CN115016073B

CN115016073B - Optical module

Info

Publication number: CN115016073B
Application number: CN202110239420.5A
Authority: CN
Inventors: 李丹; 谢一帆; 付孟博; 傅钦豪
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-03-04
Filing date: 2021-03-04
Publication date: 2023-09-12
Anticipated expiration: 2041-03-04
Also published as: CN115016073A

Abstract

The application provides an optical module, comprising: the lower shell is combined with the upper shell to form a wrapping cavity; the wrapping cavity comprises a base; the circuit board is arranged on the surface of the base in a partial area, and the partial area is arranged outside the base; the light emitting assembly is arranged on the surface of the base; the light receiving component is arranged on the surface of the circuit board; the first cover plate is covered on the base; an optical multiplexer disposed on an inner wall of the first cover plate, capable of combining light from the light emitting assembly; the optical demultiplexer is arranged on the inner wall of the first cover plate and can split light and emit the split light to the light receiving assembly; a first optical fiber adapter disposed on the first cover plate and capable of transmitting light from the optical multiplexer; and the second optical fiber adapter is arranged on the first cover plate and can transmit light to the optical demultiplexer. According to the application, the first cover plate and the base can be respectively subjected to modularized design, so that the operation space for realizing assembly on the first cover plate or the base is enlarged, and the first cover plate and the base are conveniently covered.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

Disclosure of Invention

The embodiment of the application provides an optical module, which realizes optical device packaging and optical path.

The application provides an optical module, comprising: an upper housing; the lower shell is combined with the upper shell to form a wrapping cavity; the wrapping cavity comprises a base; the circuit board is arranged on the surface of the base in a partial area, and the partial area is arranged outside the base; the light emitting assembly is arranged on the surface of the base; the light receiving component is arranged on the surface of the circuit board; the first cover plate is covered on the base; the light multiplexing component is arranged on the inner wall of the first cover plate and can combine light beams from the light emitting component; the optical demultiplexing component is arranged on the inner wall of the first cover plate and can split light and emit the split light to the optical receiving component; a first fiber optic adapter disposed on the first cover plate capable of transmitting light from the optical multiplexing assembly; and the second optical fiber adapter is arranged on the first cover plate and can transmit light to the optical demultiplexing component.

In the optical module provided by the embodiment of the application, in the optical path between the light emitting component and the light multiplexing component, the light emitting component is arranged on the base, the light multiplexing component is arranged on the inner wall of the first cover plate, and the first cover plate covers the base to form a structure for packaging the light multiplexing component, so that the first cover plate and the base can be respectively subjected to modularized design, the operation space for realizing assembly on the first cover plate or the base is enlarged, and the cover between the first cover plate and the base is convenient; in the same way, in the light path between the light receiving component and the light demultiplexing component, the light receiving component is arranged on the circuit board, the light demultiplexing component is arranged on the inner wall of the first cover plate and is covered on the base through the first cover plate, a structure for packaging the light demultiplexing component is formed, the first cover plate can be subjected to modularized design, the operation space for realizing assembly on the first cover plate is increased, the circuit board is arranged on the surface of the base, and the light path connection with the light receiving component can be established by the covering of the first cover plate and the base.

The optical module provided by the embodiment of the application provides a design scheme different from the prior art in the aspects of realizing optical device packaging and optical path, and belongs to different technical schemes/means for realizing the same purpose.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;

fig. 2 is a schematic diagram of an optical network unit structure;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is an assembly schematic diagram of an optical transceiver sub-module and a circuit board in an optical module according to an embodiment of the present application;

fig. 6 is a partially exploded schematic diagram of an optical transceiver sub-module and a circuit board in an optical module according to an embodiment of the present application;

fig. 7 is a schematic view of another angle partial exploded view of an optical transceiver sub-module and a circuit board in an optical module according to an embodiment of the present application;

fig. 8 is a schematic diagram of a portion of an optical transceiver sub-module in an optical module according to an embodiment of the present application;

Fig. 9 is a schematic structural diagram of a first cover plate in an optical module according to an embodiment of the present application;

fig. 10 is a schematic view of another angle structure of a first cover plate in an optical module according to an embodiment of the application;

FIG. 11 is a schematic sectional view illustrating an assembly of a first optical fiber adapter and a first cover plate in an optical module according to an embodiment of the present application;

FIG. 12 is a schematic cross-sectional view illustrating an assembly of a second fiber optic adapter and a first cover plate in an optical module according to an embodiment of the present application;

fig. 13 is a partially exploded view of a chassis and a circuit board in an optical module according to an embodiment of the present application;

fig. 14 is a schematic view illustrating distribution of optical devices in a chassis of an optical module according to an embodiment of the present application;

fig. 15 is a schematic diagram of an emission optical path in an optical module according to an embodiment of the present application;

fig. 16 is a schematic structural diagram of a protective cover in an optical module according to an embodiment of the present application;

fig. 17 is a schematic diagram of another angle structure of a protective cover in an optical module according to an embodiment of the present application;

fig. 18 is a partially exploded schematic view of a circuit board and a light receiving device in an optical module according to an embodiment of the present application;

fig. 19 is a schematic diagram of a receiving optical path in an optical module according to an embodiment of the present application;

FIG. 20 is another schematic view of a receiving optical path in an optical module according to an embodiment of the present application;

fig. 21 is a schematic structural diagram of a base in an optical module according to an embodiment of the present application;

fig. 22 is an exploded view of an assembly of a base and a circuit board in an optical module according to an embodiment of the present application;

fig. 23 is a schematic view illustrating another angle assembly of a base and a circuit board in an optical module according to an embodiment of the present application;

fig. 24 is an assembled cross-sectional view of a base and a second cover in an optical module according to an embodiment of the application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

One of the key links of optical fiber communication is the mutual conversion of optical signals and electric signals. The optical fiber communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.

The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

The optical port of the optical module 200 is externally connected to the optical fiber 101, and bidirectional optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected into the optical network terminal 100, and bidirectional electrical signal connection is established with the optical network terminal 100; the method comprises the steps that the mutual conversion of optical signals and electric signals is realized in an optical module, so that information connection is established between an optical fiber and an optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing the optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104 which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100, specifically, the optical network terminal transmits signals from the optical module to the network cable, and transmits signals from the network cable to the optical module, and the optical network terminal is used as an upper computer of the optical module to monitor the operation of the optical module.

So far, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, which provides data signals for the optical module and receives data signals from the optical module, and the common optical module upper computer also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and is used for accessing an optical module electrical port such as a golden finger; the cage 106 is provided with a radiator 107, and the radiator 107 has a convex portion such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the light module is inserted into the cage, the light module is fixed by the cage, and the heat generated by the light module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application, and fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present application. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, an optical transceiver sub-module 400, a first fiber optic adapter 500 and a second fiber optic adapter 600.

The upper case 201 is covered on the lower case 202 to form a packing cavity having two openings; the outer contour of the wrapping cavity is generally square, and specifically, the lower shell comprises a main board and two side boards which are positioned on two sides of the main board and are perpendicular to the main board; the upper shell comprises a second cover plate which is covered on two side plates of the upper shell to form a wrapping cavity; the upper shell can further comprise two side walls which are positioned on two sides of the second cover plate and perpendicular to the second cover plate, and the two side walls are combined with the two side plates to realize that the upper shell is covered on the lower shell.

The two openings can be two ends openings (204, 205) in the same direction or two openings in different directions; one opening is an electric port 204, and a golden finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect with the optical transceiver sub-module 400 inside the optical module; the optoelectronic devices such as the circuit board 300, the optical transceiver sub-module 400, etc. are located in the encapsulation cavity.

The upper shell and the lower shell are combined to be assembled, so that devices such as the circuit board 300, the optical transceiver sub-module 400 and the like can be conveniently installed in the shells, and the upper shell and the lower shell form an encapsulation protection shell of the outermost layer of the optical module; the upper shell and the lower shell are generally made of metal materials, so that electromagnetic shielding and heat dissipation are facilitated; the housing of the optical module is not generally made into an integral part, so that the positioning part, the heat dissipation part and the electromagnetic shielding part cannot be installed when devices such as a circuit board are assembled, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the lower housing 202, and is used for realizing or releasing the fixed connection between the optical module and the host computer.

The unlocking part 203 is provided with a clamping part matched with the upper computer cage; pulling the end of the unlocking member can relatively move the unlocking member on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; the unlocking part is pulled, and the clamping part of the unlocking part moves along with the unlocking part, so that the connection relation between the clamping part and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be pulled out of the cage of the upper computer.

The circuit board 300 is provided with circuit wiring, electronic components (such as capacitor, resistor, triode, MOS tube) and chips (such as MCU, laser driving chip, limiting amplifying chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

The circuit board connects the electric devices in the optical module together according to the circuit design through the circuit wiring so as to realize the electric functions of power supply, electric signal transmission, grounding and the like.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driving chip and an MCU chip are integrated into one chip, or a laser driving chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is a circuit integration, but the functions of the circuits are not lost due to aggregation, only the circuit shows a change in morphology, and the chip still has the circuit morphology. Therefore, when the circuit board is provided with three independent chips of the MCU, the laser driving chip and the limiting amplifier chip, the scheme is equivalent to that of the circuit board 300 provided with a single chip with three functions.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear chips; when the optical transceiver is positioned on the circuit board, the hard circuit board can provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, specifically, a metal pin/golden finger is formed on the surface of one side tail end of the hard circuit board and is used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.

A flexible circuit board is also used in part of the optical modules and is used as a supplement of the hard circuit board; the flexible circuit board is generally used in cooperation with the hard circuit board, for example, the hard circuit board and the optical transceiver can be connected by using the flexible circuit board.

Fig. 5 is an assembly schematic diagram of an optical transceiver sub-module 400 and a circuit board 300 in an optical module according to an embodiment of the present application. As shown in fig. 5, the optical module provided in the embodiment of the application integrates the optical transmitting component and the optical receiving component into an optical transceiver sub-module 400, and the optical transceiver sub-module 400 is located at the edge of the circuit board 300. The optical transceiver sub-module 400 includes a base 410, a first cover 420 and a second cover 430; the first cover plate is covered on the base; the second cover plate is covered on the base and is positioned above or right above the light emitting component; the upper end of the base 410 is opened, the lower end of the first cover plate 420 is opened, the lower end of the second cover plate 430 is opened, the first cover plate 420 and the second cover plate 430 are covered above the base 410, so that a containing cavity is formed by the base 410, the first cover plate 420 and the second cover plate 430, and the light emitting component and the light receiving component are arranged in the containing cavity. And one side of the accommodating cavity is provided with an opening through which the circuit board 300 is inserted into the accommodating cavity to facilitate the electrical connection of the light emitting assembly, the light receiving assembly and the circuit board 300.

Fig. 5 specifies the left-right direction and the front-back direction of the light module, as indicated by the arrow in fig. 5. In the embodiment of the present application, a first optical fiber adapter 500 and a second optical fiber adapter 600 are disposed on a side of the optical transceiver sub-module 400 away from the circuit board 300, the first optical fiber adapter 500 and the second optical fiber adapter 600 are disposed side by side, that is, the first optical fiber adapter 500 and the second optical fiber adapter 600 are located at the same height, and are disposed side by side (in the front-rear direction shown in fig. 5) on an end surface of the optical transceiver sub-module 400 housing, and the first optical fiber adapter 500 and the second optical fiber adapter 600 are both inserted into the accommodating cavity. A first fiber optic adapter disposed on the first cover plate capable of transmitting light from the optical multiplexing assembly; and the second optical fiber adapter is arranged on the first cover plate and can transmit light to the optical demultiplexing component. The first optical fiber adapter 500 and the second optical fiber adapter 600 are respectively used for being connected with an optical fiber connector outside the optical module, the optical fiber connector outside the optical module is a standard component commonly used in industry, and the shape and the size of the external optical fiber connector limit the positions of the two optical fiber adapters inside the optical module, so that the first optical fiber adapter 500 and the second optical fiber adapter 600 are arranged at the same height in a product.

After the first optical fiber adapter 500 is inserted into the accommodating cavity, the first optical fiber adapter corresponds to the light emitting component in the accommodating cavity, and is used for transmitting the signal light generated by the light emitting component to an external optical fiber, so as to realize light emission. After the second optical fiber adapter 600 is inserted into the accommodating cavity, it corresponds to the light receiving component in the accommodating cavity, and is used for transmitting the signal light transmitted by the external optical fiber into the light receiving component, so as to implement light receiving.

In the embodiment of the present application, each optical device of the light emitting assembly needs to ensure high precision of the optical path, but the surface precision of the circuit board is not too high, if each optical device of the light emitting assembly is disposed on the circuit board 300, the optical path alignment precision between each optical device of the light emitting assembly may be low, and in order to avoid this situation, part of the optical devices of the light emitting assembly are supported by the metal plate and are disposed in a manner of being separated from the circuit board 300.

Fig. 6 is a partially exploded view of the optical transceiver sub-module 400 and the circuit board 300 in the optical module according to the embodiment of the application, and fig. 7 is a partially exploded view after the view angle of fig. 6 is flipped. As shown in fig. 6 and fig. 7, in the optical module provided by the embodiment of the application, the light emitting component includes a laser driving chip, a laser chip, a lens and other devices related to light emission, one end of the accommodating cavity is connected with the first optical fiber adapter 500, the laser driving chip drives the laser chip to work, the light beam generated by the laser chip is coupled to the first optical fiber adapter 500 via the lens and other devices, and the light beam is transmitted out through the first optical fiber adapter 500. The light receiving assembly comprises a lens, a light receiving chip, a transimpedance amplifier and other devices related to light receiving, one end of the accommodating cavity is connected with the second optical fiber adapter 600, the second optical fiber adapter 600 is used for receiving signal light from the outside of the light module, the received signal light is transmitted to the light receiving chip through the optical devices such as the lens and the like arranged in the accommodating cavity, and photoelectric conversion is realized by the light receiving chip.

In the embodiment of the application, in order to increase the transmission rate of the optical module, a transmission channel in the optical module is increased, that is, the optical module includes a plurality of laser chips (each of which emits light with one wavelength) and a plurality of light receiving chips (each of which receives light with one wavelength). Specifically, in the optical module provided by the embodiment of the application, a plurality of laser chips are disposed in the accommodating cavity to emit multiple beams, and the multiple beams are multiplexed into one beam and finally coupled to the first optical fiber adapter 500 in a converging manner, so as to realize that multiple beams are emitted through one optical fiber. A plurality of light receiving chips are disposed in the accommodating cavity, and one light beam transmitted by the second optical fiber adapter 600 is demultiplexed into multiple light beams, and the multiple light beams are respectively transmitted to the plurality of light receiving chips, so as to realize that one optical fiber receives multiple light.

The light emitting assembly includes a plurality of laser chips 450 and a plurality of second condensing lenses 470, and the plurality of laser chips 450 are used to emit light beams of multiple different wavelengths. In the embodiment of the present application, the light emitting assembly includes 4 laser chips 450, each laser chip 450 emits a path of light beam, and each second converging lens 470 is disposed in the outgoing light direction of each laser chip 450, for converting the light beam outgoing from the laser chip 450 into a collimated light beam.

