CN107219907A - A kind of air-cooled water-filled radiator for electronic equipment - Google Patents
A kind of air-cooled water-filled radiator for electronic equipment Download PDFInfo
- Publication number
- CN107219907A CN107219907A CN201710566722.7A CN201710566722A CN107219907A CN 107219907 A CN107219907 A CN 107219907A CN 201710566722 A CN201710566722 A CN 201710566722A CN 107219907 A CN107219907 A CN 107219907A
- Authority
- CN
- China
- Prior art keywords
- water
- fin
- radiator
- cooled
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of air-cooled water-filled radiator for electronic equipment, including radiator frame and the first fin and the second fin on radiator frame；The two ends of first fin and the second fin are equipped with some grafting blocks, the side plate at radiator frame two ends and are accordingly provided with jack, and the first fin and the second fin are fixed on radiator frame by grafting cooperation；First fin is located at the top of radiator frame, is directly contacted with electronic equipment；Offered on first fin and water cooled pipeline is installed in Pipe installing groove, Pipe installing groove, the water intake end of water cooled pipeline and water side are connected through one end of radiator frame and with outside circulation；Second fin is located at the middle part of radiator frame inner chamber, and the second fin is provided with multiple radiator fans.The air-cooled water-filled radiator of the present invention, heat-sinking capability is strong, can be easy to use according to fin is changed the need for radiating.
Description
Technical field
The present invention relates to heat spreader structures field, and in particular to one kind is used for the wind of electronic equipment, especially PC
Cold water cold type radiator.
Background technology
With the continuous improvement of electronics miniaturization, high performance and multifunction requirement, the processing of electronic equipment center
The performance more and more higher of the element such as device (CPU) and video card, element heat flow density is significantly increased therewith, subelement running hours
Larger temperature rise can be produced, if radiated not in time, the stability that the realization of systemic-function will be directly affected and worked long hours.Mesh
Fin adds the heat abstractor of fan to be more and more difficult to solve the heat dissipation problem in electronic equipment small space in preceding electronic equipment,
Water-cooled power converter with great heat radiation effect provides the another program solved the problems, such as.
The content of the invention
It is an object of the invention to overcome the problem above that prior art is present there is provided a kind of for the air-cooled of electronic equipment
Water-filled radiator, air-cooled water-filled radiator of the invention radiates by the way of air-cooled and water cooling is combined to electronic device,
Significantly enhance heat-sinking capability；Secondly, the need for can also be according to radiating, the fin in more heat exchange radiator be easy to use.
To realize above-mentioned technical purpose and the technique effect, the present invention is achieved through the following technical solutions：
A kind of air-cooled water-filled radiator for electronic equipment, including radiator frame and from top to bottom on be sequentially arranged in
The first fin and the second fin on the radiator frame；
The two ends of first fin and the second fin are equipped with some grafting blocks, the radiator frame two ends
Jack is accordingly provided with side plate, first fin and the second fin are coordinated by grafting is fixed on the radiator frame
On frame；
First fin is located at the top of radiator frame, is directly contacted with electronic equipment；First fin
On offer in Pipe installing groove, the Pipe installing groove water cooled pipeline, the water intake end of the water cooled pipeline and water outlet be installed
Hold through one end of the radiator frame and connected with outside circulation；
Second fin is located at the middle part of radiator frame inner chamber, and second fin is provided with multiple radiation airs
Fan.
Optionally, in the air-cooled water-filled radiator of electronic equipment is previously described for, each side plate of the radiator frame
Multiple heat emission holes are equipped with upper and bottom plate.
Optionally, in the air-cooled water-filled radiator of electronic equipment is previously described for, the bottom plate of the radiator is provided with
Multiple support feets.
Optionally, in the air-cooled water-filled radiator of electronic equipment is previously described for, on the outer surface of the water cooled pipeline
It is coated with heat-conducting layer.
Optionally, in the air-cooled water-filled radiator of electronic equipment is previously described for, the water cooled pipeline, the first fin
It is prepared from the second fin by aluminium alloy, the radiator frame is prepared from by plastics.
Optionally, in the air-cooled water-filled radiator of electronic equipment is previously described for, the air-cooled water-filled radiator is also wrapped
Cyclic water tank and micropump are included, the cyclic water tank is connected with the water intake end of water cooled pipeline and water side respectively by transfer tube；
The micropump is used to the water in cyclic water tank is circulated in water cooled pipeline.
