CN101316495B - Heat sink assembly - Google Patents

Abstract

A heat dissipating module for dissipating heat from electronic components, comprising a first heat sink in contact with the electronic components, a second heat sink disposed on the first heat sink, and a heat sink connected to the first and second heat sinks. At least one heat pipe of the radiator, the at least one heat pipe includes an evaporating section connected to the first radiator and a first condensing section and a second condensing section respectively bent and extended from both ends of the evaporating section, the first The condensing section and the second condensing section are located on the same side of the evaporating section and oppositely arranged, wherein the first condensing section is combined with the second radiator, and the second condensing section is sandwiched between the first and second radiators. Compared with the prior art, the first and second condensation sections of the heat pipe of the heat dissipation module of the present invention are connected with an evaporation section at the same time, and the heat can be transmitted to the first and second radiators from two directions, thereby improving the heat dissipation of the heat dissipation module efficiency.

Description

Cooling module

technical field

The invention relates to a cooling module, in particular to a cooling module for cooling electronic components.

Background technique

High-power electronic components such as computer central processing unit, north bridge chip, and graphics card will generate a lot of heat during operation. If the heat cannot be effectively dissipated, it will directly lead to a sharp rise in temperature, which will seriously affect the performance of electronic components. normal operation. Therefore, it is necessary to add a heat dissipation module to dissipate heat from these electronic components.

The traditional heat dissipation module includes a base, a number of heat dissipation fins combined with the base, and a number of "ㄈ" heat pipes connecting the heat dissipation fins and the base. The evaporation section of these heat pipes is combined with the base, and the condensation section Then it is installed in the fins. When this type of cooling module works, part of the heat is directly transferred from the base to the fins, and another part of the heat is transferred to the cooling fins through the heat pipe. Since the heat pipe is in the shape of "ㄈ", each heat pipe has only one condensing section pierced through the fins, and the heat transferred from the evaporating section is concentrated to the part where the fins and the condensing section are in contact, and then spread gradually to the entire fin. During this process, heat is radiated from one part of the fins to other parts of the fins, resulting in uneven heating of each part of the fins, so that the fins cannot effectively exchange heat with the surrounding air. Therefore, this type of heat dissipation module The heat dissipation efficiency is limited.

In order to overcome the above shortcomings, the industry has designed a heat dissipation module as disclosed in one embodiment of Taiwan Patent No. M269704. The heat pipe of the heat dissipation module is in the shape of an "S", which includes a connecting fin bottom and is connected An evaporating section of the bottom plate, a condensing section pierced through the middle of the fins, and another condensing section combined with the top of the fins. The heat pipes of the heat dissipation module are evenly distributed on the surface of the fins, and a part of the heat is directly transmitted from the bottom plate to the lower part of the fins; the other part of the heat transmitted by the evaporation section is first transmitted to the middle of the fins through a condensation section, and then the remaining heat is passed through Another condensing section transfers to the top of the fins. Due to the fast heat transfer rate of the heat pipe, the heat can reach the upper, middle, and lower parts of the fins almost simultaneously, so that each part of the fins is heated evenly, and then the heat is effectively distributed to the surrounding air. Therefore, compared with the traditional heat dissipation module, the efficiency of the heat dissipation module is improved.

However, since the heat pipe of the heat dissipation module is in an "S" shape, the evaporating section can only transfer heat to the fins in one direction through the second condensation section, and the heat accumulated on the bottom plate cannot be dissipated quickly, thereby making the heat dissipation module The cooling efficiency of the group is limited.

Contents of the invention

In view of this, it is necessary to provide a heat dissipation module with bidirectional heat pipes and high heat dissipation efficiency.

A heat dissipation module is used to dissipate heat from electronic components, which includes a first heat sink in contact with electronic components, a second heat sink arranged on the first heat sink, and a heat sink connected to the first heat sink and the second heat sink. At least one heat pipe of the radiator, the at least one heat pipe includes an evaporating section connected to the first radiator and a first condensing section and a second condensing section respectively bent and extended from both ends of the evaporating section, the first The condensing section and the second condensing section are located on the same side of the evaporating section and are oppositely arranged, wherein the first condensing section is combined with the second radiator, and the second condensing section is interposed between the first and second radiators.

Compared with the prior art, the first and second condensing sections of the heat pipe in the heat dissipation module of the present invention are bent from the same side of an evaporating section, and the first and second condensing sections are directly connected to the evaporating section. The heat absorbed by the evaporating section can be transmitted from two directions to the first and the second condensing section at the same time, and then transferred to the first and the second radiator. Bidirectional is undoubtedly more efficient than unidirectional for heat transfer. Therefore, the heat dissipation efficiency of the heat dissipation module of the present invention is relatively high.

The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a three-dimensional assembly view of the heat dissipation module of the present invention.

FIG. 2 is an exploded view of FIG. 1 .

FIG. 3 is a three-dimensional assembled view of the first heat sink and the heat pipe in FIG. 2 .

Detailed ways

The heat dissipating module of the present invention is used for dissipating heat from heating electronic components (not shown) such as a central processing unit installed on a circuit board (not shown).

Please refer to Fig. 1 and Fig. 2, have shown the cooling module of the present invention, and it comprises a first heat sink 10, a second heat sink 20 that is arranged on the top of first heat sink 10, a sandwich between the first heat sink A heat conducting plate 30 between the radiator 10 and the second radiator 20 , and two heat pipes 40 connecting the first radiator 10 and the second radiator 20 .

The first heat sink 10 includes a base plate 12 and a plurality of cooling fins 14 disposed on the base plate 12 . Described bottom plate 12 comprises a rectangular board body 120, and this board body 120 is made of the metal material with good thermal conductivity, and its lower surface is in contact with electronic components and parts to absorb the heat that it produces; The two grooves 122 on its long side are symmetrical to the left and right, and are used to embed corresponding parts of the heat pipe 40 . Four buckle ears 124 extend horizontally outward from the four corners of the board body 120 , and each buckle ear 124 is provided with a through hole 126 for threading a screw member (not shown) to fix the base plate 12 on the circuit board. The heat dissipation fins 14 are thermally conductively bonded above the plate body 120 , and each heat dissipation fin 14 includes a rectangular body 140 . The sheet body 140 is perpendicular to the bottom plate 12, and its upper and lower two opposite sides are respectively bent vertically in the same direction to form two folded edges 142. Several corresponding folded edges 142 are welded to fix the heat dissipation fins 14 into one body, thereby forming heat dissipation fins 14 respectively. The upper and lower surfaces of the fins 14. Wherein, the lower surface of the heat dissipation fins 14 is fixed to the upper surface of the bottom plate 12 by welding, and the upper surface of the heat dissipation fins 14 is thermally conductively combined with the heat conducting plate 30 . The upper and lower sides of the sheet 140 are respectively provided with two semicircular notches 144 corresponding to one side of the sheet 140. On the second straight line on the short side. The inner edge of each notch 144 and the folded edge 142 extend vertically in the same direction as semi-circular coupling pieces 148 , and several corresponding coupling pieces 148 are connected to each other to form four semi-cylindrical grooves 146 . The two grooves 146 located at the lower part of the heat dissipation fins 14 cooperate with the two corresponding grooves 122 of the bottom plate 12 to form two cylindrical channels through which the corresponding parts of the heat supply pipes 40 pass.

The heat conduction plate 30 is arranged above the first heat sink 10 parallel to the base plate 12. The area of the heat conduction plate 30 is smaller than the area of the base plate 12, and two recesses are arranged on the bottom surface corresponding to the top of the heat dissipation fins 14 of the first heat sink 10. The groove 302 , the two grooves 302 and the corresponding two grooves 146 on the upper part of the first heat sink 10 form two cylindrical passages for accommodating corresponding parts of the heat pipe 30 . The lower surface of the heat conducting plate 30 is thermally bonded to the upper surface of the heat dissipation fins 14 of the first heat sink 10 by welding, and the upper surface thereof is in contact with the second heat sink 20 .

The second heat sink 20 is disposed above the heat conducting plate 30 , and includes a plurality of heat dissipation fins 22 combined with the heat conduction plate 30 and a cover plate 24 matched with the heat dissipation fins 22 . Each radiating fin 22 comprises a rectangular sheet 220 equal in size to the sheet 140 of the first heat sink 10. Two semicircular notches 226 are provided on the top of the sheet 220. The two notches 224 are aligned with the first heat sink 10. The notches 144 correspond to each other, and the centers of the two notches 224 and the centers of the corresponding notches 144 of the first heat sink 10 are located on two straight lines parallel to the short sides of the sheet body 220 . The upper and lower opposite sides of the sheet body 220 and the inner edge of the notch 224 are respectively bent vertically in the same direction to form two folded edges 222 and two semi-circular joint pieces 226 . A plurality of corresponding folded edges 222 and bonding pieces 226 are welded to consolidate the cooling fins 22 into one body. Several corresponding folded edges 222 are connected to form the upper and lower surfaces of the heat dissipation fins 22 , and the lower surface is combined with the upper surface of the heat conducting plate 30 by welding. The plurality of bonding fins 226 are correspondingly connected to form two grooves 228 of the heat dissipation fins 22 . The cover plate 24 is parallel to the heat conducting plate 30 and is made of a metal material with good thermal conductivity. The cover plate 24 is formed by cutting out two grooves 242 from a rectangular plate body. The area of the plate is larger than that of the heat conducting plate 30 , and its lower surface is welded to the upper surface of the heat dissipation fins 22 . The above-mentioned two grooves 242 are defined parallel to the lower surface of the plate body, and cooperate with the two grooves 228 of the heat dissipation fins 22 to form two cylindrical channels for accommodating corresponding parts of the heat pipe 30 .

