CN114647040B

CN114647040B - Optical module

Info

Publication number: CN114647040B
Application number: CN202011509747.1A
Authority: CN
Inventors: 刘凯; 张洪浩; 付孟博
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-12-19
Filing date: 2020-12-19
Publication date: 2023-07-14
Anticipated expiration: 2040-12-19
Also published as: CN114647040A

Abstract

The application provides an optical module, comprising: the optical transceiver sub-module is used for receiving signal light from the outside of the optical module and transmitting the signal light; wherein, the optical transceiver sub-module includes: a first optical transceiver housing; the first light receiving and transmitting cover plate is covered on the first light receiving and transmitting shell and forms a first light receiving and transmitting cavity with the first light receiving and transmitting shell; the first light receiving component is arranged in the first light receiving and transmitting cavity and is used for receiving signal light from the outside of the light module and converting the signal light into a current signal; the first optical component is arranged in the first optical receiving and transmitting cavity and is used for adjusting the transmission light path from the external electric signal light to the first optical receiving component; the first light receiving assembly includes a shield case and a light receiving device, the shield case being provided on the light receiving device, the shield case being for shielding isolation of the first light receiving device. The optical module provided by the embodiment of the application can effectively shield interference around the first optical receiving component.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

As the demand for communications increases, fiber to the front (FTTx) has grown rapidly. Optical fiber access technologies, mainly passive optical network (PON: passive Optical Network) technologies, have been widely used worldwide in various forms. Currently, PON technology is divided into two major categories: based on time division multiplexing passive optical networks (TDM-PONs) and on wavelength division multiplexing passive optical networks (WDM-PONs). However, WDM-PON based on wavelength division multiplexing is a more advantageous multiplexing scheme. WDM-PON is a point-to-point passive optical network employing wavelength division multiplexing. In the same optical fiber, the number of the bidirectional adopted wavelengths is more than 3, the uplink access is realized by utilizing the wavelength division multiplexing technology, and the large working bandwidth can be provided with lower cost, so that the method is an important development direction of the optical fiber access in the future.

In the optical communication technology, the optical module is a tool for realizing the mutual conversion of photoelectric signals, is one of key devices in optical communication equipment, and the requirements of the optical communication on the optical module are higher and higher along with the continuous improvement of the transmission rate of the optical module required by the development of the optical communication technology.

Disclosure of Invention

The embodiment of the application provides an optical module which can effectively shield interference around a first optical receiving assembly.

The application provides an optical module, include: a circuit board;

the optical transceiver sub-module is electrically connected with the circuit board and is used for receiving signal light from the outside of the optical module and transmitting the signal light;

wherein, the optical transceiver sub-module includes:

a first optical transceiver housing;

the first light receiving and transmitting cover plate is covered on the first light receiving and transmitting shell and forms a first light receiving and transmitting cavity with the first light receiving and transmitting shell;

the first light receiving component is arranged in the first light receiving and transmitting cavity and is used for receiving signal light from the outside of the light module and converting the signal light into a current signal;

the first optical component is arranged in the first optical receiving and transmitting cavity and is used for adjusting the transmission light path from the external electric signal light to the first optical receiving component;

the first light receiving assembly includes a shield case and a light receiving device, the shield case being provided on the light receiving device, the shield case being for shielding isolation of the first light receiving device.

In the optical module provided by the application, the shielding cover of the first optical receiving assembly and the optical receiving device are arranged on the optical receiving device, and the shielding cover is used for shielding and isolation of the first optical receiving device. The photoelectric device conversion device in the first light receiving device in the optical receiving and transmitting sub-module is easy to be interfered by other non-working signal light and electric signals.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;

Fig. 2 is a schematic diagram of an optical network unit structure;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present application;

fig. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an optical transceiver sub-module according to an embodiment of the present application;

fig. 6 is a partially exploded schematic view of an optical transceiver sub-module according to an embodiment of the present application;

fig. 7 is a schematic diagram of an internal structure of a first optical transceiver according to an embodiment of the present application;

fig. 8 is a schematic diagram of a transmission optical path of a transmitting signal light and a receiving signal light in a first optical transceiver provided in an embodiment of the present application;

fig. 9 is a partial structural view one of an optical transceiver sub-module according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a first wavelength screening device according to an embodiment of the present application;

FIG. 11 is a schematic structural diagram of a light permselective device according to an embodiment of the present disclosure;

fig. 12 is a cross-sectional view of an optical transceiver sub-module according to an embodiment of the present application;

fig. 13 is a second partial structural view of an optical transceiver sub-module according to an embodiment of the present application;

fig. 14 is a second cross-sectional view of an optical transceiver sub-module according to an embodiment of the present disclosure;

Fig. 15 is a schematic structural diagram of a first connector according to an embodiment of the present application;

fig. 16 is a second schematic structural view of a first connector according to an embodiment of the present disclosure;

fig. 17 is a schematic structural diagram of another direction of an optical transceiver sub-module according to an embodiment of the present application;

fig. 18 is an exploded view of another direction of an optical transceiver sub-module according to an embodiment of the present disclosure;

fig. 19 is a schematic structural diagram of another optical transceiver sub-module according to an embodiment of the present application;

FIG. 20 is a partially exploded view of another optical transceiver sub-module according to an embodiment of the present disclosure;

fig. 21 is a schematic diagram of an internal structure of a second optical transceiver according to an embodiment of the present disclosure;

fig. 22 is a schematic diagram of optical path transmission of a transmitting signal light and a receiving signal light in a second optical transceiver provided in an embodiment of the present application;

fig. 23 is a boost circuit diagram provided in an embodiment of the present application;

FIG. 24 is a partially exploded view of another optical transceiver sub-module according to an embodiment of the present disclosure;

fig. 25 is a cross-sectional view of another optical transceiver sub-module according to an embodiment of the present disclosure;

fig. 26 is a second cross-sectional view of another optical transceiver sub-module according to an embodiment of the present disclosure;

Fig. 27 is a schematic structural diagram of a second support platform according to an embodiment of the present disclosure;

FIG. 28 is a schematic diagram of an optical fiber adapter according to an embodiment of the present disclosure;

FIG. 29 is a cross-sectional view of a fiber optic adapter according to an embodiment of the present application;

FIG. 30 is a second cross-sectional view of a fiber optic adapter according to an embodiment of the present disclosure;

fig. 31 is a schematic partial structure diagram of another transceiver sub-module according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

One of the key links of optical fiber communication is the mutual conversion of optical signals and electric signals. The optical fiber communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.

The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

The optical port of the optical module 200 is externally connected to the optical fiber 101, and bidirectional optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected into the optical network terminal 100, and bidirectional electrical signal connection is established with the optical network terminal 100; the method comprises the steps that the mutual conversion of optical signals and electric signals is realized in an optical module, so that information connection is established between an optical fiber and an optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing the optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104 which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100, specifically, the optical network terminal transmits signals from the optical module to the network cable, and transmits signals from the network cable to the optical module, and the optical network terminal is used as an upper computer of the optical module to monitor the operation of the optical module.

So far, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, which provides data signals for the optical module and receives data signals from the optical module, and the common optical module upper computer also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and is used for accessing an optical module electrical port such as a golden finger; the cage 106 is provided with a radiator 107, and the radiator 107 has a convex portion such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the light module is inserted into the cage, the light module is fixed by the cage, and the heat generated by the light module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application, and fig. 4 is an exploded structural diagram of an optical module provided in an embodiment of the present application. As shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver sub-module 400.

The upper case 201 is covered on the lower case 202 to form a packing cavity having two openings; the outer contour of the wrapping cavity is generally square, and specifically, the lower shell comprises a main board and two side boards which are positioned on two sides of the main board and are perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers the two side plates of the upper shell to form a wrapping cavity; the upper shell can further comprise two side walls which are positioned on two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates so as to realize that the upper shell covers the lower shell.

The two openings can be two ends openings (204, 205) in the same direction or two openings in different directions; one opening is an electric port 204, and a golden finger of the circuit board extends out from the electric port 205 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect with the optical transceiver sub-module 400 inside the optical module; the circuit board 300, the optical transceiver sub-module 400, and other devices are located in the encapsulation cavity.

The upper shell and the lower shell are combined to be assembled, so that devices such as the circuit board 300, the optical transceiver sub-module 400 and the like can be conveniently installed in the shells, and the upper shell and the lower shell form an encapsulation protection shell of the outermost layer of the optical module; the upper shell and the lower shell are generally made of metal materials, so that electromagnetic shielding and heat dissipation are facilitated; the housing of the optical module is not generally made into an integral part, so that the positioning part, the heat dissipation part and the electromagnetic shielding part cannot be installed when devices such as a circuit board are assembled, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the lower housing 202, and is used for realizing or releasing the fixed connection between the optical module and the host computer.

The unlocking part 203 is provided with a clamping part matched with the upper computer cage; pulling the end of the unlocking member can relatively move the unlocking member on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; the unlocking part is pulled, and the clamping part of the unlocking part moves along with the unlocking part, so that the connection relation between the clamping part and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be pulled out of the cage of the upper computer.

