CN213545202U - Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration - Google Patents
Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration Download PDFInfo
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- CN213545202U CN213545202U CN202022636992.0U CN202022636992U CN213545202U CN 213545202 U CN213545202 U CN 213545202U CN 202022636992 U CN202022636992 U CN 202022636992U CN 213545202 U CN213545202 U CN 213545202U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 57
- 238000005057 refrigeration Methods 0.000 title claims abstract description 44
- 238000001816 cooling Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 5
- 238000003491 array Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Abstract
The utility model belongs to the technical field of the CPU heat dissipation, a dull and stereotyped heat pipe formula CPU heat abstractor based on thermoelectric refrigeration is provided. The flat heat pipe with the groove on the surface is used for transferring heat generated by the CPU in the working process to the cold end of the thermoelectric refrigerating sheet, and then the heat is transferred to the external environment in a forced convection mode through the heat dissipation fins arranged at the hot end of the thermoelectric refrigerating sheet, so that the temperature of the CPU is effectively controlled, and the upper limit of the power of the CPU is improved. Compared with the traditional CPU heat dissipation mode, the method has the following advantages: the heat generated by the CPU during working is diffused by utilizing the flat heat pipe, so that the heat flux density is reduced; by changing the structure of the flat heat pipe, the contact between the cold end of the thermoelectric refrigerating sheet and air is avoided, and the problem of frost formation at the cold end is eliminated; the thermoelectric refrigerating system is adopted to dissipate heat of the CPU, the structure is simple, and the temperature is easy to control.
Description
Technical Field
The utility model belongs to the technical field of the CPU heat dissipation, concretely relates to dull and stereotyped heat pipe formula CPU heat abstractor based on thermoelectric refrigeration.
Background
With the rapid development of integrated circuit technology, the performance and power of a CPU are gradually improved, and the size is smaller and smaller, so that the CPU element with high heat flux density needs to be effectively cooled, otherwise, the power of the CPU is limited, and the CPU is damaged in severe cases. With the increasing demand of users for the performance of the CPU, the overall arrangement of the chassis is gradually compact, so designing a high-efficiency compact CPU heat dissipation device is a necessary condition for breaking through the performance limit of the CPU and improving the performance of the computer.
The existing CPU heat dissipation mode comprises active heat dissipation and passive heat dissipation, the active heat dissipation is suitable for heat dissipation of electronic components with low heat flux density, the requirement of the CPU on heat dissipation cannot be met, and the passive heat dissipation mainly comprises the following steps: air-cooled heat dissipation, liquid-cooled heat dissipation, heat pipe heat dissipation and semiconductor refrigeration. For example, in the patent of "a central processing unit chip air-cooled heat dissipating device for blade server" (patent number: 201910010481.7), by senior macro et al, heat is taken away by using the phase change of working medium in a small evaporator on a server chip, and then the liquefaction of the working medium is completed by a condenser through the forced convection of a heat dissipating fan.
For example, in the patent of "a liquid cooling device for computer CPU" (patent number: 201910103352.2), such as goertong et al, circulating water is used to cool the computer CPU, and the CPU can maintain a low temperature during operation because of the large specific heat capacity of water.
For example, in the patent of "a tower type CPU radiator including a heat column" (patent number: 201910873086.1) by liukang et al, heat is taken away by using phase change of a working medium in a heat pipe, and the working medium vapor is condensed into liquid drops and falls back through forced convection of a heat radiation fan, because the phase change of the working medium has large latent heat, heat generated by the CPU in the working process can be absorbed in a large amount.
However, the traditional CPU heat dissipation method has some disadvantages, and the air cooling heat dissipation is insufficient in that when the CPU is under a high load condition, forced convection of the fan cannot meet the heat dissipation requirement of the CPU, resulting in the temperature rise of the CPU. The liquid cooling heat dissipation is insufficient in that a circulating water system is huge, miniaturization and integration of equipment are not facilitated, and meanwhile, the problems of water leakage, sealing and the like can also exist. The heat dissipation of the heat pipe is insufficient because the contact area between the heat pipe and the CPU is small, heat cannot be distributed well, and under the condition that the load of the CPU is high, overlarge thermal stress is caused due to uneven surface temperature distribution of the CPU.
The thermoelectric refrigeration piece is applied to the CPU heat dissipation field, and the thermoelectric refrigeration piece cold junction can provide a low temperature heat source for CPU, has increased the heat transfer difference in temperature, has promoted heat dissipation heat flow density. However, the application of the thermoelectric refrigerating sheet on the CPU is limited due to the problem of frosting at the cold end, and the frosting at the cold end causes a plurality of potential safety hazards such as: the main board is affected with moisture, short circuit and the like.
In view of above-mentioned several kinds of CPU radiating mode not enough, the utility model provides a dull and stereotyped heat pipe formula CPU heat abstractor based on thermoelectric refrigeration utilizes dull and stereotyped heat pipe with CPU heat diffusion to great heat transfer surface, at dull and stereotyped heat pipe groove installation thermoelectric refrigeration piece, avoids thermoelectric refrigeration piece cold junction and air contact and leads to frosting, satisfies high heat flux density, arranges the heat dissipation of compact electronic components.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a dull and stereotyped heat pipe formula CPU heat abstractor based on thermoelectric refrigeration utilizes dull and stereotyped heat pipe with CPU heat diffusion to great heat transfer surface, at dull and stereotyped heat pipe groove installation thermoelectric refrigeration piece, avoids thermoelectric refrigeration piece cold junction and air contact and leads to frosting, has promoted CPU heat abstractor's radiating efficiency and stability.
The technical scheme of the utility model:
a flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration is characterized in that the flat heat pipe type CPU heat dissipation device for thermoelectric refrigeration comprises: the heat pipe cooling device comprises a CPU1, a flat heat pipe 2 with a groove, a thermoelectric cooling plate 3, a heat dissipation fin 4 and a heat dissipation fan 5;
wherein the flat heat pipe is tightly attached to the upper surface of the CPU1 through the buckle. The thermoelectric refrigeration piece 3 is arranged in a groove on the flat heat pipe, the cold end of the thermoelectric refrigeration piece is isolated from air, the hot end of the thermoelectric refrigeration piece 3 is tightly attached to the heat dissipation fins 4 through heat conduction interface materials, and the heat dissipation fan 5 is arranged at the upper end of the heat dissipation fins 4.
In the embodiment of the disclosure, the flat heat pipe is tightly attached to the upper surface of the CPU1 through the fastener, and a gap between the flat heat pipe and the CPU1 is filled with heat-conducting silicone grease, thereby avoiding thermal contact resistance caused by machining accuracy.
In the embodiment of the present disclosure, the thermoelectric cooling plate 3 is installed in the flat heat pipe groove, so as to avoid frosting caused by the contact between the cold end of the thermoelectric cooling plate 3 and the air.
In the embodiment of the present disclosure, the heat dissipation fan 5 is installed at the upper end of the heat dissipation fin 4, and dissipates heat to the heat dissipation fin 4 by means of forced convection.
In the embodiment of the present disclosure, one metal sheet of the flat heat pipe 2 with grooves is stamped to form the concave portion before reflow soldering, and after reflow soldering, the concave portion forms a cavity between the two metal sheets.
In the embodiment of the present disclosure, the thermoelectric cooling plate 3 is formed by using a plurality of standard thermoelectric cooling plates (40 × 40mm) in an array.
In the embodiment of the disclosure, interface materials with good thermal conductivity are filled among the CPU1, the flat heat pipe 2 with the groove, the thermoelectric cooling plate 3 and the heat dissipation fins 4, so as to reduce the contact thermal resistance.
The utility model has the advantages that:
1) the device is compact and exquisite, and is beneficial to heat dissipation of high-heat-flux-density electronic components on a circuit board with a complex appearance and a compact structure.
2) The thermoelectric refrigerating sheet is utilized to provide a low-temperature heat source lower than the ambient temperature for the heat dissipation of the CPU, so that the liquefying rate of the working medium at the condensing end of the flat heat pipe is improved, and the heat dissipation of the electronic component with high heat flow density is facilitated.
3) The flat heat pipe is utilized to disperse the heat of the CPU with high heat flux density to the whole surface, so that the heat flux density is reduced, the fluorinated liquid at the bottom of the flat heat pipe is uniformly evaporated, the temperature rise of electronic components with high heat flux density is effectively controlled, and the equipment can stably run.