The shape and function of the two heat pipes 40 are the same. Each heat pipe 40 includes a straight evaporating section 42 and a first straight condensing section 44 and a second condensing section 46 bent from opposite ends of the same side of the evaporating section 42 . The evaporating section 42 , the first condensing section 44 and the second condensing section 44 are parallel to each other and located on the same plane. The curved portion between the evaporating section 42 and the first condensing section 44 forms a first adiabatic section 45 , and the curved section between the evaporating section 42 and the second condensing section 46 forms a second adiabatic section 47 . The first heat insulation section 45 and the second heat insulation section 47 are located in the plane formed by the first condensation section 44 and the second condensation section 46, and the first heat insulation section 45 further includes a first plane perpendicular to the evaporation section 42 Straight section 452 and two arc-shaped first connecting sections 454 extending from the same side of the first straight section 452 two ends, the free ends of the two first connecting sections 454 are respectively connected to the evaporation section 42 and the first condensation section 44 connected so as to transfer part of the heat absorbed by the evaporating section 42 to the first condensing section 44 from the left side. The second heat insulating section 47 includes a second straight section 472 perpendicular to the evaporation section 42 and two arc-shaped second connecting sections 474 extending from two ends of the second straight section 472 on the same side. The length of the second straight section 472 is smaller than the length of the first straight section 452 . Free ends of the two second connecting sections 474 are respectively connected to the evaporating section 42 and the second condensing section 46 , so as to transfer another part of heat absorbed by the evaporating section 42 to the second condensing section 46 from the right side. Since heat can be transmitted to the first condensing section 44 and the second condensing section 46 respectively from two directions, the heat accumulated in the evaporating section 42 can be quickly released, so that the heat pipe 40 has a higher heat transfer efficiency.

The planes where the two heat pipes 40 are located are parallel to each other, and the positions of the parts of the two heat pipes 40 are in one-to-one correspondence. The plane where each heat pipe 40 is located is perpendicular to the heat dissipation fins 14 and the bottom plate 12 . Please also refer to FIG. 3 , when assembling the cooling module, first insert the second evaporation section 42 of the second heat pipe 40 into the second groove 122 of the bottom plate 12 of the first radiator 10; The free end of the segment 46 is slightly lifted upwards for a certain distance relative to the evaporating segment 42, and then the radiating fins 14 of the first heat sink 10 that have been welded into one are vertically inserted into the second condensing segment 46 of the heat pipe 40 from one side. In the space surrounded by the evaporating section 42 , the first and the second adiabatic section 45 , 47 . Due to the elasticity of the heat pipe 40, the second heat insulating section 47 of the heat pipe 40 is deformed during the passing process of the heat dissipation fin 14, so that the second condensation section 46 of the heat pipe 40 has a tendency to move downward, thereby being in contact with the heat dissipation fin 14. The upper surface of the upper surface interferes until the two second condensing sections 46 are inserted into the two grooves 146 on the upper part of the heat dissipation fins 14, so that the second adiabatic section 47 recovers its deformation, and the second condensing section 46 returns to its original position. At this time, the lower surface of the heat dissipation fin 14 is in close contact with the upper surface of the bottom plate 12, and the second evaporation section 42 of the heat pipe 40 is accommodated in the two cylinders formed by the cooperation of the groove 146 at the bottom of the heat dissipation fin 14 and the groove 122 of the bottom plate 12. inside the shaped channel. The two first heat insulating sections 45 of the heat pipe 40 are located on one side of the first heat sink 10, and the two second heat insulating sections 47 are located on the opposite side of the first heat sink 10; after that, the lower surface of the heat conducting plate 30 is pasted on the On the upper surface of the heat dissipation fin 14, the two cylindrical passages formed by the two grooves 302 of the heat conducting plate 30 and the two grooves 146 on the top of the heat dissipation fin 14 accommodate the two second condensation sections 46 of the two heat pipes 30; then , make the two grooves 228 of the heat dissipation fins 22 of the second radiator 20 that have been welded into one align with the lower half of the two first condensation sections 44 of the heat pipe 40, and then place the heat dissipation fins 22 along the first condensing section 44 of the heat pipe 40. The condensation section 44 moves inward until the lower surface of the heat dissipation fin 22 is completely attached to the upper surface of the heat conduction plate 30 , at this time, the two first condensation sections 44 of the heat pipe 40 are correspondingly embedded in the two grooves 228 of the heat dissipation fin 22 ; Finally, the cover plate 24 lower surface of the second radiator 20 is pasted on the upper surface of the heat dissipation fins 22, so that the two grooves 242 of the cover plate 24 and the two grooves 228 of the heat dissipation fins 22 form two circles. The cylindrical space accommodates the two first condensation sections 44 of the two heat pipes 40 therein. Thus, the heat dissipation module completes the assembly process.

To sum up, the two condensing sections 44 and 46 of each heat pipe 40 of the heat dissipation module of the present invention are bent back from the same side of an evaporating section 42, wherein the first condensing section 44 is combined with the top of the second radiator 20, and the second The second condensing section 46 is sandwiched between the first and second radiators 10, 20, part of the heat absorbed by the bottom plate 12 is directly transferred to the cooling fins 14, 22, and the other part of the heat is absorbed by the evaporation section 42 of the heat pipe 40 The heat is transferred from two directions to the first and second radiators 10 and 20 through the two condensation sections 44 and 46 respectively, and the heat dissipation efficiency thereof is higher than that of the heat transfer in one direction. Moreover, since the first and second condensation sections 44, 46 of the heat pipe 40 are respectively combined with the cover plate 24 and the heat conduction plate 30 with good thermal conductivity, the heat can be more evenly transmitted from the cover plate 24 and the heat conduction plate 30 to each cooling fin The fins 14, 22 enable the first and second radiators 10, 20 to fully dissipate heat.

Claims (10)

1. A cooling module for cooling electronic components, comprising a first heat sink in contact with electronic components, a second heat sink arranged on the first heat sink, and a first heat sink connected to the first heat sink The at least one heat pipe of the two radiators is characterized in that: the at least one heat pipe includes an evaporation section connected to the first radiator, and a first heat insulating section and a second insulation section respectively bent and extended from both ends of the evaporation section on the same side. Two heat insulation sections, the end of the first heat insulation section is bent and extended to form a first condensation section, the end of the second heat insulation section is bent and extended to form a second condensation section, and the first condensation section and the second condensation section are arranged opposite to each other, Wherein the first condensing section is combined with the second radiator, and the second condensing section is sandwiched between the first and second radiators. 2. The heat dissipation module according to claim 1, wherein the heat dissipation module further comprises a heat conduction plate sandwiched between the first heat sink and the second heat sink. 3. The heat dissipation module according to claim 2, wherein the first heat sink comprises a base plate and a plurality of heat dissipation fins interposed between the base plate and the heat conducting plate, and the second heat sink comprises A cover plate and a plurality of cooling fins sandwiched between the cover plate and the heat conduction plate. 4. The heat dissipation module according to claim 3, wherein the evaporation section of at least one heat pipe is sandwiched between the bottom of the heat dissipation fins of the first heat sink and the bottom plate, and the first heat pipe of the at least one heat pipe The condensation section is sandwiched between the top of the cooling fins of the second radiator and the cover plate, and the second condensation section of the at least one heat pipe is sandwiched between the above-mentioned heat conducting plate and the top of the cooling fins of the first radiator. 5. The heat dissipation module according to claim 3, wherein the cover plate, the heat conducting plate, and the bottom plate are parallel to each other. 6. The heat dissipation module according to claim 3, wherein the evaporation section, the first condensation section, and the second condensation section of the at least one heat pipe are parallel to each other and in the same plane, and the plane is perpendicular to the first and second condensation sections. Each cooling fin of the second radiator and the bottom plate of the first radiator. 7. The heat dissipation module according to claim 6, wherein the first heat insulating section and the second heat insulating section are coplanar with the evaporation section of at least one heat pipe. 8. The heat dissipation module according to claim 7, wherein the first heat insulating section of the heat pipe is located on one side of the first heat sink, and the second heat insulating section is located on the opposite side of the first heat sink. 9. The heat dissipation module according to claim 7, wherein the first heat insulating section comprises a first straight section perpendicular to the evaporating section, extending from both ends of the straight section on the same side and respectively Two arc-shaped first connecting sections connected with the evaporating section and the first condensing section, the second adiabatic section includes a second straight section perpendicular to the evaporating section and extending from both ends of the second straight section on the same side And the two arc-shaped second connecting sections respectively connected with the evaporating section and the second condensing section, the length of the first straight section is greater than the length of the second straight section. 10. The heat dissipation module according to claim 7, characterized in that: the heat dissipation module further comprises another heat pipe, the other heat pipe has the same shape as the at least one heat pipe and is parallel to the at least one heat pipe, so The other heat pipe and the at least one heat pipe are arranged parallel to each other and spaced apart from each other.

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