CN101316495B

CN101316495B - Heat sink assembly

Info

Publication number: CN101316495B
Application number: CN2007100748031A
Authority: CN
Inventors: 周世文; 陈俊吉; 陈菓
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-06-01
Filing date: 2007-06-01
Publication date: 2011-12-21
Anticipated expiration: 2027-06-01
Also published as: CN101316495A

Abstract

The invention relates to a heat-dissipation module used for dissipating the heat of an electronic component, which comprises a first radiator connected with the electronic component, a second radiator arranged on the first radiator and at least one heat pipe used for connecting the first radiator and the second radiator; the at least one heat pipe comprises a first condensation section and a second condensation section which respectively back-bend and protrude out from the same side of the two ends of an evaporation section of the first radiator and are combined with the evaporation section of the first radiator, and the first condensation section and the second condensation section are at the same side of the evaporation section with the opposite direction, wherein, the first condensation section and the second radiator are combined, and the second condensation section is arranged and clamped between the first radiator and the second radiator. Compared with the prior art, the first and the second condensation sections of the heat-dissipation module of the invention are connected with one evaporation section simultaneously, and the heat can be transferred in two directions to the first and the second radiators, therefore, the heat-dissipation efficiency of the heat-dissipation module is enhanced.

Description

The heat radiation module

Technical field

The present invention relates to a kind of heat radiation module, be meant a kind of heat radiation module especially cooling electronic component.

Background technology

When moving, can produce a large amount of heats such as computer cpu, north bridge chips, the contour electronic components of high power of video card, if these heats can not be left effectively, to directly cause temperature sharply to rise, and badly influence the normal operation of electronic devices and components.For this reason, needing to add a heat radiation module comes these electronic devices and components are dispelled the heat.

Traditional heat radiation module comprises that a pedestal, some thermal conductances are incorporated into the radiating fin of pedestal and some " ㄈ " heat pipe that connects radiating fin and pedestal, and the evaporation section of these heat pipes combines with pedestal, and condensation segment then is arranged in the fin.During this type of heat radiation module work, a part of heat directly transfers to fin from pedestal, and another part heat transfers to radiating fin via heat pipe.Because heat pipe is " ㄈ " shape, each heat pipe has only a condensation segment to be arranged in the fin, and the heat that transmits from its evaporation section is conducted to the part that fin is contacted with condensation segment by the concentrated area, and then is disseminated to whole fin step by step.In this process, heat is to be radiated to the other parts of fin from the part of fin, thereby it is inhomogeneous to cause the fin each several part to be heated, make fin can not be effectively and surrounding air carry out heat exchange, thus, the radiating efficiency of such heat radiation module is limited.

For overcoming above-mentioned shortcoming, industry is designed a kind of as the TaiWan, China patent M269704 number heat radiation module that disclosed of an embodiment wherein, the heat pipe of this heat radiation module is serpentine, and it comprises that an evaporation section, that connects the fin bottom and be bonded to base plate is arranged in the condensation segment at fin middle part, and another condensation segment that is incorporated into the fin top.This heat radiation module heat pipe is distributed in the fin surface equably, and a part of heat is directly conducted to the fin bottom by base plate; Transfer to the fin middle part via a condensation segment earlier by another part heat that evaporation section transmitted, remaining then heat transfers to the fin top via another condensation segment again.Because Heat Transfer of Heat Pipe on Heat Pipe speed is very fast, heat can almost arrive top, middle part, and the bottom of fin simultaneously, the fin each several part is heated evenly, and then effectively heat is disseminated to surrounding air.Therefore, this heat radiation module increases than traditional heat radiation module efficient.

But because the heat pipe of above-mentioned heat radiation module is serpentine, what its evaporation section can only be unidirectional transfers to fin with heat by two condensation segments, and the heat that base plate accumulated can not distribute rapidly, and then the radiating efficiency of this heat radiation module is restricted.

Summary of the invention

In view of this, be necessary to provide a kind of two-way heat pipe and higher heat radiation module of radiating efficiency of having.

A kind of heat radiation module, be used for cooling electronic component, it comprises first radiator that contacts with electronic devices and components, one is arranged at second radiator on first radiator, and at least one heat pipe of connection first and second radiators, described at least one heat pipe comprises that one is bonded to the evaporation section of first radiator and bends first condensation segment and second condensation segment that extends respectively from the two ends of evaporation section, described first condensation segment and second condensation segment are positioned at the homonymy of this evaporation section and are provided with in opposite directions, wherein first condensation segment combines with second radiator, and second condensation segment is located between first and second radiators.

