CN214278495U - Optical module - Google Patents

Abstract

The application provides an optical module and a circuit board; the light emission secondary module is electrically connected with the circuit board; the optical receiving sub-module is electrically connected with the circuit board and used for receiving signal light from the outside of the optical module; the first optical fiber adapter is used for optically connecting the light emission sub-module through a first optical fiber; the second optical fiber adapter is optically connected with the light receiving sub-module through a second optical fiber; the optical receive sub-module includes: the optical branching device is arranged on the circuit board, and the input end of the optical branching device is connected with the second optical fiber adapter; the light receiving chip is arranged on the surface of the circuit board, is positioned below the output reflecting surface of the optical branching device and is electrically connected with the circuit board; a second support member connected to the optical branching device; and the first converging lens is connected with the second supporting component and is positioned on a transmission light path from the light branching device to the light receiving chip. The first converging lens converges and transmits the signal light output by the optical branching device to the light receiving chip, so that the light receiving efficiency of the light receiving chip in the optical module is improved.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

Generally, to increase the transmission rate of an optical module, increasing the transmission channel in the optical module may be used, such as modifying the conventional optical module including one set of tosa (emitting light of one wavelength) and one set of rosa (receiving light of one wavelength) to include two sets of tosa (each set emitting light of one wavelength) and two sets of rosa (each set receiving light of one wavelength). Therefore, the occupied volumes of the optical transmitting sub-module and the optical receiving sub-module in the optical module are increased continuously, and further the further development of the optical module is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module to improve the light receiving efficiency of a light receiving chip in the optical module.

The application provides an optical module, includes:

a circuit board;

the light emission secondary module is electrically connected with the circuit board and used for generating signal light;

the light receiving sub-module is electrically connected with the circuit board and used for receiving signal light from the outside of the optical module;

the first optical fiber adapter is used for optically connecting the light emission sub-module through a first optical fiber;

a second optical fiber adapter optically connecting the optical sub-modules through second optical fibers;

wherein the optical receive sub-module comprises:

the optical branching device is arranged on the circuit board, and the input end of the optical branching device is connected with the second optical fiber;

the light receiving chip is arranged on the surface of the circuit board, is positioned below the output reflecting surface of the optical branching device and is electrically connected with the circuit board;

a second support member connected to the optical branching device;

and the first converging lens is connected with the second supporting component, is positioned between the optical branching device and the optical receiving chip and is used for converging and transmitting the signal light output by the optical branching device to the optical receiving chip.

The optical module provided by the application comprises a circuit board and an optical receiving submodule, wherein the optical receiving submodule comprises an optical branching device, an optical receiving chip, a second supporting component and a first converging lens, the optical branching device, the optical receiving chip and the second supporting component are arranged on the optical branching device, the second supporting component is connected with the first converging lens to enable the first converging lens to be located between an output reflecting surface of the optical branching device and the optical receiving chip, and further enable the first converging lens to be located on a transmission light path from the optical branching device to the optical receiving chip, so that the first converging lens converges and transmits signal light output by the optical branching device to the optical receiving chip, and the optical receiving efficiency of the optical receiving chip in the optical module can be improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 5 is an assembly diagram of a light emission sub-module, a light reception sub-module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic partial structure diagram of an optical module according to an embodiment of the present application;

fig. 7 is a partial structural schematic diagram of another optical module provided in the embodiment of the present application;

FIG. 8 is a schematic view of an exemplary embodiment of an OSA and a first fiber optic adapter assembly;

fig. 9 is a schematic structural diagram of a tosa removing cover according to an embodiment of the present disclosure;

fig. 10 is a cross-sectional view of an tosa according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, a tosa 400, a tosa 500, a first fiber adapter 206, and a second fiber adapter 207.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a third shell, and the third shell covers the two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned on two sides of the third shell and are perpendicular to the third shell, and the two side walls are combined with the two side plates to cover the upper shell on the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitter sub-module 400 and the optical receiver sub-module 500 inside the optical module; the optoelectronic devices such as the circuit board 300, the transmitter sub-assembly 400, the receiver sub-assembly 500, etc. are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the transmitter sub-module 400, the receiver sub-module 500 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

Fig. 5 is an assembly schematic diagram of a light emission sub-module, a light reception sub-module, and a circuit board in an optical module according to an embodiment of the present disclosure. As shown in fig. 5, in the optical module provided in the embodiment of the present application, the tosa 400 and the rosa 500 are respectively disposed at the edge of the circuit board 300 and electrically connected to the circuit board 300, the tosa 400 is connected to the first fiber adapter 206 through the first fiber 2061, the rosa 500 is connected to the second fiber adapter 207 through the second fiber 2071, and the tosa 400 and the rosa 500 are disposed on the circuit board 300. Optionally, the tosa 400 is close to one side of the circuit board 300, and the rosa 500 is close to the other side of the circuit board 300.

As shown in fig. 5, the tosa 400 includes a package cavity formed by an upper shell and a lower shell, and a mounting hole 301 is formed on the circuit board 300 for placing the tosa; the mounting hole 301 is near one side of the circuit board 300 and located at the edge of the circuit board 300, although the mounting hole 301 may also be located in the middle of the circuit board 300; the tosa 400 is embedded in the mounting hole 301 of the circuit board so that the circuit board can extend into the tosa 400 and the tosa 400 can be fixed with the circuit board 300. Alternatively, the tosa 400 may be fixedly supported by the upper and lower cases 201 and 202. The tosa 400 is used for generating signal light, and the signal light generated by the tosa 400 is transmitted to the first optical fiber 2061 and then transmitted to the outside of the optical module through the first optical fiber 2061. Of course, in the optical module provided in the embodiment of the present application, the tosa 400 may be disposed at one end of the circuit board 300 and then electrically connected to the circuit board 300 through the flexible circuit board.

As shown in fig. 5, the rosa 500 is disposed on the surface of the circuit board 300. The signal light from the outside of the optical module is transmitted to the second optical fiber 2071 connected to the second optical fiber adapter 207 through the external optical fiber, and then transmitted to the light receiving sub-module 500 through the second optical fiber 2071, and the light receiving sub-module 500 converts the received signal light into a current signal.

The light receiving sub-module 500 includes an optical device and a photoelectric conversion device. The optical device includes an optical fiber connector, an Arrayed Waveguide Grating (AWG), an optical fiber array, a lens, and the like, the photoelectric conversion device includes a light receiving chip, a transimpedance amplifier, and the like, and the light receiving chip is a PD (photodetector), such as an APD (avalanche diode) and a PIN-PD (photodiode), and is configured to convert received signal light into photocurrent. The second optical fiber 2071 transmits the signal light to the optical device, then converts the optical device into a signal light beam transmission path, and finally transmits the signal light beam to the photoelectric conversion device, which receives the signal light and converts the optical signal into an electrical signal. The AWG and the optical fiber array are used for receiving multi-wavelength signal light of the optical module.

Fig. 6 is a schematic partial structure diagram of an optical module according to an embodiment of the present application. As shown in fig. 6, the rosa 500 is disposed at one side of the rosa 400, the rosa 500 includes an AWG501, a light receiving chip 502, and a transimpedance amplifier 503, a plurality of light receiving chips 502 may be disposed on the circuit board 300 along a light receiving direction, the light receiving chip 502 may be directly attached to the circuit board 300, one end of the AWG501 is connected to the second optical fiber 2071, and the other end of the AWG501 covers the light receiving chip 502, that is, a projection of the other end of the AWG501 in the direction of the circuit board 300 covers the light receiving chip 502, the AWG501 is configured to split the signal light transmitted through the second optical fiber 2071 according to wavelength and change a transmission direction, the signal light split and change the transmission direction through the AWG501 is transmitted to a photosensitive surface of the corresponding light receiving chip 502, and the light receiving chip 502 receives the signal light, converts the received signal light into a photocurrent, and transmits the photocurrent to the transimpedance amplifier 503. When the optical module uses the optical fiber array to receive multi-wavelength signal light, the optical fiber in the optical fiber array correspondingly transmits the signal light with each wavelength to the corresponding light receiving chip.

The transimpedance amplifier 503 is mounted on the circuit board 300, and the plurality of light receiving chips 502 are connected to the transimpedance amplifier 503 for receiving the current signal generated by the light receiving chip 502 and converting the received current signal into a voltage signal. Optionally, the transimpedance amplifier 503 is wire bonded to the light receiving chip 502, such as by a semiconductor bond wire.

In some embodiments of the present application, 4 light receiving chips 502 are disposed on the circuit board 300, the other end of the AWG501 covers the 4 light receiving chips 502, and the 4 light receiving chips 502 are connected to the transimpedance amplifier 503 by wire bonding. However, when the length of the wire bonding is longer, the inductance generated by the wire bonding is larger, the signal mismatching is also larger, and the signal output by the light receiving chip 502 is a small signal, which may cause the signal quality to be degraded. Therefore, the light receiving chip 502 and the transimpedance amplifier 503 are as close as possible, the wire bonding length is reduced, and the signal transmission quality is ensured, and further, the transimpedance amplifier 503 is arranged on one side of the light receiving chip 502, so that the transimpedance amplifier 503 is as close as possible to the light receiving chip 502. Optionally, the electrode of the light receiving chip 502 and the pin on the transimpedance amplifier 503 are on the same plane, so as to ensure that the wire bonding between the light receiving chip 502 and the transimpedance amplifier 503 is shortest.

Further, the rosa 500 provided in the embodiment of the present application further includes a first supporting member 504, and the first supporting member 504 is fixedly disposed on the circuit board 300. The bottom side of the first support member 504 is attached to the circuit board 300, and the top side supports and connects the AWG501, and the first support member 504 is used to fix the AWG501 on the circuit board 300 and provide a sufficient mounting height of the AWG501, ensuring a distance between the AWG501 and the light-receiving chip 502. Alternatively, the first support member 504 may be made of a metal material such as kovar alloy.

The light receiving submodule 500 provided in the embodiment of the present application further includes a first converging lens 505, where the first converging lens 505 is disposed above the light receiving chip 502 and is configured to converge and transmit the signal light output by the AWG501 to the light receiving chip 502, and thus the signal light output by the AWG501 is coupled to the light receiving chip 502 through the first converging lens 505, so that the signal light output by the AWG501 can be accurately incident to the corresponding light receiving chip 502, and the light receiving efficiency of the light receiving chip 502 is improved.

In this embodiment, in order to facilitate the coupling and installation of the first collecting lens 505, the first collecting lens 505 may adopt an elongated integral structure, that is, the first collecting lens 505 includes a lens body and an arc surface, the arc surface is disposed on one side of the lens body close to the light receiving chip 502, the arc surface corresponds to the light receiving chip 502, the projection of the arc surface in the direction of the light receiving chip 502 covers the corresponding light receiving chip, and the arc surface is used for converging and transmitting the signal light beam transmitted to the arc surface to the corresponding light receiving chip 502. The number of the arc surfaces on the first converging lens 505 can be selected according to the number of the light receiving chips 502, for example, 4 light receiving chips 502 are arranged on the circuit board 300, the number of 4 arc surfaces can be arranged on the first converging lens 505, and the 4 arc surfaces correspond to the 4 light receiving chips 502 one to one.

To facilitate the installation of the first collecting lens 505, the rosa 500 provided in the embodiment of the present application further includes a second supporting member 506, and the second supporting member 506 is used for supporting and connecting the first collecting lens 505, such that the first collecting lens 505 is suspended between the AWG501 and the light receiving chip 502. The first converging lens 505 is mounted through the second supporting member 506, which not only facilitates the mounting of the first converging lens 505, but also facilitates the ensuring of the distance between the first converging lens 505 and the signal light output port of the AWG501 and the light receiving chip 502, so that the focal point of the first converging lens 505 can be located on the photosensitive surface of the light receiving chip 502, and the light receiving efficiency of the light receiving chip 502 can be further ensured.

In the present embodiment, the second supporting member 506 is disposed on the surface of the circuit board 300, as shown in fig. 6, the second supporting member 506 may be disposed below the AWG501, the bottom of the second supporting member 506 is connected to the circuit board 300, the first focusing lens 505 is disposed at the side of the second supporting member 506, the first focusing lens 505 is suspended above the light receiving chip 502 by the second supporting member 506, and the first focusing lens 505 focuses and transmits the signal light output by the AWG501 to the corresponding light sensitive surface of the light receiving chip 502.

Further, as shown in fig. 6, second support member 506 includes first mounting surface 5061 and first inclined surface 5062, first inclined surface 5062 is located below first mounting surface 5061, first collecting lens 505 is connected to first mounting surface 5061, and first inclined surface 5062 is located close to light receiving chip 502. The second support member 506 is generally fixed to the first collecting lens 505 by gluing, and the first mounting surface 5061 is arranged on the second support member 506 to facilitate the mounting and fixing of the first collecting lens 505; the first inclined surface 5062 is used for avoiding the light receiving chip 502, and the arrangement of the first inclined surface 5062 facilitates the requirement of ensuring the mounting accuracy of the AWG501, the light receiving chip 502 and the first converging lens 505, and facilitates the concentrated arrangement of the AWG501, the light receiving chip 502 and the first converging lens 505. In the embodiment of the present application, the height of the second supporting member 506 or the mounting position of the first collecting lens 505 on the first mounting surface 5061 can be adjusted according to the mounting height requirement of the first collecting lens 505, so that the first collecting lens 505 can be conveniently mounted on a more accurate position, and the light receiving efficiency of the light receiving chip 502 is ensured.

Fig. 7 is a partial structural schematic diagram of another optical module provided in the embodiment of the present application. As shown in fig. 7, the rosa 500 is disposed at one side of the rosa 400, and the rosa 500 includes an AWG501, a light receiving chip 502, a transimpedance amplifier 503, a first converging lens 505, and a second supporting member 506. As shown in fig. 7, in this embodiment, the second supporting member 506 is located below the AWG501, the top of the second supporting member 506 is connected to the AWG501, the first focusing lens 505 is disposed at a side of the second supporting member 506, and then the second supporting member 506 is fixed inside the optical module by the AWG501, and the first focusing lens 505 is suspended above the light receiving chip 502 by the second supporting member 506, so that the first focusing lens 505 focuses and transmits the signal light output by the AWG501 to the corresponding photosensitive surface of the light receiving chip 502.

As shown in fig. 7, second support member 506 includes first mounting surface 5061, second inclined surface 5063, and second mounting surface 5064, first collecting lens 505 is connected to first mounting surface 5061, second mounting surface 5064 is disposed above second support member 506, second mounting surface 5064 is connected to AWG501, second inclined surface 5063 is located on side of second mounting surface 5064 facing away from first mounting surface 5061, and second inclined surface 5063 is provided for avoiding AWG501 and facilitating mounting and fixing second support member 506 on AWG 501. The second support member 506 is generally fixed to the first collecting lens 505 by gluing, and the first mounting surface 5061 is arranged on the second support member 506 to facilitate the mounting and fixing of the first collecting lens 505; the second inclined surface 5063 is used for avoiding the AWG501, and the arrangement of the first inclined surface 5062 not only facilitates ensuring the mounting accuracy requirements of the AWG501, the light-receiving chip 502 and the first converging lens 505, but also facilitates the centralized arrangement of the AWG501, the light-receiving chip 502 and the first converging lens 505; the second mounting surface 5064 facilitates the affixing of the second support member 506 to the AWG 501. In the embodiment of the present application, the mounting position of the first collecting lens 505 on the first mounting surface 5061 can be adjusted according to the mounting height requirement of the first collecting lens 505, so that the first collecting lens 505 can be conveniently mounted on a more accurate position, and the light receiving efficiency of the light receiving chip 502 is ensured.

Fig. 8 is a schematic view illustrating an assembly structure of the tosa and the first fiber optic adapter 206 according to an embodiment of the present invention. As shown in fig. 8, the tosa 400 is connected to the first fiber adapter 206 via the fiber connector 600 and the first fiber 2061. The first optical fiber 2061 is connected to the fiber adapter 600 at one end and to the first fiber adapter 206 at the other end.

The optical fiber connector 600 is used for being inserted into the tosa to receive the light condensed by the optical lens; the first optical fiber adapter 206 is connected to the first optical fiber 2061 and an optical fiber plug outside the optical module, respectively, and is used for realizing optical connection between inside and outside of the optical module, so that light output by the tosa 400 is connected to the optical fiber through an optical fiber connector, transmitted to the first optical fiber adapter 206 through the optical fiber, and transmitted to outside of the optical module through the first optical fiber adapter 206.

The first fiber optic adapter 206 includes a main body 2062 and protrusions 2063, the protrusions 2063 being located on a surface of the main body 2062, the protrusions 2063 being raised relative to the main body 2062. The first fiber optic adapter 206 is fixedly assembled to the lower housing by the protrusions 2063. To facilitate the positioning and installation of the first fiber optic adapter 206, the protrusion 2063 is provided with a positioning inclined surface 2064, and the first fiber optic adapter 206 is locked and positioned by the positioning inclined surface 2064 when the protrusion 2063 is assembled and connected with the lower housing. By arranging the positioning inclined plane 2064 on the protrusion 2063 of the first optical fiber adapter 206, the first optical fiber adapter 206 can be positioned and installed, the first optical fiber 2061 is prevented from being torn due to rotation of the adapter, so that a transmitting light path is not effective, and the operation of workers in the optical module assembling process can be facilitated. Further, the structure and manner of securing the second fiber optic adapter 207 can be seen with respect to the first fiber optic adapter 206.

As shown in fig. 8, the tosa 400 provided by the embodiment of the present invention includes a cover plate 401 and a tosa cavity (hereinafter referred to as cavity) 402, the cavity 402 is covered by the cover plate 401 from above, and a sidewall of the cavity 402 has an opening 403 for inserting the circuit board 300.

Fig. 9 is a schematic structural diagram of a tosa removing cover according to an embodiment of the present disclosure. As shown in fig. 9, a laser assembly 404 is disposed in the cavity 402, the circuit board 300 extending into the cavity is electrically connected to the laser assembly 404, and the laser assembly has a laser chip, a collimating lens, and other components to form collimated light. Also disposed in the cavity 402 is an optical multiplexing assembly 405, where the optical multiplexing assembly 405 receives the multiple beams of light from the laser assembly 404, and combines the multiple beams of light into one beam of light, where the one beam of light includes light with different wavelengths. The optical fiber connector 600 is mounted on the other side wall of the cavity 402, and one of the light beams combined by the optical multiplexing component 405 is emitted into the optical fiber connector 600, and the optical fiber connector 600 receives the light beam from the optical multiplexing component 405 and transmits the light beam to the first optical fiber adapter 206 through the first optical fiber 2061. Further, a focusing lens 406 may be disposed between the optical multiplexing assembly 405 and the optical fiber connector 600, and the light is converged by the focusing lens 406 to facilitate subsequent coupling of the light.

As shown in fig. 9, the tosa 400 provided in the embodiment of the present application includes 4 laser components 404, where the 4 laser components 404 emit light with 4 different wavelengths, and the data transmission capacity is improved by increasing the number of optical paths, and the optical multiplexing component combines 4 paths of parallel light into 1 path of light.

Optionally, as shown in fig. 9, the laser assembly 404 includes a metalized ceramic, a laser chip, a collimating lens, a semiconductor refrigerator, and the like, the laser chip is disposed on a surface of the metalized ceramic, and a circuit pattern is formed on the surface of the metalized ceramic and can supply power to the laser chip; meanwhile, the metallized ceramic has better heat conduction performance and can be used as a heat sink of the laser chip for heat dissipation. The laser becomes the first choice light source of optical module and even optical fiber transmission by better single wavelength characteristic and better wavelength tuning characteristic; even if a special optical communication system adopts the light source, the characteristics and chip structure of the light source are greatly different from those of laser, so that the optical module adopting laser and the optical module adopting other light sources have great technical difference, and a person skilled in the art generally does not consider that the two types of optical modules can give technical inspiration to each other.

Fig. 10 is a cross-sectional view of an tosa according to an embodiment of the present invention. As shown in fig. 10, light emitted from the laser chip in the laser component 404 is respectively converged into parallel light by the corresponding collimating lens, each path of parallel light converged by the collimating lens is transmitted to the optical multiplexing component 405, the optical multiplexing component 405 combines each path of parallel light into one path and transmits the combined path of parallel light to the focusing lens 406, and the combined light is converged and transmitted to the optical fiber connector 600 through the focusing lens 406.

As shown in fig. 10, the optical fiber connector 600 includes a package 601, an isolator 602, and a fiber stub 603. The package 601, the isolator 602 and the fiber ferrule 603 are all cylindrical structures, and the through hole 106 is a cylindrical through hole. The isolator 602 and the fiber stub 603 are provided in the package 601, respectively, and the fiber stub 603 is connected to the first optical fiber 2061. The fixing fit of the tube housing 601 and the cavity 402 realizes the fixing of the optical fiber connector 600 and the cavity 402. The package 601 is used to fix the isolator 602 and the fiber stub 603 and facilitate the installation of the isolator 602 and the fiber stub 603. The isolator 602 allows light to pass in one direction and is blocked in the opposite direction to prevent reflected light from returning into the laser chip.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (10)

1. A light module, comprising:

a circuit board;

the light emission secondary module is electrically connected with the circuit board and used for generating signal light;

the light receiving sub-module is electrically connected with the circuit board and used for receiving signal light from the outside of the optical module;

the first optical fiber adapter is used for optically connecting the light emission sub-module through a first optical fiber;

a second optical fiber adapter optically connecting the optical sub-modules through second optical fibers;

wherein the optical receive sub-module comprises:

the optical branching device is arranged on the circuit board, and the input end of the optical branching device is connected with the second optical fiber;

the light receiving chip is arranged on the surface of the circuit board, is positioned below the output reflecting surface of the optical branching device and is electrically connected with the circuit board;

a second support member connected to the optical branching device;

and the first converging lens is connected with the second supporting component, is positioned between the optical branching device and the optical receiving chip and is used for converging and transmitting the signal light output by the optical branching device to the optical receiving chip.

2. The optical module of claim 1, wherein the optical branching device comprises an AWG, the rosa further comprising a first support member, a bottom portion of the first support member being connected to the circuit board, and a top portion of the second support member being connected to the AWG.

3. The optical module according to claim 1, wherein a first mounting surface, a second inclined surface, and a second mounting surface are provided on the second support member, the first mounting surface is located on one side of the second mounting surface, the second inclined surface is located on the other side of the second mounting surface, the second mounting surface is connected to the optical branching device, and the first mounting surface is connected to the first condensing lens.

4. The optical module of claim 1, wherein the rosa further comprises a transimpedance amplifier disposed on one side of the rosa.

5. The optical module according to claim 1, wherein the first fiber optic adapter comprises a main body and a protrusion, the protrusion is disposed on the main body, and a positioning inclined surface is disposed on the protrusion, and the positioning inclined surface is used for positioning and assembling the first fiber optic adapter to connect with a lower housing of the optical module.

6. The optical module according to claim 1, wherein the first condensing lens includes a lens body and an arc surface, the arc surface is disposed on a side of the lens body close to the light receiving chip, and a projection of the arc surface in a direction of the light receiving chip covers the corresponding light receiving chip.

7. The optical module of claim 1, wherein the circuit board has a mounting hole, and the tosa is embedded in the mounting hole, and the tosa comprises:

the light emission submodule cavity is connected with the first optical fiber;

the laser assembly is arranged in the light emission submodule cavity and used for generating an optical signal;

and the optical multiplexing component is arranged on a transmission light path from the laser component to the first optical fiber.

8. The optical module of claim 7, further comprising an optical fiber connector embedded in the tosa cavity, wherein one end of the optical fiber connector is connected to the first optical fiber, and the other end of the optical fiber connector extends into the tosa cavity.

9. The optical module of claim 8, wherein the optical fiber connector comprises a tube shell, an isolator and an optical fiber ferrule, the isolator and the optical fiber ferrule are disposed in the tube shell, the isolator is located at an end of the tube shell close to the inside of the tosa, and an end of the optical fiber ferrule far away from the inside of the tosa is connected to the first optical fiber.

10. The optical module of claim 8, wherein the tosa further comprises a focusing lens positioned on an optical path from the optical multiplexing assembly to the fiber stub.

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