JP3452120B2 - Optical module and optical transceiver - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a receiving optical module for converting an optical signal transmitted through an optical fiber into an electric signal and outputting the electric signal, and a transmitting optical module for converting the electric signal into an optical signal and transmitting the optical signal into the optical fiber. The present invention relates to a trust optical module and an optical transceiver equipped with these optical modules.

[0002]

2. Description of the Related Art As a conventional optical module, Japanese Patent Application Laid-Open No.
-91571, JP-A-57-91572,
The one disclosed in JP-A-2-61921 is known.

In Japanese Patent Laid-Open No. 57-91571 and Japanese Patent Laid-Open No. 57-91572, an optical device for converting an optical signal into an electric signal and an electronic circuit for processing an electric signal output from the optical device are disclosed. An intermediate component is formed by transfer molding with a transparent resin, and the intermediate component is housed in an enclosure provided with a coupling mechanism with an optical fiber to form an optical module. Further, this intermediate component is arranged at a predetermined position by using a predetermined assembly jig, and a resin opaque to an optical signal is injection-molded to form an enclosure capable of blocking external light.

The optical module started in JP-A-2-61921 has a structure in which an optical device is mounted on the base of a metallic optical connector. This optical connector has
A fitting mechanism is provided for connecting the ferrules that received the optical fibers. When the optical device is mounted on the base, the optical signal is actually introduced into the optical fiber,
At that time, while observing the electrical signal output from the optical device and adjusting the optical axes of the optical fiber and the optical device, the optical device is mounted with the position where the electrical signal of a predetermined level is obtained as the optimum position. Further, a metal connector on which the optical device is mounted and a hybrid IC substrate on which an electronic circuit for processing an electric signal is mounted are integrally molded with resin to form an optical module.

[0005]

However, these conventional techniques have the following problems. JP-A-57-91
In the optical modules disclosed in Japanese Patent Application Laid-Open No. 571 and Japanese Patent Application Laid-Open No. 57-91572, when the optical axes of the optical fiber and the optical device already transfer-molded are adjusted, the optical module used for molding the housing is used. High accuracy of centering cannot be obtained because it depends on various factors such as the mounting accuracy of the tool, the mounting accuracy of the intermediate part, and the outer diameter shape of the intermediate part.

Further, the optical axes of the optical fiber and the optical module are only indirectly aligned with each other via the casing. Therefore, even if the optical axes of the optical fiber and the optical module are aligned with each other during the alignment process during the manufacturing process, the mechanical axis is displaced during the subsequent manufacturing process, etc., and the optical axis is displaced. there were.

Further, in the case of forming an optical transceiver for transmission / reception in which an optical module for transmission having an electro-optical conversion device built-in and an optical module for reception having an optical-electrical conversion device incorporated are integrally formed, an optical fiber is used. The distance between the two optical modules must be adjusted by the distance between the axes of the jig for aligning the optical axes of the optical device and these optical devices. Therefore, the micro optical axis adjustment between the optical fiber and these optical devices and the macro position adjustment between the transmission optical module and the reception optical module are simultaneously performed using the same jig and in the same step. Therefore, it was extremely difficult to achieve both adjustments.

Further, due to the demand for advanced optical communication, there is a limit to the size of the lead frame even if an attempt is made to mount a large-scale electronic circuit for performing complicated signal processing.
It was extremely difficult. That is, when the lead frame is made larger, the volume of the intermediate component also becomes larger, which makes it more difficult to adjust the optical axis, and there is a problem that the optical axis is likely to shift after completion.

In the optical module disclosed in Japanese Unexamined Patent Publication No. 2-61921, the optical axis adjustment and the inter-axis adjustment are individually performed by integrating the metal optical connector and the hybrid IC with resin sealing. However, there is a problem in that an expensive metal connector must be used. In addition, a separate condensing lens is mounted in the metal connector, and the electronic circuit is also created as a hybrid IC, and then mounted on the lead frame. It is necessary to step, which causes an increase in the number of parts and a complicated manufacturing process.

The present invention has been made in view of the above problems of the prior art, and is extremely easy to manufacture, has a low manufacturing cost, has high optical / mechanical accuracy, and has high reliability, and an optical module. It is intended to provide a transceiver.

[0011]

In order to achieve such an object, the optical module of the present invention uses either an optical signal having a wavelength of 1.3 μm band transmitted through an optical fiber or an electric signal corresponding to the optical signal. An optical device that converts the signal of the other signal to the other signal, an electronic device that processes the electrical signal, an optical device mounting portion that mounts the optical device, and a lead frame that has an electronic device mounting portion that mounts the electronic device, An optical module having an optical axis that coincides with an optical main surface of the optical device and is optically coupled to the optical fiber, wherein the optical device mounting portion and the optical device are resin-sealed. Along with
A first resin molding part made of a resin transparent to the optical signal, which is integrated with a light condensing means optically coupled to the optical device, the electronic device mounting part and the electronic device are resin-sealed. In addition, the second resin molding portion molded separately from the first resin molding portion, the optical device mounting portion and the electronic device mounting portion are connected to each other, and the optical device and the electronic device are connected. And an internal lead pin for electrically and mechanically connecting and.

In the optical module of the present invention, the light condensing means is an aspherical lens integrated with the first resin molding portion, and the first portion for receiving the optical fiber and the first portion. A DIP type external lead pin for external connection, or an SI for external connection, further comprising a sleeve having a second portion into which a resin molded portion is fitted.
The structure has a P-type external lead pin.

Further, by using a top incidence type photodiode which is an opto-electrical conversion device as the optical device, a receiving optical module is constructed, and the optical device is a surface emitting device which is an electro-optical conversion device. An optical module for transmission was constructed by using a light emitting diode or a semiconductor laser of this type. Further, the structure is such that these optical devices are mounted on the first optical device mounting portion via the submount member.

The optical transceiver of the present invention has a structure in which these optical modules are housed in the same housing.

[0015]

Since the optical module of the present invention has the above-mentioned structure, it does not require an expensive metal connector, and the optical axis once adjusted does not shift during the subsequent manufacturing process. It does not increase the number of electronic devices for higher functionality and does not affect the optical axis adjustment. Further, also in the optical transceiver in which the transmission optical module and the reception optical module are integrated, the optical axis adjustment and the inter-axis adjustment can be performed completely separately.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 1 shows a first embodiment of an optical module and an optical transceiver of the present invention.
9 to FIG. First, the structure of an optical module for reception that receives an optical signal and converts it into an electrical signal will be described together with the manufacturing process.

FIG. 1 shows the shape of a lead frame for manufacturing a receiving optical module. The lead frame 2 has an optical device mounting portion 4 for mounting an optical-electrical conversion device, which is an optical device, and an electronic circuit mounted by etching a copper thin plate having a thickness of about 0.2 mm. For mounting the electronic device, and four internal lead pins 8a to 8d for electrically and mechanically connecting the optical device mounting portion 4 and the electronic device mounting portion 6 to each other.
And seven external lead pins 10a to 10g and 12a to 12g are formed on both sides of the electronic device mounting portion 6, and the surfaces of the optical device mounting portion 4 and the electronic device mounting portion 6 are plated with silver. There is. Plural fitting holes 14a to 14d for aligning a metal mold for resin molding, which will be described later, are formed at predetermined positions of the lead frame 2.

In FIG. 1, a lead frame corresponding to one receiving optical module is shown as a representative, but in reality, a strip-shaped copper thin plate is formed by connecting the lead frame of the illustrated shape. And is automatically conveyed on the production line.

The lead frame 2 is conveyed to a predetermined position on the manufacturing line, and a submount member 16 made of an insulating material such as aluminum nitride (AlN) is fixed on the optical device mounting portion 4, and then, on the submount member 16. Then, the photoelectric conversion device 18 in the form of the bare chip is fixed. The photoelectric conversion device 18 uses an InGaAs photodiode or the like having a sensitivity to a wavelength of 1.3 μm band, and by performing an etching process or the like on the insulating layer on the light receiving surface in the semiconductor manufacturing process, a minute amount is previously obtained. A condenser lens LN is formed. Furthermore, by mounting an active element or a passive element, which is an electronic device, on the electronic device mounting portion 6, an electronic circuit that amplifies an electric signal output from the optical-electrical conversion device 18 is mounted, and an electronic circuit is formed. The external lead pins 10a to 10g and 12a to 12g are electrically connected by a bonding wire.

The lead frame 2 on which the optical-electrical conversion device 18 and the electronic circuit are mounted is conveyed to a resin-molding die having a predetermined shape, and the die and the lead frame 2 are fitted into the fitting holes 14a.
After positioning via 14d, the optical device mounting portion 4 and the electronic device mounting portion 6 are separated and resin-sealed by a resin transparent to an optical signal. As a result, the first resin molding portion 20 that integrally seals the optical device mounting portion 4, the submount member 16 and the photoelectric conversion device 18 mounted therein, the electronic device mounting portion 6, and the electronic circuit mounted therein. A second resin molding portion 22 for integrally sealing and is molded (see FIG. 2). The first resin molding portion 20 may be molded with a transparent resin and the second resin may be molded with an opaque resin.

The first resin molding portion 20 is a substantially rectangular parallelepiped base portion 24 that seals the submount member 16, the opto-electric conversion device 18 and the optical device mounting portion 4, and a cone that is integrally molded on the base portion 24. It has a trapezoidal base portion 26 and an aspherical lens 28 integrally formed on the top portion of the base portion 26, and the aspherical lens 28 and the optical principal surface (light receiving surface) and the light condensing surface of the photoelectric conversion device 18. The optical axes of the lenses LN coincide.

The base 26 is concentric with the optical axes of the aspherical lens 28, the optical-electrical conversion device 18 and the condenser lens LN, and has a predetermined inclination angle so that the taper gradually becomes smaller toward the top. Is a truncated cone having a tapered side surface and a predetermined height.

After molding the first and second resin molding parts 20 and 22, unnecessary parts of the lead frame 2 are cut and removed to form intermediate parts as shown in FIG. Further, by bending the inner lead pins 8a to 8d and the outer lead pins 10a to 10g and 12a to 12g, the base portion 26 and the aspherical lens 28 are formed on the second resin molding portion 20 as shown in FIG. To form a DIP (dual inline package) type receiving optical module 30 directed to the opposite side. Note that FIG. 3A is a perspective view of the completed reception optical module 30 as seen obliquely from the front of the first resin mounting portion 20, and FIG. 3B shows the reception optical module 30 as a second optical module. FIG. 4 is a perspective view of the resin mounting portion 20 when viewed from diagonally behind.

The receiving optical module 30 is operated by supplying power to a predetermined external lead pin among the external lead pins 10a to 10g and 12a to 12g, and photoelectric conversion in the first resin molding portion 20 is performed. The electric signal output from the device 18 is input to the electronic circuit in the second resin molding portion 22 via the internal lead pins 8a to 8d to perform signal processing, and is output from another external lead pin.

As described above, this receiving optical module 30
Is an aspherical lens 28 for condensing light on the first resin molding portion 20.
Since it is integrated, it is possible to reduce the number of components, and it becomes unnecessary to adjust the optical axis and the axial distance between the photoelectric conversion device 18 and the aspherical lens 28.
Furthermore, since it is not necessary to adopt a structure in which a condenser lens and an optical-electrical conversion device are coupled with a metal connector,
Achieved cost reduction.

Further, a first resin molding portion 20 having a built-in photoelectric conversion device 18 and a second resin molding portion 22 having a built-in electronic circuit are separately molded, and these are molded by internal lead pins 8a to 8d. Since it has a structure that is electrically and mechanically coupled, when it is applied to a communication device such as an optical transceiver, the mounting position of the second resin molding portion 22 does not affect the mounting position of the first resin molding portion 20. The mounting position can be adjusted independently. Therefore, the optical axis adjustment and the inter-axis adjustment with the optical fiber in the communication device can be easily performed.

Furthermore, since the optical device mounting portion 4 and the electronic device mounting portion 6 are separated, the degree of freedom in designing an electronic circuit is increased, and a complicated and large-scale electronic device capable of meeting the demand for advanced optical communication is provided. Circuitry can be implemented. Also, as the scale of the electronic circuit increases, the second resin molding portion 2
Even if 2 is increased, the first resin molding portion 20 is not affected by this, so that it is possible to easily perform optical axis adjustment and inter-axis adjustment when applied to the communication device.

Furthermore, since this receiving optical module 30 has no movable parts, it has an excellent structure such that it has a high mechanical strength and the optical accuracy is always kept in an optimum state.

Next, the structure of the transmitting optical module for converting an electric signal into an optical signal and transmitting the optical signal into the optical fiber will be described with reference to FIGS.

FIG. 4 shows the shape of the lead frame for manufacturing the transmitting optical module. The lead frame 32 is an optical device mounting portion 34 for mounting an electro-optical conversion device, which is an optical device, by etching a copper thin plate having a thickness of about 0.2 mm.
And an electronic device mounting portion 36 for mounting an electronic circuit
And two internal lead pins 38a and 38b for electrically and mechanically connecting the optical device mounting portion 34 and the electronic device mounting portion 36, and seven external lead pins provided on each side of the electronic device mounting portion 36. Lead pins 40a-40g, 4
2a to 42g are formed, and the surfaces of the optical device mounting portion 34 and the electronic device mounting portion 36 are plated with silver. At a predetermined position of the lead frame 32, a plurality of fitting holes 4 for aligning with a metal mold for resin molding described later.
4a to 44d are drilled.

In FIG. 4, a lead frame corresponding to one transmission optical module is shown as a representative, but in practice, a strip-shaped copper thin plate is formed by connecting the lead frame of the illustrated shape in series. And is automatically transported on the manufacturing line.

The lead frame 32 is conveyed to a predetermined position on the manufacturing line, and a submount member 46 made of an insulating material such as aluminum nitride (AlN) is fixed on the optical device mounting portion 34, and then on the submount member 46. Then, the electro-optical conversion device 48 in the form of the bare chip is fixed. The electro-optical conversion device 48 uses a surface emitting type InGaAsP light emitting diode or a surface emitting type InGaAs laser diode that emits an optical signal in the 1.3 μm band. A minute condenser lens LN ′ is formed in advance by performing processing or the like. Further, an electronic circuit is mounted on the electronic device mounting portion 36 by fixing active elements and passive elements which are electronic devices, and the electronic circuit and the external lead pins 40a to 40g, 42a to 42g are electrically connected by bonding wires. Connect to each other.

The lead frame 32 on which the electro-optical conversion device 48 and the electronic circuit are mounted is conveyed to a metal mold for resin molding, and the metal mold having a predetermined shape and the lead frame 32 are fitted into the fitting hole 4.
After positioning through 4a to 44d, the optical device mounting portion 34 and the electronic device mounting portion 36 are separated and resin-sealed by a resin transparent to an optical signal. As a result, the first resin molding portion 50 that integrally seals the optical device mounting portion 34, the submount member 46 mounted therein, and the electro-optical conversion device 48, the electronic device mounting portion 36, and the electronic circuit mounted therein. A second resin molding part 52 for integrally sealing and is molded (see FIG. 5). The first resin molding part 50 may be molded with a transparent resin, and the second resin molding part 52 may be molded with an opaque resin.

The first resin molding portion 50 is a substantially rectangular parallelepiped base portion 54 for sealing the electro-optical conversion device 48 and the optical device mounting portion 34, and a truncated cone-shaped base integrally molded on the base portion 54. A portion 56 and an aspherical lens 58 integrally formed on the top portion of the base 56 are provided, and the aspherical lens 58 and the electric lens 58 are electrically connected to each other.
The optical axes of the light conversion device 48 and the condenser lens LN ′ coincide with each other. In addition, the pedestal portion 56 is a concentric circle with respect to the optical axes of the aspherical lens 58, the electro-optical conversion device 48, and the condenser lens LN ′, and has a tapered side surface with a predetermined inclination angle that gradually decreases toward the apex. And a truncated cone having a predetermined height. Further, recesses 60 and 62 for exposing a predetermined region of the lead frame 32 are provided at the upper end of the second resin molding portion. Then, a small variable resistor or the like, which is connected to the mounted electronic circuit and finely adjusts the drive current to the electro-photoelectric conversion device 48, is accommodated in the concave portion 62, and the concave portion 60 includes the small variable resistor. When adjusting
It is provided for measuring the potential of a predetermined pattern of the lead frame with the probe pin.

Thus, the first and second resin molding parts 50,
After molding 52, and further mounting a variable resistor or the like in the recess 62 to electrically connect the electronic circuit to the lead frame 32.
By cutting and removing unnecessary portions of the intermediate parts, intermediate parts as shown in FIG. 5 are formed. In addition, internal lead pin 3
8a, 38b and external lead pins 40a-40g, 42a
As shown in FIG. 6, the base portion 56 and the aspherical lens 58 are directed to the opposite side with respect to the second resin molding portion 52 by performing a bending process on the .about.42 g of a DIP (dual in-line package) type. The transmission optical module 64 is formed. 6A is a perspective view of the completed transmission optical module 64 as seen from diagonally forward of the first resin mounting portion 50, and FIG. 6B shows the transmission optical module 64 as a second optical module. FIG. 6 is a perspective view of the resin mounting portion 52 when viewed from diagonally behind.

The transmitting optical module 64 operates by supplying power to a predetermined external lead pin among the external lead pins 40a to 40g and 42a to 42g, and when an electric signal is applied to another external lead pin, The power is amplified by an electronic circuit mounted in the second resin molding part 52 and is supplied to the electro-optical conversion device 48 in the first resin molding part 50 via the internal lead pins 38a and 38b. An optical signal corresponding to the signal is emitted.

In this way, the transmitting optical module 64
Like the optical receiving module 30, the first resin molding portion 50 and the second resin molding portion 52 are separated from each other, and the internal lead pin 38 is provided between these resin molding portions 50 and 52.
Since it has an integrated structure that is connected by a and 38b, it has excellent mechanical strength, good optical precision, good applicability when applied to various communication devices, and low cost. To do.

Next, the structure of an optical transceiver using the receiving optical module 30 and the transmitting optical module 64 will be described with reference to the manufacturing process with reference to FIGS.

In FIGS. 7A and 7B, the first optical module provided on the receiving optical module 30 and the first transmitting optical module 64.
A sleeve 66 for inserting the ferrule that has received the optical fiber is fixed to each of the resin molded portions 20 and 50 using an ultraviolet curable resin.

