CN210015851U

CN210015851U - Heat dissipation device for semiconductor devices with different heating values and data center machine room

Info

Publication number: CN210015851U
Application number: CN201921201373.XU
Authority: CN
Inventors: 李越峰; 袁竹; 张娣
Original assignee: Sichuan Jia Gang Technology Co Ltd; Sichuan Changhong Air Conditioner Co Ltd
Current assignee: Sichuan Jia Gang Technology Co Ltd; Sichuan Changhong Air Conditioner Co Ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-02-04
Anticipated expiration: 2029-07-29

Abstract

The utility model discloses a heat abstractor and data center computer lab for different calorific capacity semiconductor device, including at least two different semiconductor device of calorific capacity, still include at least a set of semiconductor radiating unit loop, semiconductor radiating unit loop includes condenser and the evaporimeter of being connected with first semiconductor device, and the exit end of evaporimeter communicates with the entry end of condenser, and the entry end of evaporimeter communicates with the exit end of condenser; the second semiconductor device is connected to a connecting section of the outlet end of the evaporator and the inlet end of the condenser. The utility model not only realizes the normal heat dissipation of the semiconductor device with larger heating value, but also realizes the heat dissipation of the semiconductor device with smaller heating value by using the heat dissipation allowance of the pipeline, and maximizes the heat dissipation resource of the heat dissipation pipeline; the utility model discloses simple structure, heat dissipation section way distribution are reasonable, the waste of resource has been reduced, can satisfy the heat dissipation demand of different calorific capacity semiconductor device simultaneously.

Description

Heat dissipation device for semiconductor devices with different heating values and data center machine room

Technical Field

The utility model belongs to the technical field of the semiconductor cooling system technique and specifically relates to a heat abstractor and data center computer lab that is used for different calorific capacity semiconductor device.

Background

Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of the semiconductor material to perform specific functions, which can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. Semiconductor devices are widely used in various fields of engineering, especially in the application of semiconductor chips. At present, applications of semiconductor chips are represented by computer CPUs, IPMs of air conditioners, and power components of PFC circuits, and also lasers and display chips in laser projectors. These semiconductor devices generate a large amount of heat in applications accompanied by their high-performance operation, and in order to prevent a malfunction that may occur in electronic equipment due to a temperature rise of these semiconductor devices, it is necessary to improve the heat dissipation of the semiconductor devices so that the generated heat can be satisfactorily released to the outside.

At present, the heat dissipation of the semiconductor device mainly adopts the following modes: 1. the aluminum profile radiator and the fan are integrated, the heat-conducting silicone grease and the semiconductor heating object are fastened together, and the aluminum profile radiator conducts heat out through the operation of the fan and exhausts the heat to the outside of the machine body, so that the cooling function is realized; 2. one end of the gravity heat pipe is fixedly connected with the semiconductor heating device, heat is conducted to the aluminum profile radiator with the fan, and the heat is discharged to the outside of the machine body through air flowing through the aluminum profile, so that cooling is realized; 3. by utilizing the refrigeration cycle, a compressor is generally adopted, the cold end and the heating semiconductor are fastened and connected to cool, and the refrigeration cycle is utilized to transfer heat to the outside of the machine body.

The heat dissipation scheme for the semiconductor device only guides the heat of the heating device to the nearby air through the heat conduction structure, and for the semiconductor device with large heating value, the heat is still concentrated around the heating device, and the semiconductor device still fails due to overhigh heat over time. The applicant has previously proposed a patent application of a semiconductor heat dissipation device for performing remote heat transfer on a heat generating semiconductor device by using a loop heat pipe, which can meet the heat dissipation requirements of different semiconductor devices by allocating pipelines, but in view of the fact that the existing equipment often has a plurality of semiconductor device heat sources with different powers, the heat generation amounts are different, the heat dissipation amount required by some semiconductor devices with smaller powers is very small, and if the heat dissipation pipelines are independently arranged for the semiconductor devices with very small heat dissipation amounts, resource waste and unreasonable allocation are caused.

The data center machine room is an important application area of semiconductor devices, a large number of servers are generally placed in the data center machine room, the servers contain a large number of semiconductor devices with different specifications, the heat productivity of the servers is large, a heat dissipation system adopted by the existing data center machine room mainly adopts two modes of wind cooling and liquid cooling, the air-cooled machine room heat dissipation system mainly depends on a machine room air conditioner to reduce the indoor air temperature of the machine room, and then air flow is organized through fans and channels arranged in a machine cabinet of the servers to enable indoor cold air to enter the machine cabinet to be subjected to heat exchange with the servers, the heat dissipation technology is developed more mature, but a large amount of energy is consumed, and the organized air flow can increase the heat exchange temperature difference between the servers and the cold air, so that local overheating is; the development of a liquid-cooled machine room heat dissipation system is late, various forms such as water-cooled heat dissipation at the tail end of the existing machine room air conditioner combination, soaking heat dissipation and the like exist, but the technical problems that the liquid leakage easily causes circuit failure, component corrosion and the like exist.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the heat dissipation device for the semiconductor devices with different heat productivity can meet the heat dissipation requirements of different semiconductor devices without wasting resources.

For solving the technical problem the utility model discloses the technical scheme who adopts is: the heat dissipation device comprises at least two semiconductor devices with different heat productivity, at least one group of semiconductor heat dissipation unit loop, a heat dissipation unit and a heat dissipation unit, wherein the semiconductor device with larger heat productivity is a first semiconductor device, the semiconductor device with smaller heat productivity is a second semiconductor device, the semiconductor heat dissipation unit loop comprises a condenser and an evaporator connected with the first semiconductor device, the outlet end of the evaporator is communicated with the inlet end of the condenser, and the inlet end of the evaporator is communicated with the outlet end of the condenser; the second semiconductor device is connected to a connecting section of the outlet end of the evaporator and the inlet end of the condenser.

Further, the method comprises the following steps: the evaporator is communicated with the inlet end of the condenser through a steam pipeline, and the outlet end of the condenser is communicated with the evaporator through a liquid pipeline; and the second semiconductor device is fixedly connected to the steam pipeline.

Further, the method comprises the following steps: a liquid storage device is arranged in the evaporator, a liquid working medium is filled in the liquid storage device, and the liquid storage device is respectively communicated with the steam pipeline and the liquid pipeline; the condenser and the vapor line are located at a height greater than the evaporator and the liquid line.

Further, the method comprises the following steps: a liquid storage device and a capillary structure are arranged in the evaporator, a liquid working medium is filled in the liquid storage device, and the liquid storage device is arranged at the inlet end of the evaporator; the capillary structure is in communication with the reservoir and extends toward the outlet end of the evaporator.

Further, the method comprises the following steps: the capillary structure is a tubular structure with a plurality of capillary holes distributed on the surface.

Further, the method comprises the following steps: the condenser is a fin heat exchanger, a micro-channel heat exchanger, a tube-plate heat exchanger, a wire-tube heat exchanger or a rotary fin heat exchanger.

Further, the method comprises the following steps: the semiconductor heat dissipation unit loop also comprises a starter arranged at the inlet end of the evaporator, and the starter is connected in series in the steam pipeline.

Further, the method comprises the following steps: the connecting section of the steam pipeline and the second semiconductor device is a flat pipe section, and the second semiconductor device is in contact with the flat pipe section and is fixed through a fixing piece; the surface of the evaporator contacted with the surface of the first semiconductor device and the surface of the steam pipeline contacted with the surface of the second semiconductor device are flat surfaces.

Further, the method comprises the following steps: and heat-conducting media are filled between the evaporator and the surface of the first semiconductor device and between the steam pipeline and the surface of the second semiconductor device.

The utility model also discloses a data center computer lab of including the above-mentioned heat abstractor that is used for different calorific capacity semiconductor device.

The utility model has the advantages that: the utility model discloses establish ties the semiconductor device that calorific capacity is different on same group semiconductor heat dissipation unit loop, through setting up the semiconductor device that calorific capacity is great at evaporimeter department to the semiconductor device that calorific capacity is less sets up the steam pipe highway section between evaporimeter and condenser, realized promptly to the normal heat dissipation of the semiconductor device that calorific capacity is great, also realized utilizing the heat dissipation surplus of pipeline to the heat dissipation of the semiconductor device that calorific capacity is less, can carry out automatic heat dissipation distribution, the maximize has utilized the heat dissipation resource of heat dissipation pipeline; the utility model has simple structure, reasonable distribution of the heat dissipation section, reduced resource waste, and can simultaneously meet the heat dissipation requirements of semiconductor devices with different heat productivity; the data center machine room adopting the semi-radiating device can effectively reduce energy consumption, improve the radiating effect on the server and have small influence on the environment.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of a first embodiment of a data center room;

FIG. 3 is a schematic diagram of a second embodiment of a data center room;

labeled as: 1-a first semiconductor device, 2-a second semiconductor device, 3-a condenser, 4-an evaporator, 5-a liquid reservoir, 6-a capillary structure, 7-a vapor pipeline, 8-a liquid pipeline, 9-a fixing piece, 11-a machine room and 12-a server.

Detailed Description

In order to facilitate understanding of the present invention, the following description is further provided with reference to the accompanying drawings.

A heat abstractor for different calorific capacity semiconductor device carry out the heat exchange with semiconductor device through semiconductor radiating unit loop, the utility model discloses the same group of semiconductor radiating unit loop of accessible satisfies the heat dissipation capacity demand of different calorific capacity semiconductor device. As shown in fig. 1, the specific structure of the semiconductor heat dissipation unit loop in the present invention includes a condenser 3, an evaporator 4 and corresponding connecting pipelines, the outlet end of the evaporator 4 is communicated with the inlet end of the condenser 3 through a steam pipeline 7, and the outlet end of the condenser 3 is communicated with the inlet end of the evaporator 4 through a liquid pipeline 8; the evaporator 4 is in contact with and connected with the surface of the first semiconductor device 1, the second semiconductor device 2 is connected with the steam pipeline 7, the heat productivity of the first semiconductor device 1 is different from that of the second semiconductor device 2, and the heat productivity of the first semiconductor device 1 is larger than that of the second semiconductor device 2; the condenser 3 is of a tubular structure, the evaporator 4 can be of a tubular structure or a cuboid structure, and in order to increase the heat transfer area, the surface of the evaporator 4, which is in contact with the surface of the first semiconductor device 1, and the surface of the steam pipeline 7, which is in contact with the surface of the second semiconductor device 2, are flat surfaces, namely the evaporator 4 is of a semicircular tubular structure, and the connecting section of the steam pipeline 7 and the second semiconductor device 2 is a flat pipe section; in addition, because the machining process cannot process an ideal flat surface, there are small gaps on the contact surface between the evaporator 4 and the first semiconductor device 1 and on the contact surface between the steam pipeline 7 and the second semiconductor device 2, the gaps are filled with air, the thermal resistance of the air is high, and in order to reduce the thermal resistance to improve the heat dissipation performance, a heat-conducting medium is filled between the evaporator 4 and the first semiconductor device 1 and between the steam pipeline 7 and the second semiconductor device 2, and the heat-conducting medium can be selected from heat-conducting silica gel, heat-conducting silicone grease or graphite gaskets.

The utility model discloses in set up two semiconductor devices that calorific capacity is different on the same group semiconductor heat dissipation unit loop at least, if need dispel the heat to a plurality of semiconductor devices, wherein calorific capacity less semiconductor device all establishes ties on steam pipe way 7. The utility model exchanges heat between the middle evaporator 4 and the first semiconductor device 1, and the heat exchange is realized by the liquid storage device 5 in the evaporator 4, as shown in fig. 1, the liquid storage device 5 is arranged in the evaporator 4, the liquid working medium is arranged in the liquid storage device 5, the liquid working medium generally adopts common cooling water, when the utility model works, because the surface of the evaporator 4 is tightly attached to the first semiconductor device 1, the first semiconductor device 1 generates heat and transmits the heat to the evaporator 4, the liquid working medium in the liquid storage device 5 absorbs the heat and is gasified, the gasified steam working medium is transmitted into the condenser 3 through the steam pipeline 7, the second semiconductor device 2 exchanges heat with the normal temperature air in the steam pipeline 7, and the steam working medium pushes the air which exchanges heat with the second semiconductor device 2 in the original steam pipeline 7 into the condenser 3 during transmission; the condenser 3 dissipates heat through an air duct, the steam-state working medium releases heat and is converted into a liquid working medium again, and then the liquid working medium flows back to the liquid storage device 5 through the liquid pipeline 8 by the condenser 3, so that the cyclic utilization of the liquid working medium is realized.

