US20230418004A1 - Multi-fiber interface apparatus for photonic integrated circuit - Google Patents
Multi-fiber interface apparatus for photonic integrated circuit Download PDFInfo
- Publication number
- US20230418004A1 US20230418004A1 US18/367,777 US202318367777A US2023418004A1 US 20230418004 A1 US20230418004 A1 US 20230418004A1 US 202318367777 A US202318367777 A US 202318367777A US 2023418004 A1 US2023418004 A1 US 2023418004A1
- Authority
- US
- United States
- Prior art keywords
- substrate
- pic
- interface apparatus
- optically transmissive
- mirrors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000835 fiber Substances 0.000 title claims abstract description 267
- 239000000758 substrate Substances 0.000 claims abstract description 342
- 230000008878 coupling Effects 0.000 claims abstract description 169
- 238000010168 coupling process Methods 0.000 claims abstract description 169
- 238000005859 coupling reaction Methods 0.000 claims abstract description 169
- 239000013307 optical fiber Substances 0.000 claims abstract description 112
- 230000003287 optical effect Effects 0.000 claims abstract description 87
- 230000010354 integration Effects 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 27
- 239000000463 material Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 17
- CLODVDBWNVQLGO-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(Cl)=C1C1=C(Cl)C(Cl)=CC(Cl)=C1Cl CLODVDBWNVQLGO-UHFFFAOYSA-N 0.000 description 14
- 230000026683 transduction Effects 0.000 description 12
- 238000010361 transduction Methods 0.000 description 12
- HCWZEPKLWVAEOV-UHFFFAOYSA-N 2,2',5,5'-tetrachlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=C(Cl)C=2)Cl)=C1 HCWZEPKLWVAEOV-UHFFFAOYSA-N 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 4
- 230000013011 mating Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 208000036758 Postinfectious cerebellitis Diseases 0.000 description 2
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
- G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
Definitions
- the disclosure relates generally to apparatuses for coupling optical fibers to photonic integrated circuits.
- Israel U.S. Pat. No. 9,804,334 to Israel et al. (“Israel”) provides an optical coupler for coupling optical fibers to a PIC utilizing an optically transmissive spacer (or ‘interposer’) arranged between a substrate and the PIC, with each optical path employing a flat turning mirror as well as first and second curved mirrors that provide a double reflection expanded beam arrangement that allows for separation of optical fibers from the PIC.
- the optical fibers are positioned between a portion of the spacer and a first surface of the substrate, and the PIC is positioned on an opposing second surface of the substrate.
- the arrangement disclosed by Israel provides relaxed alignment tolerances in three dimensions while maintaining high signal efficiency.
- the disclosure relates to a multi-fiber interface apparatus for a PIC that comprises: a first optically transmissive substrate having a first face and an opposing second face; a second optically transmissive substrate having a third face and an opposing fourth face, and being configured for mountably receiving the PIC; a fiber array coupling member mounted to the first optically transmissive substrate and configured to receive a plurality of optical fibers; and at least one passive substrate alignment feature configured to align the first optically transmissive substrate and the second optically transmissive substrate to promote optical coupling between the plurality of optical fibers and the PIC.
- the fiber array coupling member comprises a plurality of optical beam turning elements and a plurality of second mirrors.
- the optically transmissive substrate comprises a plurality of electrically conductive vias extending through at least a portion of a thickness of the optically transmissive substrate.
- the plurality of optical beam turning elements comprises a plurality of beam turning mirrors. In certain embodiments, the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers are received by the fiber array coupling member.
- the plurality of optical beam turning elements comprises a plurality of beam turning mirrors. In certain embodiments, the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers is received by the fiber array coupling member.
- FIG. 1 B is a first exploded side cross-sectional view of the multi-fiber interface apparatus of FIG. 1 A with the PCB and secondary circuit member of FIG. 1 A .
- FIG. 1 C is a second, partially exploded side cross-sectional view of the multi-fiber interface apparatus of FIG. 1 A arranged over the PCB without presence of a secondary circuit member.
- FIG. 2 A is a side cross-sectional view of a multi-fiber interface apparatus according to one embodiment including first and second substrates arranged between a fiber array coupling member and a PCB, with a photonic integrated circuit (PIC) arranged within a recess defined in the PCB, and optical elements arranged in the fiber array coupling member and along a PIC/substrate interface to provide a double reflection expanded beam arrangement for optically coupling multiple fiber optical fibers to the PIC.
- PIC photonic integrated circuit
- FIG. 2 B is an exploded side cross-sectional view of the multi-fiber interface apparatus of FIG. 2 A in a state of assembly.
- FIG. 3 B is a partially exploded side cross-sectional view of a multi-fiber interface apparatus including the subassembly of FIG. 3 A , showing a PIC mounted to a lower surface of the second substrate and showing a PCB defining a recess configured to receive the PIC.
- FIG. 4 A is a partially exploded perspective view of a multi-fiber interface apparatus according to one embodiment including first and second substrates configured to be aligned with one another using vertically extending pins, with a fiber array coupling member mounted to the first substrate and with a PIC mounted to the second substrate.
- FIG. 4 B is a perspective view of the multi-fiber interface apparatus of FIG. 4 A .
- FIG. 4 C is a perspective view of the multi-fiber interface apparatus of FIG. 4 B , flipped vertically relative to the view shown in FIG. 4 B .
- FIG. 5 A is a partially exploded perspective view of the multi-fiber interface apparatus of FIGS. 4 A- 4 C and a PCB, with the second substrate and PIC received by the PCB, prior to mating of the first substrate (bearing a fiber array coupling member) with the second substrate.
- FIG. 5 C is a perspective view of a multi-fiber interface apparatus and PCB similar to those illustrated in FIGS. 5 A- 5 B with the addition of electrical terminals on the first substrate to which wires associated with the optical fibers are coupled.
- FIG. 6 is a partially exploded perspective view of a multi-fiber interface apparatus similar to that shown in FIG. 5 A , but with solder balls arranged between the second substrate and the PCB.
- FIG. 7 A is a partially exploded perspective view of a multi-fiber interface apparatus including a first substrate to which a fiber array coupling member is mounted, illustrated separately from a second substrate to which a PIC mounted to a substrate, with the first and second substrates being configured to laterally abut one another with edges thereof serving as a passive substrate alignment feature.
- FIG. 7 B is a perspective view of the multi-fiber interface apparatus of FIG. 7 A following assembly, with lateral edges of the first and second substrates abutting one another to provide edge alignment utility.
- FIG. 7 C is a perspective view of the multi-fiber interface apparatus of FIG. 7 B , flipped vertically relative to the view shown in FIG. 7 B .
- FIG. 9 is a partially exploded perspective view of a fiber array coupling member and a substrate of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of turning mirrors, and a plurality of curved mirrors.
- FIG. 10 is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of beam collimating elements, a plurality of flat turning mirrors, and a plurality of curved mirrors.
- the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of beam collimating elements, a plurality of flat turning mirrors, and a plurality of curved mirrors.
- FIG. 11 A is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers having beveled ends coated with reflective material arranged to transmit beams through the body of the fiber array coupling.
- FIG. 11 B is a side cross-sectional view of a portion of an optical fiber of FIG. 11 A having a beveled end coated with reflective material.
- FIG. 12 is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers and including a plurality of turning mirrors each including a prismatic element with a reflective surface.
- FIG. 13 is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of beam collimating elements, and a plurality of turning mirrors each including a prismatic element with a reflective surface.
- the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of beam collimating elements, and a plurality of turning mirrors each including a prismatic element with a reflective surface.
- one or more substrates and/or fiber array coupling members may be fabricated by photolithographic patterning followed by selective material removal (e.g., chemical etching, reactive ion etching, laser ablation, laser damage and etch, or other microscale removal techniques), stamping (e.g., including precision hot glass pressing) and/or other techniques, with certain features optionally provided by precision pick-and-place techniques.
- selective material removal e.g., chemical etching, reactive ion etching, laser ablation, laser damage and etch, or other microscale removal techniques
- stamping e.g., including precision hot glass pressing
- other techniques e.g., including precision hot glass pressing
- the use of features formed by lithographic patterning and removal and/or stamping may be preferable to avoid misalignment that may be increased with increasing numbers of optical fibers within an array.
- Multi-fiber interface apparatuses disclosed herein may be readily scaled to high volume and high channel count (e.g., from a single fiber to hundreds of fibers
- FIGS. 1 A to 1 C illustrate a multi-fiber interface apparatus 10 according to one embodiment having a PIC 40 recessed within a substrate (i.e., second substrate 30 ).
- the multi-fiber interface apparatus 10 includes a fiber array coupling member 12 , and first and second substrates 20 , 30 , with the second substrate 30 defining a recess 38 in which the PIC 40 is arranged. Any suitable micromolding or micromachining techniques may be used to fabricate the recess 38 .
- the recess 38 may further include raised or recessed features to promote proper alignment of the PIC 40 within the recess 38 .
- the fiber array coupling member 12 receives a plurality of optical fibers 14 (although only a single optical fiber 14 is visible in the side cross-sectional views of FIGS. 1 A to 1 C , it is to be appreciated that numerous optical fibers 14 may be arranged in a side-by-side configuration).
- the fiber array coupling member 12 also includes a plurality of beam turning elements 16 (e.g., flat turning mirrors) and a plurality of second focusing mirrors 18 (i.e., with each beam turning element 16 and associated second focusing mirror 18 being associated with a different optical fiber of the plurality of optical fibers 14 ).
- the beam turning elements 16 are arranged to redirect light from a horizontal to a vertical direction, or vice-versa.
- the plurality of first focusing mirrors 42 and/or the plurality of second focusing mirrors 18 may be replaced with a combination of a plurality of non-focusing (e.g., flat) mirrors and a plurality of focusing lenses (e.g., defined in or on the first or second substrates 10 , 20 ), as will be recognized by one skilled in the art.
- the PIC 40 includes a plurality of beam transduction regions 44 (e.g. optionally embodied in photodiodes) along a surface thereof, with the plurality of beam transduction regions 44 being configured to receive beams reflected by the plurality of second focusing mirrors 18 (and/or supply beams to the second focusing mirrors 18 to be received by the optical fibers 14 ).
- various electrical connections are provided, such as between the PIC 40 and the PCB 52 (through solder balls 68 ), between the PIC 40 and the secondary circuit member 60 (through solder ball 66 and one or more conductive vias 56 extending through the first substrate 20 ), and between the PCB 52 and the secondary circuit member 60 (through solder balls 62 , 64 and conductive vias 58 extending through the first and second substrates 20 , 30 ).
- solder balls are mentioned in various implementations described herein, it is to be appreciated that any suitable interconnection technique may be used, such as solder balls, solder bumps, electrically conductive paste, or the like.
- the second surface 36 of the second substrate 30 is arranged proximate to a first surface 54 of the PCB 52 , and an opening 32 extending between the first surface 34 of the second substrate 30 and the recess 38 enables the solder ball 66 to create a conductive path through the second substrate 30 to the PIC 40 .
- the plurality of optical fibers 14 may be arranged in a V-groove array of the fiber array coupling member 12 , which may be defined in a top surface 11 of the fiber array coupling member 12 .
- the second substrate 30 (and associated PIC 40 ) may be mounted on or over the PCB 52 , and the first substrate 20 may be attached to the second substrate 30 thereafter (e.g., after the fiber array coupling member 12 has been attached to the first substrate 20 , and after the plurality of optical fibers 14 have been coupled with the fiber array coupling member 12 ).
- the first and second substrates 20 , 30 may serve as an optical surface connector (not an end connector) that maintains a low profile.
- a plurality of first focusing mirrors 142 is additionally provided to reflect beams received from the plurality of beam turning elements 116 toward the plurality of second focusing mirrors 118 .
- the plurality of first focusing mirrors 142 is arranged in or on the second substrate 130 ; however, in certain embodiments, the plurality of first focusing mirrors 142 may be arranged in or on the PIC 140 .
- the PIC 140 also includes a plurality of beam transduction regions 144 (e.g.
- the plurality of beam turning elements 116 , the plurality of first focusing mirrors 142 , and the plurality of second focusing mirrors 118 provide double reflection expanded beam optical paths for transmitting beams 150 from the plurality of optical fibers 114 to the plurality of beam transduction regions 144 of the PIC 140 .
- the plurality of first focusing mirrors 142 and/or the plurality of second focusing mirrors 118 may be replaced with a combination of a plurality of non-focusing (e.g., flat) mirrors and a plurality of focusing lenses, with such lenses being arrangeable in and/or on the first or second substrates 120 , 130 .
- the conductive vias 156 , 158 may each be composed of via portions 156 - 1 , 156 - 2 and 158 - 1 , 158 - 2 defined in the first substrate 120 and the second substrate 130 , respectively.
- one or more surfaces of the first and/or second substrates 120 , 130 may have electrical traces arranged thereon.
- the interconnections between the via portions 156 - 1 , 156 - 2 may be recessed in the first and/or second substrates 120 , 130 so that the first and second substrates 120 , 130 can be in contact with one another after the via portions 156 - 1 , 156 - 2 are connected.
- these recesses 132 , 138 may be omitted if the second substrate 130 is spaced apart from the first surface 154 of the PCB 152 by the thickness of the solder balls 164 , 166 (e.g., with solder balls arranged on both sides of the recess 108 defined in the PCB 152 ).
- the depth of the recess 108 in the PCB 152 may be adjusted to compensate for the thickness of solder ball 166 and/or 168 disposed on one or both surfaces of the PIC 140 , to allow the solder balls 166 and/or 168 to make contact with pads (not shown) on the bottom of the recess 108 and/or on (or in) the second substrate 130 .
- the second substrate 130 (and associated PIC 140 ) may be mounted to the PCB 152 with the PIC 140 arranged in the recess 108 , and thereafter the first substrate 120 may be attached to the second substrate 130 (e.g., after the fiber array coupling member 112 has been attached to the first substrate 120 , and after the plurality of optical fibers 114 have been coupled with the fiber array coupling member 112 ).
- the first and second substrates 120 , 130 may therefore serve as mating surfaces of an optical surface connector.
- the secondary circuit member 160 may be part of the subassembly subject to being tested. After testing is complete, the first and second substrates 120 , 130 may be separated from one another, to permit the second substrate 130 and PIC 140 to be mounted to a PCB 152 , followed by coupling between the first and second substrates 120 , 130 .
- the ability to test an entire optical subassembly prior to mounting to a PCB and integration within an electro-optical system reduces subsequent quality control and troubleshooting burdens.
- various alignment structures may be used between substrates to ensure that substrates are properly positioned relative to one another for efficient and reliable optical coupling.
- face alignment structures may be placed between first and second substrates of a fiber array coupling member to promote proper alignment between substrates.
- pin guide holes or edge alignment features may be formed using ultrafast laser assisted etching process and ablation process, of which both are capable of creating mechanical features with sub-1 ⁇ m accuracy on various materials including glass.
- Lithographic fiducials may be placed on the glass substrates for marking the location of the holes/alignment features. Because of the loose lateral alignment tolerance of expanded beam coupling system, the inner diameter of pin guide holes may be larger than the diameter of the guide pins (e.g., by 2 um to 4 um) to enable a smooth fit. This is in contrast to pin tolerances for conventional single mode fiber connector, where hole-to-pin tolerances of 0.5-1.0 um are typically required.
- guide pins When guide pins are used, at least two guide pins should be provided for substrate alignment.
- guide pin diameters can be in a range of from 0.5 mm to 2.0 mm.
- guide pins disclosed herein may use a design similar to conventional multi-fiber push on (MPO) connectors, which pins have a diameter of 0.7 mm.
- guide pin holes can be flared to help passively align pins to holes during insertion.
- FIGS. 3 A and 3 B illustrate a multi-fiber interface apparatus 210 that includes a fiber array coupling member 212 as well as first and second substrates 220 , 230 .
- FIG. 3 B additionally shows a PIC 240 , as well as a PCB 252 for receiving the second substrate 230 and defining a recess 208 (e.g., recessed relative to an upper PCB surface 254 ) into which the PIC 240 is received.
- a recess 208 e.g., recessed relative to an upper PCB surface 254
- a fiber array coupling cover 206 is positioned along a lower surface 213 of the fiber array coupling member 212 and is arranged to retain the plurality of optical fibers 214 .
- a plurality of first focusing mirrors 242 is additionally provided to reflect beams received from the plurality of beam turning elements 216 toward the plurality of second focusing mirrors 218 .
- the plurality of first focusing mirrors 242 is arranged in or on the second substrate 230 ; however, in certain embodiments, the plurality of first focusing mirrors 242 may be arranged in or on the PIC 240 (of FIG. 3 B ).
- the PIC 240 also includes a plurality of beam transduction regions 244 (e.g.
- the plurality of beam turning elements 216 , the plurality of first focusing mirrors 242 , and the plurality of second focusing mirrors 218 provide double reflection expanded beam optical paths for transmitting beams (not shown) between the plurality of optical fibers 214 and the plurality of beam transduction regions 244 of the PIC 240 .
- the plurality of first focusing mirrors 242 and/or the plurality of second focusing mirrors 218 may be replaced with a combination of a plurality of non-focusing (e.g., flat) mirrors and a plurality of focusing lenses.
- FIG. 3 A shows that the conductive vias 256 , 258 may each be composed of via portions 256 - 1 , 256 - 2 and 258 - 1 , 258 - 2 defined in the first substrate 220 and the second substrate 230 , respectively.
- one or more surfaces of the first and/or second substrates 220 , 230 may have electrical traces arranged thereon.
- recesses 232 , 238 defined in the second surface 236 of the second substrate 230 may be provided to accommodate presence of solder balls 266 , 264 providing electrical connections to the PIC 240 and the substrate 252 , respectively.
- vertically extending pins may cooperate with (e.g., extending through) first and second substrates of a fiber array coupling member to promote proper alignment between substrates.
- FIGS. 4 A- 4 C provide perspective views (with FIG. 4 A being a partially exploded perspective view) of a multi-fiber interface apparatus 310 according to one embodiment that includes first and second substrates 320 , 330 configured to be aligned with one another using vertically extending pins 321 .
- a fiber array coupling member 312 is mounted to the first substrate 320 and a PIC 340 is mounted to the second substrate 330 .
- the first substrate 320 includes opposing first and second surfaces 322 , 324 , with multiple (e.g., at least two, but preferably four as illustrated) holes 329 extending between the first and second surfaces 322 , 324 , and corresponding vertical pins 321 extending through the holes 329 .
- the fiber array coupling member 312 is arranged along the first surface 322 , with optical fibers 314 received by the fiber array coupling member 312 .
- the second substrate 330 includes opposing first and second surfaces 334 , 336 , with four holes 339 extending between the first and second surfaces 334 , 336 and being configured to receive the vertical pins 321 when the first and second substrates 320 , 330 are mated to one another.
- the PIC 340 and electrical traces 337 are provided along the second surface 336 of the second substrate 330 .
- the first and second substrates 320 , 330 are fabricated of optically transmissive material (e.g., glass, silicon, etc.) to enable optical signals to be coupled through the substrates 320 , 330 between the fiber array coupling member 312 and the PIC 340 .
- optically transmissive material e.g., glass, silicon, etc.
- items such as beam turning elements, and focusing mirrors (or mirrors and focusing lenses) may provide double reflection expanded beam optical paths for transmitting beams between the optical fibers 314 and the PIC 340 , in a manner as described previously herein.
- the multi-fiber interface apparatus 310 may be mounted to a PCB 350 , and the PIC 340 may be arranged in a recess formed by the PCB 350 and/or the second substrate 330 .
- FIG. 5 A is a partially exploded perspective view of the multi-fiber interface apparatus 310 , with the second substrate 330 attached to a first surface 354 of the PCB 350 , prior to mating of the first substrate 320 to the second substrate 330 . Electrical traces of the second substrate 330 are oriented downward toward the first surface 354 of the PCB 350 .
- the fiber array coupling member 312 is arranged along the first surface 322 of the first substrate 320 with multiple optical fibers 314 received by the fiber array coupling member 312 .
- Vertically extending pins 321 extend downward from the first substrate 320 and are registered with holes 339 defined in the second substrate 330 .
- respective surfaces of the first and second substrates 320 , 330 abut one another, and double reflection expanded beam optical paths are provided for transmitting beams between the optical fibers 314 and the PIC 340 .
- a multi-fiber interface apparatus may be configured to receive electrical conductors (e.g., wires), which may be associated with optical fibers such as by emanating from a common electro-optical cable.
- electrical conductors e.g., wires
- one or more substrates of a multi-fiber interface apparatus may include electrical terminals to which electrical conductors may be coupled, such as to permit electrical connection between the conductors and a PIC and/or other electrical components.
- FIG. 5 C is a perspective view of a multi-fiber interface apparatus 310 A and PCB 350 similar to those illustrated in FIGS. 5 A- 5 B , with addition of electrical terminals 313 on the first substrate 320 to which wires 315 associated with the optical fibers 314 are coupled.
- the electrical terminals 313 may embody or include conductive vias that extend through an entire thickness of the first substrate 320 , to propagate electrical signals to and/or through the second substrate 330 of the multi-fiber interface apparatus 310 to which the first substrate 320 is attached.
- Electrical traces of the second substrate 330 are oriented downward toward the first surface 354 of the PCB 350 , with the PIC 340 being attached to the second substrate 330 and arranged within a recess formed in the PCB 350 and/or the second substrate 330 .
- the fiber array coupling member 314 is arranged along the first surface 322 of the first substrate 320 with multiple optical fibers 314 received by the fiber array coupling member 312 .
- Vertically extending pins 321 extend downward from the first substrate 320 and are registered with holes 339 defined in the second substrate 330 .
- the fiber array coupling member 312 and the first and second substrates 320 , 330 provide double reflection expanded beam optical paths for transmitting beams between the optical fibers 314 and the PIC 340 .
- the electrical terminals 313 could also be used as alignment pins to align the first and second substrates 320 , 330 .
- one or more substrates of a multi-fiber interface apparatus may be electrically coupled with a substrate (e.g., via solder balls), regardless of whether a PIC is or is not independently electrically coupled with the substrate.
- FIG. 6 is a partially exploded perspective view of a multi-fiber interface apparatus 310 B similar to that shown in FIG. 5 A , with addition of solder balls 368 arranged between the second substrate 330 and the PCB 350 B.
- the PCB 350 B may include electrical traces on the first surface 354 thereof, with the solder balls 368 being coupled to terminals associated with such traces.
- the multi-fiber interface apparatus 310 B includes a fiber array coupling member 312 mounted to the first substrate 320 , and a PIC 340 mounted to the second substrate 330 (with the PIC 340 optionally being arranged in a recess formed in the PCB 350 B and/or a recess formed in the second substrate 330 ).
- the first substrate 320 includes opposing first and second surfaces 322 , 324 , with four holes 329 extending between the first and second surfaces 322 , 324 , and vertical pins 321 extending through the holes 329 .
- the fiber array coupling member 312 is arranged along the first surface 322 , with optical fibers 314 being received by the fiber array coupling member 312 .
- the second substrate 330 includes opposing first and second surfaces 334 , 336 , with four holes 339 extending between the first and second surfaces 334 , 336 and being configured to receive the vertical pins 321 when the first and second substrates 320 , 330 are mated to one another.
- the PIC 340 and electrical traces 337 are provided along the second surface 336 of the second substrate 330 .
- the vertical pins 321 may be formed of electrically conductive material and may be used to provide electrical interconnections.
- a first substrate may be coupled with a fiber array coupling member
- a second substrate may be coupled with a PIC
- the first and second substrates may be configured to laterally abut one another, with edges thereof serving as a passive substrate alignment feature.
- FIGS. 7 A- 7 C illustrate a multi-fiber interface apparatus 410 including first and second substrates 460 , 430 configured to laterally abut one another along respective edges 465 , 435 thereof, with FIG. 7 A being a partially exploded perspective view and with FIGS. 7 B and 7 C being perspective views of the assembled multi-fiber interface apparatus 410 .
- the first substrate 460 includes a first surface 462 and an opposing second surface 464 , with an edge 465 bounding portions of the first and second surfaces 462 , 464 .
- a fiber array coupling member 412 is mounted to a portion of the first surface 462 , with a portion (e.g., a majority or major portion) of the fiber array coupling member 412 extending beyond the edge 465 of the first substrate 460 .
- Multiple optical fibers 414 are coupled with the fiber array coupling member 412 .
- the second substrate 430 includes a first surface 434 and an opposing second surface 436 , with an edge 435 bounding portions of the first and second surfaces 434 , 436 .