The optical module provided by the application further comprises an optical multiplexing component 4205, which is arranged on the inner wall of the first cover plate, and is capable of combining optical beams from the optical emission component. The optical multiplexing component 4205 is disposed in the outgoing light direction of the second focusing lens 470, and is configured to multiplex multiple light beams with different wavelengths into one composite light beam. The optical module further includes a first displacement prism 4204, where the light outlet of the optical multiplexing module 4205 and the light inlet surface of the first optical fiber adapter 500 are not on the same straight line, and there is a distance between the light outlet surface and the light inlet surface in the front-rear direction, and the front-rear direction of the light beam output by the optical multiplexing module 4205 is adjusted by the first displacement prism 4204, so that the composite light beam output by the optical multiplexing module 4205 can be injected into the first optical fiber adapter 500. Specifically, the first displacement prism 4204 is disposed in the light emitting direction of the light multiplexing assembly 4205, and is configured to refract and reflect a path of the composite light beam emitted from the light multiplexing assembly 4205, and then couple the path of the composite light beam into the first optical fiber adapter 500, so as to emit light.

In the embodiment of the present application, the plurality of laser chips 450 and the plurality of second converging lenses 470 are all disposed in the cavity of the base 410, the light multiplexing component 4205 and the first displacement prism 4204 are all disposed in the cavity of the first cover 420, and when the first cover 420 is mounted in the light path emission direction and the base 410 is covered by the first cover 420, the laser chips 450, the second converging lenses 470, the light multiplexing component 4205, the first displacement prism 4204 and the first optical fiber adapter 500 are sequentially disposed in the light emission direction.

The light receiving assembly includes a plurality of light receiving chips, and the second optical fiber adapter 600 transmits the light beam transmitted by the optical fiber to the light receiving chips to realize photoelectric conversion. In the embodiment of the present application, since there are a plurality of light receiving chips, the optical module further includes an optical demultiplexing component 4207 disposed on the inner wall of the first cover plate, and is capable of splitting light and directing the split light to the light receiving component. The optical demultiplexing module 4207 is disposed between the second optical fiber adapter 600 and the optical receiving chip, and is configured to demultiplex one light beam into multiple light beams, and transmit the multiple light beams to the multiple optical receiving chips, respectively, so as to receive light.

In the embodiment of the present application, the receiving light path of the light receiving assembly is higher than the transmitting light path of the light transmitting assembly, and the light demultiplexing assembly 4207 corresponds to the receiving light path of the light receiving assembly, so that a height difference exists between the light inlet of the light demultiplexing assembly 4207 and the light outlet surface of the second optical fiber adapter 600 in the up-down direction, so as to transmit the light beam transmitted by the second optical fiber adapter 600 to the light demultiplexing assembly 4207, and the light module further includes a second displacement prism 4206, where the second displacement prism 4206 is configured to refract and reflect one light beam transmitted by the second optical fiber adapter 600 and transmit the light beam to the light demultiplexing assembly 4207.

In the embodiment of the application, the second displacement prism 4206 and the optical demultiplexing component 4207 are disposed in the cavity of the first cover 420, the optical receiving chip is disposed on the circuit board 300 inserted into the accommodating cavity, and when the first cover 420 and the second cover 430 are covered on the base 410, the second displacement prism 4206, the optical demultiplexing component 4207 and the optical receiving chip are sequentially disposed along the optical receiving direction.

Fig. 8 is an assembly schematic diagram of the base 410, the laser chip 450 and the circuit board 300 in the optical module according to the embodiment of the application. As shown in fig. 8, the base 410 includes a first bottom plate 4110, a first side plate 4120 and a second side plate 4130 respectively located at two sides of the first bottom plate, wherein a bottom surface of the first bottom plate 4110 is connected to the lower housing 202, a bottom surface of the first side plate 4120 is connected to the first bottom plate 4110, a bottom surface of the second side plate 4130 is connected to the first bottom plate 4110, and the first side plate 4120 is opposite to the second side plate 4130, so that the base 410 is a housing with left, right and upper openings formed by the first bottom plate 4110, the first side plate 4120 and the second side plate 4130, and the plurality of laser chips 450 and the plurality of second focusing lenses 470 are all carried by the first bottom plate 4110. The left side opening of the chassis 410 faces the first fiber optic adapter 500 and the second fiber optic adapter 600; the right side opening of the base 410 faces the circuit board 300, and the circuit board 300 is inserted into the inside of the base 410 through the right side opening; the upper opening of the base 410 faces the upper housing 201, and the first cover 420 and the second cover 430 are covered at the upper opening, so that the base 410, the first cover 420 and the second cover 430 form a containing cavity. The first side plate is provided with a first projection 4120A facing the second side plate, and the second side plate is provided with a second projection 4130A facing the first side plate. The first protrusion is located at an end of the first side plate, and the second protrusion is located at an end of the second side plate.

The first bottom plate comprises a first step surface and a second step surface higher than the first step surface; the circuit board is arranged on the first step surface 4160A and comprises a third notch 300A, and the second step surface is positioned in the third notch 300A; the light emitting component is arranged on the second step surface, is positioned in the third notch and is electrically connected with the circuit board area at the edge of the third notch, and comprises a semiconductor refrigerator and a laser chip; and a second condensing lens disposed on the second step surface, capable of condensing light from the laser chip. The second converging lenses and the laser chips are respectively arranged in an array.

The semiconductor refrigerator is electrically connected with the first edge of the third notch 300A, the laser chip is electrically connected with the second edge of the third notch, and the first edge and the second edge have different extending directions.

The second focusing lens 470 and the circuit board 300 are disposed on the first bottom plate 4110, the second focusing lens is disposed on one side close to the first side plate 4120, and a partial area of the circuit board is disposed on the other side close to the second side plate 4230; the extension length of the first side plate 4120 is shorter than the extension length of the second side plate 4130; the side of the second converging lens is not provided with the first side plate. The design is convenient for assembling the second converging lens, the semiconductor refrigerator, the laser chip and the like on the first bottom plate, and provides a larger operation space.

The side of the light multiplexing component is provided with a first side plate. After the first cover plate is installed with the base, the optical multiplexing component is arranged on one side close to the first side plate, and the optical demultiplexing component is arranged on the other side close to the second side plate.

Fig. 9 is a schematic diagram illustrating a partial assembly of the base 410 and the laser chip 450 in the optical module according to an embodiment of the application. As shown in fig. 9, the laser chip 450 is disposed on the first bottom plate 4110 near the right opening, and is electrically connected to the circuit board 300, and the circuit board 300 supplies power to the laser chip 450 to drive the laser chip 450 to generate a laser beam. In order to fix the laser chip 450 on the first bottom plate 4110 of the base 410 conveniently, the first bottom plate 4110 is provided with a semiconductor refrigerator 490 near the right opening, the bottom surface of the semiconductor refrigerator 490 is adhered to the first bottom plate 4110, the top surface of the semiconductor refrigerator 490 far away from the lower housing 202 is provided with a substrate 4901, the laser chip 450 is adhered to the substrate 4901, so that the heat generated by the operation of the laser chip 450 can be transferred to the semiconductor refrigerator 490 through the substrate 4901, and the heat exchange is performed through the semiconductor refrigerator 490, so that the operating temperature of the laser chip 450 is reduced, and the service life and performance of the laser chip 450 are ensured. In the embodiment of the present application, the substrate 4901 is typically a plate made of aluminum nitride or silicon.

The laser beam generated by the laser chip 450 is transmitted along the left-right direction, and the laser beam generated by the laser chip 450 is a divergent beam, so that a first convergent lens 460 is disposed in the light emitting direction of the laser chip 450, the first convergent lens 460 is adhered to the semiconductor refrigerator 490, and the divergent angle of the divergent beam generated by the laser chip 450 is reduced by the first convergent lens 460. In the embodiment of the present application, the light emitting assembly includes 4 laser chips 450 and 4 first converging lenses 460, the 4 laser chips 450 are disposed on the semiconductor refrigerator 490 side by side, and each first converging lens 460 is disposed in the emitting direction of each laser chip 450 for reducing the divergence angle of the divergent light beam generated by each laser chip 450.

The first chassis 4110 is further provided with a plurality of second focusing lenses 470, each of the second focusing lenses 470 is disposed in an emission direction of each of the laser chips 450, and the laser chips 450, the first focusing lenses 460 and the second focusing lenses 470 are sequentially disposed along the light emission direction. Since the outer surface of the second converging lens 470 is curved, in order to fix the second converging lens 470 on the first base 4110, a plurality of glass blocks 480 are provided on the first base 4110, the bottom surface of each glass block 480 is adhered to the first base 4110, and the right side surface of each second converging lens 470 is adhered to the left side surface of each glass block 480, so that the second converging lens 470 is fixed on the first base 4110 through the glass blocks 480.

In the embodiment of the application, the glass block 480 is not only used for fixing the second converging lens 470, but also the laser beam generated by the laser chip 450 is transmitted into the second converging lens 470 through the glass block 480 after the beam divergence angle is reduced by the first converging lens 460, and the glass block 480 does not perform displacement conversion on the beam with smaller divergence angle, and the beam is directly transmitted by the glass block 480.

Fig. 10 is a schematic diagram of a partial structure of an optical transceiver sub-module 400 in an optical module according to an embodiment of the application. As shown in fig. 10, in the optical module provided by the embodiment of the application, a first mounting board 4201 and a second mounting board 4202 are disposed on a board of a first cover board 420, the first mounting board 4201 and the second mounting board 4202 are disposed side by side, and a partition board 4203 is disposed between the first mounting board 4201 and the second mounting board 4202; the first displacement prism 4204 of the light emitting component and the light multiplexing component 4205 are both located on the first mounting base 4201, the first optical fiber adapter 500 is inserted into the first cover 420, and the light multiplexing component 4205 is adhered to the bottom surface of the first mounting base 4201; the first displacement prism 4204 is located between the first optical fiber adapter 500 and the light multiplexing component 4205, the first displacement prism 4204 is adhered to the bottom surface of the first mounting board 4201, and the light input surface of the first displacement prism 4204 is adhered to the light output surface of the light multiplexing component 4205, such that one composite light beam output by the light multiplexing component 4205 is input into the first displacement prism 4204, and the one composite light beam is reflected and refracted by the first displacement prism 4204 and coupled into the first optical fiber adapter 500.

After the first cover plate is installed with the base, the optical multiplexing component is arranged on one side close to the first side plate, and the optical demultiplexing component is arranged on the other side close to the second side plate.

The first cover plate is provided with a first notch 4205A and a second notch 4206A on two sides thereof, the first protrusion 4120A is embedded in the first notch 4205A, and the second protrusion 4130A is embedded in the second notch 4206A.

The first cover plate comprises a second bottom plate and a third side plate, the first notch is arranged on the first side of the second bottom plate, the second notch is arranged on the second side of the second bottom plate, and the third side plate is arranged on the third side of the second bottom plate; the first notch and the second notch are respectively arranged on the opposite sides of the second bottom plate; one end of the third side plate protrudes relative to the first notch, and the first bulge is embedded between the first notch and the third side plate so as to realize the fixed connection between the first bulge and the third side plate; the other end of the third side plate protrudes relative to the second notch, and the second bulge is embedded between the second notch and the third side plate so as to realize the fixed connection between the second bulge and the third side plate; the fixed connection is welding. Intermittent glue dispensing and fixing are carried out at the gap between the side wall of the second bottom plate and the first side plate; intermittent glue dispensing and fixing are arranged between the side wall of the second bottom plate and the second side plate at the gap.

The second displacement prism 4206 of the light receiving assembly and the optical demultiplexing assembly 4207 are both positioned on the second mounting base 4202, the second optical fiber adapter 600 is inserted into the first cover 420, and the optical demultiplexing assembly 4207 is adhered to the bottom surface of the second mounting base 4202; the second displacement prism 4206 is located between the second optical fiber adapter 600 and the optical demultiplexing component 4207, and the second displacement prism 4206 is adhered to the bottom surface of the second mounting board 4202, so that one composite beam transmitted by the second optical fiber adapter 600 is coupled into the optical demultiplexing component 4207 by reflection and refraction of the second displacement prism 4206, and one composite beam is demultiplexed into multiple beams with different wavelengths by the optical demultiplexing component 4207.

Fig. 11 is a schematic structural diagram of a first cover 420 in an optical module according to an embodiment of the application. As shown in fig. 11, the first cover 420 includes a second bottom plate 4210, a third side plate 4220 and a fourth side plate 4230, the third side plate protrudes relative to the second bottom plate, the first cover is located between the first side plate and the second side plate, and the third side plate covers the end of the first side plate and the end of the second side plate. The first optical fiber adapter and the second optical fiber adapter are respectively arranged on the third side plate. In one embodiment, the second bottom panel and the third side panel are perpendicular to each other.

The second bottom plate 4210 is connected with the upper housing 201, the third side plate 4220 faces the first optical fiber adapter 500 and the second optical fiber adapter 600, the top surface of the third side plate 4220 is fixedly connected with the second bottom plate 4210, a first through hole 4208 and a second through hole 4209 are arranged on the third side plate 4220, the first optical fiber adapter 500 is fixed on the third side plate 4220 through the first through hole 4208, and the second optical fiber adapter 600 is fixed on the third side plate 4220 through the second through hole 4209; the top surface of the fourth side plate 4230 is fixedly connected to the second bottom plate 4210, and the left side surface (the side surface facing the optical fiber adapter) of the fourth side plate 4230 is fixedly connected to the right side surface of the third side plate 4220. Thus, the first cover 420 is a case having an opening on the right side, front side, and lower side formed by the second bottom plate 4210, the third side plate 4220, and the fourth side plate 4230.

The second substrate 4210 is provided with a first protrusion 4211 near the first through hole 4208, the right side surface of the first protrusion 4211 is a plane, the bottom surface of the light multiplexing module 4205 is adhered to the first mounting substrate 4201, the rear side surface is adhered to one side surface of the spacer 4203, and the left side surface is adhered to the right side surface of the first protrusion 4211, so that the light multiplexing module 4205 is fixed to the second substrate 4210. The left side of the light multiplexing assembly 4205 is provided with a light outlet, and the right side of the first displacement prism 4204 is adhered to the left side of the light multiplexing assembly 4205 and corresponds to the light outlet, so as to receive one path of composite light beam output by the light multiplexing assembly 4205. The left side surface (light exit surface) of the first displacement prism 4204 corresponds to the first through hole 4208, and the composite light beam is refracted and reflected by the first displacement prism 4204 and then enters the first fiber optic adapter 500 in the first through hole 4208.

The bottom surface of the optical demultiplexing module 4207 is attached to the second mounting base plate 4202, the rear side is attached to the side of the fourth side plate 4230, and the front side is attached to the side of the spacer 4203, thereby securing the optical demultiplexing module 4207 to the second base plate 4210. The second bottom plate 4210 is provided with a second protrusion 4212 near the second through hole 4209, the rear side surface of the second protrusion 4212 is a plane, the bottom surface of the second displacement prism 4206 is adhered to the second bottom plate 4210, the front side surface is adhered to the rear side surface of the second protrusion 4212, the left side surface (light incident surface) corresponds to the second through hole 4209, the right side surface (light emergent surface) corresponds to the light incident port of the optical demultiplexing component 4207, one path of signal light transmitted by the second optical fiber adapter 600 is refracted and reflected by the second displacement prism 4206 and then is incident into the optical demultiplexing component 4207, and one path of signal light is demultiplexed into multiple paths of light beams with different wavelengths by the optical demultiplexing component 4207.

Fig. 12 is a schematic view of another angle structure of the first cover 420 in the optical module according to the embodiment of the application. As shown in fig. 12, the top surface of the first mounting board 4201 in the first cover board 420 may be different from the top surface of the second mounting board 4202, for example, the second mounting board 4202 is recessed in the first mounting board 4201, and the first cover board 420 is covered above the base 410, and the second board 4210 of the first cover board 420 faces the upper housing 201, so that the optical demultiplexing component 4207 on the second mounting board 4202 is higher than the optical multiplexing component 4205 on the first mounting board 4201, and the multiplexed beam output by the optical demultiplexing component 4207 can be conveniently transmitted to the optical receiving chip, so as to prevent crosstalk of the optical receiving beam by the optical emission beam.

Also, the light receiving chip receives the light beam through the top light incident surface, so that the light beam output by the optical demultiplexing component 4207 has a height difference from the light path of the light beam received by the light receiving chip; and the laser chip emits the light beam through the side light emitting surface, the light beam output from the laser chip is at the same level as the light path of the light beam received by the light multiplexing assembly 4205. Thus, to achieve both emission and reception of light, the top surface of the second mounting substrate 4202 of the fixed optical demultiplexing component 4207 is recessed from the top surface of the first mounting substrate 4201 of the fixed optical multiplexing component 4205.

In the embodiment of the application, the first displacement prism 4204 and the light multiplexing component 4205 of the light emitting component and the second displacement prism 4206 and the light demultiplexing component 4207 of the light receiving component are all disposed on the first cover plate 420, and then the first cover plate 420 with the first displacement prism 4204, the light multiplexing component 4205, the second displacement prism 4206 and the light demultiplexing component 4207 fixed thereon is mounted on the base plate 410, so that the optical transceiver sub-module 400 can be mounted from multiple angles, resulting in a large operation space, which is beneficial to improving the assembly efficiency of the optical transceiver sub-module 400.

Fig. 13 is a schematic cross-sectional view of a first optical fiber adapter 500 and a first cover 420 in an optical module according to an embodiment of the application. As shown in fig. 13, when one path of composite light beam is injected into the first optical fiber adapter 500 through the first displacement prism 4204, the light beam is easily reflected on the optical fiber ferrule end face of the first optical fiber adapter 500, and the reflected light beam is injected into the optical multiplexing component 4205 through the first displacement prism 4204, so that interference is easily caused to the emitted light beam, and therefore, an isolator 510 is embedded in the first through hole 4208, and the isolator 510 is located between the first displacement prism 4204 and the optical fiber ferrule end face, and can be used for eliminating the light beam reflected by the optical fiber ferrule end face, so as to avoid crosstalk caused by the reflected light beam to the emitted light beam.

To facilitate coupling the composite light beam output by the first displacement prism 4204 into the first fiber optic adapter 500, a second converging lens 520 is further embedded in the first through hole 4208, and the second converging lens 520 is disposed between the isolator 510 and the fiber ferrule end face, for coupling the composite light beam transmitted through the isolator 510 to the fiber ferrule end face of the first fiber optic adapter 500, so as to implement light emission through the first fiber optic adapter 500.

Fig. 14 is a schematic cross-sectional view of the second fiber optic adapter 600 and the first cover 420 in the optical module according to the embodiment of the application. As shown in fig. 14, when the signal light transmitted by the second optical fiber adapter 600 is incident on the optical demultiplexing module 4207, the signal light transmitted by the second optical fiber adapter 600 is a divergent light beam, so as to facilitate the incident of the emission light beam into the optical demultiplexing module 4207 through the second displacement prism 4206, a second lens 610 is embedded in the second through hole 4209, and the second lens 610 is located between the second displacement prism 4206 and the fiber core end surface of the second optical fiber adapter 600, so as to convert the light beam transmitted in the second optical fiber adapter 600 into parallel light, and the parallel light is refracted and reflected by the second displacement prism 4206 and then incident on the optical demultiplexing module 4207, so that one path of parallel light is demultiplexed into light beams with different wavelengths through the optical demultiplexing module 4207.

Fig. 15 is a schematic diagram of a light path of light emission in an optical module according to an embodiment of the present application. As shown in fig. 15, the laser chip 450, the first converging lens 460, the glass block 480, the second converging lens 470, the light multiplexing component 4205, the first displacement prism 4204, the isolator 510 and the first optical fiber adapter 500 are sequentially arranged along the light emission direction, the laser beam generated by the laser chip 450 is converted into a beam with a smaller divergence angle by the first converging lens 460, the beam with the smaller divergence angle is transmitted through the glass block 480 and then enters the second converging lens 470, is converted into a collimated beam by the second converging lens 470, the collimated beam is injected into the light inlet of the light multiplexing component 4205, the multiplexed beam is multiplexed into one path of composite beam by the light multiplexing component 4205, the composite beam is injected into the first displacement prism 4204 by the light outlet of the light multiplexing component 4205, is refracted and reflected by the first displacement prism 4204 and then transmitted through the isolator 510, and the composite beam passing through the isolator 510 is coupled to the first optical fiber adapter 500 by the second converging lens 520, so as to realize light emission.

In an embodiment of the present application, the light emitting assembly includes 4 laser chips 450, 4 first condensing lenses 460, 4 glass blocks 480, and 4 second condensing lenses 470, each second condensing lens 470 is fixed on each glass block 480, each glass block 480 corresponds to each first condensing lens 460, and each first condensing lens 460 corresponds to each laser chip 450. The right side of the light multiplexing assembly 4205 is provided with 4 light inlets, and the 4 collimated light beams output by the 4 second focusing lenses 470 are emitted into the 4 light inlets one by one, so as to emit the 4 collimated light beams into the light multiplexing assembly 4205. The left side of the light multiplexing assembly 4205 is provided with 1 light outlet, and the 4 collimated light beams are reflected by the light multiplexing assembly 4205 to form a composite light beam, and the composite light beam is emitted through the light outlet to enter the first displacement prism 4204.

And the circuit board is arranged on the surface of the base in a partial area, and the partial area is arranged outside the base. The surface of the circuit board 300 inserted into the base 410 is provided with a laser driving chip 310, and after the laser chip 450 is adhered to the substrate 4901, the circuit board needs to be electrically connected with the laser driving chip 310 through a wire bonding (gold wire), so that the laser driving chip 310 drives the laser chip 450 to generate a laser beam. Specifically, the laser driving chip 310 is electrically connected to the circuit board 300 through wires (gold wires), the circuit board 300 is electrically connected to the substrate 4901 through wires (gold wires), and the substrate 4901 is electrically connected to the laser chip 450 through wires (gold wires), so that the laser driving chip 310 is electrically connected to the laser chip 450 through wires, the circuit board 300, wires, the substrate 4901, wires.

After the electrical connection between the laser driving chip 310 and the laser chip 450 is achieved through the gold wire, when other devices of the optical module are mounted, the gold wire may be touched, and damage to the gold wire is caused. In the embodiment of the present application, in order to prevent the gold wires on the circuit board 300 and the laser chip 450 and the substrate 4901 from being damaged, a protection cover 440 is disposed above the laser chip 450, the substrate 4901 and the circuit board 300, and the gold wires are isolated from the external devices by the protection cover 440, so as to prevent the gold wires from being damaged by the external devices.

Fig. 16 is a schematic structural diagram of a protective cover 440 in an optical module according to an embodiment of the present application, and fig. 17 is another schematic angular structural diagram of a protective cover 440 in an optical module according to an embodiment of the present application. As shown in fig. 16 and 17, the protective cover 440 includes a top plate 4401, a first support plate 4402 and a second support plate 4403, the first support plate 4402 is connected to the rear side of the top plate 4401, and the second support plate 4403 is connected to the front side of the top plate 4401. Thus, the protection cover 440 is a U-shaped cover body composed of the top plate 4401, the first support plate 4402 and the second support plate 4403, so as to cover the laser chip 450, the substrate 4901 and the laser driving chip 310 under the U-shaped cover body.

In the embodiment of the application, the length dimensions of the first support plate 4402 and the second support plate 4403 are smaller than the length dimensions of the top plate 4401, i.e. the first support plate 4402 and the second support plate 4403 are connected to the right side portion of the top plate 4401, the bottom surfaces of the first support plate 4402 and the second support plate 4403 are adhered to the surface of the circuit board 300, and the left side of the top plate 4401 is fixed with the glass block 480, so that the protective cover 440 is fixed above the circuit board 300 and the base 410.

In order to further support the top plate 4401, the protective cover 440 further includes a plurality of support posts 4405, one end of each support post 4405 is connected with the inner side surface of the top plate 4401, the other end of each support post 4405 is adhered to the surface of the circuit board 300, and the support posts 4405 are disposed in the middle position of the top plate 4401, so as to support the middle position of the top plate 4401 and prevent the left end of the top plate 4401 from touching gold wires or other optical devices.

In the embodiment of the present application, a notch 4404 is provided on the rear side of the top plate 4401, the notch 4404 extends along the length direction (left-right direction) of the top plate 4401, and the size of the notch 4404 in the left-right direction is smaller than the size of the top plate 4401 in the left-right direction; the notch 4404 extends in the width direction (front-rear direction) of the top plate 4401, and the size of the notch 4404 in the front-rear direction is smaller than the size of the top plate 4401 in the front-rear direction. The notch 4404 faces the light receiving component and is used for avoiding the area where the light receiving chip of the light receiving component is located.

The left side surface of the first support plate 4402 is flush with the right side surface of the notch 4404, the right side surface of the second support plate 4403 is flush with the right side surface of the top plate 4401, and the size of the second support plate 4403 in the left-right direction is the same as the size of the first support plate 4402 in the left-right direction.

The top plate 4401 is covered on the laser chip 450, the first converging lens 460, the substrate 4901 and the circuit board 300 by the first supporting plate 4402, the second supporting plate 4403 and the supporting columns 4405, and is used for protecting gold wires on the laser driving chip 310 to the circuit board 300, gold wires on the circuit board 300 to the substrate 4901 and gold wires on the laser chip 450 to the substrate 4901, and simultaneously protecting fragile devices such as the laser driving chip 310, the laser chip 450 and the first converging lens 460.

In the embodiment of the present application, the top plate 4401 of the protective cover 440 may be a plastic plate or a metal plate, but it is generally required to prevent contact with the circuits on the circuit board 300. The top plate 4401 is made of transparent plastic, so that whether the gold wire and the vulnerable device under the protective cover 440 are damaged or not can be conveniently observed.

Fig. 18 is a partially exploded view of a circuit board 300 and a light receiving assembly in an optical module according to an embodiment of the application. As shown in fig. 18, a plurality of light receiving chips 740 are provided on the circuit board 300 along the light receiving direction, the light receiving chips 740 being PD (photodetectors), such as APD (avalanche diodes), PIN-PD (photodiodes), for converting received signal light into photocurrent. Alternatively, a plurality of light receiving chips 740 in the light receiving assembly are respectively disposed on the circuit board 300.

Further, the light receiving assembly further includes a transimpedance amplifier 750, the transimpedance amplifier 750 is mounted on the circuit board 300, and the plurality of light receiving chips 740 are connected to the transimpedance amplifier 750, for receiving the current signal generated by the light receiving chips 740 and converting the received current signal into a voltage signal. Optionally, the transimpedance amplifier 750 is wire-bonded to the light receiving chip 740, such as by a semiconductor bond alloy wire.

In the embodiment of the present application, 4 light receiving chips 740,4 are disposed on the circuit board 300, and the light receiving chips 740 are connected to the transimpedance amplifier 750 through wires. However, when the length of the wire bonding is larger, the inductance generated by the wire bonding is larger, and the signal mismatch is larger, and the signal output by the light receiving chip 740 is a small signal, which may further cause a decrease in signal quality. Therefore, the optical receiving chip 740 and the transimpedance amplifier 750 are as close as possible, the wire bonding length is reduced, the signal transmission quality is ensured, and the transimpedance amplifier 750 is arranged on one side of the optical receiving chip 740, so that the transimpedance amplifier 750 is close to the optical receiving chip 740 as much as possible. Optionally, the electrodes of the light receiving chip 740 are on the same plane as pins on the transimpedance amplifier 750, so as to ensure that the wire bonding between the light receiving chip 740 and the transimpedance amplifier 750 is minimized.

The optical axes of the multiple signal lights output by the optical demultiplexing component 4207 are parallel to the surface of the circuit board 300, and the photosensitive surfaces of the multiple light receiving chips 740 are also parallel to the surface of the circuit board 300, but the optical axes of the multiple signal lights output by the optical demultiplexing component 4207 are higher than the photosensitive surfaces of the light receiving chips 740, so that in order to ensure that the light receiving chips 740 normally receive the signal lights, the optical receiving component further comprises a reflecting prism 720, the reflecting prism 720 is arranged above the light receiving chips 740 and is used for covering the 4 light receiving chips 740, and the optical axis direction of the received light beams is changed through the reflecting surfaces of the reflecting prism 720, so that the optical axes of the received light beams are converted from being parallel to the surface of the circuit board 300 to being perpendicular to the surface of the circuit board 300, and then the received light beams are perpendicular to the photosensitive surfaces of the corresponding light receiving chips 740.

In the embodiment of the present application, the reflecting prism 720 is a 45 ° reflecting prism, and the 45 ° reflecting surface of the reflecting prism 720 covers 4 light receiving chips 740 disposed on the circuit board 300.

In order to collect the 4 received light beams onto the reflecting prism 720, the light receiving assembly further includes a lens array 710, and one side of the lens array 710 is adhered to the light incident surface of the reflecting prism 720. The lens array 710 includes a plurality of converging lenses, each converging lens corresponds to each light outlet of the optical demultiplexing component 4207, and is configured to converge one path of received light beam output from the light outlet of the optical demultiplexing component 4207 into the reflecting prism 720, and convert the received light beam parallel to the surface of the circuit board 300 into a received light beam perpendicular to the surface of the circuit board 300 through the reflecting prism 720.

In the embodiment of the application, to fix the lens array 710 and the reflective prism 720, the light receiving assembly further includes a fourth housing 700, the fourth housing 700 is a housing with an opening at the bottom and formed by five sides, the fourth housing 700 is covered on the light receiving chip 740 and the transimpedance amplifier 750 of the circuit board 300, and the top surfaces of the lens array 710 and the reflective prism 720 are adhered to the top surface inside the fourth housing 700. The lens array 710 and the reflecting prism 720 can adjust the height of the fourth housing 700 according to the distance between the fourth housing 700 and the surface of the circuit board 300, so that the multiple signal beams output by the optical demultiplexing component 4207 can be accurately incident into the lens array 710 and the reflecting prism 720.

In order to adjust the distance between the top surface of the fourth housing 700 and the surface of the circuit board 300, the circuit board 300 is provided with a first adjusting plate 760 and a second adjusting plate 770, the first adjusting plate 760 and the second adjusting plate 770 are respectively positioned at two sides of the light receiving chip 740, the first adjusting plate 760 contacts with the bottom surface of the left side of the fourth housing 700, and the second adjusting plate 770 abuts against the bottom surface of the right side of the fourth housing, so that the fourth housing 700 is supported and fixed by the first adjusting plate 760 and the second adjusting plate 770, and the distance between the top surface of the fourth housing 700 and the circuit board 300 is increased.

In the embodiment of the present application, after the optical demultiplexing module 4207 is fixed on the second mounting board 4202 of the first cover board 420 and the optical receiving chip 740 is adhered to the surface of the circuit board 300, the distance between the top surface of the fourth housing 700 and the surface of the circuit board 300 is adjusted by the first adjusting board 760 and the second adjusting board 770, so that the distance between the lens array 710 and the reflecting prism 720 is adjusted, the multiple signal beams output by the optical demultiplexing module 4207 are transmitted to the lens array 710, the multiple signal beams are coupled to the reflecting prism 720 via the lens array 710, and the signal beams parallel to the surface of the circuit board 300 are converted into the signal beams perpendicular to the surface of the circuit board 300 by the reflecting prism 720, so that the multiple signal beams are respectively reflected to the corresponding optical receiving chip 740.

The signal beam reflected by the reflecting prism 720 is divergent light, and in order to transmit the reflected signal beam into the light receiving chip 740, a plurality of third convergent lenses 730 are arranged between the reflecting prism 720 and the light receiving chip 740, each third convergent lens 730 is positioned above each light receiving chip 740, so that the signal beam reflected by the reflecting prism 720 and vertical to the surface of the circuit board 300 is coupled to the light receiving chip 740 through the third convergent lenses 730, and the reflected beam can be accurately emitted into the light receiving chip 740, thereby improving the receiving efficiency of the light receiving chip 740.

Fig. 19 is a schematic diagram of a light receiving circuit in an optical module according to an embodiment of the present application, and fig. 20 is a side view of the light receiving circuit in the optical module according to the embodiment of the present application. As shown in fig. 19 and 20, the second optical fiber adapter 600, the second displacement prism 4206, the optical demultiplexing module 4207, the lens array 710, the reflecting prism 720, the third converging lens 730, and the light receiving chip 740 are sequentially disposed along the light receiving direction, the signal beam transmitted by the second optical fiber adapter 600 is transmitted to the second displacement prism 4206, and after being refracted and reflected by the second displacement prism 4206, one signal beam is injected into the optical demultiplexing module 4207, demultiplexed into multiple signal beams by the optical demultiplexing module 4207, the multiple signal beams are coupled to the reflecting prism 720 via the lens array 710, the multiple signal beams parallel to the surface of the circuit board 300 are converted into multiple signal beams perpendicular to the surface of the circuit board 300 via the reflecting prism 720, and the reflected signal beams are converged and coupled to the corresponding light receiving chip 740 via the third converging lens 730, so as to implement the reception and photoelectric conversion of the signal beams.

In the embodiment of the present application, since the received signal beam converts the horizontal beam into the vertical beam via the reflective prism 720, the height of the light receiving chip 740 from the surface of the circuit board 300 is lower than the height of the light demultiplexing assembly 4207 from the surface of the circuit board 300. The present application increases the fixed height of the optical demultiplexing module 4207 on the first cover plate 420 by recessing the second mounting substrate 4202 on the first cover plate 420 from the first mounting substrate 4201.

Fig. 21 is a schematic structural diagram of a base 410 in an optical module according to an embodiment of the present application, and fig. 22 is an assembly schematic diagram of the base 410 and a circuit board 300 in the optical module according to an embodiment of the present application. As shown in fig. 21 and 22, the base 410 is a housing with left, right and upper openings formed by a first bottom plate 4110, a first side plate 4120 and a second side plate 4130, wherein a third bottom plate 4140 is disposed at the right opening of the first bottom plate 4110, and the third bottom plate 4140 is recessed in the first bottom plate 4110, such that a step surface exists between the third bottom plate 4140 and the first bottom plate 4110. In the embodiment of the present application, the width dimension (the front-rear direction dimension) of the third bottom plate 4140 is the same as the width dimension of the base 410 to just accommodate the circuit board 300.

The side surface of the circuit board 300 where the protrusion 320 is connected and the side surface of the third bottom plate 4140 are abutted, that is, the left side surface of the circuit board 300 inserted into the chassis 410 is abutted with the left side surface of the third bottom plate 4140, thereby positioning the circuit board 300. After the circuit board 300 is inserted into the base 410, it moves from right to left along the surface of the first bottom plate 4110 of the base 410 by rubbing until the side surface of the circuit board 300 corresponding to the light emitting portion is positioned against the side surface of the third bottom plate 4140. When the left side surface of the circuit board 300 abuts against the left side surface of the third bottom plate 4140, the rear side surface of the protrusion 320 on the circuit board 300 contacts the second side plate 4130 of the base 410 to position the rear side of the circuit board 300. After positioning, the lower surface of the circuit board 300 is adhered to the third bottom plate 4140 by using glue, so as to fix the circuit board 300 and the base 410.

When the base 410 is fixedly connected with the first cover 420, the third side plate 4220 of the first cover 420 corresponds to the left opening of the base 410, and the third side plate 4220 and the left sides of the first side plate 4120 and the second side plate 4130 of the base 410 can be bonded together by glue so as to block the left opening of the base 410 by the third side plate 4220; the fourth side plate 4230 is connected with the second side plate 4130, thereby achieving fixation of the base 410 and the first cover plate 420.

The circuit board 300 is provided with electronic devices such as a capacitor, a resistor, a triode, a MOS tube, a clock data recovery CDR, a power management chip, a data processing chip DSP and the like, in order to ensure that the circuit board 300 has enough space to accommodate the electronic devices, the circuit board 300 is provided with a bulge 320, the bulge 320 extends along the left-right direction of the circuit board 300, namely, the left side of the bulge 320 is close to the left side opening of the base 410, and the right side of the bulge is connected with the circuit board 300 into a whole. The front-rear dimension of the protrusion 320 is smaller than the front-rear dimension of the circuit board 300, such that a space is left between the front side of the protrusion 320 and the front side of the circuit board 300, the space corresponding to the light emitting component, for avoiding the semiconductor refrigerator 490, the substrate 4901, the laser chip 450, the first condensing lens 460, the glass block 480, the second condensing lens 470, the light multiplexing component 4205, and the first displacement prism 4204 of the light emitting component.

In the embodiment of the present application, the protrusion 320 is located below the second displacement prism 4206 of the light receiving element and the light demultiplexing element 4207, that is, after the first cover 420 is mounted above the base 410, a gap exists between the second displacement prism 4206 in the first cover 420, the bottom surface of the light demultiplexing element 4207 and the first bottom plate 4110 of the base 410, and the protrusion 320 of the circuit board 300 is embedded in the gap, so as to increase the area of the circuit board 300 where the electronic device is disposed.

Fig. 23 is a schematic diagram illustrating another angle assembly of the base 410 and the circuit board 300 in the optical module according to the embodiment of the application. As shown in fig. 23, since the electronic device 330 is disposed on the protrusion 320 of the circuit board 300, in order to avoid the electronic device 330 on the protrusion 320, the first bottom plate 4110 of the base 410 is provided with an avoidance hole 4150, and the avoidance hole 4150 corresponds to the electronic device 330 on the protrusion 320, so that a partial area on the protrusion 320 can be exposed, the electronic device 330 is conveniently disposed on the surface of the exposed protrusion 320, thereby fully utilizing the narrow space of the optical module, and ensuring the connection strength between the circuit board 300 and the base 410 and the layout rationality of the electronic device on the circuit board 300.

After the laser chip 450, the first converging lens 460, the substrate 4901, the semiconductor refrigerator 490, the glass block 480 and the second converging lens 470 of the light emitting assembly are fixed on the first bottom plate 4110 of the base 410, the first displacement prism 4204, the light multiplexing assembly 4205 and the second displacement prism 4206 of the light receiving assembly, and the light demultiplexing assembly 4207 of the light emitting assembly are fixed on the second bottom plate 4210 of the first cover plate 420, one side of the circuit board 300 is fixed inside the base 410, and the third converging lens 730, the light receiving chip 740, the transimpedance amplifier 750 and the fourth housing with the lens array 710 and the reflecting prism 720 mounted thereon are fixed on the circuit board 300, the base 410 and the first cover plate 420 are bonded together, and then the second cover plate 430 and the base 410 are fixed together, thereby assembling the light receiving and transmitting sub-module 400 and electrically connecting the light receiving sub-module 400 and the circuit board 300.

Fig. 24 is an assembled cross-sectional view of the base 410 and the second cover 430 in the optical module according to the embodiment of the application. As shown in fig. 21 and 24, the first bottom plate 4110 includes a first step surface 4160A and a second step surface 4160 higher than the first step surface 4160A, and the first step surface and the third bottom plate are different surfaces having a height difference.

The side of the second step surface 4160 facing away from the third bottom plate 4140 contacts the side of the first side plate 4120 facing the third bottom plate 4140, i.e., the left side of the second step surface 4160 abuts against the right side of the first side plate 4120, and the right side is flush with the left side of the third bottom plate 4140. The second step surface 4160 is used for placing the semiconductor refrigerator 490 and the glass block 480, that is, the semiconductor refrigerator 490 and the bottom surface of the glass block 480 are adhered to the second step surface 4160. In addition, the rear side of the second stepped surface 4160 abuts against the front side of the boss 320 of the circuit board 300 to position the boss 320.

The second cover 430 is a housing assembled by a top plate facing the upper housing 201, and opposite side plates connected to the first side plate 4120 and the second side plate 4130 of the base 410, respectively. Specifically, the side of the second cover plate 430 facing away from the circuit board 300 contacts the side of the first side plate 4120 facing the third bottom plate 4140, i.e., the left side of the second cover plate 430 contacts the right side of the first side plate 4120.

The second step surface 4160 of the first bottom plate 4110 is provided with a first boss 4170, the side surface of the second cover plate 430 facing the second side plate 4130 is fixedly connected with the first boss 4170, that is, the front side surface of the first boss 4170 abuts against the inner wall of one side plate of the second cover plate 430, and the contact part is fixed by using a laser welding mode; the second side plate 4130 of the base 410 is provided with a second boss 4180, the second boss 4180 is opposite to the first boss 4170, and the side surface of the second cover plate 430 facing the first side plate 4120 is fixedly connected with the second boss 4180, that is, the rear side surface of the second boss 4180 abuts against the inner wall of the other side plate of the second cover plate 430, and the contact part is fixed by using a laser welding manner, so that the fixed connection between the base 410 and the second cover plate 430 is realized.

In the optical module provided by the embodiment of the application, a containing cavity is formed by assembling a base, a first cover plate and a second cover plate, a light emitting component, a light receiving component, a light multiplexing component, a first displacement prism, a second displacement prism and a light demultiplexing component are arranged in the containing cavity, a plurality of laser chips, a plurality of first converging lenses and a plurality of second converging lenses of the light emitting component are fixed in the cavity of the base, the light multiplexing component and the first displacement prism are fixed in the cavity of the first cover plate, and when the first cover plate is covered above the base, the plurality of laser chips, the plurality of first converging lenses, the plurality of second converging lenses, the light multiplexing component, the first displacement prism and the first optical fiber adapter are positioned in the same light emitting direction, so that the multi-path emission of light beams is emitted through one optical fiber; the second displacement prism and the optical demultiplexing component are fixed in the cavity of the first cover plate, the lens array and the reflecting prism of the optical receiving component are fixed in the cavity of the fourth shell, a plurality of optical receiving chips and a transimpedance amplifier of the optical receiving component are fixed on the surface of a circuit board inserted into the base, the first cover plate is covered above the base, and when the fourth shell is covered above the optical receiving chips and the transimpedance amplifier, the second optical fiber adapter, the second displacement prism, the optical demultiplexing component, the lens array, the reflecting prism, the plurality of optical receiving chips and the transimpedance amplifier are positioned in the same optical receiving direction, so that multipath receiving light beams are received through one optical fiber. The application belongs to the field of optical device structural design and assembly of optical communication devices, such as 100G products, 400G F < 4 >, and the like, wherein an optical emission component and an optical receiving component are respectively fixed in a base, a first cover plate and a fourth shell, so that the integration level of an optical receiving and transmitting sub-module is improved, and the miniaturization development of the optical module is facilitated.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, comprising

An upper housing;

a lower shell combined with the upper shell to form a wrapping cavity;

the wrapping cavity comprises

A base;

the circuit board is arranged on the surface of the base in a partial area, and the partial area is arranged outside the base;

the light emitting assembly is arranged on the surface of the base;

the light receiving component is arranged on the surface of the circuit board;

the first cover plate is covered on the base;

a light multiplexing assembly disposed on an inner wall of the first cover plate, capable of combining light from the light emitting assembly;

the optical demultiplexing component is arranged on the inner wall of the first cover plate and can split light and emit the split light to the optical receiving component;

A first fiber optic adapter disposed on the first cover plate capable of transmitting light from the optical multiplexing assembly;

the second optical fiber adapter is arranged on the first cover plate and can transmit light to the optical demultiplexing component;

the circuit board comprises a bulge, the bulge extends along the left-right direction of the circuit board and is positioned below the optical demultiplexing component, and the size of the bulge in the front-back direction is smaller than that of the circuit board in the front-back direction, so that a gap is reserved between the front side surface of the bulge and the front side surface of the circuit board, and the gap corresponds to the optical emission component.

2. The optical module of claim 1, wherein the base comprises a first bottom plate, a first side plate and a second side plate respectively positioned at two sides of the first bottom plate;

the first cover plate comprises a second bottom plate and a third side plate protruding relative to the second bottom plate, the first cover plate is positioned between the first side plate and the second side plate, and the third side plate covers the end part of the first side plate and the end part of the second side plate;

the second bottom plate is perpendicular to the third side plate; the first optical fiber adapter and the second optical fiber adapter are respectively arranged on the third side plate.

3. The optical module of claim 1, wherein the base comprises a first bottom plate, a first side plate and a second side plate respectively positioned at two sides of the first bottom plate;

the first side plate is provided with a first bulge towards the second side plate, the second side plate is provided with a second bulge towards the first side plate, two sides of the first cover plate are respectively provided with a first notch and a second notch, the first bulge is embedded into the first notch, and the second bulge is embedded into the second notch.

4. The optical module of claim 3, wherein a spacer is disposed on an inner wall of the first cover plate, the optical multiplexing component is disposed on one side of the spacer, and the optical demultiplexing component is disposed on the other side of the spacer;

the first bulge is positioned at the end part of the first side plate, and the second bulge is positioned at the end part of the second side plate;

the first cover plate comprises a second bottom plate and a third side plate, the first notch is formed in the first side of the second bottom plate, the second notch is formed in the second side of the second bottom plate, and the third side plate is formed in the third side of the second bottom plate;

the first notch and the second notch are respectively arranged on opposite sides of the second bottom plate; one end of the third side plate protrudes relative to the first notch, and the first protrusion is embedded between the first notch and the third side plate so as to realize the fixed connection between the first protrusion and the third side plate;

The other end of the third side plate protrudes relative to the second notch, and the second protrusion is embedded between the second notch and the third side plate so as to realize the fixed connection between the second protrusion and the third side plate; the fixed connection is welding.

5. The optical module of claim 4, wherein a gap exists between the side wall of the second bottom plate and the first side plate, and the second bottom plate is fixed by dispensing at the gap;

intermittent glue dispensing and fixing are arranged between the side wall of the second bottom plate and the second side plate at the gap.

6. The optical module of claim 1, wherein the base comprises a first bottom plate, a first side plate and a second side plate respectively positioned at two sides of the first bottom plate;