CN114992605B - Heat abstractor of super high power LED spotlight - Google Patents
Heat abstractor of super high power LED spotlight Download PDFInfo
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- CN114992605B CN114992605B CN202210689555.6A CN202210689555A CN114992605B CN 114992605 B CN114992605 B CN 114992605B CN 202210689555 A CN202210689555 A CN 202210689555A CN 114992605 B CN114992605 B CN 114992605B
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- heat pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a LED illumination field, especially a heat abstractor of super high-power LED spotlight, including first heat gathering base plate, second heat gathering base plate, two first heat pipe assemblies and second heat pipe assemblies, two first heat pipe assemblies with the cavity inside that the second heat pipe assemblies constitutes is equipped with a heat dissipation wing subassembly along same heat dissipation direction respectively, first heat pipe assembly's evaporation zone with first heat gathering base plate is connected, first heat pipe assembly's condensation segment the evaporation zone of second heat pipe assembly respectively with second heat gathering base plate is connected, through first heat pipe assemblies, second heat pipe assemblies and heat dissipation wing subassembly with the heat quick transfer of LED spotlight production in the air.
Description
Technical Field
The application relates to the field of LED illumination, in particular to a heat dissipation device of an ultra-high power LED spotlight.
Background
The high-power LED spotlight is mainly used for photography and video, and currently, the existing high-power LED spotlight on the market has an Orbiter series of ARRI, the maximum power of the high-power LED spotlight is 500W, and a heat pipe radiating mode is adopted; the LED spotlight with the maximum power in the market is LS1200dPro of Aishi, the power is 1200W, and the heat dissipation mode is also heat dissipation of a heat pipe.
The heat pipe radiator is affected by the characteristics of the heated pipe, so that the heat dissipation limit exists, the heat dissipation capacity of the super-power LED spotlight is large, the heat dissipation is very concentrated (namely, the heat dissipation area is small), the heat dissipation performance of the common heat pipe radiator is insufficient and even overrun, the heat generated by the spotlight cannot be timely taken away, the temperature of the LED spotlight is too high to damage the spotlight, the heat dissipation limit of the heated pipe is limited, the existing LED spotlight with the maximum power in the market is 1200W, and the LED spotlight with the higher power in the market is required to meet the requirements of photography and video, so that the heat dissipation problem of the super-power LED spotlight becomes the bottleneck technical problem of industry development and needs to break through.
Disclosure of Invention
In view of the problem, the present application has been developed to provide a heat sink for an ultra-high power LED spotlight that overcomes or at least partially solves the problem.
The heat dissipation device comprises a first heat collection substrate, a second heat collection substrate, two first heat pipe assemblies and a second heat pipe assembly, wherein one end face of the first heat collection substrate is connected with a core board of the LED spotlight, the second heat collection substrate is arranged corresponding to the other end face of the first heat collection substrate at intervals, the two first heat pipe assemblies are clamped between the corresponding end faces of the first heat collection substrate and the second heat collection substrate and symmetrically arranged along the central line of the first heat collection substrate and the central line of the second heat collection substrate, the second heat pipe assemblies are clamped on the other end face of the second heat collection substrate, a heat dissipation fin assembly is arranged in a hollow interior formed by the two first heat pipe assemblies and the second heat pipe assemblies along the same heat dissipation direction respectively, an evaporation section of the first heat pipe assemblies is connected with the first heat collection substrate, and a condensation section of the first heat pipe assemblies and an evaporation section of the second heat pipe assemblies are connected with the second heat collection substrate respectively.
Preferably, the first heat pipe assembly comprises a plurality of first heat pipe components which are uniformly arranged at intervals, the first heat pipe components comprise a first heat pipe unit and a second heat pipe unit which are stacked in a staggered mode, evaporation sections of the first heat pipe unit and the second heat pipe unit are clamped on the first heat collecting substrate, and condensation sections of the first heat pipe unit and the second heat pipe unit are clamped on the second heat collecting substrate.
Preferably, one of the heat dissipation fin assemblies is connected with one end face of the first heat collecting substrate, the other heat dissipation fin assembly is connected with one end face of the second heat collecting substrate, and the heat dissipation fin assemblies comprise a plurality of heat dissipation fins which are uniformly arranged at intervals, and a third heat pipe unit penetrating through each heat dissipation fin.
Preferably, the evaporation section of the third heat pipe unit is close to the first heat collecting substrate and/or the second heat collecting substrate.
Preferably, the second heat pipe assembly comprises a plurality of second heat pipe components which are uniformly arranged at intervals, the second heat pipe components comprise a fourth heat pipe unit and a fifth heat pipe unit which are stacked in a staggered mode, and evaporation sections of the fourth heat pipe unit and the fifth heat pipe unit are clamped on the second heat accumulating substrate.
Preferably, a support connector is provided between the first heat pipe unit and the second heat pipe unit, or between the fourth heat pipe unit and the fifth heat pipe unit.
Preferably, the same side end surfaces of the first heat collecting substrate and the second heat collecting substrate are respectively provided with a plurality of heat pipe embedding grooves penetrating through the two sides at intervals, the evaporation section of the first heat pipe assembly is clamped in the heat pipe embedding grooves of the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are clamped in the heat pipe embedding grooves of the second heat collecting substrate.
Preferably, the heat collecting device further comprises a coaming, wherein the coaming is connected with the side edges of the first heat collecting substrate and the second heat collecting substrate, and the first heat pipe assembly, the second heat pipe assembly and the heat radiating fin assembly are all arranged in the coaming.
Preferably, fan devices are respectively arranged outside the first heat pipe assembly and the second heat pipe assembly, and the air outlet ends of the fan devices correspond to the heat dissipation directions of the heat dissipation fin assemblies.
There is also provided an LED spotlight comprising a heat sink as described above.
The application has the following advantages:
in the embodiment of the application, the device comprises a first heat collecting substrate, a second heat collecting substrate, two first heat pipe assemblies and a second heat pipe assembly, wherein one end face of the first heat collecting substrate is connected with a core board of the LED spotlight, the second heat collecting substrate is arranged corresponding to the other end face of the first heat collecting substrate at intervals, the two first heat pipe assemblies are clamped between the corresponding end faces of the first heat collecting substrate and the second heat collecting substrate and symmetrically arranged along the central line of the first heat collecting substrate and the second heat collecting substrate, the second heat pipe assemblies are clamped on the other end face of the second heat collecting substrate, a heat dissipation fin assembly is arranged in a hollow interior formed by the two first heat pipe assemblies and the second heat pipe assemblies along the same heat dissipation direction, an evaporation section of the first heat pipe assemblies is connected with the first heat collecting substrate, and a condensation section of the first heat pipe assemblies and an evaporation section of the second heat pipe assemblies are connected with the second heat collecting substrate respectively; the heat of the first heat collecting substrate is quickly converted to the second heat collecting substrate through the phase change heat exchange process of the first heat pipe assembly, and then the heat of the second heat collecting substrate is converted to the air through the phase change process of the second heat pipe assembly.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the present application will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic diagram of an overall structure of a heat dissipating device of an ultra-high power LED spotlight according to an embodiment of the present disclosure;
fig. 2 is an exploded schematic view of a heat dissipating device of an ultra-high power LED spotlight according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of an installation structure of a heat pipe component of a heat dissipating device of an ultra-high power LED spotlight according to an embodiment of the present invention;
fig. 4 is a schematic top view of a heat dissipating device of an ultra-high power LED spotlight according to an embodiment of the present invention;
in the figure, 1, an LED spotlight; 10. a first heat collecting substrate; 20. a second polymeric substrate; 30. a first heat pipe assembly; 31. a first heat pipe unit; 32. a second heat pipe unit; 40. a second heat pipe assembly; 41. a fourth heat pipe unit; 42. a fifth heat pipe unit; 43. a support connection; 50. a heat dissipation fin assembly; 51. a heat radiation fin; 52. a third heat pipe unit; 60. and (5) coaming plates.
Detailed Description
In order to make the objects, features and advantages of the present application more comprehensible, the present application is described in further detail below with reference to the accompanying drawings and detailed description. It will be apparent that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that in any embodiment of the present invention, the heat dissipation device mentioned may be used in the heat dissipation scenario of a general power LED spotlight, and more preferably, the heat dissipation device may meet the heat dissipation requirement of an ultra-high power LED spotlight of 1200W-1800W, so that the service life of the ultra-high power LED spotlight is effectively improved.
Referring to fig. 1-4, a heat dissipating device of an ultra-high power LED spotlight according to an embodiment of the present application is shown, where the heat dissipating device includes a first heat collecting substrate 10, a second heat collecting substrate 20, which is disposed in a space corresponding to the other end surface of the first heat collecting substrate 10, two first heat pipe assemblies 30, which are clamped between the corresponding end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20 and symmetrically disposed along the central lines of the first heat collecting substrate 10 and the second heat collecting substrate 20, and a second heat pipe assembly 40, which is clamped on the other end surface of the second heat collecting substrate 20, wherein hollow interiors formed by the two first heat pipe assemblies 30 and the second heat pipe assemblies 40 are respectively provided with a fin assembly 50 along the same heat dissipating direction, an evaporation section of the first heat pipe assembly 30 is connected with the first heat collecting substrate 10, and an evaporation section of the first heat pipe assembly 30 is respectively connected with the second heat collecting substrate 20.
The device comprises a first heat collecting substrate 10, a second heat collecting substrate 20, two first heat pipe assemblies 30 and a second heat pipe assembly 40, wherein one end face of the first heat collecting substrate 10 is connected with a core board of the LED spotlight 1, the second heat collecting substrate 20 is arranged corresponding to the other end face of the first heat collecting substrate 10 at intervals, the two first heat pipe assemblies 30 are clamped between the corresponding end faces of the first heat collecting substrate 10 and the second heat collecting substrate 20 and symmetrically arranged along the central line of the first heat collecting substrate 10 and the second heat collecting substrate 20, the second heat pipe assemblies 40 are clamped on the other end face of the second heat collecting substrate 20, a heat dissipation fin assembly 50 is arranged in a hollow inner part formed by the two first heat pipe assemblies 30 and the second heat pipe assemblies 40 along the same heat dissipation direction, an evaporation section of the first heat pipe assemblies 30 is connected with the first heat collecting substrate 10, and a condensation section of the first heat pipe assemblies 30 and an evaporation section of the second heat pipe assemblies 40 are respectively connected with the second heat collecting substrate 20; after a large amount of heat of the LED spotlight 1 is absorbed by the first heat collecting substrate 10, part of the heat of the first heat collecting substrate 10 is quickly converted to the second heat collecting substrate 20 through the phase change heat exchange process of the first heat pipe assembly 30, and then part of the heat condensed on the second heat collecting substrate 20 is converted to the air through the phase change process of the second heat pipe assembly 40, and meanwhile, the heat dissipation fin assemblies 50 arranged inside the first heat pipe assembly 30 and the second heat pipe assembly 40 enhance the conduction heat dissipation effect on the corresponding heat collecting substrates.
Next, a heat sink of the above-described ultra-high power LED spotlight will be further described by the following embodiments.
In an embodiment of the present application, the first heat pipe assembly 30 includes a plurality of first heat pipe components that are uniformly arranged at intervals, the first heat pipe components include a first heat pipe unit 31 and a second heat pipe unit 32 that are stacked in a staggered manner, the evaporation sections of the first heat pipe unit 31 and the second heat pipe unit 32 are clamped on the first heat collecting substrate 10, and the condensation sections of the first heat pipe unit 31 and the second heat pipe unit 32 are clamped on the second heat collecting substrate 20.
It should be noted that, the first heat pipe units 31 and the second heat pipe units 32 are stacked in a staggered manner, or a certain gap may exist between the two, so that the unit heat dissipation area of the heat pipe components is effectively increased, and each first heat pipe component is arranged at intervals, so that the overall heat conduction area is greatly improved.
It can be understood that the first heat pipe unit 31 or the second heat pipe unit 32 is U-shaped, one section is an evaporation section, the other section is a condensation section, and the heat is transferred to the condensation section through the phase change of the evaporation section, that is, the heat of the first heat collecting substrate 10 can be quickly transferred to the second heat collecting substrate 20 through the first heat pipe assembly 30; because a plurality of first heat pipe parts are arranged at intervals, part of heat is emitted into the air in the heat conduction process.
In an embodiment of the present application, one heat dissipation fin assembly 50 is connected to one end surface of the first heat collecting substrate 10, the other heat dissipation fin assembly 50 is connected to one end surface of the second heat collecting substrate 20, and the heat dissipation fin assembly 50 includes a plurality of heat dissipation fins 51 arranged at regular intervals, and a third heat pipe unit 52 penetrating through each of the heat dissipation fins 51.
It can be appreciated that the heat conduction mode by the heat pipe effect is not enough to conduct the heat of the heat collecting substrate to the maximum extent, and the heat dissipation fin assembly 50 is added to accelerate the heat conduction efficiency to the heat collecting substrate; further, each heat dissipation fin 51 is perforated with a third heat pipe unit 52, so as to improve the heat conduction efficiency of the heat dissipation fin 51.
Specifically, the evaporation section of the third heat pipe unit 52 is attached to the first heat collecting substrate 10 and/or the second heat collecting substrate 20; three third heat pipe units 52 are arranged on each heat dissipation fin assembly 50 in a penetrating manner, and the heat conduction efficiency of the heat collection substrate is accelerated in a mode of combining heat pipes and heat dissipation fins.
In an embodiment of the present application, the second heat pipe assembly 40 includes a plurality of second heat pipe components uniformly arranged at intervals, the second heat pipe components include a fourth heat pipe unit 41 and a fifth heat pipe unit 42 stacked in a staggered manner, and evaporation sections of the fourth heat pipe unit 41 and the fifth heat pipe unit 42 are clamped on the second heat collecting substrate 20.
It should be noted that, when most of the heat is collected on the second heat collecting substrate 20, the heat on the second heat collecting substrate 20 is quickly conducted to the air by the second heat pipe components in the second heat pipe assembly 40 which are uniformly arranged at intervals, specifically, the evaporation sections of the fourth heat pipe unit 41 and the fifth heat pipe unit 42 which are stacked in a staggered manner in height of the second heat pipe component are clamped on the second heat collecting substrate 20, and the heat on the second heat collecting substrate 20 is quickly conducted to the condensation section contacting with the air through the phase change effect, and then, the heat of the first heat collecting substrate 10 is quickly exchanged or conducted and radiated by the heat pipe units in a multi-stage (at least two-stage) overlapping design.
The fourth heat pipe unit 41 and the fifth heat pipe unit 42 are C-shaped, and the end of the evaporation section is disposed corresponding to the end of the condensation section.
In an embodiment of the present application, a support connection member 43 is provided between the first heat pipe unit 31 and the second heat pipe unit 32, or between the fourth heat pipe unit 41 and the fifth heat pipe unit 42.
It can be understood that the support connection piece 43 maintains a stable staggered correspondence between the first heat pipe unit 31 and the second heat pipe unit 32, or between the fourth heat pipe unit 41 and the fifth heat pipe unit 42, and the gaps between the staggered high and low layers are also beneficial for heat dissipation into the air.
In an embodiment of the present application, a plurality of heat pipe engaging grooves penetrating through two sides are respectively provided on the same side end surfaces of the first heat collecting substrate 10 and the second heat collecting substrate 20 at intervals, the evaporation section of the first heat pipe assembly 30 is clamped in the heat pipe engaging groove of the first heat collecting substrate 10, and the condensation section of the first heat pipe assembly 30 and the evaporation section of the second heat pipe assembly 40 are clamped in the heat pipe engaging groove of the second heat collecting substrate 20.
It can be appreciated that the heat pipe engaging grooves of the second heat collecting substrate 20 simultaneously engage with the first heat pipe assembly 30 and the second heat pipe assembly 40, so that heat conduction can be directly performed therebetween, thereby further accelerating the overall heat dissipation efficiency.
In an embodiment of the present application, the heat dissipation fin assembly further includes a shroud 60, where the shroud 60 is connected to the sides of the first heat collecting substrate 10 and the second heat collecting substrate 20, and the first heat pipe assembly 30, the second heat pipe assembly 40 and the heat dissipation fin assembly 50 are all disposed in the shroud 60.
The coaming 60 stabilizes the relative positional relationship between the first heat collecting substrate 10 and the second heat collecting substrate 20, so as to protect the first heat pipe assembly 30, the second heat pipe assembly 40 and the heat dissipation fin assembly 50.
In an embodiment of the present application, fan devices (not shown) are respectively disposed outside the first heat pipe assembly 30 and the second heat pipe assembly 40, and an air outlet end of the fan devices corresponds to a heat dissipation direction of the heat dissipation fin assembly 50.
It can be understood that, by arranging the fan devices outside the first heat pipe assembly 30 and the second heat pipe assembly 40 respectively, the air outlet ends of the fan devices correspond to the heat dissipation directions of the heat dissipation fin assemblies 50, that is, the air outlet ends of the fan devices correspond to the gaps between the heat pipe components and between the heat dissipation fins 51, and convection is formed between the first heat pipe assembly 30, the second heat pipe assembly 40 and the heat dissipation fin assemblies 50 inside through the fan devices, so that the heat convection and heat exchange rate in the air is accelerated. In sum, the combination of the application combines various modes such as phase change heat exchange, solid heat conduction, convection heat exchange and the like, so that heat generated by the LED spotlight can be emitted more quickly and effectively, the problem of heat dissipation of the ultra-high power LED spotlight is solved, a foundation is laid for research and development of the ultra-high power LED spotlight with the power of 1500W, 1800W and 2000W even higher, and the process of appearance of the ultra-high power LED spotlight in the film and television industry and the photographic industry is accelerated.
While preferred embodiments of the present embodiments have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the present application.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.
The above describes in detail the heat dissipating device of the super-power LED spotlight provided in the present application, and specific examples are applied herein to illustrate the principles and embodiments of the present application, where the above description of the examples is only for helping to understand the method and core ideas of the present application; meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (7)
1. The heat dissipation device of the super-power LED spotlight is characterized by comprising a first heat collection substrate, a second heat collection substrate, two first heat pipe assemblies and a second heat pipe assembly, wherein one end face of the first heat collection substrate is connected with a core plate of the LED spotlight, the second heat collection substrate is arranged corresponding to the other end face of the first heat collection substrate at intervals, the two first heat pipe assemblies are clamped between the corresponding end faces of the first heat collection substrate and the second heat collection substrate and symmetrically arranged along the central lines of the first heat collection substrate and the second heat collection substrate, the second heat pipe assemblies are clamped on the other end face of the second heat collection substrate, a heat dissipation fin assembly is arranged in a hollow interior formed by the two first heat pipe assemblies and the second heat pipe assemblies along the same heat dissipation direction, an evaporation section of the first heat pipe assemblies is connected with the first heat collection substrate, and a condensation section of the first heat pipe assemblies and an evaporation section of the second heat pipe assemblies are connected with the second heat collection substrate respectively;
one of the radiating fin components is connected with one end face of the first heat collecting substrate, the other radiating fin component is connected with one end face of the second heat collecting substrate, and the radiating fin component comprises a plurality of radiating fins which are uniformly arranged at intervals and a third heat pipe unit penetrating through each radiating fin;
the evaporation section of the third heat pipe unit is attached to the first heat collecting substrate and/or the second heat collecting substrate;
the heat pipe embedding grooves penetrating through two sides are respectively arranged on the end faces of the same side of the first heat collecting substrate and the second heat collecting substrate at intervals, the evaporation section of the first heat pipe assembly is clamped in the heat pipe embedding grooves of the first heat collecting substrate, and the condensation section of the first heat pipe assembly and the evaporation section of the second heat pipe assembly are clamped in the heat pipe embedding grooves of the second heat collecting substrate.
2. The heat dissipating device of claim 1 wherein the first heat pipe assembly comprises a plurality of first heat pipe units arranged at uniform intervals, the first heat pipe units comprise first heat pipe units and second heat pipe units stacked in a staggered manner, evaporation sections of the first heat pipe units and the second heat pipe units are clamped on the first heat collecting substrate, and condensation sections of the first heat pipe units and the second heat pipe units are clamped on the second heat collecting substrate.
