JP2004071969A - Thermoelectric cooling apparatus - Google Patents

Thermoelectric cooling apparatus Download PDF

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Publication number
JP2004071969A
JP2004071969A JP2002231750A JP2002231750A JP2004071969A JP 2004071969 A JP2004071969 A JP 2004071969A JP 2002231750 A JP2002231750 A JP 2002231750A JP 2002231750 A JP2002231750 A JP 2002231750A JP 2004071969 A JP2004071969 A JP 2004071969A
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Japan
Prior art keywords
heat
thermoelectric cooling
cooling module
substrate
thermoelectric
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Pending
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JP2002231750A
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Japanese (ja)
Inventor
Jun Niekawa
贄川 潤
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Okano Electric Wire Co Ltd
岡野電線株式会社
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Priority to JP2002231750A priority Critical patent/JP2004071969A/en
Publication of JP2004071969A publication Critical patent/JP2004071969A/en
Application status is Pending legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
    • F25B2321/00Details of machines, plants, or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants, or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided is a thermoelectric cooling device that efficiently cools a heat generating portion of an electronic component that needs to be cooled with a high heat generation density.
A heat flux converter having a heat transfer area larger than a heat generating portion diffuses the heat of the heat generating portion. The heat flux converter 8 and the thermoelectric cooling module 1 are arranged to face each other, and an electric current is applied to the thermoelectric conversion element 5 provided between the first and second substrates 6 and 7 of the thermoelectric cooling module 1 so that the second substrate 7 is As a heat-absorbing substrate, the heat diffused by the heat flux converter 8 is absorbed. This heat is radiated from the first substrate 6 of the thermoelectric cooling module 1 and further radiated by the heat sink 3. The maximum heat absorption of the thermoelectric cooling module 1 is set to 2.5 times or more the required heat absorption (the required heat absorption / maximum heat absorption is 40% or less), and the heat transfer area of the heat flux converter 8 on the thermoelectric cooling module 1 side is reduced. And the heat transfer area on the heat flux converter 8 side of the thermoelectric cooling module 1 (about 80% to 120%).
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a thermoelectric cooling device attached to an electronic device such as a personal computer, a server, and a high-performance computer, and used to radiate heat from the electronic device.
[0002]
[Background Art]
Major components of electronic devices, such as various LSIs (Large Scale Integration circuits) and CPUs (Central Processing Units) used in computers, are remarkably reduced in size and performance. In addition, the wiring intervals of LSIs and the like have become smaller, the submicron region has been reached, and higher integration has been further promoted. As described above, when the miniaturization and high performance of the main components of the electric device and the integration of the wiring are advanced, the heat generation in the electronic device increases, and further, the heat generation per unit area increases to increase the heat generation density. This new problem has become a major issue.
[0003]
FIG. 7 shows an example of an air-cooled heat sink of a CPU, which is the most typical and basic example of a cooling configuration of an electronic device. In this example, the size of the heating section 9 of the CPU is 10 mm square, and the heating value of the heating section 9 is 30 W at the maximum. The heat sink 3 and the heat generating portion 9 are arranged so as to be in contact with each other via a heat conductive grease 11 and are thermally connected.
[0004]
The heat sink 3 is made of aluminum (aluminum) and has a base 14 and a plurality of fins 13 projecting upward from the base 14. The size of the base 14 is 70 mm × 70 mm, and the thickness of the base 14 is 6.5 mm. The fins 13 are arranged with an interval therebetween, and the height of each fin 13 is 30 mm and the thickness of the fin 13 is 0.6 mm.
[0005]
In this example, a passive cooling method is used in which cooling is performed by simply utilizing a temperature difference from an environmental temperature for cooling. However, in general, a system fan (not shown) is provided in the disposition section of the electronic device for cooling a plurality of electronic devices, and the fins 13 of the heat sink 3 are used by utilizing the circulation of the wind of the fan. Heat is dissipated.
[0006]
Further, in the configuration shown in FIG. 7, the number of fins 13 is not particularly limited, but an example in which 24 fins 13 are arranged has been proposed. FIG. 7 shows the number of fins 13 in a simplified manner.
[0007]
In the above example, assuming that the front wind speed with respect to the heat sink 3 is 2.6 m / s, the thermal conductivity of grease is 1 W / mK, the thickness of grease is 100 μm, the thermal conductivity of aluminum is 200 W / mK, and the environmental temperature is 40 ° C. The surface temperature of the heating section 9 is about 93 ° C.
[0008]
In addition, conventionally, many attempts have been made to more efficiently cool the heat of the heat generating unit 9 with respect to an increase in the heat generation amount of the electronic device. For example, various types of cooling such as a cooling device using a thermoelectric cooling module have been studied. A device has been proposed.
[0009]
As shown in FIG. 11, for example, a thermoelectric cooling module 1 such as a Peltier module includes a plurality of thermoelectric conversion elements between a first substrate 6 and a second substrate 7 which are vertically arranged with an interval therebetween. 5 is erected and fixed. On the opposing surfaces of the first and second substrates 6 and 7, a plurality of electrodes 2 for energization are formed at intervals from each other.
[0010]
The thermoelectric conversion elements 5 are connected in series via the corresponding electrodes 2, and a connection circuit for the thermoelectric conversion elements 5 is formed. The thermoelectric conversion element 5 is fixed to the electrode 2 by, for example, solder (not shown).
[0011]
The thermoelectric conversion element 5 (5a, 5b) of the thermoelectric cooling module is generally known as a thermoelectric conversion element, and is formed by a P-type thermoelectric conversion element 5a formed of a P-type semiconductor and an N-type semiconductor. And an N-type thermoelectric conversion element 5b. The P-type thermoelectric conversion elements 5a and the N-type thermoelectric conversion elements 5b are arranged alternately and connected in series via the electrodes 2 to form a PN element pair.
[0012]
A lead wire 10 is soldered and connected to the electrode 2 (2a) formed on the second substrate 7 and located at the end of the connection circuit of the thermoelectric conversion element 5. In the thermoelectric cooling module 1, when a current flows from the lead wire 10 to the electrode 2a by a conducting means (not shown), a current flows through the P-type thermoelectric conversion element 5a and the N-type thermoelectric conversion element 5b.
[0013]
Then, a cooling / heating effect is generated at a joint (interface) between the thermoelectric conversion element 5 (5a, 5b) and the electrode 2. That is, a so-called Peltier effect occurs in which one end of the thermoelectric conversion element 5 (5a, 5b) is heated and the other end is cooled, depending on the direction of the current flowing through the junction.
[0014]
When one end of the thermoelectric conversion element 5 (5a, 5b), for example, the lower end of the thermoelectric conversion element 5 (5a, 5b) is cooled by the Peltier effect, the second substrate 7 is placed on the second substrate 7 side. Is cooled (heat absorption) of the member provided in contact with the substrate. At this time, the upper end of the thermoelectric conversion element 5 (5a, 5b) is heated by the Peltier effect, and heat is radiated from the first substrate 6 side.
[0015]
Examples of cooling devices for electronic devices using the thermoelectric cooling module 1 include the following. For example, in Japanese Patent Application Laid-Open No. Hei 5-243438, the thermoelectric cooling module 1 is disposed in thermal contact with the heat generating unit 9, and once the heat from the heat generating unit 9 is received by the thermoelectric cooling module 1, The heat generated in the high temperature portion is transmitted from the substrate 6 on the high temperature side to the heat pipe, and the heat is transferred from the heat pipe to radiate the heat.
[0016]
Further, Japanese Patent Application Laid-Open No. 7-106640 proposes a configuration in which the cooling effect of the thermoelectric cooling module 1 is used for generating cool air for cooling. Japanese Patent Laying-Open No. 10-132478 proposes a configuration in which a CPU is cooled using a thermoelectric cooling module 1.
[0017]
In the above-mentioned Japanese Patent Application Laid-Open No. Hei 5-243438, a heat pipe is used together with the thermoelectric cooling module 1. A cooling device using a heat pipe is described in, for example, Japanese Patent Application Laid-Open No. 2000-165077. As described above, there has been proposed a configuration in which the heat from the heat generating portion 9 is moved to the low temperature side of the thermoelectric cooling module using a heat pipe to separate the heat generating source and the heat radiating portion.
[0018]
Further, Japanese Patent Application Laid-Open No. 10-10388 proposes a measure for lowering the ambient temperature of the CPU using a heat pipe. Note that the use of heat pipes in these proposals has been used to transfer heat, for example, from one side to the other.
[0019]
Further, as another example of a cooling device for an electronic device, in Japanese Patent Application No. 8-281851, an axial fan 20 and a heat sink 3 are combined, and a thermoelectric cooling module 1 is mounted on a base 14 of the heat sink 3 as shown in FIG. A configuration has been proposed in which the surface of one substrate 6 is brought into contact, and a metal plate 25 having good thermal conductivity is provided on the surface of the second substrate 7 of the thermoelectric cooling module 1.
[0020]
This proposal describes that a moisture absorber 26 is provided on the fin 13 of the heat sink 3. In FIG. 9, reference numeral 27 denotes an arrangement portion of the heat sink 3, and the heat sink 3 is formed by integrally disposing the fan 20.
[0021]
Further, in Japanese Patent Application No. 2000-233697, as shown in FIG. 10, a combination of a heat generating part 9, a low-temperature heat medium heat pipe 24 as a heat medium means, a thermoelectric cooling module 1 as a heat radiating means, and a heat sink 3 Has been advocated. In this proposal, a configuration in which a water cooling jacket is provided instead of the heat sink 3 is also proposed.
[0022]
Japanese Patent Application Nos. 8-281851 and 2000-233697 both use the heat absorbing function of the thermoelectric cooling module 1 and further combine a low-temperature heat transfer medium heat pipe 24 and a moisture absorber 26.
[0023]
[Problems to be solved by the invention]
By the way, most of the above proposals use the thermoelectric cooling module 1. Generally, if the heat absorption amount of the thermoelectric cooling module 1 such as a Peltier module is Qc, the heat radiation amount is Qh, and the electric power supplied to the thermoelectric cooling module is P, Qh = P + Qc. Further, assuming that the ratio of the heat absorption amount to the input power is Φ, Φ = Qc / P, and is represented by Qh = Qc (1 / Φ + 1). The value of Φ changes depending on the temperature difference (ΔT) between the high-temperature side substrate and the low-temperature side substrate.
[0024]
From the above equation, Qh> Qc, and when the thermoelectric cooling module 1 is used for cooling, it is necessary to dissipate more heat than the amount of heat necessary for cooling the thermoelectric cooling module 1, but the thermoelectric cooling module 1 such as a Peltier module There is a feature that a relatively low temperature can be easily partially generated in a general environment in which electronic devices are used.
[0025]
In other words, when the cooling device is configured using the thermoelectric cooling module 1 such as a Peltier module, a so-called active cooling system is used in the sense that a steep temperature difference can be created between the temperature of the heating unit 9 and the environmental temperature. Since the cooling configuration can be used, there is an advantage that the partial cooling focusing only on the heat generating portion 9 can be performed efficiently as compared with a cooling device having a configuration not using the thermoelectric cooling module 1.
[0026]
However, a conventional general method of using the thermoelectric cooling module 1 is to design and utilize a large temperature difference (ΔT) between the high-temperature side substrate and the low-temperature side substrate. Is generally used as about 1.0 to 2.5 times (100% to 250%) the maximum heat generation (heat absorption of the thermoelectric cooling module), and the heat absorption with respect to the power input to the thermoelectric cooling module 1. Was few.
[0027]
That is, conventionally, no consideration has been given to the reduction in power consumption, which is the greatest drawback when using the thermoelectric cooling module 1. Therefore, in each of the above proposals using the thermoelectric cooling module 1, even if the cooling device is configured by applying the design of the conventional thermoelectric cooling module 1, the input power of the thermoelectric cooling module 1 increases, and the power consumption of the cooling device increases. Had to be large.
[0028]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a thermoelectric cooling module such as a Peltier module for heating a heat-generating portion of an electronic component which needs to be cooled at a high heat density such as a CPU of a computer. To provide a thermoelectric cooling device that efficiently cools with low power consumption using the same.
[0029]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has means for solving the problem with the following configuration. That is, the first invention includes a heat flux converter in which a heat flux diffusion surface is arranged to contact and face a heat generating portion directly or via a heat conductive member, and the heat flux converter is larger than the heat generating portion. It has a heat area to spread the heat of the heat generating part, and the thermoelectric cooling module comes into contact with the heat flux diffusion back surface of the heat flux converter directly or through a heat conductive member. The thermoelectric cooling module has a first substrate and a second substrate which are arranged to be opposed to each other with a space therebetween, and the second substrate is substantially in contact with a heat flux diffusion back surface of the heat flux converter. , And a plurality of thermoelectric conversion elements are erected between the first substrate and the second substrate of the thermoelectric cooling module. The substrate forms a heat absorbing side substrate and the first substrate dissipates heat. A heat sink is disposed on the first substrate side so as to contact and face the first substrate directly or via a heat conductive member, and the maximum heat absorption of the thermoelectric cooling module is determined by the required heat absorption. The heat transfer area of the heat flux converter on the thermoelectric cooling module side is set to be about 80% or more and about 120% or less of the heat exchange area on the heat flux converter side of the thermoelectric cooling module. It is a means to solve.
[0030]
According to a second aspect of the present invention, in addition to the configuration of the first aspect, the heat flux converter includes a heat pipe, a flat heat diffusion plate incorporating the heat pipe, and at least one heat transport member of a vapor chamber. The heat transport member has a configuration in which the heat transport member has a hydraulic fluid therein, and performs heat transport using a phase change of the hydraulic fluid.
[0031]
In a third aspect of the present invention, in addition to the configuration of the first or second aspect, a temperature detecting section is provided at at least one of the heat generating section and the heat flux converter, and a temperature detected by the temperature detecting section is set in advance. This is a means for solving the problem with a configuration in which a power control unit that continuously or intermittently controls the input power of the thermoelectric cooling module so that the temperature becomes lower than the set temperature is set.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of the present embodiment, the same reference numerals are given to the same parts as those in the conventional example, and the overlapping description will be omitted or simplified.
[0033]
FIG. 1 shows a first embodiment of a thermoelectric cooling device according to the present invention. As shown in FIG. 1, the thermoelectric cooling device according to the present embodiment has a heat flux converter 8 which is arranged in contact with and opposed to a heat generating portion 9 via a heat conductive grease 11. The heating unit 9 is a CPU.
[0034]
The heat flux converter 8 has a heat flux diffusion surface 15 and a heat flux diffusion back surface 16, and the heat flux diffusion surface 15 is arranged so as to be in contact with the heat generating portion 9. The heat flux diffusion surface 15 and the heat flux diffusion back surface 16 of the heat flux converter 8 have a heat transfer area larger than that of the heat generating portion 9 so as to spread the heat of the heat generating portion 9.
[0035]
In addition, the thermoelectric cooling device of the present embodiment has the thermoelectric cooling module 1 which is arranged so as to be opposed to the heat flux converter 8 via the heat conductive grease 11. The thermoelectric cooling module 1 has a first substrate 6 and a second substrate 7 that are opposed to each other with an interval therebetween.
[0036]
The first and second substrates 6 and 7 have substantially the same area as the heat flux diffusion back surface 16 of the heat flux converter 8. The second substrate 7 is in substantial contact with the heat flux diffusion back surface 16 of the heat flux converter 8.
[0037]
The thermoelectric cooling module 1 applied to the present embodiment has a plurality of thermoelectric conversion elements 5 erected between a first substrate 6 and a second substrate 7, similarly to the conventional thermoelectric cooling module 1. It is formed. Further, by passing a current through these thermoelectric conversion elements 5, the second substrate 7 forms a heat-absorbing side (low-temperature side) substrate and the first substrate 6 forms a heat-radiating side (high-temperature side) substrate. .
[0038]
Further, the thermoelectric cooling device of the present embodiment has a heat sink 3 which is arranged in contact with and opposed to the thermoelectric cooling module 1 with a thermally conductive grease 11 therebetween. The heat sink 3 is, for example, a forced-air-cooling type heat sink that dissipates heat by utilizing the circulation of the wind of a system fan 20a provided for cooling a plurality of electronic devices. The cooling wind speed is 2.6 m / s. It is. Note that the structure of the heat sink 3 is the same as that of the heat sink 3 shown in FIG.
[0039]
The heat flux converter 8 is formed by a so-called flat heat pipe called a vapor chamber. This vapor chamber is one of the heat transporting members, and is a copper container having a thickness of 5 mm, pure water and a small amount of working liquid provided inside the container, and the working liquid is smoothly transferred inside the heat pipe. Equipped with a wick for transfer to
[0040]
When heat is applied to a part of the vapor chamber, the vapor chamber performs heat transport by the evaporation and condensation of the working fluid inside the vapor chamber, that is, utilizing the phase change of pure water as the working fluid, The heat can be transferred to a uniform temperature throughout the entire chamber.
[0041]
The maximum allowable temperature of the heat generating portion 9 of the electronic device is generally about 80 ° C to 100 ° C. Therefore, the operating temperature of the heat flux converter 8 in contact with the heat generating portion 9 is often 50 ° C. to 80 ° C. in which the temperature drop due to the contact resistance between the two is subtracted. Therefore, in the present embodiment, a vapor chamber using water, which is the most efficient working fluid, is applied as the heat flux converter 8.
[0042]
The heat flux diffusion back surface 16 of the heat flux converter 8 has a size of 70 mm on a side and an area of 4900 mm. 2 It is. The area of the heating surface 9 of the CPU is 100 mm 2 Therefore, the heat flux converter 8 diffuses the heat of the heat generating surface 9, thereby reducing the heat flux to 1/49. The heat flux diffusion surface 15 of the heat flux converter 8 is formed narrower than the heat flux diffusion back surface 16.
[0043]
The thermoelectric cooling module 1 is formed by providing 40 thermoelectric conversion elements 5 made of P and N thermoelectric semiconductors. One size of the semiconductor element is 2 mm square in cross section and 1 mm in height.
[0044]
The first and second substrates 6 and 7 of the thermoelectric cooling module 1 have a size of 70 mm square and are ceramic substrates made of alumina. The temperature of the second substrate 7 serving as the low-temperature substrate is set to 42 ° C. The current flowing through the electrodes (not shown) is set so that the temperature difference between the high-temperature side substrate and the low-temperature side substrate becomes 15 ° C., that is, the temperature of the first substrate 6 becomes 57 ° C. Adjust.
[0045]
In order to further improve the performance of the thermoelectric cooling module 1 applied to the present embodiment, the first and second substrates 6 and 7 are made of aluminum nitride (AlN) or boron nitride (BN). ), Silicon carbide (SiC) or the like.
[0046]
As described above, the present embodiment employs the heat flux converter 8 that diffuses the heat of the heat generating unit 9 (expands the heat flux) in order to efficiently remove the heat from the heat generating unit 9 such as the CPU of the electronic device. The thermoelectric cooling module 1 is disposed in thermal contact with the heat flux converter 8 so that the heat is absorbed by the thermoelectric cooling module 1. I have.
[0047]
The most characteristic configuration of the present embodiment is that a required cooling function can be obtained while suppressing power consumption of the thermoelectric cooling module 1 by the configuration described below.
[0048]
That is, in the present embodiment, the maximum heat absorption of the thermoelectric cooling module used is set to 2.5 times or more the required heat absorption (the required heat absorption / maximum heat absorption is 40% or less), and the thermoelectric cooling module side of the heat flux converter Heat transfer area of the heat flux converter side of the thermoelectric cooling module is about 80% or more and about 120% or less, so that heat from electronic devices can be efficiently input to the thermoelectric cooling module. The area is enlarged while lowering the heat density by the converter. In the present embodiment, the heat generating unit 9 can be sufficiently cooled while reducing the power consumption of the thermoelectric cooling module 1 by these configurations.
[0049]
In this embodiment, the thermoelectric cooling module 1 is designed and selected so that the maximum heat absorption of the thermoelectric cooling module 1 is 2.5 times or more of the heat generation amount of the heat generating portion 9, that is, the required heat absorption amount, and both sides of the thermoelectric cooling module are selected. The temperatures of the first and second substrates 6 and 7 are set so that the temperature difference does not increase more than necessary, that is, so that the temperature setting of the low-temperature side substrate does not become too low or the heat of the high-temperature side substrate is quickly removed. The temperature is set as described above (at 57 ° C. and 42 ° C., respectively).
[0050]
In the present embodiment, a temperature detector 18 is provided at at least one position (here, the heat generator 9) of the heat generator 9 and the heat flux converter 8. Further, in the present embodiment, a power control unit 19 that continuously or intermittently controls the input power of the thermoelectric cooling module 1 is provided so that the temperature detected by the temperature detection unit 18 is lower than a preset temperature. Have been.
[0051]
The power control unit 19 compares the temperature detected by the temperature detection unit 18 with predetermined control data. For example, when the temperature detected by the temperature detection unit 18 is equal to or higher than the set temperature, the power control unit 19 controls the input power of the thermoelectric cooling module 1 to be large. When the temperature detected by the temperature detector 18 is equal to or lower than the set temperature, control is performed such as reducing the power supplied to the thermoelectric cooling module 1. The control of the power control unit 19 can also be performed by turning on / off the power supply 17 of the thermoelectric cooling module 1.
[0052]
In the present embodiment, the temperature detection by the temperature detection unit 18 and the control by the power control unit 19 serve to secure the necessary cooling capacity of the heating unit 9 and to suppress unnecessary power consumption of the thermoelectric cooling module 1. The required cooling function can be obtained while suppressing the power consumption of the thermoelectric cooling module 1.
[0053]
By the way, in the thermoelectric cooling module 1, as the input electric power (current) is increased, the influence of the heat generated by the Joule heat gradually increases, and finally, the heat amount obtained by subtracting the Joule heat from the heat absorption amount on the low temperature side at a certain current value reaches a peak. It becomes. Therefore, as shown in FIG. 2, Φ, that is, Qc / P has a peak with respect to the power supplied to the thermoelectric cooling module 1.
[0054]
Therefore, if the input electric power of the thermoelectric cooling module 1 is too large compared to the heat generation amount of the heat generating unit 9 (the electronic device to be cooled), power consumption increases and wasteful cost increases. If the input power of the thermoelectric cooling module 1 is too small compared to the heat generation amount of the heat generating unit 9, the cooling cannot catch up and sufficient cooling cannot be performed.
[0055]
The capacity of the thermoelectric cooling module 1 should be determined only based on the calorific value of the heat generating part 9. As a result of various studies by the present inventors, the maximum heat absorption of the thermoelectric cooling module 1 to be used is calculated as 2. The heat transfer area on the thermoelectric cooling module 1 side of the heat flux converter 8 is set to be 5 times or more (the required heat absorption amount / maximum heat absorption amount is 40% or less). About 80% or more and about 120% or less, and the thermoelectric cooling module 1 is formed large so that heat from the heat generating portion 9 of the electronic device can be efficiently input to the thermoelectric cooling module while reducing the heat density by the heat flux converter. It has been found that enlarging the area is effective.
[0056]
In other words, as a result of the study by the present inventors, it has been found that by setting the maximum heat absorption of the thermoelectric cooling module 1 to 2.5 times or more the required heat absorption, cooling can be performed while suppressing an excessive increase in power consumption. Do you get it.
[0057]
Hereinafter, this point will be described in more detail. The amount of heat absorbed by the thermoelectric cooling module 1 varies depending on the cross-sectional area and length of the PN semiconductor constituting the thermoelectric cooling module 1, the logarithm of the PN junction, the thermoelectric performance of the element, and the like. However, for example, as shown in FIG. 12, when the horizontal axis represents the current value (or power consumption) and the vertical axis represents the low-temperature-side heat absorption amount, the curve generally has a peak.
[0058]
FIG. 12 shows the result of setting the cross section of the PN semiconductor constituting the thermoelectric cooling module 1 to 1 mm square, setting the length to 0.7 mm, and setting the logarithm of the PN junction to 100. This is a result of a simulation in which the temperature difference (ΔT) between the substrate and the heat-side substrate is 15.0 ° C.
[0059]
Conventionally, from the performance of thermoelectric conversion, a thermoelectric cooling module in which about 70 to 80% of the maximum heat absorption of the thermoelectric cooling module 1 has a desired heat absorption has been generally selected. Because, for the heat absorption, selecting a thermoelectric conversion with a large maximum heat absorption often involves selecting a thermoelectric cooling module of an unnecessary size, which is not preferable in terms of cost. Because it was thought.
[0060]
In FIG. 12, the maximum heat absorption is about 58 watts, and when the design of the conventional thermoelectric cooling module 1 is applied, it is used for heat absorption at about 45 watts. At this time, the size of the thermoelectric cooling module 1 is 25 mm square, and the heat flux density of the heat input to the thermoelectric cooling module 1 is about 7 w / cm. 2 It becomes. Thus, it can be seen that the thermoelectric cooling module 1 itself has a high heat absorption capability and can cope with a high heat flux even if it is small.
[0061]
However, the relationship between the current (power consumption) and the coefficient of performance (heat absorption / power consumption) of the thermoelectric cooling module 1 is as shown in FIG. 13, and when the current value near 5.5 A corresponding to the heat absorption of about 45 watts is obtained. It can be seen that the coefficient of performance is 1 or less.
[0062]
The present invention has been proposed to secure heat absorption while reducing power consumption. That is, the present inventor has decided to design the size and heat absorption of the thermoelectric cooling module 1 to be used, for example, so that the coefficient of performance shown in FIG. 13 is 1 or more and the temperature difference required for heat radiation is secured.
[0063]
For that purpose, it is necessary to lower the heat absorption density at the same time. In view of these, as a result of the study by the present inventor, the design of the thermoelectric cooling module 1 is set so that the required heat absorption / maximum heat absorption is 40% or less. Was found to be suitable. In this case, although the size of the thermoelectric cooling module 1 is larger than the conventional selection criterion, the required heat absorption amount and the required temperature difference can be secured while reducing the power consumption.
[0064]
For example, based on the above, if the thermoelectric cooling module 1 is designed so that the required heat absorption / maximum heat absorption is 40% or less, the maximum heat absorption is 45 ° for the heat absorption of 45 w. It is necessary to make 0.4 larger than 112.5. Therefore, in order to set the coefficient of performance shown in FIG. 13 to 1 or more and secure the temperature difference required for heat radiation, it is understood that the thermoelectric cooling module 1 having a maximum heat absorption of 125 W, for example, should be designed.
[0065]
When the thermoelectric cooling module 1 having the maximum heat absorption of 125 w is designed, for example, the size of the thermoelectric cooling module 1 is about 35 mm square in this case, and the logarithm of the PN semiconductor is 15 × 15 = 225 pairs. If the characteristics of the PN thermoelectric semiconductor and the shape and size of the PN junction are the same as those used in the simulation of FIG. 12, an endothermic curve as shown in FIG. 14 is obtained.
[0066]
In this case, while the maximum heat absorption of the thermoelectric cooling module 1 reaches 125 w, but the actual heat absorption is 45 w, the current value is 2.5 A. The heat flux density of the heat input to the thermoelectric cooling module 1 is about 3.7 w / cm 2 And the coefficient of performance at this time is about 2, as can be seen from FIG. That is, the thermoelectric cooling module 1 can secure a heat absorption amount twice as much as the input power.
[0067]
In addition, the heat flux converter 8 reduces the heat density of the heat generating unit 9 because the heat from the heat generating unit 9 such as an electronic device is efficiently input to the thermoelectric cooling module 1 due to the increase in the size of the thermoelectric cooling module 1. At the same time, it is necessary to increase the area for transferring heat to the thermoelectric cooling module 1.
[0068]
As can be seen from the above example, in practice, the coefficient of performance exceeds 1 even when about 50 to 60% of the maximum heat absorption of the thermoelectric cooling module 1 is the necessary heat absorption, which leads to a reduction in power consumption. The smaller the required heat absorption / maximum heat absorption, the better. It is desirable that the required heat absorption / maximum heat absorption be 40% or less.
[0069]
FIG. 3 shows an example in which the heat transfer cooling device having the basic configuration of the thermoelectric cooling device of the present embodiment shown in FIG. The thermoelectric cooling module 1 used at this time was selected so that the maximum heat absorption (Qmax) was 120 w (Qr / Qmax = 19%) with respect to the required heat absorption (Qr) of 35 w. Then, the relationship between the input power and the thermal resistance of the heat generating unit 9 was obtained by variously changing the input power to the thermoelectric cooling module 1 when cooling the heat generating unit 9 having the maximum heat generation of 35 W.
[0070]
The larger the power input to the thermoelectric cooling module 1, the smaller the thermal resistance of the heat generating unit 9 can be. However, the rate of decrease in the thermal resistance decreases as the power input to the thermoelectric cooling module 1 increases, and Even if the input electric power is larger than 100% of the maximum heat generation amount (necessary heat absorption amount) of the heat generation unit 9, the thermal resistance does not decrease so much.
[0071]
As is clear from FIG. 3, by adopting the form of the thermoelectric cooling module 1 and the heat flux converter 8 as in the present embodiment, efficient cooling in which the power input to the thermoelectric cooling module 1 is reduced is achieved. It has become possible.
[0072]
FIG. 6 shows the measurement results of the ratio of the power consumption P and the heat absorption Q of the thermoelectric cooling module 1 to the thermal resistance value of the thermoelectric cooling device according to the present invention, for example, in the device having the basic configuration of the present embodiment. It is shown. In FIG. 6, unlike the present embodiment, Δ indicates that the heat generation amount of the heat generating unit 9 is 27 W, and Δ indicates that the heat generation amount of the heat generation unit 9 is 18 W. As shown in this figure, when P / Q <100 (%), a cooling device having a substantially stable performance was obtained, indicating that the power consumption was successfully suppressed.
[0073]
The present embodiment is configured based on the above study. In the present embodiment, the maximum power consumption of the CPU forming the heating unit 9 is 30 W, and the area of the heating unit 9 is 10 mm × 10 mm = 100mm 2 (= 1cm 2 ). Therefore, the heat generation density of the heat generating portion 9 is 30 W / cm. 2 It is.
[0074]
When the heat generation amount of the heating section 9 is 30 W, the thermoelectric cooling module 1 absorbs the heat of 30 W. In this case, the current applied to the thermoelectric cooling module 1 is 7 A, and the required power is 15 W. .
[0075]
Therefore, the heat sink 3 needs to radiate a total of 45 W, including 15 W which is the power consumption of the thermoelectric cooling module 1, in addition to the heat generated by the heat generating portion 9 of 30 W.
[0076]
Here, if the environmental temperature is 40 ° C., ΔT at the heat sink 3 is 17 ° C., which is the temperature of the first substrate 6 which is the high-temperature side substrate of the thermoelectric cooling module 1. When the above current is applied to the thermoelectric cooling module 1, a temperature difference of 15 ° C. on both sides of the thermoelectric cooling module 1 is obtained. Therefore, the temperature of the second substrate 7 which is the low-temperature side substrate of the thermoelectric cooling module 1 is 42 ° C. It becomes.
[0077]
At this time, the surface temperature of the CPU, that is, the temperature of the heat generating portion 9 rises by 30 ° C. due to the contact resistance of the grease portion, and eventually reaches 72 ° C. Therefore, in this embodiment, as can be seen from the temperature of 93 ° C. of the heat generating portion 9 on the surface of the CPU in the conventional example, the temperature can be significantly reduced.
[0078]
Further, as shown in FIG. 8, the present inventor provided a heat flux converter 8 in contact with the heat generating unit 9 and formed a configuration in which the heat of the heat flux converter 8 was radiated by the heat sink 3. The temperature of 9 was determined. As a result, the temperature was 84 ° C., and it was confirmed that, in comparison with this example, the heat generating portion 9 of the present embodiment can be cooled very efficiently.
[0079]
For example, if the area of the heat generating portion 9 of the electronic component or the like to be cooled is substantially the same as the area of the thermoelectric cooling module 1, the heat generating portion 9 and the thermoelectric cooling module 1 are substantially connected directly or via a thermal conductive grease or the like. In principle, it is considered that the heat of the heat generating portion 9 can be sufficiently absorbed by the thermoelectric cooling module 1 even without the heat flux converting function.
[0080]
However, in recent years, the miniaturization and high integration of electronic components have been progressing, and the area of the heat generating portion 9 has been reduced, and the contact area between the heat generating portion 9 and the thermoelectric conversion module 1 has reduced the heat absorption of the heat generating portion 9. In this case, the thermoelectric cooling module 1 cannot sufficiently absorb the heat of the heat generating portion 9.
[0081]
On the other hand, in the present embodiment, a heat flux converter 8 is provided between the second substrate 7, which is a heat absorbing side substrate of the thermoelectric cooling module 1, and the heat generating unit 9, and heat of the heat generating unit 9 is converted into heat flux. The heat is cooled by the thermoelectric cooling module 1 after the heat is diffused by the vessel 8 and the heat input density to the thermoelectric cooling module 1 is reduced, so that the heat generating portion can be cooled very efficiently.
[0082]
Note that the heat density of the heat generating part 9 is 20 W / cm due to small size and high integration, such as a CPU used for a high performance server. 2 In the case of exceeding, in the prior art, it was not possible to completely cool by air cooling, so it was necessary to rely on water cooling, cooling with a refrigerant, etc.If this embodiment example is applied, it is necessary to rely on water cooling etc. which has a risk of water leakage etc. In addition, the heat generating portion 9 can be efficiently cooled as described above.