The circuit board 300 is provided with circuit wiring, electronic components (such as capacitor, resistor, triode, MOS tube) and chips (such as MCU, laser driving chip, limiting amplifying chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

The circuit board connects the electric devices in the optical module together according to the circuit design through the circuit wiring so as to realize the electric functions of power supply, electric signal transmission, grounding and the like.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driving chip and an MCU chip are integrated into one chip, or a laser driving chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is a circuit integration, but the functions of the circuits are not lost due to aggregation, only the circuit shows a change in morphology, and the chip still has the circuit morphology. Therefore, when the circuit board is provided with three independent chips of the MCU, the laser driving chip and the limiting amplifier chip, the scheme is equivalent to that of the circuit board 300 provided with a single chip with three functions.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear chips; when the optical transceiver is positioned on the circuit board, the hard circuit board can provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, specifically, a metal pin/golden finger is formed on the surface of one side tail end of the hard circuit board and is used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.

A flexible circuit board is also used in part of the optical modules and is used as a supplement of the hard circuit board; the flexible circuit board is generally used in cooperation with the hard circuit board, for example, the hard circuit board and the optical transceiver can be connected by using the flexible circuit board.

The optical transceiver sub-module 400 is used for implementing optical signal transmission and optical signal reception, and the optical transceiver sub-module 400 is electrically connected to the circuit board 300. Optionally, the optical transceiver sub-module 400 is located at an end of the circuit board 300 and is physically separated from the circuit board 300; the optical transceiver sub-module 400 is electrically connected to the circuit board 300 through a flexible circuit board.

The optical transceiver sub-module 400 provided in the embodiment of the present application includes an optical fiber adapter 407, and the optical module is connected to an external optical fiber through the optical fiber adapter 407; the optical transceiver sub-module 400 further includes an optical receiving assembly and an optical transmitting assembly; the light receiving assembly is used for receiving signal light from the outside of the light module, and the light emitting assembly is used for emitting the signal light. In order to facilitate the packaging of the optical transceiver sub-module 400, the optical transceiver sub-module 400 includes an optical transceiver housing and an optical transceiver cover plate 402a covering the optical transceiver housing; the optical transceiver shell and the optical transceiver cover plate form an optical transceiver cavity; the signal light from the outside of the optical module is transmitted into the optical transceiver cavity through the optical fiber adapter 407, and then transmitted to the optical receiving assembly; the signal light emitted by the light emitting component is transmitted into the light receiving and transmitting cavity, and then the optical fiber adapter 407 is transmitted to the outside of the optical module. In order to facilitate the transmission of signal light from outside the optical module and emitted signal light in the optical transceiver cavity, an optical assembly is disposed in the optical transceiver cavity, and the optical assembly is used for adjusting the transmission light path from the external electric signal light of the optical module to the optical receiving assembly and the transmission light path of the emitted signal light of the optical emitting assembly. The light emitting component generally comprises a laser component, a laser driver, a TEC, a backlight detector and other devices for realizing and assisting in realizing that the light module generates light signals, and the light receiving component comprises a photoelectric detector, a transimpedance amplifier, a limiting amplifier and other devices for receiving signal light, performing photoelectric conversion and assisting in photoelectric conversion.

In some techniques for achieving burst operation of a laser, it is often necessary to increase the bias current applied to the laser from 0mA to the current required for normal light emission, such as 80mA; in the whole loading process, the difference between the temperature change of the laser and the carrier change causes serious wavelength drift; if the wavelength-shifted light enters the optical network and there is crosstalk between adjacent channels, in some embodiments of the present application, the optical transmission path of the signal light emitted by the optical emission component may be generally provided with an optical tunable switch, an isolator, or a light selective transmission device combined with the optical tunable switch, so as to implement that the signal light output by the optical transceiver sub-module 400 is the signal light generated during normal light emission.

The optically tunable optical switch may be a pull-up rotator. The Faraday rotator has controllable polarization direction changing performance under the action of the magnetic field, namely, the polarization direction of the light can be changed when the light passes through the Faraday rotator; when the magnetic field outside the Faraday rotator is fixed, the change of the light polarization direction is fixed, and when the magnetic field outside the Faraday rotator is changed, the change of the light polarization direction is also changed. In some embodiments of the present application, a faraday rotator and an isolator are disposed on a transmission optical path of signal light emitted by the light emitting component; the polarization direction is consistent with that of the isolator, light can pass through the isolator and is inconsistent with that of the isolator, and all or part of the light cannot pass through the isolator, so that the polarization direction of signal light transmitted to the Faraday rotator is changed by controlling the magnetic field direction of the Faraday rotator, the signal light can pass through or pass through the isolator, and the selective passing of the signal light emitted by the light emitting component is realized by the cooperation of the Faraday rotator and the isolator. Such as: the light emitting component emits signal light with a first polarization direction, the isolator allows the polarization direction of the transmitted signal light to be a second polarization direction, and the Faraday rotator can change the polarization direction of the signal light with the first polarization direction into the second polarization direction or a third polarization direction by controlling the power-on direction of the Faraday rotator; therefore, by controlling the energizing direction of the Faraday rotator, whether the signal light emitted by the light emitting component is allowed to pass or not can be controlled. Typically the second polarization direction is 90 degrees different from the third polarization direction.

In addition, in order to realize burst transmission and reception in an optical network, the optical module provided by the embodiment of the application generally needs to realize tuning in a plurality of wavelengths, such as four wavelengths of 1532.68nm, 1533.47nm, 1534.25nm and 1535.04nm, four wavelengths of 1596.34nm, 1597.19nm, 1598.04nm and 1598.89 nm; furthermore, a plurality of wavelength screening devices are further arranged in the optical transceiver cavity in the optical module provided by the embodiment of the application, and the wavelength screening devices can be arranged on the transmitting optical path of the optical transmitting assembly and/or the receiving optical path of the optical receiving assembly. When the wavelength screening device is arranged on the transmitting light path of the light transmitting assembly, the wavelength screening device is used for screening signal light transmitted by the light transmitting assembly and preventing the signal light with the working wavelength of the non-optical module from being incident into the optical network; when the wavelength screening device is arranged on the receiving light path of the light receiving assembly, the wavelength screening device is used for screening the received signal light transmitted to the light receiving assembly and is used for preventing the signal light with the working wavelength of the non-light module from being received by the light receiving assembly.

In some embodiments of the present application, the wavelength screening device may include a TEC (semiconductor thermal refrigerator) and a filter, where the filter is disposed on the TEC, and the direction and the size of an input current in the TEC are controlled to adjust and control the temperature of the filter, so as to tune the refractive index of the filter, and further tune the wavelength of a signal light that can be transmitted by the filter, that is, the wavelength of a specific signal light is selected to be transmitted by the filter through controlling the current direction and the size of the first TEC.

In some embodiments of the present application, the wavelength screening device may include a first mirror, a second mirror, and a piezoelectric ceramic device, where an air cavity is formed between the first mirror and the first mirror, the piezoelectric ceramic device is disposed on the first mirror or the second mirror, and a voltage is applied to the piezoelectric ceramic device to change a width of the air cavity between the first mirror and the second mirror, that is, to change a length of a resonant cavity between the first mirror and the second mirror, and then to implement a wavelength of light passing through a specific signal by using a multi-beam interference principle. The piezoelectric ceramic device generally comprises a piezoelectric ceramic body, the two ends of the piezoelectric ceramic body are applied with voltage difference change, the adjustment of the stretching amount of the piezoelectric ceramic body can be realized, and then the piezoelectric ceramic body drives the first reflecting mirror or the second reflecting mirror to adjust the width of an air cavity between the first reflecting mirror and the second reflecting mirror, so that the signal light wavelength input into the wavelength screening device is screened and transmitted.

The specific structure of the wavelength selective device may be selected in combination with the size of the optical transceiver cavity, the requirements of the optical receiving assembly, and the size of the wavelength selective device. The wavelength screening device may also be applied in the transmission path of the light emitting assembly.

The optical transceiver sub-module provided in the embodiments of the present application is described in detail below with reference to specific embodiments.

Fig. 5 is a schematic structural diagram of an optical transceiver sub-module according to an embodiment of the present application, which is denoted as an optical transceiver sub-module 400a; fig. 6 is a partially exploded schematic view of an optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 5 and 6, the optical transceiver sub-module 400a provided in the embodiment of the present application includes a first optical transceiver housing 401a and a first optical transceiver cover plate 402a covering the first optical transceiver housing 401 a; the first optical transceiver housing 401a and the first optical transceiver cover plate 402a form a first optical transceiver cavity 403a, and a first optical transmitting component 404a for implementing optical signal transmission, a first optical receiving component 405a for implementing optical signal reception, and a first optical component 406a for implementing optical signal transmission path adjustment are disposed in the first optical transceiver cavity 403 a. The first light receiving and transmitting housing 401a and the first light receiving and transmitting cover 402a may be made of metal material, such as die-cast metal or milled metal. In this embodiment, the first light emitting component 404a includes a laser component, a laser driver, a TEC, a backlight detector, and other devices for implementing and assisting in implementing the optical module to generate an optical signal, and the first light receiving component 405a includes a photodetector, a transimpedance amplifier, a limiting amplifier, and other devices for receiving signal light, performing photoelectric conversion, and assisting in photoelectric conversion. In the optical transceiver sub-module 400a shown in fig. 6, the first optical receiving element 405 adopts a micro-optical package structure.

As shown in fig. 5 and 6, an optical fiber adapter 407 is connected to one end of the first optical transceiver housing 401a away from the circuit board 300, and one end of the optical fiber adapter 407 is connected to the first optical transceiver cavity 403a, and the other end is used for connecting an external optical fiber. The signal light emitted from the first light emitting element 404a is transmitted to the optical fiber adapter 407 through the first light element 406a, and then transmitted to the external optical fiber through the optical fiber adapter 407; the signal light from the external optical fiber is transmitted into the first optical transceiver cavity 403a through the optical fiber adapter 407, and is transmitted to the first optical receiving component 405a through the first optical component 406a, and the first optical receiving component 405a receives the signal light; therefore, the signal light of the first light emitting component 404a and the signal light to be received by the first light receiving component 405a are transmitted together through the optical fiber adapter 407, so that the light emitted by the optical module and the received light are transmitted through one optical fiber.

Further, in some embodiments of the present application, the first light emitting component 404a includes a light emitting chip, a metallized ceramic, and a semiconductor refrigerator. The common light emitting chip of the optical module is a laser chip, the laser chip is arranged on the surface of the metallized ceramic, and the surface of the metallized ceramic forms a circuit pattern so as to supply power for the laser chip; meanwhile, the metallized ceramic has better heat conduction performance and can be used as a heat sink of the laser chip for heat dissipation; the semiconductor refrigerator is directly or indirectly arranged on the bottom surface of the cavity of the light emitting sub-module, the metallized ceramic is arranged on the surface of the semiconductor refrigerator, and the semiconductor refrigerator is used for balancing heat to maintain the set working temperature of the laser chip, so that the adjustment and control of the temperature of the laser chip are realized. The laser becomes a preferred light source for optical module and even optical fiber transmission with better single wavelength characteristic and better wavelength tuning characteristic; other types of light, such as LED light, are not generally adopted in a common optical communication system, and even if such a light source is adopted in a special optical communication system, the characteristics and the chip structure of the light source are greatly different from those of the laser, so that the optical module adopting the laser is greatly different from those adopting other light sources in technology, and those skilled in the art generally cannot consider that the two types of optical modules can mutually give technical advices.

As shown in fig. 5 and 6, the first optical transceiver housing 401a is provided with a first connector 408a, such as a ceramic connector, near one end of the circuit board 300. The first optical transceiver housing 401a is disposed near one end of the circuit board 300 and is connected with the first connector opening 4011a, the first connector 408a is embedded in the first connector opening 4011a, and the first connector 408a is connected with the first connector opening 4011a in an interference fit manner, so that one end of the first connector 408a extends into the first optical transceiver cavity 403a, the other end extends out of the first optical transceiver cavity 403a, and one end extending into the first optical transceiver cavity 403a is generally used for wire-bonding connection with electrical devices in the first optical transmitting component 404a, the first optical receiving component 405a and the like in the first optical transceiver cavity 403 a; the surfaces of both ends of the first connector 408a are provided with a plurality of pad pins for wire-bonding connection with the electrical devices in the first light emitting component 404a, the first light receiving component 405a, etc., or electrically connecting with the flexible circuit board, respectively. Specific: one end extending out of the first optical transceiver 403a is generally used for electrically connecting the circuit board 300 through a flexible circuit board, and further, the electrical connection between the circuit board 300a and the electrical devices in the first optical transmitting component 404a, the first optical receiving component 405a, etc. is achieved through the first connector 408 a; the first connector 408a may be electrically connected to the circuit board 300 through a flexible circuit board or a plurality of flexible circuit boards.

Fig. 7 is a schematic diagram of an internal structure of a first optical transceiver according to an embodiment of the present application; fig. 8 is a schematic diagram of a transmission optical path of a transmitting signal light and a receiving signal light in a first optical transceiver provided in an embodiment of the present application; in fig. 8, solid arrows indicate transmission paths of transmitted signal light, and broken arrows indicate transmission paths of received signal light. As shown in fig. 7 and 8, the first optical component 406a in the first optical transceiver 403a includes a first lens 4061a, a first filter 4062a, a first mirror 4063a, a first collimating lens 4064a, a first focusing lens 4065a, and the like. The first collimating lens 4064a is disposed in the outgoing light direction of the first light emitting component 404a to convert the divergent light beam output by the first light emitting component 404a into a collimated light beam; the first filter 4062a is disposed in the light emitting direction of the first collimating lens 4064a, the first lens 4061a is disposed in the light transmitting direction of the first filter 4062a, and the collimated light beam emitted through the first collimating lens 4064a is transmitted to the optical fiber adapter 407 through the first filter 4062a and the first lens 4061a in this order, and the first lens 4061a is configured to converge the collimated light beam transmitted through the first filter 4062 to the optical fiber adapter 407. The first mirror 4063 is disposed in the light reflection direction of the first filter 4062, and the first focusing lens 4065a is disposed in the light reflection direction of the first mirror 4063 a; the received signal light is thus transmitted to the optical fiber adapter 407 through the external optical fiber, transmitted to the first lens 4061a through the optical fiber adapter 407, the first lens 4061a converts the divergent light beam into a collimated light beam, the collimated light beam converted by the first lens 4061a is transmitted to the first filter 4062, the first filter 4062a reflects it to the first mirror 4063a, then reflects it to the first focusing lens 4065a through the first mirror 4063a, and is converged and transmitted to the first light receiving element 405a through the first focusing lens 4065 a.

Further, the first collimating lens 4064a, the first filter 4062a, and the first lens 4061a are disposed on the optical path of the emitted signal light for ensuring transmission of the emitted signal light between the first light emitting element 404a and the optical fiber adapter 407 a; the first lens 4061a, the first filter 4062a, the first reflecting mirror 4063a, and the first focusing lens 4065a are disposed on the optical path of the received signal light for ensuring the transmission of the received signal light between the optical fiber adapter 407 and the first light-receiving component 405 a. In some embodiments of the present application, the first filter 4062a is a 45 ° filter and the first mirror 4063a is a 45 ° mirror.

The first optical component 406a provided in this embodiment of the present application further includes a second filter 4066a, where the second filter 4066a is disposed on an emission path from the first filter 4062a to the first reflector 4063a, and the second filter 4066a is configured to transmit the signal light with the wavelength received by the first light receiving component 405 a.

Fig. 9 is a first partial structural view of an optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 9, in the optical transceiver sub-module 400a provided in some embodiments of the present application, a first wavelength screening device 4091 is disposed on an emission light path of the first optical emission component 404a, and an optical selective transmission device 40924092 is disposed on the emission light path of the first optical emission component 404 a.

As shown in fig. 9, the optical transceiver sub-module 400a provided in some embodiments of the present application includes a first wavelength filtering device 4091, where the first wavelength filtering device 4091 is disposed on a transmission optical path from the first reflector 4063a to the first focusing lens 4065a, and is used for filtering the wavelength of the received signal light in the first optical receiving component 405 a. Optionally, the first wavelength selective device 4091 is a wavelength selective device including a TEC and a filter or a wavelength selective device including a first mirror, a second mirror and a piezoceramic device, and may specifically be selected in combination with the size of the first optical transceiver cavity 403a, the requirement of the first light receiving component 405a, and the size of the wavelength selective device 409.

As shown in fig. 9, the optical transceiver sub-module 400a provided in some embodiments of the present application further includes a light selective transmission device 4092, where the light selective transmission device 4092 is disposed on a transmission optical path from the first collimating lens 4064a to the first filter 4062a, and is configured to selectively transmit the signal light in the first light emitting component 404 a. Optionally, the light selective transmission device 4092 includes a faraday rotator and an isolator, and specifically may be selected in combination with the size of the first light receiving and transmitting cavity 403a, the requirements of the first light emitting element 404a, and the size of the light selective transmission device.

Fig. 10 is a schematic structural diagram of a first wavelength screening device according to some embodiments of the present application. As shown in fig. 10, the embodiment of the present application provides a first wavelength filtering device 4091 including a first TEC911 and a first wavelength filtering filter 912, where the first wavelength filtering filter 912 is disposed on the first TEC911, the first TEC911 is disposed in the first light receiving and transmitting cavity 403a and between the first reflecting mirror 4063a and the first focusing lens 4065a, so that the first wavelength filtering filter 912 is located on the transmission path from the first reflecting mirror 4063a to the first focusing lens 4065a, and then the collimated light beam reflected by the first reflecting mirror 4063a is transmitted to the first wavelength filtering filter 912, and the first wavelength filtering filter 912 is temperature-adjusted by the first TEC911 and selectively transmits according to the wavelength of the signal light transmitted to the first wavelength filtering filter 912. In this embodiment of the present application, a correspondence between a transmission wavelength and a temperature can be selected by setting up a first wavelength filtering filter 912 in the optical module, then the temperature required to be regulated and controlled by the first wavelength filtering filter 912 is selected according to the selected transmission wavelength, and finally the temperature of the first wavelength filtering filter 912 is regulated and controlled by the first TEC911, so as to further realize the filtering of the first wavelength filtering filter 912 on the transmission signal wavelength.

Further, in some embodiments of the present application, the first wavelength filtering device 4091 further includes a first filter support 913, a first through hole 9131 is disposed on the first filter support 913, the first filter support 913 is disposed on the first TEC911, the first wavelength filtering filter 912 is disposed on the first filter support 913, the first filter 912 covers the first through hole 9131, so that signal light of a specific wavelength passing through the first filter 912 is transmitted to the first focusing lens 4065a through the first through hole 9131, or signal light passing through the first through hole 9131 is transmitted to the first filter 912.

As shown in fig. 10, in some embodiments of the present application, the first filter support 913 includes a fixing plate 9132 and a supporting plate 9133, and the fixing plate 9132 and the supporting plate 9133 form an "L-shaped" structure; wherein, the fixed plate 9132 is connected to the first TEC911, the supporting plate 9133 is provided with a first through hole 9131, and the supporting plate 9133 is connected to the first wavelength filtering sheet 912 in a supporting manner; in addition, the fixing plate 9132 may be provided with a temperature sensor for measuring the temperature of the first wavelength filtering sheet 912. Furthermore, the first filter support 913 with the L-shaped structure is convenient for fixing the first wavelength screening filter 912 on the first TEC911, and a temperature sensor can be conveniently arranged for measuring the temperature of the first wavelength screening filter 912.

Fig. 11 is a schematic structural diagram of a light permselective device according to some embodiments of the present application. As shown in fig. 11, the embodiment of the present application provides a light selective transmission device 4092 including a faraday rotator 921 and an isolator 922, where the faraday rotator 921 and the isolator 922 are disposed in the first light receiving and transmitting cavity 403a, and the faraday rotator 921 and the isolator 922 are sequentially disposed on the transmission light path from the first collimating lens 4064a to the first filtering sheet 4062 a.

In some embodiments of the present application, the signal light generated by the first light emitting component 404a is collimated by the first collimating lens 4064a and then transmitted to the faraday rotator 921, and a magnetic field with a direction changing is applied to the faraday rotator 921, so that the direction-changing magnetic field can realize that the faraday rotator 921 adjusts the polarization state of the signal light according to the wavelength of the signal light generated by the first light emitting component 404a, and then the signal light is filtered according to the wavelength of the signal light generated by the first light emitting component 404a and then output to the outside of the optical module.

For example, when the polarization direction of the signal light generated by the first light emitting element 404a is adjusted to pass through the isolator 922, the direction of the magnetic field applied to the faraday rotator 921 is changed so that the signal light having a non-specific wavelength generated by the first light emitting element 404a cannot pass through the isolator 922 after passing through the faraday rotator 921 to adjust the polarization direction. Alternatively, the change in the direction of the applied magnetic field on the faraday rotator 921 is achieved by a change in the direction of the applied electric current. Assuming that the first light emitting element 404a emits the signal light of the first polarization direction, the isolator 922 allows the signal light of the second polarization direction to pass therethrough, and the faraday rotator 921 changes the polarization direction of the signal light of the first polarization direction to the second polarization direction when the first power-up direction is applied, and the faraday rotator 921 changes the polarization direction of the signal light of the first polarization direction to the third polarization direction when the second power-up direction is applied; then when the signal light emitted by the first light emitting element 404a is selected, the faraday rotator 921 is applied with electricity in the first power-up direction, and when the signal light emitted by the first light emitting element 404a is selected to be blocked, the faraday rotator 921 is applied with electricity in the first power-up direction. Optionally, the second polarization direction differs from the third polarization direction by 90 degrees. Therefore, when the laser chip in the first light emitting component 404a suddenly works, the bias current is increased from 0mA to the loading process of normal light emission, and by adjusting and controlling the direction of the magnetic field applied on the faraday rotator 921, it can be realized that the signal light generated by the first light emitting component 404a after the bias current is stabilized is allowed to be transmitted to the first filter 4062a through the isolator 922, so that the signal light with wavelength drift can be effectively prevented from entering the optical network.

In the embodiment of the present application, the faraday rotator 921 and the isolator 922 may be directly or indirectly disposed on the bottom plate of the first optical transceiver housing 401 a; for example, a fixing groove is formed in the bottom plate of the first optical transceiver housing 401a, the faraday rotator 921 is disposed in the fixing groove on the bottom plate, a supporting platform is disposed on the bottom plate of the first optical transceiver housing 401a and can be adhered to the bottom plate of the first optical transceiver housing 401a, a mounting seat is disposed on the supporting platform, the isolator 922 is connected with the mounting seat, and then the isolator 922 passes through the bottom plate of the first optical transceiver housing 401a of the supporting platform.

In the embodiment of the present application, not only the light selective transmission device 4092 but also the first wavelength screening device 4091 may be disposed on the transmission light path from the first collimating lens 4064 to the first filter 4062 a; the specific selection may be that the first wavelength selective device 4091 and the optical selective transmission device 4092 are selected and combined according to the size of the first optical transceiver 403a, the first optical transmitting component 404a, and the first optical receiving component 405 a; of course, wavelength screening devices including a first mirror, a second mirror, and a piezoceramic device may also be used on the transmission path of the first mirror 4063a to the first focusing lens 4065a and on the transmission path of the first collimating lens 4064a to the first filter 4062a, if the dimensions of the first light receiving and transmitting cavity 403a, the first light emitting element 404a, and the first light receiving element 405a allow.

Fig. 12 is a cross-sectional view of an optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 12, a first supporting platform 410a is disposed on a bottom plate of a first optical transceiver housing 401a provided in the embodiment of the present application, a mounting seat 4101a is disposed on the first supporting platform 410a, an isolator 922 is disposed on the mounting seat 4101a, the mounting seat 4101a is used for fixedly supporting the isolator 922, and the mounting of the isolator 922 and the achievement of the requirement of the mounting position of the isolator 922 are conveniently achieved through the mounting seat 4101 a; a fixed groove 4013a is formed in the bottom plate of the first optical transceiver housing 401a, the bottom of the Faraday rotator 921 is clamped in the fixed groove 4013a, and the Faraday rotator 921 is convenient to install and fix through the fixed groove 4013a, and the installation accuracy is guaranteed; the first TEC911 is disposed on the bottom plate of the first optical transceiver housing 401 a.

In the optical transceiver sub-module 400a provided in the embodiment of the present application, the first lens 4061a, the first filter 4062a, the first mirror 4063a and the second filter 4066a are disposed on the first support platform 410a; in the assembly process, the first lens 4061a, the first filter 4062a, the first reflector 4063a and the second filter 4066a may be coupled and fixedly disposed on the first support platform 410a, and then the first support platform 410a is fixedly disposed on the bottom plate of the first optical transceiver 401 a; this facilitates ensuring the mounting accuracy of the first lens 4061a, the first filter 4062a, the first mirror 4063a, and the second filter 4066 a.

Alternatively, the first filter 4062a is mounted on a side surface of the mount 4101a, and a connection through hole 4102a is provided inside the mount 4101a, and the connection through hole 4102a communicates with the first filter 4062a and the isolator 922 for transmitting the signal light through the isolator 922. Optionally, the first support platform 410a is provided with a support column 4103a, the first reflecting mirror 4063a is mounted on a side surface of the support column 4103a, and the side surface of the support column 4103a is set according to the setting angle requirement of the first reflecting mirror 4063a, so as to facilitate the coupling assembly of the first reflecting mirror 4063 a.

In some embodiments of the present application, the first light receiving component 405a includes a shielding cover, where the shielding cover is disposed in the first light receiving and transmitting cavity 403a to form a shielding cavity, and a light receiving device such as a photodetector, a transimpedance amplifier, a limiting amplifier, etc. for receiving signal light is disposed in the shielding cavity; because the photodetectors in the first light receiving element 405a are sensitive to light and the transimpedance amplifier, the limiting amplifier, etc. are sensitive to the electrical signals, both the signal light generated by the first light emitting element 404a and the electrical signals operated by the first light emitting element 404a can interfere with the photodetectors, the transimpedance amplifier, the limiting amplifier, etc. in the first light receiving element 405a, the use of the shielding case can effectively prevent the signal light generated by the first light emitting element 404a from interfering with the signal light received by the photodetectors in the first light receiving element 405a, and shield the electrical signals operated by the first light emitting element 404a from interfering with the transimpedance amplifier, the limiting amplifier, etc. Optionally, the shielding case includes a shielding case housing and a shielding case cover plate covering the shielding case housing, and the shielding case housing and the shielding case cover plate form a shielding cavity. The shielding case is provided with a receiving opening through which the received signal light converged by the first focusing lens 4065a enters the shielding cavity.

In some embodiments of the present application, the first light receiving element 405a is disposed within the first light receiving and transmitting cavity 403a by being disposed directly or indirectly on a floor within the first light receiving and transmitting cavity 403 a. In addition, in some embodiments of the present application, a light receiving support portion is provided on the first connector 408a, the light receiving support portion providing a metal land area and a pad pin; furthermore, the first light receiving component 405a can be fixedly supported by the light receiving supporting part, and the position of a grounding and electric connection area can be provided for part of devices in the first light receiving component 405a, so that the grounding and electric connection of part of devices in the first light receiving component 405a can be conveniently realized. Of course, the light receiving support portion may be used not only for supporting and connecting the first light receiving element 405a but also for supporting and connecting the first focusing lens 4065a and the like, that is, the first focusing lens 4065a and the like are provided on the light receiving support portion.

Fig. 13 is a partial structure view of a second optical transceiver sub-module according to an embodiment of the present application, and fig. 14 is a cross-sectional view of the second optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 12, 13 and 14, the first connector 408a in the optical transceiver sub-module 400a provided in the embodiment of the present application includes a light receiving support portion 4081a, and the first light receiving component 405a is disposed on the light receiving support portion 4081a; the first focus lens 4065a is disposed on the light-receiving support portion 4081. As shown in fig. 12, 13 and 14, the first light receiving element 405a includes a shield case 4051a and a shield cover plate 4052a covering the top of the shield case 4051a, the shield case 4051a and the shield cover plate 4052a forming a shield cavity 4053a; the bottom of the shield case 4051a is contact-connected to the light-receiving support portion 4081a; the side of the shielding shell 4051a is provided with a receiving opening 511, and the receiving opening 511 is disposed on the transmission output light path of the first focusing lens 4065a, that is, the projection of the first focusing lens 4065a in the direction of the shielding shell 4051a covers the receiving opening 511, so that the received signal light transmitted through the first focusing lens 4065a passes through the receiving opening 511 and enters the shielding cavity 4053a.

In some embodiments of the present application, the light receiving support portion 4081a is provided with a first focus lens support plate 4065-1a, the first focus lens 4065a is disposed on the first focus lens support plate 4065-1a, and the first focus lens 4065a is disposed on the light receiving support portion 4081a through the first focus lens support plate 4065-1 a. The first focusing lens support plate 4065-1a can facilitate the installation and arrangement of the first focusing lens 4065a and the coupling adjustment of the first focusing lens 4065 a.

The first light receiving component 405a further includes light receiving electric devices such as a photodetector, a transimpedance amplifier, a limiting amplifier, etc., which are disposed in the shielding cavity 4053 a; the surface of the light receiving support portion 4081a is provided with a metal land area and a pad pin, and the light receiving electric device is mounted on the light receiving support portion 4081 and electrically connected to the surface of the light receiving support portion 4081a is provided with a metal land area and a pad pin. In this embodiment, by providing the light receiving support portion 4081a and providing the metal land area and the pad pin on the surface of the light receiving support portion 4081, the high-frequency crosstalk of the first light receiving component 405a is reduced, and more routing positions are provided for fixing and electrically connecting the first light receiving component 405a, so that the electrical connection requirement of the first light receiving component 405a is satisfied.

Further, in some embodiments of the present application, the first light receiving component 405a further includes a displacement prism 4054a, where the displacement prism 4054a is disposed in the shielding cavity 4053a, and a projection of the displacement prism 4054a in the direction of the photodetector covers the photodetector or a photosensitive surface of the photodetector; specifically, the displacement prism 4054a is provided with a 45 ° or a reflecting surface approaching 45 °, such as 42 °, and the projection of the reflecting surface of the displacement prism 4054a in the direction of the photodetector covers the photodetector or the photosensitive surface of the photodetector; the received signal light entering the shielding cavity 4053a is reflected by the displacement prism 4054a to the photodetector. Optionally, one end of the displacement prism 4054a is connected to the shielding cover plate 4052a, and the displacement prism 4054a is disposed in the shielding cavity 4053a by the shielding cover plate 4052 a. The displacement prism 4054a is arranged on the shielding cover plate 4052a, so that on one hand, the installation and arrangement of the displacement prism 4054a in the shielding cavity 4053a are facilitated, on the other hand, the coupling adjustment of the displacement prism 4054a in the receiving light path of the first light receiving component 405 is facilitated, the compensation of tolerance in the assembly process of the first light receiving component 405a is facilitated, the increase of the installation and adjustment difficulty of each component in the first light component 406a due to excessive tolerance superposition of the first light receiving component 405a is avoided, and the reduction of the installation and adjustment difficulty of each component in the first light component 406a is facilitated to a certain extent.

In some embodiments of the present application, a shield cover plate 4052a is provided with a shield opening 521, and the components in the shield cavity 4053a can be observed and the relative positions of the components can be determined through the shield opening 521; an opening cover 522 is arranged on the shielding cover opening 521, and the opening cover 522 is used for covering the shielding cover opening 521; when the assembly of the components in the shielding cavity 4053a is completed, the opening cover 522 is covered on the shielding cover opening 521, so that the shielding effect of the shielding cover is prevented from being influenced by the arrangement of the shielding cover opening 521. The shield shell 4051a, shield cover 4052a and vent cover 522 may be formed from a metallic material, such as die cast or milled metal.

In some embodiments of the present application, the photo-receiving electric devices of the photo-detector, the transimpedance amplifier, the limiting amplifier, etc. may be fixedly disposed on the photo-receiving support portion 4081 and electrically connected to the metal land area and the pad pins on the photo-receiving support portion 4081, then the shielding cover 4051a is disposed on the photo-receiving support portion 4081 and the displacement prism 4054a is fixed on the shielding cover 4052a, then the shielding cover 4052a is disposed on the shielding cover 4051a and the coupling adjustment of the photo-detector receiving optical path is performed before the shielding cover 4052a is fixed on the shielding cover 4051a, and finally the shielding cover 4052a and the shielding cover 4051a are fixed and the shielding cover opening 521 is closed by the opening cover 522.

Fig. 15 is a schematic structural view of a first connector provided in an embodiment of the present application, and fig. 16 is a schematic structural view of a second connector provided in an embodiment of the present application. As shown in the orientations of fig. 14 and 15, the left end of the first connector 408a is configured to extend into the first light receiving and transmitting cavity 403a for wire bonding to an electrical device in the first light emitting component 404a, the first light receiving component 405a, etc. within the first light receiving and transmitting cavity 403a, and the first connector 408a extends out of the first light receiving and transmitting cavity 403a for electrically connecting the circuit board 300 through the flexible circuit board.

As shown in fig. 15 and 16, the left end of the first connector 408a includes a light receiving supporting portion 4081a, and further includes a first step surface 4082a, a second step surface 4083a, and a third step surface 4084a, a plurality of pad pins are respectively disposed on the first step surface 4082a, the second step surface 4083a, and the third step surface 4084a, and the number of pad pins required for connecting the electrical devices in the first light emitting component 404a and the first light receiving component 405a with the first connector 408a is conveniently satisfied by disposing the first step surface 4082a, the second step surface 4083a, and the third step surface 4084a at the left end of the first connector 408 a; the first step surface 4082a, the second step surface 4083a and the third step surface 4084a are different heights at the left end of the first connector 408a, that is, the first step surface 4082a, the second step surface 4083a and the third step surface 4084a are located at different heights from the bottom surface of the first connector 408a, and the first step surface 4082a, the second step surface 4083a and the third step surface 4084a are arranged in a stepped manner at the left end of the first connector 408a, so that the control of the wire bonding length of the wire bonding connection of the electric devices in the first light emitting component 404a and the first light receiving component 405a can be conveniently matched. Optionally, the first step surface 4082a is provided with a pad pin for transmitting the high-frequency signal of the first light receiving component 405a, the second step surface 4083a is provided with a pad pin for transmitting the high-frequency signal of the first light emitting component 404a, and the third step surface 4084a is provided with a pad pin for transmitting the direct-current signals of the first light receiving component 405a and the first light emitting component 404a, so that the shortest wire bonding for transmitting the high-frequency signal of the first light emitting component 404a is conveniently realized, and the transmission quality of the high-frequency signal is ensured. In some embodiments of the present application, the shielding housing 4051a encloses the first step surface 4082 within the shielding cavity 4053a, which ensures the shielding effect of the shielding housing to some extent.

As shown in fig. 15 and 16, the right end of the first connector 408a is provided with a first boss 4085a, the upper and lower sides of the first boss 4085a are respectively provided with pad pins, and the pad pins of the upper and lower sides of the first boss 4085a are respectively correspondingly connected with the pad pins of the left end of the first connector 408 a. In some embodiments of the present application, the upper side of the first boss 4085a is configured with a pad pin for transmitting the dc signals of the first light receiving component 405a and the first light emitting component 404a, and the pad pin configured on the upper side of the first boss 4085a is correspondingly and electrically connected to the pad pin on the third step surface 4084a at the left end of the first connector 408 a. In some embodiments of the present application, the lower side surface of the first boss 4085a is configured with pad pins for transmitting the high-frequency signals of the first light receiving component 405a and the first light emitting component 404a, and the pad pins configured on the lower side surface of the first boss 4085a are correspondingly and electrically connected to the pad pins configured on the first step surface 4082a and the second step surface 4083a at the left end of the first connector 408 a.

Optionally, the upper side surface of the first boss 4085a and the third step surface 4084a are located on the same layer of the first connector 408a, that is, the upper side surface of the first boss 4085a and the third step surface 4084a are located at the same height of the first connector 408a, so that the signal connection line between the pad pin on the third step surface 4084a and the pad pin on the upper side surface of the first boss 4085a is located on the same layer of the first connector 408a, which is convenient for avoiding increasing the layer number of the first connector 408a and setting vias to realize connection of signal lines of different layers. Optionally, the lower side of the first boss 4085a includes a fourth step surface 851 and a fifth step surface 852, where the fourth step surface 851 and the first step surface 4082a are located on the same layer of the first connector 408a, and the fifth step surface 852 and the second step surface 4083a are located on the same layer of the first connector 408a, and further the fourth step surface 851 and the fifth step surface 852 are located at different heights on the right end of the first connector 408a, that is, the junction of the fourth step surface 851 and the fifth step surface 852 forms a step. The fourth step surface 851 and the first step surface 4082a are located at the same layer of the first connector 408a, so that a signal line between a pad pin on the first step surface 4082a for transmitting the high-frequency signal of the first light receiving component 405 and a pad pin on the fourth step surface 851 for transmitting the high-frequency signal of the first light receiving component 405 is located at the same layer of the first connector 408a, so that the performance of transmitting the high-frequency signal of the first light receiving component 405a is ensured; the fifth step surface 852 and the second step surface 4083a are located at the same layer of the first connector 408a, so that a signal line between a pad pin on the second step surface 4083a for transmitting the high-frequency signal of the first light emitting component 404a and a pad pin on the fifth step surface 852 for transmitting the high-frequency signal of the first light emitting component 404a is located at the same layer of the first connector 408a, so as to ensure the performance of transmitting the high-frequency signal of the first light emitting component 404 a.

In some embodiments of the present application, the first connector 408a is connected to the circuit board 300 by two flexible circuit boards, wherein one flexible circuit board is used to electrically connect the upper side of the first boss 4085a to the circuit board 300, and the other flexible circuit board is used to electrically connect the lower side of the first boss 4085a to the circuit board 300. Of course, in some embodiments of the present application, the lower side of the first boss 4085a and the circuit board 300 may be electrically connected by two flexible circuit boards. Alternatively, when the lower side surface of the first boss 4085a is electrically connected to the circuit board 300 through a flexible circuit board, the flexible circuit board used for electrically connecting the lower side surface of the first boss 4085a to the circuit board 300 may be a special-shaped flexible circuit board, for example, a U-shaped groove is formed on the flexible circuit board, and the U-shaped groove on the flexible circuit board corresponds to the steps of the fourth step surface 851 and the fifth step surface 852 directly, so that the lower side surface of the first boss 4085a is electrically connected to the circuit board 300 conveniently.

In some embodiments of the present application, one end of the shielding shell 4051a is provided with an opening, the open end face contacts the end face connected with the first step face 4082a, the shielding cover plate 4052a contacts the end face connected with the third step face 4084a or the third step face 4084a, the shielding cover plate 4052a covers the first step face 4082a, and then the bonding pad pin used for transmitting the high-frequency signal of the first light receiving component 405 on the first step face 4082a is packaged in the shielding cavity 4053a, so as to further ensure the shielding effect of the shielding shell in the first light receiving component 405a and ensure the performance of the first light receiving component 405a for receiving the signal light.

Fig. 17 is a schematic structural diagram of another direction of an optical transceiver sub-module according to an embodiment of the present application, and fig. 18 is an exploded schematic diagram of another direction of an optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 17 and 18, a cutout 4012a is provided on the bottom plate of the first optical transceiver housing 401a, and the light receiving support portion 4081a covers the cutout 4012a. The unfilled corner 4012a is arranged on the bottom plate of the first optical transceiver housing 401a, so that the deformation of the first connector 408a caused by the fact that the first optical transceiver housing 401a is heated or cooled to generate stress to squeeze the light receiving support portion 4081a of the first connector 408a can be effectively avoided, the deformation of the first connector 408a is reduced, and the stability of the optical path in the first optical transceiver cavity 403a is further protected; in addition, the unfilled corner 4012a can be filled with heat conducting gel to be in contact with the inner heat dissipation block of the optical module or the upper or lower shell of the optical module in the assembly process of the optical module, so that the number of layers of heat conducting paths passing through the position of the first connector 408a in the first optical receiving and transmitting cavity 403a is reduced, and the heat dissipation paths at the first connector 408a are simple and have good heat dissipation performance.

The optical transceiver sub-module 400 provided in the embodiment of the present application provides an optical transceiver sub-module of another structural form in addition to the optical transceiver sub-module 400a structural form. Fig. 19 is a schematic structural diagram of another optical transceiver sub-module, denoted as 400b, according to an embodiment of the present application; fig. 20 is a partially exploded view of another optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 19 and 20, another optical transceiver sub-module 400b provided in the embodiment of the present application includes a second optical transceiver housing 401b and a second optical transceiver cover plate 402b covering the second optical transceiver housing 401 b; the second optical transceiver housing 401b and the second optical transceiver cover plate 402b form a second optical transceiver cavity 403b, and a second optical transmitting component 404b for implementing optical signal transmission, a second optical receiving component 405b for implementing optical signal reception, and a second optical component 406b for implementing optical signal transmission path adjustment are disposed in the second optical transceiver cavity 403 b. The second light receiving and transmitting housing 401b and the light emitting cover plate 402b may be made of metal material, such as die-cast metal or milled metal. In the embodiment of the present application, the second light emitting component 404b includes a laser component, a laser driver, a TEC, a backlight detector, and the like, for implementing and assisting in implementing the optical module to generate the optical signal. In the embodiment of the present application, as shown in fig. 19, in the optical transceiver sub-module 400b, the second optical receiving component 405b adopts a coaxial packaging structure; further, the second light receiving element 405b includes a photodetector, a transimpedance amplifier, a limiting amplifier, or the like for receiving signal light, performing photoelectric conversion, and assisting photoelectric conversion. The second light receiving component 405b of the coaxial packaging structure can adopt a receiving TO with a relatively fixed structure, so that the light path stability caused by accumulated tolerance in the process of assembling the light receiving component is reduced, and the stability of a receiving light path is ensured conveniently; the second light receiving component 405b adopting the coaxial packaging structure is convenient for realizing coupling assembly of the light receiving component in the second light receiving and transmitting cavity 403b on one hand, and can promote stability of a receiving light path on the other hand.

As shown in fig. 19 and 20, an optical fiber adapter 407 is connected to one end of the second optical transceiver housing 401b away from the circuit board 300, and one end of the optical fiber adapter 407 is connected to the second optical transceiver cavity 403b, and the other end is used for connecting an external optical fiber. The signal light emitted from the second light emitting element 404b is transmitted to the optical fiber adapter 407 through the first light element 406a, and then transmitted to the external optical fiber through the optical fiber adapter 407; the signal light from the external optical fiber is transmitted into the second optical transceiver cavity 403b through the optical fiber adapter 407, and is transmitted to the second optical receiving component 405b through the second optical component 406b, and the second optical receiving component 405b receives the signal light; therefore, the signal light of the second light emitting component 404b and the signal light to be received by the second light receiving component 405b are transmitted together through the optical fiber adapter 407, so that the light emitted by the optical module and the received light are transmitted through one optical fiber.

In some embodiments of the present application, the structure of the second light emitting component 404b in the optical transceiver sub-module 400b can be referred to as the structure of the first light emitting component 404a in the second optical transceiver sub-module. In the optical transceiver sub-module 400b provided in the embodiment of the present application, the second optical receiving component 405b may be directly connected to the circuit board 300 through a flexible circuit board.

In some embodiments of the second optical transceiver sub-module provided in the present application, the structure of the second optical component 406b may be the same as that of the first optical component 406a in the first optical transceiver sub-module embodiment, but may also be changed according to actual needs.

Fig. 21 is a schematic diagram of an internal structure of a second optical transceiver cavity provided in an embodiment of the present application, fig. 22 is a schematic diagram of optical path transmission of a transmitting signal light and a receiving signal light in the second optical transceiver cavity provided in an embodiment of the present application, and a solid arrow in fig. 22 is a transmission optical path of the transmitting signal light, and a dashed arrow is a transmission optical path of the receiving signal light. As shown in fig. 21 and 22, the optical transceiver sub-module provided in the embodiment of the present application includes a second optical component 406b and a second wavelength screening device 4093; wherein the second light assembly 406b comprises a second lens 4061b, a third filter 4062b, a fourth filter 4063b, a second collimating lens 4064b, a second focusing lens 4065b, and the like.

The second collimating lens 4064b is disposed in the outgoing light direction of the second light emitting element 404b to convert the divergent light beam output by the second light emitting element 404b into a collimated light beam; the third filter 4062b is disposed in the light emitting direction of the second collimator lens 4064, the second lens 4061b is disposed in the light transmitting direction of the third filter 4062b, and the collimated light beam thus emitted via the second collimator lens 4064b is sequentially transmitted to the optical fiber adapter 407 through the third filter 4062b and the second lens 4061b, and the second lens 4061b is configured to converge the collimated light beam transmitted through the third filter 4062b to the optical fiber adapter 407. The fourth filter 4063b is disposed in the light reflection direction of the third filter 4062b, the second wavelength screening device 4093 is disposed in the transmission direction of the third filter 4062b, the second focusing lens 4065b is disposed in the light transmission direction of the second wavelength screening device 4093, and the second wavelength screening device 4093 screens transmitted reception signal light according to the wavelength of the reception signal light; the received signal light is transmitted to the optical fiber adapter 407 through the external optical fiber, is transmitted to the first lens 4061b through the optical fiber adapter 407, the second lens 4061b converts the divergent light beam into a collimated light beam, the collimated light beam converted by the second lens 4061b is transmitted to the third filter 4062b, the third filter 4062b reflects the collimated light beam to the fourth filter 4063b, and is transmitted to the second wavelength filter 4093 through the fourth filter 4063b, the signal light transmitted through the second wavelength filter 4093 is transmitted to the first focusing lens 4065b, and is converged and transmitted to the second light receiving component 405b through the first focusing lens 4065 b.

In this embodiment, the second wavelength filtering device 4093 is disposed on the optical path of the second light receiving element 405b in the optical transceiver sub-module 400b, and is used for filtering the wavelength of the signal light received by the second light receiving element 405 b. As shown in fig. 21 and 22, the second wavelength screening device 4093 includes a first mirror 932, a second mirror 933, and a piezoelectric ceramic device including a piezoelectric ceramic block 931, an air chamber 934 being formed between the first mirror 932 and the second mirror 933, the piezoelectric ceramic block 931 being connected to the first mirror 932. The voltage applied to both ends of the piezoelectric ceramic block 931 is controlled to vary, the amount of expansion and contraction of the piezoelectric ceramic block 931 is varied, and the width of the air chamber 934 between the first mirror 932 and the second mirror 933 is varied, so that the received signal light is selectively transmitted.

In some embodiments of the present application, the piezoceramic device further includes a cantilever 935, one side of the cantilever 935 is connected to the first mirror 932, the other side of the cantilever 935 is connected to one end of the piezoceramic block 931, and the piezoceramic block 931 is powered on to drive the first mirror 932 to move through the cantilever 935; the cantilever 935 facilitates the placement of the piezoelectric ceramic block 931 and drives the first mirror 932.

Since the voltage applied to the piezoelectric ceramic block 931 is high, a booster circuit is usually required in the optical module, and an adjustable voltage is supplied to the piezoelectric ceramic block 931 by the booster circuit. Fig. 23 is a diagram of a voltage boosting circuit provided in the embodiment of the present application, and the voltage boosting circuit of the piezoelectric ceramic block 931 is not limited to the circuit shown in fig. 23. In addition, in combination with the PWM type switching power supply chip, the booster circuit can apply a voltage change to the piezoelectric ceramic block 931.

Correspondingly, a wavelength screening device may be disposed in an emission optical path of the second light emitting component 404b in the optical transceiver sub-module 400b, where the wavelength screening device may select the second wavelength screening device 4093, and may also set the first wavelength screening device 4091 or the optical selective transmission device 4092 in the first light beam transceiver sub-module provided in the embodiment of the present application; of course, by adjusting the structure of the second optical component 406b, the first wavelength filtering device 4091 or the optical selective transmission device 4092 in the first optical beam transceiver sub-module provided in the embodiment of the present application can be selectively used on the receiving optical path of the second optical receiving component 405 b.

Fig. 24 is a partially exploded schematic view of another optical transceiver sub-module according to an embodiment of the present application, and fig. 25 is a cross-sectional view of another optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 24 and 25, the second optical transceiver housing 401b is provided with a second connector 408b, such as a ceramic connector, near one end of the circuit board 300. The second optical transceiver housing 401b is provided with a second connector opening 4011b near one end of the circuit board 300, the second connector 408b is embedded in the second connector opening 4011b and the second connector 408b is connected with the second connector opening 4011b in an interference fit manner, so that one end of the second connector 408b extends into the second optical transceiver cavity 403b, the other end extends out of the second optical transceiver cavity 403b, and one end extending into the second optical transceiver cavity 403b is generally used for wire bonding connection with an electric device in the second optical transmitter assembly 404b and the like in the second optical transceiver cavity 403 b; the surfaces of the two ends of the second connector 408b are provided with a plurality of pad pins for wire bonding with the second light emitting component 404b or electrically connecting with the flexible circuit board, respectively. Specific: one end of the second optical transceiver 403b extends to electrically connect the circuit board 300 with the flexible circuit board, and further electrically connect the circuit board 300 with the electrical devices in the second optical transmitting assembly 404b through the second connector 408 b; the electrical connection to the circuit board 300 may be through a flexible circuit board or a plurality of flexible circuit boards. Of course, in the second optical transceiver sub-module provided in the embodiment of the present application, the second light emitting component 404b may also be directly connected to the circuit board 300 through a flexible circuit board.

As shown in fig. 24 and 25, a light receiving opening 4101 is provided on the second light receiving and transmitting housing 401b, and a second light receiving member 405b is embedded in the light receiving opening 4012 b. In the optical transceiver sub-module 400b provided in some embodiments of the present application, the second optical transceiver housing 401b is further provided with a light receiving accommodating cavity 4013b, the light receiving accommodating cavity 4013b communicates with the light receiving opening 4012b, and the front end of the second light receiving component 405b is disposed in the light receiving accommodating cavity 4013 b. The side wall of the light receiving accommodating cavity 4013b is provided with an accommodating opening 4014b, the accommodating opening 4014b is arranged on the output light path of the second focusing lens 4065b, a first plane light window 4015b is embedded in the accommodating opening 4014b, and the first plane light window 4015b is used for sealing the accommodating opening 4014b and transmitting the received signal light output by the second focusing lens 4065 b. The first planar light window 4015b is a glass sheet that allows light to pass therethrough, and in order to enhance the transmittance of the planar light window, to prevent the light reflection phenomenon from affecting the performance of the second light receiving element 405b, the first planar light window 4015b is typically disposed inclined in the accommodation opening 4014b, e.g., inclined by 8 °, etc., and a plating film may be plated on the surface of the glass sheet.

The light receiving accommodating cavity 4013b can be integrally formed with the second light receiving and transmitting housing 401b, and is made of a metal structural member, such as a metal member subjected to die casting and milling; furthermore, the light receiving accommodating cavity 4013b of the accommodating opening 4014b is closed by the first planar light window 4015b, so that the air tightness requirement of the second light receiving and transmitting housing 401b can be met conveniently, the second light receiving component 405b can be shielded, and the interference of non-working signal light and electric signals on the second light receiving component 405b can be avoided.

Fig. 26 is a second cross-sectional view of another optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 26, the second optical component 406b provided in the embodiment of the present application further includes a second isolator 4066b, where the second isolator 4066b is disposed in the transmission optical path from the second collimating lens 4064b to the third filter 4062 b; the second isolator 4066b is configured to isolate the emitted signal light reflected by the third filter 4062b, so as to avoid the return of the original path of the emitted signal light reflected by the third filter 4062 b.

As shown in fig. 26, a second supporting platform 410b is disposed on a bottom plate of a second optical transceiver housing 401b provided in the embodiment of the present application, the second optical component 406b and the second wavelength screening device 4093 are all disposed on the second supporting platform 410b, for example, the second lens 4061b, the third filter 4062b, the fourth filter 4063b and the like are disposed on the second supporting platform 410b, and the second lens 4061b, the third filter 4062b, the fourth filter 4063b and the like are conveniently mounted and fixed by the second supporting platform 410 b. Further, the second support platform 410b is provided with a support column and other structures to facilitate auxiliary structures such as the second lens 4061b, the third filter 4062b, the fourth filter 4063b, the second isolator 4066b, the second wavelength screening device 4093 and the like.

Fig. 27 is a schematic structural diagram of a second support platform according to an embodiment of the present application. As shown in fig. 26 and 27, the second support platform 410b is provided with a support side plate 4102b, a mounting groove 4103b, and a second mount 4101b; one side of the support side plate 4102b supports and connects the side of the piezoelectric ceramic block 931, and a mounting slot 4103b is used for accommodating and fixing the first mirror 932 and the second mirror 933; the side wall of the second mounting seat 4101b is supported and connected with the third filter 4062b, the second mounting seat 4101b is embedded and fixed with the second isolator 4066b, a connecting through hole 4104b which is communicated with the third filter 4062b and the second isolator 4066b is arranged on the second mounting seat 4101b, and the connecting through hole 4104b is communicated with the third filter 4062b and the second isolator 4066b.

Fig. 28 is a schematic structural diagram of an optical fiber adapter according to an embodiment of the present application, and fig. 29 is a cross-sectional view of an optical fiber adapter according to an embodiment of the present application. As shown in fig. 28 and 29, the fiber optic adapter 407 in the embodiment of the present application includes a fiber optic adapter body 4071, a fiber optic ferrule 4072, and a clamping mechanism for facilitating the mounting of the fiber optic ferrule 4072 in the fiber optic adapter body 4071. In some embodiments of the present application, the clamping mechanism includes a collar 4073. As shown in fig. 28 and 29, one end of the ferrule 4073 is connected to the fiber optic adapter body 4071 and the ferrule 4073 is sleeved over the fiber optic ferrule 4072, with one end of the fiber optic ferrule 4072 being located within the fiber optic adapter body 4071. Of course, other types of clamping than collar 4073 may be used in the fiber optic adapters provided by embodiments of the present application.

The optical fiber is soft and is not easy to carry out high-precision position fixing with the light emitting sub-module, so that the optical fiber inserting core is designed. The optical fiber core insert is formed by wrapping the optical fiber with a harder material capable of realizing high-precision processing, and fixing the optical fiber is realized by fixing the material. Specifically, the optical fiber core insert can be formed by wrapping an optical fiber with a ceramic material, the optical fiber is used for transmitting light, the ceramic has higher processing precision, high-precision position alignment can be realized, the optical fiber core insert is formed by combining the optical fiber and the ceramic, and the optical fiber is fixed by fixing the ceramic. The ceramic material limits the fixing direction of the optical fiber in the optical fiber inserting core, the ceramic is generally processed into a cylinder, a linear through hole is arranged in the center of the ceramic cylinder, and the optical fiber is inserted into the through hole of the ceramic cylinder to realize fixing, so that the optical fiber is straightly fixed in the ceramic body.

In the embodiment of the present application, the optical fiber adapter body 4071 is provided with a protrusion 4071a, the protrusion 4071a is located on the surface of the optical fiber adapter body 4071, and the protrusion is protruded with respect to the main side of the optical fiber adapter body 4071.

Fig. 30 is a second cross-sectional view of an optical fiber adapter according to an embodiment of the present application. As shown in fig. 30, the end surface of the optical fiber ferrule 4072 at one end in the optical fiber adapter body 4071 is configured as an inclined end surface 4072b, such as an inclined end surface 4072b inclined by 8 °, so that the return of the optical module emission signal light to the external optical fiber through the optical fiber ferrule 4072 can be effectively prevented.

The inclined end surface of the optical fiber ferrule 4072 may be generally formed by grinding the end surface of the optical fiber ferrule 4072, so as to facilitate the grinding process of the inclined end surface of the optical fiber ferrule 4072, the sidewall of the ferrule 4073 is provided with a first plane group 4073a, and the first plane group 4073a includes two oppositely disposed planes, i.e., the first plane group 4073a includes two planes with central symmetry. When the polishing process of the inclined end face 4072b of the optical fiber ferrule 4072 is required, the optical fiber ferrule 4072 is fixed by the collar 4073, and then the optical fiber ferrule 4072 is clamped and fixed by the first plane group 4073a on the side wall of the collar 4073, so that the polishing process of the inclined end face of the optical fiber ferrule 4072 is facilitated.

In order to facilitate the grinding process of the inclined end surface of the optical fiber ferrule 4072, the collar 4073 is disposed in the middle of the optical fiber ferrule 4072, so that the optical fiber adapter 407 further includes a sleeve 4074, one end of the sleeve 4074 is connected to the other end of the collar 4073, the other end of the optical fiber ferrule 4072 is disposed in the sleeve 4074, and the other end of the sleeve 4074 is connected to the optical transceiver housing, thereby protecting the other end of the optical fiber ferrule 4072.

Further, the protrusion 4071a is provided with a second plane group 4071b, and the second plane group 4071b includes two oppositely disposed planes, that is, the second plane group 4071b includes two planes of central symmetry; when the optical fiber adapter body 4071 and the collar 4073 are assembled and fixed, the positioning of the optical fiber adapter body 4071 and the collar 4073 can be achieved through the mutual positioning of the second plane group 4071b and the first plane group 4073a, and then the installation and positioning of the inclined end face 4072b of the optical fiber ferrule 4072 in the optical transceiver sub-module can be conveniently achieved through the mutual positioning of the second plane group 4071b and the first plane group 4073 a. Optionally, a third plane group 4074a is provided on the sidewall of the sleeve 4074, where the third plane group 4074a includes two oppositely disposed planes, i.e., two planes of central symmetry of the third plane group 4074 a. When the collar 4073, the sleeve 4074 and the optical transceiver housing are assembled and fixed, the collar 4073, the sleeve 4074 and the optical transceiver housing can be positioned by positioning the second plane set 4071b, the third plane set 4074a and the optical transceiver housing, so that the installation and positioning of the inclined end face 4072b of the optical fiber ferrule 4072 in the optical transceiver sub-module can be further conveniently realized.

The sleeve 4074 is provided with a second planar optical window 4074b, and the second planar optical window 4074b is used for sealing the optical fiber adapter, so that the tightness of the optical transceiver sub-module 400 is ensured. The second planar light window 4074b is a glass sheet that allows light to pass therethrough, and in order to enhance the transmittance of the planar light window and prevent the light reflection phenomenon from affecting the light receiving and transmitting performance of the light receiving and transmitting sub-module 400, the second planar light window 4074b is typically disposed in the sleeve 4074 in an inclined manner, for example, by 8 °, and may be coated with a plating film on the surface of the glass sheet.

Fig. 31 is a schematic partial structure diagram of another transceiver sub-module according to an embodiment of the present application. As shown in the orientation of fig. 31, the left end of the second connector 408b provided in the embodiment of the present application is configured to extend into the first optical transceiver cavity 403a for wire bonding to an electrical device in the second optical transmitting component 404b and the like in the second optical transceiver cavity 403b, and the second connector 408b extends out of the second optical transceiver cavity 403b for electrically connecting to the circuit board 300 through the flexible circuit board.

Alternatively, as shown in fig. 31, the sixth step surface 4081b and the seventh step surface 4082b at the left end of the second connector 408b are located at different heights from the left end of the second connector 408b, that is, the sixth step surface 4081b and the seventh step surface 4082b are located at different heights from the bottom surface of the second connector 408 b. The sixth step surface 4081b and the seventh step surface 4082b are respectively provided with a plurality of pad pins, so that the pad pins can be arranged on the sixth step surface 4081b and the seventh step surface 4082b, thereby providing sufficient number of pad pins for the electric devices in the second light emitting component 404b and the like in the second light receiving and transmitting cavity 403 b. In some embodiments of the present application, the sixth step surface 4081b is provided with a pad pin for transmitting a high-frequency signal of the second light emitting component 404b, and the seventh step surface 4082b is provided with a pad pin for transmitting a direct-current signal of the second light emitting component 404b, so that the wire bonding for transmitting the high-frequency signal of the second light emitting component 404b is conveniently shortest, and the transmission quality of the high-frequency signal is ensured.

As shown in fig. 31, a second boss 4083b is disposed at the right end of the second connector 408b, and pad pins are disposed on the upper and lower sides of the second boss 4083b, respectively, and the pad pins on the upper and lower sides of the second boss 4083b are correspondingly connected to the pad pins at the left end of the second connector 408b, respectively. Optionally, the upper side of the second boss 4083b is provided with a pad pin for transmitting a dc signal such as the second light emitting component 404b, the lower side of the second boss 4083b is provided with a pad pin for transmitting a high-frequency signal of the second light emitting component 404b, the sixth step surface 4081b and the lower side of the second boss 4083b are located at the same layer of the second connector 408b, the seventh step surface 4082b and the upper side of the second boss 4083b are located at the same layer of the second connector 408b, the pad pin on the lower side of the second boss 4083b is correspondingly connected with the pad pin on the sixth step surface 4081b, and the pad pin on the upper side of the second boss 4083b is correspondingly connected with the pad pin on the seventh step surface 4082b, so that a signal line between the pad pin on the sixth step surface 4081b for transmitting a high-frequency signal of the second light emitting component 404b and the high-frequency signal pad pin on the lower side of the second boss 4083b is located at the same layer of the second connector 408b, so as to ensure the high-frequency signal performance of the second light emitting component 404 b.

In some embodiments of the present application, the second connector 408a is connected to the circuit board 300 by two flexible circuit boards, wherein one flexible circuit board is used to electrically connect the upper side of the second boss 4083b to the circuit board 300, and the other flexible circuit board is used to electrically connect the lower side of the second boss 4083b to the circuit board 300.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. An optical module, comprising:

a circuit board;

wherein, the optical transceiver sub-module includes:

a first optical transceiver housing;

The first connector is electrically connected with the circuit board, one end of the first connector stretches into the first optical transceiver cavity, and the other end of the first connector is positioned outside the first optical transceiver cavity;

the first light receiving assembly comprises a shielding cover, a light receiving electric device and a displacement prism, wherein the light receiving electric device is arranged on one end surface of the first connector, which extends into the first light receiving cavity, the shielding cover is arranged on the light receiving electric device, the bottom of the shielding cover is connected with the first connector, the shielding cover is used for shielding and isolation of the first light receiving assembly, and the displacement prism is arranged inside the shielding cover and connected with the top surface of the inner wall of the shielding cover, so that the displacement prism is positioned above the light receiving electric device.

2. The light module of claim 1 wherein the shield comprises:

a shield case;

The shielding cover plate is covered on the shielding cover shell and forms a shielding cavity with the shielding cover shell;

the light receiving electric device is arranged in the shielding cavity.

3. The light module of claim 2 wherein the displacement prism is connected to the shield cover plate; the light receiving device comprises a photoelectric detector, and the reflecting surface of the displacement prism is used for reflecting signal light from the outside of the light module to the photoelectric detector.

4. The light module of claim 2 wherein a receiving opening is provided in the shield housing, the receiving opening being provided on a transmission light path of the first light assembly to the shield cavity.

5. The light module of claim 2 wherein a shield opening and an open cover are provided on the shield cover, the open cover covering the shield opening.

6. The optical module of claim 2, wherein a bottom of the shield housing is connected to the first connector.

7. The light module of claim 6 wherein the first light assembly comprises a first focusing lens for focusing signal light from outside the light module into the shielded cavity.

8. The optical module of claim 6, wherein the first connector includes a first step surface and a third step surface, the first step surface having a plurality of pad pins disposed thereon, the shield cover plate contacting the third step surface and the shield cover plate covering the first step surface.

9. The optical module of claim 1, wherein the optical transceiver sub-module further comprises:

the wavelength screening device is arranged in the optical receiving and transmitting cavity, is arranged on a receiving optical path of the first optical receiving assembly and is used for receiving external electric signal light from the optical module and screening and transmitting according to the wavelength of the signal light.

10. The optical module of claim 9, wherein the wavelength screening device is a first wavelength screening device, the first wavelength screening device comprising a first TEC and a first wavelength screening filter, the first wavelength screening filter disposed on the first TEC, the first TEC disposed on a receiving optical path of the first light receiving assembly.