CN1797749A - Heat elimination structure in low noise in use for fast spectral analysis modules under weak light - Google Patents
Heat elimination structure in low noise in use for fast spectral analysis modules under weak light Download PDFInfo
- Publication number
- CN1797749A CN1797749A CN 200410093592 CN200410093592A CN1797749A CN 1797749 A CN1797749 A CN 1797749A CN 200410093592 CN200410093592 CN 200410093592 CN 200410093592 A CN200410093592 A CN 200410093592A CN 1797749 A CN1797749 A CN 1797749A
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- CN
- China
- Prior art keywords
- radiator
- spectral analysis
- analysis modules
- elastic support
- light level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000010183 spectrum analysis Methods 0.000 title claims abstract description 26
- 230000008030 elimination Effects 0.000 title 1
- 238000003379 elimination reaction Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000003745 diagnosis Methods 0.000 claims abstract description 12
- 238000009413 insulation Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract 2
- 238000005057 refrigeration Methods 0.000 abstract 2
- 230000003595 spectral effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
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- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The structure is composed of metal body case, semiconductor refrigerator and radiator. Refrigeration surface of the semiconductor refrigerator is connected to the body case; and heat delivery surface of the semiconductor refrigerator is connected to radiator. Insulating blanket enwraps the body case. Cooling fan is setup inside the radiator. Elastic support is setup between the cooling fan and the radiator. In operation of the refrigerator, refrigeration surface absorbs quantity of heat from spectral analysis modules. Quantity of heat is transferred to radiator; and airflow generated by fan carried off quantity of heat. The elastic support absorbs vibration energy generated by fan to reduce noise. Temperature sensor detects temperature of metal case to turn on/off semiconductor refrigerator through temperature control circuit board. The invention solves issue of variation of spectral curve caused by temperature deviation so as to prevent error diagnosis from happening.
Description
Technical field:
The present invention relates to medicine equipment, relate in particular to a kind of medical laser diagnosis instrument, particularly relate to the low light level fast spectral analysis modules OMA in a kind of medical laser diagnosis instrument, concrete is a kind of low noise radiator structure that is used for low light level fast spectral analysis modules.
Background technology:
In the prior art, the core parts of low light level fast spectral analysis modules OMA in the medical laser diagnosis instrument are photodiode array chips, its outer periphery is equipped with metal shell, the photodiode array chip can produce heat in the course of the work, heat can influence the operating characteristic of chip, be embodied in, diagnostic equipment is after the work long period, the fluorescent spectrum curve that produces can become straight line, the influence diagnosis, usually can take away heat by the air-flow that radiator fan produces at the radiator of metal shell arranged outside and the radiator fan of low light level fast spectral analysis modules.But the radiating effect of radiator is limited, and when ambient temperature was higher, the temperature of low light level fast spectral analysis modules still can be higher, and simultaneously, radiator fan also can produce noise.
Summary of the invention:
Technical problem of the prior art to be solved by this invention is: because in the prior art, the core parts of low light level fast spectral analysis modules OMA in the medical laser diagnosis instrument are photodiode array chips, its outer periphery is equipped with metal shell, the photodiode array chip can produce heat in the course of the work, so can influence the operating characteristic of chip, be embodied in, diagnostic equipment is after the work long period, the fluorescent spectrum curve that produces can become straight line, the influence diagnosis.Usually can take away heat by the air-flow that radiator fan produces at the radiator of metal shell arranged outside and the radiator fan of low light level fast spectral analysis modules.But the radiating effect of radiator is limited, and when ambient temperature was higher, the temperature of low light level fast spectral analysis modules still can be higher, and simultaneously, radiator fan also can produce noise.
The technical scheme that the present invention is adopted for solution above-mentioned technical problem of the prior art provides a kind of low noise radiator structure that is used for low light level fast spectral analysis modules, the described this low noise radiator structure of low light level fast spectral analysis modules that is used for is by a semiconductor cooler, a radiator and a radiator fan constitute, the outer periphery of low light level fast spectral analysis modules is equipped with a metal shell in the described medical laser diagnosis instrument, wherein, the chill surface of described semiconductor cooler is connected with described metal shell, the radiating surface of described semiconductor cooler is connected with described radiator, the outside of described metal shell is enclosed with heat-insulation layer, the upside of described radiator is provided with an elastic support, fixedly connected with described radiator in the lower end of described elastic support, described radiator fan is arranged on the upper end of described elastic support and fixedlys connected with the upper end of elastic support, is provided with the gap between described radiator fan and the described radiator.