Compared with prior art, the present invention is dispelled the heat, and first and second condensation segments of heat pipe are gone out with lateral buckling by an evaporation section in the module, this first and second condensation segment all directly is connected with described evaporation section, the heat that evaporation section absorbed can transfer to first and second condensation segments respectively from two directions simultaneously, and then conducts to first and second radiators again.For heat transfer, two-way undoubtedly than the unidirectional efficient that has more.Thus, the dispel the heat radiating efficiency of module of the present invention is higher.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the dispel the heat three-dimensional assembly diagram of module of the present invention.

Fig. 2 is the exploded view of Fig. 1.

Fig. 3 is the three-dimensional assembly diagram of first radiator and heat pipe among Fig. 2.

Embodiment

Heat radiation module of the present invention is to be used for the heating electronic component such as central processing unit (figure does not show) that are installed on the circuit board (figure does not show) are dispelled the heat.

See also Fig. 1 and Fig. 2, show heat radiation module of the present invention, it second radiator 20, that comprises that one first radiator 10, is arranged at first radiator, 10 tops is folded in the heat-conducting plate 30 between first radiator 10 and second radiator 20 and connects first radiator 10 and two heat pipes 40 of second radiator 20.

Described first radiator 10 comprises a base plate 12 and is arranged at some radiating fins 14 on the base plate 12.Described base plate 12 comprises the plate body 120 of a rectangle, and this plate body 120 is made by thermal conductivity good metal material, and its lower surface contacts with electronic devices and components to absorb the heat of its generation; These plate body 120 upper surfaces offer two grooves 122 that are parallel to its long limit, and these two grooves, 122 left-right symmetric are used to embed heat pipe 40 corresponding parts.120 4 jiaos of this plate bodys locate respectively that level extends outward four buckle ears 124, and each buckle ear 124 is equipped with a through hole 126, wear and base plate 12 is fixed on the circuit board for screw rod spare (figure does not show).Described radiating fin 14 thermal conductances are incorporated into plate body 120 tops, and each radiating fin 14 includes the lamellar body 140 of a rectangle.This lamellar body 140 is perpendicular to base plate 12, and its upper and lower two opposite side vertically bend out two flangings 142 respectively in the same way, and some corresponding flanging 142 is fixed into one by welding with radiating fin 14, thereby forms the upper and lower surface of radiating fin 14 respectively.Wherein, the lower surface of described radiating fin 14 is by being fixedly welded on base plate 12 upper surfaces, and the upper surface of radiating fin 14 then combines with heat-conducting plate 30 thermal conductances.The part of close these lamellar body 140 1 sides of these lamellar body 140 upper and lower opposite side is respectively equipped with two semicircle breach 144 of mutual correspondence, and the center of circle of the center of circle of top breach 144 and following corresponding breach 144 lays respectively on two straight lines that are parallel to lamellar body 140 minor faces.The inner edge of each breach 144 and flanging 142 vertically extend a semi-circular bonding pad 148 in the same way, and some corresponding bonding pads 148 interconnect forms four semi-cylindrical shaped grooves 146.Two grooves 146 that are positioned at radiating fin 14 bottoms cooperate with base plate 12 corresponding two grooves 122, form two cylindrical channels, and heating tube 40 corresponding parts wear.

Described heat-conducting plate 30 is parallel to base plate 12 and is arranged at first radiator, 10 tops, these heat-conducting plate 30 areas are less than the area of base plate 12, its bottom surface and corresponding position, first radiator 10 radiating fins, 14 top are provided with two grooves 302, this two groove 302 be positioned at corresponding two grooves 146 in first radiator, 10 tops and form two cylindrical channels, to accommodate heat pipe 30 corresponding parts.These heat-conducting plate 30 lower surfaces combine with first radiator, 10 radiating fins, 14 upper surface thermal conductances by welding, and its upper surface contacts with second radiator 20.

Described second radiator 20 is arranged at heat-conducting plate 30 tops, and it comprises the radiating fin 22 of some and heat-conducting plate 30 combinations and a cover plate 24 that matches with radiating fin 22.Each radiating fin 22 comprises the big rectangle lamellar bodies 220 such as lamellar body 140 of one and first radiator 10, these lamellar body 220 tops offer two semicircle breach 226, this two breach 224 is corresponding mutually with the breach 144 of first radiator 10, and the center of circle of the center of circle of this two breach 224 and first radiator, 10 corresponding breach 144 is positioned on two straight lines that are parallel to lamellar body 220 minor faces.The upper and lower opposite side of described lamellar body 220 and the inner edge of breach 224 vertically bend out two flangings 222 and two semiorbicular bonding pads 226 respectively in the same way.Some corresponding flangings 222 and bonding pad 226 by welding with radiating fin 22 fixed be one.Some corresponding flangings 222 connect to form the upper and lower surface of radiating fin 22, this lower surface by solder bond in heat-conducting plate 30 upper surfaces.Some bonding pads 226 connect into two grooves 228 of radiating fin 22 accordingly.Described cover plate 24 is parallel to heat-conducting plate 30, and it is made by thermal conductance good metal material.This cover plate 24 cuts out two grooves 242 by the plate body of a rectangle and forms.This plate body area is greater than heat-conducting plate 30 areas, and its lower surface is by the upper surface of solder bond in radiating fin 22.Above-mentioned two grooves 242 are opened in the plate body lower surface abreast, and it cooperates with two grooves 228 of radiating fin 22, forms two cylindrical channels of ccontaining heat pipe 30 appropriate sections.

Described two heat pipes, 40 shapes and function are all identical.Each heat pipe 40 comprises a straight evaporation section 42 and by these evaporation section 42 two ends homonymies back bending and the first straight condensation segment 44 and second condensation segment 46 that go out in opposite directions.This evaporation section 42 and first condensation segment 44 and second condensation segment 44 are parallel to each other and are positioned at same plane.Bent back portion between the evaporation section 42 and first condensation segment 44 divides formation first adiabatic section 45, and the bent back portion between the evaporation section 42 and second condensation segment 46 divides formation second adiabatic section 47.Described first adiabatic section 45 and second adiabatic section 47 all are positioned at first condensation segment 44 and second condensation segment, 46 formed planes, this first adiabatic section 45 further comprises one perpendicular to first flat segments 452 of evaporation section 42 and by first linkage section 454 of extended two arcs of these first flat segments, 452 two ends homonymies, the free terminal of these 2 first linkage sections 454 is connected with first condensation segment 44 with evaporation section 42 respectively, thereby the part heat that evaporation section 42 is absorbed is transferred to first condensation segment 44 from the left side.Described second adiabatic section 47 comprises one perpendicular to second flat segments 472 of evaporation section 42 and by second linkage section 474 of extended two arcs of these second flat segments, 472 two ends homonymies.The length of this second flat segments 472 is less than the length of first flat segments 452.The free terminal of these 2 second linkage sections 474 is connected to the evaporation section 42 and second condensation segment 46 respectively, transfers to second condensation segment 46 from the right side with another part heat that evaporation section 42 is absorbed.Because heat can transfer to first condensation segment 44 and second condensation segment 46 respectively from twocouese, the heat that evaporation section 42 is put aside can promptly obtain discharging, thereby makes heat pipe 40 have a higher heat transfer efficiency.

Two heat pipes, 40 planes of living in are parallel to each other, and the position of two heat pipes, 40 each several parts is corresponding one by one.Described each heat pipe 40 plane of living in are perpendicular to radiating fin 14 and base plate 12.See also Fig. 3, when assembling this heat radiation module, at first two evaporation sections 42 with two heat pipes 40 embed in two grooves 122 of first radiator, 10 base plates 12; Then, the free terminal of 2 second condensation segments 46 of two heat pipes 40 is slightly upwards mentioned a segment distance with respect to evaporation section 42, and the radiating fin 14 of first radiator 10 that will be integrally welded is in vertical second condensation segment 46 that wears heat pipe 40 of a side,

evaporation section

42,45,47 spaces that surrounded, first and second adiabatic sections again.Because heat pipe 40 has elasticity, wearing in the process of radiating fin 14, deformation takes place in second adiabatic section 47 of heat pipe 40, make second condensation segment 46 of heat pipe 40 have a trend that moves down, thereby interfere with the upper surface of radiating fin 14, embed in two grooves 146 on radiating fin 14 tops until this 2 second condensation segment 46, make second adiabatic section 47 recover deformation, second condensation segment 46 returns to original position.At this moment, the lower surface of radiating fin 14 closely contacts with base plate 12 upper surfaces and two evaporation sections 42 of heat pipe 40 is contained in the groove 146 of radiating fin 14 bottoms and the groove 122 of base plate 12 cooperates in two cylindrical channels that form.2 first adiabatic sections 45 of heat pipe 40 are positioned at a side of first radiator 10, and 2 second adiabatic sections 47 are positioned at the relative opposite side of first radiator 10; Afterwards, again the lower surface of heat-conducting plate 30 is attached at the upper surface of radiating fin 14, makes two grooves 302 of heat-conducting plate 30 cooperate 2 second condensation segments 46 of ccontaining two heat pipes 30 of two cylinder type passages that form with two grooves 146 on radiating fin 14 tops; Subsequently, the latter half that makes two grooves 228 of the radiating fin 22 of the second integrally welded radiator 20 aim at 2 first condensation segments 44 of heat pipes 40, again first condensation segment 44 of radiating fin 22 along heat pipe 40 moved inward, fit fully until the lower surface of radiating fin 22 and the upper surface of heat-conducting plate 30, this moment, 2 first condensation segments, 44 correspondences of heat pipe 40 were embedded in two grooves 228 of radiating fin 22; At last, cover plate 24 lower surfaces of second radiator 20 are attached at radiating fin 22 upper surfaces, two grooves 242 that make this cover plate 24 are contained in wherein with 2 first condensation segments 44 of two grooves, 228 formed two cylindrical spaces of radiating fin 22 with two heat pipes 40.Thus, this heat radiation module has been finished assembling process.

