CN205124226U - Radiating module - Google Patents
Radiating module Download PDFInfo
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- CN205124226U CN205124226U CN201520868354.8U CN201520868354U CN205124226U CN 205124226 U CN205124226 U CN 205124226U CN 201520868354 U CN201520868354 U CN 201520868354U CN 205124226 U CN205124226 U CN 205124226U
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- metallic plate
- heat
- mainboard
- heat pipe
- heat radiation
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Abstract
The utility model relates to a mainboard design field discloses a radiating module. The utility model discloses in, radiating module contains: first heat pipe, first metal sheet and second metal sheet. First metal sheet is connected in the hot junction of first heat pipe, and the second metal sheet is connected to the cold junction of first heat pipe, first metal sheet pastes on the chip that generates heat of mainboard, the second metal sheet is located one side that the mainboard was kept away from to the mainboard. Through this kind of mode, the heat that the chip sent that will generate heat transmits two surfaces of mainboard through first heat pipe, can also can utilize the backshell heat dissipation the board under, greatly increased heat radiating area, improvement radiating effect in order to utilize the support heat dissipation on the board from this.
Description
Technical field
The utility model relates to motherboard design field, and particularly dispel the heat module.
Background technology
Current electronics produces and is tending towards lightening, and the passive heat sink conception of traditional fan-free roughly has two kinds: one to be design under CPU board, even heat is distributed in drain pan surface; Another kind is exactly that plate designs, and distributes heat in surrounding environment by keyboard holder.The maximum technical bottleneck that above two schemes runs into is exactly when chip power-consumption is excessive, cannot meet the requirement of shell temperature, and such as current passive heat sink conception can solve the power consumption of about 3.5W, and the radiating effect for more than 7W power consumption is very undesirable.Now adopting the active heat removal scheme of fan by having to, not only increasing cost, increase hardware volume, and battery standby time is shortened, system noise is excessive.
Summary of the invention
The purpose of this utility model is to provide a kind of heat radiation module, makes to increase area of dissipation, improves radiating effect.
For solving the problems of the technologies described above, execution mode of the present utility model provides a kind of heat radiation module, for the heat radiation of mainboard, comprises: the first heat pipe, the first metallic plate and the second metallic plate.The hot junction of the first heat pipe connects the first metallic plate, and the cold junction of the first heat pipe connects the second metallic plate; First metallic plate is affixed on the euthermic chip of mainboard; Second metallic plate is positioned at the side of mainboard away from mainboard.
The utility model execution mode in terms of existing technologies, the main distinction and effect thereof are: the heat pipe in the utility model execution mode connects the metallic plate being positioned at mainboard both sides, the heat that euthermic chip is sent, be delivered to mainboard two surfaces, namely the support on plate can be utilized thus to dispel the heat, also the back cover under plate can be utilized to dispel the heat, greatly increase area of dissipation, improve radiating effect.
As further improvement, the marginal existence breach of mainboard, the first heat pipe can detour through breach.The scheme that heat pipe detours from mainboard side notch, not only cost is low, and makes the installation of heat radiation module and mainboard more convenient, is beneficial to extensive popularization.
As further improvement, the hot junction of the first heat pipe can the position of corresponding euthermic chip.The heat that hot junction can make euthermic chip send near euthermic chip is passed away quickly.
As further improvement, the quantity of the first heat pipe can be greater than 1.Increase the heat propagation speed of heat pipe, the efficiency of heat trnasfer can be improved.
As further improvement, heat radiation module can comprise further: be welded in the second heat pipe on the first metallic plate.Add a short heat pipe, the heat sent by euthermic chip passes quickly.
As further improvement, the first metallic plate can be pasted by heat conductive silica gel and euthermic chip.Utilize heat conductive silica gel, euthermic chip is fully contacted with metallic plate, can better heat be delivered on metallic plate.
As further improvement, the area of the first metallic plate can be greater than the half of board area; And/or the area of the second metallic plate can be greater than the half of board area.The area of further restriction metallic plate, metallic plate area is larger, and larger for the area sharing heat equally, radiating effect is better.
As further improvement, between the second metallic plate and mainboard, space can be there is.Utilize the space trap heat transmission between metallic plate and mainboard, the heat that barrier metal plate of trying one's best diffuses out.