- Electrical traces 437 and a PIC 440 are arranged on the second surface 436 of the second substrate 430 , with the PIC 440 being illustrated as positioned over a central portion of the second substrate 430 . As shown in FIGS.
- the second substrate 430 is positioned between the PIC 440 and the portion of the fiber array coupling member 412 extending beyond the edge 465 of the first substrate 460 , with the first surface 434 of the second substrate 430 contacting the fiber array coupling member 412 , and with the respective edges 465 , 435 of the first and second substrates 460 , 430 abutting and arranged in contact with one another.
- the edge-contacting relationship between the first and second substrates 460 , 430 promotes alignment between the first and second substrates 460 , 430 .
- one or more protruding edge features of one substrate may be configured to cooperate with one or more edge surfaces of another substrate to promote passive substrate alignment between first and second substrates of a multi-fiber interface apparatus.
- FIG. 8 is a partially exploded perspective view of a multi-fiber interface apparatus 410 A similar to the apparatus 410 that shown in FIG. 7 A , but including a U-shaped first substrate 460 A to which a fiber array coupling member 412 is mounted, with the U-shaped first substrate 460 A being configured to receive and abut lateral edges of the second substrate to promote edge alignment between the respective substrates 460 A, 430 .
- the first substrate 460 A includes a first surface 462 A and an opposing second surface 464 A, with a first edge 465 A bounding portions of the first and second surfaces 462 A, 464 A.
- the second substrate 430 is to be positioned in an edge-contacting relationship with the first substrate 460 to promote alignment between the first and second substrates 460 , 430 , in which the first edges 465 A, 435 contact one another, and in which the second edges 469 A, 431 contact one another.
- the edge-contacting relationship between the first and second substrates 460 A, 430 promotes alignment between the first and second substrates 460 A, 430 in two directions.
- any suitable optical elements may be provided by or between the substrates 460 A, 430 , the fiber array coupling member 412 , and/or the PIC 440 to provide double reflection expanded beam optical paths for transmitting beams between the optical fibers 414 and the PIC 440 .
- FIG. 9 is a partially exploded perspective view of a fiber array coupling member 500 and a substrate 596 of a multi-fiber interface apparatus according to one embodiment.
- the fiber array coupling member 500 includes a body 512 having a first end 502 and a second end 503 , with the body 512 defining a V-groove array 504 that receives a plurality of optical fibers 514 .
- the substrate 596 includes vertical alignment posts 511 arranged proximate to corners thereof, with the vertical alignment posts 511 being arranged to promote alignment between the substrate 596 (e.g., a first substrate) with another substrate (e.g., a second substrate, not shown) to which a PIC may be mounted.
- the fiber array coupling member 500 may be used in conjunction with other components (e.g., a second substrate and/or PIC) providing an additional plurality of curved mirrors that may be arranged in optical paths between the beam turning elements 516 and the curved mirrors 518 to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between the optical fibers 514 and a PIC.
- FIG. 10 is a partially exploded perspective view of a fiber array coupling member 520 and a fiber array coupling cover 526 of a multi-fiber interface apparatus according to one embodiment.
- the fiber array coupling member 520 includes a body 532 having a first end 522 and a second end 523 , with the body 532 defining a V-groove array 524 that receives a plurality of optical fibers 514 .
- the fiber array coupling member 520 further includes a plurality of beam collimating elements 535 that are arranged between ends of the optical fibers 514 and a plurality of beam turning elements 536 , with the beam collimating elements 535 serving to provide beams of enhanced luminance and/or uniformity for transfer between the plurality of optical fibers 514 and the plurality of beam turning elements 536 .
- the plurality of beam turning elements 536 serve to reflect horizontal beams received from the collimating elements 535 in a vertical direction (e.g., upward according to the illustrated configuration).
- the fiber array coupling member 520 further includes a plurality of curved mirrors 538 that may provide focusing utility.
- the fiber array coupling member 520 may be used in conjunction with other components (e.g., a second substrate and/or PIC) providing an additional plurality of curved mirrors that may be arranged in optical paths between the beam turning elements 536 and the curved mirrors 538 to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between the optical fibers 514 and a PIC.
- other components e.g., a second substrate and/or PIC
- FIG. 11 A is a partially exploded perspective view of a fiber array coupling member 540 and a fiber array coupling cover 546 of a multi-fiber interface apparatus according to one embodiment.
- the fiber array coupling member 540 includes a body 552 having a first end 542 and a second end 543 , with the body 552 defining a V-groove array 544 configured to be covered by the fiber array coupling cover 546 .
- the V-groove array 544 receives a plurality of optical fibers 514 having beveled ends that are coated with reflective material 559 configured to reflect beams in a downward direction through a lower surface 555 of the body 552 . As shown in FIG.
- each optical fiber 514 includes a beveled end 556 over which the reflective material 559 is coated, wherein the reflective material 559 is arranged to reflect a horizontal beam 558 from the optical fiber 514 in a vertical (e.g., downward) direction.
- the beveled ends 556 and reflective material 559 of the optical fibers 514 shown in FIGS. 11 A and 11 B serve as beam turning elements that may be used in combination with focusing mirrors, or with flat mirrors and focusing lenses (not shown), to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between the optical fibers 514 and a PIC.
- the reflective material 559 may be omitted as being unnecessary.
- Each reflective surface 577 is arranged to reflect a horizontal beam received from a corresponding optical fiber 514 in a vertical (e.g., downward) direction through a lower surface 575 of the body 572 .
- the fiber array coupling member 560 may be used in combination with focusing mirrors, or with flat mirrors and focusing lenses (not shown), to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between the optical fibers 514 and a PIC.
- multi-fiber interface apparatuses As being intended for use with a PIC, the principles herein may be used with any optical connector intended for attaching optical emitters and/or optical detectors to one or more optical fibers.
- components that may be used with multi-fiber interface apparatuses disclosed herein include vertical cavity surface emitting lasers (VCSELs), photodiodes, integrated silicon photonic components, and the like.
- VCSELs vertical cavity surface emitting lasers
- photodiodes photodiodes
- integrated silicon photonic components and the like.
- a multi-fiber interface apparatus may include multiple rows of connectivity, in which a first plurality of optical fibers horizontally overlaps a second plurality of optical fibers, with both pluralities of optical fibers interfacing with a PIC.
Abstract
Multi-fiber interface apparatuses providing a double reflection expanded beam arrangement include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate, optical elements associated with the substrate and/or the fiber array coupling member, and one or more additional features. An additional feature according to certain implementations includes one or more passive substrate alignment features for aligning substrates to promote optical coupling between optical fibers and the PIC. In certain implementations configured for interfacing with printed circuit boards (PCBs), an additional feature includes a recess defined in an optically transmissive substrate in which a PIC is mounted, or includes a recess defined in a PCB into which the PIC is mounted. Various embodiments provide relaxed fiber alignment tolerances with simplified fabrication and system integration capabilities.
Description
- This application is a divisional of U.S. patent application Ser. No. 17/060,842 filed on Oct. 1, 2020, which claims the benefit of priority of U.S. Provisional Application Ser. No. 62/937,434 filed on Nov. 19, 2019, the content of which is relied upon and incorporated herein by reference in its entirety.
- The disclosure relates generally to apparatuses for coupling optical fibers to photonic integrated circuits.
- One of the biggest challenges with optical communication solutions today, especially for silicon photonics and data center applications, is providing low cost, low profile, robust connections. Cost is often directly proportional to the requisite alignment tolerances. Multimode fiber optical interconnections, which typically have lateral alignment tolerances in the 5-10 μm range, have historically been significantly cheaper for connectivity compared to single mode fiber optical interconnections, which typically require sub-1 μm precision. Single mode fiber, however, dominates longer distance signal transmission due to the lower cost of fiber as well as its high bandwidth transmission characteristics. If single mode connectivity were rendered more cost effective (e.g., rivaling the cost of multimode connectivity), then it is anticipated that single mode fiber would be more widely implemented for short distance applications. Silicon photonics is another driver for single mode connectivity.
- A photonic integrated circuit (PIC) is a device that integrates multiple (i.e., at least two) photonic functions. Examples of devices that may be integrated in a PIC include low loss interconnect waveguides, power splitters, optical amplifiers, optical modulators, filters, lasers, and detectors. Fiber array units having individual optical fibers positioned in grooves of a V-groove array may be used for interfacing arrays of optical fibers with PICs.
- U.S. Pat. No. 9,804,334 to Israel et al. (“Israel”) provides an optical coupler for coupling optical fibers to a PIC utilizing an optically transmissive spacer (or ‘interposer’) arranged between a substrate and the PIC, with each optical path employing a flat turning mirror as well as first and second curved mirrors that provide a double reflection expanded beam arrangement that allows for separation of optical fibers from the PIC. The optical fibers are positioned between a portion of the spacer and a first surface of the substrate, and the PIC is positioned on an opposing second surface of the substrate. The arrangement disclosed by Israel provides relaxed alignment tolerances in three dimensions while maintaining high signal efficiency.
- Despite the alignment tolerance relaxation disclosed by Israel, the disclosed arrangement has limited utility due to factors such as difficulties in fabrication and system integration. Need therefore exists in the art for interface apparatuses for PICs that address limitations associated with conventional systems.
- Multi-fiber interface apparatuses according to certain aspects include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate and configured to receive multiple optical fibers, optical elements (e.g., mirrors, lenses, collimators, and/or waveguides) associated with the substrate(s) and/or the fiber array coupling member to provide a double reflection expanded beam arrangement, and at least one additional feature promoting simplified assembly and/or integration with an optoelectronic system. In certain implementations that utilize multiple optically transmissive substrates, the at least one additional feature includes one or more passive substrate alignment features (e.g., vertical pins, face alignment structures, edge alignment structures, etc.) configured to align the substrates and promote optical coupling between the optical fibers and the PIC. Such a configuration permits one substrate to be mounted to a printed circuit board (PCB), another substrate to be mounted to a fiber array coupling member, and the respective substrates to be easily and precisely positioned relative to one another. In certain implementations configured for interfacing with PCBs, an optically transmissive substrate defines a recess into which a PIC is mounted, and/or a PCB defines a recess into which the PIC is mounted.
- In one aspect, the disclosure relates to a multi-fiber interface apparatus for a PIC that comprises: a first optically transmissive substrate having a first face and an opposing second face; a second optically transmissive substrate having a third face and an opposing fourth face, and being configured for mountably receiving the PIC; a fiber array coupling member mounted to the first optically transmissive substrate and configured to receive a plurality of optical fibers; and at least one passive substrate alignment feature configured to align the first optically transmissive substrate and the second optically transmissive substrate to promote optical coupling between the plurality of optical fibers and the PIC. The fiber array coupling member comprises a plurality of optical beam turning elements and a plurality of second mirrors.
- In certain embodiments, the plurality of second mirrors comprises a plurality of second focusing mirrors. In certain embodiments, the first optically transmissive substrate or the second optically transmissive substrate comprises a plurality of second focusing lenses arranged in an optical path between the plurality of second mirrors and the PIC. In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of first mirrors configured to reflect beams received from the plurality of optical beam turning elements toward the plurality of second mirrors. In certain embodiments, first mirrors of the plurality of first mirrors are arranged in or on the second optically transmissive substrate. In certain embodiments, the first optically transmissive substrate or the second optically transmissive substrate comprises a plurality of first focusing lenses arranged in an optical path between the plurality of first mirrors and the plurality of second mirrors.
- In certain embodiments, the first optically transmissive substrate and the second optically transmissive substrate are arranged in a stacked relationship, with the second face abutting the third face. In certain embodiments, the at least one passive substrate alignment feature comprises at least one protrusion or recess associated with the first optically transmissive substrate that is configured to mate with at least one recess or protrusion associated with the second optically transmissive substrate. In certain embodiments, the at least one passive substrate alignment feature comprises a plurality of holes defined in one or more of the first optically transmissive substrate or the second optically transmissive substrate, and a plurality of pins configured to be received by the plurality of holes.
- In certain embodiments, the first optically transmissive substrate and the second optically transmissive substrate are arranged in a laterally abutting relationship, with at least one edge of the first optically transmissive substrate abutting at least one edge of the second optically transmissive substrate. In certain embodiments, the at least one passive substrate alignment feature comprises at least one first registration feature of the first optically transmissive substrate that is configured to mate with at least one second registration feature of the second optically transmissive substrate.
- In certain embodiments, the fiber array coupling member further comprises a plurality of passive fiber alignment features (e.g., at least one V-groove array) configured to align the plurality of optical fibers with the plurality of optical beam turning elements. In certain embodiments, the plurality of optical beam turning elements comprises a plurality of beam turning mirrors. In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of beam collimating elements arranged between the plurality of optical fibers and the plurality of beam turning mirrors.
- In certain embodiments, the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers are received by the fiber array coupling member.
- In certain embodiments, the multi-fiber interface apparatus further comprises a printed circuit board defining a recess configured to receive the PIC, wherein the second optically transmissive substrate is mounted to the printed circuit board with the PIC received by the recess.
- In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of electrically conductive first vias defined through the second optically transmissive substrate, wherein the plurality of electrically conductive first vias are accessible along the third face.
- In certain embodiments, the second optically transmissive substrate comprises a substrate recess configured to receive the PIC. In certain embodiments, the multi-fiber interface apparatus further comprises a printed circuit board, wherein the second optically transmissive substrate is mounted to the printed circuit board with the PIC received by the substrate recess.
- In certain embodiments, a plurality of electrically conductive paths extends through both the first optically transmissive substrate and the second optically transmissive substrate.
- In another aspect, the disclosure relates to a multi-fiber interface apparatus for a photonic integrated circuit (PIC) that comprises: an optically transmissive substrate having a first face and an opposing second face, the optically transmissive substrate defining a recess configured to receive a PIC, with the PIC being mountable to the optically transmissive substrate; and a fiber array coupling member mounted to the optically transmissive substrate and configured to receive a plurality of optical fibers, the fiber array coupling member comprising (i) a plurality of optical beam turning elements and (ii) a plurality of second mirrors, configured to promote optical coupling between the plurality of optical fibers and the PIC when the PIC is mounted to the optically transmissive substrate.
- In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of second focusing lenses arranged in an optical path between the plurality of second mirrors and the PIC. In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of first mirrors configured to reflect beams received from the plurality of optical beam turning elements toward the plurality of second mirrors. In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of first focusing lenses arranged in an optical path between the plurality of first mirrors and the plurality of second mirrors.
- In certain embodiments, the recess is defined through the first face and through less than an entire thickness of the optically transmissive substrate; the fiber array coupling member is mounted to or along the second face of the optically transmissive substrate; and the optically transmissive substrate is configured to be received by a printed circuit board with the PIC being arrangeable in the recess between the substrate and the printed circuit board.
- In certain embodiments, the optically transmissive substrate comprises a plurality of electrically conductive vias extending through at least a portion of a thickness of the optically transmissive substrate.
- In certain embodiments, the multi-fiber interface apparatus further comprises at least one passive alignment feature configured to align the PIC with the optically transmissive substrate to promote optical coupling between the plurality of optical fibers and the PIC when the PIC is mounted to the optically transmissive substrate.
- In certain embodiments, the plurality of optical beam turning elements comprises a plurality of beam turning mirrors. In certain embodiments, the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers are received by the fiber array coupling member.
- In a further aspect, the disclosure relates to a multi-fiber interface apparatus for a PIC that comprises: a printed circuit board defining a recess; an optically transmissive substrate having a first face and an opposing second face, the optically transmissive substrate being mounted along the first face to the printed circuit board; a PIC mounted to the optically transmissive substrate and arranged within the recess; and a fiber array coupling member mounted to the optically transmissive substrate along the second face and configured to receive a plurality of optical fibers, the fiber array coupling member comprising (i) a plurality of optical beam turning elements and (ii) a plurality of second mirrors, configured to promote optical coupling between the plurality of optical fibers and the PIC.
- In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of second focusing lenses arranged in an optical path between the plurality of second mirrors and the PIC.
- In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of first mirrors configured to reflect beams received from the plurality of optical beam turning elements toward the plurality of second mirrors. In certain embodiments, the multi-fiber interface apparatus further comprises a plurality of first focusing lenses arranged in an optical path between the plurality of first mirrors and the plurality of second mirrors.
- In certain embodiments, the optically transmissive substrate comprises a plurality of electrically conductive vias extending through at least a portion of a thickness of the optically transmissive substrate.
- In certain embodiments, the multi-fiber interface apparatus further comprises at least one passive alignment feature configured to align the PIC with the optically transmissive substrate to promote optical coupling between the plurality of optical fibers and the PIC.
- In certain embodiments, the plurality of optical beam turning elements comprises a plurality of beam turning mirrors. In certain embodiments, the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers is received by the fiber array coupling member.
- In certain embodiments, the optically transmissive substrate comprises a first substrate portion defining the first face and a second substrate portion defining the second face, wherein the first substrate portion and the second substrate portion are joined to one another along a surface arranged between the first face and the second face.
- In another aspect, features of any aspects or embodiments disclosed herein may be combined for additional advantage.
- Additional features and advantages will be set forth in the detailed description which follows, and in part will be readily apparent to those skilled in the art from that description or recognized by practicing the embodiments as described herein, including the detailed description which follows, the claims, as well as the appended drawings.
- It is to be understood that both the foregoing general description and the following detailed description are merely exemplary and are intended to provide an overview or framework to understanding the nature and character of the claims. The accompanying drawings are included to provide a further understanding and are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiment(s), and together with the description serve to explain principles and operation of the various embodiments.
-
FIG. 1A is a side cross-sectional view of a multi-fiber interface apparatus according to one embodiment including first and second substrates arranged between a fiber array coupling member and a printed circuit board (PCB), with a photonic integrated circuit (PIC) arranged within a recess defined in the second substrate, and optical elements arranged in the fiber array coupling member and along a PIC/substrate interface to provide a double reflection expanded beam arrangement for optically coupling multiple fiber optical fibers to the PIC, with the multi-fiber interface apparatus mounted over a PCB and having a secondary circuit member attached thereto. -
FIG. 1B is a first exploded side cross-sectional view of the multi-fiber interface apparatus ofFIG. 1A with the PCB and secondary circuit member ofFIG. 1A . -
FIG. 1C is a second, partially exploded side cross-sectional view of the multi-fiber interface apparatus ofFIG. 1A arranged over the PCB without presence of a secondary circuit member. -
FIG. 2A is a side cross-sectional view of a multi-fiber interface apparatus according to one embodiment including first and second substrates arranged between a fiber array coupling member and a PCB, with a photonic integrated circuit (PIC) arranged within a recess defined in the PCB, and optical elements arranged in the fiber array coupling member and along a PIC/substrate interface to provide a double reflection expanded beam arrangement for optically coupling multiple fiber optical fibers to the PIC. -
FIG. 2B is an exploded side cross-sectional view of the multi-fiber interface apparatus ofFIG. 2A in a state of assembly. -
FIG. 3A is a side cross-sectional view of a multi-fiber interface apparatus subassembly according to one embodiment in a state of fabrication including first and second substrates having face alignment structures serving as substrate alignment features and including a fiber array coupling member mounted to the first substrate. -
FIG. 3B is a partially exploded side cross-sectional view of a multi-fiber interface apparatus including the subassembly ofFIG. 3A , showing a PIC mounted to a lower surface of the second substrate and showing a PCB defining a recess configured to receive the PIC. -
FIG. 4A is a partially exploded perspective view of a multi-fiber interface apparatus according to one embodiment including first and second substrates configured to be aligned with one another using vertically extending pins, with a fiber array coupling member mounted to the first substrate and with a PIC mounted to the second substrate. -
FIG. 4B is a perspective view of the multi-fiber interface apparatus ofFIG. 4A . -
FIG. 4C is a perspective view of the multi-fiber interface apparatus ofFIG. 4B , flipped vertically relative to the view shown inFIG. 4B . -
FIG. 5A is a partially exploded perspective view of the multi-fiber interface apparatus ofFIGS. 4A-4C and a PCB, with the second substrate and PIC received by the PCB, prior to mating of the first substrate (bearing a fiber array coupling member) with the second substrate. -
FIG. 5B is a perspective view of the multi-fiber interface apparatus and PCB ofFIG. 5A following assembly. -
FIG. 5C is a perspective view of a multi-fiber interface apparatus and PCB similar to those illustrated inFIGS. 5A-5B with the addition of electrical terminals on the first substrate to which wires associated with the optical fibers are coupled. -
FIG. 6 is a partially exploded perspective view of a multi-fiber interface apparatus similar to that shown inFIG. 5A , but with solder balls arranged between the second substrate and the PCB. -
FIG. 7A is a partially exploded perspective view of a multi-fiber interface apparatus including a first substrate to which a fiber array coupling member is mounted, illustrated separately from a second substrate to which a PIC mounted to a substrate, with the first and second substrates being configured to laterally abut one another with edges thereof serving as a passive substrate alignment feature. -
FIG. 7B is a perspective view of the multi-fiber interface apparatus ofFIG. 7A following assembly, with lateral edges of the first and second substrates abutting one another to provide edge alignment utility. -
FIG. 7C is a perspective view of the multi-fiber interface apparatus ofFIG. 7B , flipped vertically relative to the view shown inFIG. 7B . -
FIG. 8 is a partially exploded perspective view of a multi-fiber interface apparatus similar to that shown inFIG. 7A , including a U-shaped first substrate to which a fiber array coupling member is mounted, illustrated separately from a second substrate to which a PIC is mounted, with the U-shaped first substrate being configured to receive and abut lateral edges of the second substrate to promote edge alignment therebetween. -
FIG. 9 is a partially exploded perspective view of a fiber array coupling member and a substrate of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of turning mirrors, and a plurality of curved mirrors. -
FIG. 10 is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of beam collimating elements, a plurality of flat turning mirrors, and a plurality of curved mirrors. -
FIG. 11A is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers having beveled ends coated with reflective material arranged to transmit beams through the body of the fiber array coupling. -
FIG. 11B is a side cross-sectional view of a portion of an optical fiber ofFIG. 11A having a beveled end coated with reflective material. -
FIG. 12 is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers and including a plurality of turning mirrors each including a prismatic element with a reflective surface. -
FIG. 13 is a partially exploded perspective view of a fiber array coupling member and a fiber array coupling cover of a multi-fiber interface apparatus according to one embodiment, with the fiber array coupling member including a V-groove array receiving a plurality of optical fibers, a plurality of beam collimating elements, and a plurality of turning mirrors each including a prismatic element with a reflective surface. - The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
- It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
- Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the drawing figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the drawing figures.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including” when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
- As introduced previously, multi-fiber interface apparatuses according to certain aspects include one or more substrates being configured to mountably receive a photonic integrated circuit (PIC), a fiber array coupling member mounted to a substrate and configured to receive multiple optical fibers, and optical elements (e.g., mirrors, lenses, and/or collimators) associated with the substrate(s) and/or the fiber array coupling member to provide a double reflection expanded beam arrangement. Additional features promote simplified assembly and/or integration with an optoelectronic system. In certain embodiments, one or more substrates and/or fiber array coupling members (or components or subassemblies thereof) may be fabricated by photolithographic patterning followed by selective material removal (e.g., chemical etching, reactive ion etching, laser ablation, laser damage and etch, or other microscale removal techniques), stamping (e.g., including precision hot glass pressing) and/or other techniques, with certain features optionally provided by precision pick-and-place techniques. Although traditional V-groove fabrication techniques such as sawing may be used in certain embodiments, the use of features formed by lithographic patterning and removal and/or stamping may be preferable to avoid misalignment that may be increased with increasing numbers of optical fibers within an array. Multi-fiber interface apparatuses disclosed herein may be readily scaled to high volume and high channel count (e.g., from a single fiber to hundreds of fibers) with repeatable fiber alignment.
-
FIGS. 1A to 1C illustrate amulti-fiber interface apparatus 10 according to one embodiment having aPIC 40 recessed within a substrate (i.e., second substrate 30). Themulti-fiber interface apparatus 10 includes a fiberarray coupling member 12, and first andsecond substrates second substrate 30 defining arecess 38 in which thePIC 40 is arranged. Any suitable micromolding or micromachining techniques may be used to fabricate therecess 38. In certain embodiments, therecess 38 may further include raised or recessed features to promote proper alignment of thePIC 40 within therecess 38. Thefirst substrate 20 includes afirst surface 22 on which the fiberarray coupling member 12 is arranged and includes an opposingsecond surface 24 arranged in contact with afirst surface 34 of thesecond substrate 30. Thesecond substrate 30 additionally includes asecond surface 36 into which therecess 38 is defined. As shown inFIGS. 1A and 1B , thesecond surface 36 is arranged proximate to aPCB 52, and a secondary circuit member 60 (e.g., an amplifier, a processor, an application specific integrated circuit (ASIC), or any other suitable circuit member) is arranged overfirst surface 22 of thefirst substrate 20, laterally adjacent to the fiberarray coupling member 12. The fiberarray coupling member 12 receives a plurality of optical fibers 14 (although only a singleoptical fiber 14 is visible in the side cross-sectional views ofFIGS. 1A to 1C , it is to be appreciated that numerousoptical fibers 14 may be arranged in a side-by-side configuration). The fiberarray coupling member 12 also includes a plurality of beam turning elements 16 (e.g., flat turning mirrors) and a plurality of second focusing mirrors 18 (i.e., with eachbeam turning element 16 and associated second focusingmirror 18 being associated with a different optical fiber of the plurality of optical fibers 14). Thebeam turning elements 16 are arranged to redirect light from a horizontal to a vertical direction, or vice-versa. Additionally, a plurality of first focusingmirrors 42 is provided to reflect beams received from the plurality ofbeam turning elements 16 toward the plurality of second focusing mirrors 18. In certain embodiments, the plurality of first focusingmirrors 42 is arranged in or on thesecond substrate 30. In certain embodiments, the plurality of first focusingmirrors 42 may be arranged in or on thePIC 40. In certain embodiments, the plurality of first focusingmirrors 42 and/or the plurality of second focusingmirrors 18 may be replaced with a combination of a plurality of non-focusing (e.g., flat) mirrors and a plurality of focusing lenses (e.g., defined in or on the first orsecond substrates 10, 20), as will be recognized by one skilled in the art. ThePIC 40 includes a plurality of beam transduction regions 44 (e.g. optionally embodied in photodiodes) along a surface thereof, with the plurality ofbeam transduction regions 44 being configured to receive beams reflected by the plurality of second focusing mirrors 18 (and/or supply beams to the second focusingmirrors 18 to be received by the optical fibers 14). - In combination, the plurality of
beam turning elements 16, the plurality of first focusingmirrors 42, and the plurality of second focusingmirrors 18 provide double reflection expanded beam optical paths for transmittingbeams 50 from the plurality ofoptical fibers 14 to the plurality ofbeam transduction regions 44 of the PIC 40 (or for transmittingbeams 50 from thebeam transduction regions 44 of thePIC 40 to be received by the plurality of optical fibers 14). The double reflection expanded beam arrangement provides relaxed alignment tolerances between theoptical fibers 14 and thebeam transduction regions 44, thereby permitting single mode optical fibers to be used with themulti-fiber interface apparatus 10, if desired. Additionally, the use ofbeam turning elements 16 permits horizontally arrangedoptical fibers 14 to be interfaced with aPIC 40 having vertically orientedbeam transduction regions 44 in a low profile (i.e., thin)interface apparatus 10. - As shown in
FIG. 1A , various electrical connections are provided, such as between thePIC 40 and the PCB 52 (through solder balls 68), between thePIC 40 and the secondary circuit member 60 (throughsolder ball 66 and one or moreconductive vias 56 extending through the first substrate 20), and between thePCB 52 and the secondary circuit member 60 (throughsolder balls conductive vias 58 extending through the first andsecond substrates 20, 30). Provision of thePIC 40 within therecess 38 defined by thesecond substrate 30 permits regions of thesecond substrate 30 to be proximate to thePCB 52, thereby enabling direct electrical connection to thePCB 52 by (and through) thesecond substrate 30—permitting either the size of thePCB 52 to be reduced, or permitting space on thePCB 52 to allocated other uses.FIG. 1B shows that theconductive vias 58 may be composed of via portions 58-1 and 58-2 defined in thefirst substrate 20 and thesecond substrate 30, respectively. Although conductive vias are described in connection with various embodiments herein, in certain embodiments these vias may be replaced by electrically conductive posts (e.g., spring posts). In certain embodiments, one or more surfaces of the first and/orsecond substrates - Although solder balls are mentioned in various implementations described herein, it is to be appreciated that any suitable interconnection technique may be used, such as solder balls, solder bumps, electrically conductive paste, or the like.
- With continued reference to
FIG. 1A , thesecond surface 36 of thesecond substrate 30 is arranged proximate to afirst surface 54 of thePCB 52, and anopening 32 extending between thefirst surface 34 of thesecond substrate 30 and therecess 38 enables thesolder ball 66 to create a conductive path through thesecond substrate 30 to thePIC 40. Although not specifically shown inFIGS. 1A to 1C , the plurality ofoptical fibers 14 may be arranged in a V-groove array of the fiberarray coupling member 12, which may be defined in atop surface 11 of the fiberarray coupling member 12. Preferably, at least portions of the fiberarray coupling member 12 as well as the first andsecond substrates beams 50 will be propagated comprise substantially optically transmissive materials, such as glass, silicon, quartz, sapphire, or the like. In certain embodiments, thesubstrates second substrate 30 to which thePIC 40 is mounted, may comprises (or may consist essentially of) a material having a coefficient of thermal expansion (CTE) that is substantially matched to (e.g., within a threshold such as 10%, 5%, 3%, 2%, 1%, 0.5%, or 0.1% of) a CTE of thePIC 40. In certain embodiments, thePIC 40 is predominantly fabricated of silicon, and thesecond substrate 30 comprises glass. In certain embodiments, one or more anti-reflective and/or refractive index matching materials may be provided along interfaces between the fiberarray coupling member 12, thefirst substrate 20, and/or thesecond substrate 30, to reduce reflection and/or attenuation of thebeams 50 when they are transmitted through such interfaces. - In certain embodiments, the second substrate 30 (and associated PIC 40) may be mounted on or over the
PCB 52, and thefirst substrate 20 may be attached to thesecond substrate 30 thereafter (e.g., after the fiberarray coupling member 12 has been attached to thefirst substrate 20, and after the plurality ofoptical fibers 14 have been coupled with the fiber array coupling member 12). In this regard, the first andsecond substrates substrates substrates substrates second substrates -
FIG. 1C shows the first andsecond substrates PCB 52, with the fiberarray coupling member 12 being coupled to thefirst substrate 20 and with thePIC 40 arranged within therecess 38 defined in thesecond substrate 30. In certain embodiments, the first andsecond substrates array coupling member 12 coupled to a top surface thereof and having thePIC 40 defined within a recess defined in the bottom surface thereof. -
FIGS. 2A and 2B illustrate amulti-fiber interface apparatus 110 according to one embodiment configured for coupling withPIC 140 that is recessed within aPCB 152. Themulti-fiber interface apparatus 110 includes a fiberarray coupling member 112, and first andsecond substrates first substrate 120 includes afirst surface 122 on which the fiberarray coupling member 112 is arranged and includes an opposingsecond surface 124 arranged in contact with afirst surface 134 of thesecond substrate 130. Thesecond substrate 130 additionally includes asecond surface 136 coupled with thePIC 140, which is arranged in arecess 108 defined in thePCB 152. As shown, a secondary circuit member 160 (e.g., an amplifier, a processor, an ASIC, or any other suitable circuit member) is arranged over thefirst surface 122 of thefirst substrate 120, laterally adjacent to the fiberarray coupling member 112. The fiberarray coupling member 112 receives a plurality ofoptical fibers 114 and includes a plurality of beam turning elements 116 (e.g., flat turning mirrors) as well as a plurality of second focusing mirrors 118. A fiberarray coupling cover 106 is positioned along alower surface 113 of the fiberarray coupling member 112 and is arranged to retain the plurality ofoptical fibers 114. A plurality of first focusingmirrors 142 is additionally provided to reflect beams received from the plurality ofbeam turning elements 116 toward the plurality of second focusing mirrors 118. As illustrated, the plurality of first focusingmirrors 142 is arranged in or on thesecond substrate 130; however, in certain embodiments, the plurality of first focusingmirrors 142 may be arranged in or on thePIC 140. ThePIC 140 also includes a plurality of beam transduction regions 144 (e.g. photodiodes) along a surface thereof and being configured to receivebeams 150 reflected by the plurality of second focusing mirrors 118 (or to transmit beams from thePIC 140 to the plurality of second focusingmirrors 118 to be received by the plurality of optical fibers 114). In combination, the plurality ofbeam turning elements 116, the plurality of first focusingmirrors 142, and the plurality of second focusingmirrors 118 provide double reflection expanded beam optical paths for transmittingbeams 150 from the plurality ofoptical fibers 114 to the plurality ofbeam transduction regions 144 of thePIC 140. In certain embodiments, the plurality of first focusingmirrors 142 and/or the plurality of second focusingmirrors 118 may be replaced with a combination of a plurality of non-focusing (e.g., flat) mirrors and a plurality of focusing lenses, with such lenses being arrangeable in and/or on the first orsecond substrates - As shown in
FIG. 2A , various electrical connections are provided, such as between thePIC 140 and the PCB 152 (through solder balls 168), between thePIC 140 and the secondary circuit member 160 (throughsolder ball 166 and one or moreconductive vias 156 extending through the first substrate 120), and between thePCB 152 and the secondary circuit member (throughsolder balls conductive vias 158 extending through the first andsecond substrates 120, 130). Positioning of thePIC 140 within therecess 108 defined in thePCB 152 permits regions of thesecond substrate 130 to be proximate to thePCB 152, thereby enabling direct electrical connection to thePCB 152 by (and through) thesecond substrate 130.FIG. 2B shows that theconductive vias first substrate 120 and thesecond substrate 130, respectively. In certain embodiments, one or more surfaces of the first and/orsecond substrates second substrates second substrates - With continued reference to
FIG. 2A , thesecond surface 136 of thesecond substrate 130 is arranged proximate to afirst surface 154 of thePCB 152, and arecess 132 defined in thesecond surface 136 of thesecond substrate 130 enables one ormore solder balls 166 to create a conductive path through thesecond substrate 130 to thePIC 140. Similarly, recesses 138 defined in thesecond surface 136 of thesecond substrate 130 enablesolder balls 164 to establish conductive paths from thePCB 152 and through thevias 158 andsolder balls 162 to thesecondary circuit member 160. Althoughrecesses substrate 130 are shown inFIG. 2A , in certain embodiments theserecesses second substrate 130 is spaced apart from thefirst surface 154 of thePCB 152 by the thickness of thesolder balls 164, 166 (e.g., with solder balls arranged on both sides of therecess 108 defined in the PCB 152). In certain embodiments, the depth of therecess 108 in thePCB 152 may be adjusted to compensate for the thickness ofsolder ball 166 and/or 168 disposed on one or both surfaces of thePIC 140, to allow thesolder balls 166 and/or 168 to make contact with pads (not shown) on the bottom of therecess 108 and/or on (or in) thesecond substrate 130. - In certain embodiments, the plurality of
optical fibers 114 may be arranged in a V-groove array (not shown) of the fiberarray coupling member 112, which may be defined in thelower surface 113 of the fiberarray coupling member 112. Preferably, at least portions of the fiberarray coupling member 112, the fiberarray coupling cover 106, and the first andsecond substrates beams 150 will be propagated comprise substantially optically transmissive materials, such as glass, silicon, quartz, sapphire, or the like. In certain embodiments, one or both of the first andsecond substrates PIC 140. In certain embodiments, thePIC 140 is predominantly fabricated of silicon, and one or both of the first andsecond substrates array coupling member 112, the fiberarray coupling cover 106, thefirst substrate 120, and/orsecond substrate 130, to reduce reflection and/or attenuation of thebeams 150 when they are transmitted through such interfaces. - In certain embodiments, the second substrate 130 (and associated PIC 140) may be mounted to the
PCB 152 with thePIC 140 arranged in therecess 108, and thereafter thefirst substrate 120 may be attached to the second substrate 130 (e.g., after the fiberarray coupling member 112 has been attached to thefirst substrate 120, and after the plurality ofoptical fibers 114 have been coupled with the fiber array coupling member 112). The first andsecond substrates - In certain embodiments, the
PIC 140 may be coupled with thesecond substrate 130, the first andsecond substrates optical fibers 114 mounted therein) may be coupled with thefirst substrate 120 to form a subassembly. Thereafter, the subassembly may be tested to verify proper coupling of optical signals between theoptical fibers 114 andbeam transduction regions 144 of thePIC 140. In certain embodiments, position between the fiberarray coupling member 112 and thefirst substrate 120 may be adjusted responsive to results of the testing, and testing may be performed again to confirm whether sufficient optical coupling has been attained. In certain embodiments, thesecondary circuit member 160 may be part of the subassembly subject to being tested. After testing is complete, the first andsecond substrates second substrate 130 andPIC 140 to be mounted to aPCB 152, followed by coupling between the first andsecond substrates - As noted previously, various alignment structures (e.g., face alignment structures, edge alignment structures, and/or vertically extending pins) may be used between substrates to ensure that substrates are properly positioned relative to one another for efficient and reliable optical coupling. In certain embodiments, face alignment structures may be placed between first and second substrates of a fiber array coupling member to promote proper alignment between substrates.
- In one embodiment, pin guide holes or edge alignment features may be formed using ultrafast laser assisted etching process and ablation process, of which both are capable of creating mechanical features with sub-1 μm accuracy on various materials including glass. Lithographic fiducials may be placed on the glass substrates for marking the location of the holes/alignment features. Because of the loose lateral alignment tolerance of expanded beam coupling system, the inner diameter of pin guide holes may be larger than the diameter of the guide pins (e.g., by 2 um to 4 um) to enable a smooth fit. This is in contrast to pin tolerances for conventional single mode fiber connector, where hole-to-pin tolerances of 0.5-1.0 um are typically required. The use of very tight hole-to-pin tolerances would increase the likelihood of over-constraining alignment of a pair of pins to a mating pair of holes, resulting in racking and potential damage to the glass hole edges or the guide pin. Relaxed lateral alignment tolerances associated with the expanded beam approach disclosed herein helps avoid this over-constrained condition. When guide pins are used, at least two guide pins should be provided for substrate alignment. In such an embodiment, guide pin diameters can be in a range of from 0.5 mm to 2.0 mm. In certain embodiments, guide pins disclosed herein may use a design similar to conventional multi-fiber push on (MPO) connectors, which pins have a diameter of 0.7 mm. In certain embodiments, guide pin holes can be flared to help passively align pins to holes during insertion.
- One example of a fiber array coupling member incorporating face alignment structures between two substrates is shown in
FIGS. 3A and 3B . Such figures illustrate amulti-fiber interface apparatus 210 that includes a fiberarray coupling member 212 as well as first andsecond substrates FIG. 3B additionally shows aPIC 240, as well as aPCB 252 for receiving thesecond substrate 230 and defining a recess 208 (e.g., recessed relative to an upper PCB surface 254) into which thePIC 240 is received. With reference toFIGS. 3A and 3B , thefirst substrate 220 includes afirst surface 222 on which the fiberarray coupling member 212 is arranged and includes an opposingsecond surface 224 with two protruding face alignment features 225. Thesecond substrate 230 includes afirst surface 234 defining two recessed face alignment features 235 that are configured to receive the protruding alignment features 225 and includes an opposingsecond surface 236 to which a PIC 240 (shown inFIG. 3B ) may be mounted. The fiberarray coupling member 212 receives a plurality ofoptical fibers 214 and includes a plurality of beam turning elements 216 (e.g., flat turning mirrors) as well as a plurality of second focusing mirrors 218. A fiberarray coupling cover 206 is positioned along alower surface 213 of the fiberarray coupling member 212 and is arranged to retain the plurality ofoptical fibers 214. A plurality of first focusingmirrors 242 is additionally provided to reflect beams received from the plurality ofbeam turning elements 216 toward the plurality of second focusing mirrors 218. As illustrated, the plurality of first focusingmirrors 242 is arranged in or on thesecond substrate 230; however, in certain embodiments, the plurality of first focusingmirrors 242 may be arranged in or on the PIC 240 (ofFIG. 3B ). ThePIC 240 also includes a plurality of beam transduction regions 244 (e.g. photodiodes) along a surface thereof and being configured to receive beams reflected by the plurality of second focusing mirrors 218 (or to transmit beams from thePIC 240 to the plurality of second focusingmirrors 218 to be received by the plurality of optical fibers 214). In combination, the plurality ofbeam turning elements 216, the plurality of first focusingmirrors 242, and the plurality of second focusingmirrors 218 provide double reflection expanded beam optical paths for transmitting beams (not shown) between the plurality ofoptical fibers 214 and the plurality ofbeam transduction regions 244 of thePIC 240. In certain embodiments, the plurality of first focusingmirrors 242 and/or the plurality of second focusingmirrors 218 may be replaced with a combination of a plurality of non-focusing (e.g., flat) mirrors and a plurality of focusing lenses. -
FIGS. 3A and 3B show that various electrical connections may be made by themulti-fiber interface apparatus 210 and between elements thereof. For example, electrical connections may be made between thePIC 240 and the PCB 252 (through solder balls 268), between thePIC 240 and a secondary circuit member (not shown) mountable to the first substrate 220 (throughsolder ball 266 and one or moreconductive vias 256 extending through the first substrate 220), and between thePCB 252 and a secondary circuit member (not shown) (i.e., throughsolder balls 264 andconductive vias 258 extending through the first andsecond substrates 220, 230). Positioning of thePIC 240 within therecess 208 defined in thePCB 252 permits regions of thesecond substrate 230 to be proximate to thePCB 252, thereby enabling direct electrical connection to thePCB 252 by (and through) thesecond substrate 230.FIG. 3A shows that theconductive vias first substrate 220 and thesecond substrate 230, respectively. In certain embodiments, one or more surfaces of the first and/orsecond substrates second surface 236 of thesecond substrate 230 may be provided to accommodate presence ofsolder balls PIC 240 and thesubstrate 252, respectively. - In certain embodiments, vertically extending pins may cooperate with (e.g., extending through) first and second substrates of a fiber array coupling member to promote proper alignment between substrates.
-
FIGS. 4A-4C provide perspective views (withFIG. 4A being a partially exploded perspective view) of amulti-fiber interface apparatus 310 according to one embodiment that includes first andsecond substrates array coupling member 312 is mounted to thefirst substrate 320 and aPIC 340 is mounted to thesecond substrate 330. Thefirst substrate 320 includes opposing first andsecond surfaces second surfaces vertical pins 321 extending through theholes 329. The fiberarray coupling member 312 is arranged along thefirst surface 322, withoptical fibers 314 received by the fiberarray coupling member 312. Thesecond substrate 330 includes opposing first andsecond surfaces holes 339 extending between the first andsecond surfaces vertical pins 321 when the first andsecond substrates PIC 340 andelectrical traces 337 are provided along thesecond surface 336 of thesecond substrate 330. As shown, the first andsecond substrates substrates array coupling member 312 and thePIC 340. Although not specifically illustrated inFIGS. 4A-4C , it is to be appreciated that items such as beam turning elements, and focusing mirrors (or mirrors and focusing lenses) may provide double reflection expanded beam optical paths for transmitting beams between theoptical fibers 314 and thePIC 340, in a manner as described previously herein. - As shown in
FIGS. 5A and 5B , themulti-fiber interface apparatus 310 may be mounted to aPCB 350, and thePIC 340 may be arranged in a recess formed by thePCB 350 and/or thesecond substrate 330.FIG. 5A is a partially exploded perspective view of themulti-fiber interface apparatus 310, with thesecond substrate 330 attached to afirst surface 354 of thePCB 350, prior to mating of thefirst substrate 320 to thesecond substrate 330. Electrical traces of thesecond substrate 330 are oriented downward toward thefirst surface 354 of thePCB 350. As shown, the fiberarray coupling member 312 is arranged along thefirst surface 322 of thefirst substrate 320 with multipleoptical fibers 314 received by the fiberarray coupling member 312. Vertically extendingpins 321 extend downward from thefirst substrate 320 and are registered withholes 339 defined in thesecond substrate 330. After thefirst substrate 320 and affixed fiberarray coupling member 312 are pressed downward to cause the vertically extendingpins 321 to be received by theholes 339 defined in thesecond substrate 330, respective surfaces of the first andsecond substrates optical fibers 314 and thePIC 340. - In certain embodiments, a multi-fiber interface apparatus may be configured to receive electrical conductors (e.g., wires), which may be associated with optical fibers such as by emanating from a common electro-optical cable. For instance, one or more substrates of a multi-fiber interface apparatus may include electrical terminals to which electrical conductors may be coupled, such as to permit electrical connection between the conductors and a PIC and/or other electrical components.
-
FIG. 5C is a perspective view of amulti-fiber interface apparatus 310A andPCB 350 similar to those illustrated inFIGS. 5A-5B , with addition ofelectrical terminals 313 on thefirst substrate 320 to whichwires 315 associated with theoptical fibers 314 are coupled. Theelectrical terminals 313 may embody or include conductive vias that extend through an entire thickness of thefirst substrate 320, to propagate electrical signals to and/or through thesecond substrate 330 of themulti-fiber interface apparatus 310 to which thefirst substrate 320 is attached. Electrical traces of thesecond substrate 330 are oriented downward toward thefirst surface 354 of thePCB 350, with thePIC 340 being attached to thesecond substrate 330 and arranged within a recess formed in thePCB 350 and/or thesecond substrate 330. As shown, the fiberarray coupling member 314 is arranged along thefirst surface 322 of thefirst substrate 320 with multipleoptical fibers 314 received by the fiberarray coupling member 312. Vertically extendingpins 321 extend downward from thefirst substrate 320 and are registered withholes 339 defined in thesecond substrate 330. In combination, the fiberarray coupling member 312 and the first andsecond substrates optical fibers 314 and thePIC 340. - In certain embodiments, the
electrical terminals 313 could also be used as alignment pins to align the first andsecond substrates -
FIG. 6 is a partially exploded perspective view of amulti-fiber interface apparatus 310B similar to that shown inFIG. 5A , with addition ofsolder balls 368 arranged between thesecond substrate 330 and thePCB 350B. Although not shown, it is to be understood that thePCB 350B may include electrical traces on thefirst surface 354 thereof, with thesolder balls 368 being coupled to terminals associated with such traces. Themulti-fiber interface apparatus 310B includes a fiberarray coupling member 312 mounted to thefirst substrate 320, and aPIC 340 mounted to the second substrate 330 (with thePIC 340 optionally being arranged in a recess formed in thePCB 350B and/or a recess formed in the second substrate 330). Thefirst substrate 320 includes opposing first andsecond surfaces holes 329 extending between the first andsecond surfaces vertical pins 321 extending through theholes 329. The fiberarray coupling member 312 is arranged along thefirst surface 322, withoptical fibers 314 being received by the fiberarray coupling member 312. Thesecond substrate 330 includes opposing first andsecond surfaces holes 339 extending between the first andsecond surfaces vertical pins 321 when the first andsecond substrates PIC 340 andelectrical traces 337 are provided along thesecond surface 336 of thesecond substrate 330. In certain embodiments, thevertical pins 321 may be formed of electrically conductive material and may be used to provide electrical interconnections. - In certain embodiments, a first substrate may be coupled with a fiber array coupling member, a second substrate may be coupled with a PIC, and the first and second substrates may be configured to laterally abut one another, with edges thereof serving as a passive substrate alignment feature.
-
FIGS. 7A-7C illustrate amulti-fiber interface apparatus 410 including first andsecond substrates respective edges FIG. 7A being a partially exploded perspective view and withFIGS. 7B and 7C being perspective views of the assembledmulti-fiber interface apparatus 410. Thefirst substrate 460 includes afirst surface 462 and an opposingsecond surface 464, with anedge 465 bounding portions of the first andsecond surfaces array coupling member 412 is mounted to a portion of thefirst surface 462, with a portion (e.g., a majority or major portion) of the fiberarray coupling member 412 extending beyond theedge 465 of thefirst substrate 460. Multipleoptical fibers 414 are coupled with the fiberarray coupling member 412. Thesecond substrate 430 includes afirst surface 434 and an opposingsecond surface 436, with anedge 435 bounding portions of the first andsecond surfaces PIC 440 are arranged on thesecond surface 436 of thesecond substrate 430, with thePIC 440 being illustrated as positioned over a central portion of thesecond substrate 430. As shown inFIGS. 7B and 7C , when themulti-fiber interface apparatus 410 is assembled, thesecond substrate 430 is positioned between thePIC 440 and the portion of the fiberarray coupling member 412 extending beyond theedge 465 of thefirst substrate 460, with thefirst surface 434 of thesecond substrate 430 contacting the fiberarray coupling member 412, and with therespective edges second substrates second substrates second substrates edges second substrates substrates FIGS. 7A-7C , it is to be appreciated that any suitable optical elements (e.g., beam turning elements, mirrors, lenses, collimators, etc.) may be provided by or between thesubstrates array coupling member 412, and/or thePIC 440 to provide double reflection expanded beam optical paths for transmitting beams between theoptical fibers 414 and thePIC 440. - In certain embodiments, one or more protruding edge features of one substrate may be configured to cooperate with one or more edge surfaces of another substrate to promote passive substrate alignment between first and second substrates of a multi-fiber interface apparatus.
-
FIG. 8 is a partially exploded perspective view of amulti-fiber interface apparatus 410A similar to theapparatus 410 that shown inFIG. 7A , but including a U-shapedfirst substrate 460A to which a fiberarray coupling member 412 is mounted, with the U-shapedfirst substrate 460A being configured to receive and abut lateral edges of the second substrate to promote edge alignment between therespective substrates first substrate 460A includes afirst surface 462A and an opposing second surface 464A, with afirst edge 465A bounding portions of the first andsecond surfaces 462A, 464A. Thefirst substrate 460A also includes two projectingportions 469A each having asecond edge 461A that may be arranged substantially perpendicular to thefirst edge 465A. A fiberarray coupling member 412 is mounted to a portion of thefirst surface 462A, with a portion (e.g., a majority or major portion) of the fiberarray coupling member 412 extending beyond thefirst edge 465A of thefirst substrate 460A. Multipleoptical fibers 414 are coupled with the fiberarray coupling member 412. Thesecond substrate 430 includes afirst surface 434 and an opposingsecond surface 436, with first andsecond edges second surfaces PIC 440 are arranged on thesecond surface 436 of thesecond substrate 430, with thePIC 440 being illustrated as positioned over a central portion of thesecond substrate 430. When themulti-fiber interface apparatus 410A is assembled, thesecond substrate 430 is to be positioned in an edge-contacting relationship with thefirst substrate 460 to promote alignment between the first andsecond substrates first edges second edges second substrates second substrates FIG. 8 , it is to be appreciated that any suitable optical elements (e.g., beam turning elements, mirrors, lenses, collimators, etc.) may be provided by or between thesubstrates array coupling member 412, and/or thePIC 440 to provide double reflection expanded beam optical paths for transmitting beams between theoptical fibers 414 and thePIC 440. - Details of fiber array coupling members according to various embodiments will now be described in connection with
FIGS. 9 to 13 . -
FIG. 9 is a partially exploded perspective view of a fiberarray coupling member 500 and a substrate 596 of a multi-fiber interface apparatus according to one embodiment. The fiberarray coupling member 500 includes abody 512 having afirst end 502 and asecond end 503, with thebody 512 defining a V-groove array 504 that receives a plurality ofoptical fibers 514. (Although the term “V-groove array” is used throughout this disclosure, it is to be appreciated that an array of grooves of any suitable shape, such as U-shaped grooves, may be used instead.) The fiberarray coupling member 500 further includes a plurality of beam turning elements 516 (e.g., mirrors configured to reflect horizontal beams received from theoptical fibers 514 in a vertical direction, such as upward according to the illustrated configuration), and includes a plurality ofcurved mirrors 518. The substrate 596 includesvertical alignment posts 511 arranged proximate to corners thereof, with thevertical alignment posts 511 being arranged to promote alignment between the substrate 596 (e.g., a first substrate) with another substrate (e.g., a second substrate, not shown) to which a PIC may be mounted. It is to be appreciated that the fiberarray coupling member 500 may be used in conjunction with other components (e.g., a second substrate and/or PIC) providing an additional plurality of curved mirrors that may be arranged in optical paths between thebeam turning elements 516 and thecurved mirrors 518 to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between theoptical fibers 514 and a PIC. In use, optical beams supplied by the optical fibers are reflected upward by the plurality ofbeam turning elements 516, then reflected by structures not part of the fiber array coupling member 500 (e.g., a plurality of focusing mirrors, or a plurality flat mirrors in combination with focusing lenses (not shown)) to be received by thecurved mirrors 518, and ultimate reflected to beam transduction areas of a PIC (not shown). -
FIG. 10 is a partially exploded perspective view of a fiberarray coupling member 520 and a fiberarray coupling cover 526 of a multi-fiber interface apparatus according to one embodiment. The fiberarray coupling member 520 includes abody 532 having afirst end 522 and asecond end 523, with thebody 532 defining a V-groove array 524 that receives a plurality ofoptical fibers 514. The fiberarray coupling member 520 further includes a plurality of beamcollimating elements 535 that are arranged between ends of theoptical fibers 514 and a plurality ofbeam turning elements 536, with the beamcollimating elements 535 serving to provide beams of enhanced luminance and/or uniformity for transfer between the plurality ofoptical fibers 514 and the plurality ofbeam turning elements 536. The plurality ofbeam turning elements 536 serve to reflect horizontal beams received from thecollimating elements 535 in a vertical direction (e.g., upward according to the illustrated configuration). The fiberarray coupling member 520 further includes a plurality ofcurved mirrors 538 that may provide focusing utility. The fiberarray coupling member 520 may be used in conjunction with other components (e.g., a second substrate and/or PIC) providing an additional plurality of curved mirrors that may be arranged in optical paths between thebeam turning elements 536 and thecurved mirrors 538 to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between theoptical fibers 514 and a PIC. -
FIG. 11A is a partially exploded perspective view of a fiberarray coupling member 540 and a fiberarray coupling cover 546 of a multi-fiber interface apparatus according to one embodiment. The fiberarray coupling member 540 includes abody 552 having afirst end 542 and asecond end 543, with thebody 552 defining a V-groove array 544 configured to be covered by the fiberarray coupling cover 546. The V-groove array 544 receives a plurality ofoptical fibers 514 having beveled ends that are coated withreflective material 559 configured to reflect beams in a downward direction through alower surface 555 of thebody 552. As shown inFIG. 11B , eachoptical fiber 514 includes abeveled end 556 over which thereflective material 559 is coated, wherein thereflective material 559 is arranged to reflect ahorizontal beam 558 from theoptical fiber 514 in a vertical (e.g., downward) direction. In this manner, the beveled ends 556 andreflective material 559 of theoptical fibers 514 shown inFIGS. 11A and 11B serve as beam turning elements that may be used in combination with focusing mirrors, or with flat mirrors and focusing lenses (not shown), to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between theoptical fibers 514 and a PIC. Depending on the beam turning angle provided by the beveled ends 556, if light is reflected via total internal reflection at the beveled ends 556, then thereflective material 559 may be omitted as being unnecessary. -
FIG. 12 is a partially exploded perspective view of a fiberarray coupling member 560 and a fiberarray coupling cover 566 of a multi-fiber interface apparatus according to one embodiment. The fiberarray coupling member 560 includes abody 572 having afirst end 562 and asecond end 563. Thebody 572 defines a V-groove array 564 configured to be covered by the fiberarray coupling cover 566, with the V-groove array 564 receiving a plurality ofoptical fibers 514. Positioned downstream of the V-groove array 564 is a plurality ofbeam turning elements 574 each embodied in a prismatic element having areflective surface 577, which may comprise a reflective coating. Eachreflective surface 577 is arranged to reflect a horizontal beam received from a correspondingoptical fiber 514 in a vertical (e.g., downward) direction through alower surface 575 of thebody 572. The fiberarray coupling member 560 may be used in combination with focusing mirrors, or with flat mirrors and focusing lenses (not shown), to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between theoptical fibers 514 and a PIC. -
FIG. 13 is a partially exploded perspective view of a fiberarray coupling member 580 and a fiberarray coupling cover 586 of a multi-fiber interface apparatus according to one embodiment. The fiberarray coupling member 580 includes abody 592 having afirst end 582 and asecond end 583. Thebody 592 defines a V-groove array 584 configured to be covered by the fiberarray coupling cover 586, with the V-groove array 584 receiving a plurality ofoptical fibers 514. The fiberarray coupling member 580 further includes a plurality of beamcollimating elements 593 that are arranged between ends of theoptical fibers 514 and a plurality ofbeam turning elements 594 each including a prismatic element having areflective surface 597. Eachreflective surface 597 is arranged to reflect a horizontal beam received from a correspondingoptical fiber 514 in a vertical (e.g., downward) direction through alower surface 595 of thebody 592, with the beamcollimating elements 593 serving to provide beams of enhanced luminance and/or uniformity for transfer between the plurality ofoptical fibers 514 and the plurality ofbeam turning elements 594. The fiberarray coupling member 580 may be used in combination with focusing mirrors, or with flat mirrors and focusing lenses (not shown), to provide a double reflection expanded beam arrangement (as described previously herein) to promote optical coupling between theoptical fibers 514 and a PIC. - Various features of the fiber
array coupling members - In certain embodiments, multi-fiber interface apparatuses that include multiple substrates may include substrates incorporating a feature (e.g., fiducials) to enable vision-based alignment between substrates in combination with features to enable mechanical-based alignment between substrates, preferably with better than 5 μm, 3 μm, or 1 μm tolerance.
- In certain embodiments, various components of a multi-fiber interface apparatus may be arranged within a surrounding mechanical fixture to maintain the components in proper alignment, and various means may be applied to maintain the contact. In certain embodiment, spring force, clamping arrangements, adhesives, and/or passivation material, may be used to maintain the contact and/or alignment between components of a multi-fiber interface apparatus.
- In certain embodiments, any suitable number of optical fibers (e.g., 1, 2, 3, 4, 6, 8, 10, 12, 16, 24, 32, 48, 72, 96, 144, may be used with one or more fiber array couplings and/or multi-fiber interface apparatuses as disclosed herein.
- In certain embodiments, a multi-fiber interface apparatus serves as or embodies a true surface connector (i.e., not an end connector) that maintains an extremely low profile. In certain embodiments, the profile of a multi-fiber interface apparatus as disclosed herein (e.g., including one or more substrates in combination with a fiber array coupling member) may be less than 1.5 mm, less than 1.0 mm, less than 0.7 mm, or less than another threshold disclosed herein, with any of the foregoing thresholds optionally being bounded by a minimum thickness of at least 0.2 mm, 0.3 mm, or 0.5 mm. Various embodiments disclosed herein may utilize single mode, multimode, and/or polarization-maintaining optical fibers.
- In certain embodiments, multi-fiber interface apparatuses as disclosed herein are suitable for co-packaging and/or use with silicon (and silicon-based) photonic devices, since the interface apparatuses may leverage lithographically patterned features already present in these devices, thereby alleviating challenges such as facilitating high fiber density, enabling utilization with large numbers of fibers, avoiding undue system-level insertion loss, providing solder reflow compatibility, and/or facilitating optical disconnection and/or reconnection on optoelectronic packages (e.g., including but not limited to PCBs).
- Although various embodiments refer to multi-fiber interface apparatuses as being intended for use with a PIC, the principles herein may be used with any optical connector intended for attaching optical emitters and/or optical detectors to one or more optical fibers. Examples of components that may be used with multi-fiber interface apparatuses disclosed herein include vertical cavity surface emitting lasers (VCSELs), photodiodes, integrated silicon photonic components, and the like.
- Provision of a double reflection expanded beam arrangement using multi-fiber interface apparatuses disclosed herein facilitates relaxed alignment tolerances within the connector plane, thereby reducing cost and complexity of the resulting interface apparatuses relative to other solutions.
- In certain embodiments, at least a PIC portion of a multi-fiber interface apparatus may be completely hermetically sealed, such as by using epoxy, silicone, or other passivation materials. Passivation materials and/or epoxy may also be used to protect optical surfaces (e.g., reflectors) and affix optical fibers in place. In certain embodiments, a multi-fiber interface apparatus and a PIC may also be solder reflow compatible.
- In certain embodiments, a multi-fiber interface apparatus may include multiple rows of connectivity, in which a first plurality of optical fibers horizontally overlaps a second plurality of optical fibers, with both pluralities of optical fibers interfacing with a PIC.
- Those skilled in the art will appreciate that other modifications and variations can be made without departing from the spirit or scope of the invention.
- Since modifications, combinations, sub-combinations, and variations of the disclosed embodiments incorporating the spirit and substance of the invention may occur to persons skilled in the art, the invention should be construed to include everything within the scope of the appended claims and their equivalents. The claims as set forth below are incorporated into and constitute part of this detailed description.
