CN110376691A - A kind of optical module - Google Patents

A kind of optical module Download PDF

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Publication number
CN110376691A
CN110376691A CN201910824700.5A CN201910824700A CN110376691A CN 110376691 A CN110376691 A CN 110376691A CN 201910824700 A CN201910824700 A CN 201910824700A CN 110376691 A CN110376691 A CN 110376691A
Authority
CN
China
Prior art keywords
light
optical
filter plate
tec
fiber adapter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910824700.5A
Other languages
Chinese (zh)
Inventor
董本正
葛建平
谢一帆
傅钦豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN201910824700.5A priority Critical patent/CN110376691A/en
Publication of CN110376691A publication Critical patent/CN110376691A/en
Priority to PCT/CN2020/093298 priority patent/WO2021042775A1/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide

Abstract

Thermal insulation board is equipped with the invention discloses a kind of optical module, in shell shell is separated into light emitting cavity and light-receiving cavity；Shell is equipped with the fiber adapter being connected to light emitting cavity.In light emitting cavity, the light-emitting window of laser chip and the light inlet of fiber adapter are corresponding, and the light that laser chip issues projects after entering fiber adapter.In optical receiver cavity body, optical signal from fiber adapter reflects after being radiated at the first filter plate, the reflected light of formation passes through light port directive reflector plate, is reflected towards the second filter plate again through reflector plate, is reflected by the light of the second filter plate by reflecting the direction towards light-receiving chip.As it can be seen that optical module provided by the invention, light emitting devices and light receiving element are encapsulated in the same shell, and the two shares a fiber adapter, form the optical module of single fiber bi-directional, it is ensured that optical device couples angle with the optical path of fiber adapter respectively, keeps coupling effect good.

Description

A kind of optical module
Technical field
The present invention relates to technical field of optical fiber communication more particularly to a kind of optical modules.
Background technique
Due to higher and higher to the requirement of communication bandwidth in fiber optic communication field, fly so that global optic communication is in one Fast developing period.And in high-speed data communication field, in order to ensure data can long range high-speed transfer, this field is usually adopted The transmitting and reception of different wavelengths of light are realized with optical module.
Existing optical module is often referred to the integration module for photoelectric conversion, is fitted by light receiving element and corresponding optical fiber Orchestration is packaged into optical receiver module, is packaged into optical transmitter module by light emitting devices and corresponding fiber adapter, then light is connect Module, optical transmitter module and circuit board is received to be packaged.In signal conversion process, optical receiver module is by corresponding light After fine adapter receives optical signal, electric signal can be converted optical signals into, then electric signal transmission to light is sent out by circuit board Penetrate module；Optical transmitter module can convert the electrical signal to optical signal after receiving electric signal, then by corresponding with optical transmitter module Fiber adapter project, to realize the conversion of photosignal.
It is respectively that light emitting devices and light receiving element are equipped with corresponding fiber adapter in existing optical module, is formed double Fine two-way optical module.The two-way optical module of double-fiber can carry out parallel signal transmission, and therefore, it is necessary to optical device (light emitting devices And light receiving element) with corresponding fiber adapter form preferable optical path coupling angle.But due to the volume of fiber adapter Larger, optical module is two fiber adapter of adaptation, easily leads to and generates gap between optical device and optical module shell, so that light device Part can not precise positioning, and then influence the optical path coupling angle of optical device and corresponding fiber adapter.
Summary of the invention
The present invention provides a kind of optical modules, to solve the problems, such as that existing optical module coupling effect is poor.
The present invention provides a kind of optical modules, comprising: shell is equipped with thermal insulation board in the shell, and the thermal insulation board is by institute It states shell and is separated into light emitting cavity and light-receiving cavity；One end of the shell is equipped with the light being connected to the light emitting cavity Fine adapter；
Laser chip and the first filter plate are equipped in the light emitting cavity, the optical signal that the laser chip issues penetrates First filter plate projects after entering the fiber adapter；
The thermal insulation board is equipped with light port, be equipped in the optical receiver cavity body reflector plate, the second filter plate, reflecting surface and Light-receiving chip；
It is reflected after lightray propagation from the fiber adapter to first filter plate, the reflected light of formation By reflector plate described in the smooth port directive, it is reflected towards second filter plate again through the reflector plate, passes through described The light of two filter plates is reflected by the direction of the reflection towards the light-receiving chip.
From the above technical scheme, a kind of optical module provided in an embodiment of the present invention, shell is interior equipped with thermal insulation board, heat-insulated Shell is separated into light emitting cavity and light-receiving cavity by plate；One end of shell is equipped with the fiber adapters being connected to light emitting cavity Device.Be equipped with laser chip and the first filter plate in light emitting cavity, the optical signal that laser chip issues through the first filter plate into It is projected after entering fiber adapter.Reflector plate, the second filter plate, reflecting surface and light-receiving chip are equipped in optical receiver cavity body, it is heat-insulated Plate is equipped with light port.It is reflected after lightray propagation from fiber adapter to the first filter plate, the reflected light of formation By light port directive reflector plate, the second filter plate is reflected towards again through reflector plate, by the light of the second filter plate by reflecting surface It is reflected to the direction of light-receiving chip.As it can be seen that optical module provided by the invention, light emitting devices and light receiving element are encapsulated in In the same shell, light emitting devices and light receiving element are separated by thermal insulation board in shell, to avoid two light Device generates hot crosstalk；And the two share a fiber adapter, form the optical module of single fiber bi-directional, it is ensured that optical device with The optical path of fiber adapter couples angle, keeps coupling effect good.
Detailed description of the invention
In order to illustrate more clearly of technical solution of the present invention, letter will be made to attached drawing needed in the embodiment below Singly introduce, it should be apparent that, for those of ordinary skills, without any creative labor, It is also possible to obtain other drawings based on these drawings.
Fig. 1 is optical communication terminal connection relationship diagram；
Fig. 2 is optical network unit structural schematic diagram；
Fig. 3 is the structural schematic diagram of optical module；
Fig. 4 provides optical module decomposition texture schematic diagram for the embodiment of the present invention；
Fig. 5 is the overall structure diagram of optical module provided in an embodiment of the present invention；
Fig. 6 is the decomposition texture schematic diagram of optical module provided in an embodiment of the present invention；
Fig. 7 is the schematic diagram of internal structure of optical module provided in an embodiment of the present invention；
Fig. 8 is the schematic diagram of internal structure of another angle of optical module provided in an embodiment of the present invention；
Fig. 9 is the schematic diagram of internal structure of light emitting cavity provided in an embodiment of the present invention；
Figure 10 is the schematic diagram of internal structure of another angle of light emitting cavity provided in an embodiment of the present invention；
Figure 11 is the schematic diagram of internal structure of light-receiving cavity provided in an embodiment of the present invention；
Figure 12 is the partial top view for the optical module that further embodiment of this invention provides；
Figure 13 is the structural schematic diagram of triangular prism and third filter plate that further embodiment of this invention provides；
Figure 14 is the index path on triangular prism and third filter plate that further embodiment of this invention provides；
Figure 15 is the structural schematic diagram of reflecting surface provided in an embodiment of the present invention；
Figure 16 is the optical device structural schematic diagram of light-receiving cavity provided in an embodiment of the present invention；
Figure 17 is the decomposition texture schematic diagram of light-receiving cavity provided in an embodiment of the present invention；
Figure 18 is the structural schematic diagram of the 2nd TEC component provided in an embodiment of the present invention；
Figure 19 is the structural schematic diagram of another angle of the 2nd TEC component provided in an embodiment of the present invention；
Figure 20 is the structural schematic diagram of the first TEC component provided in an embodiment of the present invention.
Specific embodiment
The core link of fiber optic communication first is that the conversion of photosignal.Fiber optic communication is existed using the optical signal for carrying information It is transmitted in optical fiber/optical waveguide, low cost may be implemented using the passive transmission characteristic of light in a fiber, low-loss information passes It is defeated.And the information processing equipments such as computer are using electric signal, this just need to realize in signals transmission electric signal with The mutual conversion of optical signal.
Optical module realizes above-mentioned photoelectric converting function in technical field of optical fiber communication, and optical signal and the mutual of electric signal turn Change be optical module core function.Optical module realizes being electrically connected between external host computer by the golden finger on circuit board, Main electrical connection includes power supply, I2C signal, transmission data-signal and ground connection etc., and the electric connection mode that golden finger is realized is Through becoming the standard mode of optical module industry, based on this, circuit board is technical characteristic indispensable in most of optical module.
Fig. 1 is optical communication terminal connection relationship diagram.As shown in Figure 1, the connection of optical communication terminal mainly includes light net Network unit 100, optical module 200, optical fiber 101 and cable 103；One end connection remote server of optical fiber 101, the one of cable 103 End connection local information processing equipment, the connection of local information processing equipment and remote server is by optical fiber 101 and cable 103 Connection is completed；And the connection between optical fiber 101 and cable 103 is completed by the optical network unit 100 with optical module.
The optical port of optical module 200 is connect with optical fiber 101, is established two-way optical signal with optical fiber 101 and is connect；Optical module 200 Power port access optical network unit 100 in, establish two-way electric signal with optical network unit 100 and connect；Optical module 200 realizes light The mutual conversion of signal and electric signal establishes connection between optical fiber 101 and optical network unit 100 to realize.Specifically, come It is input in optical network unit 100 after being converted to electric signal from the optical signals optical module 200 of optical fiber 101, comes from optical-fiber network list The electric signal of member 100 is converted to optical signal by optical module 200 and is input in optical fiber 101.Optical module 200 is to realize photosignal phase The tool mutually converted, the function without processing data, in above-mentioned photoelectric conversion process, information does not change.
There is optical network unit 100 optical module interface 102 to establish with optical module 200 two-way for accessing optical module 200 Electric signal connection；There is optical network unit 100 cable interface 104 to establish with cable 103 two-way for accessing cable 103 Electric signal connection；Connection is established by optical network unit 100 between optical module 200 and cable 103.Specifically, optical network unit Signal from optical module 200 is passed to cable 103 by 100, and the signal from cable 103 is passed to optical module 200, light net Work of the network unit 100 as the ipc monitor optical module 200 of optical module 200.
So far, remote server is by optical fiber 101, optical module 200, optical network unit 100 and cable 103, with local letter Two-way signal transmission channels are established between breath processing equipment.
Common information processing equipment includes router, interchanger, electronic computer etc.；Optical network unit 100 is optical mode The host computer of block 200 provides data-signal to optical module 200, and receives the data-signal from optical module 200, common light There are also optical line terminals etc. for module host computer.
Fig. 2 is optical network unit structural schematic diagram.As shown in Fig. 2, there is circuit board 105 in optical network unit 100, Cage 106 is arranged in the surface of circuit board 105；It is provided with electric connector in cage 106, for accessing the optical modules such as golden finger electricity Mouthful；Radiator 107 is provided on cage 106, radiator 107 has the bulge-structures such as the fin of increasing heat radiation area.
Optical module 200 is inserted into optical network unit 100, specially being electrically connected in the power port insertion cage 106 of optical module 200 Device is connect, the optical port of optical module 200 is connect with optical fiber 101.
Cage 106 is located on circuit board 105, and the electric connector on circuit board 105 is wrapped in cage 106；Optical module In 200 insertion cages 106, by the fixed optical module 200 of cage 106, the heat that optical module 200 generates is conducted by optical module shell To cage 106, it is diffused eventually by the radiator 107 on cage 106.
Fig. 3 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention, and Fig. 4 provides optical mode for the embodiment of the present invention Block decomposition texture schematic diagram.As shown in Figure 3, Figure 4, optical module 200 provided in an embodiment of the present invention includes upper housing 201, lower casing Body 202, release lever 203, circuit board 300 and optical transceiving device 400.
Upper housing 201 and lower case 202 form tool there are two the package cavity being open, and specifically can be unidirectional Both ends open (204,205) is also possible to be open at two in different directions；One of opening is power port 204, for inserting Enter in the host computers such as optical network unit, another opening is optical port 205, is accessed for external fiber to connect internal optical fiber, electricity The photoelectric devices such as road plate 300, optical transceiving device 400 are located in package cavity.
Upper housing and lower case generally use metal material, are conducive to realize electromagnetic shielding and heat dissipation；Using upper housing, under The shell of optical module will not be generally made by the assembly method that shell combines convenient for the devices such as circuit board are installed in shell Integral structure, in this way in devices such as wiring harness plates, positioning element, heat dissipation and electromagnetic armouring structure can not be installed, also not Conducive to production automation.
Release lever 203 is located at the outer wall of package cavity/lower case 202, pulls the end of release lever that can make to solve Handle is locked to relatively move in outer wall surface；Optical module is fixed on the cage of host computer by optical module by release lever when being inserted into host computer In son, by pulling release lever to release the snap-fit relationship of optical module and host computer, so as to by optical module from host computer Cage in extract out.
Existing optical module is usually packaged into optical receiver module, You Guangfa by light receiving element and corresponding fiber adapter Emitter part and corresponding fiber adapter are packaged into optical transmitter module, then by optical receiver module, optical transmitter module and circuit board into Row encapsulates.And respectively light emitting devices and light receiving element are equipped with corresponding fiber adapter, and it is two-way to form double-fiber Optical module.The two-way optical module of double-fiber can carry out parallel signal transmission, and therefore, it is necessary to optical device (light emitting devices and light-receivings Device) with corresponding fiber adapter form preferable optical path coupling angle.But since the volume of fiber adapter is larger, optical mode Block is two fiber adapter of adaptation, easily leads to and generates gap between optical device and optical module shell, so that optical device can not essence Certainly position, and then influence optical device and couple angle with the optical path of corresponding fiber adapter.For improve optical module coupling effect, The embodiment of the present invention provides a kind of optical module, has the characteristics that single fiber bi-directional, coupling effect are more preferable.
Fig. 5 is the overall structure diagram of optical transceiving device provided in an embodiment of the present invention；Fig. 6 mentions for the embodiment of the present invention The decomposition texture schematic diagram of the optical transceiving device of confession.
A kind of optical module provided in an embodiment of the present invention, specially Fig. 5 and optical transceiving device shown in fig. 6, comprising: shell 1, shell 1 is made of cover board 110 and cavity 120, and cover board 110, which is fastened on cavity 120, constitutes closed cavity, is held in cavity Light emitting devices 6 and light receiving element 8.Optical module provided in an embodiment of the present invention has the characteristics that single fiber bi-directional, therefore by light Ballistic device 6 and light receiving element 8 are encapsulated in the same cavity, and a fiber adapter 2 is connected on shell 1, by light Fine adapter 2 realizes receiving and sending for optical signal simultaneously.
In optical module work, since the heat that light emitting devices 6 generates can be diffused into area locating for light receiving element 8 Domain, so that light emitting devices 6 and light receiving element 8 are also easy to produce hot crosstalk phenomenon, so that influencing light receiving element is utilizing TEC group Part temperature control screens the effect of optical signal, influences wavelength Adjustment precision.
Therefore, to avoid generating hot crosstalk between light emitting devices 6 and light receiving element 8, light shown in Figure 7 is received and dispatched The schematic diagram of internal structure of device, optical module provided in an embodiment of the present invention are equipped with thermal insulation board 5 in shell 1, and thermal insulation board 5 is set Set and be arranged in shell 1 and shell 1 is separated into two regions so that thermal insulation board 5 and shell 1 formed light emitting cavity 101 and Light-receiving cavity 102.Light emitting devices 6 is placed in light emitting cavity 101, light receiving element 8 is placed in optical receiver cavity In body 102.
In the present embodiment, fiber adapter 2 is arranged at the corresponding shell of light emitting cavity 101, i.e., by fiber adapters Device 2 is connected to light emitting cavity 101.The position that shell 1 installs fiber adapter 2 is equipped with through-hole 14, to guarantee fiber adapter 2 Fixing-stable, shell 1 further includes hollow shell 130, and shell 130 is fixed on the side wall of cavity 120, shell 130 and logical Hole 14 is connected to, and shell 130 is for installing fiber adapter 2, so that the fiber stub 21 of fiber adapter 2 is exposed by through-hole 14, The optical signal that light emitting devices 6 emits is received convenient for fiber stub 21, and, transmitting optical signal is received by light receiving element 8.This In embodiment, shell 130 can be integrally formed with cavity 120.
The light-emitting window of light emitting devices 6 in light emitting cavity 101 is corresponding with the light inlet of fiber adapter 2, so that light The light that ballistic device 6 issues is able to enter in fiber adapter 2, and fiber stub 21 is equipped in fiber adapter 2, is inserted by optical fiber Core 21 goes out the light emission that the light emitting devices 6 received issues.In signal conversion process, light emitting devices 6 is receiving electricity After signal, optical signal sending can be converted the electrical signal to, is projected after entering back into fiber adapter 2 corresponding with light emitting devices 6.
In order to which sun adjuster part (light emitting devices 6 and light receiving element 8) is powered, optical module provided in this embodiment, Respectively light emitting devices 6 and light receiving element 8 configure corresponding flexible circuit board, i.e., are equipped with first in one end of shell 1 Flexible circuit board 3 and the second flexible circuit board 4.Two flexible circuit boards and fiber adapter 2 are mounted on the not ipsilateral of shell 1 On, one end lateral wall opposite with the installation site of fiber adapter 2 of shell opens up flexible board mounting groove 13, by the first flexibility Circuit board 3 and the second flexible circuit board 4 are fixed in flexible board mounting groove 13.
Light emitting devices 6 is equipped in light emitting cavity 101, the first flexible circuit board 3 extends in light emitting cavity 101, First flexible circuit board 3 is electrically connected with light emitting devices 6.First flexible circuit board 3 is that telecommunications is powered and provided to light emitting devices 6 Number, light emitting devices 6 projects after the electric signal received is converted to optical signal.Optical receiver is equipped in light-receiving cavity 102 Part 8, the second flexible circuit board 4 extend in light-receiving cavity 102, and the second flexible circuit board 4 is electrically connected with light receiving element 8, Light receiving element 8 is transmitted to the second flexible circuit board 4 after receiving the optical signal from fiber adapter 2 and forms electric signal.
Optical module provided in this embodiment is the optical module of single fiber bi-directional, and light emitting devices 6 and light receiving element 8 share one A fiber adapter 2 carries out receiving and sending for optical signal by fiber adapter 2 simultaneously.For the reception for realizing optical signal, light The light-emitting window of ballistic device 6 is corresponding with the light inlet of fiber adapter 2, and the light that light emitting devices 6 issues enters light by light inlet It is projected after fine adapter 2.
Since light emitting devices 6 and light receiving element 8 are encapsulated in the same cavity, fiber adapter 2 and optical transmitting set Part 6 is correspondingly arranged, and the optical signal from fiber adapter 2 can be propagated first in light emitting cavity 101, and light receiving element 8 In the side of light emitting devices 6, the light-emitting window of fiber adapter 2 can not be corresponding with the light inlet of light receiving element 8, so that coming from The optical signal of fiber adapter 2 can not be received by light receiving element 8.Therefore, it is come to enable light receiving element 8 to receive The optical signal of fiber adapter 2 needs the optical signal in light emitting cavity 101 reflecting into light-receiving cavity 102, and then by light Receiving device 8 receives.
And be to avoid generating hot crosstalk between light emitting devices 6 and light receiving element 8, in light emitting devices 6 and light-receiving Thermal insulation board 5 is equipped between device 8.So when reflecting into the optical signal in light emitting cavity 101 in light-receiving cavity 102, The optical signal is needed to pass through thermal insulation board 5, therefore, optical module provided in this embodiment is equipped with light port 51 on thermal insulation board 5.
Since fiber stub 21 comes from light towards light emitting devices 6, and not towards light receiving element 8 in fiber adapter 2 The optical signal of fine adapter 2 can be propagated first in light emitting cavity 101, for make light receiving element 8 by light port 51 receive come From the optical signal of fiber adapter 2, the structural schematic diagram of another angle of optical module as shown in Figure 8, in light emitting cavity 101 Interior equipped with the first filter plate 88 being obliquely installed, the first filter plate 88 is located at light port 51, and is located at close to light emitting devices 6 Side, the inclined direction of the first filter plate 88 is along fiber adapter 2 to the direction of light emitting devices 6.By the first filter plate 88, which are arranged in fiber adapter 2, is transmitted through on the propagation path of the optical signal come, enables the optical signal from fiber adapter 2 It is radiated on the first filter plate 88 being obliquely installed, to generate reflection.
Optical signal from fiber adapter 2 can be traveled to when propagating to the direction of light emitting devices 6 positioned at light emitting On the first filter plate 88 between device 6 and fiber adapter 2, reflection, the reflected light of formation are generated on the first filter plate 88 Enter in light-receiving cavity 102 by light port 51, and injects in light receiving element 8.
As it can be seen that optical module provided in an embodiment of the present invention, the design feature with single fiber bi-directional, by a fiber adapter The transmitting and reception of 2 Parallel Implementation optical signals, i.e. light emitting devices 6 and light receiving element 8 are encapsulated in the same shell 1, by The same fiber adapter 2 receives the optical signal that light emitting devices 6 emits, and emits optical signal simultaneously and connect by light receiving element 8 It receives, realizes the conversion of photosignal, improve coupling effect.
The design feature of the optical module provided for the embodiment of the present invention will be further explained and the beneficial effect that can be obtained, are pressed The propagation path of irradiation signal, the introduction distinguished with light emitting cavity 101 and light-receiving cavity 102.
Fig. 9 is the schematic diagram of internal structure of light emitting cavity provided in an embodiment of the present invention；Figure 10 is the embodiment of the present invention The schematic diagram of internal structure of another angle of the light emitting cavity of offer.
Referring to Fig. 9 and Figure 10, optical module provided in an embodiment of the present invention, in light emitting cavity 101, light emitting devices 6 Including laser chip 61, convergent lens 63, optoisolator 64 and unified platform 65.Laser chip 61 according to electric signal for sending out Optical signals；Convergent lens 63 is used to the optical signal of dispersion being converged to directional light, avoids light loss occur when long distance transmission； Optoisolator 64 is to allow light to a direction by preventing the passive device passed through round about, for the propagation to light Direction is limited, make light can only one direction transmission, by the light of optical fiber echo reflection can by optoisolator 64 well every From raising light wave transmissions efficiency；Unified platform 65 is used as firm banking, for fixing other light emitting devices, such as optical isolation Device 64, condenser lens 80 and first filter plate 88 etc., to adjust the height of light emitting devices, so that light emitting devices 6 goes out light Mouth can be corresponding with the light inlet of fiber adapter 2, improves optical coupling effect.
In light emitting cavity 101, the propagation path of optical signal is that laser chip 61 generates optical signal, into fiber adapters It is projected after in the fiber stub 21 of device 2.Since the optical signal that laser chip 61 generates is polarised light, when to avoid long distance transmission Light loss is generated, convergent lens 63 is set up in the sender of optical signal, is issued laser chip 61 by convergent lens 63 Optical signal becomes directional light, continues to propagate to the direction of fiber adapter 2.
And be avoid optical signal enter fiber stub 21 after there is part light to reflect again, and according to former propagation path into Enter laser chip 61, influence the performance of laser chip 61, in the present embodiment, is set between convergent lens 63 and fiber adapter 2 Optoisolator 64 is set, convergent lens 63 is set between laser chip 61 and optoisolator 64.After optical signal enters optoisolator 64, It is projected again after the polarization direction of light rotates, the optical signal of injection enters in the fiber stub 21 of fiber adapter 2.
If optical signal generates reflection at fiber stub 21, reflected light is irradiated to optoisolator along former propagation path again 64 light-emitting window, but since the polarization direction of optical signal changes, reflected light can not enter light according still further to former propagation path In isolator 64, it can thus be avoided reflected light enters in laser chip 61 again by optoisolator 64, avoid influencing laser The luminescent properties of chip 61.
For the height in optic path for precisely adjusting light emitting devices, so that the light-emitting window and optical fiber of light emitting devices The light inlet of adapter 2 is corresponding, in the present embodiment, optoisolator 64 is fixed on the side wall of unified platform 65, integration The light passing path being connected to the light-emitting window of optoisolator 64 is equipped in platform 65, the light-emitting window in light passing path in unified platform 65 It is corresponding with the light inlet of fiber adapter 2.Light passing path for realizing by optoisolator 64 optical signal propagation, by light passing The optical signal that path is projected can enter in fiber adapter.
Therefore, in light emitting cavity 101, the path as shown in the dotted arrow in Figure 10, the propagation path of optical signal are as follows: For the light that laser chip 61 issues after the convergence of convergent lens 63, the directional light of formation enters light passing path by optoisolator 64 After project, projected after the fiber stub 21 that the emergent light of formation enters in fiber adapter 2.
In the present embodiment, optoisolator 64 is fixed by unified platform 65, and laser chip 61 and convergent lens 63 Then it is fixed by the first ceramic substrate 60.For this purpose, light emitting devices 6 further includes the first ceramic substrate 60, and, it is located at first The first conductive metal layer 62 and optical detector 66 on ceramic substrate 60.Unified platform 65 be used for adjust optoisolator 64 Height in optic path, the first ceramic substrate 60 be used to adjust laser chip 61 and convergent lens 63 in optic path Highly, make the optical axis coincidence of the two, and the optical axis weight with fiber stub 21 in the optical axis of optoisolator 64 and fiber adapter 2 It closes, improves optical coupling effect.
The surface of first ceramic substrate 60 is coated with the first conductive metal layer 62, and laser chip 61 is arranged in the first conductive gold Belong on layer 62, laser chip 61 is connect with the positive routing of the first conductive metal layer 62, and the first conductive metal layer 62 is used for sharp Optical chip 61 transmits electric signal.First ceramic substrate 60 is connect by the first conductive metal layer 62 with the first flexible circuit board 3, the The electric signal of one conductive metal layer 62 is then provided by the first flexible circuit board 3.
Optical detector 66 is located at the rear of laser chip 61, and fiber adapter 2 is located at the front of laser chip 61, optical detection The light sensation face of device 66 and the light-emitting window of backward launched optical signal of laser chip 61 are corresponding.The optical signal that laser chip 61 issues In, wherein high power light signal propagates (forward propagate) towards the direction of fiber adapter 2, and small-power optical signal and visits to light Propagate (back-propagation) in the direction for surveying device 66.
The small-power optical signal that laser chip 61 issues is received by optical detector 66, and optical detector 66 is used for laser chip The 61 small-power optical signals issued carry out power monitoring.Optical power into optical detector 66 is generally much smaller than the hair of laser chip 61 The light wave general power penetrated, being normally set up into the power for carrying out power detection in optical detector 66 is the 1/10 of general power.
Above-described embodiment mainly describes the propagation path of the optical signal in light emitting cavity 101, in light emitting cavity 101 Interior, laser chip 61 is fixed on the first ceramic substrate 60, and convergent lens 63 is located on the propagation path of light out of laser chip 61, Optoisolator 64 is fixed on unified platform 65, and the height of laser chip 61, convergent lens 63 and optoisolator 64 may be implemented Degree is precisely adjusted, so that the light-emitting window of laser chip 61 is corresponding with the light inlet of convergent lens 63, the light-emitting window of convergent lens 63 Corresponding with the light inlet of optoisolator 64, the light-emitting window of optoisolator 64 is corresponding with the light inlet of fiber adapter 2, laser chip 61 optical signals issued can all be received by fiber adapter 2, to guarantee optical coupling effect.
In light-receiving cavity 102, light receiving element 8 receive from the optical signal of fiber adapter 2 when, need by The optical signal propagated in light emitting cavity 101 reflects into light-receiving cavity 102.For this purpose, being tilted in the present embodiment using setting The mode of the first filter plate 88 optical signal is reflected into light-receiving cavity 102.
Figure 11 is the schematic diagram of internal structure of light-receiving cavity provided in an embodiment of the present invention, referring to Figure 11, for adjustment the One filter plate 88 in the height in optic path, it is flat in integration in the present embodiment to guarantee the efficiency of optical signal reflection The light-emitting window of platform 65 is equipped with light inclined-plane 650, and light inclined-plane 650 is the surface being obliquely installed out, arrives light emitting along fiber adapter 2 The direction of device 6 tilts.First filter plate 88 is arranged on light inclined-plane 650 out, to guarantee the light letter from fiber adapter 2 Number, reflection can be generated after being irradiated to the first filter plate 88, and reflection direction is towards light-receiving cavity 102.
Optical signal from fiber adapter 2 is diverging light, for raising coupling efficiency, avoids the occurrence of light loss, this reality It applies in example, condenser lens 80 is equipped between the first filter plate 88 and fiber adapter 2.Optical signal from fiber adapter 2 It is radiated on the first filter plate 88 and reflects by condenser lens is after 80s, the reflected light of formation enters light by light port 51 In receiving cavity 102, and inject in light receiving element 8.
Condenser lens 80 is arranged between unified platform 65 and fiber adapter 2, and the light-emitting window of unified platform 65 On light inclined-plane 650 out, at this point, fiber adapter 2 connects in region between unified platform 65 and fiber adapter 2 The path for receiving optical signal is overlapped with the path of outflow optical signal, then fiber adapter 2 is made to receive what laser chip 61 emitted When optical signal, optical signal can also pass through condenser lens 80, and optical signal passes through condenser lens formation directional light after 80s, then injects optical fiber In adapter 2.
Optical signal from fiber adapter 2 continues the side to unified platform 65 after condenser lens 80 is assembled It to propagation, and then is radiated on the first filter plate 88, the light port 51 after the reflection of the first filter plate 88 on thermal insulation board 5 Into in light-receiving cavity 102.
It is equipped with light receiving element 8 in light-receiving cavity 102, light-receiving cavity is reflected by light emitting cavity 101 to receive Optical signal in 102, in the present embodiment, light receiving element 8 includes that optical path changes platform 81.Optical path change platform 81 for realizing The reception of optical signal and change propagation path direction.
To receive the optical signal that the first filter plate 88 reflects back, optical path, which changes, is equipped with darkening path, darkening in platform 81 The light inlet in path is corresponding with light port 51, enters change by the optical signal that light port 51 reflects back by light emitting cavity 101 It is propagated in light path.Light receiving element 8 in light-receiving cavity 102 is arranged along the length direction of light-receiving cavity 102, and enters The direction of propagation of the optical signal of light-receiving cavity 102 is then the length direction perpendicular to light-receiving cavity 102, therefore, into change The optical signal of light path needs to change the direction of propagation to enter in light receiving element 8.
In the present embodiment, reflector plate 82 is equipped on the darkening face 810 that optical path changes platform 81, darkening face 810 is optical path Change be obliquely installed a face for platform 81, darkening face 810 is corresponding with light port 51.The inclined direction in darkening face 810 is edge Fiber adapter 2 is to the direction of light receiving element 8.Reflector plate 82 is set on darkening face 810, so that propagating in darkening path Optical signal generate reflection after being radiated at reflector plate 82, and propagated along the length direction of light-receiving cavity 102.
Figure 12 is the partial top view for the optical module that further embodiment of this invention provides；Figure 13 is further embodiment of this invention The triangular prism of offer and the structural schematic diagram of third filter plate.
In another embodiment, anti-to reduce generation during the turnover of lightray propagation path referring to Figure 12 and Figure 13 It penetrates shadow and rings signal transmission, reduce light return loss, in the present embodiment, platform 81 is no longer changed using optical path, but as replacement, Triangular prism 654 and third filter plate 655, triangular prism 654 and third filter are additionally provided between reflector plate and the first filter plate Wave plate 655 is respectively positioned in light-receiving cavity 102, and triangular prism 654 realizes the reflection of optical signal to change propagation path, third filter The screening of the realization specific wavelength optical signal of wave plate 655.
To enter the optical signal of specific wavelength in light-receiving chip 85, in the lightray propagation from fiber adapter 2 When in entering light receiving cavity 102, the screening of optical signal is realized by third filter plate 655.Third filter plate 655 is positioned close to light The position of port 51, the incidence surface S3 of third filter plate 655 is towards light port 51, and third filter plate 655 is filtered with from first The lightray propagation path orthogonal of wave plate 88 enables and passes through third filter plate through the optical signal of the first filter plate 88 reflection 655。
Third filter plate 655 is arranged on the incidence surface S3 of triangular prism 654, so that the light-emitting surface of third filter plate 655 S2 is overlapped with the incidence surface S3 of triangular prism 654, and the optical signal from the first filter plate 88 enters triangle through third filter plate 655 In prism 654.And in other embodiments, the light-emitting surface S2 of third filter plate 655 and the incidence surface S3 of triangular prism 654 can also It is not overlapped setting, at this time, it may be necessary in the light-emitting surface S2 of third filter plate 655 and the equal plated film of incidence surface S3 of triangular prism 654.
The optional section of triangular prism 654 be isosceles right triangle prism, a right-angle side of triangular prism 654 be into Smooth surface S3, another right-angle side are light-emitting surface S5, and bevel edge is the inclined-plane S4 for realizing optical signal reflection, the inclined-plane of triangular prism 654 Reflector plate is formed on S4 or reflector plate 82 is attached on the inclined-plane S4 of triangular prism 654.
The incidence surface S3 of triangular prism 654 is towards the first filter plate 88, and the light-emitting surface S5 of triangular prism 654 is towards light-receiving Chip 85, so that the optical signal into triangular prism 654 reflects after the reflector plate 82 traveled on inclined-plane S4, reflected light It is projected towards light-emitting surface S5 and enters light-receiving chip 85.
Therefore, the optical signal referring to path shown in arrow in Figure 14, at triangular prism 654 and third filter plate 655 Propagation path are as follows: the optical signal from fiber adapter 2 generates reflection in the first filter plate 88, reflects into third through light port 51 Filter plate 655 enters triangular prism 654 by the filtered optical signals incidence surface S3 of third filter plate 655, in triangular prism Reflection is generated at reflector plate 82 on 654 inclined-plane S4, reflected light projects triangular prism 654 by light-emitting surface S5, to light-receiving core It propagates in the direction of piece 85.
To guarantee that changing platform 81 by optical path to change the optical signal of the direction of propagation is directional light, when avoiding long distance transmission There is light loss, the second filter plate 83 is equipped at the light-emitting window that optical path changes platform 81, at the light-emitting window of the second filter plate 83 Equipped with reflecting surface 84, light-receiving chip 85 is equipped at the light-emitting window of reflecting surface 84.Second filter plate allows the light of specific wavelength logical It crosses, can be changed with the temperature change of the second filter plate by the optical wavelength of the second filter plate.Reflecting surface 84 will pass through Filter treated optical signal of second filter plate 83 receives, and generates instead to the light-receiving chip 85 for being located at 84 lower section of reflecting surface It penetrates, optical signal is received by light-receiving chip 85.
The structural schematic diagram of reflecting surface as shown in figure 15, dotted arrow show lightray propagation road in reflecting surface in figure Diameter.Reflecting surface 84 provided in an embodiment of the present invention for changing optical signal propagation path.Optical signals fiber adapter 2 issues When with certain height, and light-receiving chip 85 it is photosensitive up, i.e., from the lightray propagation path of fiber adapter 2 It is inconsistent with the light-receiving path of light-receiving chip 85, optical signal is received for the ease of light-receiving chip 85, is needed using anti- It penetrates face 84 optical signal of higher propagation is reflected down into light-receiving chip 85.
Wherein, reflecting surface 84 includes incidence surface 841, reflecting slant 842 and light bottom surface 843 out.Incidence surface 841 towards second Filter plate 83, for receiving the optical signal for passing through the second filter plate 83.Reflecting slant 842 is arranged on lightray propagation path, And be obliquely installed, so that the optical signal injected by incidence surface 841 can be reflected down after being radiated at reflecting slant 842.Light out Bottom surface 843 is arranged on reflection path, and light bottom surface 843 is equipped with lens 844 out, is assembled by lens 844 to reflected light.
Light-receiving chip 85 is located at the lower section of light bottom surface 843, the photosurface of light-receiving chip 85 and the light out of lens 844 It is mouthful corresponding so that light-receiving chip 85 can receive by reflecting surface 84 propagate Lai optical signal.
Light-receiving chip 85 needs to filter out different waves by way of temperature control by TEC component when receiving optical signal Long optical signal.Therefore, optical receiver cavity shown in the optical device structural schematic diagram and Figure 17 of light-receiving cavity as shown in figure 16 In optical module provided in this embodiment, the 2nd TEC component 9 is arranged in the decomposition texture schematic diagram of body in light-receiving cavity 102. And the element for carrying out screening different wave length optical signal is the second filter plate 83, then by the 2nd TEC component 9 to the second filter plate 83 carry out temperature controls to screen the optical signal of different wave length.
For the coupling effect for guaranteeing light, dissipating for heat is absorbed when realizing the second filter plate 83 of refrigeration by the 2nd TEC component 9 When hot, also second filter plate 83 is fixed using the 2nd TEC component 9, to adjust the second filter plate 83 in optic path On height, guarantee entering optical axis and capable of being overlapped for each optical device in light-receiving cavity 102, i.e. optical path changes going out for platform 81 Optical port is corresponding with the light inlet of the second filter plate 83, and the light-emitting window of the second filter plate 83 is corresponding with the light inlet of reflecting surface 84, with Improve the optical coupling effect of light-receiving optical signal.
The screening that different wave length is carried out to guarantee the second filter plate 83 to the optical signal that horizontal direction is propagated, by the second filtering Piece 83 is vertically arranged, i.e. the second filter plate 83 perpendicular to shell 1 bottom plate 11, and it is vertical with the transmission path of optical signal. For the temperature for adjusting the second filter plate 83 convenient for the 2nd TEC component 9, the light letter of different wave length is screened in a manner of through temperature control Number, therefore, the second filter plate 83 is arranged on the side wall of the 2nd TEC component 9, and then the 2nd TEC component 9 is needed also to set vertically It sets, i.e., it is edge-on in light-receiving cavity 102, it is vertical with bottom plate 11.
Since the setting of the 2nd TEC component 9 changes between platform 81 and the second filter plate 83 in optical path, that is to say, that optical path Change after the optical signal that platform 81 projects needs to first pass through the 2nd TEC component 9 and enter back into the second filter plate 83, to avoid second TEC component 9 generates optical signal and is lost, and in the present embodiment, light hole is equipped on the 2nd TEC component 9, light hole changes with optical path Flatten platform 81 light-emitting window it is opposite, the second filter plate 83 is attached on light hole.
Specifically, the 2nd TEC component shown in the structural schematic diagram and Figure 19 of the 2nd TEC component as shown in figure 18 is another The structural schematic diagram of one angle, to realize that the second filter plate 83 screens the optical signal of different wave length by way of adjusting temperature, 2nd TEC component 9 includes heat-exchange surface 91 on the 2nd TEC component of edge-on setting, the 2nd TEC modular construction part 92 and the respectively Heat-exchange surface 96 under two TEC components, the 2nd TEC component 9 are arranged on the 2nd TEC unitized substructure 93.
Heat-exchange surface 96 and the 2nd TEC unitized substructure 93 are both needed to be equipped with light admission port under 2nd TEC component, change according in optical path Flatten the light direction of platform 81, and the first light admission port 95 is arranged on the 2nd TEC unitized substructure 93, and hot under the 2nd TEC component The second light admission port 920 is arranged in the corresponding position in exchange face 96, the corresponding position setting of heat-exchange surface 91 the on the 2nd TEC component Three light admission port (not shown)s.When second filter plate 83 is fixed on the 2nd TEC component on heat-exchange surface 91, second need to be made Filter plate 83 is attached in third light admission port, so that the optical signal projected by optical path change platform 81 is continuously across the 2nd TEC It is able to enter the second filter plate 83 after three light admission ports on component 9, second filter plate 83 is carried out convenient for the 2nd TEC component 9 The optical signal of temperature control screening different wave length.
Therefore, in light-receiving cavity 102, path as the dotted line in Figure 11 arrows, the propagation path of optical signal Are as follows: the optical signal from fiber adapter 2 travels on the first filter plate 88 after the convergence of condenser lens 80, and generates anti- It penetrates, reflected light enters in light-receiving cavity 102 by light port 51, by the light in 51 incident light receiving cavity 102 of light port, warp It crosses darkening path to enter in optical path change platform 81, incident light reflects after being radiated at reflector plate 82, and reflected light is successively passed through The first light admission port 95, the second light admission port 920 and third light admission port on 2nd TEC component 9 enter filter plate 83, realize optical signal The screening of different wave length, the optical signal after screening enter reflecting surface 84, shoot down by the reflected light of reflecting surface 84 into light It receives in chip 85.
In the present embodiment, reflector plate 82 is fixed on optical path and changes on platform 81, and is fixed reflection surface 84 and light-receiving core Piece 85 guarantees optical coupling effect to adjust height of the light receiving element in optic path.For this purpose, as shown in figure 16, light-receiving Device 8 further includes the second ceramic substrate 86 and the second conductive metal layer 87, and the second conductive metal is arranged on the second ceramic substrate 86 Layer 87, reflecting surface 84 and light-receiving chip 85.Second ceramic substrate 86 is used for fixed reflection surface 84 and light-receiving chip 85, so that The light-emitting window of reflecting surface 84 is corresponding with the photosurface of light-receiving chip 85, and light-receiving chip 85 can receive the propagation of reflecting surface 84 Optical signal avoids light loss.
Light-receiving chip 85 is connect with the second conductive metal layer 87, and the second ceramic substrate 86 passes through the second conductive metal layer 87 It is connect with the second flexible circuit board 4, the optical signal that light-receiving chip 85 receives is transferred to the by the second conductive metal layer 87 Two flexible circuit boards 4 realize the photoelectric conversion of optical module to convert optical signals to electric signal.
From the above technical scheme, a kind of optical module provided in an embodiment of the present invention, shell 1 are separated by thermal insulation board 5 Form light emitting cavity 101 and light-receiving cavity 102；One end of shell 1 is equipped with the fiber adapters being connected to light emitting cavity 101 Device 2.Laser chip 61 and the first filter plate 88 are equipped in light emitting cavity 101, it is suitable that the light that laser chip 61 issues enters optical fiber It is projected after orchestration 2.Reflector plate 82, the second filter plate 83, reflecting surface 84 and light-receiving chip 85 are equipped in light-receiving cavity 102, Thermal insulation board 5 is equipped with light port 51.It is reflected after lightray propagation from fiber adapter 2 to the first filter plate 88, shape At reflected light pass through 84 directive reflector plate 82 of light port, be reflected towards the second filter plate 83 again through reflector plate 82, pass through second The light of filter plate 83 is reflected from reflecting surface 84 to the direction of light-receiving chip 85.As it can be seen that optical module provided by the invention, light is sent out Emitter part and light receiving element are encapsulated in the same shell, pass through thermal insulation board 5 in shell for light emitting devices and light-receiving Device is separated, and generates hot crosstalk to avoid two optical devices；And the two shares a fiber adapter 2, and it is double to form single fiber To optical module, it is ensured that optical device couples angle with the optical path of fiber adapter respectively, keeps coupling effect good.
For the optical signal for obtaining different wave length, different waves are modulated in this field in use of wavelength division multiplexing usually in optical module Long optical signal, to improve communication capacity.For this reason, it may be necessary to by TEC component, (Thermoelectric cooler, is partly led Chiller) carry out hot tune.When emitting optical signal, the laser chip in light emitting devices produces light emitting devices in optical module Heat amount avoids the optical wavelength out for changing laser chip, need to come by a TEC component to stablize the temperature of laser chip The temperature of laser chip is maintained to stablize, to obtain stable optical signal；Light receiving element is when receiving optical signal, due to coming from light The light of fine adapter has multiple, and for the optical signal for filtering out appropriate wavelength, light receiving element needs logical by another TEC component The mode for crossing temperature control filters out the optical signal of different wave length.
To avoid optical module at work, light receiving element 8 and light emitting devices 6 is made to generate hot crosstalk phenomenon and TEC Component (7,9) can not modulated optical signal the phenomenon that, influence the normal work of light receiving element 8,6 performance of light emitting devices and optical module Make.The first TEC component 7 is arranged in light emitting cavity 101, sets in light-receiving cavity 102 for optical module provided in this embodiment Set the 2nd TEC component 9.
Figure 20 is the structural schematic diagram of the first TEC component provided in an embodiment of the present invention.Specifically, in light emitting cavity In 101, as shown in Fig. 7 and Figure 20, the bottom plate 11 of shell 1 is equipped with the first TEC component 7, and the upper surface of the first TEC component 7 is set Laser chip 61 is set, the first TEC component 7 is for being exported the heat that laser chip 61 generates by bottom plate 11.First TEC component 7 The bottom of first ceramic substrate 60 is set, and the laser chip 61 on the first ceramic substrate 60 is also easy to produce when issuing optical signal Heat is the major source that heat is generated in light emitting devices.
In the heat transfer to the first ceramic substrate 60 that laser chip 61 generates, the first TEC component 7 is again by the first ceramic base Heat absorption on plate 60, and heat is exported to the outside of shell 1 along the bottom plate 11 of shell 1.
For the more clear heat dissipation effect of the first TEC component 7 of explanation, in optical module provided in an embodiment of the present invention, First TEC component 7 includes hot under heat-exchange surface 71, the first TEC modular construction part 72 and the first TEC component on the first TEC component Exchange face 73.
The first ceramic substrate 60, heat-exchange surface on the first TEC component is arranged in the top of heat-exchange surface 71 on first TEC component 71 for absorbing the heat that laser chip 61 generates on the first ceramic substrate 60.The bottom of heat-exchange surface 71 on first TEC component It is connected with the first TEC modular construction part 72, the first TEC modular construction part 72 is fixed under the first TEC component on heat-exchange surface 73, First TEC modular construction part 72 is used for will be under heat-exchange surface 71 absorbs on the first TEC component heat transfer to the first TEC component On heat-exchange surface 73, and heat-exchange surface 73 is fixed on bottom plate 11 under the first TEC component, therefore, can be by bottom plate 11 by the first TEC The heat derives that heat-exchange surface 73 carries under component are to the outside of shell 1.
As it can be seen that the heat dissipation for the heat that light emitting devices generates exports path are as follows: the first TEC group in light emitting cavity 101 Heat-exchange surface 71 absorbs the heat that laser chip 61 generates by the first ceramic substrate 60 on part, and heat is passed through the first TEC Modular construction part 72 is transmitted under the first TEC component on heat-exchange surface 73, then by heat-exchange surface 73 under the first TEC component by heat It is exported via bottom plate 11.
In the present embodiment, the first TEC component 7 further includes first electrode 74, and first electrode 74 is used to be the first TEC component 7 Heat dissipation effect is realized in power supply.One end of first electrode 74 is electrically connected with the first conductive metal layer 62, the other end of first electrode 74 It is fixed under the first TEC component on heat-exchange surface 73.A part of electric energy is transferred to laser chip 61 by the first conductive metal layer 62, To guarantee the normal work of laser chip 61；Another part electric energy is transferred to first electrode 74 again, to be protected by first electrode 74 Demonstrate,prove the normal work of the first TEC component 7.In order to which the first conductive metal layer 62 on the first ceramic substrate 60 can be smoothly the One electrode 74 provides electricity, needs the height of first electrode 74 concordant with the height of the first ceramic substrate 6.
As it can be seen that the first TEC component 7 exports to the same of 1 outside of shell along bottom plate 11 in the heat for generating laser chip 61 When, the heat that can also generate itself is exported by heat dissipation export path through bottom plate 11, so that light emitting devices 6 and the first TEC Component 7 is in normal temperature environment, is not in hot crosstalk, will not be influenced 7 modulated optical signal of the first TEC component Effect, to guarantee the performance of light emitting devices 6 and the first TEC component 7.
In optical receiver cavity body, since the second filter plate 83 is vertically arranged, i.e., the second filter plate 83 is perpendicular to shell 1 Bottom plate 11, and it is vertical with the transmission path of optical signal so that optical signal passes through the second filter plate 83.Consequently, to facilitate second TEC component 9 adjusts the temperature of the second filter plate 83, and the optical signal of different wave length is screened in a manner of through temperature control, need to be by second Filter plate 83 is arranged on the side wall of the 2nd TEC component 9, and then the 2nd TEC component 9 is needed also to be vertically arranged, i.e., edge-on in light It is vertical with bottom plate 11 in receiving cavity 102.
As it can be seen that in light emitting cavity 101, the first TEC component 7 is located at the first ceramic base in order to adapt to propagation path of light It is below plate 60 and parallel with bottom plate 11, so that the light direction of heat-exchange surface 71 and laser chip 61 is flat on the first TEC component Row；And in light-receiving cavity 102, the 2nd TEC component 9 is vertical with bottom plate 11, and heat-exchange surface 91 and light pass on the 2nd TEC component It is vertical to broadcast direction, so that heat-exchange surface 71 is mutually perpendicular to heat-exchange surface 91 on the 2nd TEC component on the first TEC component.
In the present embodiment, the 2nd TEC component 9 adjusts the temperature of the second filter plate 83, screens not in a manner of through temperature control When the optical signal of co-wavelength, the heat dissipation used exports path to be exported by the side wall 12 of shell 1.
In order to more clearly illustrate the heat dissipation effect of the 2nd TEC component 9, the 2nd TEC component shown in Figure 18 The structural schematic diagram of another angle of 2nd TEC component shown in structural schematic diagram and Figure 19, light provided in an embodiment of the present invention In module, the 2nd TEC component 9 includes heat-exchange surface 91, the 2nd TEC modular construction on the 2nd TEC component of the edge-on setting of difference Heat-exchange surface 96 under part 92 and the 2nd TEC component, the 2nd TEC component 9 are arranged on the 2nd TEC unitized substructure 93.
Second filter plate 83 is set on the lateral wall of heat-exchange surface 91 on the 2nd TEC component, and the setting of the second filter plate 83 exists On the upper heat-exchange surface 91 of 2nd TEC component, the light that reflects through reflector plate 82 penetrates the by the surface of the second filter plate 83 Two filter plates 83 generate when heat-exchange surface 91 is used to absorb to the progress temperature control of the second filter plate 83 on the 2nd TEC component Heat.The inner sidewall of heat-exchange surface 91 is connect with the 2nd TEC modular construction part 92 on 2nd TEC component, the 2nd TEC modular construction Part 92 is fixed under the 2nd TEC component on heat-exchange surface 96, and the both ends of the 2nd TEC modular construction part 92 are separately connected the 2nd TEC Heat-exchange surface 96 under heat-exchange surface 91 and the 2nd TEC component on component.Heat-exchange surface 96 is fixed on second under 2nd TEC component On the side wall of TEC unitized substructure 93, heat-exchange surface 96 is for inhaling heat-exchange surface 91 on the 2nd TEC component under the 2nd TEC component In the heat transfer of receipts to the 2nd TEC unitized substructure 93, and the side wall 12 of one end of the 2nd TEC unitized substructure 93 and shell 1 connects It connects, therefore, the outside for the heat derives shell 1 that can be carried the 2nd TEC unitized substructure 93 by the side wall 12 of shell 1.
As it can be seen that the heat dissipation of the 2nd TEC component 9 exports path are as follows: heat is handed on the 2nd TEC component in light-receiving cavity 102 The heat generated when face 91 is absorbed to the progress temperature control of the second filter plate 83 is changed, and heat is passed through into the 2nd TEC modular construction Part 92 is transmitted under the 2nd TEC component on heat-exchange surface 96, then conducts heat to by heat-exchange surface 96 under the 2nd TEC component On two TEC unitized substructures 93, the 2nd TEC unitized substructure 93 exports heat by the side wall 12 of shell 1.
2nd TEC unitized substructure 93, will be warm under the 2nd TEC component for carrying heat-exchange surface 96 under the 2nd TEC component The heat that the transmitting of exchange face 96 comes is transmitted on the side wall 12 of shell 1.Since propagation path of light is horizontal direction and is parallel to side Wall 12, being propagated through the optical signal come need to be by the second filter plate 83, and therefore, it is necessary to the second filter plates 83 both perpendicular to bottom plate 11 It is arranged with side wall 12, and is attached on the 2nd TEC component on heat-exchange surface 91, so that heat-exchange surface 91 on the 2nd TEC component Vertical with bottom plate 11 and side wall 12 simultaneously, for the transmitting convenient for heat, the 2nd TEC unitized substructure 93 need to be both perpendicular to bottom plate 11 With side wall 12.
The face that heat dissipation is realized in light-receiving cavity 102 is the side wall 12 of shell 1, and the 2nd TEC unitized substructure 93 is for holding The part of the 2nd TEC component 9 is carried for receiving heat, i.e., the part contacted with heat-exchange surface 96 under the 2nd TEC component is for connecing Heat is received, one of end of the part for receiving heat of the 2nd TEC unitized substructure 93 extends along side wall 12, formation Extension is vertical with the part for receiving heat and contacts with side wall 12；2nd TEC unitized substructure 93 is used to receive heat Another end of the part of amount extends along the direction opposite with side wall 12, so that the Z-shaped structure of the 2nd TEC unitized substructure 93. 2nd TEC unitized substructure 93 receives the side wall 12 for conducting heat to shell 1 after heat using the Z-type design feature of itself, Realize heat exchange.
In light-receiving cavity 102, realize heat exchange is the side wall 12 of shell, rather than as in light emitting cavity 101 The bottom plate 11 of use.Bottom plate 11 and side wall 12 are vertical, (the heat-exchange surface 91 and the on the 2nd TEC component so that two heat-exchange surfaces Heat-exchange surface 71 on one TEC component) heat that absorbs conducted by the different sides of shell 1, and it can be to avoid two cavity (light emittings Cavity 101 and light-receiving cavity 102) there is hot crosstalk.
To improve heat derives effect, the 2nd TEC unitized substructure 93 includes: the heat receiving unit for being respectively perpendicular to bottom plate 11 931 and heat derives portion 932.Heat receiving unit 931 is used to receive the heat that heat-exchange surface 96 conducts under the 2nd TEC component, heat Leading-out portion 932 is measured for realizing the received heat of heat receiving unit 931 along the export of side wall 12, and can increase by the 2nd TEC component The contact area of pedestal 93 and side wall 12 improves radiating efficiency.
Heat receiving unit 931 is bonded with heat-exchange surface 96 under the 2nd TEC component, one end of heat receiving unit 931 and heat Leading-out portion 932 vertically connects, and heat derives portion 932 is fixed on side wall 12, and heat derives portion 932 is the 2nd TEC component bottom Seat 93 is along the extension that side wall 12 extends.The heat that heat-exchange surface 96 transmits under 2nd TEC component can be by heat receiving unit 931 It absorbs, and heat is exported to the outside of shell 1 by heat derives portion 932 by side wall 12.Due to heat receiving unit 931 and side Wall 12 is vertical, so that heat derives portion 932 is fitted on side wall 12, heat derives portion 932 can increase the export area of heat, mention High heat dissipation effect.
To enable the 2nd TEC component 9 to work normally, in the present embodiment, at another end of the 2nd TEC unitized substructure 93 Power supply 933 is arranged in portion.As it can be seen that the 2nd TEC unitized substructure 93 forms heat derives portion along the extension that side wall 12 extends 932, and it is the transmission for avoiding power supply 933 from influencing optical signal, power supply 933 is positioned close to the side of thermal insulation board 5, i.e., the The part that two TEC unitized substructures 93 extend to the direction opposite with side wall 12 forms power supply 933, by heat derives portion 932, heat It measures receiving unit 931 and power supply 933 forms Z-type structure.Power supply 933 is vertical with the other end of heat receiving unit 931 to be connect, and Extend towards the direction of the second ceramic substrate 86, is the power supply of power supply 933 convenient for the second ceramic substrate 86.
2nd TEC unitized substructure 93 extend to side wall 12 be partially larger than the 2nd TEC unitized substructure 93 to 12 phase of side wall The part that anti-direction extends, so that the area in heat derives portion 932 is greater than 933 area of power supply.Increase heat derives portion 932 Area the contact area in heat derives portion 932 Yu side wall 12 can be improved, to improve radiating efficiency.Power supply 933 is for real The power supply of existing 2nd TEC component 9, therefore, the size of power supply 933 can satisfy electrical conduction requirement.
To enable the 2nd TEC component 9 to work normally, in the present embodiment, the component for being used to power is arranged in the 2nd TEC On unitized substructure 93.I.e. one end of the 2nd TEC component 9 is equipped with power supply block 94, and specifically, power supply 933 is arranged in the 2nd TEC group On part pedestal 93, power supply 933 is vertical with the other end of heat receiving unit 931 to be connect.To avoid power supply 933 from influencing optical signal Transmission, power supply 933 is positioned close to the side of thermal insulation board 5.
Block 94 of powering is equipped with third conductive metal layer, and third conductive metal layer is coated on the side wall 941 of power supply block 94 On upper surface 942.Block 94 of powering by the second flexible circuit board 4 is that light receiving element is powered, i.e. the second conductive metal layer 87 and The conductive metal layer powered on the side wall 941 of block 94 connects, the upper surface of conductive metal layer and power supply block 94 on side wall 941 942 conductive metal layer connection, the conductive metal layer of upper surface 942 are connect with heat-exchange surface 91 on the 2nd TEC component, therefore, It is respectively that heat is handed on the 2nd TEC component by the second conductive metal layer 87 and third conductive metal layer by the second flexible circuit board 4 The power supply of face 91 is changed, to guarantee the normal work of the 2nd TEC component 9.
As it can be seen that when realizing heat dissipation in light-receiving cavity 102, the heat dissipation export of light receiving element 8 in light-receiving cavity 102 Path is different from the heat dissipation export path of light emitting devices 6 in light emitting cavity 101, and the heat dissipation of light emitting devices 6 exports path To be exported by the bottom plate 11 of shell 1, and the heat dissipation of light receiving element 8 export path is then exported by the side wall 12 of shell 1.Two chambers Body is using different heat dissipation export path heat dissipations, it is ensured that the heat dissipation effect of two cavitys avoids two cavitys using same The heat that heat dissipation export path makes two cavitys shed influences each other, and then reduces radiating efficiency.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to of the invention its Its embodiment.This application is intended to cover any variations, uses, or adaptations of the invention, these modifications, purposes or Person's adaptive change follows general principle of the invention and including the undocumented common knowledge in the art of the present invention Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by appended Claim is pointed out.
It should be understood that the present invention is not limited to the precise structure already described above and shown in the accompanying drawings, and And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.

Claims (7)

1. a kind of optical module characterized by comprising shell is equipped with thermal insulation board in the shell, and the thermal insulation board is by the shell Body is separated into light emitting cavity and light-receiving cavity；It is suitable that one end of the shell is equipped with the optical fiber being connected to the light emitting cavity Orchestration；
Laser chip and the first filter plate are equipped in the light emitting cavity, described in the optical signal transmission that the laser chip issues First filter plate enters the fiber adapter；
The thermal insulation board is equipped with light port, is equipped with reflector plate, the second filter plate, reflecting surface and light in the optical receiver cavity body and connects Chip is received, second filter plate allows the light of specific wavelength to pass through；
It is reflected after lightray propagation from the fiber adapter to first filter plate, the reflected light of formation is passed through Reflector plate described in the smooth port directive is reflected towards second filter plate through the reflector plate again, filters by described second The light of wave plate is reflected by the direction of the reflection towards the light-receiving chip.
2. optical module according to claim 1, which is characterized in that be additionally provided with the 2nd TEC component in the optical receiver cavity body With the 2nd TEC unitized substructure；The 2nd TEC component is arranged on the 2nd TEC unitized substructure, and the second filter plate setting exists On the upper heat-exchange surface of the 2nd TEC component, the light that is reflected through the reflector plate by the surface of second filter plate with Through second filter plate.
3. optical module according to claim 2, which is characterized in that the 2nd TEC component is equipped with light hole, described logical Unthreaded hole passes through for realizing the optical signal reflected from the reflector plate, and second filter plate is attached on the light hole.
4. optical module according to claim 3, which is characterized in that the 2nd TEC unitized substructure is equipped with the first light passing Mouthful, first light admission port passes through for realizing the optical signal reflected from the reflector plate.
5. optical module according to claim 1, which is characterized in that also set between the reflector plate and first filter plate There is third filter plate.
6. optical module according to claim 1, which is characterized in that be additionally provided with convergent lens, light in the light emitting cavity Isolator and unified platform；
The convergent lens is set between the laser chip and the optoisolator；The optoisolator is fixed on the one On the side wall for changing platform, the light passing path being connected to the light-emitting window of the optoisolator is equipped in the unified platform；It is described The light-emitting window of light passing path described in unified platform is corresponding with the light inlet of the fiber adapter；
The light that the laser chip issues enters the optoisolator after convergent lens convergence, and the directional light of formation passes through It crosses after the optoisolator enters light passing path and projects, the emergent light of formation enters the fiber adapter.
7. optical module according to claim 6, which is characterized in that it is oblique that the light-emitting window of the unified platform is equipped with light Face, the first filter plate setting are equipped between first filter plate and the fiber adapter on the light inclined-plane out Condenser lens；Optical signal from the fiber adapter is radiated on first filter plate simultaneously after the condenser lens It reflects, the reflected light of formation enters in the light-receiving cavity by the smooth port.
CN201910824700.5A 2019-09-02 2019-09-02 A kind of optical module Pending CN110376691A (en)

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