CN203673428U - Notebook computer heat dissipation base - Google Patents

Notebook computer heat dissipation base Download PDF

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Publication number
CN203673428U
CN203673428U CN201420027539.1U CN201420027539U CN203673428U CN 203673428 U CN203673428 U CN 203673428U CN 201420027539 U CN201420027539 U CN 201420027539U CN 203673428 U CN203673428 U CN 203673428U
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CN
China
Prior art keywords
heat
dissipating
plate
cavity
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420027539.1U
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Chinese (zh)
Inventor
李凤臣
崔鹏飞
舒杰
张丽娜
余祥
何春锋
陈士军
周海迎
汤蒂莲
王振华
柴新军
周慧
王少文
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East China Institute of Technology
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East China Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by East China Institute of Technology filed Critical East China Institute of Technology
Priority to CN201420027539.1U priority Critical patent/CN203673428U/en
Application granted granted Critical
Publication of CN203673428U publication Critical patent/CN203673428U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to the field of notebook computer heat dissipation, in particular to a notebook computer heat dissipation base. The notebook computer heat dissipation base comprises a base shell and a semiconductor chilling plate, the base shell is divided into a refrigeration cavity and a heat dissipation cavity through a partition plate, and the refrigeration cavity and the heat dissipation cavity are two relatively independent spaces; a turbo fan and a copper cooling plate are arranged in the refrigeration cavity, axial fans and an aluminum heat dissipation plate are arranged in the heat dissipation cavity, the copper cooling plate is attached to the cold surface of the semiconductor chilling plate, the aluminum heat dissipation plate is attached to the hot surface of the semiconductor chilling plate, the copper cooling plate and the aluminum heat dissipation plate are respectively provided with a fin set, and a great deal of cooling air is produced by means of reinforced heat exchange measures of the turbo fan, the axial fans, the fin sets and heat conducting pipes so as to cool the interior of a computer. The notebook computer heat dissipation base has the advantages that a refrigeration surface and a heat dissipation surface make contact with the cold surface and the hot surface of the semiconductor chilling plate respectively in a completely tightly attached mode, the structure is compact, the heat exchange effect is higher, and the refrigeration effect is better.

Description

A kind of holder for dissipating heat of laptop computer
Technical field
The utility model relates to laptop radiating field, relates to specifically a kind of holder for dissipating heat of laptop computer.
Background technology
Current notebook computer internal heat dissipating effect is on the market poor, in the time that computer is long playing, amount of heat accumulates in CPU annex and distributes and do not go out, affect the serviceable life of CPU and the fortune performance of notebook computer, therefore need efficient cooling device to carry out cooling to the air that enters notebook computer.
Summary of the invention
The purpose of this utility model is to address the above problem, and a kind of holder for dissipating heat of laptop computer is provided.
In order to realize the purpose of this utility model, the technical solution adopted in the utility model is:
A kind of holder for dissipating heat of laptop computer, comprise base shell, semiconductor chilling plate, base shell is divided into refrigeration cavity and two relatively independent spaces of heat-dissipating cavity by dividing plate, periphery at refrigeration cavity has air vent lattice, in refrigeration cavity, turbofan is installed, turbofan shell and cooled copper, the lower surface of cooled copper and the laminating of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the upper surface of cooled copper has refrigeration fins group, one end of refrigeration fins group is sealed other one end and is docked with turbofan shell, the blind end of refrigeration fins group, outermost fin and turbofan shell and base shell composition gas channel, refrigeration fins group just has ventilation mesh to base shell place, base shell place is provided with O-ring seal for entering the bottom air inlet mouth of notebook computer with ensureing cooling air around along ventilation mesh, air-flow enters refrigeration cavity from air vent lattice and then under the water conservancy diversion of turbofan shell, enters refrigeration fins group by turbofan, the air inlet that is blown out to laptop bottom from corresponding base shell ventilation mesh after air-flow is cooling by refrigeration fins group enters its inside, have air vent lattice at the periphery of heat-dissipating cavity, heat-dissipating aluminium plate is installed in heat-dissipating cavity, it is light face that a upper surface part for heat-dissipating aluminium plate has radiating fin group a part of in addition, the light face of heat-dissipating aluminium plate extends through the hot side laminating of dividing plate and semiconductor chilling plate, the lower surface of heat-dissipating aluminium plate has some groove bars, groove bar two ends extend to respectively below radiating fin group and light face, and heat pipe is placed in groove bar, conduct the radiating fin group that the heat of the light face of aluminium sheet is delivered to aluminium sheet by heat pipe.
Some aerofoil fans are installed in heat-dissipating cavity.
Aerofoil fan is arranged in radiating fin group.
Fill with scolding tin in space between groove bar and heat pipe.
Between the lower surface of cooled copper and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, laminating is filled with heat-conducting silicone grease in space.
Between the light face of heat-dissipating aluminium plate upper surface and the hot side of semiconductor chilling plate, laminating is filled with liquid metal for conducting heat agent in space.
Be provided with semiconductor chilling plate control module.
Be provided with fan control module.
The beneficial effects of the utility model are: hot and cold with semiconductor chilling plate fits tightly and contact respectively chill surface completely with radiating surface, compact conformation, and heat transfer effect is higher, and refrigeration is better.
Brief description of the drawings
Fig. 1 is the structural representation that the utility model omits base shell,
Fig. 2 is the utility model structural representation,
Fig. 3 is the structural representation of turbofan of the present utility model, turbofan shell and cooled copper combination,
Fig. 4 is the B-B cut-open view of Fig. 3,
Fig. 5 is the structural representation front view of aerofoil fan of the present utility model and heat-dissipating aluminium plate combination,
Fig. 6 is the rear view of Fig. 5,
Fig. 7 is the C-C cutaway view Amplified image of Fig. 5,
Fig. 8 is the utility model profile front view,
Fig. 9 is the utility model profile left view,
Figure 10 is the utility model profile rear view.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further illustrated:
Embodiment: referring to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, Fig. 7, Fig. 8, Fig. 9, Figure 10.
A kind of holder for dissipating heat of laptop computer, comprise base shell 8, base shell 8 is rectangular parallelepiped casing, semiconductor chilling plate 11, base shell 8 is divided into refrigeration cavity 15 and 16 two relatively independent spaces of heat-dissipating cavity by dividing plate 1, periphery at refrigeration cavity 15 has air vent lattice 7, the interior installation turbofan 3 of refrigeration cavity 15, turbofan shell 6 and cooled copper 2, the huyashi-chuuka (cold chinese-style noodles) laminating of the lower surface of cooled copper 2 and semiconductor chilling plate 11, the upper surface of cooled copper 2 has refrigeration fins group, one end of refrigeration fins group is sealed other one end and is docked with turbofan shell, the blind end of refrigeration fins group, outermost fin and turbofan shell 6 and base shell 8 form gas channel, refrigeration fins group just has ventilation mesh 14 to base shell 8 places, base shell 8 places are provided with O-ring seal 17 for entering the bottom air inlet mouth of notebook computer with ensureing cooling air around along ventilation mesh 14, O-ring seal 17 can have sponge or elastomeric material to make, air-flow enters refrigeration cavity 15 from air vent lattice 7 and then under the water conservancy diversion of turbofan shell 6, enters refrigeration fins group by turbofan 3, ventilation mesh 14 after air-flow is cooling by refrigeration fins group from corresponding base shell 8 is blown out to the inside of notebook computer, have air vent lattice 7 at the periphery of heat-dissipating cavity 16, heat-dissipating aluminium plate 4 is installed in heat-dissipating cavity 16, it is light face 42 that a upper surface part for heat-dissipating aluminium plate 4 has radiating fin group 41 a part of in addition, the light face 42 of heat-dissipating aluminium plate 4 extends through dividing plate 1 and fits with the hot side of semiconductor chilling plate 11, the lower surface of heat-dissipating aluminium plate 4 has some groove bars, groove bar two ends extend to respectively below radiating fin group 41 and light face 42, heat pipe 9 is placed in groove bar, by heat pipe 9 conduction, the heat of the light face 42 of aluminium sheet is delivered to the radiating fin group 41 of aluminium sheet.
Some aerofoil fans 5 are installed in heat-dissipating cavity 16.
Aerofoil fan 5 is arranged in radiating fin group 41.
Space between groove bar and heat pipe 9 fills 10 with scolding tin.
Between the huyashi-chuuka (cold chinese-style noodles) of the lower surface of cooled copper 2 and semiconductor chilling plate 11, laminating is filled with heat-conducting silicone grease in space.
Between the light face 42 of heat-dissipating aluminium plate 4 upper surfaces and the hot side of semiconductor chilling plate 11, laminating is filled with liquid metal for conducting heat agent in space, liquid metal for conducting heat agent is a kind of low melting point alloy, for example, on the market for the Heat Conduction Material of computer, Chinese name: cruel cold rich, English name: CoolLaboratory.
Be provided with semiconductor chilling plate control module 12.
Be provided with fan control module 13.
Above-mentioned each fan and semiconductor chilling plate all have power module power supply, and power supply can access from outside, also can be from the USB interface access of computer.
The utility model specification:
Adopt semiconductor chilling plate as core component, use a similar and common fin heat-exchanger rig to carry out amplification to its refrigeration.Air themperature is reduced, then by fan, cold air is blown into notebook computer inside, its notebook internal environment bulk temperature is declined, reach the effect that makes its cooling.According to the restrictive condition of the shape of whole device and volume, the moulding to radiating module and structure are carried out for design, make it not produce heat build-up simultaneously.
Smear the normal heat-conducting silicone grease using of very thin one deck electronic component at the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and fill, to expand the contact area of semiconductor chilling plate and cooled copper.
Place the extraordinary liquid metal for conducting heat agent of heat conductivility (as: cruel cold winning at the hot side of semiconductor chilling plate, the English CoolLaboratory that cries, a kind of low melting point alloy), in the time that hot-face temperature reaches the fusing point of liquid metal for conducting heat agent, can expand the contact area of semiconductor chilling plate and heat-dissipating aluminium plate.
The embedded heat pipe of cooled copper groove bar, by the high heat-transfer performance of heat pipe, the heat of light face portion that concentrates on aluminium sheet is delivered to efficiently to the radiating fin group part of aluminium sheet, the gap of the groove bar of heat pipe and aluminium sheet re-uses heat gun after scolding tin and melts by inserting, make its both junctions gas of not leaving a blank, increase greatly both conjugations, improved the efficiency of heat interchange.
Aerofoil fan has been strengthened the cross-ventilation of radiating fin group in heat-dissipating cavity, thereby improves radiating effect.
Be provided with semiconductor chilling plate control module and can control the cryogenic temperature of semiconductor chilling plate.
Be provided with fan control module and can control the air quantity of each fan, thereby control the cross-ventilation intensity in hot and cold cavity.
What embodiment of the present utility model announced is preferred embodiment; but be not limited to this; those of ordinary skill in the art; very easily according to above-described embodiment; understand spirit of the present utility model; and make different amplifications and variation, but only otherwise depart from spirit of the present utility model, all in protection domain of the present utility model.

Claims (8)

1. a holder for dissipating heat of laptop computer, comprise base shell, semiconductor chilling plate, it is characterized in that: base shell is divided into refrigeration cavity and two relatively independent spaces of heat-dissipating cavity by dividing plate, periphery at refrigeration cavity has air vent lattice, in refrigeration cavity, turbofan is installed, turbofan shell and cooled copper, the lower surface of cooled copper and the laminating of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the upper surface of cooled copper has refrigeration fins group, one end of refrigeration fins group is sealed other one end and is docked with turbofan shell, the blind end of refrigeration fins group, outermost fin and turbofan shell and base shell composition gas channel, refrigeration fins group just has ventilation mesh to base shell place, base shell place is provided with O-ring seal around along ventilation mesh, have air vent lattice at the periphery of heat-dissipating cavity, heat-dissipating aluminium plate is installed in heat-dissipating cavity, it is light face that a upper surface part for heat-dissipating aluminium plate has radiating fin group a part of in addition, the light face of heat-dissipating aluminium plate extends through the hot side laminating of dividing plate and semiconductor chilling plate, the lower surface of heat-dissipating aluminium plate has some groove bars, groove bar two ends extend to respectively below radiating fin group and light face, and heat pipe is placed in groove bar.
2. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: some aerofoil fans are installed in heat-dissipating cavity.
3. a kind of holder for dissipating heat of laptop computer according to claim 2, is characterized in that: aerofoil fan is arranged in radiating fin group.
4. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: scolding tin is filled in the space between groove bar and heat pipe.
5. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: between the lower surface of cooled copper and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, space heat-conducting silicone grease is filled.
6. a kind of holder for dissipating heat of laptop computer according to claim 1, is characterized in that: between the light face portion of heat-dissipating aluminium plate upper surface and the hot side of semiconductor chilling plate, fill with liquid metal for conducting heat agent in space.
7. according to a kind of holder for dissipating heat of laptop computer described in any one claim in claim 1 to 6, it is characterized in that: be provided with semiconductor chilling plate control module.
8. a kind of holder for dissipating heat of laptop computer according to claim 7, is characterized in that: be provided with fan control module.
CN201420027539.1U 2014-01-17 2014-01-17 Notebook computer heat dissipation base Expired - Fee Related CN203673428U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420027539.1U CN203673428U (en) 2014-01-17 2014-01-17 Notebook computer heat dissipation base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420027539.1U CN203673428U (en) 2014-01-17 2014-01-17 Notebook computer heat dissipation base

Publications (1)

Publication Number Publication Date
CN203673428U true CN203673428U (en) 2014-06-25

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ID=50969701

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420027539.1U Expired - Fee Related CN203673428U (en) 2014-01-17 2014-01-17 Notebook computer heat dissipation base

Country Status (1)

Country Link
CN (1) CN203673428U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104850199A (en) * 2015-05-25 2015-08-19 福建农林大学 Notebook computer heat dissipation pad capable of cooling, and control method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104850199A (en) * 2015-05-25 2015-08-19 福建农林大学 Notebook computer heat dissipation pad capable of cooling, and control method therefor

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Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140625

Termination date: 20180117

CF01 Termination of patent right due to non-payment of annual fee