4) The flat heat pipe with the groove forms the groove through stamping and is used for installing the thermoelectric refrigeration piece, so that the cold end of the thermoelectric refrigeration piece is isolated from the external air phase, the cold end of the thermoelectric refrigeration piece is prevented from contacting with moisture in the air, frosting is caused, and the safe operation of the system is maintained.
5) When the CPU is in a high-load operation condition, the surface temperature of the CPU is rapidly increased, the heat generation quantity is rapidly increased, in order to ensure that the CPU is in a normal working temperature, the power of the thermoelectric refrigerating sheet can be increased, the cost of the power increase is the increase of energy consumption, but compared with other heat dissipation modes, the energy consumption is the minimum.
Drawings
Fig. 1 is a schematic diagram of a flat heat pipe type CPU heat dissipation device based on thermoelectric cooling.
FIG. 2(a) is a schematic structural diagram of a heat dissipation fan
Fig. 2(b) a schematic structural view of a heat sink
FIG. 2(c) is a schematic structural diagram of a thermoelectric cooling plate array
FIG. 2(d) is a schematic structural diagram of a flat heat pipe with grooves
FIG. 2(e) is a schematic diagram of the CPU structure
In the figure: 1 CPU; 2, a flat heat pipe with a groove; 3 thermoelectric refrigerating sheets; 4 heat dissipation fins; 5 a heat radiation fan;
Detailed Description
The following further describes a specific embodiment of the present invention with reference to the drawings and technical solutions.
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. It is to be understood that such descriptions are merely illustrative of the features and advantages of the present invention and are not intended to limit the scope of the present invention as claimed.
The utility model discloses a dull and stereotyped heat pipe formula CPU heat abstractor based on thermoelectric refrigeration, its characterized in that, this dull and stereotyped heat pipe CPU heat abstractor for thermoelectric refrigeration includes: the heat pipe cooling device comprises a CPU1, a flat heat pipe 2 with a groove, a thermoelectric cooling plate 3, a heat dissipation fin 4 and a heat dissipation fan 5; when the CPU1 is in a working state, the temperature of the surface of the CPU1 rises, the CPU1 is tightly attached to the surface of the flat heat pipe through the buckle, and a heat conducting interface material is coated between the CPU1 and the flat heat pipe to reduce the thermal contact resistance between the CPU1 and the flat heat pipe, the CPU1 transfers heat to the cold end of the thermoelectric cooling plate 3 through the flat heat pipe, the heat is absorbed by the cold end of the thermoelectric cooling plate 3 and then transferred to the heat dissipation fins 4 through the hot end of the thermoelectric cooling plate 3, and the heat is diffused to the external environment under the forced convection action.
The flat heat pipe is tightly attached to the upper surface of the CPU1 through the buckle, and heat-conducting silicone grease is filled in a gap between the flat heat pipe and the CPU1, so that thermal contact resistance caused by machining precision is avoided.
The heat dissipation fan 5 is installed at the upper end of the heat dissipation fin 4, and dissipates heat to the heat dissipation fin 4 in a forced convection mode.
The flat heat pipe is characterized in that a metal sheet on one side of the flat heat pipe is punched to form a concave part before reflow soldering is carried out, and a cavity is formed between the two metal sheets after the concave part is subjected to reflow soldering.
The thermoelectric refrigerating plate 3 is formed by a plurality of standard thermoelectric refrigerating plates 3(40 x 40mm) in an array.
Interface materials with good thermal conductivity are filled among the CPU1, the flat heat pipe 2 with the groove, the thermoelectric refrigerating sheet 3 and the radiating fins 4, and the contact thermal resistance is reduced.
Fig. 1 is a schematic diagram of a flat heat pipe type CPU1 heat dissipation device based on thermoelectric cooling, and in this example, a computer CPU1 is taken as an example to explain the whole device. The flat heat pipe 2 with the groove is tightly attached to the upper surface of the CPU1 through the buckle, interface materials with good heat conductivity are filled between the flat heat pipe 2 with the groove to reduce contact thermal resistance, heat generated by the CPU1 is transmitted to the cold end of the thermoelectric refrigeration piece 3 installed in the groove of the flat heat pipe through the flat heat pipe 2 with the groove and is absorbed by the cold end of the thermoelectric refrigeration piece 3, and the heat is transmitted to the heat dissipation fins 4 from the hot end of the thermoelectric refrigeration piece 3 and then is diffused to the external environment under the forced convection action of the heat dissipation fan 5.