The sleeve 66 is a circular tubular member molded of opaque resin, and for fitting the fitting insertion hole 68 for fitting the ferrule from the front end side and the base portions 26, 56 from the rear end side. Has a fitting hole 70, a communication hole 72 for communicating between the fitting insertion hole 68 and the fitting hole 70, and a flange portion 74 is formed at a predetermined position on the outer peripheral portion. These holes 6
The inner peripheral surfaces of 8, 70, and 72 are designed in advance so that the optical axis Q of the multimode optical fiber is at the center when the ferrule containing the multimode optical fiber is fitted into the fitting hole 68. There is. The fitting hole 70 is the base 2
It has a truncated cone-shaped inner peripheral surface that is fitted to the tapered surfaces of 6, 56, an annular convex portion 70a, and a concave annular resin reservoir 70b. Further, the large diameter through hole 68 and the smaller diameter communication hole 72 allow the ferrule 78 at the boundary between them.
Is formed with a stepped portion 76a for abutting the tip of the.

Next, the base 26 of the receiving optical module 30
The ultraviolet curable resin RS is applied to the taper surface of No. 1 and the taper surface of the base 56 of the transmission optical module 64, the bases 26 and 56 are fitted in the fitting holes 70, and the ultraviolet curable resin RS is irradiated with ultraviolet light. As a result, the sleeve 66 is fixed to each of the first resin molded parts 20 and 50. Furthermore, in this fixing process,
The ferrule 78 for adjustment which received the multi-mode optical fiber is inserted into the insertion hole 68 of the sleeve 66, the optical modules 30 and 64 are actually operated, and the multi-mode optical fiber and each optical device are operated by the so-called power monitor method. The optical axis alignment with 18, 48 and the adjustment of the inter-axis distance are also performed at the same time.

Here, when the pedestals 26 and 56 are fitted into the fitting holes 70, the ultraviolet curable resin RS has an annular convex portion 70a.
Since it is stopped by the resin reservoir 70b, it does not adhere to the aspherical lenses 28 and 58. Further, in order to cope with the change in shape of the aspherical lenses 28, 58 due to the variation in shrinkage at the time of molding the first resin molding parts 20, 50, the three axes are aligned. Furthermore, by fixing the sleeve 66 once and then reinforcing it with a thermosetting resin, the optimum aligned state is maintained as it is. Therefore, during the subsequent manufacturing process and the like, an optical axis shift or the like does not occur, and a highly maintenance-free optical coupling structure is realized.

Next, referring to FIG. 8, a plurality of rows of through-hole groups 80a-80d provided at predetermined positions of a rectangular array substrate 80 formed of glass epoxy resin,
External lead pins 10a to 10 of the receiving optical module 30
g, 12a to 12g and the external lead pins 40a to 40g, 42a to 42g of the transmission optical module 64 are integrated by fitting them, and as shown in FIG.
Inside the shell-shaped housing 82 molded with opaque resin,
The alignment substrate 80 is assembled so that the receiving optical module 30 and the transmitting optical module 64 are housed.

Here, the housing 82 has a plurality of engaging projections 84 projecting inward, and a plurality of step portions (not shown) provided slightly deeper than the engaging projections 84. ), The receiving optical module 30 and the transmitting optical module 64 are housed in the housing 82 only by inserting the side end portions of the alignment substrate 80 between the engaging protrusions 84 and the stepped portions. The structure is such that the aligned substrate 80 can be automatically accommodated in the rear position and the integrated substrate 80 can be integrated with the housing 82.

Further, the casing 82 has openings 86 and 88 for inserting the ferrules provided at the front position, and the opening 8
Sleeve mounting chambers 90 and 92 extending rearward from 6, 88 are formed. By simply assembling the alignment substrate 80, the respective sleeves 66 are automatically directed toward the openings 86 and 88, respectively. It is designed to be mounted in the 92.

Next, the resin-molded engaging member 9 having two pairs of holding pieces 94a and 94b for sandwiching the respective sleeves 66.
6 is connected to the alignment substrate 80, and sleeve mounting chambers 90, 9
By assembling the above two, the respective sleeves 66 are more firmly fixed in the casing 82. It should be noted that the pair of engaging projections 98, 98 projectingly provided on both ends of the engaging member 96 are provided in the housing 8.
The engagement member 96 can be automatically assembled to the housing 82 by being fitted into the pair of engagement holes 100, 100 formed in the side wall of No. 2.

Next, the rectangular flat plate 102 is attached to the holding pieces 94a,
The optical transceiver is completed by assembling it to the housing 82 so as to cover 94b and the respective sleeves 66. The rectangular flat plate 102 is simply fitted into the pair of engaging holes 106, 106 formed in the side wall of the housing 82, so that the pair of engaging projections 104, 104 projecting from both ends of the rectangular flat plate 102 can be fitted. Has a structure capable of being automatically assembled to the housing 82. The aligned substrate 80, the engaging member 96, and the rectangular flat plate 102 also function as a bottom plate that covers the back surface side of the housing 82.

Thus, according to this optical transceiver,
Since the DIP type reception optical module 30 and the transmission optical module 64 which are separate bodies are used, the optical axes of the reception system and the transmission system and the inter-axis distance can be adjusted independently. . Since the sleeve 66 having the optical axis adjusted and the axial distance adjusted is fixed to each of the optical modules 30 and 64, the assembly process can be greatly simplified. Furthermore,
Distance between these optical modules 30 and 64 (arrangement interval)
And the mounting adjustment of the respective sleeves 66 can be performed independently and independently of each other, so that the alignment accuracy of the optical modules 30 and 64 and the respective sleeves 66 is not affected by the adjustment of the arrangement interval. Therefore, it is possible to realize an optical module that is optically extremely accurate.

(Second Embodiment) Next, FIGS.
A second embodiment of the optical module and the optical transceiver will be described with reference to FIG. The differences and features from the first embodiment will be mainly described.

First, the structure of the receiving optical module will be described together with the manufacturing process with reference to FIG. In FIG. 1A, a lead frame 200 for manufacturing the receiving optical module has an optical device mounting portion 202 for mounting an opto-electric conversion device and an electronic device mounting for mounting an electronic circuit. Part 204 and these mounting parts 2
No. 02 and No. 204 are electrically and mechanically connected to each other, and four internal lead pins 206 and five external lead pins 208 provided behind the electronic device mounting portion 204 are formed, and the optical device mounting portion 202 and the electronic device are formed. Mounting part 20
The surface of 4 is plated with silver. Then, the optical-electrical conversion device 210 is fixed to the optical device mounting portion 202 via the submount member, and the electronic device mounting portion 20 is attached.
An electronic circuit is mounted by fixing an electronic device to 4.

Next, as shown in FIG. 6B, a first resin that integrally seals the optical device mounting portion 202 and the opto-electric conversion device 210 is formed by using a resin that is transparent to an optical signal. By molding the molding portion 212, the second resin molding portion 214 that integrally seals the electronic device mounting portion 204 and the electronic circuit, and further cutting and deleting unnecessary portions of the lead frame 200, the same drawing ( Form an intermediate part as shown in c). The first resin molding part 212 is similar to the first resin molding part 20 shown in FIG.
It has a structure in which a base 216 in which 10 is embedded, a truncated cone-shaped base 218, and an aspherical lens 220 are integrated.

Then, as shown in FIG. 6D, the internal lead pins 206 and the external lead pins 208 are bent to form an SI in which the external lead pins 208 are arranged in a line.
A P (single inline package) type reception optical module 222 is completed.

Next, the structure of the transmitting optical module will be described together with the manufacturing process with reference to FIG. In FIG. 3A, a lead frame 300 for manufacturing this optical module for transmission has an optical device mounting portion 302 for mounting an electro-optical conversion device and an electronic device mounting for mounting an electronic circuit. Part 304 and these mounting parts 3
02 and 304 are electrically and mechanically connected to each other, and two internal lead pins 306 and four external lead pins 308 provided behind the electronic device mounting portion 304 are formed, and the optical device mounting portion 302 and the electronic device are formed. Mounting part 30
The surface of 4 is plated with silver. Then, the electrical-optical conversion device 310 is fixed to the optical device mounting portion 302, and the electronic device is fixed to the electronic device mounting portion 304 to mount an electronic circuit.

Next, as shown in FIG. 6B, a first resin which integrally seals the optical device mounting portion 302 and the electro-optical conversion device 310 is formed by using a resin transparent to an optical signal. By molding the molding portion 312 and the second resin molding portion 314 that integrally seals the electronic device mounting portion 204 and the electronic circuit, and further cutting and deleting unnecessary portions of the lead frame 300, the same drawing ( Form an intermediate part as shown in c). The first resin molding portion 312 is shown in FIGS.
Similar to the first resin molding parts 20 and 212 shown in (c),
It has a structure in which a base 316 in which the electro-optical conversion device 310 is embedded, a truncated cone-shaped base 318, and an aspherical lens 320 are integrated.

Then, as shown in FIG. 7D, the internal lead pins 306 and the external lead pins 308 are bent to form an SI in which the external lead pins 308 are arranged in a line.
A P (single inline package) type optical module for transmission 322 is completed.

Next, these receiving optical modules 222
The structure of an optical transceiver using the transmitting optical module 322 will be described together with the manufacturing process.

First, as shown in FIGS. 10 (d) and 11 (d), a ferrule that receives a multimode optical fiber is placed in each of the first resin molding portions 212 and 312 of the optical modules 222 and 322, respectively. The sleeve 400 for fitting is fixed. That is, this sleeve 400 is
This is a cylindrical resin molding member similar to that of FIG. 7, and the sleeve 400 is fixed to the respective first resin molding portions 212 and 312 using an ultraviolet curable resin and a thermosetting resin.

Next, in FIG. 12, the receiving optical module 22 is placed in the through-hole groups 500a and 500b which are formed in rows at predetermined positions of the rectangular array substrate 500.
2 external lead pins 208 and transmitting optical module 322
These are integrated by inserting the external lead pins 308. Then, as shown in FIG. 9, the alignment substrate 50 is arranged so that the receiving optical module 222 and the transmitting optical module 322 are housed in the resin-molded housing 82.
0 is assembled, and the engaging member 96 and the rectangular flat plate 102 are assembled to the casing 82, thereby completing the optical transceiver of the present embodiment.

As described above, the optical modules 222 and 322 of this embodiment have the first resin molding portions 212 and 312.
And the second resin molding portions 214, 314 are separated, and the resin molding portions 212, 214, 312, 314 are connected by the internal lead pins 206, 306 to have an integrated structure, so that the mechanical strength is excellent. It has excellent optical accuracy, excellent applicability when applied to various communication devices, and low cost.

Further, according to the optical transceiver of this embodiment, since the SIP type receiving optical module 222 and the transmitting optical module 322 are provided separately,
The optical axes of the receiving system and the transmitting system and the inter-axis distance can be adjusted independently. Each optical module 2
Since the sleeve 400 having the optical axis and the distance between the axes adjusted is fixed to the parts 22, 322, the assembly process can be greatly simplified. Furthermore, these optical modules 222, 32
Adjustment of the distance (arrangement interval) between the two sleeves 40
Since the attachment adjustment of 0 can be performed separately and independently, the optical module 22 can be adjusted by adjusting the arrangement interval.
The alignment accuracy between the sleeves 400 and 2, 322 is not affected. Therefore, it is possible to realize an optical module that is optically extremely accurate.

[0061]

As described above, according to the optical module of the present invention, since the light condensing means is integrated with the first resin molding portion, the number of parts can be reduced, and the optical device and the optical device can be reduced. It is not necessary to adjust the optical axis between the light collecting means and the distance between the axes. Furthermore, since it is not necessary to adopt a structure in which the light converging means and the optical device are connected by a metal connector, it is possible to reduce the cost.

Further, the first resin molding portion for resin-sealing the optical device and the second resin molding portion for resin-sealing the electronic device are separately and independently molded, and these are electrically / mechanically connected by internal lead pins. Since it has a structure connected to, when it is applied to a communication device such as an optical transceiver, the mounting position of the first resin molding part is independently adjusted without being affected by the mounting position of the second resin molding part. can do. Therefore, the optical axis adjustment and the inter-axis adjustment with the optical fiber in the communication device can be easily performed.

Further, since the external lead pins have to be aligned at predetermined positions, the mounting position of the second resin molding portion must be adjusted, but the optical device mounting portion and the electronic device mounting portion are separated. Therefore, the degree of freedom in designing an electronic circuit is increased, and a complicated and large-scale electronic circuit that can meet the demand for advanced optical communication can be mounted. In addition, as the scale of the electronic circuit increases, the second
Even if the resin-molded portion becomes large, the first resin-molded portion is not affected by this, and therefore the optical axis adjustment and the inter-axis adjustment when applied to the communication device can be easily performed.

Further, since the optical device is fixed on the lead frame via the submount member, the difference in the expansion coefficient between the leadframe and the optical device is influenced by properly selecting the material of the submount. Never. As a result, stress on the optical device is relieved and reliability is improved.

Furthermore, since this optical module has no movable parts, it has an excellent structure such that it has high mechanical strength and the optical accuracy is always kept in an optimum state. Furthermore,
1.3μm suitable for long distance and large capacity transmission by using InGaAsP compound semiconductor as optical device
It can be operated at band wavelengths.

Since the optical transceiver of the present invention is configured by using the separate receiving optical module and transmitting optical module, the optical axes of the receiving system and the transmitting system are adjusted and the interaxial distance is adjusted. Can be done independently. Since the sleeve is fixed to each optical module, the assembly process can be greatly simplified. Furthermore, the adjustment of the arrangement interval between these optical modules and the attachment adjustment of the respective sleeves can be performed independently, so that the alignment accuracy of the optical module and the respective sleeves can be adjusted by adjusting the arrangement interval. Not affected. Therefore, it is possible to realize an optical module that is optically extremely accurate.

[Brief description of drawings]

FIG. 1 is a perspective view showing a shape of a lead frame of a receiving optical module according to a first embodiment.

FIG. 2 is a perspective view showing a shape of an intermediate component of the receiving optical module.

FIG. 3 is a perspective view showing the shape of a completed reception optical module.

FIG. 4 is a perspective view showing a shape of a lead frame of the transmitting optical module according to the first embodiment.

FIG. 5 is a perspective view showing a shape of an intermediate component of the transmitting optical module.

FIG. 6 is a perspective view showing the shape of a completed transmission optical module.

FIG. 7 is an explanatory diagram showing a connection structure of a sleeve, a receiving optical module, and a transmitting optical module.

FIG. 8 is a perspective view for explaining the structure of the optical transceiver of the first embodiment.

FIG. 9 is a perspective view for further explaining the structure of the optical transceiver.

FIG. 10 is an explanatory diagram showing the structure of the receiving optical module of the second embodiment together with the manufacturing process.

FIG. 11 is an explanatory diagram showing the structure of the transmission optical module of the second embodiment together with the manufacturing process.

FIG. 12 is a perspective view for explaining the structure of the optical transceiver of the second embodiment.

[Explanation of symbols]

2, 32, 200, 300 ... Lead frame, 4, 3
4, 202, 302 ... Optical device mounting part, 6, 36, 2
04, 304 ... Electronic device mounting portion, 8a to 8d, 38
a, 38b ... Internal lead pins, 10a to 10g, 12a
~ 12g, 40a-40g, 42a-42g, 208,
308 ... External lead pin, 16, 46 ... Submount member, 18, 210 ... Photoelectric conversion device, 48, 31
0 ... Electric-optical conversion device, 20, 50, 212, 31
2 ... 1st resin molding part, 22, 52, 214, 314 ...
Second resin molding part, 24, 54, 216, 316 ... Base part, 26, 56, 218, 318 ... Stand part, 28, 58,
220, 320 ... Aspherical lens, 66, 400 ... Sleeve, 80, 500 ... Aligned substrate, 82 ... Housing.

Continuation of the front page (56) Reference JP-A-8-136767 (JP, A) JP-A-7-282928 (JP, A) JP-A-4-211208 (JP, A) JP-A-11-103004 (JP , A) JP-A-11-87781 (JP, A) JP-A-10-123376 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 31,33 G02B 6/42- 6/43

Claims (12)

(57) [Claims] 1. An optical device for converting one signal into another signal by an optical signal having a wavelength of 1.3 μm band transmitted through an optical fiber and an electric signal corresponding to the optical signal, and an electronic device for processing the electric signal. A device, a lead frame having an optical device mounting part for mounting the optical device and an electronic device mounting part for mounting the electronic device, an optical axis of which coincides with an optical main surface of the optical device, and an optical fiber An optical module comprising a light condensing means coupled to the optical device mounting part and the optical device, which are integrated with a light condensing means optically coupled with the optical device. A first resin molding part made of a resin transparent to the optical signal, the electronic device mounting part and the electronic device being resin-sealed, and A second resin molding portion molded separately from the resin molding portion, the optical device mounting portion and the electronic device mounting portion are connected, and the optical device and the electronic device are electrically and mechanically connected. And an internal lead pin connected to the optical module. 2. The first resin molding portion includes a rectangular parallelepiped base portion and a truncated cone-shaped base portion integrated with the base portion.
The optical module according to claim 1, further comprising: the light condensing unit that is integrated with a top portion of the base portion and has a diameter smaller than that of the base portion. 3. The optical module according to claim 1, wherein the light condensing unit is an aspherical lens. 4. The lead frame is a D for external connection.
The optical module according to claim 1, wherein an IP type external lead pin or a SIP type external lead pin for external connection is provided. 5. The sleeve according to claim 1, further comprising a sleeve having a first portion for receiving the optical fiber and a second portion for fitting the first resin molding portion. The optical module according to 1 above. 6. A sleeve having a first portion that receives the optical fiber and a second portion that fits the base portion of the first resin molding portion.
Optical module described in. 7. The optical module according to claim 1, wherein the optical fiber is a multimode fiber. 8. The optical module according to claim 1, wherein the optical device is mounted on the optical device mounting portion via a submount member. 9. The optical module according to claim 1, wherein the optical device is a surface emitting light emitting diode or a surface emitting semiconductor laser. 10. The optical device is a top-illuminated type In.
The optical module according to claim 1, which is a GaAs photodiode. 11. The optical module according to claim 1, wherein the optical device receives an optical signal transmitted through the optical fiber and converts the optical signal into an electric signal corresponding to the optical signal.
The first optical module, which is an electric conversion device, and the optical module according to claim 1, wherein the optical device receives an electric signal, converts the electric signal into a corresponding optical signal, and emits the electric signal into the optical fiber. An optical transceiver including a second optical module which is a conversion device, wherein the first and second optical modules are housed in the same casing. 12. The lead frame which is a constituent element of the first optical module and the lead frame which is a constituent element of the second optical module are electrically independent from each other. Optical transceiver described in.