In addition, the utility model provides a semiconductor heat dissipation unit loop can two kinds of implementation modes of gravity type loop or capillary core type loop, when adopting gravity type loop, reservoir 5 in the evaporimeter 4 is direct to be communicated with steam pipe 7, liquid pipeline 8, and condenser 3 and steam pipe 7 are located the height and are higher than the height that locates of evaporimeter 4 and liquid pipeline 8, this kind of implementation mode is through the difference in height of condenser 3 and evaporimeter 4 to low, the density is high after condensation liquefaction realizes the circulation in the loop heat pipe after the characteristics according to liquid working medium density low after the gasification of being heated, density is high after the condensation liquefaction, need not adopt other auxiliary structure; the capillary core type loop adopts a capillary structure 6, the capillary structure 6 is a tubular structure with a plurality of capillary holes distributed on the surface, the capillary structure 6 is communicated with the liquid storage device 5 and extends towards the outlet end of the evaporator 4, the liquid working medium in the liquid storage device 5 is continuously conveyed to the heat absorption section of the evaporator 4 through the capillary structure 6 by utilizing the capillary phenomenon for heat absorption, the steam working medium which absorbs heat and is gasified is discharged from the capillary holes of the capillary structure 6 and is discharged into the condenser 3 under the action of pressure difference between the steam pipeline 7 and the liquid pipeline 8.

In order to make the heat abstractor for different calorific capacity semiconductor device have better start-up effect, still can set up the starter near the entry end of evaporimeter 4, the starter is established ties in steam pipe 7, provides the thermodynamic for the semiconductor radiating element loop through the starter.

As shown in fig. 1, the second semiconductor device 2 is fixedly connected to the vapor pipe 7 by a fixing member 9, and the fixing member 9 may adopt a snap structure or a collar structure.

The heat dissipation device for semiconductor devices with different heat values continuously transfers the heat of the semiconductor devices to the outside through the cyclic utilization of the liquid working medium in the loop of the heat dissipation unit without providing power by an external mechanical device, and compared with the existing heat dissipation device and a fan, the heat dissipation device for semiconductor devices with different heat values can transfer more heat to a longer distance and avoid heat concentration; compared with the existing gravity heat pipe radiating structure, the transmission efficiency is higher, and the cost is lower; compared with a cooling mode by applying a refrigerating system, the cooling system has low energy consumption and strong reliability; and the utility model is suitable for a dispel the heat to different calorific capacity semiconductor device, under the condition of not wasting heat dissipation loop heat dissipation efficiency, utilize pipeline heat dissipation surplus to dispel the heat to less calorific capacity semiconductor device, carried out the maximize to the heat dissipation loop and utilized, realized the energy rational distribution, reduced the waste of resource.

A heat abstractor for different calorific capacity semiconductor device can be applied to in the most equipment that has a plurality of semiconductor device, and data center computer lab is then typical application ground, data center computer lab is owing to placed a large amount of servers, install a large amount of semiconductor device on the server, the semiconductor device generates heat and can make the temperature obviously rise in the data center computer lab during server work, adopt above-mentioned semiconductor device heat abstractor can effectively improve the radiating effect of data center computer lab, when setting up semiconductor device heat abstractor in the data center computer lab, set up the condenser outdoor at the data center computer lab, with the radiating unit loop with the computer lab internal on the server semiconductor device contact can, the indoor radiating unit loop can adopt parallelly connected or the form of establishing ties to be connecting the server of difference. As shown in fig. 2 and 3, for the servers 12 stacked in the same server cabinet in the same machine room 11, all the servers 12 in a single cabinet can be connected in series on a heat dissipation unit loop in a serpentine pipe-routing manner, and then the heat dissipation unit loop is communicated with the outdoor condenser 3; when a plurality of server cabinets exist indoors, the heat dissipation unit loops of each server cabinet can be connected in parallel and then communicated with the outdoor condenser 3. The machine room 11 may have a plurality of cabinets on which a plurality of layers of electronic devices are arranged, each layer of electronic device has one or more semiconductor devices, and the heat dissipation matrix formed by the heat dissipation matrix may distribute heat dissipation through the parallel cabinets in the form of semiconductor devices in the series electronic devices, or distribute heat dissipation through the series cabinets in the form of semiconductor devices in the parallel electronic devices, or distribute heat dissipation through the parallel cabinets in the form of semiconductor devices in the series electronic devices, or distribute heat dissipation through the parallel cabinets in the form of semiconductor devices in the parallel electronic devices, or distribute heat dissipation through the series-parallel alternate manner. Adopt the utility model discloses in behind the semiconductor device heat abstractor, the semiconductor device of server directly carries out the heat transfer with outdoor environment and condenser in the data center computer lab, need not initiative refrigeration cycle, and the phase transition process of utilizing working medium in the radiating element loop carries out heat transfer, does not have extra energy resource consumption, also does not have unnecessary heat production, and is less to the influence of environment, and the radiating effect of server is excellent in the computer lab, and the efficiency is than higher.