As shown in fig. 2(d), one side of the flat heat pipe 2 with grooves is stamped to form a concave part before reflow soldering, and after reflow soldering, a cavity is formed between the two metal sheets. The groove part of the flat heat pipe is used for installing the thermoelectric refrigerating piece 3, so that the cold end of the thermoelectric refrigerating piece is isolated from the outside air, and the cold end of the thermoelectric refrigerating piece is prevented from frosting.
The thermoelectric refrigeration piece 3 shown in fig. 2c is formed by adopting 6 standard thermoelectric refrigeration pieces (40mm × 40mm) in an array, and the 6 standard thermoelectric refrigeration pieces 3 are installed in a flat heat pipe groove to isolate moisture in the outside air, so that the cold end of the thermoelectric refrigeration piece 3 is prevented from frosting, and potential safety hazards caused by frosting are eliminated.
To sum up, the utility model discloses a dull and stereotyped heat pipe formula CPU heat abstractor based on thermoelectric refrigeration diffuses CPU's heat through utilizing dull and stereotyped heat pipe to through the dull and stereotyped heat pipe of taking the recess with heat transfer to thermoelectric refrigeration piece cold junction, and absorb by the cold junction, thermoelectric refrigeration piece hot junction is with heat transfer to heat radiation fins, its heat spreads to external environment under radiator fan forces the convection current effect.
The technical solutions and advantages of the present disclosure have been described in detail with reference to the specific examples, and it should be understood that the above description is only exemplary of the present disclosure, and is not intended to limit the present disclosure. The sizes and shapes of the various elements in the drawings are not to be considered as reflecting actual sizes and proportions, but are merely representative of the contents of the present example. Any modification, improvement or equivalent replacement made on the principle and spirit of the present disclosure is within the protection scope of the present disclosure.
Claims (5)
1. A flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration is characterized by comprising a CPU (1), a flat heat pipe (2) with a groove, a thermoelectric refrigeration piece (3), heat dissipation fins (4) and a heat dissipation fan (5);
the flat heat pipe (2) with the groove is tightly attached to the upper surface of the CPU (1) through the fastener;
the thermoelectric refrigerating sheet (3) is arranged at the groove of the flat heat pipe (2) with the groove;
the heat radiating fins (4) are tightly attached to the hot end of the thermoelectric refrigerating sheet (3) through a heat conducting interface material;
the heat radiation fan (5) is arranged at the upper end of the heat radiation fin (4) and radiates heat to the fin through forced convection.
2. The flat heat pipe type CPU heat sink based on thermoelectric cooling according to claim 1, wherein the grooved flat heat pipe (2) has a recessed portion formed by stamping a metal sheet on one side before reflow soldering, and a cavity formed between the two metal sheets after reflow soldering.
3. The flat heat pipe type CPU heat sink device based on thermoelectric refrigeration as claimed in claim 1 or 2, wherein the thermoelectric refrigeration chip (3) is formed by using a plurality of standard thermoelectric refrigeration chip arrays.
4. The flat heat pipe type CPU heat sink device based on thermoelectric refrigeration as claimed in claim 1 or 2, wherein the interface material with good thermal conductivity is filled between the CPU (1), the flat heat pipe (2) with groove, the thermoelectric refrigeration sheet (3) and the heat dissipation fins (4) to reduce the contact thermal resistance.
5. The flat heat pipe type CPU heat sink device based on thermoelectric refrigeration as claimed in claim 3, wherein the CPU (1), the flat heat pipe (2) with the groove, the thermoelectric refrigeration sheet (3) and the heat dissipation fins (4) are filled with interface materials with good thermal conductivity, so as to reduce the contact thermal resistance.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022636992.0U CN213545202U (en) | 2020-11-13 | 2020-11-13 | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration |
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| CN202022636992.0U CN213545202U (en) | 2020-11-13 | 2020-11-13 | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112256113A (en) * | 2020-11-13 | 2021-01-22 | 大连理工大学 | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112256113A (en) * | 2020-11-13 | 2021-01-22 | 大连理工大学 | Flat heat pipe type CPU heat dissipation device based on thermoelectric refrigeration |
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