3. The heat dissipating device of claim 2, wherein the second heat pipe assembly comprises a plurality of second heat pipe components which are uniformly arranged at intervals, the second heat pipe components comprise a fourth heat pipe unit and a fifth heat pipe unit which are stacked in a staggered manner, and evaporation sections of the fourth heat pipe unit and the fifth heat pipe unit are clamped on the second heat accumulating substrate.
4. A heat sink according to claim 3, wherein a support connection is provided between the first heat pipe unit and the second heat pipe unit or between the fourth heat pipe unit and the fifth heat pipe unit.
5. The heat dissipating device of claim 1 further comprising a shroud connected to sides of said first heat collecting substrate and said second heat collecting substrate, said first heat pipe assembly, said second heat pipe assembly and said heat dissipating fin assembly being disposed within said shroud.
6. The heat dissipating device of claim 1, wherein fan devices are disposed outside the first heat pipe assembly and the second heat pipe assembly, respectively, and an air outlet end of the fan device corresponds to a heat dissipating direction of the heat dissipating fin assembly.
7. An LED spotlight comprising a heat sink as claimed in any of claims 1-3, 5-6.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210689555.6A CN114992605B (en) | 2022-06-17 | 2022-06-17 | Heat abstractor of super high power LED spotlight |
| PCT/CN2022/104963 WO2023240724A1 (en) | 2022-06-17 | 2022-07-11 | Heat dissipation device of ultra-high-power led spotlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210689555.6A CN114992605B (en) | 2022-06-17 | 2022-06-17 | Heat abstractor of super high power LED spotlight |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114992605A CN114992605A (en) | 2022-09-02 |
| CN114992605B true CN114992605B (en) | 2023-06-02 |
Family
ID=83035701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210689555.6A Active CN114992605B (en) | 2022-06-17 | 2022-06-17 | Heat abstractor of super high power LED spotlight |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114992605B (en) |
| WO (1) | WO2023240724A1 (en) |
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| CN105387438A (en) * | 2015-12-24 | 2016-03-09 | 刘树泽 | Cooling suite of LED project lamp |
| CN110848646A (en) * | 2019-11-27 | 2020-02-28 | 特能热交换科技（中山）有限公司 | High-efficiency radiator and lamp with same |
| CN216308711U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe radiator |
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| CN101316495B (en) * | 2007-06-01 | 2011-12-21 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| TW200915051A (en) * | 2007-09-21 | 2009-04-01 | Foxconn Tech Co Ltd | Heat dissipation device |
| TWI484895B (en) * | 2010-05-14 | 2015-05-11 | Asia Vital Components Co Ltd | Heat dissipation device |
| CN203799328U (en) * | 2014-03-24 | 2014-08-27 | 中山市久能光电科技有限公司 | CPU (central processing unit) radiator |
| CN206846331U (en) * | 2017-04-27 | 2018-01-05 | 中山市久能光电科技有限公司 | A kind of LED radiator of good heat dissipation effect |
| CN110906293A (en) * | 2019-11-27 | 2020-03-24 | 特能热交换科技（中山）有限公司 | Heat radiator |
| US11817372B2 (en) * | 2020-04-15 | 2023-11-14 | Asia Vital Components Co., Ltd. | Heat sink device |
| CN215725361U (en) * | 2021-05-11 | 2022-02-01 | 特能热交换科技（中山）有限公司 | High heat conduction type radiator |
| CN215003107U (en) * | 2021-05-11 | 2021-12-03 | 特能热交换科技（中山）有限公司 | Heat pipe radiator |
| CN216308713U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe sheet type heat dissipation device |
-
2022
- 2022-06-17 CN CN202210689555.6A patent/CN114992605B/en active Active
- 2022-07-11 WO PCT/CN2022/104963 patent/WO2023240724A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105387438A (en) * | 2015-12-24 | 2016-03-09 | 刘树泽 | Cooling suite of LED project lamp |
| CN110848646A (en) * | 2019-11-27 | 2020-02-28 | 特能热交换科技（中山）有限公司 | High-efficiency radiator and lamp with same |
| CN216308711U (en) * | 2021-10-14 | 2022-04-15 | 特能(厦门)超导科技有限公司 | Heat pipe radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023240724A1 (en) | 2023-12-21 |
| CN114992605A (en) | 2022-09-02 |
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