CN101115368A - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN101115368A CN101115368A CNA2006100618688A CN200610061868A CN101115368A CN 101115368 A CN101115368 A CN 101115368A CN A2006100618688 A CNA2006100618688 A CN A2006100618688A CN 200610061868 A CN200610061868 A CN 200610061868A CN 101115368 A CN101115368 A CN 101115368A
- Authority
- CN
- China
- Prior art keywords
- heat
- base plate
- fin
- evaporation part
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001704 evaporation Methods 0.000 claims abstract description 21
- 230000008020 evaporation Effects 0.000 claims abstract description 21
- 230000005494 condensation Effects 0.000 claims abstract description 15
- 238000009833 condensation Methods 0.000 claims abstract description 15
- 238000005452 bending Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract 5
- 238000010438 heat treatment Methods 0.000 abstract 4
- 239000006185 dispersion Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A cooling device used for cooling electronic components comprises a bottom board, a plurality of cooling fin pieces which are arranged on the bottom board, and a heating tube connected the bottom board and the fin piece, the heating tube comprises an evaporation part bended and combined to the bottom board, two condensation parts combined with the fin piece, and two connecting parts connected with the corresponding two condensation parts and the evaporation part. The evaporation part of the heating tube evenly distributes the heat generated by the heating electronic components on the bottom board; the connecting part and the evaporation part rapidly transfer the heat of the bottom board to the fin pieces and cool down, so the cooling performance of the cooling device is upgraded.
Description
Technical field
The present invention relates to a kind of heat abstractor, relate in particular to a kind of heat abstractor that is used for electronic element radiating.
Background technology
Electronic component such as central processing unit etc. produce a large amount of heat in running, for guaranteeing the normal operation of electronic component, the heat of its generation need distribute in time.Usually, install a heat abstractor additional on this electronic component.
Heat abstractor commonly used comprises a metal base plate and the some radiating fins that extend from this base plate.This base plate adheres on heat-generating electronic elements and absorbs the heat of its generation, and then heat transferred is dispersed into surrounding space to fin.Yet along with the development of electronic industry, the running frequency and the function of electronic component promote day by day, and its caloric value also increases thereupon.Above-mentioned radiator need add a heat pipe to promote its heat dispersion.Heat-pipe radiating apparatus commonly used comprises a base plate, is located at some fins of this plate upper surface and the some heat pipes that conduct heat to fin from this base plate.The upper surface of this base plate is provided with some parallel grooves, and each heat pipe comprises the linear condensation part that is bonded to linear evaporation part in the respective groove, passes these some fins.During use, this base plate contacts electronic component and absorbs the heat that this electronic component produces, and the heat on this base plate is passed to fin by heat pipe, and then is distributed to surrounding space by fin.Along with the increase that electronic component produces heat, the heat-sinking capability of this heat abstractor also need promote to satisfy radiating requirements.Usually the heat-sinking capability of this heat abstractor promotes by the quantity that increases heat pipe, but owing to the shape of heat pipe and in reasons such as arranging of heat abstractor, the effect of its performance is unsatisfactory.So this heat abstractor needs further to improve.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor of perfect heat-dissipating in fact.
A kind of heat abstractor is used for electronic element radiating, the heat pipe that it comprises a base plate, places the some radiating fins on this base plate and connect this base plate and this fin, this heat pipe comprise bending be bonded to the evaporation part of this base plate, with two condensation parts of this fin combination and be connected two connecting portions of corresponding two condensation parts and evaporation part.
Compared with prior art, above-mentioned heat pipe evaporation part bends the heat that is bonded to above-mentioned base plate and heat-generating electronic elements is produced and is distributed to comparatively uniformly on this base plate, and promptly this base plate heat transferred to fin is distributed by above-mentioned connecting portion and evaporation part, the heat dispersion of this heat abstractor is promoted.
The invention will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the part assembly drawing of heat abstractor of the present invention.
Fig. 3 is the assembly drawing of heat abstractor of the present invention.
Embodiment
See also Fig. 1, heat abstractor of the present invention comprises a base plate 10, places the heat pipe 50 of some fins 30, this base plate 10 of connection and the fin 30 of this base plate 10.
Above-mentioned base plate 10 is a roughly rectangular heat conductivility good metal plate body, as copper coin, aluminium sheet etc.The upper surface of this base plate 10 is provided with a groove 110 that roughly is " U " shape, with in conjunction with heat pipe 50.This groove 110 comprises the two parallel first groove sections 111 and the second groove section 113 that is connected this 2 first groove section 111.This second groove section 113 is an arc.Be formed with a square projection 130 that exceeds these base plate 10 upper surfaces between this 2 first groove section 111.
The metal lamellar body of above-mentioned each fin 30 for roughly being square, it comprises a body (not indicating), this body is provided with two perforates that separate (not indicating) that roughly are positioned at same horizontal level near its upper position place, and the perforate of these some fins 30 forms the passage 310 in conjunction with heat pipe 50.The bottom of these some fins 30 is provided with in conjunction with the projection 130 of above-mentioned base plate 10 and the groove 330 of heat pipe 50.
Above-mentioned heat pipe 50 comprises that one roughly is the evaporation part (not indicating) of " U " shape, the shape of this evaporation part is identical with the groove 110 of above-mentioned base plate 10, it comprises two parallel first heat transfer segment 511 and arc second heat transfer segment 513 that is connected these 2 first heat transfer segment 511, and wherein these first and second heat transfer segment 511,513 place plane parallel are in above-mentioned base plate 10.This heat pipe 50 also comprises two condensation parts 530 that are parallel to this 2 first heat transfer segment 511 and connects two connecting portions 550 of corresponding first heat transfer segment 511 and condensation part 530, wherein these two condensation parts, 530 place plane parallel are in above-mentioned first and second plane, heat transfer segment 511,513 place, and are positioned at this first heat transfer segment, 511 tops.Each connecting portion 550 is curved.
Please consult Fig. 2 and Fig. 3 simultaneously, the evaporation part of above-mentioned heat pipe 50 is bonded in the groove 110 of above-mentioned base plate 10, wherein, 2 first heat transfer segment 511 are bonded to the relative both sides that are positioned at base plate 10 projections 130 in the 2 first groove sections 111 respectively, and second heat transfer segment 513 is bonded in the second groove section 113.Above-mentioned fin 30 places the upper surface of this base plate 10, and the projection 130 of base plate 10 and the evaporation part of heat pipe 50 are contained in the groove of this fin 30.The bottom of this fin 30 contacts with this base plate 10, heat pipe 50 and projection 130 heat conduction.Two condensation parts 530 of heat pipe 50 penetrate respectively in two passages 310 of fin 30.Two connecting portions 550 of heat pipe 50 are positioned at a side of this fin 30.
During use, above-mentioned base plate 10 conforms to heat-generating electronic elements and absorbs the heat that this electronic component produces, part heat on this base plate 10 directly is passed to the bottom of above-mentioned fin 30, the part heat is absorbed by the evaporation part of above-mentioned heat pipe 50, and be passed to the top of fin 30, and then be distributed to surrounding space by fin 30 by connecting portion 550 and condensation part 530.
Compared with prior art, the evaporation part of above-mentioned heat pipe 50 bends the heat that is bonded to above-mentioned base plate 10 and heat-generating electronic elements is produced and is distributed to comparatively uniformly on this base plate 10, and then be passed to fin 30 and distribute by two connecting portions 550 and two condensation parts 530, make heat more rapid to the transmission of fin 30, thereby the heat dispersion of this heat abstractor is promoted by base plate 10.And in this heat abstractor, the usage quantity of heat pipe is less, and the cost of this heat abstractor is lower.
Claims (10)
1. heat abstractor, comprise a base plate, place the some radiating fins on this base plate and connect a heat pipe of this base plate and this fin, it is characterized in that: described heat pipe comprise bending be bonded to the evaporation part of this base plate, with two condensation parts of described fin combination and be connected two connecting portions of corresponding two condensation parts and evaporation part.
2. heat abstractor as claimed in claim 1 is characterized in that: described evaporation part comprises two parallel first heat transfer segment and connects second heat transfer segment of this 2 first heat transfer segment.
3. heat abstractor as claimed in claim 2 is characterized in that: described evaporation part is " U " shape.
4. heat abstractor as claimed in claim 2 is characterized in that: described two condensation parts are parallel to described base plate.
5. heat abstractor as claimed in claim 2 is characterized in that: described two connecting portions connect corresponding 2 first heat transfer segment and two condensation parts.
6. heat abstractor as claimed in claim 2 is characterized in that: described connecting portion is curved.
7. heat abstractor as claimed in claim 2 is characterized in that: described base plate is formed with a projection between described 2 first heat transfer segment.
8. heat abstractor as claimed in claim 7 is characterized in that: described fin is provided with a groove in conjunction with described projection and described evaporation part.
9. as each described heat abstractor among the claim 1-8, it is characterized in that: described two connecting portions are in a side of described fin.
10. as each described heat abstractor among the claim 1-8, it is characterized in that: described base plate is provided with the groove in conjunction with described evaporation part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100618688A CN101115368A (en) | 2006-07-28 | 2006-07-28 | Heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006100618688A CN101115368A (en) | 2006-07-28 | 2006-07-28 | Heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101115368A true CN101115368A (en) | 2008-01-30 |
Family
ID=39023382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100618688A Pending CN101115368A (en) | 2006-07-28 | 2006-07-28 | Heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101115368A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7548426B2 (en) * | 2007-06-22 | 2009-06-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7870890B2 (en) * | 2007-12-10 | 2011-01-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
| CN104735947A (en) * | 2013-12-18 | 2015-06-24 | 华硕电脑股份有限公司 | Heat sink fins and heat sink |
| CN108770291A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic device |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic device |
-
2006
- 2006-07-28 CN CNA2006100618688A patent/CN101115368A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7548426B2 (en) * | 2007-06-22 | 2009-06-16 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
| US7870890B2 (en) * | 2007-12-10 | 2011-01-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipe |
| CN104735947A (en) * | 2013-12-18 | 2015-06-24 | 华硕电脑股份有限公司 | Heat sink fins and heat sink |
| CN104735947B (en) * | 2013-12-18 | 2017-08-08 | 华硕电脑股份有限公司 | Heat sink fins and heat sink |
| CN108770291A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic device |
| CN108770294A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |