CN210072144U

CN210072144U - Optical module

Info

Publication number: CN210072144U
Application number: CN201920935142.5U
Authority: CN
Inventors: 付孟博; 傅钦豪; 谢一帆
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-06-20
Filing date: 2019-06-20
Publication date: 2020-02-14
Anticipated expiration: 2029-06-20

Abstract

The utility model discloses an optical module, include: the optical fiber coupler comprises a light emission sub-module, a light receiving chip, an array waveguide grating chip, a coupler, an optical fiber and a circuit board. The transmitter optical subassembly is positioned at the edge of the circuit board, and the transmitter optical subassembly and the light receiving chip are arranged on the surface of the circuit board in a staggered manner, so that the light receiving chip is positioned at the non-edge position of the circuit board, and the positions of the components of the light receiving optical subassembly are moved, thereby improving the electromagnetic shielding effect; one end of the coupler is connected with the optical fiber, the other end of the coupler is connected with the arrayed waveguide grating chip, and the bottom of the arrayed waveguide grating chip is provided with a glue layer with an inclined surface, so that an included angle is formed between the arrayed waveguide grating chip and the circuit board; the array waveguide grating chip is in an inclined state, so that after an optical signal irradiates the inclined end face of the array waveguide grating chip, most of light is reflected to the photosensitive surface of the light receiving chip, and the rest reflected light cannot return to the coupler along the original light path, and the light receiving performance of the light receiving sub-module can be ensured.

Description

Optical module

Technical Field

The utility model relates to an optical communication field especially relates to an optical module.

Background

Optical modules are important products in the optical communications industry, which implement interconversion between optical signals and telecommunications, provide optical signals for transmission in optical fibers, and provide electrical signals for transmission in electronic devices. With the continuous expansion of data transmission capacity, the improvement of the transmission capacity in a single optical fiber and the number of the optical fibers are the technical directions of solving the capacity problem and advancing in parallel. The increase in transmission capacity in a single fiber in turn includes increasing the rate of single wavelength and employing multi-wavelength transmission. Under the condition that the single wavelength rate cannot be improved, the multi-wavelength transmission is a technical scheme which is relatively easy to realize.

In order to realize multi-wavelength transmission, a plurality of laser chips and a plurality of light receiving chips need to be distributed in an optical module, BOX packaging is a packaging mode which can realize the plurality of laser chips and the plurality of light receiving chips, and meanwhile, the BOX packaging structure has the advantages of high integration level, miniaturization, convenience in realization of commercial-grade working temperature, adaptability to severe working environments and the like.

Fig. 1 is a schematic structural diagram of an optical module provided in the prior art. As shown in fig. 1, a transmitter sub-module TX101 and a receiver sub-module RX102 are disposed at one end of the surface of a circuit board 100, and a gold finger 103 is disposed at the other end of the surface of the circuit board, so that a layout is formed in which one end of the circuit board is an optical port and the other end is an electrical port. The optical transmitter sub-module comprises a laser chip, and the optical receiver sub-module comprises an optical receiver chip, a coupler and an array waveguide grating chip. The laser chip is used for emitting optical signals according to the electric signals, and the optical signals enter the optical receiving chip through the optical fibers. Specifically, the optical signal enters the coupler through the optical fiber, enters the arrayed waveguide grating chip through the coupler, and then enters the light receiving chip downward after irradiating the end face of the arrayed waveguide grating chip. However, after the optical signal irradiates the end face of the waveguide grating chip, a part of light is reflected back and enters the coupler again, which affects the light receiving performance of the optical receive sub-module.

SUMMERY OF THE UTILITY MODEL

The utility model provides an optical module to solve the problem that the reverberation easily influences the receipts light of light receiving submodule piece.

The utility model provides an optical module, include: the optical transceiver comprises a light emission sub-module, a light receiving chip, an array waveguide grating chip, a coupler, an optical fiber and a circuit board;

the light emission secondary module is positioned at the edge of the circuit board and is staggered with the light receiving chip on the surface of the circuit board;

the light receiving chip is arranged between the circuit board and the array waveguide grating chip; one end of the coupler is connected with the optical fiber, and the other end of the coupler is connected with the arrayed waveguide grating chip;

the bottom of the arrayed waveguide grating chip is provided with a glue layer with an inclined surface, and the glue layer is fixed between the arrayed waveguide grating chip and the circuit board to form an included angle between the arrayed waveguide grating chip and the circuit board;

the tail end of the array waveguide grating chip is an end face inclined relative to the photosensitive surface of the light receiving chip so as to reflect light to the photosensitive surface.

According to the above technical solution, the embodiment of the utility model provides an optical module, include: the optical fiber coupler comprises a light emission sub-module, a light receiving chip, an array waveguide grating chip, a coupler, an optical fiber and a circuit board. The transmitter optical subassembly is positioned at the edge of the circuit board, and the transmitter optical subassembly and the light receiving chip are arranged on the surface of the circuit board in a staggered manner, so that the light receiving chip is positioned at the non-edge position of the circuit board, and the positions of the components of the light receiving optical subassembly are moved, thereby improving the electromagnetic shielding effect; one end of the coupler is connected with the optical fiber, the other end of the coupler is connected with the arrayed waveguide grating chip, and the bottom of the arrayed waveguide grating chip is provided with a glue layer with an inclined surface, so that an included angle is formed between the arrayed waveguide grating chip and the circuit board; the array waveguide grating chip is in an inclined state, so that after an optical signal irradiates the inclined end face of the array waveguide grating chip, most of light is reflected to the photosensitive surface of the light receiving chip, and the rest reflected light cannot return to the coupler along the original light path, and the light receiving performance of the light receiving sub-module can be ensured.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic structural diagram of an optical module provided in the prior art;

fig. 2 is an external structural schematic diagram of an optical module according to an embodiment of the present invention;

fig. 3 is an exploded schematic view of an optical module according to an embodiment of the present invention;

fig. 4 is a schematic view of a partial structure of an optical module according to an embodiment of the present invention;

FIG. 5 is a partial enlarged view of portion A of FIG. 4;

fig. 6 is a schematic view of a partially exploded structure of an optical module according to an embodiment of the present invention;

fig. 7 is a partial side view of an optical module provided in an embodiment of the present invention;

fig. 8 is a side view of a glue layer provided by an embodiment of the present invention;

fig. 9 is a partial enlarged view of portion B of fig. 7;

fig. 10 is a schematic structural diagram of an arrayed waveguide grating chip according to an embodiment of the present invention.

Detailed Description

Fig. 2 is an external structural schematic diagram of an optical module according to an embodiment of the present invention; fig. 3 is an exploded schematic view of an optical module according to an embodiment of the present invention.

Referring to fig. 2 and 3, the optical module includes an upper housing 120 and a lower housing 110, forming a housing of the optical module. The optical transmitter sub-module 202, the optical receiver sub-module 204 and the circuit board 200 are mainly packaged in the shell, the optical transmitter sub-module 202 mainly comprises a laser chip and a lens forming a light path, and the optical receiver sub-module 204 mainly comprises an optical receiver chip 201 and a lens forming a light path; temperature regulating electronics may also be included in the tosa 202. The high-rate optical transmission of the optical module is completed by the tosa 202, the high-rate optical reception is completed by the rosa 204, and the high-rate signal has high requirements on the electrical performance of the optical module, such as impedance matching and electromagnetic compatibility of a signal path.

The embodiment of the utility model provides an optical module, including circuit board 200, emission of light submodule 202, light receiving chip 201, array waveguide grating chip 205, coupler 206 and optic fibre 203. The tosa 202 is located at the edge of the circuit board 200, and the tosa 202 and the lru 201 are staggered on the surface of the circuit board 200. The light receiving chip 201 is disposed between the circuit board 200 and the arrayed waveguide grating chip 205; the coupler 206 has one end connected to the optical fiber 203 and the other end connected to the arrayed waveguide grating chip 205. The center of the optical fiber 203 is aligned with the center of the coupler 206, the center of the arrayed waveguide grating chip 205 is not aligned with the center of the coupler 206, and light from the optical fiber 203 sequentially passes through the center of the optical fiber 203, the center of the coupler 206 and the position of the arrayed waveguide grating chip 205 which is lower than the center of the arrayed waveguide grating chip 205 and is emitted to the end face 2051 inclined at the tail end of the arrayed waveguide grating chip 205; the end of the arrayed waveguide grating chip 205 is a side surface inclined with respect to the light-sensitive surface of the light-receiving chip 201 to reflect light toward the light-sensitive surface of the light-receiving chip 201.

The embodiment of the utility model provides an optical module, the transmitter optical subassembly 202 is located the edge of circuit board 200, and the transmitter optical subassembly 202 staggers the setting with the light receiving chip 201 on circuit board 200 surface for light receiving chip 201 is located the non-border position of circuit board 200, thereby optical module subassembly position takes place to remove and improves electromagnetic shield effect. The center of the optical fiber 203 is aligned with the center of the coupler 206, and the center of the arrayed waveguide grating chip 205 is not aligned with the center of the coupler 206, which is a requirement for light to propagate in the optical fiber, the coupler, and the arrayed waveguide grating chip.

Specifically, the embodiment of the present invention provides an optical module, which includes an upper housing 120, a lower housing 110 and a circuit board 200, wherein the circuit board 200 is provided with a tosa 202 and a tosa 204. The upper housing 120 and the lower housing 110 are combined to form a cavity for packaging the circuit board 200, the tosa 202 and the rosa 204.

The tosa 202 includes a plurality of laser chips, and optical signals with a plurality of wavelengths emitted by the plurality of laser chips are combined into one path of light, and then transmitted out of the optical module through the emission optical fiber and further enter the external communication optical fiber. Specifically, the tosa 202 is disposed at one end edge of the circuit board 200 in the length direction, and a gold finger for electrical communication with the outside of the optical module is disposed at the other end edge of the circuit board 200 in the length direction.

Combine the requirement of outside optic fibre, put emission of light submodule 202, the light receiving submodule 204 (built-in has light receiving chip 201) at the homonymy edge of circuit board 200 for the distance between emission of light submodule 202 and the light receiving submodule 204 is close relatively, produces mutual electromagnetic interference easily, and utility model people considers staggering both in order to pull open distance each other.

In order to avoid producing electromagnetic interference between tosa 202 and tosa 204, especially to the optical module of high-rate receiving and dispatching, the embodiment of the utility model provides an among the optical module, tosa 202 and tosa 204 stagger each other and set up.

Specifically, in the prior art, the laser chip in the tosa 202 and the optical receiver chip 201 in the rosa 204 are arranged side by side at intervals in the width direction of the circuit board, and the gold finger is electrically connected to the tosa 202 or the rosa 204 in the length direction of the circuit board.

And the embodiment of the utility model provides an in, the laser chip in the tosa 202 and the optical receiver chip 201 in the tosa 204 set up side by side at the width direction interval of circuit board 200, realized the obvious setting of staggering at the length direction of circuit board 200, the tosa 202 is located the edge of circuit board promptly, staggers the setting on circuit board 200 surface with the optical receiver chip 201. Since the width of the circuit board 200 is generally small, even if the distance is limited when the circuit board 200 is spaced apart, the circuit board 200 has a large length direction, and the circuit board can be spaced apart within a large range by being staggered.

However, the spacing in the width direction is relatively easy to achieve, and the offset in the length direction can present technical difficulties in the placement of the optical module assemblies and in the design of the circuit board. Specifically, the light receiving chip 201 extends from the edge of the circuit board 200 to the middle area of the circuit board 200, and the optical components associated with the light receiving chip 201 all move to the middle area of the circuit board, and such optical components extend into the middle area of the circuit board and conflict with the original circuit design and shape position of the circuit board, and the existing circuit board cannot easily achieve compatibility with the above changes, and further improvement is needed, and such improvement requires creative labor.

Fig. 4 is a schematic view of a partial structure of an optical module according to an embodiment of the present invention; fig. 5 is a partially enlarged view of a portion a in fig. 4. To this end, as shown in fig. 4 and 5, an optical module provided by an embodiment of the present invention includes a circuit board 200, a light emission sub-module 202 located at an edge of the circuit board 200, a light receiving chip 201 located on a middle surface of the circuit board 200, an Arrayed Waveguide Grating chip 205 (AWG), a coupler 206 and an optical fiber 203, wherein one end of the coupler 206 is connected to the optical fiber 203, and the other end is connected to the Arrayed Waveguide Grating chip 205. External single-beam multi-wavelength light sequentially passes through the optical fiber 203 and the coupler 206 and is transmitted into the arrayed waveguide grating chip 205, the arrayed waveguide grating chip 205 decomposes the single-beam multi-wavelength light into multiple paths of single-beam single-wavelength light, and the tail end of the arrayed waveguide grating chip 205 is in an inclined plane shape, so that the propagation direction of the multiple paths of single-beam single-wavelength light is changed, and the light is propagated to the surface of the light receiving chip 201.

The coupler 206 realizes the connection between the arrayed waveguide grating chip 205 and the optical fiber 203, and the coupler 206 is used because the optical fiber 203 is made of a soft material, the arrayed waveguide grating chip 205 is made of a hard material, and the connection between the optical fiber 203 and the arrayed waveguide grating chip 205 needs to be excessive. Specifically, coupler 206 may be a capillary tube.

The light receiving chip 201 is located on the surface of the circuit board 200, the light receiving surface/photosensitive surface of the light receiving chip faces to the upper side of the circuit board 200, a protective cover is arranged above the light receiving chip, and single-path multi-wavelength light sequentially propagates from the optical fiber 203 to the coupler 206 and the arrayed waveguide grating chip 205. When light is in the optical fiber 203 and the coupler 206, the propagation position of the light is located at the center of the optical fiber 203 and the center of the coupler 206; when light propagates in the arrayed waveguide grating chip 205, the propagation position of the light is located below the arrayed waveguide grating chip 205, and the propagation position is relatively close to the surface of the circuit board 200 and the photosensitive surface of the light receiving chip 201. The light is reflected at the end face 2051 inclined at the end of the array of the arrayed waveguide grating chip 205 toward the photosensitive surface of the light receiving chip 201.

Unlike an optical fiber and a coupler, in the arrayed waveguide grating chip 205, light propagates in a position close to the lower surface of the chip, that is, light does not propagate in the center of the chip. In the optical fiber, light propagates along the center of the optical fiber, and specifically, the optical fiber is divided into an inner core layer and an outer cladding layer, and the light propagates along the center of the core layer; in the coupler 206, the light also propagates along the central position of the coupler 206 shape.

In the arrayed waveguide grating chip 205, due to the chip generation process, the substrate thickness of the chip is much greater than the thickness of the grating layer, and light passes through the grating layer, so that the position of the arrayed waveguide grating chip 205 receiving light is located on the lower side of the whole arrayed waveguide grating chip, rather than the central position. After the product is assembled, the position of the array waveguide grating chip 205 is shifted closer to the surface of the circuit board 200 and the surface of the light receiving chip 201.

When light propagates in the arrayed waveguide grating chip 205, light is reflected at the end face 2051 of the tip and is directed downward toward the photosensitive surface of the light-receiving chip 201. However, in the reflection process, a part of the light may return to the coupler 206 according to the original optical path after being reflected, and the reflected light enters the coupler 206 again, which may affect the transmission of the original light, and further affect the receiving performance of the rosa. Therefore, the embodiment of the present invention provides an optical module, which is an optical receive sub-module, and is configured to tilt the optical receive sub-module, i.e. lift up the end of the arrayed waveguide grating chip 205, so that the arrayed waveguide grating chip 205 and the circuit board 200 form an angle.

Fig. 6 is a schematic view of a partially exploded structure of an optical module according to an embodiment of the present invention; fig. 7 is a partial side view of an optical module according to an embodiment of the present invention. Specifically, to realize the inclination of the arrayed waveguide grating chip 205, as shown in fig. 6 and 7, in this embodiment, a glue layer 300 having an inclined surface 301 is disposed at the bottom of the arrayed waveguide grating chip 205, and the glue layer 300 is fixed between the arrayed waveguide grating chip 205 and the circuit board 200, so that an included angle is formed between the arrayed waveguide grating chip 205 and the circuit board 200.

To tilt the arrayed waveguide grating chip 205, the glue layer 300 is poured into a wedge-shaped structure with one thick end and one thin end. A wedge-shaped glue layer 300 is disposed at the bottom of the arrayed waveguide grating chip 205 such that one end of the arrayed waveguide grating chip 205 is close to the circuit board 200 and the other end is lifted away from the circuit board 200.

Since the light is transmitted in the arrayed waveguide grating chip 205, after the light hits the inclined end face 2051 of the arrayed waveguide grating chip 205, most of the light is reflected downward and enters the light receiving chip 201, and a small part of the light returns along the original optical path. After the arrayed waveguide grating chip 205 is tilted, the return path of the reflected light is no longer the original optical path, but a new path, so that the reflected light can be prevented from returning to the coupler 206 along the original optical path.

In order to change the return path of the reflected light and ensure the installation position of the relevant components of the rosa 204, in this embodiment, the end of the awg chip 205 near the coupler 206 is lifted, so that the cross-sectional area of the glue layer 300 is gradually reduced from the coupler 206 to the rosa 201, such that the end of the awg chip 205 near the coupler 206 is thicker and the end near the rosa 201 is thinner.

In order to make the awg 205 gradually incline downward from the coupler 206 to the light-receiving chip 201, it is necessary to connect the inclined surface 301 to the bottom of the awg 205, that is, the bottom of the awg 205 contacts the inclined surface 301 of the glue layer 300, while the bottom surface 302 of the glue layer 300 contacts the circuit board 200, and the bottom surface 302 is horizontal, that is, the bottom surface 302 is parallel to the upper surface of the circuit board 200.

Fig. 8 is a side view of a glue layer provided by an embodiment of the present invention. As shown in fig. 8, a distance H1 between one end of the inclined surface 301 close to the coupler 206 and the circuit board 200 is greater than a distance H2 between one end of the inclined surface 301 close to the light-receiving chip 201 and the circuit board 200 to ensure that the inclined direction of the inclined surface 301 is gradually inclined downward from the coupler 206 to the light-receiving chip 201, so that one end of the arrayed waveguide grating chip 205 close to the coupler 206 is lifted.

Since the coupler 206 is fixed at one end of the arrayed waveguide grating chip 205, after the arrayed waveguide grating chip 205 is set in an inclined state, the coupler 206 is also in an inclined state, so that the distance between the coupler 206 and the circuit board 200 gradually increases from the arrayed waveguide grating chip 205 to the optical fiber 203.

In order to avoid the influence on the injection of the optical signal from the optical fiber 203, in this embodiment, the inclination angle of the arrayed waveguide grating chip 205 is not too large, and therefore, the inclination angle of the arrayed waveguide grating chip 205, that is, the angle α between the arrayed waveguide grating chip 205 and the circuit board 200, is set to be 2 ° ± 0.5 °, or the angle α is set to be 2 ° ± 1 °.

In the optical module provided by this embodiment, the glue layer 300 with a wedge-shaped structure is disposed between the arrayed waveguide grating chip 205 and the circuit board 200, so that the arrayed waveguide grating chip 205 is in an inclined state, and an optical signal is transmitted in the arrayed waveguide grating chip 205 and reflected after being irradiated on the inclined end surface 2051, which can prevent the reflected light from returning into the coupler 206.

In order to ensure that the transmission of the optical signal is not affected after the arrayed waveguide grating chip 205 is set in the tilted state, it is necessary to ensure that the height of the arrayed waveguide grating chip 205 is adapted to the entrance height of the optical signal into the optical fiber 203. In this embodiment, the height adjustment of the glue layer 300 is realized by the adjustment plate 400.

Fig. 9 is a partially enlarged view of a portion B in fig. 7. As shown in fig. 7 and 9, an embodiment of the present invention provides an optical module, in which an adjusting plate 400 is disposed between a glue layer 300 and a circuit board 200, an upper surface of the adjusting plate 400 is connected to a bottom surface 302 of the glue layer 300, and a lower surface of the adjusting plate 400 is connected to the circuit board 200.

The adjusting plate 400 may be a flat plate, that is, the adjusting plate 400 has a linear structure, and the adjusting plate 400 is used to adjust the thickness of the glue layer 300. The adjustment plate 400 is in contact with the glue layer 300, and the shape of the glue layer 300 can be changed since the glue layer 300 is formed by pouring glue. When the height adjustment is needed, the adjusting plate 400 is embedded in the glue layer 300 to adjust the height of the arrayed waveguide grating chip 205, so as to ensure the normal transmission of the optical signal.

The material of the adjusting plate 400 is aluminum nitride ceramic, so that the adjusting plate 400 can adjust the three-temperature characteristics of the glue layer 300, namely the high-temperature characteristic, the normal-temperature characteristic and the low-temperature characteristic, while adjusting the thickness of the glue layer 300, thereby ensuring that the glue layer 300 can stably support the arrayed waveguide grating chip 205 and avoiding the arrayed waveguide grating chip 205 from shaking to affect the transmission of optical signals.

It can be seen that the adjusting plate 400 provided in this embodiment can stabilize the tilt state of the glue layer 300, and further ensure that the glue layer 300 can support the arrayed waveguide grating chip 205 to assume a tilt state. The adjusting plate 400 is a linear structure, so that the installation angle of the glue layer 300 is not changed while the thickness of the glue layer 300 is adjusted, and the inclination angle of the arrayed waveguide grating chip 205 is not changed, so that the optical signal transmission in the arrayed waveguide grating chip 205 is stable. That is, a small portion of reflected light generated after the optical signal irradiates the inclined end face 2051 of the arrayed waveguide grating chip 205 can be transmitted along a new path all the time without returning to the coupler along the original optical path, so as to ensure the light receiving performance of the light receiving sub-module.

Because the junction surface of the coupler 206 and the arrayed waveguide grating chip 205 is an inclined surface, the inclined surface can change the reflection direction of light, and the light path passing through the junction surface is prevented from being reflected back into the coupler 206. And the joint surface of the coupler 206 and the optical fiber 203 is also an inclined surface, so that the light original path passing through the joint surface can be further prevented from being reflected back to the optical fiber 203, and the light receiving performance of the light receiving submodule is prevented from being influenced.

Fig. 10 is a schematic structural diagram of an arrayed waveguide grating chip according to an embodiment of the present invention. As shown in fig. 10, the arrayed waveguide grating chip 205 is manufactured by growing and etching processes step by step, and the substrate is the basis of the growth and etching of the chip, so the substrate 401 of the chip has a larger thickness, and the grating layer 402 of the chip has a relatively smaller thickness, and light passes through the grating layer 402 of the chip, so that the light is not transmitted through the central position of the arrayed waveguide grating chip 205 as a whole. In an actual product, in order to make the light exit position of the arrayed waveguide grating chip 205 as close as possible to the surface of the light receiving chip 201, the arrayed waveguide grating chip 205 is used upside down on the basis of the position shown in fig. 10, so that the grating layer 402 of the arrayed waveguide grating chip 205 faces the circuit board 200, the substrate 401 faces away from the circuit board 200, and the substrate 401 of the arrayed waveguide grating is far away from the circuit board 200 relative to the grating layer 402.

As shown in fig. 9, in the assembled optical module structure, since the grating layer 402 of the arrayed waveguide grating chip 205 is relatively close to the light receiving chip 201, light propagates along the lower layer in the arrayed waveguide grating chip 205, and after being reflected by the inclined end face 2051, the light propagates along the lower surface of the arrayed waveguide grating chip 205, i.e., toward the surface of the circuit board 200, and finally toward the surface/photosensitive surface of the light receiving chip 301. The optical signal is represented by the dashed line with arrows in fig. 9.

According to the above technical solution, the embodiment of the utility model provides an optical module, include: the optical transmitter sub-assembly 202, the optical receiver chip 201, the arrayed waveguide grating chip 205, the coupler 206, the optical fiber 203 and the circuit board 200. The tosa 202 is located at the edge of the circuit board 200, and the tosa 202 and the photoreceiving chip 201 are arranged on the surface of the circuit board 200 in a staggered manner, so that the photoreceiving chip 201 is located at a non-edge position of the circuit board 200, and the position of the photoreceiving submodule component moves, thereby improving the electromagnetic shielding effect; one end of the coupler 206 is connected with the optical fiber 203, the other end is connected with the arrayed waveguide grating chip 205, and the bottom of the arrayed waveguide grating chip 205 is provided with a glue layer 300 with an inclined surface 301, so that an included angle is formed between the arrayed waveguide grating chip 205 and the circuit board 200; the arrayed waveguide grating chip 205 is in an inclined state, so that after an optical signal irradiates on the inclined end face 2051 of the arrayed waveguide grating chip 205, most of the light is reflected to the photosensitive surface of the light receiving chip 201, and the rest of the reflected light cannot return to the coupler 206 along the original light path, thereby ensuring the light receiving performance of the light receiving sub-module.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A light module, comprising: the optical transceiver comprises a light emission sub-module, a light receiving chip, an array waveguide grating chip, a coupler, an optical fiber and a circuit board;

2. The optical module of claim 1, wherein a cross-sectional area of the glue layer gradually decreases from the coupler to the light-receiving chip.

3. The optical module of claim 1, wherein a distance between an end of the inclined surface near the coupler and the circuit board is greater than a distance between an end of the optical receiver chip and the circuit board, and the inclined surface is connected to the bottom of the arrayed waveguide grating chip.

4. The optical module of claim 1, wherein the included angle between the arrayed waveguide grating chip and the circuit board is 2 ° ± 0.5 °.

5. The optical module according to claim 1, wherein an adjustment plate is disposed between the glue layer and the circuit board, an upper surface of the adjustment plate is connected to a bottom surface of the glue layer, and a lower surface of the adjustment plate is connected to the circuit board.

6. The optical module of claim 5, wherein the adjustment plate is a linear structure, and the adjustment plate is used for adjusting the thickness of the glue layer.

7. The optical module according to claim 5, wherein the adjusting plate is made of aluminum nitride ceramic.