Further, described elastic support is made of a rubber tube.
Further, the connecting portion of the chill surface of described refrigerator and described metal shell is provided with temperature sensor.
Further, described temperature sensor is connected with a temperature control circuit board.
Further, described semiconductor cooler is connected with temperature control circuit board, and described temperature control circuit board is connected with a power supply.
The course of work of the present invention is: during semiconductor cooler energising work, the chill surface of semiconductor cooler absorbs the heat of low light level fast spectral analysis modules in the medical laser diagnosis instrument, the radiating surface of semiconductor cooler arrives radiator with heat transferred, the air-flow that radiator fan produces is taken away heat, the vibrational energy that elastic support between radiator fan and the radiator produces when absorbing the radiator fan running, thus noise reduced.Temperature sensor detects the temperature of metal shell, when temperature arrives the bound of setting, opens or close semiconductor cooler by temperature control circuit board.
The present invention and prior art contrast, and its effect is actively with tangible.The present invention utilizes the elastic support between radiator fan and the radiator to absorb the vibrational energy that produces when radiator fan turns round, thereby reduces noise by the heat of low light level fast spectral analysis modules in the semiconductor cooler absorption medical laser diagnosis instrument.And utilize temperature sensor to detect the temperature of metal shell, when temperature arrives the bound of setting, open or close semiconductor cooler by temperature control circuit board.The present invention be fit to solve the variation of the curve of spectrum that diagnostic equipment causes because of low light level fast spectral analysis modules temperature deviation, prevents Error Diagnostics.
Description of drawings:
Fig. 1 is a kind of structural representation that is used for the low noise radiator structure of low light level fast spectral analysis modules of the present invention.
Embodiment:
As shown in Figure 1, the low noise radiator structure that is used for low light level fast spectral analysis modules of the present invention, by a semiconductor cooler 2, a radiator 3 and a radiator fan 5 constitute, the outer periphery of low light level fast spectral analysis modules 8 is equipped with a metal shell 1 in the described medical laser diagnosis instrument, wherein, the chill surface of described semiconductor cooler 2 is connected with described metal shell 1, the radiating surface of described semiconductor cooler 2 is connected with described radiator 3, the outside of described metal shell 1 is enclosed with heat-insulation layer 4, the upside of described radiator is provided with an elastic support 9, fixedly connected with described radiator 3 in the lower end of described elastic support 9, described radiator fan 5 is arranged on the upper end of described elastic support 9 and fixedlys connected with the upper end of elastic support 9, is provided with the gap between described radiator fan 5 and the described radiator 3.
Further, described elastic support 9 is made of a rubber tube.
Further, be provided with radiator fan 5 in the described radiator 3, the connecting portion of the chill surface of described refrigerator 2 and described metal shell 1 is provided with temperature sensor 6.
Further, described temperature sensor 6 is connected with a temperature control circuit board 7.
Further, described semiconductor cooler 2 is connected with temperature control circuit board 7, and described temperature control circuit board 7 is connected with a power supply.
Claims (5)
1. low noise radiator structure that is used for low light level fast spectral analysis modules, by a semiconductor cooler, a radiator and a radiator fan constitute, the outer periphery of low light level fast spectral analysis modules is equipped with a metal shell in the described medical laser diagnosis instrument, it is characterized in that: the chill surface of described semiconductor cooler is connected with described metal shell, the radiating surface of described semiconductor cooler is connected with described radiator, the outside of described metal shell is enclosed with heat-insulation layer, the upside of described radiator is provided with an elastic support, fixedly connected with described radiator in the lower end of described elastic support, described radiator fan is arranged on the upper end of described elastic support and fixedlys connected with the upper end of elastic support, is provided with the gap between described radiator fan and the described radiator.