In sum, the present invention is dispelled the heat two

condensation segments

44,46 of each heat pipe 40 of module by the back bending and going out in opposite directions of an evaporation section 42 homonymies, wherein first condensation segment 44 is incorporated into second radiator, 20 tops, second condensation segment 46 is folded between first and

second radiators

10,20, the heat part that base plate 12 is absorbed is directly conducted to radiating

fin

14,22, another part heat transfers to first and

second radiators

10,20 via two

condensation segments

44,46 from two directions respectively, the more unidirectional heat transfer height of its radiating efficiency after being absorbed by the evaporation section 42 of heat pipe 40.And, because first and

second condensation segments

44,46 of heat pipe 40 combine with good cover plate 24 and the heat-conducting plate 30 of thermal conductivity respectively, heat can transfer to each radiating

fin

14,22 from cover plate 24 and heat-conducting plate 30 more uniformly, and first and

second radiators

10,20 can be dispelled the heat fully.

Claims

One kind the heat radiation module, be used for cooling electronic component, it comprises first radiator that contacts with electronic devices and components, one is arranged at second radiator on first radiator, and at least one heat pipe of connection first and second radiators, it is characterized in that: described at least one heat pipe comprises that one is bonded to the evaporation section of first radiator and bends first adiabatic section and second adiabatic section of extending respectively from the two ends homonymy of evaporation section, the end bending of this first adiabatic section extends to form first condensation segment, the end bending of this second adiabatic section extends to form second condensation segment, described first condensation segment and second condensation segment are provided with in opposite directions, wherein first condensation segment combines with second radiator, and second condensation segment is located between first and second radiators.
2. heat radiation module as claimed in claim 1 is characterized in that: described heat radiation module comprises that also one is folded in the heat-conducting plate between first and second radiators.
3. heat radiation module as claimed in claim 2, it is characterized in that: described first radiator comprise a base plate and be folded in base plate and above-mentioned heat-conducting plate between some radiating fins, described second radiator comprise a cover plate and be folded in cover plate and heat-conducting plate between some radiating fins.
4. heat radiation module as claimed in claim 3, it is characterized in that: the evaporation section of at least one heat pipe is located between the radiating fin bottom and base plate of described first radiator, first condensation segment of described at least one heat pipe is folded between the radiating fin top and cover plate of second radiator, and second condensation segment of described at least one heat pipe is located between the above-mentioned heat-conducting plate and the first radiator heat-dissipation fin top.
5. heat radiation module as claimed in claim 3 is characterized in that: described cover plate, heat-conducting plate and base plate are parallel to each other.
6. heat radiation module as claimed in claim 3, it is characterized in that: the evaporation section of described at least one heat pipe, first condensation segment, and second condensation segment be parallel to each other and be in same plane, this plane is perpendicular to the base plate of each radiating fin of first and second radiators and first radiator.
7. heat radiation module as claimed in claim 6 is characterized in that: the evaporation section coplane of described first adiabatic section and second adiabatic section and at least one heat pipe.
8. heat radiation module as claimed in claim 7 is characterized in that: first adiabatic section of described heat pipe is positioned at a side of first radiator, and second adiabatic section is positioned at the relative opposite side of first radiator.
9. heat radiation module as claimed in claim 7, it is characterized in that: described first adiabatic section comprises that one extends and first linkage section of two arcs that are connected with first condensation segment with evaporation section respectively perpendicular to first flat segments of evaporation section and by this flat segments two ends homonymy, second adiabatic section comprises that one extends and second linkage section of two arcs that are connected with second condensation segment with evaporation section respectively perpendicular to second flat segments of evaporation section and by this second flat segments two ends homonymy, and the length of described first flat segments is greater than the length of second flat segments.
10. heat radiation module as claimed in claim 7, it is characterized in that: described heat radiation module also comprises another heat pipe, described another heat pipe is identical with above-mentioned at least one heat pipe shape and be parallel to above-mentioned at least one heat pipe, and described another heat pipe and above-mentioned at least one heat pipe are parallel to each other and are provided with at interval.