CN112994411A - Power adapter heat radiation structure - Google Patents
Power adapter heat radiation structure Download PDFInfo
- Publication number
- CN112994411A CN112994411A CN202110162703.4A CN202110162703A CN112994411A CN 112994411 A CN112994411 A CN 112994411A CN 202110162703 A CN202110162703 A CN 202110162703A CN 112994411 A CN112994411 A CN 112994411A
- Authority
- CN
- China
- Prior art keywords
- heat
- power adapter
- heat dissipation
- piece
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 44
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 206010014405 Electrocution Diseases 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat dissipation structure of a power adapter, which comprises a heat conduction piece, a semiconductor refrigerator and a heat dissipation piece, wherein the heat conduction piece is attached to an electronic element of the power adapter, the heat dissipation piece is arranged on the outer wall of a shell of the power adapter, an opening is formed in the shell to allow a hot end of the semiconductor refrigerator to be in thermal conduction with the heat dissipation piece, and a cold end of the semiconductor refrigerator is in thermal conduction with the heat conduction piece. The heat dissipation structure of the power adapter can directionally guide the heat generated by the electronic element of the power adapter during working out of the shell to the outside of the shell for heat dissipation, thereby avoiding the heat from accumulating in the shell, ensuring the working stability of the electronic element under the condition of proper temperature, and prolonging the service life.
Description
Technical Field
The invention relates to the technical field of power adapters, in particular to a heat dissipation structure of a power adapter.
Background
The power adapter is a power supply conversion device for small portable electronic equipment and electronic appliances, generally comprises components such as a shell, a transformer, an inductor, a capacitor, a control IC (integrated circuit), a PCB (printed circuit board) and the like, has the working principle that alternating current input is converted into direct current output, and is commonly used for equipment such as mobile phones, liquid crystal displays, notebook computers and the like.
In the use of electrical apparatus, power adapter self can generate heat, by it when electrical apparatus full load work, power adapter's calorific capacity is very big, and current power adapter sets up electronic component in the plastic casing usually, and plastic casing's radiating effect is poor, and the heat can lead to the high temperature in the inside accumulation of casing, and electronic component works for a long time and can influence job stabilization nature, reduction life under high temperature environment.
Disclosure of Invention
The technical problem to be solved and the technical task provided by the invention are to improve the prior art, provide a heat dissipation structure of a power adapter, and solve the problems that the heat dissipation performance of the power adapter in the prior art is poor, and the working stability and the service life are influenced.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a heat dissipation structure of a power adapter comprises a heat conduction piece, a semiconductor refrigerator and a heat dissipation piece, wherein the heat conduction piece is attached to an electronic element of the power adapter, the heat dissipation piece is arranged on the outer wall of a shell of the power adapter, a hole is formed in the shell, the hot end of the semiconductor refrigerator is in thermal conduction with the heat dissipation piece, and the cold end of the semiconductor refrigerator is in thermal conduction with the heat conduction piece. The heat dissipation structure of the power adapter can directionally guide the heat generated by the electronic element of the power adapter during working out of the shell to the outside of the shell for heat dissipation, thereby avoiding the heat from accumulating in the shell, ensuring the working stability of the electronic element under the condition of proper temperature, and prolonging the service life.
Furthermore, the heat conducting piece is made of heat conducting silica gel.
Further, a groove for inserting the electronic component is arranged on the heat conducting piece.
Furthermore, a plurality of heat conducting pieces are arranged at intervals, different types of electronic components are respectively attached to one heat conducting piece, or the shell of the power adapter is divided into a plurality of areas, and each area is respectively provided with one heat conducting piece.
Further, a heat insulation layer is arranged between the adjacent heat conduction pieces.
Furthermore, the number of the semiconductor refrigerators is several.
Furthermore, a heat conduction gap filling layer is arranged between the hot end of the semiconductor refrigerator and the heat radiating piece, and a heat conduction gap filling layer is arranged between the cold end of the semiconductor refrigerator and the heat conducting piece.
Further, the heat-conducting gap filling layer comprises one of heat-conducting silicone grease and silver adhesive.
Furthermore, the heat dissipation piece is provided with fins.
Further, the surface of the heat dissipation piece is provided with a radiation coating.
Compared with the prior art, the invention has the advantages that:
the heat dissipation structure of the power adapter can conduct the heat inside the power adapter out of the shell for heat dissipation, has high heat dissipation efficiency, prevents electronic elements of the power adapter from working in a high-temperature environment, ensures the working stability of the power adapter, and prolongs the service life.
Drawings
FIG. 1 is a schematic structural diagram of a heat dissipation structure of a power adapter;
FIG. 2 is a schematic structural diagram of another heat dissipation structure of a power adapter;
fig. 3 is a schematic diagram of a third structure of the heat dissipation structure of the power adapter.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention discloses a heat dissipation structure of a power adapter, which can effectively guide and dissipate heat generated by an electronic element during working, avoid heat accumulation in the power adapter, ensure that the electronic element can work at a proper temperature, ensure the working stability and prolong the service life.
As shown in fig. 1, a heat dissipation structure of a power adapter mainly includes a heat conduction member 1, a semiconductor refrigerator 2 and a heat dissipation member 3, the heat conduction member 1 is attached to an electronic component 4 of the power adapter, the heat dissipation member 3 is disposed on an outer wall of a housing 5 of the power adapter, an opening is formed in the housing 5 to allow a hot end of the semiconductor refrigerator 2 to be thermally conducted with the heat dissipation member 3, and a cold end of the semiconductor refrigerator 2 is thermally conducted with the heat conduction member 1. The semiconductor refrigerator is made by utilizing the Peltier effect of semiconductor materials, when direct current passes through the semiconductor refrigerator, one end of the semiconductor refrigerator absorbs heat, the other end releases heat, the heating and refrigerating and the working speed of the semiconductor refrigerator are determined by the direction and the size of the current passing through the semiconductor refrigerator, the semiconductor refrigerator is small in size, high in speed and convenient to control, and the heat dissipation effect can be effectively improved under the condition that the size of a power adapter is not increased.
The power adapter is at the during operation, the heat conduction that electronic component 4 produced is on the heat-conducting piece 1 with electronic component looks laminating, then the heat is again conducted on semiconductor cooler 2 from heat-conducting piece 1, at last conduct by semiconductor cooler 2 and dispel the heat on the radiating piece 3 on the 5 outer walls of casing, thereby effectual heat with electronic component 4 production is outside conducted from power adapter's inside directional conduction, avoid the heat to accumulate in power adapter inside and lead to the excessive temperature to rise, ensure that electronic component work under suitable temperature situation, improve job stabilization nature, increase of service life.
In this embodiment, heat-conducting member 1 adopts heat conduction silica gel to make, and the heat conductivility is good, form good hot passageway between the position of generating heat and radiating part position, effectively promote heat transfer efficiency, heat conduction silica gel has the compliance, can with the more abundant contact laminating of electronic component 4, can also play insulating in the heat conduction, the shock attenuation, sealed effect, heat conduction silica gel has electrical insulation nature, derive the heat outside in-process of casing from power adapter casing inside, the risk that can not have the electrical leakage, make semiconductor refrigerator 2 and radiating part 3 and electronic component 4 be complete electrical insulation, eliminate the risk of electrocution, improve the safety in utilization.
Furthermore, the heat conducting member 1 has a certain rear portion, and a groove for inserting the electronic element 4 is formed in the heat conducting member 1, so that the heat conducting member 1 can wrap most of the area of the electronic element 4, the contact area between the heat conducting member 1 and the electronic element 4 is increased, the heat conducting effect is improved, and heat generated by the electronic element 4 during working is guided out of the shell 5 to be dissipated.
As shown in fig. 2, the power adapter includes many electronic components 4, and the heat generation amounts of different electronic components 4 are different, or the heat generation amounts of different areas in the power adapter housing are different, because the heat conducting member 1 itself does not have the directionality of heat conduction, the heat will be conducted along the heat conducting member 1 in all directions, if all the electronic components share one heat conducting member 1, the heat generated by the electronic component with large heat generation amount will reverse to make the electronic component with small heat generation amount affected adversely, so that the temperature of the electronic component with small heat generation amount will rise inversely, therefore, the present application sets the interval of the heat conducting members 1 to be several, the electronic components of different types are respectively attached to one heat conducting member 1, or the housing 5 of the power adapter is divided into several areas, each area is respectively provided with one heat conducting member 1, every heat conduction piece 1 is connected a semiconductor cooler 2 respectively, then all semiconductor coolers 2 are connected to same radiating piece 3, and, be provided with insulating layer 6 between the adjacent heat conduction piece 1, and then avoid the heat to spread in power adapter inside, avoid the electronic component that self calorific capacity is big to influence the electronic component that self calorific capacity is little, make the heat that the electronic component that self calorific capacity is big produced derive the radiating piece 3 outside the casing respectively with the heat that self calorific capacity is little to dispel the heat.
As shown in fig. 3, all electronic components may share one heat conducting member 1, and a plurality of semiconductor refrigerators 2 are arranged at intervals, so as to improve heat dissipation efficiency, and ensure that the overall temperature of the heat conducting member 1 is low, thereby avoiding that the electronic components with large heat generation amount affect the electronic components with small heat generation amount.
In this embodiment, a heat conduction gap filling layer is arranged between the hot end of the semiconductor refrigerator 2 and the heat dissipation member 3, a heat conduction gap filling layer is arranged between the cold end of the semiconductor refrigerator 2 and the heat conduction member 1, the gap is filled by the heat conduction gap filling layer, a heat conduction channel is opened, the thermal resistance is reduced, and the heat conduction efficiency is improved, so that the heat dissipation effect is improved. The heat-conducting gap filling layer can be one of heat-conducting silicone grease and silver adhesive, and can also be other materials.
The radiating piece 3 is provided with fins, so that the radiating area is increased, the convection radiating efficiency is improved, and the surface of the radiating piece 3 is provided with a radiation coating, so that the outward heat radiation of the radiating piece 3 is accelerated, and the accumulation of heat on the radiating piece 3 is avoided, and the heat is further prevented from being conducted to the inside of the power adapter through the shell.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (10)
1. The utility model provides a power adapter heat radiation structure, characterized in that, includes heat-conducting piece (1), semiconductor cooler (2) and radiating piece (3), heat-conducting piece (1) laminate with power adapter's electronic component (4), radiating piece (3) set up on power adapter's casing (5) outer wall, casing (5) trompil for the hot junction and the radiating piece (3) heat conduction of semiconductor cooler (2), and the cold junction and the heat-conducting piece (1) heat conduction of semiconductor cooler (2).
2. The power adapter heat dissipation structure according to claim 1, wherein the heat conducting member (1) is made of heat conducting silicone.
3. The power adapter heat dissipation structure according to claim 2, wherein the heat conductive member (1) is provided with a groove into which the electronic component (4) is inserted.
4. The heat dissipation structure of the power adapter as claimed in claim 1, wherein the heat conducting member (1) is provided with a plurality of spaced apart heat conducting members, different types of electronic components are respectively attached to one heat conducting member (1), or the housing (5) of the power adapter is divided into a plurality of regions, and each region is provided with one heat conducting member (1).
5. The power adapter heat dissipation structure according to claim 4, wherein a heat insulating layer (6) is provided between adjacent heat conductive members (1).
6. The power adapter heat dissipation structure according to claim 1, wherein the semiconductor cooler (2) is provided in a plurality at intervals.
7. A power adapter heat dissipation structure as defined in any one of claims 1 to 6, wherein a heat conductive caulking layer is arranged between the hot end of the semiconductor refrigerator (2) and the heat dissipation member (3), and a heat conductive caulking layer is arranged between the cold end of the semiconductor refrigerator (2) and the heat conductive member (1).
8. The power adapter heat dissipation structure of claim 7, wherein the thermally conductive caulking layer comprises one of thermally conductive silicone grease and silver paste.
9. The power adapter heat dissipation structure according to any one of claims 1 to 6, characterized in that the heat dissipation member (3) is provided with fins.
10. A power adapter heat dissipation structure according to any one of claims 1 to 6, characterized in that the heat dissipation member (3) is surface-provided with a radiation coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110162703.4A CN112994411A (en) | 2021-02-05 | 2021-02-05 | Power adapter heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110162703.4A CN112994411A (en) | 2021-02-05 | 2021-02-05 | Power adapter heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112994411A true CN112994411A (en) | 2021-06-18 |
Family
ID=76348255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110162703.4A Pending CN112994411A (en) | 2021-02-05 | 2021-02-05 | Power adapter heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112994411A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113923938A (en) * | 2021-09-06 | 2022-01-11 | 联想(北京)有限公司 | Electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1797749A (en) * | 2004-12-24 | 2006-07-05 | 上海雷硕医疗器械有限公司 | Heat elimination structure in low noise in use for fast spectral analysis modules under weak light |
| CN204417270U (en) * | 2014-05-27 | 2015-06-24 | 鲁同新 | PTF moment heat-producing machine is used to increase the water purifier of R/O membrane efficiency |
| CN205196152U (en) * | 2015-11-18 | 2016-04-27 | 浙江大华技术股份有限公司 | Supervisory equipment's protection casing and supervisory equipment |
| CN205644425U (en) * | 2016-05-03 | 2016-10-12 | 内蒙古商贸职业学院 | Closed dustproof heat dissipation computer housing |
| CN206728481U (en) * | 2017-05-08 | 2017-12-08 | 清远市粤万通智能设备科技有限公司 | A kind of housings close formula charging pile |
| CN108738368A (en) * | 2017-02-13 | 2018-11-02 | 新电元工业株式会社 | Electronic equipment |
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| CN110425796A (en) * | 2019-08-28 | 2019-11-08 | 广东富信科技股份有限公司 | Breast milk cold storage plant |
| TW202033063A (en) * | 2019-02-22 | 2020-09-01 | 大陸商業成科技（成都）有限公司 | High thermal conductivity circuit board |
| CN211785712U (en) * | 2019-02-22 | 2020-10-27 | 宁波三星医疗电气股份有限公司 | Bottom shell structure of electric energy meter |
| CN212007569U (en) * | 2020-05-07 | 2020-11-24 | 鄂州职业大学 | Temperature measuring device based on semiconductor cooler difference in temperature self-power |
-
2021
- 2021-02-05 CN CN202110162703.4A patent/CN112994411A/en active Pending
Patent Citations (12)
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|---|---|---|---|---|
| CN1797749A (en) * | 2004-12-24 | 2006-07-05 | 上海雷硕医疗器械有限公司 | Heat elimination structure in low noise in use for fast spectral analysis modules under weak light |
| CN204417270U (en) * | 2014-05-27 | 2015-06-24 | 鲁同新 | PTF moment heat-producing machine is used to increase the water purifier of R/O membrane efficiency |
| CN205196152U (en) * | 2015-11-18 | 2016-04-27 | 浙江大华技术股份有限公司 | Supervisory equipment's protection casing and supervisory equipment |
| CN205644425U (en) * | 2016-05-03 | 2016-10-12 | 内蒙古商贸职业学院 | Closed dustproof heat dissipation computer housing |
| CN108738368A (en) * | 2017-02-13 | 2018-11-02 | 新电元工业株式会社 | Electronic equipment |
| CN206728481U (en) * | 2017-05-08 | 2017-12-08 | 清远市粤万通智能设备科技有限公司 | A kind of housings close formula charging pile |
| CN109041552A (en) * | 2018-10-12 | 2018-12-18 | 成都优博创通信技术股份有限公司 | A kind of radiating subassembly and communication module |
| TW202033063A (en) * | 2019-02-22 | 2020-09-01 | 大陸商業成科技（成都）有限公司 | High thermal conductivity circuit board |
| CN211785712U (en) * | 2019-02-22 | 2020-10-27 | 宁波三星医疗电气股份有限公司 | Bottom shell structure of electric energy meter |
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| CN110425796A (en) * | 2019-08-28 | 2019-11-08 | 广东富信科技股份有限公司 | Breast milk cold storage plant |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113923938A (en) * | 2021-09-06 | 2022-01-11 | 联想(北京)有限公司 | Electronic device |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 635000 4th floor, building 3, zhizaoyuan workshop (phase I), south of Qihe Road, economic development zone, Dazhou City, Sichuan Province Applicant after: Sichuan Enju Electronic Technology Co.,Ltd. Address before: 635000 4th floor, building 3, zhizaoyuan workshop (phase I), south of Qihe Road, economic development zone, Dazhou City, Sichuan Province Applicant before: Sichuan Enju Industrial Co.,Ltd. |
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| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210618 |
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| RJ01 | Rejection of invention patent application after publication |