- It will also be apparent to those skilled in the art that unless otherwise expressly stated, it is in no way intended that any method in this disclosure be construed as requiring that its steps be performed in a specific order. Accordingly, where a method claim below does not actually recite an order to be followed by its steps or it is not otherwise specifically stated in the claims or descriptions that the steps are to be limited to a specific order, it is no way intended that any particular order be inferred. Moreover, where a method claim below does not explicitly recite a step mentioned in the description above, it should not be assumed that the step is required by the claim.
Claims (19)
1. A multi-fiber interface apparatus for a photonic integrated circuit (PIC), the multi-fiber interface apparatus comprising:
an optically transmissive substrate having a first face and an opposing second face, the optically transmissive substrate defining a recess configured to receive a PIC, with the PIC being mountable to the optically transmissive substrate; and
a fiber array coupling member mounted to the optically transmissive substrate and configured to receive a plurality of optical fibers, the fiber array coupling member comprising (i) a plurality of optical beam turning elements and (ii) a plurality of second mirrors, configured to promote optical coupling between the plurality of optical fibers and the PIC when the PIC is mounted to the optically transmissive substrate.
2. The multi-fiber interface apparatus of claim 1 , further comprising a plurality of second focusing lenses arranged in an optical path between the plurality of second mirrors and the PIC.
3. The multi-fiber interface apparatus of claim 1 , further comprising a plurality of first mirrors configured to reflect beams received from the plurality of optical beam turning elements toward the plurality of second mirrors.
4. The multi-fiber interface apparatus of claim 3 , further comprising a plurality of first focusing lenses arranged in an optical path between the plurality of first mirrors and the plurality of second mirrors.
5. The multi-fiber interface apparatus of claim 1 , wherein:
the recess is defined through the first face and through less than an entire thickness of the optically transmissive substrate;
the fiber array coupling member is mounted to or along the second face of the optically transmissive substrate; and
the optically transmissive substrate is configured to be received by a printed circuit board with the PIC being arrangeable in the recess between the substrate and the printed circuit board.
6. The multi-fiber interface apparatus of claim 1 , wherein the optically transmissive substrate comprises a plurality of electrically conductive vias extending through at least a portion of a thickness of the optically transmissive substrate.
7. The multi-fiber interface apparatus of claim 1 , further comprising at least one passive alignment feature configured to align the PIC with the optically transmissive substrate to promote optical coupling between the plurality of optical fibers and the PIC when the PIC is mounted to the optically transmissive substrate.
8. The multi-fiber interface apparatus of claim 1 , wherein the plurality of optical beam turning elements comprises a plurality of beam turning mirrors.
9. The multi-fiber interface apparatus of claim 1 , wherein the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers are received by the fiber array coupling member.
10. The multi-fiber interface apparatus of claim 1 , wherein the optically transmissive substrate comprises a first substrate portion defining the first face and a second substrate portion defining the second face, wherein the first substrate portion and the second substrate portion are joined to one another along a surface arranged between the first face and the second face.
11. A multi-fiber interface apparatus for a photonic integrated circuit (PIC), the multi-fiber interface apparatus comprising:
a printed circuit board defining a recess;
an optically transmissive substrate having a first face and an opposing second face, the optically transmissive substrate being mounted along the first face to the printed circuit board;
a PIC mounted to the optically transmissive substrate and arranged within the recess; and
a fiber array coupling member mounted to the optically transmissive substrate along the second face and configured to receive a plurality of optical fibers, the fiber array coupling member comprising (i) a plurality of optical beam turning elements and (ii) a plurality of second mirrors, configured to promote optical coupling between the plurality of optical fibers and the PIC.
12. The multi-fiber interface apparatus of claim 11 , further comprising a plurality of second focusing lenses arranged in an optical path between the plurality of second mirrors and the PIC.
13. The multi-fiber interface apparatus of claim 11 , further comprising a plurality of first mirrors configured to reflect beams received from the plurality of optical beam turning elements toward the plurality of second mirrors.
14. The multi-fiber interface apparatus of claim 13 , further comprising a plurality of first focusing lenses arranged in an optical path between the plurality of first mirrors and the plurality of second mirrors.
15. The multi-fiber interface apparatus of claim 11 , wherein the optically transmissive substrate comprises a plurality of electrically conductive vias extending through at least a portion of a thickness of the optically transmissive substrate.
16. The multi-fiber interface apparatus of claim 11 , further comprising at least one passive alignment feature configured to align the PIC with the optically transmissive substrate to promote optical coupling between the plurality of optical fibers and the PIC.
17. The multi-fiber interface apparatus of claim 11 , wherein the plurality of optical beam turning elements comprises a plurality of beam turning mirrors.
18. The multi-fiber interface apparatus of claim 11 , wherein the plurality of optical beam turning elements comprises beveled ends of the plurality of optical fibers when the plurality of optical fibers are received by the fiber array coupling member.
19. The multi-fiber interface apparatus of claim 11 , wherein the optically transmissive substrate comprises a first substrate portion defining the first face and a second substrate portion defining the second face, wherein the first substrate portion and the second substrate portion are joined to one another along a surface arranged between the first face and the second face.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18/367,777 US20230418004A1 (en) | 2019-11-19 | 2023-09-13 | Multi-fiber interface apparatus for photonic integrated circuit |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962937434P | 2019-11-19 | 2019-11-19 | |
US17/060,842 US11782225B2 (en) | 2019-11-19 | 2020-10-01 | Multi-fiber interface apparatus for photonic integrated circuit |
US18/367,777 US20230418004A1 (en) | 2019-11-19 | 2023-09-13 | Multi-fiber interface apparatus for photonic integrated circuit |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/060,842 Division US11782225B2 (en) | 2019-11-19 | 2020-10-01 | Multi-fiber interface apparatus for photonic integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
US20230418004A1 true US20230418004A1 (en) | 2023-12-28 |
Family
ID=75909381
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/060,842 Active US11782225B2 (en) | 2019-11-19 | 2020-10-01 | Multi-fiber interface apparatus for photonic integrated circuit |
US18/367,777 Pending US20230418004A1 (en) | 2019-11-19 | 2023-09-13 | Multi-fiber interface apparatus for photonic integrated circuit |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/060,842 Active US11782225B2 (en) | 2019-11-19 | 2020-10-01 | Multi-fiber interface apparatus for photonic integrated circuit |
Country Status (1)
Country | Link |
---|---|
US (2) | US11782225B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230296853A9 (en) * | 2015-10-08 | 2023-09-21 | Teramount Ltd. | Optical Coupling |
US20200371285A1 (en) * | 2019-05-24 | 2020-11-26 | Nlight, Inc. | Apparatuses for scattering light and methods of forming apparatuses for scattering light |
US20230324634A1 (en) * | 2022-04-11 | 2023-10-12 | Nien-Yi Industrial Corporation | Miniature optoelectronic signal conversion and transmission device |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6801693B1 (en) | 2002-10-16 | 2004-10-05 | International Business Machines Corporation | Optical backplane array connector |
US6982437B2 (en) | 2003-09-19 | 2006-01-03 | Agilent Technologies, Inc. | Surface emitting laser package having integrated optical element and alignment post |
EP2816677B1 (en) | 2009-09-18 | 2020-04-01 | Intel Corporation | Combined optical and electrical interface |
US8064745B2 (en) * | 2009-11-24 | 2011-11-22 | Corning Incorporated | Planar waveguide and optical fiber coupling |
EP2588906A1 (en) | 2010-06-29 | 2013-05-08 | Ultra Communications, Inc. | Low profile fiber-to-module interface with relaxed alignment tolerances |
US8803269B2 (en) | 2011-05-05 | 2014-08-12 | Cisco Technology, Inc. | Wafer scale packaging platform for transceivers |
US9581772B2 (en) * | 2011-09-09 | 2017-02-28 | Centera Photonics Inc. | Optical electrical module used for optical communication |
CN103827711B (en) | 2011-09-26 | 2017-06-09 | 3M创新有限公司 | Optical conenctor with a plurality of optical fiber that staggeredly cut end is coupled to relevant microlenses |
US8548287B2 (en) | 2011-11-10 | 2013-10-01 | Oracle International Corporation | Direct interlayer optical coupler |
US9285554B2 (en) * | 2012-02-10 | 2016-03-15 | International Business Machines Corporation | Through-substrate optical coupling to photonics chips |
US9874688B2 (en) | 2012-04-26 | 2018-01-23 | Acacia Communications, Inc. | Co-packaging photonic integrated circuits and application specific integrated circuits |
JP6366602B2 (en) | 2012-12-13 | 2018-08-01 | スリーエム イノベイティブ プロパティズ カンパニー | Multichannel optical connector with coupling lens |
EP3213133B1 (en) | 2014-10-27 | 2019-12-25 | Elenion Technologies, LLC | Photonic interface for electronic circuit |
US9791645B2 (en) | 2015-09-30 | 2017-10-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods, devices and systems that dissipate heat and facilitate optical alignment in optical communications modules |
US9804334B2 (en) * | 2015-10-08 | 2017-10-31 | Teramount Ltd. | Fiber to chip optical coupler |
US9933566B2 (en) | 2015-11-13 | 2018-04-03 | Cisco Technology, Inc. | Photonic chip with an evanescent coupling interface |
US9946028B2 (en) | 2015-12-18 | 2018-04-17 | Finisar Corporation | Wafer assembly including a guide pin wafer |
US10222552B2 (en) | 2016-01-12 | 2019-03-05 | Oracle International Corporation | Wafer-scale fabrication of vertical optical couplers |
US20180180829A1 (en) | 2016-09-22 | 2018-06-28 | Innovative Micro Technology | Microfabricated optical apparatus with flexible electrical connector |
US10180523B2 (en) | 2016-10-26 | 2019-01-15 | Juniper Networks, Inc. | Grating and lens system for coupling light |
US20200049909A1 (en) | 2017-01-30 | 2020-02-13 | Hewlett Packard Enterprise Development Lp | Silicon photonic solder reflowable assembly |
US10386589B2 (en) | 2017-02-01 | 2019-08-20 | 3M Innovation Properties Company | Hybrid cable-to-board connector |
US20180259710A1 (en) | 2017-02-15 | 2018-09-13 | Technische Universiteit Eindhoven | Wafer-Scale Polymer-Aided Light Coupling for Epitaxially Grown Material Platforms |
DE102017208523A1 (en) * | 2017-05-19 | 2018-11-22 | Sicoya Gmbh | Photonic component and method for its production |
US10705302B2 (en) * | 2018-02-27 | 2020-07-07 | Samsung Electronics Co., Ltd. | Photonic integrated circuit packages |
-
2020
- 2020-10-01 US US17/060,842 patent/US11782225B2/en active Active
-
2023
- 2023-09-13 US US18/367,777 patent/US20230418004A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20210149128A1 (en) | 2021-05-20 |
US11782225B2 (en) | 2023-10-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10429597B2 (en) | Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device | |
US10782474B2 (en) | Detachable optical connectors for optical chips comprising a connector support and methods of fabricating the same | |
US20230418004A1 (en) | Multi-fiber interface apparatus for photonic integrated circuit | |
US20190170945A1 (en) | Waveguide connector elements and optical assemblies incorporating the same | |
US6450704B1 (en) | Transparent substrate and hinged optical assembly | |
US7703991B2 (en) | Flip-chip mountable optical connector for chip-to-chip optical interconnectability | |
US20040105630A1 (en) | Parallel fiber optics communications module | |
US11585991B2 (en) | Fiberless co-packaged optics | |
US9176288B2 (en) | Optical plug connector having an optical body with a lens on a reflective surface | |
US6547454B2 (en) | Method to align optical components to a substrate and other optical components | |
US20190250341A1 (en) | Silicon-based optical ports providing passive alignment connectivity | |
WO2018081340A1 (en) | Optical transceiver having alignment module | |
US20190064454A1 (en) | Glass-based ferrule assemblies and coupling apparatus for optical interface devices for photonic systems | |
WO2003014772A2 (en) | Assembly for aligning an optical array with optical fibers | |
US20230130045A1 (en) | Detachable connector for co-packaged optics | |
US11112574B1 (en) | Optoelectronic system with a wedge-shaped adapter | |
Mathai et al. | Optoelectronic system with a wedge-shaped adapter |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: CORNING RESEARCH & DEVELOPMENT CORPORATION, NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHAEVITZ, REBECCA KAYLA;SUTHERLAND, JAMES SCOTT;WU, QI;SIGNING DATES FROM 20201113 TO 20201124;REEL/FRAME:064892/0458 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |