CN111458816A

CN111458816A - Optical module

Info

Publication number: CN111458816A
Application number: CN202010441912.8A
Authority: CN
Inventors: 李丹; 付孟博; 谢一帆; 傅钦豪
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-05-22
Filing date: 2020-05-22
Publication date: 2020-07-28

Abstract

The application provides an optical module, and a light receiving assembly thereof comprises a lens fixing component, a focusing lens and a light receiving chip. A lens fixing component is arranged in the optical module, a through hole is formed in the lens fixing component, the focusing lens is arranged at the position of the through hole formed in the lens fixing component, and the photosensitive surface of the light receiving chip faces the focusing lens. Thus, the optical signal received by the optical fiber socket is transmitted to the light conduction component through the optical fiber and then emitted out, and then is irradiated to the focusing lens arranged at the through hole, and the optical signal is converged to the photosensitive surface of the light receiving chip by the focusing lens. This application utilizes focusing lens, can make the facula of shining to the photosensitive surface of light receiving chip dwindle, and then can improve the coupling efficiency between light receiving chip and the optic fibre.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. The optical module realizes the function of photoelectric conversion in the technical field of optical communication, and is one of key devices in optical communication equipment.

For receiving optical signals, a light receiving chip is disposed inside an optical module, wherein the light receiving chip is a PIN photodiode or a photo avalanche diode APD. After an optical signal sent by external equipment is emitted into a photosensitive surface of a light receiving chip through an optical fiber, the light receiving chip generates a current signal by utilizing a photoelectric conversion effect, and then the current signal is correspondingly processed by other devices in an optical module and then sent to an upper computer.

However, with the increase of the communication rate of the optical module, in order to meet the requirement of the receiving end for high-speed photoelectric conversion rate, it is a common practice to further reduce the area of the photosensitive surface of the light receiving chip. However, the reduction in the area of the photosensitive surface leads to a reduction in the coupling efficiency between the light receiving chip and the receiving fiber, which affects the signal reception quality.

Disclosure of Invention

The embodiment of the application provides an optical module to improve the coupling efficiency between an optical receiving chip and a receiving optical fiber.

An optical module provided in an embodiment of the present application mainly includes:

a circuit board;

the optical fiber socket is used for being optically connected with an optical fiber outside the optical module;

the optical fiber is connected with the optical fiber socket at one end and connected with the light conduction component at the other end, and is used for transmitting light received by the optical fiber socket to the light conduction component;

the light outlet of the light conduction component is an inclined plane and is used for reflecting the light to the upper surface of the circuit board;

a light receiving chip disposed on an upper surface of the circuit board with a photosensitive surface thereof disposed toward the light conductive member;

the lens fixing component is arranged between the light conduction component and the light receiving chip, and a through hole is formed in the position corresponding to the light outlet of the light conduction component;

and the focusing lens is arranged at the position of the lens fixing part provided with the through hole and is used for converging the light output by the light conduction part to the photosensitive surface of the light receiving chip.

As can be seen from the above embodiments, in the embodiments of the present application, the lens fixing member is disposed between the light receiving chip and the light conducting member, and the through hole is formed in the lens fixing member, the focusing lens is disposed at a position where the through hole is formed in the lens fixing member, and the photosensitive surface of the light receiving chip faces the focusing lens. Thus, the optical signal received by the optical fiber socket is transmitted to the light conduction component through the optical fiber and then emitted out, and then is irradiated to the focusing lens arranged at the through hole, and the optical signal is converged to the photosensitive surface of the light receiving chip by the focusing lens. The embodiment of the application utilizes the focusing lens, so that light spots irradiated to the photosensitive surface of the light receiving chip can be reduced, and further the coupling efficiency between the light receiving chip and the optical fiber can be improved.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a schematic view of a first structure of a circuit board and a light receiving module provided in an embodiment of the present application;

fig. 6 is an exploded schematic view of a circuit board and a light receiving module provided in the embodiment of the present application;

fig. 7 is a schematic cross-sectional view of a light receiving element provided in an embodiment of the present application;

fig. 8 is an exploded view of a light receiving module provided in an embodiment of the present application;

fig. 9 is a side view of a light receiving assembly provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.

An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 30, a light emitting module 40, and a light receiving module 50.

The upper shell 201 covers the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower tube shell comprises a main plate and two side plates which are positioned on two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 205 for external optical fiber access to connect the optical transmitting assembly 40 and the optical receiving assembly 50 inside the optical module; optoelectronic devices such as circuit board 30, light emitting assembly 40 and light receiving assembly 50 are located in the package cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 30, the light emitting assembly 40, the light receiving assembly 50 and other devices can be conveniently installed in the shells, and the upper shell and the lower shell form an outermost packaging protection shell of the optical module; the upper shell and the lower shell are made of metal materials, so that electromagnetic shielding and heat dissipation are facilitated; generally, the shell of the optical module cannot be made into an integrated structure, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be installed, and the production automation is not facilitated.

The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower tube shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer through a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 30 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as the microprocessor MCU2045, the laser driver chip, the limiting amplifier, the clock data recovery CDR, the power management chip, and the data processing chip DSP).

The circuit board 30 connects the electrical devices in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board 30 is generally a rigid circuit board, which can also realize a bearing function due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board may also provide a smooth load bearing when the light emitting assembly 40 and the light receiving assembly 50 are located on the circuit board; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The optical module further includes a light emitting module and a light receiving module, which may be collectively referred to as an optical sub-module. As shown in fig. 4, the optical module provided in the embodiment of the present invention includes a light emitting module 40 and a light receiving module 50. The light emitting assembly 40 is disposed on the surface of the circuit board 30, and in another common packaging mode, the light emitting assembly is physically separated from the circuit board and is electrically connected through a flexible board; the light receiving element 50 is disposed on the surface of the circuit board 30, and in another common packaging method, the light receiving element is physically separated from the circuit board, and the electrical connection is realized through a flexible board.

Further, with the increase of the communication rate of the optical module, in order to meet the requirement of the receiving end for high-speed photoelectric conversion rate, it is a common practice to further reduce the area of the photo-sensitive surface of the light receiving chip, for example, the 4 × 100G optical module has a higher requirement for the bandwidth of the receiving end, which results in further reduction of the photo-sensitive surface of the light receiving chip compared with the photo-sensitive surface of the light receiving chip in the 4 × 25G optical module, and the diameter of the original photo-sensitive surface is reduced from 20um to 16 um. In order to solve the coupling difficulty between the light receiving chip and the receiving optical fiber caused by the reduction of the photosensitive surface, the focusing lens is added at the light receiving chip to reduce the light spot irradiated to the photosensitive surface of the light receiving chip, and meanwhile, the fixing problem of the focusing lens is solved.

Fig. 5 is a schematic view of a first structure of a circuit board and a light receiving assembly provided in the embodiment of the present application. As shown in fig. 5, the components for optical signal transmission include an optical fiber receptacle 61, an optical fiber 62, and an optical conduction component 63, and the optical reception assembly includes a lens fixing component 51, a focusing lens 52, an optical reception chip 53, a transimpedance amplifier 54, a first support component 55, a second support component 56, and a third support component 57. It should be noted that, in the present embodiment, four light receiving chips and corresponding matching elements are provided, and one light receiving channel is taken as an example in the present embodiment.

The optical fiber receptacle 61 is used to realize optical connection with an optical fiber outside the optical module, the optical fiber receptacle 61 is connected to one end of the optical fiber 62, and the other end of the optical fiber 62 is butted against the light receiving chip 53. The optical signal transmitted from the external optical fiber is transmitted to the optical fiber 62 through the optical fiber socket 61, and is transmitted to the light receiving chip 53 through the optical fiber 62, wherein the number of the optical fibers 62 can be set to one or more according to the specific structure of the light conducting part 63.

In order to facilitate the optical fiber 62 to be butted against the light receiving chip 53, the optical fiber conducting member 63 is configured as a fiber ribbon splice (FA) structure in the present embodiment, and the optical fiber 62 at the end for butting against the light receiving chip 53 is clamped in the fiber ribbon splice and fixed by the optical fiber conducting member 63. The end of the optical fiber 62 may be an inclined surface, or the end of the optical fiber ribbon connector may be an inclined surface, so that light is reflected by the inclined surface, and the light output from the optical fiber 62 is reflected toward the upper surface of the circuit board 30 and is incident on the photosensitive surface of the light receiving chip 53.

Of course, in other embodiments, the light conducting member 63 may also adopt an Arrayed Waveguide Grating (AWG) structure, that is, the light signal transmitted in one optical fiber enters the AWG, and the AWG splits the light signal into multiple paths of light signals and transmits the light signals to the corresponding light receiving chips 53. Meanwhile, the end of the arrayed waveguide grating is set to be an inclined plane, and light is reflected at the inclined plane so as to reflect light output by the inclined plane to the upper surface of the circuit board 30.

Fig. 6 is an exploded structural schematic view of a circuit board and a light receiving assembly provided in the embodiment of the present application, and fig. 7 is a cross-sectional structural schematic view of the light receiving assembly provided in the embodiment of the present application. As shown in fig. 5 to 7, in order to improve the coupling efficiency of the optical fiber 62 and the light receiving chip 53, the present embodiment is provided with a focusing lens 52 above the light receiving chip 53. In this embodiment, the light receiving chip 53 is packaged in a non-sealing manner, and the lower surface of the light receiving chip 53 is attached to the circuit board 30, and the upper surface thereof is provided with a photosensitive surface. For convenience of description, the present embodiment uses the surface of the light receiving chip 53 close to the circuit board 30 as the lower surface and the surface far from the circuit board 30 as the upper surface.

To fix the focus lens 52, the present embodiment provides a lens fixing member 51, a first support member 55, and a second support member 56. Wherein the first support member 55 and the second support member 56 can be made of non-conductive material, preferably, since the first support member 55 and the second support member 56 support the lens fixing member 51 and the lens fixing member 51 is provided with the focusing lens 52, in order to ensure the stability of the relative positions of the focusing lens 52 and the light receiving chip 53 and the light conducting member 63, the first support member 55 and the second support member 56 can be made of material with high processing precision and small thermal expansion coefficient, for example, ceramic, glass, etc. Since the lens holding member 51 is provided with the focusing lens 52 and the first and

second support members

55 and 56 are made of a non-conductive material, the lens holding member 51 may be made of a metal material.

In the module packaging, the lower surfaces of the first support member 55 and the second support member 56 may be fixed to the circuit board 30 using glue or the like, with a certain distance between the first support member 55 and the second support member 56 to accommodate the light receiving chip 53, i.e., the light receiving chip 53 is disposed between the first support member 55 and the second support member 56. Meanwhile, the upper surfaces of the first support member 55 and the second support member 56 are fixedly coupled to the lower surface of the lens fixing member 51 by glue or the like, that is, the lens fixing member 51 is bridged over the first support member 55 and the second support member 56.

Meanwhile, a through hole 511 is opened in the lens fixing member 51 at a position corresponding to the light exit of the light conducting member 63, the focusing lens 52 is disposed at a position where the through hole 511 is opened in the lens fixing member 51, and the photosensitive surface of the light receiving chip 53 is disposed toward the focusing lens 52. In addition, in the present embodiment, the focusing lens 52 is disposed on the lower surface of the lens fixing member 51, that is, on the surface close to the circuit board 30, and compared with the focusing lens 52 disposed on the upper surface of the lens fixing member 51, the through hole 511 not only allows effective optical signals to pass through, but also isolates the influence of stray light on the light receiving chip 53, and is also advantageous for reducing the overall thickness of the optical module.

In this way, the optical signal received by the optical fiber receptacle 61 is transmitted to the light conducting member 63 through the optical fiber 62, and then emitted out, and then irradiated to the focusing lens 52 through the through hole 511, and the divergent optical signal is converged to the photosensitive surface of the light receiving chip 53 by the focusing lens 52, and the light receiving chip 53 converts the received optical signal into an electrical signal by the photoelectric conversion effect. In the present embodiment, the focusing lens 52 is used to reduce the light spot irradiated on the photosensitive surface of the light receiving chip 53, so as to improve the optical coupling efficiency between the light receiving chip 53 and the optical fiber; further, by providing the lens fixing member 51 with the through hole 511 to fix the focus lens 52, the through hole 511 can pass an effective optical signal and can block the influence of stray light on the light receiving chip 53.

In addition, in other embodiments, the lens fixing member 51 may be directly fixed to the circuit board, for example, the lens fixing member 51 may be configured as a sealed housing structure in which the light receiving chip 53 is also disposed, or the lens fixing member 51 may be configured as a structure with an open bottom that is covered on the light receiving chip 53. In contrast to the way of directly fixing the lens fixing member 51 to the circuit board 30, the first supporting member 55 and the second supporting member 56 support the lens fixing member 51 in this embodiment, the first supporting member 55 and the second supporting member 56 can provide a more stable bearing surface for the lens fixing member 51 fixed thereon, so as to ensure the stability of the relative position between the focusing lens 52 and the light conducting member 63, and further ensure the stability of the optical coupling efficiency between the light receiving chip 53 and the optical fiber clamped in the light conducting member 63.

Similarly, in order to facilitate fixing the position of the light conducting member 63, the third supporting member 57 is disposed on the circuit board, wherein the third supporting member 57 may be made of a non-conductive material, preferably, since the third supporting member 57 supports the light conducting member 63 and the light output by the light conducting member 63 enters the light receiving chip 53, and in order to ensure the stability of the relative position of the light receiving chip 53 and the light conducting member 63, the third supporting member 57 may be made of a material with high processing precision and a small thermal expansion coefficient, for example, a material such as ceramic or glass. The lower surface of the third support member 57 may be fixed on the circuit board 30 by glue or the like, and then the lower surface of the light-transmitting member 63 may be fixed on the upper surface of the third support member 57 by glue or the like.

Through the above design, in the working process of the optical module, the third supporting member 57 can provide a more stable bearing surface for the light conducting member 63 fixed thereon, so as to ensure the stability of the relative positions of the light receiving chip 53 and the light conducting member 63, and further ensure the stability of the optical coupling efficiency between the light receiving chip 53 and the optical fiber clamped in the light conducting member 63.

Fig. 8 is an exploded schematic view of a light receiving module according to an embodiment of the present invention, further, in order to facilitate module packaging, the lens fixing member 51 is further designed in this embodiment, as shown in fig. 8, the lens fixing member 51 is an L-shaped structure composed of a horizontal plate 51a and a vertical plate 51b disposed at one end of the horizontal plate 51a, wherein the horizontal plate 51a is provided with a through hole 511, and a lower surface of the horizontal plate 51a is fixed on the first supporting member 55 and the second supporting member 56.

When the module is packaged, the first supporting part 55 is adhered to the lower surface of the transverse plate 51a through silver adhesive, meanwhile, the first supporting part 55 is arranged close to the vertical plate 51b, and the vertical plate 51b is utilized to provide a positioning surface for the first supporting part 55, so that the positioning precision and the mounting speed of the first supporting part 55 can be improved; meanwhile, the focusing lens 52 is fixed on the transverse plate 51a through silver paste at the position where the through hole 511 is formed in a passive manner.

It should be noted that, because the silver paste has small material particles and small fluidity compared with the common glue, the first supporting member 55 and the focusing lens 52 have small position movement after being fixed on the horizontal plate 51a, so that the positioning accuracy and the packaging speed can be ensured, and in other embodiments, other materials can be selected; in addition, since the focusing lens 52 in this embodiment can converge the diverging light output from the optical fiber, the optical coupling efficiency can be satisfied even when the alignment accuracy between the focusing lens 52 and the light receiving chip 53 is not high, and further, in this embodiment, a passive package method is adopted for the focusing lens 52, and in other embodiments, an active package method can be adopted.

Then, the combined lens fixing member 51, the focusing lens 52 and the first supporting member 55 are fixed on the circuit board 30, wherein, in order to ensure the mounting accuracy, an insulating layer is usually disposed on the circuit board 30, and therefore, the first supporting member 55 is also fixed on the circuit board 30 by silver paste in this embodiment. Since the lens fixing member 51 has been positioned by the first supporting member 55, the other end of the horizontal plate 51a of the lens fixing member 51 may be fixed to the second supporting member 56 by glue, silver paste, or the like.

In this way, the light receiving chip 53 and the focusing lens 52 are positioned on one side of the first support member 55 and the other side of the riser 51b and the first support member 55, respectively, and the light receiving chip 53 and the focusing lens 52 are positioned between the first support member 55 and the second support member 56, respectively. In addition, the riser 51b is also located between the first support member 55 and the third support member 57.

Further, when receiving the optical signal, after the optical receiving chip 53 converts the received optical signal into a photocurrent, a transimpedance amplifier is further required to convert the current signal into a voltage signal and convert the voltage signal into a voltage for differential output, and then, a limiting amplifier is used to further amplify the signal output by the transimpedance amplifier and limit the signal to a set output differential amplitude, so as to obtain a final electrical signal. Since the electrical signal output from the light-receiving chip 53 is generally small, the distance between the light-receiving chip 53 and the transimpedance amplifier should be as close as possible in order to reduce the distortion effect of signal transmission on the electrical signal output from the light-receiving chip 53.

As shown in fig. 5 to 8, the present embodiment also arranges the transimpedance amplifier 54 between the first support member 55 and the second support member 56, and preferably, in view of the signal flow direction, the transimpedance amplifier 54 is arranged close to the second support member 56 in order to save the layout area. The transimpedance amplifier 54 can be electrically connected to the circuit board 30 by wire bonding, and the transimpedance amplifier 54 can be connected to the light receiving chip 53 and the limiting amplifier (not shown) by high-frequency signal lines arranged on the circuit board. In order to shorten the transmission distance between the transimpedance amplifier 54 and the limiting amplifier, the present embodiment arranges the second supporting member 56 on the high-speed signal trace of the transimpedance amplifier 54, and electromagnetic isolation needs to be made around the high-speed signal trace to prevent the influence on signal transmission. Therefore, the second support member 56 is fixed to the circuit board 30 by a non-conductive material such as glue, and at the same time, the first support member 55 is fixed to the circuit board 30 by silver paste. Therefore, the fixing precision of the lens fixing component 51 and the transmission stability of high-frequency signals can be guaranteed, the board distribution area can be reduced through reasonable layout of all components, and the size of the whole optical module is further reduced.

Fig. 9 is a side view of a light receiving assembly provided in an embodiment of the present application. As shown in fig. 9, when receiving the optical signal, the optical signal transmitted by the optical fiber is reflected at the light exit of the light conducting member 63, and then irradiates the focusing lens 52 through the through hole 511, and the diverging optical signal is converged on the photosensitive surface of the light receiving chip 53 by the focusing lens 52. In order to prevent the light reflected by the photosensitive surface from entering the optical fiber again along the original optical path, in this embodiment, a certain distance d is set between the central axis of the photosensitive surface of the light receiving chip 53 and the optical axis of the focusing lens 52, wherein the specific offset may be determined according to factors such as the area of the photosensitive surface, the distance between the photosensitive surface and the focusing lens 52, and for example, d is set to any value from 10um to 20um, but is not limited to this value range.

Further, in order to prevent the influence of the reflected light on other devices in the optical module and to take into consideration the direction of the light emitted from the light-conducting member 63, the present embodiment provides that the focusing lens 52 is shifted toward the transimpedance amplifier 54, so that the light condensed by the focusing lens 52 can be obliquely irradiated on the photosensitive surface of the light-receiving chip 53 and the light reflected by the photosensitive surface can be irradiated on the first supporting member 55.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A light module, comprising:

a circuit board;

the light outlet of the light conduction component is an inclined plane and is used for reflecting the light received by the light conduction component to the upper surface of the circuit board;

2. The optical module according to claim 1, characterized in that the focus lens is disposed on a side of the lens holder part facing the circuit board.

3. The light module according to claim 1 or 2, characterized in that the upper surface of the circuit board is further provided with a first support member and a second support member, wherein:

the lens fixing part is provided on the first support member and the second support member;

the light receiving chip and the focusing lens are respectively disposed between the first and second supporting members.

4. A light module as claimed in claim 1 or 2, characterized in that a third support member is further provided on the circuit board, the light-conducting member being provided on the third support member.

5. The optical module according to claim 3, wherein the lens fixing member includes a horizontal plate and a vertical plate provided at one end of the horizontal plate, wherein:

the transverse plate is provided with the through hole, and the transverse plate is arranged on the first supporting part and the second supporting part through the lower surface of the transverse plate;

the light receiving chip and the focusing lens are located on one side of the first supporting part, and the vertical plate is located on the other side of the first supporting part.

6. The optical module according to claim 4, wherein the lens fixing member includes a horizontal plate and a vertical plate provided at one end of the horizontal plate, wherein:

the riser is located between the first support component and the third support component.

7. The optical module of claim 3, wherein a transimpedance amplifier is further disposed on the circuit board, wherein:

the transimpedance amplifier is arranged between the first supporting component and the second supporting component and used for converting a current signal output by the light receiving chip into a voltage signal.

8. The optical module of claim 7, wherein a high-speed signal trace of the transimpedance amplifier is routed on the circuit board at the bottom of the second supporting member;

the second supporting component is made of non-conductive materials, and the second supporting component is fixed on the circuit board in a non-conductive mode.

9. The optical module of claim 1, wherein the central axis of the photosurface is spaced from the optical axis of the focusing lens.

10. The optical module according to claim 1, wherein one or more optical fibers are provided in the optical module, the light conducting member is an optical fiber ribbon connector, two or more optical fibers are held in the optical fiber ribbon connector, and a distal end of the optical fiber is an inclined surface;

alternatively, the first and second electrodes may be,

the optical module is provided with one optical fiber, the light conduction component is an arrayed waveguide grating, and the tail end of the arrayed waveguide grating is an inclined plane.