CN214228255U

CN214228255U - Optical module

Info

Publication number: CN214228255U
Application number: CN202120501408.2U
Authority: CN
Inventors: 付孟博; 李丹; 傅钦豪; 崔峰; 李传斌; 王腾飞
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-03-09
Filing date: 2021-03-09
Publication date: 2021-09-17
Anticipated expiration: 2031-03-09

Abstract

The application provides an optical module, includes: a circuit board; the light receiving assembly is arranged on the circuit board and used for receiving signal light from the outside of the optical module; the light receiving module includes: the light receiving chip is arranged on the circuit board and is electrically connected with the circuit board; a fourth housing disposed on the circuit board and covering the light receiving chip; and the reflecting prism is connected and arranged on the inner wall of the fourth shell and comprises a reflecting surface, and the reflecting surface is projected on the circuit board to cover the light receiving chip. The application provides an optical module, reflecting prism set up on the fourth casing, cover in the top of light receiving chip through the fourth casing, remove through centre gripping fourth casing and drive reflecting prism and remove, can avoid direct centre gripping reflecting prism and cause the reflecting prism damage.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

Generally, to increase the transmission rate of an optical module, increasing the transmission channel in the optical module may be used, such as modifying the conventional optical module including one set of tosa (emitting light of one wavelength) and one set of rosa (receiving light of one wavelength) to include two sets of tosa (each set emitting light of one wavelength) and two sets of rosa (each set receiving light of one wavelength). Therefore, the occupied volumes of the optical transmitting sub-module and the optical receiving sub-module in the optical module are increased continuously, and further the further development of the optical module is not facilitated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module to prevent a reflecting prism from being damaged when the reflecting prism is installed in a coupling mode.

The application provides an optical module, includes:

a circuit board;

the light receiving assembly is arranged on the circuit board and used for receiving signal light from the outside of the optical module;

the light receiving module includes:

the light receiving chip is arranged on the circuit board and is electrically connected with the circuit board;

a fourth housing disposed on the circuit board and covering the light receiving chip;

and the reflecting prism is connected and arranged on the inner wall of the fourth shell and comprises a reflecting surface, and the reflecting surface is projected on the circuit board to cover the light receiving chip.

The application provides an optical module includes circuit board and light receiving component, and light receiving component includes light receiving chip, fourth casing and reflecting prism, and the fourth casing setting just covers on light receiving chip on the circuit board, and then reflecting prism sets up on the fourth casing, covers the top at light receiving chip through the fourth casing. In the assembling process of the optical module, when the reflecting prism needs to be moved during coupling installation, the fourth shell is clamped to move so that the reflecting prism moves. Therefore, the reflecting prism is driven to move by clamping the fourth shell, and the reflecting prism can be prevented from being damaged by directly clamping the reflecting prism.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 5 is an assembly diagram of an optical transceiver sub-assembly and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 6 is a partially exploded schematic view of an optical transceiver sub-assembly and a circuit board in an optical module according to an embodiment of the present disclosure;

FIG. 7 is a partially exploded view of the view of FIG. 6 after being flipped;

fig. 8 is a first partial schematic diagram of an optical transceiver sub-assembly in an optical module according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a second housing in an optical module according to an embodiment of the present disclosure;

fig. 10 is a schematic view of another angular structure of a second housing in an optical module according to an embodiment of the present disclosure;

fig. 11 is a schematic cross-sectional view illustrating an assembly of a first fiber optic adapter and a second housing in an optical module according to an embodiment of the present disclosure;

fig. 12 is a schematic cross-sectional view illustrating an assembly of a second fiber optic adapter and a second housing in an optical module according to an embodiment of the present disclosure;

fig. 13 is a partially exploded schematic view of a first housing and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 14 is a schematic distribution diagram of optical devices in a first housing in an optical module according to an embodiment of the present disclosure;

fig. 15 is a schematic diagram of a transmission optical path in an optical module according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram of a protective cover in an optical module according to an embodiment of the present disclosure;

fig. 17 is a schematic view of another angle structure of a protection cover in an optical module according to an embodiment of the present disclosure;

fig. 18 is a partially exploded schematic view of a circuit board and a light receiving module in an optical module according to an embodiment of the present disclosure;

fig. 19 is a partially enlarged view of a light receiving module in the optical module according to the embodiment of the present application;

fig. 20 is a schematic diagram of a receiving optical path in an optical module according to an embodiment of the present disclosure;

fig. 21 is a schematic view of another angle of a receiving optical path in an optical module according to an embodiment of the present disclosure;

fig. 22 is a schematic structural diagram of a first housing in an optical module according to an embodiment of the present disclosure;

fig. 23 is an exploded view illustrating an assembly of a first housing and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 24 is a schematic view illustrating another angle assembly of the first housing and the circuit board in an optical module according to an embodiment of the present disclosure;

fig. 25 is an assembly cross-sectional view of a first housing and a third housing in an optical module provided in the embodiment of the present application;

fig. 26 is a schematic structural diagram illustrating a local light receiving module of an optical module according to an embodiment of the present disclosure being mounted on a circuit board;

fig. 27 is a first schematic structural diagram of a fourth housing in an optical module according to an embodiment of the present application;

fig. 28 is a second schematic structural diagram of a fourth housing in an optical module according to an embodiment of the present application;

fig. 29 is an exploded view of a fourth housing, a lens array, and a reflection prism in an optical module according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, an optical transceiver sub-assembly 400, a first optical fiber adapter 500, and a second optical fiber adapter 600.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a third shell, and the third shell covers the two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned on two sides of the third shell and are perpendicular to the third shell, and the two side walls are combined with the two side plates to cover the upper shell on the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver sub-assembly 400 inside the optical module; the photoelectric devices such as the circuit board 300 and the optical transceiver sub-assembly 400 are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver sub-module 400 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

Fig. 5 is an assembly diagram of an optical transceiver sub-assembly 400 and a circuit board 300 in an optical module according to an embodiment of the present disclosure. As shown in fig. 5, the optical module provided in the embodiment of the present application integrates the light emitting component and the light receiving component into one optical sub-transceiver module 400, and the optical sub-transceiver module 400 is located at the edge of the circuit board 300. The optical transceiver sub-assembly 400 includes a first housing 410, a second housing 420 and a third housing 430, an upper end opening of the first housing 410, a lower end opening of the second housing 420, a lower end opening of the third housing 430, and the second housing 420 and the third housing 430 are both covered on the first housing 410, so that an accommodating cavity is formed by the first housing 410, the second housing 420 and the third housing 430, and the optical transmitter and receiver are both disposed in the accommodating cavity. And one side of the accommodating cavity is provided with an opening through which the circuit board 300 is inserted into the accommodating cavity, so as to facilitate the electrical connection of the light emitting assembly, the light receiving assembly and the circuit board 300.

Fig. 5 shows the left-right direction and the front-back direction of the optical module, as indicated by the arrows in fig. 5. In the embodiment of the present application, a first fiber adapter 500 and a second fiber adapter 600 are disposed on a side of the optical transceiver sub-assembly 400 away from the circuit board 300, the first fiber adapter 500 and the second fiber adapter 600 are disposed side by side, that is, the first fiber adapter 500 and the second fiber adapter 600 are located at the same height, and are disposed on an end surface of the housing of the optical transceiver sub-assembly 400 side by side in the front-back direction (the front-back direction is disposed side by side in fig. 5), and both the first fiber adapter 500 and the second fiber adapter 600 are inserted into the accommodating cavity. The first optical fiber adapter 500 and the second optical fiber adapter 600 are respectively used for connecting with an optical fiber connector outside the optical module, the optical fiber connector outside the optical module is a standard component commonly used in the industry, and the positions of the two optical fiber adapters inside the optical module are limited by the shape and the size of the external optical fiber connector, so that the first optical fiber adapter 500 and the second optical fiber adapter 600 are arranged on the same height in a product.

After the first optical fiber adapter 500 is inserted into the accommodating cavity, the first optical fiber adapter corresponds to the light emitting component in the accommodating cavity, and is used for transmitting the signal light generated by the light emitting component to the external optical fiber, so as to realize the emission of the light. After the second optical fiber adapter 600 is inserted into the accommodating cavity, it corresponds to the light receiving component in the accommodating cavity, and is used for transmitting the signal light transmitted by the external optical fiber to the light receiving component, so as to receive the light.

In this application embodiment, each optical device of the light emission module needs to guarantee the high accuracy of the light path, and the surface accuracy of the circuit board is not too high, if each optical device of the light emission module is arranged on the circuit board 300, the light path alignment accuracy between each optical device of the light emission module may be low, in order to avoid this situation, part of the optical devices of the light emission module are supported by the metal plate, are arranged in a manner of being separated from the circuit board 300, and are electrically connected in a routing manner.

Fig. 6 is a partially exploded view of an optical transceiver sub-assembly 400 and a circuit board 300 in an optical module according to an embodiment of the present disclosure, and fig. 7 is a partially exploded view of the optical transceiver sub-assembly with the view angle of fig. 6 reversed. As shown in fig. 6 and 7, in the optical module provided in the embodiment of the present application, the optical transmission assembly includes a laser driver chip, a laser chip, a lens, and other devices related to optical transmission, one end of the receiving cavity is connected to the first optical fiber adapter 500, the laser driver chip drives the laser chip to operate, a light beam generated by the laser chip is coupled to the first optical fiber adapter 500 through the lens and other devices, and the light beam is transmitted through the first optical fiber adapter 500. The light receiving assembly comprises a lens, a light receiving chip, a transimpedance amplifier and other devices related to light receiving, one end of the accommodating cavity is connected with the second optical fiber adapter 600, signal light from the outside of the optical module is received through the second optical fiber adapter 600, the received signal light is transmitted to the light receiving chip through the optical devices such as the lens arranged in the accommodating cavity, and photoelectric conversion is achieved through the light receiving chip.

In the embodiment of the present application, to increase the transmission rate of the optical module, the transmission channel in the optical module is increased, that is, the optical module includes a plurality of laser chips (each laser chip emits light of one wavelength) and a plurality of light receiving chips (each receives light of one wavelength). Specifically, in the optical module provided in the embodiment of the present application, a plurality of laser chips are disposed in the accommodating cavity to emit multiple light beams, where the multiple light beams are multiplexed into one light beam and finally converged and coupled to the first optical fiber adapter 500, so that the multiple light beams are emitted through one optical fiber. A plurality of light receiving chips are arranged in the accommodating cavity, one path of light beam transmitted by the second optical fiber adapter 600 is demultiplexed into multiple paths of light beams, and the multiple paths of light beams are respectively transmitted to the plurality of light receiving chips so as to realize that one optical fiber receives multiple paths of light.

The optical transmission assembly includes a plurality of laser chips 450, a plurality of collimating lenses 470, an optical multiplexer 4205, and a first shift prism 4204, the plurality of laser chips 450 being for transmitting a plurality of light beams of different wavelengths. In the embodiment of the present application, the light emitting assembly includes 4 laser chips 450, each laser chip 450 emits one light beam, and each collimating lens 470 is disposed in the emitting light direction of each laser chip 450, and is configured to convert the light beam emitted by the laser chip 450 into a collimated light beam; the optical multiplexer 4205 is disposed in the emergent light direction of the collimating lens 470, and is configured to multiplex multiple light beams with different wavelengths into one composite light beam; the first shift prism 4204 is disposed in the light outgoing direction of the optical multiplexer 4205, and is configured to couple one path of the composite light beam emitted by the optical multiplexer 4205 into the first fiber adapter 500 after being refracted and reflected, so as to implement light emission.

In the present embodiment, the plurality of laser chips 450 and the plurality of collimating lenses 470 are disposed in the cavity of the first housing 410, the optical multiplexer 4205 and the first shift prism 4204 are disposed in the cavity of the second housing 420, and are mounted in the light emitting direction, and when the second housing 420 is covered on the first housing 410, the laser chips 450, the collimating lenses 470, the optical multiplexer 4205, the first shift prism 4204, and the first fiber adapter 500 are sequentially disposed in the light emitting direction.

The light receiving module includes a second shift prism 4206, an optical demultiplexer 4207, and a plurality of light receiving chips, the second shift prism 4206 is configured to transmit one of the light beams transmitted by the second optical fiber adapter 600 to the optical demultiplexer 4207; the optical demultiplexer 4207 is used to demultiplex one beam into multiple beams; the multiple light receiving chips are used for respectively receiving the multiple paths of light beams to achieve light receiving.

In the embodiment of the present application, the second shift prism 4206 and the optical demultiplexer 4207 are disposed in the cavity of the second housing 420, the light receiving chip is disposed on the circuit board 300 inserted into the receiving cavity, and the second housing 420 and the third housing 430 are covered with the first housing 410, and the second shift prism 4206, the optical demultiplexer 4207 and the light receiving chip are sequentially disposed in the light receiving direction.

Fig. 8 is an assembly diagram of the first housing 410, the laser chip 450, and the circuit board 300 in the optical module according to the embodiment of the present disclosure. As shown in fig. 8, the first housing 410 includes a first bottom plate 4110, a first side plate 4120 and a second side plate 4130, the bottom surface of the first bottom plate 4110 is connected to the lower housing 202, the bottom surface of the first side plate 4120 is connected to the first bottom plate 4110, the bottom surface of the second side plate 4130 is connected to the first bottom plate 4110, and the first side plate 4120 and the second side plate 4130 are disposed opposite to each other, so that the first housing 410 is a housing with left, right and upper openings formed by the first bottom plate 4110, the first side plate 4120 and the second side plate 4130, and the plurality of laser chips 450 and the plurality of collimating lenses 470 are all carried by the first bottom plate 4110. The left side of the first housing 410 opens toward the first fiber optic adapter 500 and the second fiber optic adapter 600; the right side opening of the first case 410 faces the circuit board 300, and the circuit board 300 is inserted into the first case 410 through the right side opening; the upper opening of the first casing 410 faces the upper casing 201, and the second casing 420 and the third casing 430 are covered at the upper opening, so that the first casing 410, the second casing 420 and the third casing 430 form an accommodating cavity.

Fig. 9 is a schematic partial assembly diagram of the first housing 410 and the laser chip 450 in the optical module according to the embodiment of the present application. As shown in fig. 9, the laser chip 450 is disposed on the first base plate 4110 near the right opening, and is electrically connected to the circuit board 300, and the circuit board 300 supplies power to the laser chip 450 to drive the laser chip 450 to generate a laser beam. In order to fix the laser chip 450 on the first base plate 4110 of the first housing 410, a semiconductor cooler 490 is disposed on the first base plate 4110 near the right opening, the bottom surface of the semiconductor cooler 490 is attached to the first base plate 4110, a substrate 4901 is disposed on the top surface of the semiconductor cooler 490 away from the lower housing 202, the laser chip 450 is attached to the substrate 4901, so that heat generated by the operation of the laser chip 450 can be transferred to the semiconductor cooler 490 through the substrate 4901, and heat exchange is performed through the semiconductor cooler 490, thereby reducing the operating temperature of the laser chip 450 and ensuring the lifetime of the laser chip 450. In the present embodiment, the substrate 4901 is typically a plate made of aluminum nitride or silicon.

The laser beam generated by the laser chip 450 is transmitted along the left-right direction, and the laser beam generated by the laser chip 450 is a diverging beam, so that the first converging lens 460 is disposed in the light emitting direction of the laser chip 450, the first converging lens 460 is attached to the semiconductor cooler 490, and the first converging lens 460 is used for converting the diverging beam generated by the laser chip 450 into a parallel beam. In the embodiment of the present application, the light emitting module includes 4 laser chips 450 and 4 first condensing lenses 460, the 4 laser chips 450 are disposed on the semiconductor cooler 490 side by side in front of and behind each other, and each first condensing lens 460 is disposed in the emitting direction of each laser chip 450 for converting a diverging light beam generated by each laser chip 450 into a parallel light beam.

The first base plate 4110 is further provided with a plurality of collimating lenses 470, each collimating lens 470 is disposed in the emitting direction of each laser chip 450, and the laser chips 450, the first condensing lens 460 and the collimating lenses 470 are sequentially disposed along the light emitting direction. Since the outer surface of the collimating lens 470 is a curved surface, in order to fix the collimating lens 470 on the first base plate 4110, the first base plate 4110 is provided with a plurality of glass blocks 480, the bottom surface of each glass block 480 is adhered to the first base plate 4110, and the right side surface of each collimating lens 470 is adhered to the left side surface of each glass block 480, so that the collimating lens 470 is fixed on the first base plate 4110 through the glass blocks 480.

In the embodiment of the present application, the glass block 480 is not only used for fixing the collimating lens 470, the laser beam generated by the laser chip 450 is converted into a parallel beam by the first converging lens 460, and the parallel beam enters the collimating lens 470 through the glass block 480, the glass block 480 does not perform displacement conversion on the parallel beam, and the beam is directly transmitted out from the glass block 480.

Fig. 10 is a schematic partial structure diagram of an optical transceiver sub-assembly 400 in an optical module according to an embodiment of the present disclosure. As shown in fig. 10, in the optical module provided in the embodiment of the present application, a first cavity 4201 and a second cavity 4202 are disposed in a second housing 420, the first cavity 4201 and the second cavity 4202 are disposed in front of and behind each other, and a partition 4203 is disposed between the first cavity 4201 and the second cavity 4202; the first displacement prism 4204 and the optical multiplexer 4205 of the optical transmission module are both located in the first cavity 4201, the first fiber optic adapter 500 is inserted into the first cavity 4201 of the second housing 420, and the optical multiplexer 4205 is attached to the bottom surface of the first cavity 4201; the first shift prism 4204 is located between the first fiber adapter 500 and the optical multiplexer 4205, the first shift prism 4204 is attached to the bottom surface of the first cavity 4201, and the light input surface of the first shift prism 4204 is attached to the light output surface of the optical multiplexer 4205, such that one composite light beam output by the optical multiplexer 4205 is input into the first shift prism 4204, and the one composite light beam is refractively coupled into the first fiber adapter 500 by reflection of the first shift prism 4204.

The second displacement prism 4206 and the optical demultiplexer 4207 of the light receiving module are located in the second cavity 4202, the second fiber optic adapter 600 is inserted into the second cavity 4202 of the second housing 420, and the optical demultiplexer 4207 is attached to the bottom surface of the second cavity 4202; the second shift prism 4206 is disposed between the second fiber adapter 600 and the optical demultiplexer 4207, and the second shift prism 4206 is attached to the bottom surface of the second cavity 4202, such that one composite beam transmitted by the second fiber adapter 600 is reflected and refractively coupled into the optical demultiplexer 4207 by the second shift prism 4206, and the one composite beam is demultiplexed into beams with different wavelengths by the optical demultiplexer 4207.

Fig. 11 is a schematic structural diagram of a second housing 420 in an optical module provided in the embodiment of the present application. As shown in fig. 11, the second housing 420 includes a second bottom plate 4210, a third side plate 4220 and a fourth side plate 4230, the second bottom plate 4210 is connected to the upper housing 201, the third side plate 4220 faces the first fiber optic adapter 500 and the second fiber optic adapter 600, a top surface of the third side plate 4220 is fixedly connected to the second bottom plate 4210, the third side plate 4220 is provided with a first through hole 4208 and a second through hole 4209, the first fiber optic adapter 500 is fixed to the third side plate 4220 through the first through hole 4208, and the second fiber optic adapter 600 is fixed to the third side plate 4220 through the second through hole 4209; the top surface of the fourth side plate 4230 is fixedly connected to the second base plate 4210, and the left side surface (the side surface facing the fiber optic adapter) of the fourth side plate 4230 is fixedly connected to the right side surface of the third side plate 4220. Thus, the second casing 420 is a casing in which the right, front, and lower sides formed by the second bottom plate 4210, the third side plate 4220, and the fourth side plate 4230 are open.

A first cavity 4201 is formed between the front opening end surface of the second housing 420 and the spacer 4203, the second base plate 4210 is provided with first protrusions 4211 at positions close to the first through holes 4208, a right side surface of the first protrusions 4211 is a flat surface, a bottom surface of the optical multiplexer 4205 is attached to the second base plate 4210, a rear side surface thereof is attached to one side surface of the spacer 4203, and a left side surface thereof is attached to the right side surface of the first protrusions 4211, thereby fixing the optical multiplexer 4205 to the second base plate 4210. The left side surface of the optical multiplexer 4205 is provided with a light outlet, and the right side surface of the first shift prism 4204 is attached to the left side surface of the optical multiplexer 4205 and corresponds to the light outlet to receive one path of the composite light beam output by the optical multiplexer 4205. The left side surface (light exit surface) of the first shift prism 4204 corresponds to the first through hole 4208, and the composite light beam is refracted and reflected by the first shift prism 4204 and then enters the first fiber adapter 500 in the first through hole 4208.

A second cavity 4202 is formed between the other side surface of the spacer 4203 and the side surface of the fourth side plate 4230, and the optical demultiplexer 4207 is fixed to the second base plate 4210 by attaching the bottom surface of the optical demultiplexer 4207 to the second base plate 4210, attaching the rear surface to the side surface of the fourth side plate 4230, and attaching the front surface to the side surface of the spacer 4203. A second protrusion 4212 is disposed on the second base plate 4210 near the second through hole 4209, a rear side surface of the second protrusion 4212 is a flat surface, a bottom surface of the second shift prism 4206 is attached to the second base plate 4210, a front side surface is attached to a rear side surface of the second protrusion 4212, a left side surface (light incident surface) corresponds to the second through hole 4209, and a right side surface (light emergent surface) corresponds to the light entrance of the optical demultiplexer 4207, and a signal light transmitted by the second optical fiber adapter 600 is refracted and reflected by the second shift prism 4206 and then enters the optical demultiplexer 4207, and is demultiplexed into multiple beams with different wavelengths by the optical demultiplexer 4207.

Fig. 12 is another schematic angle structure diagram of the second housing 420 in the optical module according to the embodiment of the present application. As shown in fig. 12, the top surface of the first cavity 4201 in the second housing 420 may be different from the top surface of the second cavity 4202, for example, the second cavity 4202 is recessed in the first cavity 4201, the second housing 420 is disposed over the first housing 410, and the second bottom plate 4210 of the second housing 420 faces the upper housing 201, so that the optical demultiplexer 4207 in the second cavity 4202 is higher than the optical multiplexer 4205 in the first cavity 4201, which facilitates transmission of the multiplexed light output from the optical demultiplexer 4207 to the light receiving chip and prevents the optical transmitting beam from causing crosstalk to the optical receiving beam.

Also, the light receiving chip receives the light beam through the top incident surface, so there is a height difference between the light beam output from the optical demultiplexer 4207 and the light path of the light beam received by the light receiving chip; the laser chip emits a light beam through the side light emitting surface, so that the light beam output by the laser chip is located at the same height as the light path of the light beam received by the optical multiplexer 4205. Therefore, in order to realize the transmission and reception of light, the top surface of the second cavity 4202 of the fixed optical demultiplexer 4207 is recessed from the top surface of the first cavity 4201 of the fixed optical multiplexer 4205.

In the embodiment of the present application, the first shift prism 4204 and the optical multiplexer 4205 of the optical transmitter module and the second shift prism 4206 and the optical demultiplexer 4207 of the optical receiver module are all disposed on the second housing 420, and then the second housing 420 with the first shift prism 4204, the optical multiplexer 4205, the second shift prism 4206 and the optical demultiplexer 4207 fixed thereon is mounted on the first housing 410, so that the optical transceiver sub-module 400 can be mounted from multiple angles, resulting in a large operation space and an improvement in the assembly efficiency of the optical transceiver sub-module 400.

Fig. 13 is a schematic cross-sectional view of a first optical fiber adapter 500 and a second housing 420 in an optical module according to an embodiment of the present disclosure. As shown in fig. 13, when a composite light beam enters the first fiber optic adapter 500 through the first shift prism 4204, the light beam is easily reflected on the fiber stub end surface of the first fiber optic adapter 500, and the reflected light beam enters the optical multiplexer 4205 through the first shift prism 4204, which is easily interfered with the emitted light beam, so that an isolator 510 is embedded in the first through hole 4208, and the isolator 510 is located between the first shift prism 4204 and the fiber stub end surface, and is used to eliminate the light beam reflected by the fiber stub end surface, so as to avoid crosstalk of the emitted light beam caused by the reflected light beam.

To facilitate coupling the composite light beam output by the first displacement prism 4204 into the first fiber optic adapter 500, a second converging lens 520 is further embedded in the first through hole 4208, and the second converging lens 520 is disposed between the isolator 510 and the fiber stub end surface and is used for coupling the composite light beam transmitted through the isolator 510 to the fiber stub end surface of the first fiber optic adapter 500, so as to implement light emission through the first fiber optic adapter 500.

Fig. 14 is a schematic cross-sectional view of a second optical fiber adapter 600 and a second housing 420 in an optical module according to an embodiment of the present application. As shown in fig. 14, when the signal light transmitted by the second fiber optic adapter 600 is incident on the optical demultiplexer 4207, the signal light transmitted by the second fiber optic adapter 600 is a diverging light beam, and for the purpose of conveniently injecting the emitted light beam into the optical demultiplexer 4207 through the second displacement prism 4206, the second lens 610 is embedded in the second through hole 4209, the second lens 610 is located between the second displacement prism 4206 and the fiber ferrule end face of the second fiber optic adapter 600 and is used for converting the light beam transmitted in the second fiber optic adapter 600 into parallel light, and the parallel light is injected into the optical demultiplexer 4207 after being refracted and reflected by the second displacement prism 4206, and is demultiplexed into a plurality of light beams with different wavelengths by the optical demultiplexer 4207.

Fig. 15 is a schematic diagram of a light emitting optical path in the optical module according to the embodiment of the present application. As shown in fig. 15, the laser chip 450, the first converging lens 460, the glass block 480, the collimating lens 470, the optical multiplexer 4205, the first shift prism 4204, the isolator 510, and the first optical fiber adapter 500 are sequentially arranged along the light emission direction, the laser beam generated by the laser chip 450 is converted into a parallel beam by the first converging lens 460, the parallel beam passes through the glass block 480 and enters the collimating lens 470, the collimated beam passes through the collimating lens 470 and enters the light inlet of the optical multiplexer 4205, the collimated beam is multiplexed into a composite beam by the optical multiplexer 4205, the composite beam enters the first shift prism 4204 through the light outlet of the optical multiplexer 4205, the composite beam passes through the isolator 510 after being refracted and reflected by the first shift prism 4204, and the composite beam passing through the isolator 510 is coupled to the first optical fiber adapter 500 through the second converging lens 520, so as to realize light emission.

In the embodiment of the present application, the light emitting module includes 4 laser chips 450, 4 first collecting lenses 460, 4 glass blocks 480 and 4 collimating lenses 470, each collimating lens 470 is fixed on each glass block 480, each glass block 480 corresponds to each first collecting lens 460, and each first collecting lens 460 corresponds to each laser chip 450. The right side surface of the optical multiplexer 4205 is provided with 4 light inlets, and 4 collimated light beams output by the 4 collimating lenses 470 are respectively incident into the 4 light inlets, so as to irradiate the 4 collimated light beams into the optical multiplexer 4205. The left side surface of the optical multiplexer 4205 is provided with 1 light outlet, 4 collimated light beams are reflected by the optical multiplexer 4205 and then combined into one composite light beam, and the composite light beam is emitted through the light outlet to enter the first shift prism 4204.

The surface of the circuit board 300 inserted into the first housing 410 is provided with a laser driver chip 310, and after the laser chip 450 is adhered to the substrate 4901, the laser driver chip 450 needs to be electrically connected to the laser driver chip 310 by a wire bonding (gold wire), so that the laser driver chip 310 drives the laser driver chip 450 to generate a laser beam. Specifically, the laser driver chip 310 is electrically connected to the circuit board 300 by a wire (gold thread), the circuit board 300 is electrically connected to the substrate 4901 by a wire (gold thread), and the substrate 4901 is electrically connected to the laser chip 450 by a wire (gold thread), so that the laser driver chip 310 is electrically connected to the laser chip 450 by the wire, the circuit board 30, the wire, the substrate 4901, and the wire.

After the laser driver chip 310 and the laser chip 450 are electrically connected by wire bonding, other devices of the optical module may be damaged by wire bonding due to the wire bonding. In the embodiment of the present application, in order to prevent the wire bonding damage on the circuit board 300 and the laser chip 450 and the substrate 4901, the protective cover 440 is disposed above the laser chip 450, the substrate 4901 and the circuit board 300, and the wire bonding is isolated from the external device through the protective cover 440, thereby preventing the wire bonding damage caused by the external device.

Fig. 16 is a schematic structural diagram of a protective cover 440 in an optical module according to an embodiment of the present application, and fig. 17 is another schematic angular structural diagram of the protective cover 440 in the optical module according to the embodiment of the present application. As shown in fig. 16 and 17, the protective cover 440 includes a top plate 4401, a first support plate 4402 and a second support plate 4403, the first support plate 4402 is connected to the rear side of the top plate 4401, and the second support plate 4403 is connected to the front side of the top plate 4401. Thus, the protection cover 440 is a U-shaped cover body composed of the top plate 4401, the first support plate 4402 and the second support plate 4403, so as to cover the laser chip 450, the substrate 4901 and the laser driver chip 310 under the U-shaped cover body.

In the embodiment of the present application, the length dimensions of the first support plate 4402 and the second support plate 4403 are smaller than the length dimension of the top plate 4401, that is, the first support plate 4402 and the second support plate 4403 are connected to the right portion of the top plate 4401, the bottom surfaces of the first support plate 4402 and the second support plate 4403 are both adhered to the surface of the circuit board 300, and the left side of the top plate 4401 is fixed to the glass block 480, so that the protection cover 440 is fixed above the circuit board 300 and the first housing 410.

In order to further support the top plate 4401, the protection cover 440 further includes a plurality of supporting pillars 4405, one end of each supporting pillar 4405 is connected to the inner side surface of the top plate 4401, the other end of each supporting pillar 4405 is attached to the surface of the circuit board 300, and the supporting pillars 4405 are disposed in the middle of the top plate 4401, so as to support the middle of the top plate 4401 and prevent the left end of the top plate 4401 from touching gold wires or other optical devices.

In the embodiment of the present application, the rear side of the top plate 4401 is provided with a notch 4404, the notch 4404 extends along the length direction (left-right direction) of the top plate 4401, and the dimension of the notch 4404 in the left-right direction is smaller than the dimension of the top plate 4401 in the left-right direction; the notch 4404 extends in the width direction (front-rear direction) of the top plate 4401, and the dimension of the notch 4404 in the front-rear direction is smaller than the dimension of the top plate 4401 in the front-rear direction. The notch 4404 faces the light receiving module and is used for avoiding the area of the light receiving chip of the light receiving module.

The left side of the first support plate 4402 is flush with the right side of the notch 4404, the right side of the second support plate 4403 is flush with the right side of the top plate 4401, and the left and right dimensions of the second support plate 4403 are the same as the left and right dimensions of the first support plate 4402.

The top plate 4401 is covered above the laser driver chip 310 on the laser driver chip 450, the first collecting lens 460, the substrate 4901 and the circuit board 300 by the first supporting plate 4402, the second supporting plate 4403 and the supporting column 4405, and is used for protecting gold wires from the laser driver chip 310 to the circuit board 300, gold wires from the circuit board 300 to the substrate 4901 and gold wires from the laser driver chip 450 to the substrate 4901, and simultaneously protecting fragile devices such as the laser driver chip 310, the laser driver chip 450 and the first collecting lens 460.

In the present embodiment, the top plate 4401 of the protective cover 440 may be a plastic plate or a metal plate, but generally needs to be prevented from contacting the circuits on the circuit board 300. The top plate 4401 is made of transparent plastic materials, and whether gold wires and easily-damaged devices below the protective cover 440 are damaged or not can be conveniently observed.

Fig. 18 is a partially exploded schematic view of a circuit board 300 and a light receiving module in an optical module according to an embodiment of the present disclosure. As shown in fig. 18, a plurality of light receiving chips 740 are disposed on the circuit board 300 along the light receiving direction, and the light receiving chips 740 are PDs (photo detectors), such as APDs (avalanche photo diodes) and PIN-PDs (photo diodes), for converting received signal light into photocurrent. Alternatively, a plurality of light receiving chips 740 in the light receiving module are respectively disposed on the circuit board 300.

Further, the optical receiving module further includes a transimpedance amplifier 750, the transimpedance amplifier 750 is mounted on the circuit board 300, and the plurality of optical receiving chips 740 are connected to the transimpedance amplifier 750, and are configured to receive a current signal generated by the optical receiving chip 740 and convert the received current signal into a voltage signal. Alternatively, the transimpedance amplifier 750 is wire bonded to the photoreceiving chip 740, such as by a semiconductor bond wire.

In the embodiment of the present application, 4 light receiving chips 740 are disposed on the circuit board 300, and the 4 light receiving chips 740 are connected to the transimpedance amplifier 750 by wire bonding. However, when the length of the wire bonding is longer, the inductance generated by the wire bonding is larger, the signal mismatching is also larger, and the signal output by the light receiving chip 740 is a small signal, which may cause the signal quality to be degraded. Therefore, the photoreceiving chip 740 and the transimpedance amplifier 750 are as close as possible, the length of the wire bonding is reduced, the signal transmission quality is ensured, and the transimpedance amplifier 750 is further arranged on one side of the photoreceiving chip 740, so that the transimpedance amplifier 750 is as close as possible to the photoreceiving chip 740. Optionally, the electrode of the light receiving chip 740 and the pin on the transimpedance amplifier 750 are on the same plane, so as to ensure that the wire bonding between the light receiving chip 740 and the transimpedance amplifier 750 is shortest.

The optical axis of the multi-channel signal light output from the optical demultiplexer 4207 of the light receiving module is parallel to the surface of the circuit board 300, and the photosensitive surfaces of the plurality of light receiving chips 740 are also parallel to the surface of the circuit board 300, but the optical axis of the multi-channel signal light output from the optical demultiplexer 4207 is higher than the photosensitive surfaces of the light receiving chips 740, so in order to ensure that the light receiving chips 740 normally receive the signal light, the light receiving module further includes a reflection prism 720, the reflection prism 720 is disposed above the light receiving chips 740 to cover the 4 light receiving chips 740, the direction of the optical axis of the received light beam is changed by the reflection surface of the reflection prism 720, the optical axis of the received light beam is changed from being parallel to the surface of the circuit board 300 to being perpendicular to the surface of the circuit board 300, and the received light beam is made to be perpendicular to the photosensitive surfaces of the corresponding light receiving chips 740.

In the embodiment of the present application, the reflection prism 720 is a prism including a reflection surface covering the light receiving chip 740 disposed on the circuit board 300, for changing the transmission direction of the reception light beam, i.e., reflecting the reception light beam toward the light receiving chip 740. Optionally, the reflecting surface of the reflecting prism 720 is a 40-45 ° reflecting surface; taking a 45 ° reflection prism as an example, the reflection prism 720 includes a 45 ° reflection surface, and the 45 ° reflection surface covers 4 light receiving chips 740 disposed on the circuit board 300.

In order to converge the 4 paths of received light beams onto the reflecting prism 720, the light receiving assembly further includes a lens array 710, the lens array 710 is disposed on one side of the light incident surface of the reflecting prism 720; optionally, one side of the lens array 710 is attached to the light incident surface of the reflection prism 720. The lens array 710 may include a plurality of converging lenses, each converging lens corresponds to each light outlet of the optical demultiplexer 4207, and is configured to converge each received light beam outputted from the light outlet of the optical demultiplexer 4207 into the reflecting prism 720, so that the received light beam parallel to the surface of the circuit board 300 through the reflecting prism 720 is converted into a received light beam perpendicular to the surface of the circuit board 300.

Further, to facilitate the assembly and optical path coupling of the lens array 710, the lens array 710 is a strip-shaped integral structure, a plurality of protrusions are disposed on one side of the lens array 710 close to the reflection prism 720, each protrusion corresponds to each light outlet of the optical demultiplexer 4207, and functions as a converging lens, and is used for correspondingly converging each path of received light beam output from the light outlet of the optical demultiplexer 4207 into the reflection prism 720, and a received light beam parallel to the surface of the circuit board 300 through the reflection prism 720 is converted into a received light beam perpendicular to the surface of the circuit board 300. By using the lens array 710 with an integrated structure, the received light beams output from the output ports of the optical demultiplexer 4207 can be integrally adjusted during optical path coupling, which has high optical path coupling efficiency and high assembly efficiency compared to the lens array 720 including a single converging lens.

In the embodiment of the present application, in order to fix the lens array 710 and the reflection prism 720 and adjust the coupling optical path between the lens array 710 and the reflection prism 720, the light receiving assembly further includes a fourth housing 700, the fourth housing 700 is a housing with an open bottom, the fourth housing 700 covers the light receiving chip 740 and the transimpedance amplifier 750 of the circuit board 300, and the lens array 710 and the reflection prism 720 are fixed on the inner wall of the fourth housing 700, for example, the top surfaces of the lens array 710 and the reflection prism 720 are adhered to the top surface inside the fourth housing 700. The received light beam output from the output port of the optical demultiplexer 4207 is transmitted to the lens array 710 and the reflection prism 720 through one end of the fourth housing 700.

The lens array 710 and the reflection prism 720 may be adjusted in height according to the distance from the fourth housing 700 to the surface of the circuit board 300, so that the multiple signal beams output by the optical demultiplexer 4207 can be accurately incident into the lens array 710 and the reflection prism 720. In addition, when the receiving light path coupling is needed, the transparent mirror array 710 and the reflecting prism 720 are fixedly assembled on the fourth shell 700, and then the lens array 710 and the reflecting prism 720 are moved by clamping the fourth shell 700, so that the lens array 710 and the reflecting prism 720 are clamped to move conveniently, and the light path coupling efficiency is further improved; meanwhile, since the lens array 710 and the reflection prism 720 are usually made of silicon, if the lens array 710 and the reflection prism 720 are directly clamped, the lens array 710 and the reflection prism 720 are easily scratched, and therefore, damage such as scratching and pinching caused by clamping the lens array 710 and the reflection prism 720 can be avoided through the fourth housing 700. The lens array 710 and the reflection prism 720 are fixed by the fourth housing 700, which facilitates the process of coupling and mounting the lens array 710 and the reflection prism 720.

In order to adjust the distance between the top surface of the fourth housing 700 and the surface of the circuit board 300, the circuit board 300 is provided with a first adjusting plate 760 and a second adjusting plate 770, the first adjusting plate 760 and the second adjusting plate 770 are respectively located at two sides of the light receiving chip 740, the first adjusting plate 760 is in contact with the bottom surface of the left side of the fourth housing 700, and the second adjusting plate 770 is in contact with the bottom surface of the right side of the fourth housing, so that the fourth housing 700 is supported and fixed by the first adjusting plate 760 and the second adjusting plate 770, and the distance between the top surface of the fourth housing 700 and the circuit board 300 is increased. Optionally, the first adjusting plate 760 and the second adjusting plate 770 are disposed at two sides of the light receiving chip 740 along the length direction of the circuit board 300, so that when the positions of the lens array 710 and the reflection prism 720 in the light path of the received light beam are adjusted by coupling, the fourth housing 700 moves on the first adjusting plate 760 and the second adjusting plate 770, and the fourth housing 700 can be effectively prevented from touching the light receiving chip 740 and other devices, so as to damage the light receiving chip 740 and other devices. The first adjusting plate 760 and the second adjusting plate 770 facilitate ensuring flatness of installation of the fourth housing 700, thereby improving accuracy and flatness of mounting positions of the mounting lens array 710 and the reflection prism 720, reducing errors of a received light path, and increasing stability of the light path.

In the embodiment of the present application, the optical demultiplexer 4207 is fixed to the second cavity 4202 of the second housing 420, and after the light receiving chip 740 is attached to the surface of the circuit board 300, the distance from the top surface of the fourth housing 700 to the surface of the circuit board 300 is adjusted by the first adjusting plate 760 and the second adjusting plate 770, so that the distance from the lens array 710 to the surface of the circuit board 300 is adjusted, so that the multiplexed signal beams output from the optical demultiplexer 4207 are transmitted to the lens array 710, the multiplexed signal beams are coupled to the reflecting prism 720 via the lens array 710, the signal beams parallel to the surface of the circuit board 300 are converted into signal beams perpendicular to the surface of the circuit board 300 by the reflecting prism 720, and the multiplexed signal beams are reflected to the corresponding light receiving chips 740, respectively.

The signal light beam reflected by the reflecting prism 720 is divergent light, and in order to transmit the reflected signal light beam to the light receiving chip 740, a plurality of third converging lenses 730 are arranged between the reflecting prism 720 and the light receiving chip 740, and each third converging lens 730 is located above each light receiving chip 740, so that the signal light beam reflected by the reflecting prism 720 and perpendicular to the surface of the circuit board 300 is coupled to the light receiving chip 740 through the third converging lenses 730, and the reflected light beam can be accurately emitted into the light receiving chip 740, thereby improving the receiving efficiency of the light receiving chip 740. In a high-speed optical module, a photosensitive surface of a light receiving chip is smaller than that of a light receiving chip used in a conventional low-speed optical module, and statistics show that the photosensitive surface of the high-speed light receiving chip is smaller than that of the low-speed light receiving chip by nearly one fourth, so that the third collecting lens 730 is arranged to ensure the receiving efficiency of the light receiving chip 740, and simultaneously, the distance between the light receiving chip 740 and the reflecting prism 720 can be shortened, the space between the light receiving chip 740 and the reflecting prism 720 can be reduced, and the occupied volume of a light receiving component in the optical module can be saved.

In this embodiment of the application, the light receiving chip 740 is a single light receiving chip, and the mounting tolerance of the single light receiving chip is increased relative to the integrated light receiving chip array, so that the coupling difficulty from the reflecting prism 720 to the light receiving chip 740 is large, and therefore, the light path coupling from the reflecting prism 720 to the light receiving chip 740 is facilitated by making the third converging lens 730 an independent single converging lens; meanwhile, the coupling tolerance is increased, so that the difficulty of the assembling process of the light receiving component is reduced conveniently.

Further, to facilitate the mounting of the third condensing lens 730, a pad 780 is provided on the circuit board 300. Fig. 19 is a partially enlarged view of a light receiving module in the optical module according to the embodiment of the present application. As shown in fig. 19, a spacer 780 is disposed at one side of the light receiving chip 740, one end of the third condensing lens 730 is disposed on the spacer 780, and the other end is located above the light receiving chip 740, and the signal light whose transmission direction is changed by the reflection prism 720 is condensed and transmitted to the photosensitive surface of the light receiving chip 740 through the third condensing lens 730. The third converging lens 730 is fixedly installed by the cushion block 780 arranged on the circuit board 300, the height of the cushion block 780 can be adjusted according to the installation height requirement of the third converging lens 730, and then the third converging lenses 730 are conveniently installed at accurate positions, so that the light receiving efficiency of the light receiving chip 740 is ensured.

Fig. 20 is a schematic diagram of a light receiving circuit in an optical module according to an embodiment of the present disclosure, and fig. 21 is a side view of the light receiving circuit in the optical module according to the embodiment of the present disclosure. As shown in fig. 20 and 21, the second fiber adapter 600, the second shift prism 4206, the optical demultiplexer 4207, the lens array 710, the reflecting prism 720, the third condensing lens 730, and the light receiving chip 740 are sequentially arranged along the light receiving direction, the signal beam transmitted by the second fiber adapter 600 is transmitted to the second shift prism 4206, after being refracted and reflected by the second shift prism 4206, one signal beam is incident into the optical demultiplexer 4207, the one signal beam is demultiplexed into multiple signal beams by the optical demultiplexer 4207, the multiple signal beams are coupled to the reflection prism 720 via the lens array 710, the plurality of signal beams parallel to the surface of the circuit board 300 are converted into a plurality of signal beams perpendicular to the surface of the circuit board 300 by the reflection prism 720, and the reflected signal beams are converged and coupled to the corresponding light receiving chips 740 by the third converging lens 730, so that the reception and the photoelectric conversion of the signal light are realized.

In the embodiment of the present application, since the received signal beam converts the parallel beam into the perpendicular beam via the reflection prism 720, the height of the light receiving chip 740 from the surface of the circuit board 300 is lower than the height of the optical demultiplexer 4207 from the surface of the circuit board 300. The present application increases the fixed height of the optical demultiplexer 4207 on the second housing 420 by recessing the second housing 4202 on the second housing 420 in the first housing 4201.

Fig. 22 is a schematic structural diagram of the first housing 410 in the optical module provided in the embodiment of the present application, and fig. 23 is an assembly schematic diagram of the first housing 410 and the circuit board 300 in the optical module provided in the embodiment of the present application. As shown in fig. 11 and 23, the first housing 410 is a housing with left, right and upper openings, and the housing is composed of a first bottom plate 4110, a first side plate 4120 and a second side plate 4130, a third bottom plate 4140 is disposed at the right opening of the first bottom plate 4110, and the third bottom plate 4140 is recessed in the first bottom plate 4110, so that a step surface exists between the third bottom plate 4140 and the first bottom plate 4110.

The left side surface of the circuit board 300 inserted into the first housing 410 abuts against the left side surface of the third base plate 4140, thereby positioning the circuit board 300. That is, after the circuit board 300 is inserted into the first housing 410, the circuit board 300 moves along the surface of the first base plate 4110 of the first housing 410 from right to left in a rubbing manner until the side surface of the circuit board 300 corresponding to the light emitting portion abuts against the side surface of the third base plate 4140, and then the lower surface of the circuit board 300 and the third base plate 4140 are bonded together by using glue, so that the circuit board 300 and the first housing 410 are fixed.

When the first housing 410 and the second housing 420 are fixedly connected, the third side plate 4220 of the second housing 420 corresponds to the left opening of the first housing 410, and the third side plate 4220 and the left side surfaces of the first side plate 4120 and the second side plate 4130 of the first housing 410 can be adhered together by glue, so that the left opening of the first housing 410 is blocked by the third side plate 4220, thereby fixing the first housing 410 and the second housing 420.

The circuit board 300 is provided with electronic devices such as a capacitor, a resistor, a triode, a MOS transistor, a clock data recovery CDR, a power management chip, and a data processing chip DSP, in order to ensure that the circuit board 300 has a sufficient space to accommodate the electronic devices, the circuit board 300 is provided with a protrusion 320, the protrusion 320 extends along the left-right direction of the circuit board 300, that is, the left side of the protrusion 320 is close to the left opening of the first housing 410, and the right side is connected with the circuit board 300 as a whole. The dimension of the bump 320 in the front-rear direction is smaller than the dimension of the circuit board 300 in the front-rear direction, so that a gap is left between the right side surface of the bump 320 and the right side surface of the circuit board 300, the gap corresponding to the light emitting module, and is used for avoiding the semiconductor cooler 490, the substrate 4901, the laser chip 450, the first condensing lens 460, the glass block 480, the collimating lens 470, the optical multiplexer 4205, and the first shift prism 4204 of the light emitting module.

In the embodiment of the present application, the bump 320 is located below the second shift prism 4206 and the optical demultiplexer 4207 of the light receiving assembly, that is, after the second housing 420 is mounted on the first housing 410, a gap exists between the bottom surfaces of the second shift prism 4206 and the optical demultiplexer 4207 in the second housing 420 and the first base plate 4110 of the first housing 410, and the bump 320 of the circuit board 300 is embedded in the gap to increase the area on the circuit board 300 where the electronic devices are disposed.

Fig. 24 is a schematic view illustrating another angle assembly of the first housing 410 and the circuit board 300 in the optical module according to the embodiment of the present application. As shown in fig. 24, since the electronic device 330 is disposed on the protrusion 320 of the circuit board 300, in order to avoid the electronic device 330 on the protrusion 320, the first bottom plate 4110 of the first housing 410 is provided with an avoiding hole 4150, the avoiding hole 4150 corresponds to the electronic device 330 on the protrusion 320, so that a partial area on the protrusion 320 can be exposed, the electronic device 330 is conveniently disposed on the surface of the exposed protrusion 320, thereby sufficiently utilizing a narrow space of the optical module, and ensuring the connection strength between the circuit board 300 and the first housing 410 and the layout rationality of the electronic device on the circuit board 300.

The laser chip 450, the first condenser lens 460, the substrate 4901, the semiconductor cooler 490, the glass block 480, and the collimating lens 470 of the optical transmission module are fixed to the first base plate 4110 of the first housing 410, the first displacement prism 4204, the optical multiplexer 4205, and the second displacement prism 4206, the optical demultiplexer 4207 of the optical transmission module are fixed to the second base plate 4210 of the second housing 420, one side of the circuit board 300 is fixed inside the first housing 410, and the third condenser lens 730, the optical receiving chip 740, the transimpedance amplifier 750, and the fourth housing mounted with the lens array 710 and the reflecting prism 720 are fixed to the circuit board 300, and then the first housing 410 and the second housing 420 are bonded together, the third housing 430 is then fixed to the first housing 410, thereby assembling the optical sub-assembly 400 and electrically connecting the optical sub-assembly 400 to the circuit board 300.

Fig. 25 is an assembly cross-sectional view of the first housing 410 and the third housing 430 in the optical module provided in the embodiment of the present application. As shown in fig. 22 and 25, the first bottom plate 4110 is provided with a support 4160, and the left side surface of the support 4160 is in contact with the right side surface of the first side plate 4120, and the right side surface is flush with the left side surface of the third bottom plate 4140. The supporting platform 4160 is used to place the semiconductor cooler 490 and the glass block 480, i.e. the bottom surface of the semiconductor cooler 490 and the glass block 480 is adhered to the supporting platform 4160. In addition, the rear side of the support stage 4160 abuts against the front side of the bumps 320 of the circuit board 300 to position the bumps 320.

The third housing 430 is a housing formed by assembling a top plate facing the upper housing 201 and two opposite side plates connected to the first side plate 4120 and the second side plate 4130 of the first housing 410, respectively. Specifically, a support table 4160 of the first base plate 4110 is provided with a first boss 4170, a front side surface of the first boss 4170 abuts against an inner wall of a side plate of the third housing 430, and a contact portion is fixed by laser welding; the second side plate 4130 of the first housing 410 is provided with a second boss 4180, the second boss 4180 is opposite to the first boss 4170, the rear side surface of the second boss 4180 abuts against the inner wall of the other side plate of the third housing 430, and the contact part is fixed by laser welding, so that the first housing 410 and the third housing 430 are fixedly connected.

In the optical module provided by the embodiment of the application, a containing cavity is formed by assembling a first shell, a second shell and a third shell, a light emitting component and a light receiving component are arranged in the containing cavity, a plurality of laser chips, a plurality of first converging lenses and a plurality of collimating lenses of the light emitting component are fixed in the cavity of the first shell, an optical multiplexer and a first displacement prism of the light emitting component are fixed in the cavity of the second shell, when the second shell is covered above the first shell, the plurality of laser chips, the plurality of first converging lenses, the plurality of collimating lenses, the optical multiplexer, the first displacement prism and a first optical fiber adapter are positioned in the same light emitting direction, and multiple paths of emitted light beams are emitted through one optical fiber; the second displacement prism of light receiving component, optical demultiplexer is fixed in the cavity of second casing, the lens array of light receiving component, reflection prism is fixed in the cavity of fourth casing, a plurality of light receiving chip of light receiving component, the transimpedance amplifier is fixed in on inserting the circuit board surface of first casing, the top of first casing is located to second casing cover, light receiving chip is located to fourth casing cover, during the transimpedance amplifier top, the second fiber adapter, the second displacement prism, optical demultiplexer, the lens array, reflection prism, a plurality of light receiving chip, the transimpedance amplifier is located same light receiving side upwards, it receives through an optical fiber to have realized multichannel received light beam. The application belongs to optical device structural design and equipment field of optical communication device, like 100G product, 400G FR4 etc. fix light emission subassembly and light receiving assembly respectively in first casing, second casing, fourth casing, improved the integrated level of optical transceiver subassembly, be favorable to the miniaturized development of optical module.

Fig. 26 is a schematic structural diagram illustrating a local light receiving module of an optical module according to an embodiment of the present application being mounted on a circuit board. As shown in fig. 26, the fourth housing 700 is housed on the circuit board 300; the lens array 710 and the reflection prism 720 are disposed inside the fourth casing 700, one end of the fourth casing 700 is connected to the first adjusting plate 760, and the other end is connected to the second adjusting plate 770, so that the reflection prism 720 is covered on the light receiving chip 740 by the fourth casing 700.

Fig. 27 is a first structural schematic diagram of a fourth housing in an optical module provided in the embodiment of the present application, fig. 28 is a second structural schematic diagram of the fourth housing in the optical module provided in the embodiment of the present application, and fig. 29 is an exploded view of the fourth housing, a lens array, and a reflection prism in the optical module provided in the embodiment of the present application. As shown in fig. 27 to 29, the fourth housing 700 provided in the embodiment of the present application includes a fourth bottom plate 701, and a fifth side plate 702 and a sixth side plate 703 disposed at two sides, where the fourth bottom plate 701 is used to fixedly mount the lens array 710 and the reflection prism 720, and the fifth side plate 702 and the sixth side plate 703 are used to support the fourth bottom plate 701 so that the fourth bottom plate 701 floats over the light receiving chip 740; meanwhile, the fifth side plate 702 and the sixth side plate 703 are also used for limiting the lens array 710 and the reflection prism 720; this facilitates simplifying the process of coupling the lens array 710 and the reflection prism 720. Generally, the distance between the fifth and

sixth side plates

702 and 703 is greater than the length of the lens array 710 and the reflection prism 720, which facilitates the installation of the lens array 710 and the reflection prism 720. Optionally, the lens array 710 and the reflective prisms 720 end against the fifth side plate 702 or the sixth side plate 703.

In order to facilitate the installation of the lens array 710 and the reflection prism 720, a first slot 704 is disposed on the fifth side plate 702, a second slot 705 is disposed on the sixth side plate 703, the first slot 704 and the second slot 705 are symmetrically disposed on the fourth housing 700, and the lens array 710 and the reflection prism 720 enter and exit the fourth housing 700 through the first slot 704 and the second slot 705. Further, the depths of the first and

second slots

704 and 705 are smaller than the heights of the fifth and

sixth side plates

702 and 703, so that when the lens array 710 and the reflection prism 720 are assembled to the fourth housing 700, the ends of the lens array 710 and the reflection prism 720 abut against the fifth or

sixth side plate

702 or 703 at the bottom of the first or

second slot

704 or 705.

In order to achieve the precise installation of the lens array 710 and the reflection prism 720 on the fourth housing 700, positioning pillars are disposed on the fourth base plate 701, and the positioning pillars can be used for positioning the lens array 710 or the reflection prism 720, i.e. the positioning pillars are close to the lens array 710 or the reflection prism 720. Taking the positioning post to position the reflection prism 720 as an example, the positioning post 706 is disposed on one side of the reflection prism 720, and the cylindrical surface of the reflection prism 720 connected to the reflection surface is adhered to the positioning post 706. In this way, when the reflection prism 720 is mounted on the fourth casing 700, the reflection prism 720 is positioned by the fifth side plate 702 or the sixth side plate 703 in the width direction of the fourth casing 700, and the reflection prism 720 is positioned by the positioning posts 706 in the length direction of the fourth casing 700, so as to achieve the precise mounting of the reflection prism 720 on the fourth casing 700. The lens array 710 is mounted on one side of the reflecting prism 720, so that the lens array 710 can be accurately mounted on the fourth casing 700, and the lens array 710 can be accurately and smoothly mounted on the reflecting prism 720.

When the joints between the fifth side plate 702 and the fourth bottom plate 701 and the sixth side plate 703 are formed into arcs due to poor right-angle processing, the installation of the lens array 710 and the reflection prism 720 may be interfered, and in order to prevent the joints between the fifth side plate 702 and the fourth bottom plate 701 and the joints between the sixth side plate 703 and the fourth bottom plate 701 from being formed into arcs due to poor right-angle processing, the joints between the fifth side plate 702 and the fourth bottom plate 701 and the joints between the sixth side plate 703 and the fourth bottom plate 701 may be provided with sinking grooves. For example, the sinking groove 707 is disposed at the joint of the fifth side plate 702 and the fourth bottom plate 701, and the sinking groove 707 can effectively prevent the joint of the fifth side plate 702 and the fourth bottom plate 701 from generating an arc to interfere with the installation of the lens array 710 and the reflection prism 720, thereby increasing the stability of the receiving optical path. When one end of the lens array 710 and the reflecting prism 720 abuts against the fifth side plate 702, the sinking groove 707 may be provided only at the joint of the fifth side plate 702 and the fourth bottom plate 701, and of course, the sinking groove may be provided at the joint of the fifth side plate 702 and the sixth side plate 703 and the fourth bottom plate 701, and one end of the lens array 710 and the reflecting prism 720 may abut against the fifth side plate 702 or the sixth side plate 703 according to specific use requirements.

In order to facilitate the installation of the fourth housing 700, an identification circular hole 708 is disposed on the fourth bottom plate 701, and the identification circular hole 708 penetrates through the fourth bottom plate 701. When the fourth housing 700 is fixed to the circuit board 300 by coupling, the positioning of the fourth housing 700 is recognized through the recognition hole 708.

The fourth housing 700 may be made of a metal material, which can reduce the influence of the emitted signal light on the light reception and shield the electromagnetic interference of the electrical devices in the light reception assembly when the lens array 710 and the reflection prism 720 are mounted in a coupling manner. Optionally, the fourth casing 700 is made of kovar alloy, and the expansion coefficient of the fourth casing 700 is close to the expansion coefficients of the lens array 710 and the reflection prism 720, so as to ensure the stability of the optical path during the high and low temperature deformation of the fourth casing 700.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

the light receiving module includes:

2. The optical module according to claim 1, wherein the fourth housing includes a fourth bottom plate, and fifth and sixth side plates provided on both sides of the fourth bottom plate;

the fifth side plate and the sixth side plate support the fourth bottom plate so that the fourth bottom plate covers the light receiving chip, and the reflection prism is arranged on the fourth bottom plate in a connected manner.

3. The optical module of claim 2, further comprising a first regulation board and a second regulation board, the first regulation board and the second regulation board being disposed on the circuit board with the first regulation board on one side of the light receiving chip and the second regulation board on the other side of the light receiving chip;

the first adjusting plate is connected with one end of the fifth side plate and one end of the sixth side plate in a supporting mode, and the second adjusting plate is connected with the other end of the fifth side plate and the other end of the sixth side plate in a supporting mode.

4. The optical module according to claim 2, wherein a first slot is disposed on the fifth side plate, and one end of the reflecting prism is in abutting connection with a bottom of the first slot on the fifth side plate;

and/or a second slot is formed in the sixth side plate, and the other end of the reflecting prism is connected with the bottom of the second slot in a butting mode on the sixth side plate.

5. The optical module as claimed in claim 2, wherein a positioning post is disposed on the fourth base plate, and a side surface of the positioning post is connected to a cylindrical surface of the reflection prism, which is close to the reflection surface.

6. The optical module according to claim 2, wherein a sunken groove is formed in the fourth bottom plate, the sunken groove is formed at a connection position of the fifth side plate and the fourth bottom plate, and one end of the reflection prism spans the sunken groove.

7. The optical module according to claim 2, wherein an identification circular hole is provided on the fourth base plate, and the identification circular hole penetrates through the fourth base plate.

8. The light module of claim 1, wherein the light receiving assembly further comprises a lens array disposed on the reflective prism away from the cylindrical surface of the reflective surface; and the side surface of the lens array close to the cylindrical surface is provided with a bulge.

9. The light module of claim 1, wherein the light receiving assembly further comprises a third converging lens and a spacer;

the cushion block is arranged on the circuit board, one end of the third converging lens is connected and arranged on the cushion block, and the convex end of the third converging lens is arranged above the light receiving chip in a suspension mode.

10. The light module of claim 1, further comprising a first housing, a second housing, a third housing, and a light emitting assembly;

the second shell and the third shell are arranged on the first shell in a side-by-side covering mode to form an accommodating cavity, and the light emitting assembly and the light receiving assembly are arranged in the accommodating cavity;

one side of the first shell is provided with an opening, the circuit board is inserted into the first shell through the opening, and the light emitting assembly is electrically connected with the circuit board inserted into the first shell through a routing.