CN114035285A

CN114035285A - Optical module

Info

Publication number: CN114035285A
Application number: CN202111434220.1A
Authority: CN
Inventors: 吴涛; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-11-29
Filing date: 2021-11-29
Publication date: 2022-02-11
Anticipated expiration: 2041-11-29
Also published as: CN114035285B

Abstract

The optical module comprises a light emission submodule which is respectively connected with a first optical fiber adapter and a second optical fiber adapter, wherein the light emission submodule comprises a first light emission component, a second light emission component, a first optical circulator, a second translation prism and a third translation prism; one end of the second translation prism is positioned at the light outlet of the first optical circulator, and the other end of the second translation prism extends to the outside of the light emission submodule and is opposite to the first light receiving submodule to translate the light from the first optical circulator to the first light receiving submodule; one end of the third translation prism is positioned at the light outlet of the second optical circulator, and the other end of the third translation prism extends to the outside of the light emission submodule and is opposite to the second light receiving submodule to translate the light from the second optical circulator to the second light receiving submodule. The application combines the optimized module structure design to realize the combination and separation of the two-way optical signals.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

With the increasing demand of data centers for communication bandwidth, the speed requirement of optical modules is higher and higher, and especially in recent years, 400G and 800G optical modules are gradually brought to the market. With the increase of transmission rate, the limited optical fiber resource gradually becomes a bottleneck of expanding transmission bandwidth. The bidirectional transmission of a single optical fiber is one of the effective ways to alleviate this bottleneck. However, as the size of the optical module is smaller and smaller, how to combine and separate the two-way transmission optical signals in the limited space of the existing optical module becomes a key to achieve the goal.

Disclosure of Invention

The embodiment of the application provides an optical module, which is used for realizing combination and separation of bidirectional transmission optical signals in a limited space of the existing optical module, reasonably distributing optical components and optimizing an assembly process.

The application provides an optical module, includes:

the optical fiber adapter comprises a first optical fiber adapter, a second optical fiber adapter, a light emitting secondary module, a first optical circulator, a second translation prism and a third translation prism, wherein the first optical fiber adapter is connected with the first optical fiber adapter;

one end of the second translation prism is positioned at the light outlet of the first optical circulator, and the other end of the second translation prism extends to the outside of the light emission submodule and is opposite to the first light receiving submodule; translating light from the first optical circulator to the first rosa;

one end of the third translation prism is positioned at the light outlet of the second optical circulator, and the other end of the third translation prism extends to the outside of the light emission submodule and is opposite to the second light receiving submodule; translating light from the second optical circulator to a second optical receive sub-module;

the light of the first light emitting assembly is transmitted to the first light circulator after passing through the second translation prism;

the light of the second light emitting assembly is emitted to the second light circulator;

the first optical fiber adapter receives the light from the first optical circulator and directs the light from the outside of the optical module to the first optical circulator;

and the second optical fiber adapter receives the light from the second optical circulator and directs the light from the outside of the optical module to the second optical circulator.

The optical module provided by the embodiment of the application comprises a light emission submodule, a first light receiving submodule, a second light receiving submodule, a first optical fiber adapter and a second optical fiber adapter, wherein the light emission submodule is respectively connected with the first optical fiber adapter and the second optical fiber adapter and comprises a first light emission assembly, a second light emission assembly, a first optical circulator, a second translation prism and a third translation prism; one end of the second translation prism is positioned at the light outlet of the first optical circulator, the other end of the second translation prism extends to the outside of the optical transmitter sub-module and is opposite to the first optical receiver sub-module, light of the first optical transmitter assembly penetrates through the second translation prism and then is emitted to the first optical circulator, and the light from the first optical circulator is translated to the first optical receiver sub-module, so that an optical signal emitted by the first optical transmitter assembly is separated from an external optical signal through the first optical circulator, combination and separation of two-way transmission light beams can be realized in a narrow space, and the light transmitter and the light receiver can share a single optical fiber; and the light output by the first light circulator is subjected to light path translation through the second translation prism so as to translate the light to the first light receiving secondary module, and the light can be received. One end of the third translation prism is positioned at a light outlet of the second optical circulator, the other end of the third translation prism extends to the outside of the optical transmitter sub-module and is opposite to the second optical receiver sub-module, light of the second optical transmitter assembly is emitted to the second optical circulator, namely, the light from the second optical circulator is translated to the second optical receiver sub-module, so that an optical signal emitted by the second optical transmitter assembly is separated from an external optical signal through the second optical circulator, combination and separation of bidirectional transmission light beams can be realized in a narrow space, and the light transmission and the signal reception can share a single optical fiber; and the light output by the second light circulator is subjected to light path translation through the third translation prism so as to translate the light to the second light receiving submodule, and the light can be received. The first optical fiber adapter receives light from the first optical circulator and emits light from the outside of the optical module to the first optical circulator; the second optical fiber adapter receives light from the second optical circulator and directs light from outside the optical module to the second optical circulator. This application is through two optical fiber adapters, two optic fibre, two optical circulator can realize two way transmitting optical signal and two way single fiber two-way optical transmission who receives optical signal, can realize the light path translation through two translation prisms, in order to realize the receipt of two ways light, from this through the composite wave of rational arrangement optical emission submodule and optical reception submodule, the distribution of wavelength division light path, simplify optical module structure, optimize the assembly flow, make the very big simplification of the holistic assembly of module, production efficiency and maintenance efficiency are for improving greatly, more be fit for mass production.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is an assembly schematic diagram of a circuit board, a tosa, a rosa and an optical fiber adapter in an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 7 is a partially exploded schematic view of a circuit board, an optical transmitter sub-assembly, and an optical fiber adapter in an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of an inverted structure of a light emission submodule in an optical module according to an embodiment of the present application;

fig. 9 is a schematic view illustrating another angle assembly of a circuit board and a tosa in an optical module according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram of an inverted structure of a transmitting base in an optical module according to an embodiment of the present application;

fig. 11 is a cross-sectional view of a light emission sub-module in a light module according to an embodiment of the present disclosure;

fig. 12 is a schematic diagram of a transmission optical path in an optical module according to an embodiment of the present disclosure;

fig. 13 is another schematic angle diagram of a transmitting optical path in an optical module according to an embodiment of the present disclosure;

fig. 14 is a schematic diagram of light splitting and combining of an optical circulator in an optical module according to an embodiment of the present application;

fig. 15 is an assembly diagram of a circuit board, a tosa, and a rosa in an optical module according to an embodiment of the present disclosure;

fig. 16 is a schematic diagram of a transmitting optical path and a receiving optical path in an optical module according to an embodiment of the present disclosure;

fig. 17 is a schematic signal connection diagram of a light emission sub-module in an optical module according to an embodiment of the present disclosure;

fig. 18 is a cross-sectional view of signal connection between a light emission sub-module and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 19 is a schematic signal connection diagram of an optical receive sub-module in an optical module according to an embodiment of the present disclosure;

fig. 20 is a cross-sectional view of signal connection between a light receiving sub-assembly and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 21 is a cross-sectional view of a heat dissipation channel of a light emission submodule and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 22 is a cross-sectional view of a heat dissipation channel of a light receiving sub-assembly in an optical module according to an embodiment of the present disclosure.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C," each including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of several kilometers (6 kilometers to 8 kilometers), on the basis of which if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, the optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component located on an outer wall of a housing thereof, and the unlocking component is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with the cage of the upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member; when the unlocking member is pulled, the engaging member of the unlocking member moves along with the unlocking member, and further the connection relationship between the engaging member and the upper computer is changed, so that the engagement relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, Metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to adapt to the situation with a large demand for the number of pins. The golden finger is configured to establish an electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

Fig. 5 is an assembly schematic diagram of a circuit board, a tosa, a rosa, and an optical fiber adapter in an optical module according to an embodiment of the present disclosure. As shown in fig. 5, in the optical module provided in the embodiment of the present application, the optical transceiver includes a tosa 400, a first tosa 500, and a second tosa 600, the tosa 400 adopts a light emitter structure with an upward bottom surface (flip-chip), so that the bottom surface of the tosa 400 is in contact with the upper housing 201, and the heat dissipation characteristic of the tosa 400 is greatly improved; the tosa 400 and the first rosa 500 are connected to the first fiber adapter 700 through the same fiber, and the tosa 400 and the second rosa 600 are connected to the second fiber adapter 800 through the same fiber. That is, part of the optical signals transmitted by the tosa 400 are transmitted through one internal optical fiber and the first optical fiber adapter 700, and the rest of the optical signals are transmitted through the other internal optical fiber and the second optical fiber adapter 800, so as to implement light transmission; external optical signals are transmitted to the first optical receiving sub-module 500 through the first optical fiber adapter 700 and an internal optical fiber, and transmitted to the second optical receiving sub-module 600 through the second optical fiber adapter 800 and another internal optical fiber, so that light receiving is realized. Therefore, the optical transmitting signal and the optical receiving signal share the single optical fiber, and the requirement and occupation of optical fiber resources can be reduced.

Fig. 6 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present disclosure, and fig. 7 is a schematic partial exploded view of the circuit board, the tosa, and the fiber adapter in the optical module according to the embodiment of the present disclosure. As shown in fig. 6 and 7, the circuit board 300 is provided with a mounting hole 320, the laser assembly of the tosa 400 is embedded in the mounting hole 320, so as to approach the laser assembly to the lower surface (back surface) of the circuit board 300, and the tosa 400 is reversely assembled to the circuit board 300, so that the routing surface of the laser assembly and the back surface of the circuit board 300 are located on the same surface during assembly, thereby minimizing the connecting routing between the back surface of the circuit board 300 and the laser assembly, and ensuring excellent high-frequency transmission performance.

A signal processing chip 310, an MCU, a power management chip, a TIA (Trans-impedance Amplifier), a high-speed PD (Photo Diode), etc. may be disposed on the front surface of the circuit board 300, the signal processing chip 310 is connected to the transimpedance Amplifier via a high-frequency signal line, and the signal processing chip 310 is used for processing a high-frequency signal.

The circuit design on the back side of the circuit board 300 is mainly to transmit the high frequency signal transmitted from the gold finger end to the tosa 400 through the high frequency via hole and the high frequency trace of the circuit board after being processed by the signal processing chip 310, so that the tosa 400 transmits the optical signal. Meanwhile, the first optical receive sub-module 500 and the second optical receive sub-module 600 convert the received external optical signals into electrical signals, and the high-frequency signals received by the PD are amplified by the TIA, transmitted to the signal processing chip 310 via a high-frequency signal line connecting the TIA and the signal processing chip 310 for processing, and then transmitted to the communication system via the gold finger.

The circuit design and device layout of the circuit board 300 are mainly for facilitating the mounting, coupling and circuit connection of optical components required for the transmitting signal of the tosa 400 and the receiving signals of the first and second rosas 500 and 600.

Fig. 8 is a schematic diagram of an inverted structure of a tosa in an optical module according to an embodiment of the present disclosure, and fig. 9 is a schematic diagram of another angle partial assembly between a circuit board and the tosa in the optical module according to an embodiment of the present disclosure. As shown in fig. 8 and 9, the tosa 400 may include an emission base 410, and a first and a second light emitting assembly disposed on the emission base 410, wherein the first and the second light emitting assemblies each include a laser 420, a collimating lens 430, a first shifting prism 440, a first optical circulator 4610 and a second optical circulator 4620, a bottom surface (a surface facing away from the installation surface) of the emission base 410 faces the upper housing 201, the installation surface of the emission base 410 faces the circuit board 300, the laser 420, the collimating lens 430, the first shifting prism 440, the first optical circulator 4610 and the second optical circulator 4620 are installed on the installation surface of the emission base 410, and the installation heights of the laser 420, the collimating lens 430 and the first shifting prism 440 are higher than the installation heights of the first and the second

optical circulators

4610 and 4620, so that the laser 420, the collimating lens 430 and the first shifting prism 440 are located on the back side of the circuit board 300 through the installation holes 320 on the circuit board 300, the first optical circulator 4610 and the second optical circulator 4620 are located on the front side of the circuit board 300.

The laser beam emitted by the laser 420 is converted into a collimated beam through the collimating lens 430, the collimated beam reflects the collimated beam positioned on the back side of the circuit board 300 to the front side of the circuit board 300 through the first shifting prism 440, the laser beam reflected by the first shifting prism 440 directly passes through the optical circulator, and the laser beam passing through the optical circulator is coupled to the optical fiber adapter, so that the emission of an optical signal is realized.

For an optical module with a high transmission rate, such as an 800G optical module, to implement the transmission rate of the 800G optical module, it is necessary to integrate 8 optical transmitters and 8 optical receivers in the package of QSFP-DD or OSFP, so that the tosa 400 includes 8 optical transmitters to implement the transmission of 8 optical transmission beams; the first optical receive sub-module 500 includes 4 optical receivers to implement reception of 4 external optical signals; the second optical receive sub-module 600 includes 4 optical receivers to implement reception of 4 external optical signals.

Based on this, the light emission submodule 400 may further include a transmitting base 410, and a plurality of lasers 420, a plurality of collimating lenses 430, a first shifting prism 440, a first light combiner 4510, a second light combiner 4520, a first light circulator 4610, and a second light circulator 4620 disposed on the transmitting base 410, where a bottom surface of the transmitting base 410 faces the upper housing 201, a mounting surface of the transmitting base 410 faces the circuit board 300, the plurality of lasers 420, the plurality of collimating lenses 430, the first shifting prism 440, the first light combiner 4510, the second light combiner 4520, the first light circulator 4610, and the second light circulator 4620 are all mounted on the mounting surface of the transmitting base 410, and mounting heights of the lasers 420, the collimating lenses 430, and the first shifting prism 440 are higher than mounting heights of the first light combiner 4510, the second light combiner 4520, the first light circulator 4610, and the second light circulator 4620.

In some embodiments, the tosa 400 further includes a first fiber coupler 4710 and a second fiber coupler 4720, the first fiber coupler 4710 and the second fiber coupler 4720 are both disposed on the mounting surface of the launch base 410, and a composite light beam transmitted through the first optical circulator 4610 is coupled to a single-mode fiber through the first fiber coupler 4710 and launched out through the single-mode fiber and the first fiber adapter 700; the other composite beam transmitted through the second optical circulator 4620 is coupled to another single-mode fiber via the second fiber coupler 4720, and is launched out through the single-mode fiber, the second fiber adapter 800.

In some embodiments, the first fiber coupler 4710 and the second fiber coupler 4720 may each be comprised of a coupling lens and a fiber flange, also referred to as a fiber collimator, through which a collimated beam is focused onto the fiber flange to enter the fiber. In the embodiment shown in fig. 8, the coupling lens and the fiber flange are pre-mounted in a glass sleeve to ensure concentricity. In the same principle, the coupling lens and the fiber flange can be assembled by active coupling by using separate parts.

The transmitting base 410 is installed on the front side of the circuit board 300, the plurality of lasers 420 and the plurality of collimating lenses 430 installed on the transmitting base 410 are located on the back side of the circuit board 300 through the mounting holes 320, one end of the first translation prism 440 is located on the back side of the circuit board 300 through the mounting holes 320, the other end of the first translation prism 440 is located on the front side of the circuit board 300, and the first optical combiner 4510, the second optical combiner 4520, the first optical circulator 4610, the second optical circulator 4620, the first optical fiber coupler 4710 and the second optical fiber coupler 4720 are all located on the front side of the circuit board 300.

In some embodiments, the tosa 400 includes 8 lasers 420, 8 collimating lenses 430 and a first translating prism 440, the lasers 420 and the collimating lenses 430 are arranged in a one-to-one correspondence, each laser 420 emits one laser beam, each collimating lens 430 converts each laser beam into a collimated beam, the collimated beam emitted by each collimating lens 430 is transmitted to the first translating prism 440, and the collimated beam is reflected by the first translating prism 440 to change the transmission direction and position of the laser beam.

The plurality of lasers 420 respectively emit laser beams parallel to the back surface of the circuit board 300; the plurality of collimating lenses 430 convert the laser beam emitted from the laser 420 into a collimated beam, the plurality of collimated beams are transmitted to the first translating prism 440, and the first translating prism 440 reflects the laser beam located at the back side of the circuit board 300 to the front side of the circuit board 300.

The first translation prism 440 functions to translate the 8-way beam upwards by a distance such that all subsequent optics positions are on the front side of the circuit board 300 and at a suitable gap from the circuit board 300. Thus, the position conflict between the optical device and the circuit board 300 is avoided, so that the hole digging area of the circuit board 300 can be reduced as much as possible, the arrangement area of the electronic devices on the circuit board 300 is increased, and the wiring of the circuit board 300 is easier.

In some embodiments, the first translation prism 440 includes a first mirror and a second mirror, the first mirror facing the collimating lens 430 and located at the back side of the circuit board 300 for reflecting the collimated light beam parallel to the back side of the circuit board 300 into a collimated light beam perpendicular to the circuit board 300; the second mirror faces the first mirror, is located on the front side of the circuit board 300, and reflects the collimated light beam perpendicular to the circuit board 300 into a collimated light beam parallel to the front side of the circuit board 300.

The first optical multiplexer 4510 and the second optical multiplexer 4520 are disposed side by side on the mounting surface of the transmitting base 410, that is, the first optical multiplexer 4510 and the second optical multiplexer 4520 are disposed side by side along the front-rear direction of the transmitting base 410, and the light input ends of the first optical multiplexer 4510 and the second optical multiplexer 4520 face the light output end of the first translation prism 440, so as to respectively emit 8 laser beams parallel to the front surface of the circuit board 300 into the first optical multiplexer 4510 and the second optical multiplexer 4520, wherein 4 laser beams are emitted into the first optical multiplexer 4510, and the first optical multiplexer 4510 combines the 4 laser beams into a composite beam; in addition, 4 laser beams are emitted into the second optical combiner 4520, and the second optical combiner 4520 combines the 4 laser beams into another composite beam.

The right side of the first optical combiner 4510 includes four light inlets for inputting signal light of a plurality of wavelengths, and each light inlet is for inputting signal light of one wavelength; the left side of the first optical combiner 4510 includes an exit port for exiting light. Taking 4 wavelengths of λ 1, λ 2, λ 3, and λ 4 incident on the first optical combiner 4510 as an example, λ 1 signal light enters the first optical combiner 4510 through the first light entrance, and reaches the light exit after six different reflections at six different positions in the first optical combiner 4510; the λ 2 signal light enters the first optical combiner 4510 through the second light inlet, and reaches the light outlet after being reflected for four times at four different positions in the first optical combiner 4510; the λ 3 signal light enters the first optical multiplexer 4510 through the third light inlet, and reaches the light outlet after being reflected twice differently at two different positions in the first optical multiplexer 4510; the λ 4 signal light enters the first optical multiplexer 4510 through the fourth light inlet, and is directly transmitted to the light outlet. In this way, the first optical multiplexer 4510 realizes that the signal lights with different wavelengths are input through different light input ports and output through the same light output port, thereby realizing the light combination of the signal lights with different wavelengths.

After the plurality of laser beams positioned on the back side of the circuit board 300 are reflected to the front side of the circuit board 300 by the first translation prism 440, the plurality of laser beams are combined into two composite beams by the first optical combiner 4510 and the second optical combiner 4520. The emission light beam emitted by the laser 420 is linearly polarized light, after the emission light beam is emitted into the first optical circulator 4610 and the second optical circulator 4620, the emission light beam keeps linearly transmitted in the optical paths of the first optical circulator 4610 and the second optical circulator 4620, and the path is not changed, so that the two paths of composite light beams respectively and directly penetrate through the first optical circulator 4610 and the second optical circulator 4620, the composite light beam penetrating through the first optical circulator 4610 is coupled to the first optical fiber adapter 700 through the first optical fiber coupler 4710, the composite light beam penetrating through the second optical circulator 4620 is coupled to the second optical fiber adapter 800 through the second optical fiber coupler 4720, and the emission of multiple paths of optical signals is realized.

In some embodiments, the optical circulator includes an optical inlet, an optical outlet, and an optical inlet and an optical outlet, the optical inlet and the optical outlet face to the first fiber adapter 700 and the second fiber adapter 800, the optical inlet and the optical outlet are located on the same side, and the optical inlet and the optical outlet face away from the first fiber adapter 700.

The light outlet of the first optical combiner 4510 corresponds to the light inlet of the first optical circulator 4610, one path of the composite light beam output by the first optical combiner 4510 is emitted into the first optical circulator 4610 through the light inlet of the first optical circulator 4610, the composite light beam directly passes through the first optical circulator 4610 and is emitted into the first optical fiber coupler 4710 through the light inlet and outlet, and the composite light beam is coupled to the first optical fiber adapter 700 through the first optical fiber coupler 4710, so that the purpose that the composite light beam synthesized by multiple paths of emission light beams is emitted out is achieved.

The light outlet of the second optical combiner 4520 corresponds to the light inlet of the second optical circulator 4620, one path of the composite light beam output by the second optical combiner 4520 is emitted into the second optical circulator 4620 through the light inlet of the second optical circulator 4620, the composite light beam directly passes through the second optical circulator 4620 and is emitted into the second optical fiber coupler 4720 through the light inlet and outlet, and the composite light beam is coupled to the second optical fiber adapter 800 through the second optical fiber coupler 4720, so that the purpose that the composite light beam synthesized by multiple paths of emission light beams is emitted out is achieved.

Fig. 10 is a schematic diagram of an inverted structure of a transmitting base in an optical module provided in the embodiment of the present application. As shown in fig. 10, to support and fix the laser 420, the collimating lens 430, the first translation prism 440, the first optical multiplexer 4510, the second optical multiplexer 4520, the first optical circulator 4610, the second optical circulator 4620, the first optical fiber coupler 4710 and the second optical fiber coupler 4720, the transmitting base 410 includes a first mounting surface 4110, a second mounting surface 4120 and a third mounting surface 4130, the first mounting surface 4110 is recessed in the second mounting surface 4120, the second mounting surface 4120 is recessed in the third mounting surface 4130, that is, the third mounting surface 4130 has a smaller dimension from the front surface of the circuit board 300 than the second mounting surface 4120, and the second mounting surface 4120 has a smaller dimension from the front surface of the circuit board 300 than the first mounting surface 4110 so that the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 form a stepped surface.

In the embodiment of the present application, each of the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 is parallel to the front surface of the circuit board 300, and the front and rear ends of the second mounting surface 4120 are open to facilitate fixing the first translation prism 440 to the second mounting surface 4120; the front and rear ends of the first mounting surface 4110 are open to facilitate fixing the optical multiplexer and the optical circulator on the first mounting surface 4110. The front and rear ends of the third mounting surface 4130 may be provided with a baffle plate, and the side surface facing the circuit board 300 may abut against the front side of the circuit board 300.

Fig. 11 is a cross-sectional view of a light emission sub-module in a light module according to an embodiment of the present application. As shown in fig. 11, the tosa 400 further includes a semiconductor cooler 480 and a laser substrate 490, the semiconductor cooler 480 is disposed on the third mounting surface 4130 of the transmitting base 410, each laser 420 is disposed on the laser substrate 490, each laser substrate 490 is disposed on the cooling surface of the semiconductor cooler 480, a collimating lens 430 corresponding to the laser 420 is disposed on the cooling surface of the semiconductor cooler 480, and the collimating lens 430 is disposed in the light-emitting direction of the laser 420.

In some embodiments, the semiconductor cooler 480 is first placed on the third mounting surface 4130 of the emission base 410, 8 lasers 420 and 8 collimating lenses 430 are disposed on the semiconductor cooler 480, the 8 lasers 420 are respectively disposed on 8 laser substrates 490, and the 8 laser substrates 490 are disposed side by side along the front-rear direction of the emission base 410, so that the 8 lasers 420 emit 8 light beams with different wavelengths.

The 8 laser substrates 490 disposed on the semiconductor refrigerator 480 may have the same size in the left and right directions, so that the 8 collimating lenses 430 have the same size from the left and right end surfaces of the semiconductor refrigerator 480, thereby disposing the 8 lasers 420 on the semiconductor refrigerator 480 in a row, and the 8 collimating lenses 430 are also disposed on the semiconductor refrigerator 480 in a row.

The left and right dimensions of the 8 laser substrates 490 arranged on the semiconductor refrigerator 480 can be different, the dimension of the laser substrate 490 close to the rear side of the semiconductor refrigerator 480 from the right end face of the semiconductor refrigerator 480 is smaller, and the dimension of the laser substrate 490 adjacent to the laser substrate 490 from the right end face of the semiconductor refrigerator 480 is larger, so that the 8 laser substrates 490 are fixed on the semiconductor refrigerator 480 at intervals in the arrangement modes of short, long, short and long; the size of the collimating lens 430 arranged in the light-emitting direction of the laser 420 from the left end surface of the semiconductor refrigerator 480 is different, so that mutual influence caused by glue flowing is avoided when the collimating lens 430 is assembled. That is, two front and back rows of 8 lasers 420 are disposed on the semiconductor refrigerator 480, and two front and back rows of 8 collimating lenses 430 are disposed on the semiconductor refrigerator 480. In this way, by optimizing the design of the laser substrate 490, the pitch of the multiple collimated lights can be reduced to reduce the collective size of the entire emission base 410, particularly the width dimension of the emission base 410 in the front-rear direction, so that no conflict occurs with the light-receiving sub-module when assembling.

In some embodiments, a front-rear direction width dimension of third mounting surface 4130 may be slightly greater than a front-rear direction width dimension of second mounting surface 4120, and a front-rear direction width dimension of second mounting surface 4120 may coincide with a front-rear direction width dimension of first mounting surface 4110. When the plurality of lasers 420 are fixed to the third mounting surface 4130 side by side in the front-rear direction, the wider third mounting surface 4130 facilitates placement of the lasers 420, and prevents the adjacent lasers 420 from being closer to each other, thereby preventing crosstalk of laser beams emitted by the lasers 420.

In some embodiments, the laser 420 disposed on the semiconductor cooler 480 is a narrow width laser, which greatly reduces the spacing between adjacent laser beams, e.g., 0.75mm, which greatly reduces the total width of the entire tosa 400, thereby reducing the volume of the tosa 400 and the corresponding hole area of the circuit board 300.

The first translating prism 440 is disposed on the second mounting surface 4120 recessed in the third mounting surface 4130, the first translating prism 440 is perpendicularly fixed on the second mounting surface 4120, the first mirror of the first translating prism 440 is far from the second mounting surface 4120 and close to the laser 420 on the semiconductor refrigerator 480, the second mirror of the first translating prism 440 is close to the second mounting surface 4120 and is located on the front side of the circuit board 300, so that the laser beam on the back side of the circuit board 300 is reflected to the front side of the circuit board 300 by the first translating prism 440.

A first optical combiner 4510, a second optical combiner 4520, a first optical circulator 4610 and a second optical circulator 4620 are disposed on the first mounting surface 4110 recessed in the second mounting surface 4120, the first optical combiner 4510 and the second optical combiner 4520 are disposed side by side along the front-rear direction of the transmitting base 410, the first optical circulator 4610 and the second optical circulator 4620 are disposed side by side along the front-rear direction of the transmitting base 410, and the optical combiners and the optical circulators are arranged along the light emitting direction.

In some embodiments, a width dimension of the first mounting surface 4110 in a front-back direction may be smaller than a width dimension of the first optical multiplexer 4510 and the second optical multiplexer 4520 in a front-back direction, such that when the first optical multiplexer 4510 and the second optical multiplexer 4520 are disposed side by side on the first mounting surface 4110 in the front-back direction, a side of the first optical multiplexer 4510 and a side of the second optical multiplexer 4520 both protrude from a front side and a rear side of the first mounting surface 4110, thereby reducing a size of the transmitting base 410 in the front-back direction.

The end of the first mounting surface 4110 away from the laser 420 is provided with a first boss 4140, the first boss 4140 extends from the first mounting surface 4110 toward the front surface of the circuit board 300, and the left end surface of the first boss 4140 is flush with the left end surface of the emitting base 410.

The first boss 4140 is provided with two through holes 4150, the two through holes 4150 are arranged side by side along the front-rear direction, and the through holes 4150 penetrate through the left end surface and the right end surface of the first boss 4140 and are communicated with the first mounting surface 4110. The first optical fiber coupler 4710 and the second optical fiber coupler 4720 are inserted into two through holes 4150 of the first boss 4140, respectively, so as to fix the first optical fiber coupler 4710 and the second optical fiber coupler 4720 on the emission base 410 through the first boss 4140.

In some embodiments, the first boss 4140 is provided with a first positioning pin 4160, and the circuit board 300 is provided with a positioning hole, which is disposed corresponding to the first positioning pin 4160. Thus, when the radiation base 410 is mounted on the circuit board 300, the first positioning pins 4160 may be inserted into the corresponding positioning holes of the circuit board 300 to fix the radiation base 410 on the circuit board 300.

One end of the emitting base 410, which is far away from the first boss 4140, is provided with a second boss 4170, the second boss 4170 is fixedly connected with the right end surface of the emitting base 410, and the second boss 4170 is provided with a second positioning pin 4180. The circuit board 300 is provided with a positioning hole corresponding to the second positioning pin 4180. Thus, when the emission base 410 is mounted on the circuit board 300, the second positioning pins 4180 may be inserted into the corresponding positioning holes of the circuit board 300 to fix the emission base 410 on the circuit board 300.

When the emission base 410 is reversely mounted on the front surface of the circuit board 300, one end of the first boss 4140 and one end of the second boss 4170 contact with the front surface of the circuit board 300, the first positioning pin 4160 on the first boss 4140 and the second positioning pin 4180 on the second boss 4170 are inserted into the positioning holes on the circuit board 300, so that the emission base 410 is fixed on the circuit board 300, and the semiconductor cooler 480 arranged on the third mounting surface 4130, the laser 420 arranged on the semiconductor cooler 480, the collimating lens 430 and the first translating prism 440 arranged on the second mounting surface 4120 are embedded into the mounting hole 320 of the circuit board 300, so that the height of the routing surface of the laser 420 is flush with the back surface of the circuit board 300.

The semiconductor refrigerator 480, the laser 420, the collimating lens 430, the first translation prism 440, the optical multiplexer, the optical circulator and the optical fiber coupler are fixed on the transmitting base 410 through the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 which are arranged in a stepped manner, so as to form a mounting height difference among the laser 420, the collimating lens 430, the optical multiplexer, the optical circulator and the optical fiber coupler, the laser 420 and the collimating lens 430 with relatively high mounting heights are arranged on the back side of the circuit board 300 through the mounting hole 320 of the circuit board 300, and the optical multiplexer, the optical circulator and the optical fiber coupler with relatively low mounting heights are arranged on the front side of the circuit board 300, so that the overlapping area of the optical transmit sub-module 400 and the circuit board 300 in space can be reduced.

When the tosa 400 is assembled, the semiconductor cooler 480 is first mounted on the third mounting surface 4130, then the laser substrate 490 with the laser 420 is mounted on the cooling surface of the semiconductor cooler 480, then the first translation prism 440 is fixed on the second mounting surface 4120, then the first optical combiner 4510, the second optical combiner 4520, the first optical circulator 4610, and the second optical circulator 4620 are independently fixed on the first mounting surface 4110 according to the light emitting direction, and finally the collimating lens 430 is fixed on the third mounting surface 4130 according to the light emitting direction of the laser 420, and at the same time, the coupling efficiency in the optical fiber is detected, and the position of the collimating lens 430 is optimized.

Fig. 12 is a schematic view of a transmission light path in an optical module provided in the embodiment of the present application, and fig. 13 is a schematic view of another angle of the transmission light path in the optical module provided in the embodiment of the present application. As shown in fig. 12 and 13, after the laser 420 is mounted on the third mounting surface 4130 through the laser substrate 490 and the semiconductor refrigerator 480, the collimating lens 430 is mounted on the third mounting surface 4130 through the semiconductor refrigerator 480, the first shift prism 440 is mounted on the second mounting surface 4120, the first optical multiplexer 4510, the second optical multiplexer 4520, the first optical circulator 4610 and the second optical circulator 4620 are disposed on the first mounting surface 4110, the 8-channel laser 420 emits 8 laser beams, the 8 laser beams are converted into 8 collimated beams through the 8 collimating lenses 430, the 8 collimated beams are transmitted to the first mirror of the first shift prism 440, and the first mirror reflects the collimated beams parallel to the back surface of the circuit board 300 into collimated beams perpendicular to the circuit board 300; the collimated light beam perpendicular to the circuit board 300 is transmitted to the second reflecting mirror of the first translating prism 440, which reflects the collimated light beam perpendicular to the circuit board 300 as a laser beam parallel to the front surface of the circuit board 300, thereby reflecting the laser beam located at the rear side of the circuit board 300 as a laser beam located at the front side of the circuit board 300; 4 laser beams of the 8 laser beams output by the second reflector are transmitted into the first optical combiner 4510, and the other 4 laser beams are transmitted to the second optical combiner 4520; the first optical combiner 4510 multiplexes 4 laser beams into one multiplexed beam, and the second optical combiner 4520 multiplexes 4 laser beams into another multiplexed beam; the multiplexed light beam output by the first optical combiner 4510 is directly transmitted to the first optical fiber coupler 4710 through the first optical circulator 4610, so as to implement transmission of one path of multiplexed light beam; the multiplexed light beam output by the second optical combiner 4520 is directly transmitted to the second optical fiber coupler 4720 through the second optical circulator 4620 to implement the transmission of another multiplexed light beam.

The tosa 400 is designed to be reversely assembled, that is, the bottom of the transmitter base 410 faces upward, and the height of the wire bonding surface of the laser module is the same as the back of the circuit board 300 during assembly, so that the connection wire bonding between the two is the shortest, thereby ensuring excellent high-frequency transmission performance. The parallel light beams are moved to a proper position by the translation prism, so that the position conflict area of the whole light emission sub-module 400 and the circuit board 300 can be reduced, the aim of reducing the hole digging area of the circuit board is fulfilled, and high-frequency circuit wiring and the arrangement area of electronic components are increased conveniently.

In some embodiments, a specially designed free-space optical circulator is integrally assembled in the tosa 400 to separate the emitted light beam of the tosa 400 from the external optical signal of the rosa.

Fig. 14 is a schematic diagram of light splitting and combining of an optical circulator in an optical module according to an embodiment of the present application. As shown in fig. 14, the optical circulator includes a first polarizer 4630, a faraday rotator 4640, a half-wave plate 4650 and a second polarizer 4660, the first polarizer 4630 is disposed corresponding to the light exit ports of the first optical combiner 4510 and the second optical combiner 4520, and the first polarizer 4630, the faraday rotator 4640, the half-wave plate 4650 and the second polarizer 4660 are sequentially disposed along the light emission direction. The composite light beams emitted from the first optical combiner 4510 and the second optical combiner 4520 travel from bottom to top, and the double-headed arrow in the optical path indicates the light polarization direction, and is parallel to the paper surface here.

The polarizer is used for carrying out polarization splitting on light beams, linearly polarized light parallel to the paper surface directly passes through the polarizer without splitting, and after the unpolarized light enters the polarizer, the unpolarized light is split into two paths of light in the polarization direction on the film coating surface of the polarizer. The Faraday rotator changes the polarization direction of light under the action of a magnetic field, so that the polarization direction of the light passing through the Faraday rotator rotates clockwise in the light propagation direction and rotates anticlockwise in the reverse direction. The half-wave plate rotates the light clockwise when passing in forward or reverse direction.

Because the composite light beams emitted by the first optical combiner 4510 and the second optical combiner 4520 are linearly polarized light and are parallel to the paper surface, in the process of transmission from bottom to top, the composite light beams do not split after being emitted into the first polarizer 4630, the composite light beams directly pass through the first polarizer 4630, then the composite light beams sequentially enter the faraday rotator 4640 and the half-wave plate 4650, the polarization direction of the composite light beams is not changed, the light path is transmitted linearly, and the path is unchanged, so that the composite light beams emitted by the first optical combiner 4510 directly pass through the first optical circulator 4610 and are emitted into the first optical fiber coupler 4710, and the composite light beams emitted by the second optical combiner 4520 directly pass through the second optical circulator 4620 and are emitted into the second optical fiber coupler 4720.

In some embodiments, the tosa 400 and the first rosa 500 share a single mode fiber, that is, the tosa 400 and the first rosa 500 share the first fiber adapter 700, the internal fiber, the first fiber coupler 4710, and the first optical circulator 4610; the tosa 400 and the second tosa 600 share a single mode fiber, that is, the tosa 400 and the second tosa 600 share the second fiber adapter 800, the internal fiber, the second fiber coupler 4720, and the second optical circulator 4620.

The laser beam emitted by the laser 420 is coupled to two internal optical fibers through the collimating lens 430, the first translating prism 440, the first optical combiner 4510, the second optical combiner 4520, the first optical circulator 4610, the second optical circulator 4620, the first optical fiber coupler 4710, and the second optical fiber coupler 4720 in sequence, and is emitted through the first optical fiber adapter 700 and the second optical fiber adapter 800 respectively.

One path of external optical signal sequentially passes through the first optical fiber adapter 700, the internal optical fiber and the first optical fiber coupler 4710 to form a parallel light beam (the optical fiber coupler plays the role of a collimator at this time), and then is transmitted to the first optical receive sub-module 500 through the first optical circulator 4610; the other path of external optical signal sequentially passes through the second optical fiber adapter 800, the internal optical fiber, and the second optical fiber coupler 4720 to form a parallel beam (the optical fiber coupler plays the role of a collimator at this time), and then passes through the second optical circulator 4620 to be transmitted to the second optical receive sub-module 600.

After an external optical signal enters the optical circulator, the external optical signal is unpolarized light and includes one polarized light with a double-headed arrow and another polarized light with a circle, the double-headed arrow indicates that the polarization direction of the part of light is parallel to the paper surface, and the circle indicates that the polarization direction of the part of light is perpendicular to the paper surface. The external optical signal is transmitted from top to bottom, the light beam is divided into two paths of light in the polarization direction on the film coating surface of the polarizer to be respectively transmitted, and finally, the two paths of light are combined into a beam of light at the position which is horizontally moved for a certain distance leftwards and continuously transmitted downwards. Therefore, the purpose of separating the external optical signal from the emitted light beam is achieved through the optical circulator.

Specifically, after an external optical signal is incident on the second polarizer 4660, the external optical signal is divided into polarized light with a bidirectional arrow and polarized light with a circle on a film-coated surface of the second polarizer 4660, the polarized light with the bidirectional arrow is transmitted through the second polarizer 4660, then the polarized light with the bidirectional arrow sequentially enters the half-wave plate 4650 and the faraday rotator 4640, the polarized light with the bidirectional arrow is converted into polarized light with a circle after passing through the half-wave plate 4650 and the faraday rotator 4640, the polarized light with a circle emitted from the faraday rotator 4640 enters the first polarizer 4630, and the converted polarized light with a circle is reflected at the first polarizer 4630 at a certain angle, and the emission direction is perpendicular to the emission direction of the polarized light with the bidirectional arrow.

The circularly polarized light is reflected at the second polarizer 4660 at a certain angle, the exit direction is different from the exit direction of the bidirectional arrow polarized light, the reflected circularly polarized light is reflected at the second polarizer 4660 at a certain angle again, the exit direction is parallel to the exit direction of the bidirectional arrow polarized light, the re-reflected circularly polarized light sequentially enters the half-wave plate 4650 and the faraday rotator 4640, the circularly polarized light is converted into the bidirectional arrow polarized light, the converted bidirectional arrow polarized light emitted from the faraday rotator 4640 enters the first polarizer 4630, the reflected converted circularly polarized light is combined with the reflected circularly polarized light at the first polarizer 4630, and the combined external optical signal enters the first optical receive submodule 500 and the second optical receive submodule 600.

Fig. 15 is an assembly schematic diagram of a circuit board, a tosa, and a rosa in an optical module according to an embodiment of the present disclosure. As shown in fig. 15, the first and

second rosa

500, 600 are located on the same side of the transmitting base 410, and the first rosa 500 and the second rosa 600 are arranged in a left-right manner, and are staggered from each other in the front-back direction by a suitable distance so that the two external optical signals are not blocked during transmission.

The first optical receive sub-module 500 includes a second shift prism 510, a first optical splitter 520, a first coupling lens group 530, a first reflection prism 540, a first detector 550 and a first transimpedance amplifier 560, an input end of the second shift prism 510 is disposed corresponding to an optical output port of the first optical circulator 4610, an output end of the second shift prism 510 extends to the outside of the optical transmit sub-module 400 and is disposed corresponding to an input end of the first optical splitter 520, such that an external optical signal emitted from the first optical circulator 4610 is transmitted to the first optical splitter 520 after being shifted by an optical path of the second shift prism 510.

The second rosa 600 includes a third prism 610, a second optical splitter 620, a second coupling lens group 630, a second reflection prism 640, a second detector 650 and a second transimpedance amplifier 660, wherein an input end of the third prism 610 is disposed corresponding to an optical output port of the second optical circulator 4620, an output end of the third prism 610 extends to the outside of the rosa 400 and is disposed corresponding to an input end of the second optical splitter 620, so that an external optical signal emitted from the second optical circulator 4620 is transmitted to the second optical splitter 620 after being translated by an optical path of the third prism 610.

In some embodiments, a side of the transmitting base 410 facing the first and second

light receiving sub-modules

500 and 600 is provided with a protrusion 4190, the protrusion 4190 extends from a front side of the transmitting base 410 to a direction close to the light receiving sub-modules, the protrusion 4190 is connected to the first mounting surface 4110, and the protrusion 4190 and the first mounting surface 4110 are located on the same plane.

One end of the second shift prism 510 is disposed corresponding to the light outlet of the first optical circulator 4610, and the other end is fixed on the protrusion 4190, so that the external optical signal output by the first optical circulator 4610 is incident into the second shift prism 510 to implement the shift of the optical path, and the shifted external optical signal is reflected to the first optical splitter 520.

One end of the third translation prism 610 is disposed corresponding to the light outlet of the second optical circulator 4620, and the other end is fixed on the protrusion 4190, so that the external optical signal output by the second optical circulator 4620 is incident on the third translation prism 610 to implement the translation of the optical path, and the translated external optical signal is reflected to the second optical splitter 620.

In some embodiments, the second and

third translation prisms

510 and 610 are arranged side by side in the left-right direction, the third translation prism 610 protrudes from the second translation prism 510 in the front-rear direction, the second translation prism 510 is close to the first and second

optical circulators

4610 and 4620, and the third translation prism 610 is close to the first and second

optical combiners

4510 and 4520. One path of the composite light beam output by the first optical combiner 4510 passes through the second translation prism 510 and then is incident into the first optical circulator 4610, and the other path of the composite light beam output by the second optical combiner 4520 passes through the second translation prism 510 and then is incident into the second optical circulator 4620.

In some embodiments, the mounting height of the first optical circulator 4610 and the mounting height of the second shifting prism 510 may be the same as the mounting height of the first optical splitter 520, such that the second shifting prism 510 is horizontally fixed on the protrusion 4190, such that one external optical signal is horizontally shifted to the first optical splitter 520 by the first optical circulator 4610.

The installation height of the second optical circulator 4620 and the installation height of the third translation prism 610 may be the same as the installation height of the second optical splitter 620, so that the third translation prism 610 is horizontally fixed on the protrusion 4190, so that another external optical signal is horizontally translated to the second optical splitter 620 by the second optical circulator 4620.

Fig. 16 is a schematic diagram of a transmitting optical path and a receiving optical path in an optical module according to an embodiment of the present application. As shown in fig. 16, one external optical signal is incident into the first optical circulator 4610 through the light inlet/outlet, the external optical signal sequentially passes through the second polarizer 4660, the half-wave plate 4650, the faraday rotator 4640 and the first polarizer 4630 to separate the external optical signal from the emitted light beam, so that the external optical signal passes through the polarization splitting and combining of the first optical circulator 4610 and then is incident into the second shift prism 510, and the external optical signal is reflected and shifted in the second shift prism 510, so that the reflected external optical signal can be incident into the first optical splitter 520.

That is, the external optical signal input from the first optical fiber adapter 700 is incident on the first optical circulator 4610, the optical signal is polarization-split and combined in the first optical circulator 4610, the combined optical signal is reflected and translated in the second translating prism 510, and the reflected external optical signal is incident on the first optical splitter 520 through the third translating prism 610.

The other external optical signal is emitted into the second optical circulator 4620 through the light inlet/outlet, the external optical signal passes through the second polarizer 4660, the half-wave plate 4650, the faraday rotator 4640 and the first polarizer 4630 in sequence to separate the external optical signal from the emitted light beam, so that the external optical signal passes through the polarization splitting and light combining of the second optical circulator 4620 and then is emitted to the third shifting prism 610, and the external optical signal is reflected and shifted in the third shifting prism 610, so that the reflected external optical signal can be emitted into the second optical demultiplexer 620.

That is, the external optical signal input from the second optical fiber adapter 800 is incident on the second optical circulator 4620, the optical signal is polarized and split and combined in the second optical circulator 4620, the combined optical signal is incident on the third translation prism 610 through the second translation prism 510, the optical signal is reflected and translated in the third translation prism 610, and the reflected external optical signal is incident on the second optical demultiplexer 620.

The first optical receive sub-module 500 separates the transmitted light beam transmitted in both directions from the external optical signal by using the first optical circulator 4610 and the second translating prism 510, and translates the external optical signal to a suitable position, so as to inject one path of the external optical signal into the first optical demultiplexer 520 for optical demultiplexing. The second optical receive sub-module 600 separates the transmitted light beam transmitted in both directions from the external optical signal by using the second optical circulator 4620 and the third shift prism 610, and shifts the external optical signal to a proper position so as to inject the other external optical signal into the second optical demultiplexer 620 for optical demultiplexing.

In some embodiments, the first and

second rosa

500 and 600 may further include a supporting plate disposed on the front surface of the circuit board 300, and the first optical splitter 520 and the first coupling lens group are disposed on the supporting plate to raise the mounting height of the first optical splitter 520 and the first coupling lens group; the second optical splitter 620 and the second coupling lens group 630 are disposed on another supporting plate to raise the mounting height of the second optical splitter 620 and the second coupling lens group 630.

The coupling lens group comprises 4 coupling lenses, each coupling lens is arranged corresponding to a plurality of light outlets of the optical branching filter, so that the optical branching filter demultiplexes one path of reflected external optical signals into 4 paths of light beams, the 4 paths of light beams are respectively incident into corresponding lenses in the coupling lens group and converted into converged light beams, the 4 paths of converged light beams are emitted to the reflecting prism, each path of converged light beam is reflected at the reflecting prism, and the reflected converged light beams are perpendicular to the circuit board 300.

The detector is arranged on the front surface of the circuit board 300 and is positioned right below the reflecting prism, so that after the light beam is converged and reflected by the reflecting prism, the reflected light beam directly enters the detector, and the light signal is converted into an electric signal through the detector.

The transimpedance amplifier is disposed on the front surface of the circuit board 300, and the electrical signal converted by the detector is transmitted to the transimpedance amplifier, and is amplified by the transimpedance amplifier.

Laser 420 emits laser beam under the drive of bias current, high frequency signal that circuit board 300 transmitted, for the emitted optical power of monitoring laser 420, the back of circuit board 300 is provided with light detector, light detector sets up the left side edge of mounting hole 320 on circuit board 300, and the light-sensitive surface of this light detector faces the light-emitting direction of laser 420 for gather the preceding light that laser 420 emitted, and with the relevant device of data transmission on circuit board 300 of gathering, realize the control to laser 420 preceding emitted optical power.

In some embodiments, the light transmission characteristics of the reflective surface of the first mirror in first translation prism 440 are used to allow a small portion of the collimated light beam to leak through the first mirror and onto the photosensitive surface of the light detector, such that the light detector can receive the portion of the light beam, thereby obtaining the emitted optical power of laser 420.

Specifically, the first mirror of the first translating prism 440 faces the light emitting direction of the laser 420 to split the laser beam generated by the laser into two beams, one beam (usually 95% of the total power) is reflected by the first mirror to the second mirror to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300, and the other beam is directly transmitted through the first mirror to the photosensitive surface of the light detector, through which the laser beam emitted from the light emitting surface of the laser 420 is received.

In some embodiments, 8 photodetectors are disposed on the back surface of the circuit board 300, and each photodetector is disposed corresponding to each laser 420, so that each photodetector collects a portion of the laser beam emitted by each laser 420 and transmitted through the first reflector, and measures the forward output power of the corresponding laser 420 through a device electrically connected to the photodetector.

Because the light detector receives the parallel light with a certain area, the accuracy requirement of the assembling position of the light detector is low, the assembling is easier, and only the light transmitting range of the first reflector in the first translation prism 440 is aligned with the photosensitive surface of the light detector, so that the light detector can collect the laser beam penetrating through the first reflector.

Fig. 17 is a schematic signal connection diagram of a light emission sub-module in an optical module according to an embodiment of the present application, and fig. 18 is a cross-sectional signal connection diagram of the light emission sub-module and a signal processing chip in the optical module according to the embodiment of the present application. As shown in fig. 17 and 18, the side of the signal processing chip 310 facing the circuit board 300 may be provided with pads and solder balls, the front surface of the circuit board 300 is provided with corresponding pads, and the signal processing chip 310 is soldered to the circuit board 300 through the pads and the solder balls. In order to transmit the high frequency signal of the signal processing chip 310 to the laser 420, a first high frequency signal via hole 330 is provided under the Tx output pad of the signal processing chip 310, the first high frequency signal via hole 330 penetrates the front and back surfaces of the circuit board 300, one end of the first high frequency signal via hole 330 is signal-connected to the Tx output pad of the signal processing chip 310, and the other end is signal-connected to a high frequency signal line disposed on the back surface of the circuit board 300, so as to transmit the high frequency signal.

Since the height of the wire-bonding surface of the laser substrate 490 in the tosa 400 is equal to the back surface of the circuit board 300, the high-frequency signal line is connected to the first high-frequency signal via 330 and then wired along the back surface of the circuit board 300, and then electrically connected to the laser substrate 490 by wire-bonding and then electrically connected to the laser 420 by wire-bonding, i.e. one end of the high-frequency signal line is electrically connected to the Tx output pad of the signal processing chip 310 by the first high-frequency signal via 330, and the other end is located on the back surface of the circuit board 300 and electrically connected to the laser 420 by wire-bonding. The high frequency signal transmitted from the gold finger end of the circuit board 300 is processed by the signal processing chip 310 and then transmitted to the laser 420 through the high frequency signal line, so that the laser 420 emits a laser beam.

In some embodiments, the mounting surface of one end of the transmitter base 410 is disposed corresponding to the mounting hole 320 of the circuit board 300, and a cavity is formed between the mounting surface of the other end of the transmitter base 410 and the front surface of the circuit board 300 for mounting the optical device of the tosa 400. Specifically, the third mounting surface 4130 of the emitting base 410 is disposed corresponding to the mounting hole 320, the laser 420 is disposed on the third mounting surface 4130, and the laser 420 is located on the back side of the circuit board 300 through the mounting hole 320; the second mounting surface 4120 of the emission base 410 is disposed corresponding to the mounting hole 320, the first translation prism 440 is disposed on the second mounting surface 4120, and the first translation prism 440 is located at the back side of the circuit board 300 through the mounting hole 320; a cavity is formed between the first mounting surface 4110 of the transmitting base 410 and the front surface of the circuit board 300, and optical devices such as an optical multiplexer, an optical circulator and an optical fiber coupler are disposed on the first mounting surface 4110 and located in the cavity between the first mounting surface 4110 and the circuit board 300.

The signal processing chip 310 on the front side of the circuit board 300 transmits the high frequency signal on the circuit board 300 from the front side of the circuit board 300 to the back side of the circuit board 300 through the high frequency signal line connected to its Tx output pad to transmit the high frequency signal to the laser 420 on the back side of the circuit board 300, and the high frequency signal connection of the tosa 400 and the circuit board 300 can be realized.

In some embodiments, when the plurality of lasers 420 are arranged in two front and back rows, when designing the high-frequency signal lines on the circuit board 300 that are connected from the signal processing chip 310, only one row of lasers 420 near the edge of the signal processing chip 310 may be connected to the front side of the circuit board 300 through the high-frequency signal via holes, and then connected to the signal processing chip 310 through the high-frequency signal lines arranged on the front side of the circuit board 300; and the other row of lasers 420, which is far away from the edge of the signal processing chip 310, may be directly connected to the TX pads of the signal processing chip 310 through high-frequency signal lines, high-frequency signal vias, which are arranged on the back surface of the circuit board 300.

In some embodiments, a plurality of first high frequency signal vias 330 on the circuit board 300 are disposed at the right side of the mounting hole 320, and each first high frequency signal via 330 is connected to the laser 420 in a one-to-one correspondence manner, so that a high frequency signal line passing through each first high frequency signal via 330 is connected to the laser 420 to transmit a high frequency signal transmitted by the circuit board 300 to the laser 420, so as to satisfy the high frequency signal required by the tosa 400.

Fig. 19 is a schematic signal connection diagram of a light receiving sub-module in an optical module according to an embodiment of the present application, and fig. 20 is a cross-sectional signal connection diagram of the light receiving sub-module and a signal processing chip in the optical module according to the embodiment of the present application. As shown in fig. 19 and 20, in order to transmit the high frequency signal of the signal processing chip 310 to the first transimpedance amplifier 560, one end of the high frequency signal line disposed on the front surface of the circuit board 300 is in signal connection with the signal processing chip 310, and the other end of the high frequency signal line is in signal connection with the first transimpedance amplifier 560 by a wire bonding, so as to transmit the electrical signal amplified by the first transimpedance amplifier 560 to the signal processing chip 310 through the high frequency signal line.

In order to transmit the high-frequency signal of the signal processing chip 310 to the second transimpedance amplifier 660, a second high-frequency signal via 340 is disposed below the Rx input pad of the signal processing chip 310, a third high-frequency signal via 350 is disposed on the circuit board 300 near the second transimpedance amplifier 660, and both the second high-frequency signal via 340 and the third high-frequency signal via 350 pass through the front surface and the back surface of the circuit board 300. One end of the second high-frequency signal via hole 340 is electrically connected to the Rx input pad of the signal processing chip 310, the other end of the second high-frequency signal via hole is electrically connected to the high-frequency signal line disposed on the back side of the circuit board 300, the other end of the high-frequency signal line is electrically connected to one end of the third high-frequency signal via hole 350, the other end of the third high-frequency signal via hole 350 is electrically connected to the high-frequency signal line disposed on the front side of the circuit board 300, the high-frequency signal line is electrically connected to the second transimpedance amplifier 660 on the front side of the circuit board 300 through a wire bonding, so that the electric signal amplified by the second transimpedance amplifier 660 is transmitted to the signal processing chip 310 through the high-frequency signal line.

After the tosa 400 is reversely mounted to the front surface of the circuit board 300, the bottom surface of the emission base 410 of the tosa 400 faces the upper case 201; after the laser 420 in the tosa 400 is signal-connected to the signal processing chip 310 on the front side of the circuit board 300 through the high-frequency signal line and the via hole, the laser 420 is driven by the direct current and the high-frequency signal transmitted by the circuit board 300 to generate a laser beam, so that the laser 420 generates heat, and the light emitting performance of the laser 420 is affected by the temperature, so that the laser 420 needs to work in a certain fixed temperature range, and therefore, the laser 420 needs to be placed on the semiconductor refrigerator 480 to ensure the working temperature of the laser 420, and the semiconductor refrigerator 480 generates a large amount of heat during the refrigeration process, which needs to be transmitted out to ensure the refrigeration efficiency of the semiconductor refrigerator 480.

Fig. 21 is a cross-sectional view of a heat dissipation channel of a light emission sub-module and a signal processing chip in an optical module according to an embodiment of the present disclosure. As shown in fig. 21, since laser 420 is fixed to semiconductor cooler 480 on emission base 410, heat generated by laser 420 is transferred to emission base 410 through semiconductor cooler 480 to maintain the temperature of laser 420. In order to improve the heat dissipation performance of the optical module, the emission base 410 may be made of tungsten copper or other metal materials with good thermal conductivity, and the mass and the bottom area of the emission base 410 are properly increased, so that the heat generated by the operation of the laser 420 and the semiconductor cooler 480 can be transmitted to the upper housing 201 through the emission base 410, and the heat dissipation effect of the laser 420 is effectively improved.

In some embodiments, the mounting surface of one end of the emission base 410 is disposed corresponding to the mounting hole 320 of the circuit board 300, and the laser 420 is disposed on the mounting surface corresponding to the mounting hole 320 through the semiconductor cooler 480, so that the mounting area of the laser 420 on the emission base 410 is smaller than the contact area of the emission base 410 and the upper case 201, which can improve the heat dissipation efficiency of the laser 420.

In order to ensure that the laser works at a certain fixed temperature, the mass of the emission base 410 and the contact area between the emission base 410 and the upper shell 201 are increased, so that the contact area between the emission base 410 and the upper shell 201 is larger than the installation area of the laser 420 on the emission base 410, thus, heat generated by the laser 420 is transmitted to the laser substrate 490, the laser substrate 490 transmits the heat to the semiconductor cooler 480, the semiconductor cooler 480 transmits the heat to the emission base 410, and the emission base 410 transmits the heat to the upper shell 201, so that the heat generated by the laser 420 is transmitted to the outer side of the optical module.

In order to facilitate the transmission of the heat of the transmitting base 410 to the upper casing 201, a first heat-conducting gasket may be disposed between the bottom of the transmitting base 410 and the inner side of the upper casing 201, so that the heat of the transmitting base 410 is transmitted to the first heat-conducting gasket, and the first heat-conducting gasket transmits the heat to the upper casing 201, thereby effectively improving the heat dissipation effect.

In some embodiments, the first thermal pad may be a thermal conductive adhesive, which can adhere the emission base 410 to the inner side surface of the upper casing 201 and can conduct heat of the emission base 410 to the upper casing 201.

In some embodiments, the most dominant heat source of the optical module is, in addition to the laser 420 and the semiconductor cooler 480, the signal processing chip 310, and the side of the signal processing chip 310 facing away from the circuit board 300 is in contact with the upper housing 201, so that heat generated by the operation of the signal processing chip 310 is transmitted to the upper housing 201 to transmit the heat generated by the signal processing chip 310 to the outside of the optical module.

In order to facilitate the transmission of the heat of the signal processing chip 310 to the upper casing 201, a second heat conducting gasket may be disposed between the signal processing chip 310 and the inner side surface of the upper casing 201, so that the heat generated by the signal processing chip 310 is transmitted to the second heat conducting gasket, and the second heat conducting gasket transmits the heat to the upper casing 201, thereby effectively improving the heat dissipation effect.

In some embodiments, in order to ensure the normal operation of the first and

second rosa

500 and 600, the first and

second transimpedance amplifiers

560 and 660 also need to be cooled, and the heat of the first and

second transimpedance amplifiers

560 and 660 is conducted to the outside of the housing.

Fig. 22 is a cross-sectional view of a heat dissipation channel of a light receiving sub-assembly in an optical module according to an embodiment of the present disclosure. As shown in fig. 22, in order to improve the heat dissipation efficiency of the first transimpedance amplifier 560 and the second transimpedance amplifier 660, a first metal protrusion 2011 and a second metal protrusion 2012 may be disposed on a side surface of the upper housing 201 facing the circuit board 300, where the first metal protrusion 2011 extends from an inner side surface of the upper housing 201 to a position near an upper surface of the first transimpedance amplifier 560, and then contacts with the upper surface of the first transimpedance amplifier 560 through a heat conduction gasket to form a good heat conduction channel, so as to conduct heat of the first transimpedance amplifier 560 to the upper housing 201.

The second metal protrusion 2012 extends from the inner side surface of the upper housing 201 to a position near the upper surface of the second transimpedance amplifier 660, and then contacts the upper surface of the second transimpedance amplifier 660 through the heat conducting gasket to form a good heat conducting channel, so as to conduct the heat of the second transimpedance amplifier 660 to the upper housing 201.

The application is applied to the structural design of a high-speed optical communication module, and comprises optical components, a structure, high-frequency signal transmission, heat dissipation and other innovation considerations, and through unique optical and structural design, through adopting a compact miniaturized free space optical circulator in a QSFP-DD narrow space, the combination and separation of two-way optical transmission are realized, so that the light emission and the signal receiving are further realized to share a single optical fiber, and the requirements and the occupation of optical fiber resources are reduced. Through the reasonable layout of optical components, the assembly process is optimized, the assembly of the whole module is greatly simplified, the production efficiency and the maintenance efficiency are greatly improved, and the module is more suitable for batch production.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art will appreciate that changes or substitutions within the technical scope of the present disclosure are included in the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A light module, comprising:

2. The optical module of claim 1, wherein the emission base includes a first mounting surface, a second mounting surface, and a third mounting surface, the first mounting surface being recessed from the second mounting surface, the second mounting surface being recessed from the third mounting surface;

the first light emitting assembly and the second light emitting assembly respectively comprise a laser and a first translation prism, the laser is arranged on the third mounting surface, the first translation prism is arranged on the second mounting surface, and the first light circulator and the second light circulator are arranged on the first mounting surface.

3. The optical module according to claim 2, wherein the second translation prism and the third translation prism are provided side by side in a left-right direction on the first attachment surface, and the third translation prism protrudes in a front-rear direction from the second translation prism.

4. The optical module of claim 3, wherein the light of the second light emitting assembly is directed to the second optical circulator through the second translating prism;

the light translated by the second translation prism is transmitted to the first light receiving submodule through the third translation prism;

light from the second light circulator is transmitted through the second translation prism to the third translation prism.

5. The light module of claim 2, wherein the first light emitting assembly further comprises:

the plurality of lasers are arranged on the third mounting surface in parallel in a front-back mode and are used for generating a plurality of laser beams with different wavelengths;

the first optical combiner is arranged on the first mounting surface and used for combining the laser beams reflected by the first translation prism into a composite beam and enabling the composite beam to penetrate through the second translation prism;

the second optical combiner and the first optical combiner are arranged on the first mounting surface in parallel in a front-back mode and used for combining the laser beams reflected by the first translation prism into a composite beam and enabling the composite beam to penetrate through the second translation prism;

the first optical fiber coupler is arranged on the emission base and is used for coupling the composite light beam penetrating through the first optical circulator to the first optical fiber adapter; and transmitting the external optical signal input by the first optical fiber adapter to the first optical circulator;

the second optical fiber coupler is arranged on the emission base and is used for coupling the composite light beam penetrating through the second optical circulator to the second optical fiber adapter; and transmitting the external optical signal input by the second optical fiber adapter to the second optical circulator.

6. The optical module of claim 5, further comprising a circuit board having a mounting hole disposed thereon, the laser being located on a backside of the circuit board through the mounting hole; one end of the first translation prism is located on the back side of the circuit board through the mounting hole, and the other end of the first translation prism is located on the front side of the circuit board and used for translating the laser beam from the back side of the circuit board to the front side of the circuit board.

7. The optical module of claim 6, wherein the routing surface of the laser is on the same surface as the back surface of the circuit board.

8. The optical module according to claim 5, wherein the first optical circulator and the second optical circulator each comprise a first polarizer, a Faraday rotator, a half-wave plate and a second polarizer which are sequentially arranged along a light emission direction, and the composite light beam directly passes through the first polarizer, the Faraday rotator, the half-wave plate and the second polarizer sequentially;

the external optical signal is subjected to polarization light splitting at the second polarizer, the split optical signal respectively passes through the half-wave plate and the Faraday rotator to be subjected to beam conversion, and the converted optical signal is subjected to polarization light combination at the first polarizer.

9. The optical module according to claim 6, wherein a signal processing chip is disposed on a front surface of the circuit board, a first high-frequency signal via hole is disposed on the circuit board, one end of the first high-frequency signal via hole is in signal connection with the signal processing chip, the other end of the first high-frequency signal via hole is in signal connection with a high-frequency signal line disposed on a back side of the circuit board, and the high-frequency signal line disposed on the back side of the circuit board is in signal connection with the laser through a routing.

10. The optical module according to claim 9, wherein one end of a high-frequency signal line arranged on the front side of the circuit board is in signal connection with the first optical receive sub-module, and the other end of the high-frequency signal line is in signal connection with the signal processing chip;

be provided with second high frequency signal via hole, the third high frequency signal via hole that runs through on the circuit board, the one end of second high frequency signal via hole with signal processing chip signal connection, the other end and lay in the one end signal connection of the dorsal high frequency signal line of circuit board, the other end of high frequency signal line with the one end signal connection of third high frequency signal via hole, the other end of third high frequency signal via hole with lay in the high frequency signal line signal connection of the positive side of circuit board, the high frequency signal line of the positive side of circuit board pass through the routing with second light-receiving submodule signal connection.