The beneficial effects of the invention are as follows:
The air-cooled water-filled radiator for electronic equipment of the present invention, by setting water cooled pipeline in the first fin,
Radiator fan is set in the second fin, so as to combine water cooling and air-cooled two kinds of radiating modes, radiating is significantly enhanced
The heat-sinking capability of device.
The air-cooled water-filled radiator for electronic equipment of the present invention, the first fin and the second fin are removably
It is connected on radiator frame, according to different radiating needs, replaceable different fin preferably meets the need of radiating
Ask.
The air-cooled water-filled radiator for electronic equipment of the present invention, is provided with multiple on the bottom plate of radiator frame
Spike, the support feet gets up radiator frame supporting so that heat to distribute space bigger, improve heat-sinking capability.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
The embodiment of the present invention is shown in detail by following examples and its accompanying drawing.
Brief description of the drawings
Technical scheme in technology in order to illustrate the embodiments of the present invention more clearly, in being described below to embodiment technology
The required accompanying drawing used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present invention
Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is the structural representation of the air-cooled water-filled radiator according to one embodiment of the present invention；
Fig. 2 is the top view of the first fin in Fig. 1；
Fig. 3 is the top view of the second fin in Fig. 1；
Fig. 4 is the upward view of bottom plate in Fig. 1；
Fig. 5 is the structural representation of support feet in Fig. 4.
Wherein：1st, radiator frame；11st, side plate；111st, jack；12nd, bottom plate；13rd, support feet；131st, pedestal；132nd, prop up
Strut；14th, heat emission hole；2nd, the first fin；21st, water cooled pipeline；211st, water intake end；212nd, water side；22nd, grafting block；3rd,
Two fin；31st, radiator fan；4th, cyclic water tank；41st, transfer tube；42nd, micropump.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The air-cooled water-filled radiator for electronic equipment of the present invention, it is adaptable to various electronic equipments, especially personal electricity
Brain.
Fig. 1 is shown to be shown according to the structure of the air-cooled water-filled radiator for electronic equipment of one embodiment of the present invention
It is intended to.
From figure 1 it appears that the air-cooled water-filled radiator include radiator frame 1 and from top to bottom on be sequentially arranged in
The first fin 2 and the second fin 3 on radiator frame 1；In the present embodiment, radiator frame 1 is a frame structure, its
Multiple heat emission holes 14 are equipped with upper end open, other each side plates 11 and bottom plate 12, facilitate the circulation of air and distributing for heat；
In other embodiments, it is in other structures that radiator frame 1 is settable.Radiator frame 1 is preferably to be prepared from by plastics
So that it has lightweight, it is high-strength the characteristics of.Refer in Fig. 4-5, the present embodiment, provided with many on the bottom plate 12 of radiator
Individual support feet 13, the support feet 13 includes section of pedestal 131 and the support bar 132 being arranged on pedestal 131, wherein pedestal 131
Area is noticeably greater than support bar 132, so as to ensure that the stability of support.The support feet 13 gets up the supporting of radiator frame 1,
So that heat to distribute space bigger, improve heat-sinking capability.
The two ends for referring to the fin 3 of Fig. 2-3, the first fin 2 and second are equipped with some grafting blocks 22, radiator frame
Jack 111 is accordingly provided with the side plate 11 at the two ends of frame 1, above-mentioned grafting block 22 is accordingly plugged in jack 111, so that
First fin 2 and the second fin 3 are removably installed on radiator frame 1.Those skilled in the art will be seen that,
One fin 2 and the second fin 3 include but is not limited to be fixed on radiator frame 1 with inserting mode, such as use clamping side
Formula etc..First fin 2 is installed on the top of radiator frame 1, and it is directly contacted with electronic equipment when in use；First
Offered on fin 1 water cooled pipeline 21 is installed in Pipe installing groove (not shown), Pipe installing groove, water cooled pipeline 21 enters
Water end (W.E.) 211 and water side 212 are connected through one end of radiator frame 1 and with outside circulation.In the present embodiment,
Heat conducting coating (not shown) is coated with the outer surface of water cooled pipeline 21, the heat conducting coating can lift the capacity of heat transmission, can be preferably
Conduct heat in recirculated water.
Fig. 3 is referred to, the second fin 3 is located at the middle part of the inner chamber of radiator frame 1, and the second fin 3 is provided with multiple
Radiator fan 31.In use, radiator fan 31 can in heat radiation framework 1 air circulation, set so as to take away electronics
The standby heat produced.In the present invention, the first fin 2 is directly contacted with electronic equipment, the recirculated water band in water cooled pipeline 21
Most of heat of electronic equipment generation is walked, radiator fan 31 taken away the heat of remainder, by water cooling and air-cooled
Coordinate, improve the heat-sinking capability of radiator.It is preferred that, the first fin 2, the second fin 3 and water cooled pipeline 21 be by
What aluminium alloy was prepared from, its light weight, the capacity of heat transmission are good.
In radiator in use, when electronic equipment caloric value is excessive, the heat-sinking capability of radiator is not enough, now
Need to buy the strong radiator of new, heat-sinking capability again, cause to waste.And the air-cooled water-filled radiator of the present invention, it first
The fin 3 of fin 2 and second be all it is replaceable, by change that water cooled pipeline 21 is more and/or the power of radiator fan 31 more
Big fin, you can the heat-sinking capability of increase radiator, so as to remove more heat exchange radiator from, adds expanding for radiator
Malleability, it is to avoid waste.Secondly, the caloric value of electronic equipment different zones is different, using traditional radiator, can cause part
The hypodynamic situation of heat radiation energy occur.Such as using the radiator of the present invention, by selecting that there are more water coolings in correspondence position
First fin 2 of pipeline 21, you can the local heat-sinking capability of increase radiator, the need for meeting radiating.
Fig. 1 is referred to, the air-cooled water-filled radiator of the present embodiment also includes cyclic water tank 4 and micropump 42, cyclic water tank 4
Connected respectively with the water intake end 211 of water cooled pipeline 21 and water side 212 by transfer tube 41；Micropump 42 is used to cause recirculated water
Water in case 4 is circulated in water cooled pipeline 21.When in use, water is added into cyclic water tank 4, upper water cooling tube is then connected
The water intake end 211 in road 21 and water side 212, start micropump 42, you can Water-cooling circulating is produced, using very convenient.In order to enter
One step heat radiation ability, can add ice cube in cyclic water tank 4.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (6)
1. a kind of air-cooled water-filled radiator for electronic equipment, it is characterised in that including radiator frame and from top to bottom
On be sequentially arranged in the first fin and the second fin on the radiator frame；
The two ends of first fin and the second fin are equipped with some grafting blocks, the side plate at the radiator frame two ends
On accordingly be provided with jack, first fin and the second fin by grafting coordinate is fixed on the radiator frame
On；
First fin is located at the top of radiator frame, is directly contacted with electronic equipment；Opened on first fin
Provided with Pipe installing groove, water cooled pipeline is installed in the Pipe installing groove, the water intake end of the water cooled pipeline and water side are worn
Cross one end of the radiator frame and connected with outside circulation；
Second fin is located at the middle part of radiator frame inner chamber, and second fin is provided with multiple radiator fans.
2. it is used for the air-cooled water-filled radiator of electronic equipment as claimed in claim 1, it is characterised in that the radiator frame
Each side plate on and bottom plate on be equipped with multiple heat emission holes.
3. it is used for the air-cooled water-filled radiator of electronic equipment as claimed in claim 1, it is characterised in that the bottom of the radiator
Plate is provided with multiple support feets.
4. it is used for the air-cooled water-filled radiator of electronic equipment as claimed in claim 1, it is characterised in that the water cooled pipeline
Heat-conducting layer is coated with outer surface.
5. it is used for the air-cooled water-filled radiator of electronic equipment as claimed in claim 1, it is characterised in that the water cooled pipeline,
What the first fin and the second fin were prepared from by aluminium alloy, the radiator frame is prepared from by plastics.
6. it is used for the air-cooled water-filled radiator of electronic equipment as claimed in claim 1, it is characterised in that the air-cooled water cooling dissipates
Hot device also includes cyclic water tank and micropump, and the cyclic water tank passes through transfer tube water intake end respectively with water cooled pipeline and water outlet
End connection；The micropump is used to make the water in cyclic water tank circulate in water cooled pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566722.7A CN107219907A (en) | 2017-07-12 | 2017-07-12 | A kind of air-cooled water-filled radiator for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710566722.7A CN107219907A (en) | 2017-07-12 | 2017-07-12 | A kind of air-cooled water-filled radiator for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107219907A true CN107219907A (en) | 2017-09-29 |
Family
ID=59952392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710566722.7A Withdrawn CN107219907A (en) | 2017-07-12 | 2017-07-12 | A kind of air-cooled water-filled radiator for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107219907A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107756365A (en) * | 2017-10-26 | 2018-03-06 | 无锡杰森表面处理设备有限公司 | Intermetallic composite coating water cooling spreading for cooling platform |
| CN109246020A (en) * | 2018-10-19 | 2019-01-18 | 合肥享淘科技有限公司 | A kind of novel computer network router |
| CN109960385A (en) * | 2017-12-26 | 2019-07-02 | 技嘉科技股份有限公司 | Have the radiator that fan may be reversed and has the motherboard of radiator |
| CN110968173A (en) * | 2019-11-01 | 2020-04-07 | 苏州永腾电子制品有限公司 | Combined water-cooling radiator |
| CN111026251A (en) * | 2019-11-01 | 2020-04-17 | 苏州永腾电子制品有限公司 | High-efficiency combined heat dissipation type CPU radiator |
| CN111629569A (en) * | 2020-06-23 | 2020-09-04 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
| CN111629561A (en) * | 2020-05-09 | 2020-09-04 | 安徽春辉仪表线缆集团有限公司 | Automatic change instrument and meter heat-proof device |
-
2017
- 2017-07-12 CN CN201710566722.7A patent/CN107219907A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107756365A (en) * | 2017-10-26 | 2018-03-06 | 无锡杰森表面处理设备有限公司 | Intermetallic composite coating water cooling spreading for cooling platform |
| CN109960385A (en) * | 2017-12-26 | 2019-07-02 | 技嘉科技股份有限公司 | Have the radiator that fan may be reversed and has the motherboard of radiator |
| CN109246020A (en) * | 2018-10-19 | 2019-01-18 | 合肥享淘科技有限公司 | A kind of novel computer network router |
| CN110968173A (en) * | 2019-11-01 | 2020-04-07 | 苏州永腾电子制品有限公司 | Combined water-cooling radiator |
| CN111026251A (en) * | 2019-11-01 | 2020-04-17 | 苏州永腾电子制品有限公司 | High-efficiency combined heat dissipation type CPU radiator |
| CN111629561A (en) * | 2020-05-09 | 2020-09-04 | 安徽春辉仪表线缆集团有限公司 | Automatic change instrument and meter heat-proof device |
| CN111629569A (en) * | 2020-06-23 | 2020-09-04 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
| CN111629569B (en) * | 2020-06-23 | 2022-06-21 | 镇江元普电子科技有限公司 | Electronic radiator with air cooling and water cooling combined |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107219907A (en) | A kind of air-cooled water-filled radiator for electronic equipment | |
| CN206147457U (en) | Computer case efficient in heat radiation | |
| CN105180504A (en) | Semiconductor refrigeration device for circulating cooling system | |
| CN108153401A (en) | A kind of computer server radiator | |
| CN104125759A (en) | Liquid-cooled radiating server cabinet | |
| CN210896901U (en) | Oil-immersed transformer with heat dissipation function | |
| CN206895115U (en) | A kind of radiator of electronics | |
| CN108227883A (en) | A kind of huge computer servers radiator | |
| CN203673428U (en) | Notebook computer heat dissipation base | |
| CN206042648U (en) | High -power power supply unit with hot superconductive heat radiator | |
| CN205648307U (en) | Water cooling device used for cooling electronic device | |
| CN210007821U (en) | kinds of 5G base station cooling system | |
| CN203015356U (en) | Liquid-cooling radiator | |
| CN207067913U (en) | A kind of air-cooled water-filled radiator for electronic equipment | |
| CN206430294U (en) | A kind of computer server heat dissipation system for computer room | |
| CN105758226A (en) | Outdoor air cooling radiator | |
| CN204923552U (en) | A semiconductor refrigerator for circulative cooling system | |
| CN104914949A (en) | Combined type computer water-cooling heat dissipation device | |
| CN205979674U (en) | Special radiator of LED lamp | |
| CN206018858U (en) | Electric controller and air-conditioner outdoor unit based on hot superconductive radiating plate | |
| CN207283497U (en) | Solar cell module cools down platform | |
| CN207674760U (en) | A kind of Wind-cooling type semiconductor cooling device | |
| CN104124490B (en) | Panel heat radiator | |
| CN207909065U (en) | A kind of huge computer servers radiator | |
| CN207909067U (en) | A kind of computer server radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170929 |