CN205336711U - Radiator and optical module heat abstractor - Google Patents

Abstract

The utility model provides a TEC radiator to have higher stress carrying capacity, have more extensive range of application. The utility model provides an optical module heat abstractor. In some feasible embodiment, the TEC radiator includes: first base plate and second base plate and a plurality of TEC, first base plate with the second base plate adopts a plurality of locking structure fixed connection, a plurality of TEC install in the installation space of formation between first base plate and the second base plate, TEC's two sides respectively with first base plate with the second base plate passes through the soft connection of heat conduction material.

Description

Radiator and optical module heat radiation device

Technical field

This utility model relates to technical field of heat dissipation, is specifically related to a kind of radiator and optical module heat radiation device。

Background technology

Optical module is commonly used in the communications field, and along with the continuous growth of the network bandwidth, veneer and optical module integrated level are more and more higher, and the heat radiation of optical module progressively becomes veneer heat radiation bottleneck。The mode that optical module is dispelled the heat by traditional heat sinks becomes inapplicable when optical module local environment temperature allows specification temperature near or above module。Continue to rise with communications field optical module integrated level, adopt thermoelectric cooling module (English full name: ThermoelectricCooler, English abbreviation: TEC) TEC to become the development trend solving optical module heat radiation。

TEC is a kind of semiconductor device, and its essence is that the Peltier effect (i.e. pyroelectric effect) utilizing semi-conducting material freezes。Peltier effect refers to that absorb heat in its one end, the phenomenon of one end heat release when unidirectional current is by the galvanic couple of two kinds of semi-conducting material compositions。TEC includes some P types and N-type to (group), and they are connected together by electrode, and is clipped between two ceramic electrodes；When there being electric current to flow through from TEC, the heat that electric current produces can pass to opposite side from the side of TEC, produces " heat " side and " cold " side on TEC, here it is the heating of TEC and refrigeration principle。

TEC, owing to possessing the function of refrigeration and heating, is normally used for optical device equitemperature and controls。As shown in Figure 1, TEC refrigerating sheet such as can be applied between optical module at radiator and temperature control object, if due to TEC internal main by P type and N-type semiconductor galvanic couple to and what ceramic substrate formed, stress ability to bear is poor, so common application is all that TEC and temperature control object and radiator are relatively-stationary, can not relative motion between temperature control object and radiator。

Practice find, due to TEC cooling piece stress ability to bear difference etc. feature, limit the range of application of TEC。

Utility model content

This utility model provides a kind of TEC radiator, to have higher stress ability to bear, has wider application scope。This utility model also provides for a kind of optical module heat radiation device。

This utility model first aspect provides a kind of TEC radiator, including: first substrate and second substrate and multiple TEC；Described first substrate and described second substrate adopt the fixing connection of multiple closing component structures；The plurality of TEC is arranged between described first substrate and second substrate in the installing space of formation；The two sides of described TEC is connected by Heat Conduction Material is soft with described first substrate and described second substrate respectively。

Multiple TEC are arranged between two fixing substrates by this technical scheme; utilize substrate that TEC is protected; improve the stress ability to bear of whole TEC radiator; such that it is able to support between temperature control object and radiator can the scene of relative motion, for instance the pluggable characteristic of optical module can be supported；Further, TEC is connected by Heat Conduction Material is soft with substrate, it is possible to reduce the substrate stress effect to TEC, improves the reliability of TEC；Additionally, multiple TEC cobasis plates in TEC radiator, the temperature that multiple temperature control objects (such as optical module) can carry out high efficient and reliable simultaneously controls, it is also possible to avoids single TEC to lose efficacy and causes the risk of temperature control, such that it is able to effectively promote the functional reliability of temperature control object。

In conjunction with first aspect, in the implementation that the first is possible, described closing component structure includes: the screw for sealed fixing described first substrate and described second substrate connects assembly, for described screw being connected the insulation blanket that assembly is isolated with described first substrate or second substrate, and it being placed between described first substrate and described second substrate for spacing support column, the thickness of described support column is not less than the thickness of described TEC。The insulation blanket of this closing component structure, it is possible to prevent the heat of one of them substrate from connecting assembly by screw and flow backward to another substrate；The support column of this closing component structure, it is possible to prevent the TEC in the middle of two substrate extruding, to realize the protection to TEC。

In conjunction with the first possible implementation of first aspect, in the implementation that the second is possible, described support column and described insulation blanket adopt low Heat Conduction Material to be made, and described low Heat Conduction Material can be plastics or nylon etc.。Wherein, plastics or nylon have good effect of heat insulation, and less costly。

In conjunction with any one in the first implementation possible with the second of first aspect, in the implementation that the third is possible, described screw connects assembly and includes the self-clinching standoff that matches and to lock screw, described second substrate is fixed in one end of described self-clinching standoff, the other end of described self-clinching standoff be positioned at the described to lock screw closure of described first substrate side, described insulation blanket is placed in described screw and connects between assembly and described first substrate。

In conjunction with the first of first aspect or first aspect to any one in the third possible implementation; in the 4th kind of possible implementation; described Heat Conduction Material is heat conduction viscose glue, heat conductive silica gel, heat-conducting cream, heat conductive pad or thermally conductive gel etc.; there is after solidification certain elasticity; a part of base plate stress can be offset; reduce the substrate stress effect to TEC, thus protecting TEC。

In conjunction with the first of first aspect or first aspect to any one in the 4th kind of possible implementation, in the 5th kind of possible implementation, described second substrate is as huyashi-chuuka (cold chinese-style noodles) substrate, fitted by described Heat Conduction Material with the utility model surface of described TEC, described second substrate is provided with the heat pipe of samming。Wherein, second substrate is as huyashi-chuuka (cold chinese-style noodles) substrate, can fit with temperature control object such as optical module, the heat of temperature control object is delivered to the first substrate as hot side substrate and vapors away and (first substrate can also mount conventional aluminum or copper radiator, to improve radiating efficiency；Or, it is also possible to directly using traditional aluminum or copper radiator as first substrate)。Further, heat pipe can realize the abundant samming to second substrate, it is achieved the huyashi-chuuka (cold chinese-style noodles) substrate of multiple TEC is shared, and when occurring indivedual TEC to lose efficacy, realizes the reliable temperature of temperature control object is controlled by huyashi-chuuka (cold chinese-style noodles) substrate samming。

In conjunction with any one in the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation, described radiator also includes the temperature sensor being arranged on described second substrate, and the signal transmission cable of the power supply control cable of the plurality of TEC and described temperature sensor collects in the reason line unit being arranged on described first substrate or described second substrate。Wherein, the temperature of temperature sensor monitors second substrate is utilized, it is possible to control to export the voltage to TEC or electric current according to the temperature of monitoring, TEC is carried out temperature adjustment。It addition, cable is collected in reason line unit, it is possible to avoid Internal cable to affect use in a jumble, for instance, during for pluggable optical module, it is possible to avoid cable to affect optical module plug in a jumble。

In conjunction with any one in the 6th kind of possible implementation of first aspect, in the 7th kind of possible implementation, the plurality of TEC is arranged by described power supply control cable parallel operation。Wherein, powering in parallel, multiple TEC are separate, even if certain TEC lost efficacy, nor affect on other TEC work。

In conjunction with the first of first aspect or first aspect to any one in the 7th kind of possible implementation, in the 8th kind of possible implementation, described first substrate and described second substrate are metal basal board。For example, it may be stainless steel substrate or copper base or aluminium alloy base plate etc.。Metal basal board has higher intensity, and stress ability to bear is strong, makes this TEC radiator support the pluggable characteristic of optical module。

This utility model second aspect provides a kind of optical module heat radiation device, including: circuit board, optical module, adapter, and radiator；Described adapter and described radiator are arranged on described circuit board, and described optical module is plugged in described adapter, and described radiator is fitted with described optical module, and described radiator is TEC radiator described according to a first aspect of the present invention。This optical module heat radiation device utilizes TEC radiator that pluggable optical module is dispelled the heat, and this TEC radiator stress ability to bear is strong, can use reliably and with long-term。

Therefore, in some feasible embodiments of the present invention, it is provided that a kind of have higher stress ability to bear, has the TEC radiator of wider application scope, thus providing a kind of Cooling Solution that can be used for pluggable optical module。

Accompanying drawing explanation

In order to be illustrated more clearly that this utility model embodiment technical scheme, the accompanying drawing used required in embodiment and description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings。

Fig. 1 is the schematic diagram of the TEC radiator structure of a kind of routine；

Fig. 2 is the structural representation of the TEC radiator that one embodiment of this utility model provides；

Fig. 3 is the structural representation of the closing component structure that one embodiment of this utility model provides；

Fig. 4 is the Facad structure schematic diagram of the TEC radiator that another embodiment of this utility model provides；

Fig. 5 is the inverse layer structure schematic diagram of the TEC radiator that another embodiment of this utility model provides；

Fig. 6 is the internal structure schematic diagram of the TEC radiator that another embodiment of this utility model provides；

Fig. 7 is the structural representation of the optical module heat radiation device that one embodiment of this utility model provides。

Detailed description of the invention

In order to make those skilled in the art be more fully understood that this utility model scheme, below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is clearly and completely described, obviously, described embodiment is only the embodiment of this utility model part, rather than whole embodiments。Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, all should belong to the scope of this utility model protection。

Below by specific embodiment, it is described in detail。

Refer to Fig. 2, one embodiment of this utility model provides a kind of thermoelectric cooling module TEC radiator。

This TEC radiator comprises the steps that first substrate 10 and second substrate 20 and multiple TEC30；Described first substrate 10 and described second substrate 20 adopt multiple fixing connection of closing component structure 40；The plurality of TEC30 is arranged between described first substrate 10 and second substrate 20 in the installing space of formation；The two sides of described TEC30 is connected by Heat Conduction Material 50 is soft with described first substrate 10 and described second substrate 20 respectively。

Wherein, described TEC30, it is possible to be called TEC chip or TEC refrigerating sheet。Heat can be transmitted to opposite side surface (hot side surface) from one side surface (i.e. cold side surface) by TEC30, the substrate that the cold side surface with TEC30 in described first substrate 10 and second substrate 20 fits can be described as huyashi-chuuka (cold chinese-style noodles) substrate, and the substrate fitted with the hot side surface of TEC30 can be described as hot side substrate。

Therefore; this TEC radiator provides a kind of double-basis plate TEC Cooling Solution; utilize the feature that the stress ability to bear of the double-basis plate TEC that is clipped in the middle of protection and substrate is higher compared with TEC, it is possible to for the heat radiation of optical module, support the characteristic that optical module can plug；By ad hoc structure design, the program supports that multiple TEC share substrate simultaneously, multiple optical modules can be carried out high efficient and reliable temperature control simultaneously, the radiator scheme of single TEC composition can be prevented effectively from the risk occurring TEC refrigerating sheet inefficacy time module temperature out of control, the functional reliability of optical module can be promoted。

The principal character of this TEC radiator is as follows:

1, the fixing protection of double-basis plate。

This TEC fansink designs is that two substrates is relatively fixed, it is achieved the protection to internal multiple TEC30, it is to avoid TEC30 is directly clashed into and module plug shear action to TEC30 is greatly reduced。Wherein, first substrate 10 and second substrate 20 can be metal basal boards, for instance, it is possible to it is stainless steel substrate or copper base or aluminium alloy base plate etc.。Metal basal board has higher intensity, and stress ability to bear is strong, makes this TEC radiator support the pluggable characteristic of optical module, and can better protect TEC。Further, metal basal board also has stronger heat conductivility, is conducive to heat radiation。

2, being relatively fixed of two substrates is realized by closing component structure。

Refer to Fig. 3, in some embodiments, closing component structure 40 includes: the screw for sealed fixing described first substrate 10 and described second substrate 20 connects assembly 41, for described screw being connected the insulation blanket 42 that assembly 41 is isolated with described first substrate 10 or second substrate 20, and it being placed between described first substrate 10 and described second substrate 20 for spacing support column 43, the thickness of described support column 43 is not less than the thickness of described TEC30。Optionally, multiple closing component structures 40 are uniformly distributed。

Wherein, support column 43 is possible to prevent two substrate TEC30, to realize the protection to TEC30。

In some embodiments, described screw connects assembly 41 and includes the self-clinching standoff 4101 that matches and to lock screw 4102, described second substrate 20 is fixed in one end of described self-clinching standoff 4101, the other end of described self-clinching standoff 4101 be positioned at the described that lock screw 4102 is sealed of described first substrate 10 side, described insulation blanket 42 is placed in described screw and connects between assembly 41 and described first substrate 10。

Wherein, described support column 43 and described insulation blanket 42 can adopt low Heat Conduction Material to be made, and described low Heat Conduction Material can be such as plastics or nylon etc.。Described support column 43 and insulation blanket 42 are low Heat Conduction Material, it is possible to reduce hot side substrate, to the heat disturbance of huyashi-chuuka (cold chinese-style noodles) substrate, promotes TEC radiator performance。

3, TEC is soft with substrate is connected。

Can being all connected by Heat Conduction Material double-surface flexible between TEC with huyashi-chuuka (cold chinese-style noodles) substrate and hot side substrate, Heat Conduction Material can be such as heat conduction viscose glue, heat conductive silica gel, (argentiferous) heat-conducting cream, heat conductive pad or thermally conductive gel etc., does not limit herein。During the work of TEC radiator, hot side basal plate heated expands, and the cooling of huyashi-chuuka (cold chinese-style noodles) substrate is shunk, and adopts TEC and the hot side substrate mode that be connected soft with huyashi-chuuka (cold chinese-style noodles) substrate, it is possible to substrate stress effect to TEC is greatly decreased, it is prevented that TEC is squeezed damage, it is ensured that the reliability of TEC。

4, multiple TEC share substrate。

Arranging multiple TEC, multiple TEC between two substrates and share substrate, can realize samming by substrate, namely whole huyashi-chuuka (cold chinese-style noodles) substrate temperature keeps consistent, owing to the area of substrate is relatively big, contributes to realizing the heat radiation to multiple temperature control objects such as multiple optical modules。

Based on features described above, double-basis plate many TEC total solution that the TEC radiator of the present embodiment provides, the protection to TEC can be strengthened, and the samming that can also pass through substrate when generating portion TEC lost efficacy maintains radiating requirements；And for products application, the space of TEC is often less, there is stress effect because of temperature contrast in cold and hot substrate, TEC refrigerating sheet and substrate are flexible coupling by Heat Conduction Material or viscose glue, it is possible to fully ensures that good heat conduction and reduces the base plate stress impact on TEC refrigerating sheet。

Refer to Fig. 4 and Fig. 5 and Fig. 6, another embodiment of the present invention provides another kind of TEC radiator。On the basis of Fig. 1 and Fig. 2 TEC radiator provided, for second substrate 20 as huyashi-chuuka (cold chinese-style noodles) substrate, the TEC radiator that the present embodiment provides also has the feature that

Described second substrate 20, as huyashi-chuuka (cold chinese-style noodles) substrate, is fitted by described Heat Conduction Material 50 with the cold side surface of described TEC30, described second substrate 20 is provided with the heat pipe 60 of samming。Second substrate 20 can be carried out sufficient samming by heat pipe 60, it is achieved the huyashi-chuuka (cold chinese-style noodles) substrate of multiple TEC30 is shared, and when occurring indivedual TEC to lose efficacy, still can fully ensure that the temperature to all temperature control object such as optical modules controls by substrate samming。

Described TEC radiator also includes the temperature sensor 70 being arranged on described second substrate 20。Temperature sensor 70, for detecting the temperature of second substrate 20, according to the temperature of monitoring, can realize the control to temperature by TEC voltage or electric current are adjusted, thus ensureing optical module temperature-controllable。

The plurality of TEC30 is arranged by power supply control cable parallel operation。Multiple TEC parallel operations so that multiple TEC are separate, even if certain TEC lost efficacy, nor affect on other TEC normal operation。

The signal transmission cable of the power supply control cable of the plurality of TEC30 and described temperature sensor 70 collects in the reason line unit 80 being arranged on described first substrate 10 or second substrate 20。Cable walks wire management by managing inside line unit, and Internal cable can be avoided to affect optical module plug in a jumble。

Therefore, this utility model provides a kind of TEC radiator, and wherein, the mode that multiple TEC are connected by double-basis plate and double-surface flexible is protected, it is possible to support that the temperature to pluggable class optical module controls application reliably and with long-term；Meanwhile, support that multiple TEC cobasis plate cold is shared, higher for ensureing multiple optical module application of temperature reliability；Compare traditional radiator scheme, it is possible to effectively expand the temperature limit of optical module, or, it is possible to being combined with TEC radiator of the present utility model by business level optical module is substituted technical grade module application product cost is greatly reduced。Particularly critical, technical solutions of the utility model achieve the TEC application in pluggable optical module field, support optical module temperature limit to expand or integrated level improves, be provided simultaneously with high reliability and the advantage that can promote optical module temperature reliability。

Refer to Fig. 7, one embodiment of this utility model also provides for a kind of optical module heat radiation device 90。This device 90 comprises the steps that circuit board 901, optical module 902, adapter 903, and radiator 904；Described adapter 903 and described radiator 904 are arranged on described circuit board 901, described optical module 902 is plugged in described adapter 903, described radiator 904 is fitted with described optical module 902, and described radiator 904 is the thermoelectric cooling module TEC radiator according to foregoing embodiments。This optical module heat radiation device utilizes TEC radiator that pluggable optical module is dispelled the heat, and this TEC radiator stress ability to bear is strong, can use reliably and with long-term。

In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, the part being not described in certain embodiment, it is possible to referring to the associated description of other embodiments。

The pressing module for terminal unit and the terminal unit that above this utility model embodiment are provided are described in detail, principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof；Simultaneously for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this specification content should not be construed as restriction of the present utility model。

Claims (10)

1. a thermoelectric cooling module TEC radiator, it is characterised in that including:

First substrate and second substrate and multiple TEC；Described first substrate and described second substrate adopt the fixing connection of multiple closing component structures；The plurality of TEC is arranged between described first substrate and second substrate in the installing space of formation；The two sides of described TEC is connected by Heat Conduction Material is soft with described first substrate and described second substrate respectively。

2. radiator according to claim 1, it is characterised in that described closing component structure includes:

Screw for sealed fixing described first substrate and described second substrate connects assembly, for described screw being connected the insulation blanket that assembly is isolated with described first substrate or second substrate, and it being placed between described first substrate and described second substrate for spacing support column, the thickness of described support column is not less than the thickness of described TEC。

3. radiator according to claim 2, it is characterised in that

Described support column and described insulation blanket adopt low Heat Conduction Material to be made, and described low Heat Conduction Material is plastics or nylon。

4. radiator according to claim 2, it is characterised in that

Described screw connects assembly and includes the self-clinching standoff that matches and to lock screw, described second substrate is fixed in one end of described self-clinching standoff, the other end of described self-clinching standoff be positioned at the described to lock screw closure of described first substrate side, described insulation blanket is placed in described screw and connects between assembly and described first substrate。

5. according to described radiator arbitrary in Claims 1-4, it is characterised in that

Described Heat Conduction Material is heat conduction viscose glue, heat conductive silica gel, heat-conducting cream, heat conductive pad or thermally conductive gel。

6. according to the arbitrary described radiator of Claims 1-4, it is characterised in that

Described second substrate, as huyashi-chuuka (cold chinese-style noodles) substrate, is fitted by described Heat Conduction Material with the cold side surface of described TEC, described second substrate is provided with the heat pipe of samming。

7. radiator according to claim 6, it is characterised in that

Described TEC radiator also includes the temperature sensor being arranged on described second substrate, and the signal transmission cable of the power supply control cable of the plurality of TEC and described temperature sensor collects in the reason line unit being arranged on described first substrate or described second substrate。

8. radiator according to claim 7, it is characterised in that

The plurality of TEC is arranged by described power supply control cable parallel operation。

9. according to described radiator arbitrary in Claims 1-4, it is characterised in that

Described first substrate and described second substrate are metal basal board。

10. an optical module heat radiation device, it is characterised in that including:

Circuit board, optical module, adapter, and radiator；

Described adapter and described radiator are arranged on described circuit board, and described optical module is plugged in described adapter, and described radiator is fitted with described optical module, and described radiator is according to described thermoelectric cooling module TEC radiator arbitrary in claim 1 to 9。