CN203673428U - Notebook computer heat dissipation base - Google Patents
Notebook computer heat dissipation base Download PDFInfo
- Publication number
- CN203673428U CN203673428U CN201420027539.1U CN201420027539U CN203673428U CN 203673428 U CN203673428 U CN 203673428U CN 201420027539 U CN201420027539 U CN 201420027539U CN 203673428 U CN203673428 U CN 203673428U
- Authority
- CN
- China
- Prior art keywords
- heat
- dissipating
- cavity
- heat dissipation
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 10
- 238000005057 refrigeration Methods 0.000 claims abstract description 32
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000004411 aluminium Substances 0.000 claims description 24
- 238000009423 ventilation Methods 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 9
- 235000012149 noodles Nutrition 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000005192 partition Methods 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型涉及笔记本电脑散热领域，具体的说是涉及一种笔记本电脑散热底座。包括底座外壳，半导体制冷片，底座外壳被隔板分成制冷腔体和散热腔体两个相对独立的空间，在制冷腔体内安装有涡轮风扇和冷却铜板，在散热腔体内安装有轴流风扇和散热铝板，冷却铜板与半导体制冷片的冷面贴合，散热铝板与半导体制冷片的热面贴合，冷却铜板和散热铝板均设有鳍片组，通过涡轮风扇、轴流风扇、鳍片组以及热导管的强化热交换措施，制出大量冷却空气，以此冷却电脑内部。本实用新型的有益效果在于：制冷面和散热面与半导体制冷片的冷、热面分别完全紧密贴合接触，结构紧凑，换热效果更高，制冷效果更好。
The utility model relates to the field of notebook computer heat dissipation, in particular to a notebook computer heat dissipation base. Including the base shell, the semiconductor cooling chip, the base shell is divided into two relatively independent spaces by the partition plate, the cooling cavity and the heat dissipation cavity, the turbo fan and the cooling copper plate are installed in the cooling cavity, and the axial flow fan and the heat dissipation cavity are installed in the heat dissipation cavity. The heat dissipation aluminum plate, the cooling copper plate is bonded to the cold surface of the semiconductor refrigeration sheet, and the heat dissipation aluminum plate is bonded to the hot surface of the semiconductor refrigeration sheet. Both the cooling copper plate and the heat dissipation aluminum plate are equipped with fin groups. As well as the enhanced heat exchange measures of the heat pipe, a large amount of cooling air is produced to cool the inside of the computer. The beneficial effect of the utility model is that: the cooling surface and the heat dissipation surface are completely in close contact with the cold and hot surfaces of the semiconductor refrigeration sheet respectively, the structure is compact, the heat exchange effect is higher, and the cooling effect is better.
Description
Technical field
The utility model relates to laptop radiating field, relates to specifically a kind of holder for dissipating heat of laptop computer.
Background technology
Current notebook computer internal heat dissipating effect is on the market poor, in the time that computer is long playing, amount of heat accumulates in CPU annex and distributes and do not go out, affect the serviceable life of CPU and the fortune performance of notebook computer, therefore need efficient cooling device to carry out cooling to the air that enters notebook computer.
Summary of the invention
The purpose of this utility model is to address the above problem, and a kind of holder for dissipating heat of laptop computer is provided.
In order to realize the purpose of this utility model, the technical solution adopted in the utility model is:
A kind of holder for dissipating heat of laptop computer, comprise base shell, semiconductor chilling plate, base shell is divided into refrigeration cavity and two relatively independent spaces of heat-dissipating cavity by dividing plate, periphery at refrigeration cavity has air vent lattice, in refrigeration cavity, turbofan is installed, turbofan shell and cooled copper, the lower surface of cooled copper and the laminating of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the upper surface of cooled copper has refrigeration fins group, one end of refrigeration fins group is sealed other one end and is docked with turbofan shell, the blind end of refrigeration fins group, outermost fin and turbofan shell and base shell composition gas channel, refrigeration fins group just has ventilation mesh to base shell place, base shell place is provided with O-ring seal for entering the bottom air inlet mouth of notebook computer with ensureing cooling air around along ventilation mesh, air-flow enters refrigeration cavity from air vent lattice and then under the water conservancy diversion of turbofan shell, enters refrigeration fins group by turbofan, the air inlet that is blown out to laptop bottom from corresponding base shell ventilation mesh after air-flow is cooling by refrigeration fins group enters its inside, have air vent lattice at the periphery of heat-dissipating cavity, heat-dissipating aluminium plate is installed in heat-dissipating cavity, it is light face that a upper surface part for heat-dissipating aluminium plate has radiating fin group a part of in addition, the light face of heat-dissipating aluminium plate extends through the hot side laminating of dividing plate and semiconductor chilling plate, the lower surface of heat-dissipating aluminium plate has some groove bars, groove bar two ends extend to respectively below radiating fin group and light face, and heat pipe is placed in groove bar, conduct the radiating fin group that the heat of the light face of aluminium sheet is delivered to aluminium sheet by heat pipe.
Some aerofoil fans are installed in heat-dissipating cavity.
Aerofoil fan is arranged in radiating fin group.
Fill with scolding tin in space between groove bar and heat pipe.
Between the lower surface of cooled copper and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, laminating is filled with heat-conducting silicone grease in space.
Between the light face of heat-dissipating aluminium plate upper surface and the hot side of semiconductor chilling plate, laminating is filled with liquid metal for conducting heat agent in space.
Be provided with semiconductor chilling plate control module.
Be provided with fan control module.
The beneficial effects of the utility model are: hot and cold with semiconductor chilling plate fits tightly and contact respectively chill surface completely with radiating surface, compact conformation, and heat transfer effect is higher, and refrigeration is better.
Brief description of the drawings
Fig. 1 is the structural representation that the utility model omits base shell,
Fig. 2 is the utility model structural representation,
Fig. 3 is the structural representation of turbofan of the present utility model, turbofan shell and cooled copper combination,
Fig. 4 is the B-B cut-open view of Fig. 3,
Fig. 5 is the structural representation front view of aerofoil fan of the present utility model and heat-dissipating aluminium plate combination,
Fig. 6 is the rear view of Fig. 5,
Fig. 7 is the C-C cutaway view Amplified image of Fig. 5,
Fig. 8 is the utility model profile front view,
Fig. 9 is the utility model profile left view,
Figure 10 is the utility model profile rear view.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further illustrated:
Embodiment: referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10.
A kind of holder for dissipating heat of laptop computer, comprise base shell 8, base shell 8 is rectangular parallelepiped casing, semiconductor chilling plate 11, base shell 8 is divided into refrigeration cavity 15 and 16 two relatively independent spaces of heat-dissipating cavity by dividing plate 1, periphery at refrigeration cavity 15 has air vent lattice 7, the interior installation turbofan 3 of refrigeration cavity 15, turbofan shell 6 and cooled copper 2, the huyashi-chuuka (cold chinese-style noodles) laminating of the lower surface of cooled copper 2 and semiconductor chilling plate 11, the upper surface of cooled copper 2 has refrigeration fins group, one end of refrigeration fins group is sealed other one end and is docked with turbofan shell, the blind end of refrigeration fins group, outermost fin and turbofan shell 6 and base shell 8 form gas channel, refrigeration fins group just has ventilation mesh 14 to base shell 8 places, base shell 8 places are provided with O-ring seal 17 for entering the bottom air inlet mouth of notebook computer with ensureing cooling air around along ventilation mesh 14, O-ring seal 17 can have sponge or elastomeric material to make, air-flow enters refrigeration cavity 15 from air vent lattice 7 and then under the water conservancy diversion of turbofan shell 6, enters refrigeration fins group by turbofan 3, ventilation mesh 14 after air-flow is cooling by refrigeration fins group from corresponding base shell 8 is blown out to the inside of notebook computer, have air vent lattice 7 at the periphery of heat-dissipating cavity 16, heat-dissipating aluminium plate 4 is installed in heat-dissipating cavity 16, it is light face 42 that a upper surface part for heat-dissipating aluminium plate 4 has radiating fin group 41 a part of in addition, the light face 42 of heat-dissipating aluminium plate 4 extends through dividing plate 1 and fits with the hot side of semiconductor chilling plate 11, the lower surface of heat-dissipating aluminium plate 4 has some groove bars, groove bar two ends extend to respectively below radiating fin group 41 and light face 42, heat pipe 9 is placed in groove bar, by heat pipe 9 conduction, the heat of the light face 42 of aluminium sheet is delivered to the radiating fin group 41 of aluminium sheet.
Some aerofoil fans 5 are installed in heat-dissipating cavity 16.
Aerofoil fan 5 is arranged in radiating fin group 41.
Space between groove bar and heat pipe 9 fills 10 with scolding tin.
Between the huyashi-chuuka (cold chinese-style noodles) of the lower surface of cooled copper 2 and semiconductor chilling plate 11, laminating is filled with heat-conducting silicone grease in space.
Between the light face 42 of heat-dissipating aluminium plate 4 upper surfaces and the hot side of semiconductor chilling plate 11, laminating is filled with liquid metal for conducting heat agent in space, liquid metal for conducting heat agent is a kind of low melting point alloy, for example, on the market for the Heat Conduction Material of computer, Chinese name: cruel cold rich, English name: CoolLaboratory.
Be provided with semiconductor chilling plate control module 12.
Be provided with fan control module 13.
Above-mentioned each fan and semiconductor chilling plate all have power module power supply, and power supply can access from outside, also can be from the USB interface access of computer.
The utility model specification:
Adopt semiconductor chilling plate as core component, use a similar and common fin heat-exchanger rig to carry out amplification to its refrigeration.Air themperature is reduced, then by fan, cold air is blown into notebook computer inside, its notebook internal environment bulk temperature is declined, reach the effect that makes its cooling.According to the restrictive condition of the shape of whole device and volume, the moulding to radiating module and structure are carried out for design, make it not produce heat build-up simultaneously.
Smear the normal heat-conducting silicone grease using of very thin one deck electronic component at the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and fill, to expand the contact area of semiconductor chilling plate and cooled copper.
Place the extraordinary liquid metal for conducting heat agent of heat conductivility (as: cruel cold winning at the hot side of semiconductor chilling plate, the English CoolLaboratory that cries, a kind of low melting point alloy), in the time that hot-face temperature reaches the fusing point of liquid metal for conducting heat agent, can expand the contact area of semiconductor chilling plate and heat-dissipating aluminium plate.
The embedded heat pipe of cooled copper groove bar, by the high heat-transfer performance of heat pipe, the heat of light face portion that concentrates on aluminium sheet is delivered to efficiently to the radiating fin group part of aluminium sheet, the gap of the groove bar of heat pipe and aluminium sheet re-uses heat gun after scolding tin and melts by inserting, make its both junctions gas of not leaving a blank, increase greatly both conjugations, improved the efficiency of heat interchange.
Aerofoil fan has been strengthened the cross-ventilation of radiating fin group in heat-dissipating cavity, thereby improves radiating effect.
Be provided with semiconductor chilling plate control module and can control the cryogenic temperature of semiconductor chilling plate.
Be provided with fan control module and can control the air quantity of each fan, thereby control the cross-ventilation intensity in hot and cold cavity.
What embodiment of the present utility model announced is preferred embodiment; but be not limited to this; those of ordinary skill in the art; very easily according to above-described embodiment; understand spirit of the present utility model; and make different amplifications and variation, but only otherwise depart from spirit of the present utility model, all in protection domain of the present utility model.
Claims (8)
1. a holder for dissipating heat of laptop computer, comprise base shell, semiconductor chilling plate, it is characterized in that: base shell is divided into refrigeration cavity and two relatively independent spaces of heat-dissipating cavity by dividing plate, periphery at refrigeration cavity has air vent lattice, in refrigeration cavity, turbofan is installed, turbofan shell and cooled copper, the lower surface of cooled copper and the laminating of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the upper surface of cooled copper has refrigeration fins group, one end of refrigeration fins group is sealed other one end and is docked with turbofan shell, the blind end of refrigeration fins group, outermost fin and turbofan shell and base shell composition gas channel, refrigeration fins group just has ventilation mesh to base shell place, base shell place is provided with O-ring seal around along ventilation mesh, have air vent lattice at the periphery of heat-dissipating cavity, heat-dissipating aluminium plate is installed in heat-dissipating cavity, it is light face that a upper surface part for heat-dissipating aluminium plate has radiating fin group a part of in addition, the light face of heat-dissipating aluminium plate extends through the hot side laminating of dividing plate and semiconductor chilling plate, the lower surface of heat-dissipating aluminium plate has some groove bars, groove bar two ends extend to respectively below radiating fin group and light face, and heat pipe is placed in groove bar.
2. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: some aerofoil fans are installed in heat-dissipating cavity.
3. a kind of holder for dissipating heat of laptop computer according to claim 2, is characterized in that: aerofoil fan is arranged in radiating fin group.
4. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: scolding tin is filled in the space between groove bar and heat pipe.
5. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: between the lower surface of cooled copper and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, space heat-conducting silicone grease is filled.
6. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: between the light face portion of heat-dissipating aluminium plate upper surface and the hot side of semiconductor chilling plate, fill with liquid metal for conducting heat agent in space.
7. according to a kind of holder for dissipating heat of laptop computer described in any one claim in claim 1 to 6, it is characterized in that: be provided with semiconductor chilling plate control module.
8. a kind of holder for dissipating heat of laptop computer according to claim 7, is characterized in that: be provided with fan control module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420027539.1U CN203673428U (en) | 2014-01-17 | 2014-01-17 | Notebook computer heat dissipation base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420027539.1U CN203673428U (en) | 2014-01-17 | 2014-01-17 | Notebook computer heat dissipation base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203673428U true CN203673428U (en) | 2014-06-25 |
Family
ID=50969701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420027539.1U Expired - Fee Related CN203673428U (en) | 2014-01-17 | 2014-01-17 | Notebook computer heat dissipation base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203673428U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104850199A (en) * | 2015-05-25 | 2015-08-19 | 福建农林大学 | Notebook computer heat dissipation pad capable of cooling, and control method therefor |
| CN108234913A (en) * | 2018-01-23 | 2018-06-29 | 华南理工大学 | A kind of high-efficiency heat radiation structure of large scale high power ultrathin liquid crystal display television set |
| CN111942746A (en) * | 2019-05-21 | 2020-11-17 | 浙江云崖科技有限公司 | A kind of refrigeration insulation box and using method |
| CN112230748A (en) * | 2020-11-10 | 2021-01-15 | 周连芬 | Temperature-adjustable refrigerating device and notebook computer radiating support with metal machine body |
| CN113220097A (en) * | 2021-03-24 | 2021-08-06 | 杭州大和热磁电子有限公司 | Notebook computer CPU heat sink |
-
2014
- 2014-01-17 CN CN201420027539.1U patent/CN203673428U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104850199A (en) * | 2015-05-25 | 2015-08-19 | 福建农林大学 | Notebook computer heat dissipation pad capable of cooling, and control method therefor |
| CN108234913A (en) * | 2018-01-23 | 2018-06-29 | 华南理工大学 | A kind of high-efficiency heat radiation structure of large scale high power ultrathin liquid crystal display television set |
| CN108234913B (en) * | 2018-01-23 | 2024-02-23 | 华南理工大学 | An efficient heat dissipation structure for large-size, high-power, ultra-thin LCD TVs |
| CN111942746A (en) * | 2019-05-21 | 2020-11-17 | 浙江云崖科技有限公司 | A kind of refrigeration insulation box and using method |
| CN112230748A (en) * | 2020-11-10 | 2021-01-15 | 周连芬 | Temperature-adjustable refrigerating device and notebook computer radiating support with metal machine body |
| CN113220097A (en) * | 2021-03-24 | 2021-08-06 | 杭州大和热磁电子有限公司 | Notebook computer CPU heat sink |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103838334A (en) | Heat dissipation base of notebook computer | |
| CN101510533B (en) | Novel microelectronic device radiator | |
| CN203673428U (en) | Notebook computer heat dissipation base | |
| CN204535494U (en) | A kind of many pedestals position heat exchanger | |
| CN205213192U (en) | Cool off casing and have said machine controller who cools off casing | |
| CN203376678U (en) | A built-in water cooling heat sink for a notebook computer | |
| CN107170937A (en) | A kind of anhydrous rapid cooling battery thermal management method | |
| CN107887356B (en) | A heat sink for devices with high heat flux density in a closed structure | |
| CN206563932U (en) | Processor heat abstractor | |
| CN104679175A (en) | Dustproof radiating machine case | |
| CN207623920U (en) | High efficiency and heat radiation totally enclosed type chassis component | |
| CN105810805B (en) | A kind of liquid cooling heat radiator | |
| CN205537254U (en) | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator | |
| CN203520294U (en) | A high-efficiency computer cooling device | |
| CN104976810B (en) | Four-air outlet refrigeration device and its refrigeration module | |
| CN207487103U (en) | A kind of radiator | |
| CN206895114U (en) | A positioning radiator for communication equipment | |
| CN201662759U (en) | Heat radiator capable of providing cold air | |
| WO2016192298A1 (en) | Cold transfer device and semiconductor refrigeration box having cold transfer device | |
| CN205103750U (en) | Computer cooling ware based on heat pipe principle | |
| CN206097028U (en) | Electric wire netting access control system based on cloud platform | |
| CN211451446U (en) | Semiconductor refrigerator and fan using same | |
| CN204830957U (en) | Big big wave type runner antipollution heat exchanger of tooth pitch | |
| CN205245105U (en) | Utilize device and LED lighting apparatus of heat transfer of heat conduction material wire rod knitting | |
| CN202562127U (en) | Cold and heat exchange device with high thermal conductivity cooling chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20180117 |