As further improvement, the first heat pipe length be connected on the first metallic plate or the second metallic plate can be the maximum length of corresponding metallic plate.The further length limiting connection, connecting length is longer, and effective contact area is larger, and heat-conducting effect is better.
As further improvement, the first heat pipe can for welding with the connected mode of the first metallic plate or the second metallic plate.Welding manner is utilized not only to ensure that being fully connected between heat pipe with metallic plate, and good heat conduction effect.
Accompanying drawing explanation
Fig. 1 a is the vertical view according to the heat radiation module upper surface in the utility model first execution mode;
Fig. 1 b is the end view according to the heat radiation module in the utility model first execution mode;
Fig. 1 c is the vertical view according to the heat radiation module lower surface in the utility model first execution mode;
Fig. 2 a is the structural representation according to the heat radiation module in the utility model second execution mode;
Fig. 2 b is the vertical view according to the heat radiation module upper surface in the utility model second execution mode;
Fig. 2 c is the end view according to the heat radiation module upper surface in the utility model second execution mode;
Fig. 2 d is the vertical view according to the heat radiation module lower surface in the utility model second execution mode;
Fig. 3 is the vertical view according to the heat radiation module upper surface in the utility model the 3rd execution mode.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, each execution mode of the present utility model is explained in detail.But, persons of ordinary skill in the art may appreciate that in each execution mode of the utility model, proposing many ins and outs to make reader understand the application better.But, even without these ins and outs with based on the many variations of following execution mode and amendment, each claim of the application technical scheme required for protection also can be realized.
First execution mode of the present utility model relates to a kind of heat radiation module, as shown in Fig. 1 a-Fig. 1 c, comprises: the first heat pipe 1, mainboard 2, first metallic plate 3, second metallic plate 4 and euthermic chip (not shown).In present embodiment, one side mainboard 2 posting euthermic chip is defined as the upper surface of mainboard, the one side not posting euthermic chip is defined as the lower surface of mainboard.
Wherein, the first metallic plate 3 is positioned at the upper surface of mainboard 2, and the second metallic plate 4 is positioned at the lower surface of mainboard 2, and the cold junction 12 that the hot junction 11 of the first heat pipe 1 is connected to the first metallic plate 3, first heat pipe 1 connects described second metallic plate 4.First metallic plate 3 is affixed on the euthermic chip of mainboard 2, specifically, can be pasted during stickup by heat conductive silica gel, to make euthermic chip fully contact with the first metallic plate 3, thus can is better delivered to by heat on the first metallic plate 3.
In addition, the first metallic plate 3 and the second metallic plate 4 can be fixed by screws on mainboard 2, and present embodiment is only illustrated with this and is limited, and the combination of other existing metallic plates and mainboard 2 is all within the protection range of present embodiment.
It is worth mentioning that can there is space between the second metallic plate 4 and mainboard 2, utilize this space to carry out heat obstruct, be passed to mainboard 2 with the heat that obstruct second metallic plate 4 diffuses out as far as possible.
Specifically, the first metallic plate 3 and the second metallic plate 4 are in the both sides of mainboard 1, and the first heat pipe 1 in present embodiment detours through the side of mainboard, and is connected between two pieces of metallic plates.The marginal existence breach of the mainboard 2 in present embodiment, the first heat pipe 1 detours through the side of breach from mainboard, and scheme cost that side detours is lower to utilize breach to carry out, and the installation of make to dispel the heat module and mainboard is more convenient, is beneficial to extensive popularization.
It should be noted that, the first heat pipe 1 in present embodiment and the link position of two pieces of metallic plates can be positioned at the side away from mainboard 2, that is, the hot junction 11 of the first heat pipe 1 can be connected to the upper surface of the first metallic plate 3, the cold junction 12 of the first heat pipe 1 is connected to the lower surface of the second metallic plate 4.
It is worth mentioning that; first heat pipe 1 can be connected with the first metallic plate 3 or the second metallic plate 4 by the mode of welding; to ensure being fully connected between heat pipe with metallic plate; heat-conducting effect is better; only illustrate with this and be limited, the link position of any first heat pipe 1 and the first metallic plate 3 or the second metallic plate 4 and connected mode are all within the protection range of present embodiment.
It is worth mentioning that, as shown in Fig. 1 a-Fig. 1 c, first heat pipe 1 length be connected on the first metallic plate 3 or the second metallic plate 4 can be the maximum length of corresponding metallic plate, fully be connected with each metallic plate to make the first heat pipe 1, increase effective contact area of the first heat pipe 1 and the first metallic plate 3 or the second metallic plate 4, thus good heat-conducting effect can be obtained.In addition, in the specific implementation, the first heat pipe 1 also can be made to bend with the coupling part of metallic plate, to increase effective contact area of heat pipe and metallic plate.
In present embodiment, for obtaining good radiating effect, following several mode can also be taked:
1, because euthermic chip is main pyrotoxin, the mode conducted rapidly by the heat sent by euthermic chip, can obtain good radiating effect.Therefore by the position of corresponding for the hot junction of the first heat pipe 1 euthermic chip, the heat sent to make euthermic chip can be passed to the first heat pipe 1 faster, to be passed by heat.
2, make the quantity of the first heat pipe 1 be greater than 1, namely by the mode of increase by first heat pipe 1 quantity, the propagation velocity of heat pipe can be increased, to improve the efficiency of heat trnasfer, obtain good radiating effect.
3, make the area of the first metallic plate 3 be greater than the area of euthermic chip, the heat that euthermic chip is sent can be shared equally on the first metallic plate 3, and heat is passed to the first heat pipe 1 by the first metallic plate 3, thus reaches good radiating effect.It is worth mentioning that, the area of the first metallic plate 3 can also be made to be the half being greater than board area, and/or the area of the second metallic plate 4 is also for being greater than the half of board area.Like this, metallic plate area is larger, and larger for the area sharing heat equally, radiating effect is better.
Present embodiment applicability is extremely strong; can be applicable in the electronic equipments such as Notebook, Ultrabook, chromebook, detachable, pad, phone, 2in1, AIO; no matter euthermic chip designs under plate or plate designs all to apply according to actual design demand; all can play good radiating effect; equipment shell temperature is improved, meets the temperature protection etc. of internal component.In the present embodiment, the heat that euthermic chip sends first is absorbed by the first metallic plate 3 and shifts, utilize the efficient heat transfer property of heat pipe, further heat is transferred to the opposite side of mainboard along heat pipe trend, by the second metallic plate 4 of heat pipe cold junction by uniform heat distribution.
Illustrate: when being applied to Notebook, euthermic chip occupies very large power consumption, can be keyboard metallic support or platen bracket directly over the first metallic plate 3, is conducive to heat and is dispersed in the surrounding environment outside mainboard by keyboard; Can be drain pan immediately below second metallic plate 4, drain pan inner surface has the samming sheets such as one deck Copper Foil or graphite flake, and heat can be evenly distributed in drain pan surface further, and then is dispersed in time in surrounding environment by heat, obtains good radiating effect.Like this, by the heat transfer property of hot tube high-efficiency, timely and effectively by both sides under the transfer of heat of euthermic chip to plate upper plate, make full use of drain pan at one time and keyboard holder dispels the heat, effectively solve the problem of mainboard heat radiation, be the twice of traditional heat-dissipating scheme ability, thus achieve when euthermic chip power consumption is greater than 10W, still can adopt the effect of the passive heat dissipation design of fan-free.
In actual application, the shape of the first metallic plate 3 and the second metallic plate 4, can design according to the structure of application scenarios, the area coverage of metallic plate can be made to extend to outside mainboard, to increase the area sharing heat equally, obtain good radiating effect.
Second execution mode of the present utility model relates to a kind of heat radiation module.Second execution mode is roughly the same with the first execution mode, and main distinction part is: in the first embodiment, and the first heat pipe detours through the breach of mainboard side and connects.And in the utility model second execution mode, the first heat pipe passes through mainboard through hole, to connect each metallic plate.
Specifically, in present embodiment, there is through hole 5 in mainboard 2, and through hole 5 can arrange on mainboard and be located between the first metallic plate 3 and the second metallic plate 4, and the first heat pipe 1 via through holes 5 connects the first metallic plate 3 and the second metallic plate 4, as shown in Fig. 2 a to Fig. 2 d.For the first execution mode, effectively shorten the use length of the first heat pipe 1, make the first heat pipe 1 more convenient with the connection of each metallic plate, structure is more firm.
3rd execution mode of the present utility model relates to a kind of heat radiation module, 3rd execution mode is improved on the basis of the first execution mode or the second execution mode, main improvements are: in the present embodiment, heat radiation module also comprises the second heat pipe connected with on the first metallic plate, to obtain better radiating effect.
Specifically, as shown in Figure 3, the first metallic plate 3 also can be provided with the second heat pipe 6, the second heat pipe 6 increased can be shorter, and the second heat pipe 6 can be fitted completely by the mode of welding and the first metallic plate 3.Like this, by increasing the mode of a short heat pipe, the heat sent by euthermic chip passes faster.
4th execution mode of the present utility model relates to a kind of heat radiation module.4th execution mode is roughly the same with the first execution mode, main distinction part is: in the first embodiment, the link position of the first heat pipe 1 and two pieces of metallic plates is positioned at the side away from mainboard 2, and the link position in present embodiment is positioned at the side near mainboard 2.
Specifically, the hot junction of the first heat pipe connects the lower surface with the first metallic plate, and the cold junction of the first heat pipe is connected to the upper surface of the second metallic plate.Add further flexibility of the present utility model, be applicable to the different demands of different scene, expanded range of application of the present utility model further.
Persons of ordinary skill in the art may appreciate that the respective embodiments described above realize specific embodiment of the utility model, and in actual applications, various change can be done to it in the form and details, and do not depart from spirit and scope of the present utility model.
Claims (15)
1. dispel the heat a module, for the heat radiation of a mainboard, it is characterized in that, comprise: the first heat pipe, the first metallic plate and the second metallic plate;
The hot junction of described first heat pipe connects described first metallic plate, and the cold junction of described first heat pipe connects described second metallic plate; Described first metallic plate is affixed on the euthermic chip of described mainboard; Described second metallic plate is positioned at the side of described mainboard away from described euthermic chip.
2. heat radiation module according to claim 1, is characterized in that, described first heat pipe detours through the side of described mainboard.
3. heat radiation module according to claim 2, is characterized in that, the marginal existence breach of described mainboard, and described first heat pipe detours through described breach.
4. heat radiation module according to claim 1, is characterized in that, described mainboard exists through hole, and described first heat pipe connects described first metallic plate and the second metallic plate through described through hole.
5. heat radiation module according to claim 1, is characterized in that, the position of the corresponding described euthermic chip in hot junction of described first heat pipe.
6. heat radiation module according to claim 1, is characterized in that, the quantity of described first heat pipe is greater than 1.
7. heat radiation module according to claim 1, is characterized in that, described heat radiation module comprises further: be welded in the second heat pipe on described first metallic plate.
8. heat radiation module according to claim 1, is characterized in that, described first metallic plate is pasted by heat conductive silica gel and described euthermic chip.
9. heat radiation module according to claim 1, is characterized in that, the area of described first metallic plate is greater than the area of described euthermic chip.
10. heat radiation module according to claim 1, is characterized in that, the area of described first metallic plate is greater than the half of described board area; And/or,
The area of described second metallic plate is greater than the half of described board area.
11. heat radiation modules according to claim 1, is characterized in that, described first metallic plate and the second metallic plate are fixed on described mainboard by screw.
12. heat radiation modules according to claim 1, is characterized in that, there is space between described second metallic plate and described mainboard.
13. heat radiation modules according to claim 1, is characterized in that, the described first heat pipe length be connected on described first metallic plate or described second metallic plate is the maximum length of corresponding metallic plate.
14. heat radiation modules according to claim 1, is characterized in that, the link position of described first heat pipe and described first metallic plate or described second metallic plate is positioned at the side near described mainboard, or away from the side of described mainboard.
15. heat radiation modules according to claim 1, is characterized in that, the connected mode of described first heat pipe and described first metallic plate or described second metallic plate is for welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520868354.8U CN205124226U (en) | 2015-10-30 | 2015-10-30 | Radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520868354.8U CN205124226U (en) | 2015-10-30 | 2015-10-30 | Radiating module |
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| Publication Number | Publication Date |
|---|---|
| CN205124226U true CN205124226U (en) | 2016-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520868354.8U Active CN205124226U (en) | 2015-10-30 | 2015-10-30 | Radiating module |
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| CN (1) | CN205124226U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228422A (en) * | 2015-10-30 | 2016-01-06 | 广东虹勤通讯技术有限公司 | Heat radiation module |
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2015
- 2015-10-30 CN CN201520868354.8U patent/CN205124226U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228422A (en) * | 2015-10-30 | 2016-01-06 | 广东虹勤通讯技术有限公司 | Heat radiation module |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |