CN110542957A - Optical module - Google Patents

Abstract

The invention discloses an optical module.A heat insulation plate is arranged in a shell, and the shell is divided into a light emitting cavity and a light receiving cavity by the heat insulation plate. The light emitting device and the first TEC assembly are arranged in the light emitting cavity, and the light receiving device, the second filter plate, the second TEC assembly and the second TEC base are arranged in the light receiving cavity. In the light emission cavity, heat generated by temperature control of the light emitting device is absorbed by the first TEC assembly, and the heat is conducted out through the bottom plate of the shell by the first TEC assembly. And in the light receiving cavity, the second TEC assembly absorbs heat generated by controlling the temperature of the second filter plate, and transmits the heat to the side wall of the shell through the second TEC base and conducts the heat out. Therefore, in the optical module provided by the invention, the two TEC assemblies can lead out the heat generated by the corresponding optical device and the heat of the two TEC assemblies through different surfaces of the shell.

Description

Optical module

Technical Field

The invention relates to the technical field of optical fiber communication, in particular to an optical module.

Background

An optical module generally refers to an integrated module for photoelectric conversion, which is generally packaged by a light receiving device, a light emitting device, and a circuit board. With the increasing demand for communication bandwidth in the field of optical fiber communication, wavelength division multiplexing is generally used in the optical module to modulate optical signals with different wavelengths in the field, so as to improve the communication capacity of the optical fiber. Wavelength Division Multiplexing (WDM) technology can multiplex optical signals with different optical wavelengths into one optical fiber according to the optical wavelengths for transmission, and can also decompose multiple Wavelength optical signals simultaneously transmitted in the same optical fiber into single wavelengths for output respectively.

When the optical module modulates optical signals with different wavelengths by using the wavelength division multiplexing technology, thermal modulation needs to be performed by a TEC (Thermoelectric cooler). That is, the light emitting device in the optical module needs to modulate optical signals with different wavelengths by means of one TEC assembly, and the light receiving device needs to screen out optical signals with different wavelengths by means of another TEC assembly through temperature control.

When the optical module works, the light receiving device, the light emitting device and the TEC assemblies generate heat, and the arrangement of the two TEC assemblies in the optical module causes the heat generation amount to be larger. A large amount of heat is accumulated in the optical module, which easily causes the optical receiving device and the optical transmitting device to generate a thermal crosstalk phenomenon and a phenomenon that an optical signal cannot be modulated, thereby affecting the performance of the optical receiving device and the optical transmitting device and the normal operation of the optical module.

disclosure of Invention

The invention provides an optical module, which aims to solve the problem that the existing optical module cannot dissipate heat timely.

The present invention provides an optical module, comprising: the device comprises a shell, wherein a heat insulation plate is arranged in the shell, the shell is divided into a light emitting cavity and a light receiving cavity by the heat insulation plate, and a light emitting device and a first TEC assembly are arranged in the light emitting cavity; a light receiving device, a second filter, a second TEC component and a second TEC component base are arranged in the light receiving cavity;

The light emitting device is arranged on the upper heat exchange surface of the first TEC assembly, the lower heat exchange surface of the first TEC assembly is in heat conduction connection with the bottom plate of the shell, and the first TEC assembly and the bottom plate of the shell perform heat exchange;

the second filter plate is attached to the upper heat exchange surface of the second TEC assembly, the lower heat exchange surface of the second TEC assembly is in heat conduction connection with the second TEC assembly base, the second TEC assembly adjusts the temperature of the second filter plate, and the light receiving device receives light from the second filter plate;

One end of the second TEC assembly mount extends to a side wall of the housing so that the second TEC assembly exchanges heat with the side wall of the housing through the second TEC assembly mount.

According to the technical scheme, the light emitting device and the light receiving device are packaged in the same shell, the heat insulation plate is arranged in the shell, and the heat insulation plate and the shell form the light emitting cavity and the light receiving cavity. The light emitting device and the first TEC assembly are arranged in the light emitting cavity, and the light receiving device, the second filter plate, the second TEC assembly and the second TEC assembly base are arranged in the light receiving cavity. In the light emission cavity, first TEC subassembly is connected with the bottom plate heat conduction of casing, and the light emission device sets up on the heat exchange surface of first TEC subassembly, and first TEC subassembly is used for absorbing the heat that produces when carrying out temperature control to the light emission device to derive the heat through the bottom plate of casing. In the light receiving cavity, a second filter is attached to the upper heat exchange surface of a second TEC component, the second TEC component adjusts the temperature of the second filter, and a light receiving device receives light from the second filter so as to realize the screening of the wavelength of the received light by the second filter; the lower heat exchange surface of the second TEC assembly is in heat conduction connection with the second TEC assembly base, and one end of the second TEC assembly base extends to the side wall of the shell, so that the second TEC assembly carries out heat exchange with the side wall of the shell through the second TEC assembly base. Therefore, in the optical module provided by the invention, the two TEC assemblies are arranged on different heat dissipation surfaces of the shell, and the two TEC assemblies can timely guide out heat generated by the corresponding optical device and self heat through different surfaces of the shell. The two TEC assemblies are isolated by the heat insulation plate, and the light emitting device and the light receiving device are isolated, so that the crosstalk of heat in the two cavities is avoided, and the performance of the light receiving device and the light emitting device and the normal work of the optical module can be ensured.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any inventive exercise.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

Fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;

FIG. 4 is an exploded view of an optical module according to an embodiment of the present invention;

Fig. 5 is a schematic diagram of an overall structure of an optical transceiver according to an embodiment of the present invention;

fig. 6 is an exploded view of an optical transceiver according to an embodiment of the present invention;

Fig. 7 is a schematic diagram of an internal structure of an optical transceiver according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of an internal partial structure of an optical transceiver according to an embodiment of the present invention;

FIG. 9 is a schematic diagram of an alternative internal configuration of an optical transceiver according to an embodiment of the present invention;

Fig. 10 is a schematic connection diagram of a flexible circuit board according to an embodiment of the present invention;

FIG. 11 is a schematic structural diagram of a light emission cavity provided in an embodiment of the invention;

fig. 12 is a schematic structural diagram of a first TEC assembly according to an embodiment of the present invention;

Fig. 13 is a schematic structural diagram of a light receiving cavity provided in an embodiment of the present invention;

Fig. 14 is a schematic structural diagram of a second TEC assembly according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing devices such as computers use electrical signals, which require the interconversion between electrical signals and optical signals during the signal transmission process.

The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103; one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network unit 100 having the optical module.

An optical port of the optical module 200 is connected with the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit 100; the optical module 200 converts an optical signal and an electrical signal to each other, so as to establish a connection between the optical fiber 101 and the optical network unit 100. Specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.

The optical network unit 100 has an optical module interface 102, which is used for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200; the optical network unit 100 has a network cable interface 104 for accessing the network cable 103 and establishing a bidirectional electrical signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network unit 100. Specifically, the optical network unit 100 transmits a signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, and the optical network unit 100 monitors the operation of the optical module 200 as an upper computer of the optical module 200.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the onu 100 is an upper computer of the optical module 200, and provides a data signal to the optical module 200 and receives a data signal from the optical module 200, and a common upper computer of the optical module also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module 200 is inserted into an electrical connector in the cage 106, and an optical port of the optical module 200 is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board 105, and the electrical connector on the circuit board 105 is wrapped in the cage 106; the optical module 200 is inserted into the cage 106, the cage 106 fixes the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 through the optical module case and finally diffused by the heat sink 107 on the cage 106.

fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, an optical module 200 according to an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking handle 203, a circuit board 300, and an optical transceiver 400.

The upper shell 201 and the lower shell 202 form a package cavity with two openings, specifically, two ends of the package cavity are opened (204, 205) in the same direction, or two openings in different directions are opened; one of the openings is an electrical port 204 for being inserted into an upper computer such as an optical network unit, the other opening is an optical port 205 for external optical fiber access to connect internal optical fibers, and the photoelectric devices such as the circuit board 300 and the optical transceiver 400 are located in the package cavity.

The upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; the assembly mode that adopts upper casing, lower casing to combine is convenient for install devices such as circuit board in the casing, generally can not make the casing of optical module structure as an organic whole, like this when devices such as assembly circuit board, locating component, heat dissipation and electromagnetic shield structure can't install, also do not do benefit to production automation yet.

the unlocking handle 203 is positioned on the outer wall of the packaging cavity/lower shell 202, and the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; when the optical module is inserted into the upper computer, the unlocking handle fixes the optical module in the cage of the upper computer, and the clamping relation between the optical module and the upper computer is released by pulling the unlocking handle, so that the optical module can be drawn out from the cage of the upper computer.

In order to obtain optical signals with different wavelengths, wavelength division multiplexing is commonly used in the art to modulate the optical signals with different wavelengths in the optical module, so as to improve the optical fiber communication capacity. For this purpose, thermal conditioning is required by means of TEC assemblies (semiconductor coolers). When a light emitting device in an optical module emits a light signal, a laser chip in the light emitting device generates heat, and in order to stabilize the temperature of the laser chip and avoid changing the light emitting wavelength of the laser chip, the temperature of the laser chip needs to be maintained to be stable by means of a TEC (thermoelectric cooler) component so as to obtain a stable light signal; when the optical receiving device receives optical signals, because there are a plurality of lights from the optical fiber adapter, in order to screen out optical signals with appropriate wavelengths, the optical receiving device needs to screen out optical signals with different wavelengths by means of another TEC assembly through a temperature control mode.

In order to avoid the thermal crosstalk phenomenon in the optical module, embodiments of the present invention provide an optical module, where different TEC assemblies perform heat exchange with different heat dissipation surfaces.

Fig. 5 is a schematic overall structure diagram of an optical transceiver according to an embodiment of the present invention, and fig. 6 is a schematic exploded structure diagram of the optical transceiver according to the embodiment of the present invention.

an optical module provided in an embodiment of the present invention, specifically, an optical transceiver shown in fig. 5 and 6, includes: the shell 1, the shell 1 comprises apron 110 and cavity 120, and the apron 110 lock constitutes confined cavity on cavity 120, holds light emitting device 6 and light receiving device 8 in the cavity. The optical module provided by the embodiment of the invention has the characteristic of single-fiber bidirectional, so that the light emitting device 6 and the light receiving device 8 are encapsulated in the same cavity, the shell 1 is communicated with the optical fiber adapter 2, and the optical fiber adapter 2 simultaneously realizes the receiving and the transmitting of optical signals.

When the optical module works, heat generated by the light emitting device 6 can be diffused to the area where the light receiving device 8 is located, so that the light emitting device 6 and the light receiving device 8 are prone to generating a thermal crosstalk phenomenon, the effect of the light receiving part in temperature control and optical signal screening by utilizing the TEC assembly is influenced, and the wavelength adjustment precision is influenced.

Therefore, in order to avoid thermal crosstalk between the light emitting device 6 and the light receiving device 8, referring to the schematic internal structure of the light receiving device shown in fig. 7 and the schematic internal partial structure of the light receiving device shown in fig. 8, in the optical module provided in the embodiment of the present invention, a heat insulation plate 5 is disposed in the housing 1, and the heat insulation plate 5 is disposed in the housing 1 and divides the housing 1 into two regions, so that the heat insulation plate 5 divides the housing 1 into a light emitting cavity 101 and a light receiving cavity 102. The light emitting device 6 is placed in the light emitting cavity 101 and the light receiving device 8 is placed in the light receiving cavity 102.

In this embodiment, the optical fiber adapter 2 is disposed at the corresponding housing of the light emitting cavity 101, that is, the optical fiber adapter 2 is communicated with the light emitting cavity 101. The through hole 14 is arranged at the position of the housing 1 where the optical fiber adapter 2 is installed, in order to ensure the fixation stability of the optical fiber adapter 2, the housing 1 further comprises a hollow tube shell 130, the tube shell 130 is fixed on the side wall of the cavity 120, the tube shell 130 is communicated with the through hole 14, the tube shell 130 is used for installing the optical fiber adapter 2, so that the optical fiber insertion core 21 of the optical fiber adapter 2 is exposed out of the through hole 14, the optical fiber insertion core 21 is convenient to receive an optical signal emitted by the light emitting device 6, and the optical signal transmitted by the optical fiber insertion core 21 is received by the light receiving device. In this embodiment, the case 130 may be integrally formed with the cavity 120.

The light outlet of the light emitting device 6 in the light emitting cavity 101 corresponds to the light inlet of the optical fiber adapter 2, so that light emitted by the light emitting device 6 can enter the optical fiber adapter 2, the optical fiber ferrule 21 is installed in the optical fiber adapter 2, and the received light emitted by the light emitting device 6 is emitted by the optical fiber ferrule 21. In the signal conversion process, the optical transmitter 6 receives the electrical signal, converts the electrical signal into an optical signal, and emits the optical signal into the optical fiber adapter 2 corresponding to the optical transmitter 6.

Since the light emitting device 6 and the light receiving device 8 are separated by the heat insulating board 5, and the optical fiber adapter 2 is disposed only at a position of the housing 1 corresponding to the light emitting cavity 101, in order to allow the optical signal from the optical fiber adapter 2 to enter the light receiving cavity 102 to be received by the light receiving device 8, in the present embodiment, the light through opening 51 may be opened in the heat insulating board 5.

As shown in fig. 9, which is another angle of the internal structure of the optical transceiver, since the optical fiber ferrule 21 of the optical fiber adapter 2 faces the light emitting device 6 but does not face the light receiving device 8, in order for the light receiving device 8 to receive the optical signal from the optical fiber adapter 2, in the present embodiment, the first filter 88 is disposed at the optical port 51. The first filter 88 is disposed in the light emission cavity 101 and is disposed obliquely in a direction along the fiber optic adapter 2 to the light emitting device 6. When the optical signal from the optical fiber adapter 2 is transmitted in the direction of the light emitting device 6, the optical signal is irradiated to the first filter 88 located between the light emitting device 6 and the optical fiber adapter 2, and the reflection is generated on the first filter 88, and the reflected light enters the light receiving cavity 102 through the light through hole 51. The light receiving device 8 is arranged in the light receiving cavity 102, and the reflected light enters the light receiving cavity 102 and is received by the light receiving device 8.

Referring to fig. 7 and 8, the light emitting device 6 includes a laser chip 61, a condensing lens 63, an optical isolator 64, and an integrated stage 65. The laser chip 61 is used for emitting optical signals according to the electric signals; the converging lens 63 is used for converging the dispersed optical signals into parallel light, so that optical loss during long-distance transmission is avoided; the optical isolator 64 is a passive device which allows light to pass in one direction and prevents the light from passing in the opposite direction, and is used for limiting the propagation direction of the light, so that the light can be transmitted only in one direction, the light reflected by the optical fiber echo can be well isolated by the optical isolator 64, and the light wave transmission efficiency is improved; integration platform 65 is as unable adjustment base for other light emitting device, such as optical isolator 64, focusing lens 80 and first filter 88 to adjust light emitting device's height, make light emitting device 6's the light-emitting window can correspond with the income light inlet of fiber adapter 2, improve the optical coupling effect.

Fig. 10 is a schematic connection diagram of a flexible circuit board according to an embodiment of the present invention. As shown in fig. 10, in order to supply power to the optical devices (the light emitting device 6 and the light receiving device 8), the optical module provided in the present embodiment is configured with corresponding flexible circuit boards for the light emitting device 6 and the light receiving device 8, that is, the first flexible circuit board 3 and the second flexible circuit board 4 are mounted at one end of the housing 1. Two flexible circuit boards and optical fiber adapter 2 are installed on different sides of casing 1, and flexible board mounting groove 13 is seted up to the one end lateral wall that the mounted position of casing 1 and optical fiber adapter 2 is relative, fixes first flexible circuit board 3 and second flexible circuit board 4 in flexible board mounting groove 13.

The first flexible circuit board 3 extends into the light emission cavity 101 and is electrically connected to the light emitting device 6. The first flexible circuit board 3 supplies power and an electric signal to the light emitting device 6, and the light emitting device 6 converts the received electric signal into an optical signal and emits the optical signal. The second flexible circuit board 4 extends into the light receiving cavity 102 and is electrically connected with the light receiving device 8, and the light receiving device 8 transmits the optical signal from the optical fiber adapter 2 to the second flexible circuit board 4 to form an electrical signal.

In the light emitting cavity 101, the propagation path of the optical signal generates an optical signal for the laser chip 61, and the optical signal enters the fiber ferrule 21 of the fiber adapter 2 and then is emitted. Since the optical signal generated by the laser chip 61 is polarized light, in order to avoid optical loss, the converging lens 63 is disposed in the emitting direction of the optical signal, and the optical signal emitted by the laser chip 61 is converted into parallel light by the converging lens 63 and continues to propagate in the direction of the optical fiber adapter 2.

An optical isolator 64 is provided at the light exit of the converging lens 63, and after an optical signal enters the optical isolator 64, the optical signal is rotated in the polarization direction of light and then emitted, and the emitted optical signal enters the optical fiber ferrule 21 of the optical fiber adapter 2. If optical signal produces the reflection at optic fibre lock pin 21 department, the reflected light shines the light-emitting port of optical isolator 64 again along former propagation path, but because the polarization direction of optical signal changes, the reflected light can't get into in the optical isolator 64 according to former propagation path again, consequently, can avoid the reflected light to get into laser chip 61 through optical isolator 64 again in, avoids influencing the luminous performance of laser chip 61.

The optical isolator 64 is fixed to a side wall of the integrated stage 65, and a light passage communicating with a light outlet of the optical isolator 64 is provided in the integrated stage 65, and the light outlet of the light passage corresponds to a light inlet of the optical fiber adapter 2. The optical path is used to propagate the optical signal passing through the optical isolator 64, and the optical signal emitted from the optical path can enter the optical fiber adapter 2.

Thus, within the light emitting cavity 101, the propagation path of the optical signal is: light emitted by the laser chip 61 is converged by the converging lens 63, and then parallel light is emitted after entering the light path through the optical isolator 64, and the emitted light is emitted after entering the optical fiber ferrule 21 in the optical fiber adapter 2.

In the light receiving cavity 102, in order to fix the first filter 88 to ensure the efficiency of light signal reflection, in this embodiment, a light exit inclined plane 650 is provided at the light exit of the integrated platform 65, and the light exit inclined plane 650 is an inclined surface, and is inclined along the direction from the optical fiber adapter 2 to the light emitting device 6. The first filter 88 is disposed on the light exit inclined plane 650 to ensure that the light signal from the fiber adapter 2 can be reflected after being irradiated to the first filter 88, and the reflection direction is toward the light receiving cavity 102.

The optical signal from the fiber adapter 2 is divergent light, and in order to improve the optical coupling efficiency and avoid optical loss, in this embodiment, a focusing lens 80 is disposed between the first filter 88 and the fiber adapter 2. The optical signal from the optical fiber adapter 2 passes through the focusing lens 80, then is irradiated onto the first filter 88 and reflected, and the formed reflected light enters the light receiving cavity 102 through the light opening 51 and is emitted into the light receiving device 8.

Since the focusing lens 80 is disposed between the integrated platform 65 and the optical fiber adapter 2, and the light outlet of the integrated platform 65 is located on the light outlet inclined plane 650, at this time, in the region between the integrated platform 65 and the optical fiber adapter 2, the path of the optical signal received by the optical fiber adapter 2 coincides with the path of the outgoing optical signal, so that when the optical fiber adapter 2 receives the optical signal emitted by the laser chip 61, the optical signal also passes through the focusing lens 80, and the optical signal passes through the focusing lens 80 to form parallel light, and then is emitted into the optical fiber adapter 2.

Referring to fig. 9, the light receiving device 8 includes a light path changing stage 81, a reflection sheet 82, a second filter 83, a reflection surface 84, a light receiving chip 85, a second ceramic substrate 86, and a second conductive metal layer 87. The light path changing platform 81 is used for receiving the light signal and changing the direction of the propagation path, a light changing path is arranged in the light path changing platform 81, a light inlet of the light changing path corresponds to the light through opening 51, and the light signal reflected by the light emitting cavity 101 through the light through opening 51 enters the light changing path to be propagated.

the light changing surface 810 of the light path changing platform 81 is provided with the reflection sheet 82, the light changing surface 810 is a surface of the light path changing platform 81 which is obliquely arranged, and the light changing surface 810 corresponds to the light through hole 51. The inclined direction of the light-changing surface 810 is the direction along the fiber adapter 2 to the light-receiving device 8. The reflector plate 82 is disposed on the light affecting surface 810 such that a light signal propagating in the light affecting path reflects upon impinging on the reflector plate 82 and propagates along the length of the light receiving cavity 102.

In order to ensure that the optical signal which changes the propagation direction through the optical path changing platform 81 is parallel light and avoid light loss during long-distance transmission, a second filter 83 is arranged at the light outlet of the optical path changing platform 81, a reflecting surface 84 is arranged at the light outlet of the second filter 83, and a light receiving chip 85 is arranged at the light outlet of the reflecting surface 84. The reflection surface 84 receives the optical signal filtered by the second filter 83, reflects the optical signal to the light receiving chip 85 located below the reflection surface 84, and receives the optical signal by the light receiving chip 85.

Therefore, in the light receiving cavity 102, the propagation path of the optical signal is: the optical signal from the optical fiber adapter 2 is converged by the focusing lens 80, and then irradiated onto the first filter 88, and reflected, the reflected light enters the light receiving cavity 102 through the light port 51, the light incident into the light receiving cavity 102 through the light port 51 enters the light path changing platform 81 through the light changing path, the incident light is irradiated onto the reflector 82 and reflected, the reflected light enters the reflection surface 84 through the second filter 83, and the reflected light passing through the reflection surface 84 is emitted downward into the light receiving chip 85.

The reflecting surface 84 and the light receiving chip 85 are fixed to adjust the height of the light receiving device in the optical path transmission, thereby ensuring the optical coupling effect. In this embodiment, a second conductive metal layer 87, a reflection surface 84, and a light receiving chip 85 are provided on a second ceramic substrate 86. The second ceramic substrate 86 is used to fix the reflection surface 84 and the light receiving chip 85, so that the light exit of the reflection surface 84 corresponds to the light sensing surface of the light receiving chip 85, and the light receiving chip 85 can receive the optical signal transmitted by the reflection surface 84, thereby avoiding optical loss.

The light receiving chip 85 is connected to the second conductive metal layer 87, the second ceramic substrate 86 is connected to the second flexible circuit board 4 through the second conductive metal layer 87, and the optical signal received by the light receiving chip 85 is transmitted to the second flexible circuit board 4 through the second conductive metal layer 87, so that the optical signal is converted into an electrical signal, and the photoelectric conversion of the optical module is realized.

As can be seen, in the optical module provided in the embodiment of the present invention, the light emitting device 6 and the light receiving device 8 are encapsulated in one housing 1, and the light emitting device 6 and the light receiving device 8 are separated by the thermal insulation board 5, so that the thermal crosstalk phenomenon is prevented from occurring and affecting the performance of the light emitting device 6 and the light receiving device 8. The light emitting device 6 and the light receiving device 8 share one optical fiber adapter 2, and the optical fiber adapter 2 simultaneously realizes the receiving and the sending of optical signals to form a single-fiber bidirectional optical module.

When a single-fiber bidirectional optical module modulates optical signals with different wavelengths by using a wavelength division multiplexing technology, two TEC (semiconductor cooler) assemblies are required for thermal modulation. Therefore, the present embodiment provides an optical module in which the first TEC assembly 7 is disposed in the light emitting cavity 101 and the second TEC assembly 9 is disposed in the light receiving cavity 102.

In order to avoid the phenomenon that the optical receiving device 8 and the optical emitting device 6 generate thermal crosstalk and the TEC assemblies (7 and 9) cannot modulate optical signals when the optical module works, the performance of the optical receiving device 8 and the optical emitting device 6 and the normal work of the optical module are influenced. In the optical module provided by this embodiment, the heat dissipation of the corresponding optical device is realized by the corresponding TEC assembly, and the optical devices in the two cavities (101, 102) realize heat exchange through different surfaces of the cavity 120, so as to avoid the heat being conducted to the same surface to affect the heat exchange effect.

specifically, when heat dissipation is achieved in the light emission cavity 101, the first TEC assembly 7 is disposed on the bottom plate 11 of the housing 1, and the light emitting device 6 is disposed on the upper heat exchange surface of the first TEC assembly 7. The first TEC assembly 7 modulates the light emitting device 6 to emit light signals with different wavelengths, and simultaneously, the heat generated by the light emitting device 6 can be conducted out from the bottom plate 11 of the housing 1, so that the heat dissipation of the light emitting cavity 101 is realized.

The light emitting device 6 includes a ceramic substrate 60, a conductive metal layer 62 disposed on the ceramic substrate 60, and a laser chip 61 disposed on the conductive metal layer 62. The laser chip 61 is apt to generate heat when emitting an optical signal, which is a main source of heat generation in the light emitting device 6. The conductive metal layer 62 is disposed on the surface of the ceramic substrate 60, the ceramic substrate 60 is electrically connected to the first flexible circuit board 3 through the conductive metal layer 62, and the laser chip 61 is connected to the conductive metal layer 62, so that an electrical signal generated by the first flexible circuit board 3 enters the laser chip 61 through the conductive metal layer 62, and the laser chip 61 emits an optical signal.

The laser chip 61 is in heat conduction connection with the first TEC assembly 7 through the ceramic substrate 60, and the first TEC assembly 7 is configured to absorb heat generated by the laser chip 61 through the ceramic substrate 60 and conduct the heat away from the base plate 11. The first TEC assembly 7 is located below the ceramic substrate 60, and when heat is generated by the laser chip 61 on the ceramic substrate 60, the heat is absorbed by the first TEC assembly 7 and is guided to the outside of the housing 1 through the bottom plate 11 of the housing 1.

to more clearly illustrate the heat dissipation effect of the first TEC assembly 7, referring to the schematic structural diagram of the light emission cavity shown in fig. 11 and the schematic structural diagram of the first TEC assembly shown in fig. 12, in the optical module provided by the embodiment of the present invention, the first TEC assembly 7 includes a first TEC assembly upper heat exchange surface 71, a first TEC assembly structural member 72, and a first TEC assembly lower heat exchange surface 73.

the ceramic substrate 60 is arranged on the top of the heat exchange surface 71 on the first TEC assembly, and the heat exchange surface 71 on the first TEC assembly is used for absorbing heat generated by the laser chip 61 on the ceramic substrate 60. The bottom of the heat exchange surface 71 on the first TEC assembly is connected with a first TEC assembly structure 72, the first TEC assembly structure 72 is fixed on the lower heat exchange surface 73 of the first TEC assembly, the first TEC assembly structure 72 is used for transferring heat absorbed by the upper heat exchange surface 71 of the first TEC assembly to the lower heat exchange surface 73 of the first TEC assembly, and the lower heat exchange surface 73 of the first TEC assembly is connected with the bottom plate 11 in a heat conduction manner, so that heat carried by the lower heat exchange surface 73 of the first TEC assembly can be conducted out of the housing 1 through the bottom plate 11.

It can be seen that, within the light emission cavity 101, the heat dissipation and conduction path of the heat generated by the light emitting device 6 is: the upper heat exchange surface 71 of the first TEC assembly absorbs heat generated by the laser chip 61 through the ceramic substrate 60, and conducts the heat to the lower heat exchange surface 73 of the first TEC assembly through the first TEC assembly structural member 72, and the heat is conducted out through the bottom plate 11 through the lower heat exchange surface 73 of the first TEC assembly.

in the specific structural design, because the appearance shape of the first TEC assembly is a square, the upper heat exchange surface of the first TEC assembly and the lower heat exchange surface of the first TEC assembly are arranged in parallel with the bottom plate of the housing 1 respectively.

When the optical module operates, the temperature of the ceramic substrate 60 is increased by heat generated by the laser chip 61, and when the heat dissipation is realized by the first TEC assembly 7, the first TEC assembly 7 absorbs the heat of the ceramic substrate 60 and guides the heat out of the bottom plate 11 of the housing 1, and at this time, the temperature of the ceramic substrate 60 is reduced. That is, when the laser chip 61 generates heat, the temperature of the ceramic substrate 60 is high, and the temperature of the first TEC assembly 7 is low; when the first TEC assembly 7 dissipates heat, the temperature of the ceramic substrate 60 is low, and the temperature of the first TEC assembly 7 is high.

in order to enable the first TEC assembly 7 to work normally, in this embodiment, the first TEC assembly 7 further includes a first electrode 74, and the first electrode 74 is used to supply power to the first TEC assembly 7, so as to achieve a heat dissipation effect. One end of the first electrode 74 is electrically connected to the conductive metal layer 62, and the other end of the first electrode 74 is fixed on the first TEC assembly lower heat exchange surface 73. When the first flexible circuit board 3 supplies power to the light emitting device 6, the transfer of the power is achieved through the conductive metal layer 62. The conductive metal layer 62 transmits a part of the electric energy to the laser chip 61 to ensure the normal operation of the laser chip 61; another portion of the electrical energy is then transmitted to the first electrode 74 to ensure proper operation of the first TEC assembly 7 by the first electrode 74. In order for the conductive metal layer 62 on the ceramic substrate 60 to smoothly supply power to the first electrode 74, it is necessary that the height of the first electrode 74 is flush with the height of the ceramic substrate 60.

in the optical module provided by the above embodiment, when heat is dissipated, the lower heat exchange surface 73 of the first TEC assembly is placed on the bottom plate 11, and at this time, the size of the area of the bottom plate 11 that can be used for dissipating heat is the area of the lower heat exchange surface 73 of the first TEC assembly. In order to improve the heat dissipation efficiency of the light emission cavity 101, in the optical module provided in the embodiment of the present invention, a heat conduction layer 75 may be further disposed between the lower heat exchange surface 73 of the first TEC assembly and the bottom plate 11, and the heat conduction layer 75 is used to realize the heat conduction connection between the lower heat exchange surface 73 of the first TEC assembly and the bottom plate 11, so as to increase the heat dissipation area of the lower heat exchange surface 73 of the first TEC assembly.

The heat conduction layer 75 elevates the first TEC assembly 7, and then adjusts the height of the laser chip 61 to adapt to the light path plane, and the contact area between the heat conduction layer and the bottom plate 11 is larger than the contact area between the heat exchange surface 73 and the bottom plate 11 under the first TEC assembly, so as to increase the available area for the bottom plate 11 to dissipate heat, and further improve the heat dissipation effect.

As can be seen, in the optical module provided in the embodiment of the present invention, in the light emission cavity 101, the first TEC assembly 7 is disposed between the light emitting device 6 and the bottom plate 11 of the housing 1, the ceramic substrate 60 absorbs heat generated by the laser chip 61 through the upper heat exchange surface 71 of the first TEC assembly, and conducts the heat to the lower heat exchange surface 73 of the first TEC assembly through the first TEC assembly structural member 72, and then the lower heat exchange surface 73 of the first TEC assembly conducts the heat out through the bottom plate 11. The first TEC assembly 7 can also conduct the heat generated by itself out of the heat radiation outgoing path through the bottom plate 11 while conducting the heat generated by the laser chip 61 out of the housing 1, so that the light emitting device 6 and the first TEC assembly 7 are both in a normal temperature environment, thermal crosstalk does not occur, the effect of modulating an optical signal by the first TEC assembly 7 is not affected, and the temperature of the light emitting device 6 is maintained stable to obtain a stable optical signal.

When heat dissipation is performed in the light-receiving cavity 102, the heat dissipation path of the light-receiving device 8 in the light-receiving cavity 102 is different from the heat dissipation path of the light-emitting device 6 in the light-emitting cavity 101, the heat dissipation path of the light-emitting device 6 is led out from the bottom plate 11 of the housing 1, and the heat dissipation path of the light-receiving device 8 is led out from the side wall 12 of the housing 1. The two cavities adopt different heat dissipation leading-out paths for heat dissipation, so that the heat dissipation effect of the two cavities can be ensured, the mutual influence of the heat dissipated by the two cavities due to the same heat dissipation leading-out path is avoided, and the heat dissipation efficiency is reduced.

Specifically, when heat is dissipated from the light receiving device 8, the second TEC assembly 9 is disposed in the light receiving cavity 102 in a side-standing manner, and unlike the first TEC assembly 7, the second TEC assembly 9 is disposed in a manner parallel to the bottom plate 11 and perpendicular to the bottom plate 11 of the housing 1. The light receiving device 8 includes a second filter 83, and when the light receiving device receives the optical signal from the optical fiber adapter 2, the optical signal that does not meet the wavelength requirement needs to be filtered by the second filter 83, and then enters the second flexible circuit board 4 to be converted into an electrical signal. In the light receiving cavity 102, the transmission path direction of the optical signal is parallel to the direction of the bottom plate 11, so that in order to make the horizontally propagating optical signal pass through the second filter 83, the second filter 83 needs to be vertically disposed, that is, the second filter 83 is perpendicular to the bottom plate 11 and perpendicular to the transmission path of the optical signal.

The second TEC assembly 9 includes a second TEC assembly upper heat exchange surface 91, a second TEC assembly structural member 92, and a second TEC assembly lower heat exchange surface 96, which are respectively disposed on the side, and the second TEC assembly 9 is disposed on a second TEC assembly base 93.

Because the light propagation path is horizontal direction and is on a parallel with lateral wall 12, the optical signal that the transmission was come needs to pass through second filter 83, consequently, need second filter 83 perpendicular to bottom plate 11 and lateral wall 12 setting to attached on second TEC subassembly heat exchange surface 91, make second TEC subassembly heat exchange surface 91 also perpendicular with bottom plate 11 and lateral wall 12 simultaneously, be convenient for thermal transmission, second TEC subassembly base 93 need perpendicular to bottom plate 11 and lateral wall 12 simultaneously.

When the light receiving device 8 receives the light signal, the TEC assemblies are used to screen out the light signals with different wavelengths in a temperature control manner, that is, the second TEC assembly 9 is used to screen out the light signals with different wavelengths by controlling the temperature of the second filter 83. And second filter 83 sets up perpendicularly relative to the casing bottom plate, for the temperature of second filter 83 is adjusted to second TEC subassembly 9 to filter the optical signal of different wavelength through the mode of accuse temperature, consequently, set up second filter 83 on the last heat exchange surface of second TEC subassembly 9, and then need the also vertical setting of second TEC subassembly 9, second TEC subassembly 9 side stands in light receiving cavity 102 promptly, is perpendicular with bottom plate 11. In the specific structural design, because the appearance shape of the second TEC assembly is a square, the upper heat exchange surface of the second TEC assembly and the lower heat exchange surface of the second TEC assembly are respectively arranged in the vertical direction with the bottom plate of the housing 1.

It can be seen that, in order to adapt to the light propagation path, in the light emission cavity 101, the first TEC assembly 7 is located below the first ceramic substrate 60 and parallel to the base plate 11, so that the heat exchange surface 71 on the first TEC assembly is parallel to the light outgoing direction of the laser chip 61; in the light receiving cavity 102, the second TEC assembly 9 is perpendicular to the base plate 11, and the heat exchanging surface 91 of the second TEC assembly is perpendicular to the light propagation direction, so that the heat exchanging surface 71 of the first TEC assembly is perpendicular to the heat exchanging surface 91 of the second TEC assembly.

When this embodiment dispels the heat to light receiving device 8, the heat dissipation derivation route of adoption is derived by lateral wall 12 of casing 1, consequently is connected second TEC subassembly 9 and lateral wall 12 of casing 1, and second TEC subassembly 9 is used for realizing second filter 83 accuse temperature to make second filter 83 screen the optical signal of different wavelength, second TEC subassembly 9 is derived by lateral wall 12 with the absorptive heat of refrigeration.

To more clearly illustrate the heat dissipation effect of the second TEC assembly 9, referring to the schematic structural diagram of the light receiving cavity shown in fig. 12 and the schematic structural diagram of the second TEC assembly shown in fig. 13, in the optical module provided in the embodiment of the present invention, the second TEC assembly 9 includes a second TEC assembly upper heat exchange surface 91, a second TEC assembly structural member 92, and a second TEC assembly lower heat exchange surface 96, which are respectively disposed on the sides, and the second TEC assembly 9 is disposed on a second TEC assembly base 93.

The second filter 83 is arranged on a heat exchange surface 91 of the second TEC component, and the heat exchange surface 91 of the second TEC component is used for absorbing heat generated when the temperature of the second filter 83 is controlled. The inner side wall of the upper heat exchange surface 91 of the second TEC assembly is connected with the second TEC assembly structural member 92, the second TEC assembly structural member 92 is fixed on the lower heat exchange surface 96 of the second TEC assembly, and two ends of the second TEC assembly structural member 92 are respectively connected with the upper heat exchange surface 91 of the second TEC assembly and the lower heat exchange surface 96 of the second TEC assembly. The second TEC assembly lower heat exchanging surface 96 is fixed to a side wall of the second TEC assembly base 93, the second TEC assembly lower heat exchanging surface 96 is used for transferring heat absorbed by the second TEC assembly upper heat exchanging surface 91 to the second TEC assembly base 93, and one end of the second TEC assembly base 93 is connected to the side wall 12 of the housing 1, so that heat carried by the second TEC assembly base 93 can be conducted out of the outer side of the housing 1 by the side wall 12 of the housing 1.

It can be seen that, within the light receiving cavity 102, the heat dissipation exit path of the second TEC assembly 9 is: the heat exchange surface 91 on the second TEC assembly absorbs heat generated when the temperature of the second filter 83 is controlled, and transmits the heat to the heat exchange surface 96 under the second TEC assembly through the second TEC assembly structural member 92, and then transmits the heat to the second TEC assembly base 93 through the heat exchange surface 96 under the second TEC assembly, and the second TEC assembly base 93 transmits the heat out through the side wall 12 of the housing 1.

The second TEC assembly mount 93 is configured to carry a second TEC assembly lower heat exchange surface 96 to conduct heat transferred from the second TEC assembly lower heat exchange surface 96 to the side wall 12 of the housing 1.

The surface for realizing heat dissipation in the light receiving cavity 102 is a side wall 12 of the housing 1, the portion of the second TEC assembly base 93 for carrying the second TEC assembly 9 is for receiving heat, i.e., the portion in contact with the lower heat exchange surface 96 of the second TEC assembly is for receiving heat, one end of the portion of the second TEC assembly base 93 for receiving heat extends along the side wall 12, and a heat conducting portion is formed to be perpendicular to the portion for receiving heat and to be in contact with the side wall 12; the other end of the portion of the second TEC assembly base 93 for receiving heat extends in a direction opposite to the side wall 12 such that the second TEC assembly base 93 has a Z-shaped configuration. After receiving the heat, the second TEC assembly base 93 conducts the heat to the side wall 12 of the housing 1 by using the Z-shaped structural feature of the second TEC assembly base, thereby realizing heat exchange.

Within the light receiving cavity 102, heat exchange is effected by the side walls 12 of the housing, rather than the bottom plate 11 as employed in the light emitting cavity 101. The bottom plate 11 and the side wall 12 are perpendicular, so that the heat absorbed by the two heat exchange surfaces (the heat exchange surface 91 on the second TEC assembly and the heat exchange surface 71 on the first TEC assembly) is conducted through different surfaces of the housing 1, and the thermal crosstalk between the two cavities (the light emitting cavity 101 and the light receiving cavity 102) can be avoided.

To improve the heat removal effect, the second TEC assembly mount 93 includes: a heat receiving part 931 and a heat deriving part 932. The heat receiving portion 931 is configured to receive heat conducted by the lower heat exchanging surface 96 of the second TEC assembly, and the heat guiding portion 932 is configured to guide the heat received by the heat receiving portion 931 along the side wall 12, so as to increase a contact area between the base 93 of the second TEC assembly and the side wall 12, and improve heat dissipation efficiency.

The heat receiving portion 931 is attached to the lower heat exchanging surface 96 of the second TEC assembly, one end of the heat receiving portion 931 is connected to the heat conducting portion 932, the heat conducting portion 932 is connected to the side wall 12 in a heat conducting manner, and the heat conducting portion 932 is a heat conducting portion of the second TEC assembly base 93 extending along the side wall 12. The heat transferred from the lower heat exchange surface 96 of the second TEC assembly can be absorbed by the heat receiving portion 931 and conducted to the outside of the housing 1 through the side wall 12 by the heat conducting portion 932. Since the heat receiving portion 931 is perpendicular to the side wall 12, the heat dissipating portion 932 is attached to the side wall 12, and the heat dissipating portion 932 can increase the heat dissipating area and improve the heat dissipating effect.

In order to enable the second TEC assembly 9 to work normally, in this embodiment, a power supply part 933 is provided at the other end of the second TEC assembly base 93. It can be seen that the heat leading-out portion of the second TEC assembly base 93 extending along the side wall 12 forms a heat leading-out portion 932, while the feeding portion 933 is disposed on the side close to the heat shield 5, i.e., the portion of the second TEC assembly base 93 extending in the direction opposite to the side wall 12 forms a feeding portion 933, in order to prevent the feeding portion 933 from affecting the transmission of the optical signal, and the heat leading-out portion 932, the heat receiving portion 931 and the feeding portion 933 form a Z-shaped structure. The power supply part 933 is perpendicularly connected to the other end of the heat receiving part 931 and extends toward the second ceramic substrate 86, so that the second ceramic substrate 86 supplies power to the power supply part 933.

The portion of the second TEC assembly base 93 extending toward the side wall 12 is larger than the portion of the second TEC assembly base 93 extending in the opposite direction to the side wall 12, so that the area of the heat lead-out part 932 is larger than the area of the power supply part 933. Increasing the area of the heat discharging part 932 can increase the contact area of the heat discharging part 932 with the side wall 12 to improve the heat dissipation efficiency. The power supply part 933 is used to supply power to the second TEC assembly 9, and therefore the size of the power supply part 933 may be sufficient to satisfy the electrical conduction requirement.

The side wall of the power supply part 933 is provided with a power supply block 94, the side wall of the power supply block 94 is provided with a third conductive metal layer 941, the upper surface of the power supply block 94 is provided with a fourth conductive metal layer 942, and the fourth conductive metal layer 942 is electrically connected with the third conductive metal layer 941 and the heat exchange surface 91 on the second TEC assembly respectively.

in the optical module provided in the embodiment of the present invention, the light receiving device 8 further includes a second ceramic substrate 86 and a second conductive metal layer 87 located on the second ceramic substrate 86, the second conductive metal layer 87 is connected to the second flexible circuit board 4, and the second flexible circuit board 4 supplies power to the light receiving device 8. The second ceramic substrate 86 and the power feeding block 94 are positioned opposite to each other, and the power feeding portion 933 extends in the direction of the second ceramic substrate 86 so that the power feeding block 94 on the power feeding portion 933 is close to the second ceramic substrate 86 and connection by wire bonding is facilitated.