2. the low noise radiator structure that is used for low light level fast spectral analysis modules as claimed in claim 1 is characterized in that: described elastic support is made of a rubber tube.
3. the low noise radiator structure that is used for low light level fast spectral analysis modules as claimed in claim 1 is characterized in that: the chill surface of described refrigerator and the connecting portion of described metal shell are provided with temperature sensor.
4. the low noise radiator structure that is used for low light level fast spectral analysis modules as claimed in claim 1 is characterized in that: described temperature sensor is connected with a temperature control circuit board.
5. the low noise radiator structure that is used for low light level fast spectral analysis modules as claimed in claim 1 is characterized in that: described semiconductor cooler is connected with a temperature control circuit board, and described temperature control circuit board is connected with a power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410093592 CN1797749A (en) | 2004-12-24 | 2004-12-24 | Heat elimination structure in low noise in use for fast spectral analysis modules under weak light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410093592 CN1797749A (en) | 2004-12-24 | 2004-12-24 | Heat elimination structure in low noise in use for fast spectral analysis modules under weak light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1797749A true CN1797749A (en) | 2006-07-05 |
Family
ID=36818662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410093592 Pending CN1797749A (en) | 2004-12-24 | 2004-12-24 | Heat elimination structure in low noise in use for fast spectral analysis modules under weak light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1797749A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103954088A (en) * | 2014-04-17 | 2014-07-30 | 北京华泰诺安科技有限公司 | High-energy-efficiency intelligent temperature control system for CCD (charge coupled device) detector refrigerating device based on spectrograph |
| CN104571185A (en) * | 2014-12-31 | 2015-04-29 | 聚光科技(杭州)股份有限公司 | Temperature control device and method of energy dispersion X-ray fluorescence spectrophotometer |
| CN109041552A (en) * | 2018-10-12 | 2018-12-18 | 成都优博创通信技术股份有限公司 | A kind of radiating subassembly and communication module |
| CN110701824A (en) * | 2019-09-26 | 2020-01-17 | 广西博世科环保科技股份有限公司 | XRF temperature control device based on semiconductor |
| CN112994411A (en) * | 2021-02-05 | 2021-06-18 | 四川恩巨实业有限公司 | Power adapter heat radiation structure |
-
2004
- 2004-12-24 CN CN 200410093592 patent/CN1797749A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103954088A (en) * | 2014-04-17 | 2014-07-30 | 北京华泰诺安科技有限公司 | High-energy-efficiency intelligent temperature control system for CCD (charge coupled device) detector refrigerating device based on spectrograph |
| CN103954088B (en) * | 2014-04-17 | 2016-09-07 | 北京华泰诺安探测技术有限公司 | A kind of based on spectrometer, for the high energy efficiency intelligent temperature control system of ccd detector refrigerating plant |
| CN104571185A (en) * | 2014-12-31 | 2015-04-29 | 聚光科技(杭州)股份有限公司 | Temperature control device and method of energy dispersion X-ray fluorescence spectrophotometer |
| CN109041552A (en) * | 2018-10-12 | 2018-12-18 | 成都优博创通信技术股份有限公司 | A kind of radiating subassembly and communication module |
| WO2020073897A1 (en) * | 2018-10-12 | 2020-04-16 | Chengdu Superxon Communication Technology Co., Ltd. | Heat Dissipation Assembly and Communication Module |
| KR20210082168A (en) * | 2018-10-12 | 2021-07-02 | 청두 슈퍼손 커뮤니케이션 테크놀로지 컴퍼니 리미티드 | Heat dissipation assembly and communication module |
| KR102541949B1 (en) * | 2018-10-12 | 2023-06-13 | 청두 슈퍼손 커뮤니케이션 테크놀로지 컴퍼니 리미티드 | Thermal assembly and communication module |
| CN110701824A (en) * | 2019-09-26 | 2020-01-17 | 广西博世科环保科技股份有限公司 | XRF temperature control device based on semiconductor |
| CN112994411A (en) * | 2021-02-05 | 2021-06-18 | 四川恩巨实业有限公司 | Power adapter heat radiation structure |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |