CN112859259A - Photoelectric cooperative packaging silicon light engine - Google Patents
Photoelectric cooperative packaging silicon light engine Download PDFInfo
- Publication number
- CN112859259A CN112859259A CN202110253542.XA CN202110253542A CN112859259A CN 112859259 A CN112859259 A CN 112859259A CN 202110253542 A CN202110253542 A CN 202110253542A CN 112859259 A CN112859259 A CN 112859259A
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- chip
- silicon
- silicon light
- pcba
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention provides a photoelectric cooperative packaging silicon light engine, which comprises: the laser comprises a photoelectric module and a laser which is arranged separately from the photoelectric module; the photovoltaic module includes: the heat dissipation substrate, PCBA, electric chip and silicon optical chip; the heat dissipation substrate set up in PCBA's one side, electric chip set up in PCBA's one side, silicon optical chip set up in on the heat dissipation substrate to with be located the homonymy the electric chip is connected, silicon optical chip through optic fibre with the components of a whole that can function independently setting the laser instrument is connected. According to the invention, the heat dissipation substrate, the PCBA, the electric chip and the silicon optical chip are designed into independent modules, and the laser is externally arranged, so that high-density heat dissipation can be realized, the electric chip and the switch chip can be quickly disassembled and easily maintained, meanwhile, the transmission distance between the electric chip and the switch chip is shortened, and the transmission loss of high-frequency signals is well reduced. The invention can be applied to CPO, and greatly improves the characteristics of high density, high bandwidth, signal transmission loss, easy maintenance, low cost maintenance and the like.
Description
Technical Field
The invention relates to the technical field of optical device packaging, in particular to a photoelectric cooperative packaging silicon optical engine.
Background
Photoelectric synergistic encapsulation (CPO) originated in the High Performance Computer (HPC) domain, by 2030 CPO will become the dominant enabling technology for cloud provider data centers, and 63% of CPO product revenue will come from this application market. As data rates for data communications exceed 400G, conventional pluggable optics will have difficulty in cost-effectively keeping up with CPOs.
Currently, the CPO optical engine has about two major branches: one is a solution mainly applied within 30 meters based on a surface emitting laser (VCSEL) technology and a multimode optical fiber, and mainly aims at short-distance interconnection of an ultra-computation and AI cluster. The other is a solution mainly based on silicon optical technology and single-mode fiber and applied for less than 2 kilometers, and mainly solves the application of optical interconnection between large-scale data center racks and clusters.
However, the conventional on-board optical module has the disadvantages that the pluggable performance cannot be realized, and the built-in laser causes the whole on-board optical module to be repaired and replaced once the laser is damaged. And also has the problem of poor heat dissipation and large high-frequency signal loss. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The invention aims to provide a photoelectric cooperative packaging silicon light engine to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
an optoelectronic collaborative packaged silicon light engine, comprising: the laser comprises a photoelectric module and a laser which is arranged separately from the photoelectric module;
the photovoltaic module includes: the heat dissipation substrate, PCBA, electric chip and silicon optical chip;
the heat dissipation substrate set up in PCBA's one side, electric chip set up in PCBA's one side, silicon optical chip set up in on the heat dissipation substrate to with be located the homonymy the electric chip is connected, silicon optical chip through optic fibre with the components of a whole that can function independently setting the laser instrument is connected.
As an improvement of the photoelectric cooperative packaging silicon light engine, the heat dissipation substrate is a tungsten copper substrate.
As an improvement of the photoelectric cooperative packaging silicon light engine, the heat dissipation substrate is installed in the middle area of the PCBA in a fitting mode.
As an improvement of the photoelectric cooperative packaging silicon optical engine, the electric chip is arranged on one surface of the PCBA in a welding mode, and the silicon optical chip is arranged on the heat dissipation substrate in a welding mode.
As an improvement of the photoelectric cooperative packaging silicon optical engine, the electric chip and the PCBA are connected through gold wire bonding, and the electric chip and the silicon optical chip are connected through gold wire bonding.
As an improvement of the photoelectric cooperative packaging silicon optical engine, the number of the electric chips and the number of the silicon optical chips are both multiple, the electric chips are longitudinally arranged on one side of the heat dissipation substrate, the silicon optical chips are arranged corresponding to the electric chips, and any electric chip is connected with the silicon optical chip on one side of the electric chip.
As an improvement of the photoelectric cooperative packaging silicon optical engine, the silicon optical chip is divided into an emitting end silicon optical chip and a receiving end silicon optical chip, and the emitting end silicon optical chip and the receiving end silicon optical chip are longitudinally arranged at intervals.
As an improvement of the photoelectric cooperative packaging silicon optical engine, the transmitting end silicon optical chip is connected with the first optical fiber support in an end face coupling or V-shaped groove passive coupling mode, and the receiving end silicon optical chip is connected with the second optical fiber support in an end face coupling or V-shaped groove passive coupling mode.
As an improvement of the photoelectric cooperative packaging silicon optical engine, the number of the transmitting end silicon optical chips and the number of the receiving end silicon optical chips are two, and the number of the electric chips is four.
As an improvement of the optoelectronic collaborative encapsulation silicon light engine of the present invention, the optoelectronic collaborative encapsulation silicon light engine further comprises a spring plate connector electrically connected to the other side of the PCBA.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the heat dissipation substrate, the PCBA, the electric chip and the silicon optical chip are designed into independent modules, and the laser is externally arranged, so that high-density heat dissipation can be realized, the electric chip and the switch chip can be quickly disassembled and easily maintained, meanwhile, the transmission distance between the electric chip and the switch chip is shortened, and the transmission loss of high-frequency signals is well reduced. The invention can be applied to CPO, and greatly improves the characteristics of high density, high bandwidth, signal transmission loss, easy maintenance, low cost maintenance and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a front side of an embodiment of an optoelectronic package silicon light engine of the present invention;
fig. 2 is a schematic back view of the optoelectronic module shown in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, the present invention provides an optoelectronic cooperative packaging silicon light engine, which includes: the optoelectronic module 10 and the laser 20 separately installed from the optoelectronic module 10.
The photoelectric module 10 is arranged independently relative to the laser 20, so that high-density heat dissipation and quick disassembly and easy maintenance can be realized, and the problem that once the laser 20 is damaged, the whole onboard optical module needs to be maintained and replaced due to the built-in laser 20 in the prior art is solved.
The photovoltaic module 10 includes: heat sink substrate 11, PCBA12, electrical chip 13, and silicon optical chip 14. Design into independent module with above-mentioned radiating basal plate 11, PCBA12, electric chip 13 and silicon optical chip 14, still be favorable to shortening the transmission distance of electric chip 13 and switch chip simultaneously to fine reduction high frequency signal transmission loss.
The heat dissipation substrate 11 is disposed on one surface of the PCBA12, and the heat dissipation substrate 11 is provided to facilitate heat dissipation of the silicon optical chip 14. The heat dissipating substrate 11 may be a tungsten copper substrate, and in the mounting method, the heat dissipating substrate 11 may be mounted in the middle area of the PCBA12 by fitting. The PCBA12 may be an existing product, and integrates the functions of MCU, resistor, capacitor, etc.
The electrical chip 13 is disposed on one surface of the PCBA12, and the silicon optical chip 14 is disposed on the heat dissipating substrate 11 and connected to the electrical chip 13 located on the same side. In one embodiment of the mounting method, the electrical die 13 can be bonded to one side of the PCBA12 by soldering, and the silicon optical die 14 can be bonded to the heat sink substrate 11 by soldering. To achieve the connection between PCBA12, electrical chip 13, and silicon photonic chip 14, electrical chip 13 and PCBA12 are connected by gold wire bonding, and electrical chip 13 and silicon photonic chip 14 are connected by gold wire bonding. The silicon optical chip 14 is connected to a laser 20 provided separately through an optical fiber.
The electric chip 13 and the silicon optical chip 14 are both plural. At this time, the electric chips 13 and the silicon optical chip 14 are optimally arranged to form the independent optical electrical module 10 as follows: the plurality of electric chips 13 are longitudinally arranged on one side of the heat dissipation substrate 11, the plurality of silicon optical chips 14 are arranged corresponding to the plurality of electric chips 13, and any electric chip 13 is connected with the silicon optical chip 14 on one side thereof.
According to the actual application requirements, the silicon optical chip 14 can be divided into an emitting end silicon optical chip 140 and a receiving end silicon optical chip 141, so as to form optical communication with the laser 20. At this time, the transmitting end silicon optical chips 140 and the receiving end silicon optical chips 141 are arranged longitudinally at intervals, and each of the silicon optical chips 140 and 141 is connected to the corresponding electrical chip 13. The transmitting end silicon optical chip 140 and the receiving end silicon optical chip 141 may be the same or different types of silicon optical chips, and in order to connect with the laser 20, the transmitting end silicon optical chip 140 is connected with the first optical fiber support 15 by end face coupling or V-groove passive coupling, and the receiving end silicon optical chip 141 is connected with the second optical fiber support 16 by end face coupling or V-groove passive coupling.
In one embodiment, there are two transmitting-side silicon optical chips 140 and two receiving-side silicon optical chips 141, and four electrical chips 13. At this time, the transmitting-side silicon optical chip 140, the receiving-side silicon optical chip 141, the transmitting-side silicon optical chip 140, and the receiving-side silicon optical chip 141 are arranged in sequence in the longitudinal direction. In other embodiments, the number of the transmitting-side silicon optical chips 140 and the receiving-side silicon optical chips 141 is not limited to the number shown in the drawings, and can be adjusted according to the structural size of the structured light engine.
To meet the application requirements, the optoelectronic collaborative packaged silicon light engine further includes a spring connector 30, wherein the spring connector 30 is electrically connected to the other side of the PCBA 12. By means of the elastic sheet connector 30, the optoelectronic collaborative encapsulation silicon photo engine can be electrically connected to the mainboard of the applied product.
In conclusion, the heat dissipation substrate, the PCBA, the electric chip and the silicon optical chip are designed into independent modules, and the laser is externally arranged, so that high-density heat dissipation is achieved, the electric chip and the switch chip can be quickly disassembled and easily maintained, the transmission distance between the electric chip and the switch chip is shortened, and the transmission loss of high-frequency signals is well reduced. The invention can be applied to CPO, and greatly improves the characteristics of high density, high bandwidth, signal transmission loss, easy maintenance, low cost maintenance and the like.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. An optoelectronic cooperating packaged silicon light engine, comprising: the laser comprises a photoelectric module and a laser which is arranged separately from the photoelectric module;
the photovoltaic module includes: the heat dissipation substrate, PCBA, electric chip and silicon optical chip;
the heat dissipation substrate set up in PCBA's one side, electric chip set up in PCBA's one side, silicon optical chip set up in on the heat dissipation substrate to with be located the homonymy the electric chip is connected, silicon optical chip through optic fibre with the components of a whole that can function independently setting the laser instrument is connected.
2. The optoelectronic collaboration packaged silicon light engine as specified in claim 1 wherein the heat spreader substrate is a tungsten copper substrate.
3. The optoelectronic cooperative packaging silicon light engine as recited in claim 1 or 2, wherein the heat sink substrate is mounted to the PCBA at a middle region thereof by a fitting manner.
4. The optoelectronic cooperative packaged silicon light engine as recited in claim 1, wherein the electrical die is attached to one side of the PCBA by soldering, and the silicon light die is attached to the heat sink substrate by soldering.
5. The optoelectronic collaboration packaged silicon light engine as recited in claim 1 or 4, wherein the electrical chip and the PCBA are connected by gold wire bonding, and the electrical chip and the silicon light chip are connected by gold wire bonding.
6. The optoelectronic collaboration packaged silicon light engine as claimed in claim 1, wherein the electrical chips and the silicon light chips are all plural, the electrical chips are arranged longitudinally on one side of the heat dissipation substrate, the silicon light chips are disposed corresponding to the electrical chips, and any electrical chip is connected to the silicon light chip on one side.
7. The optoelectronic cooperative packaged silicon light engine as recited in claim 6, wherein the silicon light chips are divided into an emitting end silicon light chip and a receiving end silicon light chip, and the emitting end silicon light chip and the receiving end silicon light chip are arranged longitudinally and alternately.
8. The optoelectronic cooperative packaged silicon optical engine as claimed in claim 7, wherein the transmitting end silicon optical chip is connected to the first optical fiber support by end-face coupling or V-groove passive coupling, and the receiving end silicon optical chip is connected to the second optical fiber support by end-face coupling or V-groove passive coupling.
9. The optoelectronic cooperative packaged silicon light engine as claimed in claim 7 or 8, wherein there are two emitting end silicon optical chips and four receiving end silicon optical chips.
10. The optoelectronic package silicon light engine of claim 1, further comprising a spring connector electrically connected to another side of the PCBA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110253542.XA CN112859259A (en) | 2021-03-09 | 2021-03-09 | Photoelectric cooperative packaging silicon light engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110253542.XA CN112859259A (en) | 2021-03-09 | 2021-03-09 | Photoelectric cooperative packaging silicon light engine |
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| Publication Number | Publication Date |
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| CN112859259A true CN112859259A (en) | 2021-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110253542.XA Pending CN112859259A (en) | 2021-03-09 | 2021-03-09 | Photoelectric cooperative packaging silicon light engine |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113376775A (en) * | 2021-07-16 | 2021-09-10 | 亨通洛克利科技有限公司 | 800G silicon optical module |
| CN113484961A (en) * | 2021-08-13 | 2021-10-08 | 亨通洛克利科技有限公司 | Grating coupling CPO silicon light engine |
| WO2022252913A1 (en) * | 2021-06-03 | 2022-12-08 | 华为技术有限公司 | Optoelectronic hybrid packaging structure and electronic device |
Citations (4)
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| CN107819515A (en) * | 2017-11-20 | 2018-03-20 | 江苏亨通光网科技有限公司 | A kind of highly integrated multichannel optical transceiver module of silicon photon chip and active optical cable |
| CN109841600A (en) * | 2019-01-31 | 2019-06-04 | 亨通洛克利科技有限公司 | The encapsulating structure and its packaging method of silicon photon optical module |
| CN109884754A (en) * | 2019-04-23 | 2019-06-14 | 苏州海光芯创光电科技有限公司 | A kind of coupled structure and encapsulating structure of laser and silicon optical chip |
| CN214174690U (en) * | 2021-03-09 | 2021-09-10 | 亨通洛克利科技有限公司 | Photoelectric cooperative packaging silicon light engine |
-
2021
- 2021-03-09 CN CN202110253542.XA patent/CN112859259A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107819515A (en) * | 2017-11-20 | 2018-03-20 | 江苏亨通光网科技有限公司 | A kind of highly integrated multichannel optical transceiver module of silicon photon chip and active optical cable |
| CN109841600A (en) * | 2019-01-31 | 2019-06-04 | 亨通洛克利科技有限公司 | The encapsulating structure and its packaging method of silicon photon optical module |
| CN109884754A (en) * | 2019-04-23 | 2019-06-14 | 苏州海光芯创光电科技有限公司 | A kind of coupled structure and encapsulating structure of laser and silicon optical chip |
| CN214174690U (en) * | 2021-03-09 | 2021-09-10 | 亨通洛克利科技有限公司 | Photoelectric cooperative packaging silicon light engine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022252913A1 (en) * | 2021-06-03 | 2022-12-08 | 华为技术有限公司 | Optoelectronic hybrid packaging structure and electronic device |
| CN113376775A (en) * | 2021-07-16 | 2021-09-10 | 亨通洛克利科技有限公司 | 800G silicon optical module |
| CN113484961A (en) * | 2021-08-13 | 2021-10-08 | 亨通洛克利科技有限公司 | Grating coupling CPO silicon light engine |
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