That is, the second conductive metal layer 87 is connected to the third conductive metal layer 941, the third conductive metal layer 941 is connected to the fourth conductive metal layer 942, and the fourth conductive metal layer 942 is connected to the heat exchanging surface 91 of the second TEC assembly, so that the second flexible circuit board 4 supplies power to the heat exchanging surface 91 of the second TEC assembly through the second conductive metal layer 87, the third conductive metal layer 941 and the fourth conductive metal layer 942, respectively, to ensure the normal operation of the second TEC assembly 9.

it can be seen that, in the optical module provided in the embodiment of the present invention, the second TEC assembly 9 is set up in the light receiving cavity 102, and is connected to the side wall 12 of the housing. The heat generated when the temperature of the second filter 83 is controlled is absorbed by the heat exchange surface 91 on the second TEC assembly, and the heat is conducted to the heat exchange surface 96 under the second TEC assembly through the second TEC assembly structural member 92, and then conducted to the second TEC assembly base 93 through the heat exchange surface 96 under the second TEC assembly, and the heat is conducted out through the side wall 12 of the housing 1 by the second TEC assembly base 93. The second TEC assembly 9 guides heat generated by controlling the temperature of the second filter 83 to the outside of the housing 1, and also guides the heat generated by the second TEC assembly 9 out through the side wall 12, so that the light receiving device 8 and the second TEC assembly 9 are both in a normal temperature environment, thermal crosstalk does not occur, and the effect of modulating an optical signal by the second TEC assembly 9 is not affected, thereby ensuring the performance of the light receiving device 8 and the second TEC assembly 9.

As can be seen from the above technical solutions, in the optical module provided in the embodiments of the present invention, the light emitting device 6 and the light receiving device 8 are packaged in the same housing 1, the heat insulating plate 5 is disposed in the housing 1, and the heat insulating plate 5 and the housing 1 form the light emitting cavity 101 and the light receiving cavity 102. The light emitting device 6 and the first TEC assembly 7 are disposed in the light emitting cavity 101, and the light receiving device 8, the second filter 83, and the second TEC assembly 9 are disposed in the light receiving cavity 102. In the light emission cavity 101, the first TEC assembly 7 is connected with the bottom plate 11 of the housing 1 in a heat conducting manner, the light emitting device 6 is disposed on a heat exchange surface of the first TEC assembly 7, and the first TEC assembly 7 is used for absorbing heat generated when the temperature of the light emitting device 6 is controlled and guiding the heat out through the bottom plate 11 of the housing 1. In the light receiving cavity 102, the second filter 83 is perpendicular to the bottom plate 11 and the side wall 12 of the housing 1, respectively, and is disposed on the upper heat exchanging surface of the second TEC assembly 9, and the second TEC assembly 9 absorbs heat generated when the temperature of the second filter 83 is controlled, and transfers the heat to the side wall 12 of the housing 1 and guides the heat out. Therefore, in the optical module provided by the invention, the two TEC assemblies are arranged on different heat dissipation surfaces of the shell, and the two TEC assemblies can timely guide out heat generated by the corresponding optical device and self heat through different surfaces of the shell. The two TEC assemblies are isolated by the heat insulation plate, and the light emitting device and the light receiving device are isolated, so that the crosstalk of heat in the two cavities is avoided, and the performance of the light receiving device and the light emitting device and the normal work of the optical module can be ensured.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (7)

1. A light module, comprising: the device comprises a shell, wherein a heat insulation plate is arranged in the shell, the shell is divided into a light emitting cavity and a light receiving cavity by the heat insulation plate, and a light emitting device and a first TEC assembly are arranged in the light emitting cavity; a light receiving device, a second filter, a second TEC assembly and a second TEC assembly base are arranged in the light receiving cavity;

The light emitting device is arranged on the upper heat exchange surface of the first TEC assembly, the lower heat exchange surface of the first TEC assembly is in heat conduction connection with the bottom plate of the shell, and the first TEC assembly is in heat exchange with the bottom plate of the shell;

the second filter plate is attached to the upper heat exchange surface of the second TEC component, the lower heat exchange surface of the second TEC component is in heat conduction connection with the second TEC component base, the second TEC component adjusts the temperature of the second filter plate, and the light receiving device receives light from the second filter plate;

One end of the second TEC assembly base extends to a side wall of the housing so that the second TEC assembly exchanges heat with the side wall of the housing through the second TEC assembly base.

2. The optical module of claim 1, wherein the second TEC assembly mount comprises a heat receiving portion and a heat conducting portion at one end of the heat receiving portion;

the lower heat exchange surface of the second TEC assembly is arranged on the heat receiving part to exchange heat; the heat leading-out part extends towards the side wall and is in heat conduction contact with the side wall.

3. the optical module of claim 2, wherein the second TEC assembly mount further comprises a power supply portion, the power supply portion being vertically connected to the other end of the heat receiving portion; the side wall of the power supply part is provided with a power supply block, the side wall of the power supply block is provided with a third conductive metal layer, the upper surface of the power supply block is provided with a fourth conductive metal layer, and the fourth conductive metal layer is respectively electrically connected with the third conductive metal layer and the second TEC component.

4. the optical module of claim 1, wherein the lower heat exchanging surface of the first TEC assembly is disposed parallel to the housing bottom plate and the lower heat exchanging surface of the second TEC assembly is disposed perpendicular to the housing bottom plate.

5. The light module of claim 1, wherein a propagation direction of light from the second filter is parallel to the housing bottom plate.

6. The light module of claim 1, wherein a direction of propagation of light from the second filter is perpendicular to the lower heat exchange surface of the second TEC assembly.

7. The optical module of claim 1, further comprising a thermally conductive layer disposed between the first TEC assembly and the base plate, the thermally conductive layer for thermally conductive connection of the first TEC assembly lower heat exchange surface to the base plate.