CN114895410B - High-speed light emitting assembly based on inverted PLC chip and manufacturing method thereof - Google Patents
High-speed light emitting assembly based on inverted PLC chip and manufacturing method thereof Download PDFInfo
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- CN114895410B CN114895410B CN202210585933.6A CN202210585933A CN114895410B CN 114895410 B CN114895410 B CN 114895410B CN 202210585933 A CN202210585933 A CN 202210585933A CN 114895410 B CN114895410 B CN 114895410B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 136
- 238000010168 coupling process Methods 0.000 claims abstract description 97
- 230000008878 coupling Effects 0.000 claims abstract description 92
- 238000005859 coupling reaction Methods 0.000 claims abstract description 92
- 238000010438 heat treatment Methods 0.000 claims description 50
- 238000004806 packaging method and process Methods 0.000 claims description 43
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000011521 glass Substances 0.000 claims description 33
- 239000003292 glue Substances 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 33
- 230000008569 process Effects 0.000 claims description 21
- 238000005253 cladding Methods 0.000 claims description 19
- 238000001179 sorption measurement Methods 0.000 claims description 18
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 description 27
- 239000002184 metal Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 25
- 238000010586 diagram Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000012858 packaging process Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
Abstract
The invention discloses a high-speed light emitting component based on an inverted PLC chip and a manufacturing method thereof. The assembly comprises a laser chip, a first substrate, a second substrate, a PLC chip, an FA assembly, a lens and an isolator, wherein the laser chip, the isolator, the PLC chip and the FA assembly are sequentially coupled and arranged on the first substrate; the lens is arranged between the laser and the isolator in a coupling way, and the lower end of the lens and the upper surface of the first substrate are arranged in a suspending way at a preset height; the upper end of the lens is arranged on one side of the lower surface of the second substrate, and the other side of the second substrate is fixedly coupled with the surface of the PLC chip. According to the invention, the lens is hung, and the lens is coupled with the PLC chip through the second substrate, so that the damage caused by direct clamping of the lens by coupling equipment is avoided; in addition, the device under the lens is expanded to cause inaccurate light as the laser heats seriously can be avoided.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to a high-speed light emitting component based on an inverted PLC chip and a manufacturing method thereof.
Background
At present, two kinds of wave combining chips of high-speed light emitting components in industry are mainly used, one kind is a TFF component based on a thin film filter, and the other kind is a wave combining chip based on a PLC chip. Among the latter 800G, 1.6T, 3.2T products, PLC chips take up greater advantages as the number of channels increases and the transmission rate increases, and are becoming a mainstream product in the industry. The current packaging mode of the PLC chip is basically that the waveguide layer is arranged on the upper surface, and the waveguide layer can cause the effect of electrostatic adsorption in the packaging process, so that some dirt is more easily adsorbed on the PLC chip or can be said to be more easily adsorbed on the waveguide layer of the PLC chip, and the subsequent testing yield and the reliability of products are influenced. The main working procedures of the light emitting component formed by the wave combining chip based on the PLC at the present stage comprise the steps of pasting, wire bonding, coupling, testing and the like, each working procedure is indispensable, and the probability of introducing dirt is higher as the working procedures are more.
In view of this, overcoming the drawbacks of the prior art is a problem to be solved in the art.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is how to solve the problem that in a high-speed emission component, in the packaging process of a PLC chip, a waveguide layer causes dirt to be adsorbed on the waveguide layer on the PLC chip due to electrostatic adsorption in the packaging process, so that the defective rate of the light emission component is increased in the test; the invention further solves the technical problem that in the working and measuring process of the light emitting component, the device under the lens expands to cause inaccurate light between the lens and the PLC chip due to serious heat generation of the laser chip.
The embodiment of the invention adopts the following technical scheme:
in a first aspect, the present invention provides a high-speed light emitting assembly based on an inverted PLC chip, comprising: the device comprises a laser chip, a first substrate, a second substrate, a PLC chip, an FA component, a lens and an isolator;
sequentially coupling and connecting the laser chip, the isolator, the PLC chip and the FA component in sequence, and arranging the coupled laser chip, isolator, PLC chip and FA component on the upper surface of the first substrate;
the lens is arranged between the laser and the isolator in a coupling way, and the lower end of the lens and the upper surface of the first substrate are arranged in a suspending way at a preset height;
the upper end of the lens is arranged on one side of the lower surface of the second substrate, and the other side of the second substrate is fixedly coupled with the surface of the PLC chip.
Preferably, the PLC chip is arranged upside down, specifically:
the upper cladding layer of the PLC chip is coupled with the upper surface of the first substrate, and the lower substrate of the PLC chip is coupled with the lower surface of the second substrate.
Preferably, a glue guiding groove is formed in a position, close to the front end of the PLC chip, of the upper surface of the first substrate, and is used for mounting glue.
Preferably, the mode of coupling the PLC chip and the FA component is one or more of coupling the FA component and the index matching glue, coupling the FA component and the optical path matching lens, coupling the collimator component and the index matching glue and coupling the collimator component and the optical path matching lens.
Preferably, a control circuit is disposed in the first substrate, and the laser chip and the PLC chip are respectively electrically connected with the control circuit.
Preferably, the second substrate near the lens is disposed at a position beyond the top of the laser chip at the proximal end thereof, so as to prevent dust and dirt from falling into the laser chip.
In a second aspect, the present invention further provides, based on the high-speed light emitting assembly based on the inverted PLC chip of the first aspect, a method for manufacturing the high-speed light emitting assembly based on the inverted PLC chip, including:
according to the coupling sequence of each device, the coupling positions of the laser chip, the PLC chip, the FA component and the isolator on the first substrate are obtained and coupled;
coupling a lens within the light emitting assembly: and mounting a lens on one side of the lower surface of the second substrate, hanging the lens between the laser and the isolator, moving the second substrate to be coupled with the PLC chip for finding light, determining the coupling position of the lens, and fixing the second substrate provided with the lens on the PLC chip to finish the manufacturing of the light emitting component.
Preferably, the PLC chip adopts inverse coupling, specifically: and according to the obtained position of the PLC chip, coupling and fixing the lower substrate of the PLC chip with the second substrate, and then coupling and fixing the upper cladding of the PLC chip on the upper surface of the first substrate.
Preferably, the coupling and fixing the lower substrate of the PLC chip and the second substrate is specifically:
inverting the PLC chip on a glass base 9 of the deformation-free packaging device, and adsorbing and fixing the PLC chip by utilizing vacuum adsorption holes on the glass base 9;
heating the PLC chip inverted on the glass base 9 by using a heating core 81 of the deformation-free packaging device, so that the whole PLC chip reaches the preset packaging temperature;
maintaining the PLC chip at a stable packaging temperature, and coupling and fixing the lower substrate of the PLC chip with the lower surface of the second substrate until the lower substrate of the PLC chip and the second substrate are coupled;
wherein, vacuum adsorption holes for adsorbing the PLC chips, a glass base 9 for bearing the PLC chips and a heating core 81 for heating the PLC chips are arranged in the deformation-free packaging device.
Preferably, after the upper cladding of the PLC chip is fixed on the upper surface of the first substrate, the method further includes setting a glue guiding groove, specifically:
determining the glue bonding position when the PLC chip is coupled according to the coupling position of the upper cladding of the PLC chip and the first substrate;
and a glue guide groove is arranged at the glue bonding position so as to be convenient for receiving the glue overflowed in the bonding process.
Compared with the prior art, the embodiment of the invention has the beneficial effects that: according to the invention, the lens is arranged between the laser and the isolator in a hanging manner, the lens is arranged on one side of the second substrate, and then the lens is fixed on the PLC chip through the other side of the second substrate, and when the lens is coupled with the PLC chip, the second substrate is clamped by the coupling device to drive the lens to move to be aligned with the PLC chip, so that the lens is prevented from being directly clamped by the coupling device and damaged; in addition, the lens is hung, so that the phenomenon that the device below the lens expands to cause inaccurate light due to severe heating of the laser can be effectively avoided; the PLC chip is arranged upside down, the upper cladding of the PLC chip is attached to the upper surface of the first substrate, dirt introduced in the processes of ageing, temperature circulation, turnover, testing and the like of a device can be effectively avoided, dirt is not visible or is not cleaned due to the inclination angle problem in the forward attaching process of the PLC chip, and therefore the problem that the dirt is found after the encapsulation is finished or the dirt at the front end of the PLC chip is not moved to the front end of the PLC chip waveguide after the module works for a period of time is caused, and the problem that the yield or the reliability of a light emitting assembly is caused is avoided.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of coupling of the overall structure of a high-speed light emitting assembly based on an inverted PLC chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first substrate of a high-speed light emitting assembly based on an inverted PLC chip according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a connection structure of a high-speed light emitting module FA module and a glue coupling with a refractive index matching based on an inverted PLC chip according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a coupling connection structure between a high-speed light emitting module FA module and an optical path matching lens based on an inverted PLC chip according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a connection structure of a collimator assembly of a high-speed light emitting assembly based on an inverted PLC chip and an index matching glue coupling according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a connection structure of coupling a collimator assembly of a high-speed light emitting assembly based on an inverted PLC chip and an optical path matching lens according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a control circuit position distribution of a high-speed light emitting component based on an inverted PLC chip according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a parallel arrangement of multiple groups of high-speed light emitting components based on an inverted PLC chip according to an embodiment of the present invention;
fig. 9 is a flowchart of a method for manufacturing a high-speed light emitting module based on an inverted PLC chip 4 according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a deformation-free packaging device for coupling a second substrate and a PLC chip according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of a deformation-free packaging device with optical detection according to an embodiment of the present invention;
FIG. 12 is a schematic top view of a glass base with a cavity window according to an embodiment of the present invention;
FIG. 13 is a schematic top view of a metal heating base with a light-passing window according to an embodiment of the present invention;
fig. 14 is a schematic cross-sectional view of a deformation-free packaging device with optical detection according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom", etc. refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
Example 1:
embodiment 1 of the present invention provides a high-speed light emitting module based on an inverted PLC chip 4, as shown in fig. 1, comprising: a laser chip 1, a first substrate 2, a second substrate 3, a PLC chip 4, an FA assembly 5, a lens 6, and an isolator 7;
sequentially coupling and connecting the laser chip 1, the isolator 7, the PLC chip 4 and the FA component 5 in sequence, and arranging the coupled laser chip 1, isolator 7, PLC chip 4 and FA component 5 on the upper surface of the first substrate 2;
the lens 6 is arranged between the laser and the isolator 7 in a coupling way, and the lower end of the lens 6 and the upper surface of the first substrate 2 are arranged in a suspending way at a preset height;
the upper end of the lens 6 is disposed on one side of the lower surface of the second substrate 3, and the other side of the second substrate 3 is coupled and fixed with the surface of the PLC chip 4.
The lens 6 in the embodiment of the invention is suspended between the laser and the isolator 7 and is coupled with the PLC chip 4 through the second substrate 3, and the coupling device drives the lens 6 arranged on the second substrate 3 to move and is coupled and aligned with the PLC chip 4 by clamping the second substrate 3. According to the invention, the second substrate 3 is clamped by the coupling device to drive the lens 6 to be aligned with the PLC chip 4, so that the damage caused by the fact that the coupling device directly clamps the lens 6 is avoided; moreover, by adopting the suspension arrangement, the phenomenon that the laser heats seriously, so that the lens 6 is shifted due to expansion of a device below the lens 6 can be effectively avoided, and the lens 6 is inaccurate in light.
In order to describe the complete scheme of the present invention, the following details of the present invention will be described in detail, and further, the PLC chip 4 adopts an inverted configuration, specifically: the upper cladding layer of the PLC chip 4 is coupled with the upper surface of the first substrate 2, and the lower substrate of the PLC chip 4 is coupled with the lower surface of the second substrate 3.
In the embodiment of the invention, the PLC chip 4 is arranged upside down, the upper cladding of the PLC chip 4 and the upper side surface of the first substrate 2 are coupled and fixed, and the coupling and fixing mode is usually adopted for fixing by adopting a glue bonding mode. Most PLC products are that the PLC chip 4 is forward mounted, and the traditional forward light emitting assembly of the PLC chip 4 is likely to be dirty in the processes of aging, temperature cycle, turnover, test and the like, and the forward mounted PLC chip 4 can cause dirty which is converged at the front end of the PLC waveguide to be invisible or not clean due to the problem of inclination angle, so that the dirty is accumulated at the waveguide layer of the PLC chip 4 after encapsulation is finished, and further the problem of yield or reliability is caused. Further, dirt, debris, and the like are more likely to be collected in the waveguide layer due to the influence of static electricity and the like, resulting in a device failure. After the PLC chip 4 is inverted, the dirt on the waveguide layer of the PLC chip 4 can be clearly seen, the dirt can be completely removed through the technology such as visual inspection, and the yield and the reliability of the product are improved.
Further, as shown in fig. 2, a glue guiding groove 21 is provided on the upper surface of the first substrate 2 near the front end of the PLC chip 4, for mounting glue.
After the upper cladding of the PLC chip 4 is attached to the first substrate 2, the PLC chip 4 is polished at a certain angle. In the process of mounting the upper cladding layer of the PLC chip 4 and the first substrate 2, glue at the mounting position may overflow and adhere to the waveguide layer of the PLC chip 4, so that the situation that the lens 6 cannot be aligned in the coupling process of the PLC chip 4 is caused. It should be noted that, after the glue guiding groove 21 is provided, the height of other devices (such as the isolator 7) correspondingly arranged in the glue guiding groove 21 is always consistent with the height before coupling, so that the coupling condition of the light emitting component is met.
Further, the manner of coupling the PLC chip 4 and the FA assembly 5 is one or more of coupling the FA assembly 5 and the index matching glue, coupling the FA assembly 5 and the optical path matching lens, coupling the collimator assembly and the index matching glue, and coupling the collimator assembly and the optical path matching lens.
After the corresponding optical signals are emitted by the laser of the optical emission component of the embodiment of the invention and pass through the lens 6, the isolator 7 and the PLC chip 4, the optical signals are emitted by the optical fibers after passing through the FA component 5, the FA component 5 is actually an optical fiber array, the front end of the FA component 5 is coupled with the tail end of the PLC chip 4, and the optical fibers are connected at the tail end of the FA component 5. As shown in fig. 3 and fig. 4, in the coupling manner of the FA assembly 5 and the PLC chip 4 in the embodiment of the present invention, the FA assembly 5 and the glue with matched refractive index may be coupled, and the front end of the FA assembly 5 and the rear end of the PLC chip 4 are bonded together by the glue, so that the glue should be uniformly applied to the bonding portion during the bonding process, so as to avoid the occurrence of bubbles or non-uniformity inside the glue layer at the bonding portion, and affect the coupling effect between the FA assembly 5 and the PLC chip 4; the coupling mode of the FA component 5 and the PLC chip 4 can also be implemented by coupling the FA component 5 and the PLC chip 4 by using a matched lens and the coupling mode of the lens 6 is implemented according to the coupling mode of the optical path; besides, as shown in fig. 5 and 6, the present invention may also replace the coupling of the FA assembly 5 and the PLC chip 4 with a collimator assembly, which specifically includes two modes of coupling: the first mode adopts a mode of matching the collimator assembly with the refractive index to align with the tail end of the PLC chip 4 in a coupling way; the second type is coupled and aligned with the end of the PLC chip 4 by means of a collimator assembly coupled with an optical path matching lens.
Further, a control circuit 22 is disposed in the first substrate 2, and the laser chip 1 and the PLC chip 4 are electrically connected to the control circuit 22, respectively.
As shown in fig. 7, fig. 7 is a schematic diagram of the position distribution of the control circuit, in which only the distribution positions of the control circuit 22 are shown, and in fact, the control circuit 22 should be distributed on the circuit board in the first substrate 2. The laser chip 1 and the PLC chip 4 in the embodiment of the present invention are electrically connected to corresponding power sources, and for the laser chip 1, the laser chip 1 needs the power sources to provide corresponding energy to excite corresponding optical signals, and for the PLC chip 4, additional power sources are needed to supply power to internal devices.
Further, the second substrate 3 near the lens 6 is disposed at a position beyond the laser chip 1 at a near end thereof for preventing dust from falling into the laser chip 1.
As shown in fig. 1, in order to protect the laser chip 1 according to the embodiment of the present invention, some dust or dirt is prevented from falling into the laser chip 1 during the use and packaging process of the laser chip 1, and as a result of poor contact on the laser chip 1, in the packaging process, the second substrate 3 is generally disposed in a lengthening manner, so that the second substrate 3 may face over the laser, and the second substrate 3 may play a role in protecting the laser chip 1 during use. In general, the laser chip 1 and the control circuit 22 are electrically connected by adopting a gold wire bonding mode, the position of the laser chip 1 is set aside by utilizing a probe mode to be used for powering up, and dust and dirt fall into a powered-up position in the using process can be avoided through shielding of the second substrate 3, so that poor contact results are caused.
In addition, in order to improve the efficiency of the light emitting module of the present invention, as shown in fig. 8, the embodiment of the present invention may set a plurality of laser chips 1, and set the laser chips 1 in a row (corresponding to 4 lasers in the figure), and the corresponding isolators 7 are set as array isolators 7, so that the emission of multiple light signals can be performed simultaneously at one time, thereby improving the efficiency of the embodiment of the present invention.
According to the invention, the lens 6 is connected with the second substrate 3 in a hanging manner, and the second substrate 3 is clamped by the coupling device to drive the lens 6 to move to be aligned with the PLC chip 4, so that the lens 6 is prevented from being directly clamped by the coupling device, and the lens 6 is prevented from being damaged; in addition, the lens 6 is hung, so that the consequences of inaccurate light caused by expansion of devices below the lens 6 due to serious heating of a laser can be effectively avoided; the PLC chip 4 is arranged upside down, the upper cladding of the PLC chip 4 is attached to the upper surface of the first substrate 2, dirt can be effectively introduced in the processing process, and the problem that dirt is not visible or is not cleaned due to the inclination angle problem in the forward attaching process of the PLC chip 4 is avoided, so that the problem that the dirt which is not at the front end of the PLC chip 4 is found after the encapsulation is finished or the dirt at the front end of the PLC chip 4 is not moved to the front end of the PLC chip 4 waveguide after the module works for a period of time is caused, and the problem of yield or reliability of a light emitting component is caused. In addition, the second substrate 3 is lengthened, so that the second substrate 3 can extend beyond the position right above the laser chip 1, and the laser chip 1 and the bonding part of the laser are protected.
Example 2:
the present invention also provides a method for manufacturing a high-speed light emitting module based on an inverted PLC chip, as shown in fig. 9, based on the high-speed light emitting module based on the inverted PLC chip of embodiment 1, including:
step 201: according to the coupling sequence of each device, the coupling positions of the laser chip 1, the PLC chip 4, the FA component 5 and the isolator 7 on the first substrate 2 are obtained and are coupled;
in the processing process of the embodiment of the present invention, the positions of the corresponding devices in the light emitting assembly should be determined first, and then the corresponding devices are mounted on the corresponding positions of the first substrate 2.
Step 202: coupling the lens 6 within the light emitting assembly: and mounting a lens 6 on one side of the lower surface of the second substrate 3, suspending the lens 6 between the laser and the isolator 7, moving the second substrate 3 and the PLC chip 4 to perform coupling light finding, determining the coupling position of the lens 6, and fixing the second substrate 3 provided with the lens 6 on the PLC chip 4 to complete the manufacture of the light emitting component.
When the lens 6 is coupled, the lens 6 is mounted on the second substrate 3 in a hanging mode, and then the coupling position of the lens 6 and the PLC chip 4 is determined by adjusting the position of the second substrate 3; after the coupling position of the lens 6 is determined, the lens 6 is fixed at the coupling position by adjusting the position of the lens 6 and fixing the second substrate 3.
In the manufacturing process of the light emitting component, the lens 6 is always in a hanging state, and the coupling device is always used for indirectly setting the lens 6 through the second substrate 3, so that the coupling device is not in direct contact with the second substrate 3, and further damage caused by the fact that the coupling device directly clamps the lens 6 is avoided; in addition, the lens 6 adopts a hanging arrangement, so that the phenomenon that the lens 6 is misplaced and cannot be aligned with the PLC chip 4 due to serious heating in the working process of the laser chip 1 is avoided.
In order to describe the manufacturing process of the light emitting assembly of the embodiment of the present invention in detail, details of the manufacturing process of the light emitting assembly of the embodiment of the present invention are described in detail below; further, the PLC chip 4 adopts inverse coupling, specifically: according to the obtained position of the PLC chip 4, the lower substrate of the PLC chip 4 is coupled and fixed with the second substrate 3, and then the upper cladding of the PLC chip 4 is coupled and fixed on the upper surface of the first substrate 2.
After determining the coupling position of the lens 6, the embodiment of the invention needs to fix the lens 6 in the light emitting component to ensure that the lens 6 can be in a state of being coupled with the PLC chip 4 for a long time, and the invention couples and bonds the second substrate 3 provided with the lens 6 and the lower substrate of the PLC chip 4, so that the lens 6 can be fixed at the coupling position without moving, then fixes the upper cladding of the PLC chip 4 fixed with the second substrate 3 on the upper surface of the first substrate 2, and further realizes the coupling and fixing of the lens 6 and the PLC chip 4.
In order to avoid the situation that too much glue adheres to the upper cladding layer of the PLC chip 4 and the upper surface of the first substrate 2 in the embodiment of the present invention, and thus the glue overflows and is accumulated on the waveguide layer of the PLC chip 4 in the mounting process, so that the lens 6 and the PLC chip 4 are inaccurate in light, the embodiment of the present invention further includes the provision of a glue guiding groove 21, specifically: determining the glue bonding position when the PLC chip 4 is coupled according to the coupling position of the upper cladding of the PLC chip 4 and the first substrate 2; the glue guiding groove 21 is arranged at the glue bonding position so as to be convenient for receiving the glue overflowed in the bonding process, and the influence of the glue on the light emitting assembly can be effectively avoided.
Further, in order to prevent the embodiment of the present invention from deformation of the coupling between the PLC chip 4 and the second substrate 3 due to inconsistent temperatures of each part of the PLC chip 4 in the coupling and bonding process between the second substrate 3 and the PLC chip 4, and further change the relative positions of the lens 6 and the PLC chip 4, and cause the relative offset between the originally aligned lens 6 and the PLC chip 4, in the coupling and fixing process between the lower substrate of the PLC chip 4 and the second substrate 3, a heating device is provided, and the coupling and fixing between the PLC chip 4 and the second substrate 3 at a preset packaging temperature is ensured by using heating in the non-deformation packaging device, specifically:
inverting the PLC chip 4 on a glass base 9 of the deformation-free packaging device, and adsorbing and fixing the PLC chip 4 by utilizing vacuum adsorption holes on the glass base 9;
heating the PLC chip 4 inverted on the glass base 9 by using a heating core 81 of the deformation-free packaging device, so that the whole PLC chip 4 reaches a preset packaging temperature;
maintaining the PLC chip 4 at a stable packaging temperature, and coupling and fixing the lower substrate of the PLC chip 4 and the lower surface of the second substrate 3 until the lower substrate of the PLC chip 4 and the second substrate 3 are coupled;
wherein, be provided with in the non-deformation packaging hardware and be used for adsorbing the vacuum adsorption hole of PLC chip 4, be used for accepting the glass base 9 of PLC chip 4 to and be used for giving the heating core 81 of PLC chip 4 heating, so that the PLC chip 4 keeps under the encapsulation temperature of predetermineeing, and the lower substrate of PLC chip 4 does not take place asynchronous deformation when carrying out the coupling with second base plate 3.
In order to better explain the manufacturing method of the high-speed light emitting component based on the inverted PLC chip, which is provided by the embodiment of the invention, the structure, the function and the working principle of the deformation-free packaging device used by the embodiment are explained in detail.
In order to distinguish the structure of the present invention from the structure of the deformation-free packaging device, the structure in the deformation-free packaging device in the drawings is also provided with corresponding reference numerals, and it should be noted that the deformation-free packaging device is only a processing tool used in the manufacturing method of the light emitting assembly of the present invention, and not belongs to the internal structure of the light emitting assembly of the present invention, but is a tool used in one process for manufacturing the high-speed light emitting assembly of the embodiment of the present invention. The deformation-free packaging device used in the present invention specifically includes a metal heating base 8, and a heating core 81 and a temperature sensor 82 located in the metal heating base 8, specifically:
a glass base 9 is adhered to the metal heating base 8, and the glass base 9 transmits heat of the heating base to the PLC chip 4, so that the PLC chip 4 and the second substrate 3 are packaged in a deformation-free manner;
the metal heating base 8 is provided with a first-stage vacuum adsorption air hole 83 and a through air passage 84, the through air passage 84 is connected to a vacuum pump 85 for providing vacuum suction for the vacuum adsorption air hole, and the first-stage vacuum adsorption air hole 83 on the metal heating base 8 corresponds to a second-stage vacuum adsorption air hole 91 on the glass base 9.
As shown in fig. 10, in order to avoid deformation of the glass base 9 of the deformation-free packaging device due to rapid temperature change, the glass base 9 of the deformation-free packaging device is connected with a metal heating base 8, and a heating core 81 is arranged in the metal heating base 8, so that deformation of the glass base 9 can be effectively avoided, and heat can be transferred to the PLC chip 4 through heat transfer. Because of the property of glass, compared with metal, the glass is not easy to carry out secondary processing after being molded, especially small parts are additionally arranged on a molded glass device, so that a vacuum pump 85 of a deformation-free packaging device is arranged on a metal heating base 8, vacuum adsorption air holes are formed in the metal heating base 8 and the glass base 9, after the metal heating base 8 and the glass base 9 are additionally arranged, the vacuum adsorption air holes of the metal heating base 8 and the glass base 9 penetrate and align, then through a through air passage 84 is formed in the metal heating base 8, through the suction effect of the vacuum pump 85, the control between the deformation-free packaging device and the PLC chip 4 is pulled out, and then the upper cladding of the PLC chip 4 is compressed with the glass base 9 of the deformation-free packaging device by utilizing the effect of atmospheric pressure, so that the efficient temperature supply of the PLC chip 4 is realized.
The deformation-free packaging device is also provided with the matched balancing weight 10 and the temperature controller, the balancing weight 10 is loaded on the second substrate 3, and when the second substrate 3 is bonded and coupled with the PLC chip 4, the balancing weight 10 enables the second substrate 3 to be relatively fixed with the PLC chip 4; the temperature of each part of the PLC chip 4 transmitted by the temperature sensor 82 and the preset coupling temperature are monitored by the temperature controller, the heating core 81 is controlled by the temperature controller to conduct power on/off control, so that the temperature of the PLC chip 4 is increased to be the same as the preset coupling temperature, and the power on/off of the heating core 81 is controlled by the discontinuity, so that the temperature of the PLC chip 4 is kept at the preset coupling temperature. After the second substrate 3 is coupled with the PLC chip 4, the vacuum pump 85 is adjusted to enable the inside and the outside of the deformation-free packaging device to be the same, the deformation-free packaging device is separated from the PLC chip 4, the deformation-free coupling of the PLC chip 4 and the second substrate 3 is completed, natural warping caused by screw fixation can be effectively avoided and can not be eliminated in a vacuum adsorption mode of the deformation-free packaging device, the situation that the thickness is uneven and slit bubbles are easy to occur (the lens is caused to shift) can be effectively avoided, and further, the alignment position of the lens and the PLC chip 4 is not changed in the coupling process.
In addition, as shown in fig. 11 to 14, the deformation-free packaging device used in the present invention further includes an optical mirror 11, which optically reflects the detection signal light 12 outputted from the PLC chip 4 and transmits the reflected detection signal light to an optical detection device (not directly indicated in the figure, but a person skilled in the art can know that the optical detection device is disposed at the position of the metal heating base 8 where the corresponding detection signal light 12 is reflected and emitted from the light-transmitting window 86 of the metal heating base 8), and the optical detection device detects the optical signal received by the analysis, thereby judging whether the PLC chip 4 is deformed; the metal heating base 8 is provided with a light-passing window 86, the glass base 9 is provided with a hollow window 92 (more fully shown in fig. 12 and 13), and the detection signal light 12 is transmitted into the PLC chip 4 through the light-passing window 86 and the hollow window 92 of the packaging fixture, reflected by the optical reflector 11, passes through the PLC chip 4 again, and reaches the optical detection device through the hollow window 92 and the light-passing window 86. The optical signal detection structure provided in the deformation-free packaging device used by the invention can further improve the temperature control in the packaging process, and can also concentrate on the accurate detection of possible problems under the condition of affecting the packaging process as little as possible. It should be noted that, the PLC chip 4 and the second substrate 3 of the present invention are made of transparent materials, so that the signal light 12 can be successfully transmitted.
In combination with the above-described modifications of the optical signal detection structure presented by fig. 11-14, there is a better implementation of the deformation-free packaging device in the specific implementation process, which further considers the modifications made to reduce the influence of the light-passing window 86 and the cavity window 92 on the heating effect as much as possible. Compared with the common splitting method, the method has the advantages that a large through hole is designed, in the improvement scheme, the corresponding light-passing window 86 and the cavity window 92 are flattened, the meaning of the processing is that when the parallel light set by small light spots is adopted for detecting the light signal, the flattened light-passing window 86 and the cavity window 92 can be successfully utilized to complete detection, and in addition, the flattening processing is adopted, so that the heat conduction uniformity and the heat conduction effect on the metal heating base 8 and the glass base 9 are realized.
As shown in fig. 14, the light-passing windows 86 are symmetrically disposed on both sides of the metal heating base 8, and extend from outside to inside to the upper surface of the metal heating base 8 at a first preset angle θ, and extend the extension of the preset angle to one side of the bottom surface of the adsorbed PLC chip 4 through the hollow window 92 on the glass base 9; it will be appreciated that the PLC chip 4 shown in fig. 14 located above the glass mount 9 is already a PLC chip 4 of moderate width (in the lateral length represented in fig. 14) adapted to the respective glass mount 9, and that during actual operation, it is ensured that the edge of the cavity window 92 shown in fig. 14 on the side of the top of the cavity window near the center of the collection of fig. 14 is more centered than the side of the PLC chip 4 of the smallest adapted width, so that an area where only the PLC chip 4 is incident from the bottom of the respective PLC chip 4 is reserved. Taking fig. 14 as an example, the corresponding region width is identified as B.
The detection signal light 12 enters from a light-passing window 86 at one side of the metal heating base 8 according to a second preset angle, is reflected by the optical reflector 11, and then is emitted to the optical detection device through the light-passing window 86 symmetrically arranged at the other side of the metal heating base 8. In fig. 11, the corresponding second preset angle is denoted by β, and in the actual implementation process, the corresponding β is selected to match the thickness of the optical mirror 11, that is, in order to meet the condition that the corresponding detection signal light 12 enters from the clearance window on one side of the metal heating base 8 and exits from the clearance window 86 on the other side, the thickness of the optical mirror 11 affects the allowable incident angle. The corresponding incident angle is also related to the first preset angle and the approach degree of the surface opening of the cavity window 92 to the geometric center shown in fig. 14, and the larger the corresponding first preset angle is, the closer the surface opening of the cavity window 92 is to the geometric center, the larger the corresponding second preset angle is.
After the deformation-free packaging device adopts the detection light path association structure similar to that shown in fig. 11, on one hand, the advantage that the detection travel of the angle incident light is longer than the vertical detection travel can be utilized, and the compliance detection effect can be achieved through less detection times; the influence of the light-transmitting window 86 and the cavity window 92 on the deformation of the original PLC chip 4 can be reduced to a minimum.
As shown in fig. 14, the light-passing window 86 and the hollow window 92 form a fan-shaped structure, and the incident angle of the detection light is adjusted, so that the detection light can adapt to PLC chips 4 with different thicknesses to be detected; the cavity window 92 is located near the bottom of the optical element to be detected near the edge with respect to the light entrance of the optical element to be detected. As shown in fig. 11, the thickness of the optical reflecting mirror 11 is relatively limited, so that the fan-shaped structural space is fully utilized, and the effect that the optical reflecting mirror can complete corresponding detection under the condition that the light inlet of the cavity window 92, which is opposite to the optical element to be detected, is positioned at the bottom of the optical element to be detected, which is close to the edge is achieved.
Still taking fig. 14 as an example, the influence of the corresponding light-passing window 86 and cavity window 92 on the heating effect of the original metal heating base 8 and glass base 9 is further reduced, in the above-mentioned fan-shaped light-passing window 86 and cavity window 92 structure, the fan-shaped edge near the geometric center is processed into a vertical state as much as possible, and the other edge of the fan-shaped edge is carried past by the side edges of the metal heating base 8 and glass base 9, so that the influence of the middle on the heating area of the PLC chip 4 is as little as possible.
As shown in fig. 12 and 13, the light-passing window 86 and the cavity window 92 are disposed at positions close to the vertical plane where the first stage vacuum adsorption air hole 83 and the second stage vacuum adsorption air hole 91 are located, so that the detection area covers the position close to the corresponding vacuum adsorption air hole on the PLC chip 4.
When the PLC chip 4 and the second substrate 3 are fixed in a coupling way, the heating core 81 in the deformation-free packaging device is utilized to heat the PLC chip 4, so that the constant preset coupling temperature is kept in the coupling process, the PLC chip 4 is not subjected to asynchronous deformation in the coupling process, and the waveguide layer of the PLC chip 4 and the lens 6 are always aligned. It should be noted that, in the present invention, the preset packaging temperature of the PLC chip 4 and the second substrate 3 is determined according to the type of the PLC chip 4 and the material of the second substrate 3, and in actual situations, the preset packaging temperature of the coupling process of the two can be tested in an experimental manner. It should be noted that the asynchronous deformation actually causes the PLC chip 4 to warp to some extent, so that the PLC chip 4 deforms, and the possibility of warp deformation in the process of coupling the PLC chip 4 and the second substrate 3 is further avoided by providing the optical detection device.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. A high-speed light emitting assembly based on an inverted PLC chip, comprising: a laser chip (1), a first substrate (2), a second substrate (3), a PLC chip (4), an FA component (5), a lens (6) and an isolator (7);
the laser chip (1), the isolator (7), the PLC chip (4) and the FA component (5) are sequentially coupled and connected in sequence, and the coupled laser chip (1), the isolator (7), the PLC chip (4) and the FA component (5) are arranged on the upper surface of the first substrate (2);
the lens (6) is arranged between the laser and the isolator (7) in a coupling way, and the lower end of the lens (6) and the upper surface of the first substrate (2) are arranged in a suspending way at a preset height;
the upper end of the lens (6) is arranged on one side of the lower surface of the second substrate (3), and the other side of the second substrate (3) is fixedly coupled with the surface of the PLC chip (4).
2. The high-speed light emitting assembly based on inverted PLC chips according to claim 1, wherein the PLC chips (4) take an inverted arrangement, in particular:
the upper cladding layer of the PLC chip (4) is coupled with the upper surface of the first substrate (2), and the lower substrate of the PLC chip (4) is coupled with the lower surface of the second substrate (3).
3. The high-speed light emitting assembly based on the inverted PLC chip according to claim 2, wherein a glue guiding groove (21) is formed in a part, close to the front end of the PLC chip (4), of the upper surface of the first substrate (2) for mounting glue.
4. The inverted PLC chip based high speed light emitting assembly of claim 2, wherein the PLC chip (4) is coupled to the FA assembly (5) in one or more of a glue coupling the FA assembly (5) to an index matching, a FA assembly (5) to an optical path matching lens, a collimator assembly to an index matching glue coupling, and a collimator assembly to an optical path matching lens.
5. The high-speed light emitting assembly based on the inverted PLC chip according to claim 1, wherein a control circuit (22) is disposed in the first substrate (2), and the laser chip (1) and the PLC chip (4) are electrically connected to the control circuit (22), respectively.
6. The inverted PLC chip based high speed light emitting assembly according to claim 1, wherein a proximal end of the second substrate (3) near the lens (6) is disposed beyond a position directly above the laser chip (1) for preventing dust and dirt from falling into the laser chip (1).
7. A method of manufacturing a high-speed light emitting assembly based on an inverted PLC chip, comprising:
according to the coupling sequence of each device, the coupling positions of the laser chip (1), the PLC chip (4), the FA component (5) and the isolator (7) on the first substrate (2) are obtained and are coupled;
coupling a lens (6) within the light emitting assembly: and mounting a lens (6) on one side of the lower surface of the second substrate (3), suspending the lens (6) between the laser and the isolator (7), moving the second substrate (3) to be coupled with the PLC chip (4) for finding light, determining the coupling position of the lens (6), and fixing the second substrate (3) provided with the lens (6) on the PLC chip (4) to finish the manufacturing of the light emitting component.
8. The method for manufacturing a high-speed light emitting assembly based on an inverted PLC chip according to claim 7, wherein the PLC chip (4) adopts an inverted coupling, in particular: according to the obtained position of the PLC chip (4), the lower substrate of the PLC chip (4) is coupled and fixed with the second substrate (3), and then the upper cladding of the PLC chip (4) is coupled and fixed on the upper surface of the first substrate (2).
9. The method for manufacturing the inverted PLC chip-based high-speed light emitting module according to claim 8, wherein the coupling and fixing of the lower substrate of the PLC chip (4) and the second substrate (3) is specifically:
inverting the PLC chip (4) on a glass base of the deformation-free packaging device, and adsorbing and fixing the PLC chip (4) by utilizing a vacuum adsorption hole on the glass base;
heating the PLC chip (4) inverted on the glass base by using a heating core of the deformation-free packaging device, so that the whole PLC chip (4) reaches the preset packaging temperature;
maintaining the PLC chip (4) at a stable packaging temperature, and coupling and fixing the lower substrate of the PLC chip (4) and the lower surface of the second substrate (3) until the lower substrate of the PLC chip (4) and the second substrate (3) are coupled;
wherein, be provided with in the non-deformation packaging hardware and be used for adsorbing the vacuum adsorption hole of PLC chip (4), be used for accepting the glass base of PLC chip (4) and be used for the heating core of heating PLC chip (4).
10. The method for manufacturing the high-speed light emitting assembly based on the inverted PLC chip according to claim 8, wherein after the upper cladding of the PLC chip (4) is coupled and fixed to the upper surface of the first substrate (2), further comprising providing a glue guiding groove (21), specifically:
determining the glue bonding position of the PLC chip (4) during coupling according to the coupling position of the upper cladding of the PLC chip (4) and the first substrate (2);
and a glue guiding groove (21) is arranged at the glue bonding position so as to be convenient for receiving the glue overflowed in the bonding process.
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