[0083]
For example, if the maximum temperature can be tolerated up to the temperature (93 ° C.) of the heat generating portion 9 in the conventional example, a thermoelectric cooling device having a configuration similar to that of the present embodiment and a CPU having a heating value of 40 W are applied. be able to. That is, by efficiently cooling using the thermoelectric cooling device of this embodiment, the heat generation density is 40 W / cm. 2 Can be applied to an electronic device.
[0084]
FIG. 4 shows a main configuration of a thermoelectric cooling device according to a second embodiment of the present invention. The second embodiment is substantially the same as the first embodiment. The second embodiment is different from the first embodiment in that the thermoelectric cooling module 1 includes 15 thermoelectric cooling modules. That is, the Peltier modules 12 are formed side by side.
[0085]
In the second embodiment, the heat flux diffusion surface 15 and the heat flux diffusion rear surface 16 of the heat flux converter 8 have the same area, and the heat sink 3 is a fan-integrated heat sink having a fan 20.
[0086]
In the thermoelectric cooling device of the second embodiment, the heat generating portion 9 of the IGBT for power conversion is to be cooled. The size of the heat generating part 9 is 40 mm × 70 mm, the heat generation amount is 500 W, and the heat generation density is 18 W / cm. 2 Reach
[0087]
Although the heat generation density of the heat generating portion 9 is smaller than the heat generation density of the heat generating portion 9 to be cooled in the first embodiment, the required heat radiation is much larger. The maximum heat absorption of the thermoelectric cooling module group as a whole is 500 × 2.5 = 1240 W with respect to the required heat radiation (= necessary heat absorption).
[0088]
Therefore, in the second embodiment, the thermoelectric cooling module 1 in which 3 × 5, a total of 15 Peltier modules 12 are arranged in parallel is applied in order to efficiently absorb the heat radiation and secure the maximum heat absorption. . One Peltier module 12 having a size of 40 mm square, a thickness of 2.2 mm and a maximum heat absorption of about 100 W (I = 16.5 A) was selected.
[0089]
In the second embodiment, although not particularly shown, the heat flux converter 8 is composed of twelve straight heat pipes each having a length of 200 mm and an outer diameter of 8 mmφ, which are arranged in parallel with almost no gap at equal intervals. Is made of an aluminum plate having a thickness of 0.8 mm, and a slight gap between the heat pipes and a gap between the aluminum plate heat pipes are filled with a thermally conductive resin.
[0090]
The capacity of the fan 20 provided on the heat sink 3 can ensure 3.0 m / s or more in front wind speed.
[0091]
The second embodiment is configured as described above, and the second embodiment can also provide the same effects as the first embodiment. In the second embodiment, although the size of the heat sink 3 is slightly increased, the temperature of the heat generating portion 9, that is, the surface temperature of the IGBT is reduced to 80 ° C. level by the heat absorbing action of the heat flux converter 8 and the thermoelectric cooling module 1. I was able to keep.
[0092]
Next, a third embodiment of the thermoelectric cooling device according to the present invention will be described. The third embodiment has the configuration shown in FIG. 5, and is configured almost similarly to the first embodiment. The feature of the third embodiment different from the first embodiment is that the heat sink 3 is a heat sink with an axial fan 20. In the third embodiment, the heat flux diffusion surface 15 and the heat flux diffusion back surface 16 of the heat flux converter 8 have the same area.
[0093]
Using the third embodiment, the present inventor compared the third embodiment with the conventional example and found the difference in heat resistance of the heat sink by the cooling method. The results are shown in Table 1.
[0094]
[Table 1]
[0095]
In Table 1, Conventional Example 1 has a cooling configuration using an aluminum heat sink 3 with a fan, which is most commonly used in the past, as shown in FIG. A 20 mm axial flow fan is mounted.
[0096]
The conventional example 2 has a cooling configuration in which the heat flux converter 8 is provided between the heat generating part 9 and the aluminum heat sink 3 as shown in FIG. An axial fan 20 is mounted. Further, in Conventional Example 2, the heat flux converter 8 is formed by a vapor chamber.
[0097]
In the third embodiment, the thermoelectric cooling module 1 of the thermoelectric cooling module 1 is provided between the heat flux converter 8 in the vapor chamber and the heat sink 3 made of aluminum in addition to the above-mentioned conventional example 2.
[0098]
In the third embodiment example and the conventional examples 1 and 2 shown in Table 1, the rotation speed of the fan is performed under the same condition. In each case, the size of the heat generating portion 9 is 10 mm × 10 mm, the heat sink 3 is made of aluminum, the height of the fins 13 is 25 mm, the size of the bottom portion (base) 14 is 100 × 50 mm, and the size of the heat flux converter 8 is also It has the same size as the bottom of the heat sink 3.
[0099]
As is clear from Table 1, in the conventional example 1, when the load of the heat generating part 9 is 40 watts, the thermal resistance of the heat sink 3 is 1.57 ° C./W, so that ΔT = 62.8 deg, and when the environmental temperature is 40 ° C. , The temperature of the heating section 9 exceeds 100 ° C. On the other hand, in the third embodiment, even when the load on the heat generating portion 9 is 40 watts, the thermal resistance of the heat sink 3 is 1.14 ° C./W, so ΔT = 45.6 deg, and the temperature of the heat generating portion 9 is 86 ° C. Was able to be suppressed.
[0100]
Next, a fourth embodiment of the thermoelectric cooling device according to the present invention will be described. The thermoelectric cooling device according to the fourth embodiment is an example in which the present invention is applied to a cooling device for a heat generating unit 9 that generates heat of 5 watts in a size of 5 mm square as a micro LSI, and the heat generation density of the heat generating unit 9 is 20 w / cm 2 It becomes. The basic configuration of the fourth embodiment is the same as that of the first embodiment.
[0101]
The heat flux converter 8 has a copper plate having a thickness of 3 mm and a side size of 15 mm, and a diamond layer is coated on one entire surface of the copper plate with a thickness of 30 μm, and the other surface is coated with a diamond layer. Has a thin gold plating. The surface of the heat flux converter 8 on the diamond layer forming side is in contact with the heat generating portion 9, and the surface of the heat flux converter 8 on the gold plating side is disposed so as to be in thermal contact with the thermoelectric cooling module 1.
[0102]
The size of the thermoelectric cooling module 1 is 15 mm on one side which is the same as the copper plate, and the thickness is 2.5 mm including the ceramic substrates on both sides. Aluminum nitride having good thermal conductivity of about 230 w / mK is used as the material of the ceramic substrate. The maximum heat absorption of the thermoelectric cooling module 1 was set to be three times the required heat absorption, that is, 15 w or more. Specifically, the thermoelectric element of the thermoelectric cooling module 1 has a logarithm of 35 and one P or N-type thermoelectric semiconductor cross-sectional area of 1.44 mm. 2 And
[0103]
At this time, the thermoelectric cooling module 1 can output the maximum heat absorption of 23 w near 11 amps, but the required heat absorption is 5 w, so the power input to the thermoelectric cooling module at this time is only 2 w. At this time, the temperature difference between both sides of the thermoelectric cooling module 1 can be set to about 17 ° C.
[0104]
A heat sink 3 is provided on the high-temperature side of the thermoelectric cooling module 1. The base 14 of the heat sink 3 has a size of 15 mm square and a thickness of 3 mm, and the base 14 is provided with a plurality of aluminum fins 13 at intervals. The specifications of the heat sink 3 are such that the pitch of the fins 13 is 1.7 mm, the thickness of the fins 13 is 0.6 mm, and the height of the fins 13 is 15 mm.
[0105]
In the fourth embodiment, when a wind of 0.5 to 0.8 m / s is generated by the system fan 20a at an ambient temperature of 40 ° C., the maximum temperature of the base portion 14 of the heat sink 3 is 57 ° C., and thermoelectric cooling is performed. The temperature of the substrate on the heat absorption side of the module 1 became 40 ° C., and the temperature of the heat generating portion 9 through the heat flux converter 8 could be made about 75 ° C.
[0106]
As described above, according to the fourth embodiment, it is possible to achieve effective cooling of the heat generating portion 9 of an electronic component having an extremely high heat generation density by increasing power consumption by only 2 watts. Was.
[0107]
The present invention is not limited to the above embodiments, but may be set as appropriate. For example, in each of the above embodiments, the heat conductive part 9, the heat flux converter 8, the thermoelectric cooling module 1, and the heat sink 3 are provided with the heat conductive grease 11 on the respective contact surfaces, but instead of the heat conductive grease 11. Alternatively, a heat conductive member other than the heat conductive grease 11 may be provided, or the contact surface may be brought into direct contact without the heat conductive member.
[0108]
Further, in the first and third embodiments, the heat flux converter 8 is a vapor chamber (flat heat pipe). In the second embodiment, the heat flux converter 8 is a raft-shaped heat pipe. In the fourth embodiment, a copper plate is used for the heat flux converter 8.
[0109]
However, the configuration of the heat flux converter 8 is not particularly limited and is appropriately set, and an appropriate heat flux converter 8 having a heat diffusion function in the surface direction of the heat flux diffusion surface 15 is applied. Can be. The heat flux converter 8 can be configured to include, for example, a heat conductive plate using diamond, high heat conductive carbon, graphite, and a composite member thereof, or a heat pipe.
[0110]
When a heat pipe other than the flat heat pipe is used for the heat flux converter 8, a plurality of heat pipes may be combined to form a plate in order to spread the heat from the small-sized electronic component heating element in a planar manner. You can also. In other words, as the heat flux converter 8, a device in which several pipe-shaped heat pipes are attached to a copper plate or an aluminum plate, or heat is easily transferred in the direction of the embedded surface can be applied.
[0111]
In any case, in order to obtain the maximum heat flux expansion effect, the heat flux converter 8 uses water as a working fluid, a heat conductive plate using a vapor chamber or a heat pipe and a composite member thereof, or a vibrating heat source. It can be formed of a planar material called a pipe.
[0112]
Further, the heat flux converter 8 can also be formed by a composite member in which a plane direction thermally conductive carbon filler is impregnated in an aluminum alloy. Some composite members of this type have a thermal conductivity in the plane direction of about 1000 w / mK due to the high thermal conductivity of the carbon filler.
[0113]
The heat flux converter 8 preferably has an equivalent thermal conductivity of 500 W / mK or more. Here, the equivalent thermal conductivity refers to the thermal conductivity when the thickness, length, and the like are regarded as the same as the thermal conductivity of a solid when the thermal conductivity is not solid heat such as a heat pipe.
[0114]
The number and arrangement of the Peltier modules 12 constituting the thermoelectric cooling module 1 and the number of thermoelectric conversion elements 5 provided in the thermoelectric cooling module 1 are not particularly limited, and are appropriately set. It suffices that at least the second substrate 7 of the module 1 has substantially the same area as the heat flux diffusion back surface 16 of the heat flux converter 8 and serves as the heat absorption side substrate.
[0115]
Further, the configuration of the heat sink 3 is not particularly limited and may be appropriately set. For example, the heat sink 3 may be a copper heat sink or a heat sink having the fins 13 in a curved shape. When the fan 20 is integrated, an axial fan can be easily combined. However, other types such as a sirocco fan may be used. Alternatively, the fan 20 may be used in combination with other system cooling of the electronic device instead of the integrated fan.
[0116]
【The invention's effect】
According to the present invention, a cooling method using a thermoelectric cooling module can obtain a maximum cooling effect while suppressing power consumption.
[0117]
Further, according to the present invention, the heat of the heat generating portion is diffused by the heat flux converter arranged in contact with and opposed to the heat generating portion, the heat density is reduced, and then the cooling is performed by the thermoelectric cooling module. By dissipating the heat by the heat sink, the heat generating portion having a high heat generation density can be cooled very efficiently.
[0118]
Furthermore, according to the present invention, it is not necessary to set a large temperature difference on both sides of the thermoelectric cooling module for long-term reliability, which is important as a function of the electronic component, so that the thermal strain applied to the thermoelectric module can be suppressed to be small. The life of the module can be extended.
[0119]
Further, in the present invention, the heat pipe has at least one heat transport member of a vapor chamber and a flat heat diffusion plate incorporating the heat pipe, and the heat transport member has a hydraulic fluid therein. According to the configuration in which the heat transfer is performed by utilizing the phase change of the working fluid, the heat of the heat generating portion can be efficiently diffused by the heat flux converter, and the above effect can be exhibited more efficiently.
[0120]
Further, in the present invention, a temperature detecting unit is provided at at least one of the heat generating unit and the heat flux converter, and the thermoelectric cooling module is turned on so that the detected temperature of the temperature detecting unit is lower than a preset temperature. According to the configuration in which the power control unit that controls the power continuously or intermittently is provided, the power supplied to the thermoelectric cooling module can be appropriately controlled by the control of the power control unit, and the above effects can be exhibited.
[Brief description of the drawings]
FIG. 1 is a main part configuration diagram showing a first embodiment of a thermoelectric cooling device according to the present invention.
FIG. 2 is a graph showing a relationship between electric power supplied to a thermoelectric cooling module and a ratio of a heat absorption amount to the supplied electric power.
FIG. 3 is a graph showing the relationship between the power input to the thermoelectric cooling module and the thermal resistance when the maximum heat generation amount of the heat generating section is 35 W in the first embodiment.
FIG. 4 is a main part configuration diagram showing a second embodiment of a thermoelectric cooling device according to the present invention.
FIG. 5 is a main part configuration diagram showing a third embodiment of a thermoelectric cooling device according to the present invention.
FIG. 6 is a diagram showing an example of a relationship between cooling performance and power consumption in the thermoelectric cooling device according to the present invention.
FIG. 7 is an explanatory diagram showing an example of a cooling configuration of a heat generating portion of an electronic component proposed conventionally.
FIG. 8 is an explanatory diagram showing another example of the cooling configuration of the heat generating portion of the electronic component.
FIG. 9 is an explanatory diagram showing another example of the cooling configuration of the heat generating portion of the electronic component.
FIG. 10 is an explanatory diagram showing still another example of the cooling configuration of the heat generating portion of the electronic component.
FIG. 11 is an explanatory diagram illustrating a configuration example of a thermoelectric cooling module.
FIG. 12 is a graph showing an example of the relationship between the current consumption (power consumption) of the thermoelectric cooling module and the low-temperature side heat absorption.
FIG. 13 is a graph showing a relationship example between the current of the thermoelectric cooling module and the coefficient of performance.
FIG. 14 is a graph showing another example of the relationship between the power consumption of the thermoelectric cooling module and the amount of heat absorption on the low-temperature side.
[Explanation of symbols]
1 Thermoelectric cooling module
2 electrodes
3 heat sink
5,5a, 5b thermoelectric conversion element
6 First substrate
7 Second substrate
8 Heat flux converter
9 Heating part
11 Thermal conductive grease
15 Heat flux diffusion surface
16 Heat flux diffusion back

Claims (3)

  1. A heat flux converter having a heat flux diffusion surface disposed in direct contact with the heat generating portion or through a heat conductive member, and having a heat transfer area larger than that of the heat generating portion. And a thermoelectric cooling module is disposed in contact with and opposed to the heat flux diffusion back surface of the heat flux converter directly or via a heat conductive member. Has a first substrate and a second substrate opposed to each other with an interval therebetween, the second substrate being substantially in contact with the heat flux diffusion back surface of the heat flux converter, A plurality of thermoelectric conversion elements are erected between the first substrate and the second substrate of the cooling module, and the second substrate is formed with the heat-absorbing substrate by passing a current through these thermoelectric conversion elements. Then, the first substrate forms a substrate on the heat radiation side, and the first substrate A heat sink is disposed on the plate side in direct contact with the first substrate or via a heat conductive member, and the maximum heat absorption of the thermoelectric cooling module is at least 2.5 times the required heat absorption, and the heat flux conversion is performed. A thermoelectric cooling device characterized in that the heat transfer area on the thermoelectric cooling module side of the vessel is about 80% to about 120% of the heat transfer area on the heat flux converter side of the thermoelectric cooling module.
  2. The heat flux converter has a heat pipe, a flat heat diffusion plate incorporating the heat pipe, and at least one heat transport member of a vapor chamber, wherein the heat transport member has a working fluid therein and has The thermoelectric cooling device according to claim 1, wherein heat transport is performed using a phase change of the working fluid.
  3. A temperature detecting unit is provided at at least one of the heat generating unit and the heat flux converter, and the input power of the thermoelectric cooling module is continuously or intermittently controlled so that the detected temperature of the temperature detecting unit is lower than a preset temperature. The thermoelectric cooling device according to claim 1, further comprising a power control unit that performs dynamic control.
JP2002231750A 2002-08-08 2002-08-08 Thermoelectric cooling apparatus Pending JP2004071969A (en)

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006242455A (en) * 2005-03-02 2006-09-14 Ishikawajima Harima Heavy Ind Co Ltd Cooling method and device
JP2007043075A (en) * 2005-07-04 2007-02-15 Denso Corp Thermoelectric conversion device
JP2008218513A (en) * 2007-02-28 2008-09-18 Fujikura Ltd Cooling device
CN100520238C (en) 2004-03-22 2009-07-29 盛光润 Electronic ice bag
JP2010283327A (en) * 2009-06-02 2010-12-16 Hon Hai Precision Industry Co Ltd Thermal interface material, electronic device, and manufacturing method for the electronic device
EP2312661A1 (en) * 2009-10-16 2011-04-20 Alcatel Lucent Thermoelectric assembly
US7931969B2 (en) 2006-01-13 2011-04-26 Northern Illinois University Molecular fan
KR101082580B1 (en) 2010-01-07 2011-11-10 충북대학교 산학협력단 Thermoelectric cooler for printed circuit board with flip chip bonding
CN102510990A (en) * 2009-07-17 2012-06-20 史泰克公司 Heat pipes and thermoelectric cooling devices
JP2015094552A (en) * 2013-11-13 2015-05-18 株式会社デンソー Cooler
CN105231835A (en) * 2015-10-09 2016-01-13 苏州融睿纳米复材科技有限公司 Electronic cooling and heating device
US9435571B2 (en) 2008-03-05 2016-09-06 Sheetak Inc. Method and apparatus for switched thermoelectric cooling of fluids

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100520238C (en) 2004-03-22 2009-07-29 盛光润 Electronic ice bag
JP4639850B2 (en) * 2005-03-02 2011-02-23 株式会社Ihi Cooling method and apparatus
JP2006242455A (en) * 2005-03-02 2006-09-14 Ishikawajima Harima Heavy Ind Co Ltd Cooling method and device
JP2007043075A (en) * 2005-07-04 2007-02-15 Denso Corp Thermoelectric conversion device
US8545933B2 (en) 2006-01-13 2013-10-01 Northern Illinois University Molecular fan
US7931969B2 (en) 2006-01-13 2011-04-26 Northern Illinois University Molecular fan
JP2008218513A (en) * 2007-02-28 2008-09-18 Fujikura Ltd Cooling device
US9435571B2 (en) 2008-03-05 2016-09-06 Sheetak Inc. Method and apparatus for switched thermoelectric cooling of fluids
JP2010283327A (en) * 2009-06-02 2010-12-16 Hon Hai Precision Industry Co Ltd Thermal interface material, electronic device, and manufacturing method for the electronic device
CN102510990A (en) * 2009-07-17 2012-06-20 史泰克公司 Heat pipes and thermoelectric cooling devices
US8904808B2 (en) 2009-07-17 2014-12-09 Sheetak, Inc. Heat pipes and thermoelectric cooling devices
EP2312661A1 (en) * 2009-10-16 2011-04-20 Alcatel Lucent Thermoelectric assembly
KR101082580B1 (en) 2010-01-07 2011-11-10 충북대학교 산학협력단 Thermoelectric cooler for printed circuit board with flip chip bonding
JP2015094552A (en) * 2013-11-13 2015-05-18 株式会社デンソー Cooler
CN105231835A (en) * 2015-10-09 2016-01-13 苏州融睿纳米复材科技有限公司 Electronic cooling and heating device

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