CN204923552U - A semiconductor refrigerator for circulative cooling system - Google Patents
A semiconductor refrigerator for circulative cooling system Download PDFInfo
- Publication number
- CN204923552U CN204923552U CN201520677927.9U CN201520677927U CN204923552U CN 204923552 U CN204923552 U CN 204923552U CN 201520677927 U CN201520677927 U CN 201520677927U CN 204923552 U CN204923552 U CN 204923552U
- Authority
- CN
- China
- Prior art keywords
- heat
- egr
- semiconductor
- conducting medium
- described heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor refrigerator for circulative cooling system, include: a plurality of reciprocal crosss are for folding the heat transfer unit of piling up, wherein, the heat transfer unit includes that semiconductor refrigeration layer, laminating are at the heat dissipation circulating device of semiconductor refrigeration layer cooling surface and the laminating endothermic circulating device at semiconductor refrigeration layer heat absorbent surface, heat absorption circulating device connects the heat source, heat dissipation circulating device connects heat abstractor. The utility model discloses a cold and hot alternately heat exchanger structures of multilayer, it has several quantitative limitations to break through traditional semiconductor cooler installation multi -disc semiconductor refrigeration piece in certain space, make semiconductor cooler when satisfying great cooling capacity output, have higher refrigeration energy efficiency ratio, compact structure not only, simple to operate still has higher economic benefits and social.
Description
Technical field
The utility model relates to a kind of semiconductor cooling device, particularly relates to a kind of semiconductor cooling device for circulating cooling system, belongs to semiconductor refrigerating technology field.
Background technology
At present, known semiconductor chilling plate is connected through wire with semiconductor p-type (hereinafter referred to as P type) by semiconductor N type (hereinafter referred to as N-type), is bonded at the both ends of the surface composition of N-type and P type with 2 heat carriers (being generally the potsherd of electric insulation) respectively.During semiconductor chilling plate work, the radiating surface institute liberated heat of N-type and P type, outwardly distributes through corresponding heat carrier, the required heat absorbed of heat-absorbent surface of N-type and P type, outwardly absorb through heat carrier, the heat-absorbent surface of its N-type and P type has just had the function of refrigeration.But semiconductor cooler efficiency is low, and reason is: the radiating surface of N-type and P type and heat-absorbent surface, only an end face is connected with heat carrier, causes the area of heat trnasfer little; And the radiating surface of N-type and P type and heat-absorbent surface are placed in same space, the heat that result in again between its radiating surface and heat-absorbent surface disturbs mutually.Want to improve the refrigerating efficiency of partly leading device, just need to make radiating surface temperature low as far as possible, the heat conduction velocity of radiating surface is faster, radiating effect better, and heat-absorbent surface temperature is higher, and the refrigeration of heat-absorbent surface is better.
In prior art, for the semiconductor cooler of circulating cooling system, generally all comprise: semiconductor chilling plate, water-to-water heat exchanger, metal heat sink, axial flow blower etc.Refrigerator mid portion is heat exchanger, and heat exchanger two sides is the heat-absorbent surface of semiconductor chilling plate, and the radiating surface of TEC cooling piece is aluminium alloy heat radiator.Cooling water in system water tank, flows through water-to-water heat exchanger by cooling down through circulating pump, and the heat of semiconductor chilling plate radiating surface adds axial flow blower by aluminium alloy heat radiator and dissipated.Chiller of the prior art has following defect: in semiconductor cooler, the radiating surface of semiconductor chilling plate adds axial flow blower heat radiation by aluminium alloy heat radiator, and aluminium alloy heat radiator volume is large, and can contact with semiconductor chilling plate radiating surface the limited area carrying out heat exchange, semiconductor chilling plate limited amount is installed, unsuitable expanding system refrigeration work consumption; Aluminium alloy heat radiator is positioned at the parallel distribution in both sides, and not easily form unobstructed heat dissipation wind channel, radiating efficiency is low, thus has a strong impact on the refrigerating efficiency (40%-60% refrigeration efficiency ratio) of semiconductor chilling plate; Refrigerator overall volume is large, and installation site is by the restriction of heat dissipation wind channel, and inconvenience is installed, wasting space.
Utility model content
The technical problems to be solved in the utility model is: how in certain space, to install more semiconductor cooling piece and improve radiating condition and improve refrigeration efficiency ratio.
For realizing above-mentioned utility model object, the utility model provides a kind of semiconductor cooling device for circulating cooling system, comprising: the heat exchange unit that multiple positive and negative alternate stacks;
Wherein, described heat exchange unit comprises semiconductor refrigerating layer, is fitted in the heat radiation EGR of semiconductor refrigerating layer radiating surface and is fitted in the heat absorption EGR of semiconductor refrigerating layer heat-absorbent surface;
Described heat absorption EGR connects thermal source, and described heat radiation EGR connects heat abstractor.
Wherein more preferably, described semiconductor refrigerating layer is the semiconductor chilling plate that multi-disc level is laid.
Wherein more preferably, described heat radiation EGR hollow, is connected with heat-conducting medium capable of circulation in described heat radiation EGR;
Described heat absorption EGR hollow, is connected with heat-conducting medium capable of circulation in described heat absorption EGR.
Wherein more preferably, described heat radiation EGR connects described heat abstractor by heat radiation circulation line, and described heat abstractor is air-cooled radiating device.
Wherein more preferably, described heat radiation circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described heat abstractor form heat radiation closed circuit.
Wherein more preferably, air-cooled radiating device comprises wind-cooling heat dissipating row and blower fan, and described heat radiation row is provided with radiating fin, and described blower fan is fixed on described radiating fin both sides, both sides crosswind machine rotating in same direction.
Wherein more preferably, described heat absorption EGR connects described thermal source by heat absorption circulation line.
Wherein more preferably, described heat absorption circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described thermal source form heat radiation closed circuit.
Wherein more preferably, described heat-conducting medium is conduction oil or water.
Wherein more preferably, adjacent described heat exchange unit shares heat radiation EGR or heat absorption EGR.
The semiconductor cooling device for circulating cooling system that the utility model provides, adopts the cold and hot cross exchanger structure of multilayer, and more semiconductor cooling piece installed by breakthrough conventional semiconductors refrigerator in certain space several quantitative limitation; Make semiconductor cooler while meeting larger refrigeration work consumption output, there is higher refrigeration efficiency ratio; Improve the radiating efficiency in semiconductor cooler for heat dissipation face, ensure that semiconductor cooler comparatively has high refrigeration efficiency ratio further.The semiconductor cooling device for circulating cooling system that the utility model provides, not only compact conformation, the refrigeration efficiency ratio also with 85%-120% easy for installation, far away higher than traditional semiconductor cooler product refrigeration efficiency ratio, has higher economic benefit and social benefit.
Accompanying drawing explanation
Fig. 1 is the utility model semiconductor cooling device connection diagram;
Fig. 2 is the utility model heat exchange unit structural representation;
Fig. 3 is the semiconductor heat exchange unit STRUCTURE DECOMPOSITION schematic diagram shown in Fig. 2;
Fig. 4 is the utility model semiconductor cooling device structural representation;
Fig. 5 is semiconductor refrigerating Rotating fields schematic diagram;
Fig. 6 is that semiconductor refrigerating layer cooling piece lays one of schematic diagram;
Fig. 7 is that semiconductor refrigerating layer cooling piece lays schematic diagram two;
Fig. 8 is heat absorption EGR and one of heat radiation EGR structural representation;
Fig. 9 is heat absorption EGR and heat radiation EGR structural representation two;
Figure 10 is the EGR of heat radiation shown in Fig. 8 front elevation;
Figure 11 is the EGR of heat radiation shown in Fig. 8 internal structure schematic diagram;
Figure 12 is the EGR of heat radiation shown in Fig. 9 front elevation;
Figure 13 is the EGR of heat radiation shown in Fig. 9 internal structure schematic diagram;
Figure 14 is the utility model semiconductor cooling device expansion semiconductor heat exchange unit structural representation;
Figure 15 is the semiconductor cooling device structural representation that the utility model adopts heat absorption EGR shown in Fig. 8 and heat radiation EGR;
Figure 16 is the semiconductor cooling device structural representation that the utility model adopts heat absorption EGR shown in Fig. 9 and heat radiation EGR;
Figure 17 is the utility model semiconductor cooling device and air-cooled radiating device connection diagram;
Figure 18 is the utility model heat radiation circulation line connection diagram;
Figure 19 is the utility model air-cooled radiating device structural representation;
Figure 20 is the utility model heat absorption circulation line connection diagram.
Detailed description of the invention
Below in conjunction with drawings and Examples, detailed description of the invention of the present utility model is described in further detail.Following examples for illustration of the utility model, but are not used for limiting scope of the present utility model.
As shown in Figures 1 to 4, the utility model provides a kind of semiconductor cooling device for circulating cooling system, comprising: the heat exchange unit 1 that multiple positive and negative alternate stacks; Wherein, heat exchange unit 1 comprises semiconductor refrigerating layer 10, is fitted in the heat radiation EGR 11 of the radiating surface 101 of semiconductor refrigerating layer 10 and is fitted in the heat absorption EGR 12 of heat-absorbent surface 102 of semiconductor refrigerating layer 10; Heat absorption EGR 12 connects thermal source 2, and heat radiation EGR connects heat abstractor 3.Detailed description is launched to the semiconductor cooling device for circulating cooling system that the utility model provides below.
As shown in Figure 5, Figure 6, in each heat exchange unit 1, semiconductor refrigerating layer 10 comprises more semiconductor cooling piece 100, and more semiconductor cooling piece 100 can according to power requirement or actual conditions serial or parallel connection.The semiconductor refrigerating layer 10 that more semiconductor cooling piece 100 forms comprises a radiating surface 101 and a heat-absorbent surface 102, the radiating surface of more semiconductor cooling piece 100 in the same way (heat-absorbent surface of all semiconductor chilling plates or radiating surface are in same direction) level lay formed have larger heat-absorbent surface and radiating surface semiconductor refrigerating layer 10.As shown in Figure 7, general semiconductor refrigerating layer considers the space that semiconductor cooling device is installed and volume size, and semiconductor chilling plate 100 can adopt single setting or arrange setting more.Correspondingly, the heat absorption EGR 12 of the heat radiation EGR 11 being fitted in the radiating surface 101 of semiconductor refrigerating layer 10 and the heat-absorbent surface 102 being fitted in semiconductor refrigerating layer 10, all needs to do corresponding adjustment according to the area of the radiating surface 101 of semiconductor refrigerating layer 10 or the area of heat-absorbent surface 102.In order to absolute raising refrigerating efficiency, increase Energy Efficiency Ratio, preferably by identical with the area of the area of the contact surface of semiconductor refrigerating layer 10 and the radiating surface of semiconductor refrigerating layer 10 for heat radiation EGR 11, the EGR 12 that in like manner absorbs heat is identical with the area of the area of the contact surface of semiconductor refrigerating layer 10 and the heat-absorbent surface of semiconductor refrigerating layer 10.In the utility model, the contact surface between preferably adjacent heat exchange unit 1 also scribbles heat-conducting silicone grease; Preferably on the radiating surface 101 of semiconductor refrigerating layer 10 and the contact surface of heat radiation EGR 11, also scribble heat-conducting silicone grease; Preferably on the heat-absorbent surface 102 of semiconductor refrigerating layer 10 and the contact surface of heat absorption EGR 12, also scribble heat-conducting silicone grease.
As shown in Figure 8, Figure 9, in order to ensure that the heat of thermal source is taken away by semiconductor cooling device in time further, improving refrigerating efficiency as far as possible, improving Energy Efficiency Ratio, heat radiation EGR 11 preferably hollow, is connected with heat-conducting medium capable of circulation in heat radiation EGR 11; Heat absorption EGR 12 hollow, is connected with heat-conducting medium capable of circulation in heat absorption EGR 12.Heat-conducting medium can be organic heat-conducting medium, also can be inorganic heat-conducting medium.Heat-conducting medium is preferably conduction oil or water.In order to cut down finished cost, heat radiation EGR 11 preferably adopts identical structure member with heat absorption EGR 12.For heat abstractor 11, its concrete structure is described in detail below.
As shown in Fig. 8 to Figure 10, heat abstractor 11 has two parallel up and down planes, makes heat abstractor 11 better fit tightly the radiating surface of semiconductor refrigerating layer 10.As shown in Figure 11 figure to 13, in order to the contact area strengthening heat-conducting medium in heat abstractor 11 is quick as far as possible, heat is taken away, heat abstractor 11 hollow is arranged, and is also provided with maze lattice 111, forms the passage 112 that heat-conducting medium flows through between adjacent labyrinth 111 in heat abstractor 11 inside.As shown in Fig. 8 to Figure 13, the outlet 120 of heat-conducting medium entrance 110 and heat-conducting medium can be arranged on the same one or both ends of heat abstractor 11 by heat abstractor 11 according to the actual requirements.
As shown in Fig. 4, Figure 14 to Figure 16, the semiconductor cooling device for circulating cooling system that the utility model provides adopts multiple heat exchange unit 1 positive and negative alternate to stack, the quantity of semiconductor chilling plate 100 can be increased in limited space more, thus improve the refrigeration work consumption of semiconductor cooling device, improve Energy Efficiency Ratio.Adopt the semiconductor cooling device for circulating cooling system that provides of the utility model can Longitudinal Extension heat exchange unit 1 according to actual needs, to increase the refrigeration work consumption (such as can at existing heat exchange unit 1 set up heat exchange unit 1 up and down) of semiconductor cooling device.In addition as shown in Figure 15, Figure 16, for saving semiconductor cooling device height in a longitudinal direction further, adjacent heat exchange unit 1 shares heat radiation EGR 11 or heat absorption EGR 12.The space of saving in this way can also increase heat exchange unit further, thus improves the refrigeration work consumption of semiconductor cooling device, improves Energy Efficiency Ratio.In addition as shown in Figure 15, Figure 16, when multiple heat exchange unit 1 positive and negative alternate stacks, heat abstractor 11 or the heat absorption EGR 12 of multiple hot cell 1 can be connected by pipeline.As shown in figure 15, if adopt heat abstractor 11 two ends shown in Fig. 8, Figure 10, Figure 11 to arrange the outlet 120 of heat-conducting medium entrance 110 and heat-conducting medium respectively, when the heat abstractor 11 of multiple heat exchange unit 1 or heat absorption EGR 12 are connected, the two ends of multiple heat exchange unit 1 are provided with connecting line, and possible volume is larger.As shown in figure 16, if adopt the heat abstractor 11 shown in Fig. 9, Figure 12, Figure 13 to arrange the outlet 120 of heat-conducting medium entrance 110 and heat-conducting medium with one end, when the heat abstractor 11 of multiple heat exchange unit 1 or heat absorption EGR 12 are connected, only same one end of multiple heat exchange unit 1 is provided with connecting line, relative to the semiconductor cooling device small volume shown in Figure 15.
As shown in Fig. 1, Figure 17, heat radiation EGR connects heat abstractor by heat radiation circulation line, and heat abstractor is air-cooled radiating device 30.As shown in figure 18, heat radiation circulation line comprises heat-conducting medium case 31 and heat-conducting medium circulating pump 32, and heat-conducting medium case 31, heat-conducting medium circulating pump 31, heat radiation EGR 12, air-cooled radiating device 30 are connected and formed heat radiation closed circuit.As shown in figure 19, air-cooled radiating device comprises wind-cooling heat dissipating row and blower fan, and heat radiation row is provided with radiating fin, and blower fan is fixed on radiating fin both sides, both sides crosswind machine rotating in same direction.
The EGR of heat absorption shown in 0 connects thermal source by heat absorption circulation line as shown in Figure 1, Figure 2.Heat absorption circulation line comprises heat-conducting medium case 21 and heat-conducting medium circulating pump 22, and heat-conducting medium case 21, heat-conducting medium circulating pump 22, heat absorption EGR 11, thermal source 2 are connected and formed heat radiation closed circuit.
In sum, the semiconductor cooling device for circulating cooling system that the utility model provides, adopts the cold and hot cross exchanger structure of multilayer, and more semiconductor cooling piece installed by breakthrough conventional semiconductors refrigerator in certain space several quantitative limitation; Make semiconductor cooler while meeting larger refrigeration work consumption output, there is higher refrigeration efficiency ratio; Improve the radiating efficiency in semiconductor cooler for heat dissipation face, ensure that semiconductor cooling device possesses higher refrigeration efficiency ratio further.The utility model is compact conformation not only, and easy for installation.Also there is the refrigeration efficiency ratio of 85%-120%, far away higher than the refrigeration efficiency ratio of traditional semiconductor cooler product, there is higher economic benefit and social benefit.
Above embodiment is only for illustration of the utility model; and be not limitation of the utility model; the those of ordinary skill of relevant technical field; when not departing from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.
Claims (10)
1. for a semiconductor cooling device for circulating cooling system, it is characterized in that, comprising: the heat exchange unit that multiple positive and negative alternate stacks;
Wherein, described heat exchange unit comprises semiconductor refrigerating layer, is fitted in the heat radiation EGR of semiconductor refrigerating layer radiating surface and is fitted in the heat absorption EGR of semiconductor refrigerating layer heat-absorbent surface;
Described heat absorption EGR connects thermal source, and described heat radiation EGR connects heat abstractor.
2. semiconductor cooling device as claimed in claim 1, is characterized in that, described semiconductor refrigerating layer is the semiconductor chilling plate that multi-disc level is laid.
3. semiconductor cooling device as claimed in claim 1, it is characterized in that, described heat radiation EGR hollow, is connected with heat-conducting medium capable of circulation in described heat radiation EGR;
Described heat absorption EGR hollow, is connected with heat-conducting medium capable of circulation in described heat absorption EGR.
4. semiconductor cooling device as claimed in claim 3, is characterized in that, described heat radiation EGR connects described heat abstractor by heat radiation circulation line, and described heat abstractor is air-cooled radiating device.
5. semiconductor cooling device as claimed in claim 4, it is characterized in that, described heat radiation circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described heat abstractor form heat radiation closed circuit.
6. semiconductor cooling device as claimed in claim 4, is characterized in that, air-cooled radiating device comprises wind-cooling heat dissipating row and blower fan, and described heat radiation row is provided with radiating fin, and described blower fan is fixed on described radiating fin both sides, both sides crosswind machine rotating in same direction.
7. semiconductor cooling device as claimed in claim 3, is characterized in that, described heat absorption EGR connects described thermal source by heat absorption circulation line.
8. semiconductor cooling device as claimed in claim 7, it is characterized in that, described heat absorption circulation line comprises heat-conducting medium case and heat-conducting medium circulating pump, and described heat-conducting medium case, heat-conducting medium circulating pump, described heat radiation EGR, the series connection of described thermal source form heat radiation closed circuit.
9. semiconductor cooling device as claimed in claim 3, it is characterized in that, described heat-conducting medium is conduction oil or water.
10. semiconductor cooling device as claimed in claim 1, is characterized in that, adjacent described heat exchange unit shares heat radiation EGR or heat absorption EGR.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520677927.9U CN204923552U (en) | 2015-09-02 | 2015-09-02 | A semiconductor refrigerator for circulative cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520677927.9U CN204923552U (en) | 2015-09-02 | 2015-09-02 | A semiconductor refrigerator for circulative cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204923552U true CN204923552U (en) | 2015-12-30 |
Family
ID=54972673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520677927.9U Expired - Fee Related CN204923552U (en) | 2015-09-02 | 2015-09-02 | A semiconductor refrigerator for circulative cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204923552U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105180504A (en) * | 2015-09-02 | 2015-12-23 | 北京三相典创科技有限公司 | Semiconductor refrigeration device for circulating cooling system |
| CN111045502A (en) * | 2019-12-23 | 2020-04-21 | 联想(北京)有限公司 | Combined type cooling system and electronic device |
-
2015
- 2015-09-02 CN CN201520677927.9U patent/CN204923552U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105180504A (en) * | 2015-09-02 | 2015-12-23 | 北京三相典创科技有限公司 | Semiconductor refrigeration device for circulating cooling system |
| WO2017036283A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Semiconductor refrigerating device for circulation cooling system |
| CN111045502A (en) * | 2019-12-23 | 2020-04-21 | 联想(北京)有限公司 | Combined type cooling system and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105180504A (en) | Semiconductor refrigeration device for circulating cooling system | |
| US10727149B2 (en) | Thermally superconducting heat dissipation device and manufacturing method thereof | |
| CN105066507A (en) | Air-cooling semiconductor refrigeration device for circulating cooling system | |
| CN203943523U (en) | A kind of semiconductor refrigerating drinking water apparatus | |
| CN101510533B (en) | Novel microelectronic device radiator | |
| KR100986657B1 (en) | An apparatus for thermoelectric generator and cooling | |
| CN106855741B (en) | Heat dissipation device and system for blade server chip | |
| CN103167780A (en) | Combined type radiator for power module and combined type radiator assembly | |
| CN103199316A (en) | Battery pack and heat radiation structure thereof | |
| CN107219907A (en) | A kind of air-cooled water-filled radiator for electronic equipment | |
| CN203859970U (en) | Cooling-used double-layer cooling plate and electronic component cooling device | |
| CN204923552U (en) | A semiconductor refrigerator for circulative cooling system | |
| CN203690053U (en) | Cooling device applied to large transformer | |
| CN204598547U (en) | A kind of liquid cooling plate for electric motor car | |
| CN203476479U (en) | Radiator water tank and radiator of automobile and automobile | |
| CN206118269U (en) | Cooling back installation of change of current valve | |
| CN204923553U (en) | A air -cooled semiconductor refrigerator for circulative cooling system | |
| CN205979674U (en) | Special radiator of LED lamp | |
| CN201894036U (en) | Honeycomb water-cooling radiator | |
| CN201852351U (en) | Omnibearing placed cold-heat complementary comprehensive heat exchanger | |
| CN211909533U (en) | Uniform-temperature air-cooled radiator | |
| CN203518758U (en) | Efficient circulating corrugated fin structure | |
| CN202501656U (en) | Heat exchanger | |
| CN109037833B (en) | Energy-saving battery radiator for electric automobile | |
| CN203120349U (en) | Evaporation-cooled device for cabinet body of power device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20210902 |