A heat abstractor for different calorific capacity semiconductor device also can be applied to air condensing units class equipment, if be applied to air condensing units, condenser 3 can set up in the wind channel of off-premises station, the fan side at the air condensing units baffle is fixed in the installation. The condenser 3 can be selected from heat exchangers of existing air conditioners, refrigerators or vehicle air conditioners, such as fin heat exchangers, microchannel heat exchangers, tube-plate heat exchangers, wire-tube heat exchangers or rotary fin heat exchangers.

Claims

1. A heat dissipation device for semiconductor devices with different heating values comprises at least two semiconductor devices with different heating values, wherein the semiconductor device (1) with larger heating value is a first semiconductor device (1), and the semiconductor device (2) with smaller heating value is a second semiconductor device (2), and is characterized in that: the semiconductor heat dissipation device comprises a first semiconductor device (1), a second semiconductor device (3) and at least one group of semiconductor heat dissipation unit loops, wherein the semiconductor heat dissipation unit loops comprise condensers (3) and evaporators (4) connected with the first semiconductor device (1), the outlet ends of the evaporators (4) are communicated with the inlet ends of the condensers (3), and the inlet ends of the evaporators (4) are communicated with the outlet ends of the condensers (3); and the second semiconductor device (2) is connected with the connecting section of the outlet end of the evaporator (4) and the inlet end of the condenser (3).

2. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 1, wherein: the evaporator (4) is communicated with the inlet end of the condenser (3) through a steam pipeline (7), and the outlet end of the condenser (3) is communicated with the evaporator (4) through a liquid pipeline (8); the second semiconductor device (2) is fixedly connected to the steam pipeline (7).

3. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 1, wherein: a liquid storage device (5) is arranged in the evaporator (4), a liquid working medium is filled in the liquid storage device (5), and the liquid storage device (5) is respectively communicated with a steam pipeline (7) and a liquid pipeline (8); the condenser (3) and the steam pipeline (7) are higher than the evaporator (4) and the liquid pipeline (8).

4. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 1, wherein: a liquid storage device (5) and a capillary structure (6) are arranged in the evaporator (4), a liquid working medium is filled in the liquid storage device (5), and the liquid storage device (5) is arranged at the inlet end of the evaporator (4); the capillary structure (6) is in communication with the reservoir (5) and extends towards the outlet end of the evaporator (4).

5. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 4, wherein: the capillary structure (6) is a tubular structure with a plurality of capillary holes distributed on the surface.

6. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 1, wherein: the condenser (3) is a fin heat exchanger, a micro-channel heat exchanger, a tube-plate heat exchanger, a wire-tube heat exchanger or a rotary fin heat exchanger.

7. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 2, wherein: the semiconductor heat dissipation unit loop also comprises a starter arranged at the inlet end of the evaporator (4), and the starter is connected in series in the steam pipeline (7).

8. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 2, wherein: the connecting section of the steam pipeline (7) and the second semiconductor device (2) is a flat pipe section, and the second semiconductor device (2) is in contact with the flat pipe section and is fixed through a fixing piece (9); the surface of the evaporator (4) contacted with the surface of the first semiconductor device (1) and the surface of the steam pipeline (7) contacted with the surface of the second semiconductor device (2) are flat surfaces.

9. The heat dissipating apparatus for semiconductor devices of different calorific values according to claim 8, wherein: and heat-conducting media are filled between the evaporator (4) and the surface of the first semiconductor device (1) and between the steam pipeline (7) and the surface of the second semiconductor device (2).

10. Data center computer lab, its characterized in that: the heat dissipating apparatus for the semiconductor device of different calorific value according to any one of claims 1 to 9 is included.