loss and mutual interference between signals can be minimized, so that the present invention can be applied as a high speed device of 2.5Gbps or more.

In addition, the electrical connection means according to the second aspect of the present invention includes a socket 128 'structure integrally formed on one surface of the package as shown in FIG. The socket 128 'has contact portions C and C' electrically connected to the internal active elements 103 and 104 and the external circuit board 152 at both ends thereof, and preferably between the two contacts. And a matching circuit unit 143 for implementing impedance matching. In addition, the contact portion C 'with the external circuit board 152 protrudes horizontally outward from one surface of the package, so that the insertion portion 153 of the external circuit board is easily inserted into the groove of the socket structure.

In the preferred first and second side electrical connection means, the electrical contact (C, C ') and the matching circuit unit 143 may be provided on both the top, bottom or both surfaces of the connector or socket structure.

Since the description of the matching circuit unit 143 is the same as described above, a description thereof will be omitted.

The electrical connection means according to the third aspect of the present invention includes a predetermined fin structure 145 electrically connecting the active elements 103 and 104 and the external circuit board 152 to one surface of the package. The fin structure is typically implemented as a lead frame and is installed horizontally with the package bottom, unlike the conventional parallel installation in parallel to the bottom.

In the preferred embodiment of the present invention shown in Fig. 8, the pin 145 is connected to the contact point C 'through a brazing method on the lower insulating plate 142 on which the matching circuit is formed as in the first side embodiment. A structure in which the upper insulating plate 141 is laminated thereon is illustrated.

In this case, preferably, the number of pins 145 is implemented as the minimum required for use, thereby reducing the overall volume of the package. In the embodiment of the present invention by implementing the number of pins to at least four (2 in the case of a light receiving module) per board number of remarkably reduce the volume of the entire package and the pins are projected outwards in the horizontal direction from the back of the package circuit It is easy to mount to contacts 154 on the substrate.

Hereinafter, a detailed manufacturing process of the optical transmitting module will be described with reference to the embodiment shown in FIGS. 1A to 3B (however, since the manufacturing process of the optical receiving module is composed of the same process as the manufacturing process of the optical transmitting module, the optical transmission is performed here. Only the manufacturing process of the module will be described).

The integrated module package 121 is placed on a stage (not shown), and the silicon substrate 101 and the optical waveguide 110 to which the laser diode 103 and the photodiode 104 for the monitor are attached are picked up to collect the integrated module package. After moving to the inner chamber of the 121 and the inclined sidewalls formed on the bottom surface of the silicon substrate 101 and the optical waveguide 110, the bottom surface is flat rectangular grooves 109, 112 and the integrated module package 121 The silicon substrate 101 and the optical waveguide 110 are formed on the bottom surface of the package 121 for the integrated module by mesa structures 126a and 126b having inclined sidewalls that match in size and shape with the recesses formed on the bottom surface of the chamber. Seat in the correct position. At this time, a solder having a predetermined melting point is coated on the upper surfaces of the mesa structures 126a and 126b.

The stage is heated to melt the solder applied on the mesa structures 126a and 126b to fix the silicon substrate 101 and the optical waveguide 110 for transmission to the integrated module package 121 at the correct position.

The gold wire is used to connect the contact C of the connector 128 and the metal pattern 108 formed on the silicon substrate 101.

After fixing the silicon substrate 101 and the optical waveguide 110 for transmission in the integrated module package 121, the cover 129 on the integrated module package 121 is electrically welded and fixed in a nitrogen atmosphere. .

On the other hand, the hollow silicon 122a of the transmission guide pipe 122 attached to the front surface of the integrated module package 121 is seated on the inner side of the integrated module package 121 at the correct position. ) Is inserted into the transmission Peru wool 123 including the optical fiber 124 for transmission, and fixed by laser welding or the like.

In this case, the coupling form of the optical fiber may be used in the form of a receptacle or a pigtail.

According to the present invention, since it is possible to integrate a plurality of transmitting modules or receiving modules into one package, there is an effect of miniaturization of module size and increase of optical transmission capacity. In addition, it is possible to manually align a plurality of substrates and packages without driving the light emitting device or the light receiving device, and since the optical module is manufactured in a pre-arranged manner, it can be easily installed, thereby greatly reducing the time required for alignment. Can be provided.

Claims (18)

In the optical transmission module comprising a substrate having an active element attached to a predetermined position, a light converging means for transmitting the light generated from the light emitting element to the optical fiber and an electrical connection means between the active element and the external circuit board, At least two substrates attached in parallel to the bottom of the package, An optical waveguide including a waveguide composed of an optical input terminal and a single optical output terminal provided in the same manner as the number of light emitting devices installed on the substrate is attached to the bottom surface of the package, The optical input terminal is located in front of the light emitting unit of the light emitting element attached to the plurality of substrates, the optical output terminal is a multi-port type optical transmission module, characterized in that located on the same axis as the optical fiber The method of claim 1, A multiport type optical transmission module is formed on the bottom surface of the package chamber, and has a recessed portion that matches the protrusion structure on the bottom surface of the substrate and the optical waveguide, thereby achieving manual alignment by attaching the protrusion structure and the recessed portion. The method of claim 2, The projecting structure of the bottom surface of the package is a multi-port type optical transmission module, characterized in that the mesa structure having an inclined sidewall at a predetermined angle. The method of claim 1, The material of the package is a multi-port type optical transmission module, characterized in that selected from materials of ceramics, metals, resins and equivalent materials The method of claim 1, The inner diameter of the guide pipe constituting the light collecting means is a multi-port type optical transmission module, characterized in that it is configured to be in close contact with the outer diameter of the Peru wool. The method of claim 1 wherein the electrical connection means Contact portions for electrically connecting the active element and the external circuit board are respectively formed at both ends, and a constant voltage circuit portion for implementing impedance matching with the active element is provided between the both contact portions, and the contact portion with the external circuit board is formed from one surface of the package. Multi-port type optical transmission module characterized in that the connector or socket structure configured to protrude horizontally The method of claim 1 wherein the electrical connection means An electrical contact portion between the active element and the pin is formed at both ends, and an impedance matching circuit portion between the active element is provided between the both contact portions, and the pin protrudes horizontally from one surface of the package and is attached to the electrical contact portion. Multi-port type optical transmission module The method according to claim 6 or 7, Multi-port type optical transmission module, characterized in that the constant voltage circuit portion is formed on a substrate having a constant dielectric constant The method according to claim 6 or 7, Multi-port type optical transmission module, characterized in that the constant voltage circuit portion is implemented in a multi-layer structure In a light receiving module comprising a substrate having a light receiving element attached to a predetermined position, a light converging means for transmitting light from the optical fiber to the light receiving element and an electrical connection means between the light receiving element and the external circuit board, At least two substrates attached in parallel to the bottom of the package, An optical waveguide including a waveguide including an optical output terminal and a single optical input terminal provided in the same number of light receiving elements installed on the substrate is attached to the bottom surface of the package, The optical output terminal is located in front of the light receiving portion of the light receiving element attached to the plurality of substrates, the optical input terminal is a multi-port type optical receiving module, characterized in that located on the same axis as the optical fiber The method of claim 10, A multiport type optical receiving module having a protrusion structure having a predetermined shape is formed on the bottom surface of the package chamber, and having a groove portion matching the protrusion structure on the bottom surface of the substrate and the optical waveguide to form a manual alignment by attaching the protrusion structure and the groove portion. The method of claim 11, The protrusion structure of the bottom surface of the package is a mesa structure having a mesa structure having an inclined sidewall at a predetermined angle. The method of claim 10, The material of the package is a multi-port type optical receiving module, characterized in that selected from materials of ceramics, metals, resins and equivalent materials The method of claim 10, The inner diameter of the guide pipe constituting the condensing means is substantially matched to the outer diameter of the Peru wool, the multi-port type optical receiving module, characterized in that configured to be closely fixed The method of claim 10, wherein the electrical connection means Contact portions for electrically connecting the active element and the external circuit board are respectively formed at both ends, and a constant voltage circuit portion for implementing impedance matching with the active element is provided between the both contact portions, and the contact portion with the external circuit board is formed from one surface of the package. Multi-port type optical reception module characterized in that the connector or socket structure is formed to protrude horizontally The method of claim 10, wherein the electrical connection means An electrical contact portion between the active element and the pin is formed at both ends, and an impedance matching circuit portion between the active element is provided between the both contact portions, and the pin protrudes horizontally from one surface of the package and is attached to the electrical contact portion. Multi-port type optical transmission module The method according to claim 15 or 16, Multi-port type optical receiving module, characterized in that the constant voltage circuit portion is formed on a substrate having a constant dielectric constant The method according to claim 15 or 16, Multi-port type optical reception module, characterized in that the constant voltage circuit portion is implemented in a multi-layer structure