CN218183789U - Annular heat dissipation device - Google Patents

Abstract

The utility model discloses a heat abstractor of annular, the heat pipe includes condenser pipe and evaporating pipe, both ends respectively with the condenser pipe welding about the evaporating pipe, form an annular heat pipe, the inside of evaporating pipe is provided with the capillary body, the capillary position in the inner wall of evaporating pipe and with evaporating pipe fixed connection, the toper through-hole has been seted up to the inside of capillary body, both ends are outlet end and return end respectively about the toper through-hole, outlet end and evaporating end intercommunication, return end and condensing end intercommunication, the diameter of outlet end is greater than the diameter of return end. Through the capillary body, the liquid state of the refrigerant liquid is changed into the gaseous state after the evaporation pipe absorbs heat, and meanwhile, the high-temperature region flows to the low-temperature region, so that single circulation is continuously performed in the annular pipe, a water pump is not needed for driving the refrigerant liquid to circulate, energy consumption is not needed, and noise and vibration are avoided. The capillary body only exists in the evaporation tube, powder filling and high-temperature sintering are not needed to be carried out on the whole heat tube, the usage amount of copper powder is small, the manufacturing cost is low, and the heat dissipation efficiency is high.

Description

Annular heat dissipation device

Technical Field

The utility model belongs to the technical field of the electronic heat radiator technique and specifically relates to a heat abstractor of ring form is related to.

Background

With the progress of the era, science and technology are gradually developed, the demand of network communication is more and more increased, along with the development of 5G and the entrance of high-speed optical fibers, under the conditions of high demand and high network speed, the development of a server is faster and faster, and in order to ensure that the requirements of higher response speed, higher transmission speed and the like can be provided, the performance of the server is more and more powerful, the most direct part for improving the performance of the server is a chip, the chip can generate a large amount of heat during working due to small volume, the operation speed is reduced due to overhigh temperature, and even the chip is burnt out, so people often press a radiator on the chip, and the heat generated by the chip is transferred out through the radiator, so that the temperature of the chip is reduced, and the operation stability is improved. The heat radiator consists of a plurality of heat pipes, fins and a base, wherein each heat pipe is connected with the base and is in contact with the chip through the base to transfer heat, and the fins are distributed around the heat pipes to take away the heat of the heat pipes. The traditional heat pipe manufacturing process is to fill copper powder into the whole pipe shell, then put the whole pipe shell into a bell jar furnace to be sintered to 980 ℃, keep the temperature for 3 hours to ensure that the copper powder forms a capillary structure on the inner wall of the whole pipe shell through high-temperature sintering, and then fill pure water into the pipe shell. Since the conventional heat pipe is limited in the use orientation and length by the gravity field, the operation of the heat pipe is adversely affected when the evaporation section is located above the condensation section, because the capillary wick may not provide enough capillary pressure to overcome the gravity force to enable the condensed liquid to flow back to the evaporation section, i.e., the antigravity capability of the conventional heat pipe is very poor, and the vapor exerts a shearing force on the liquid flowing back in the capillary wick due to the direct contact and opposite flow directions of the vapor and the liquid in the heat pipe. When the vapor flow rate is high, liquid at the gas-liquid interface may be carried back to the condensation section in the form of droplets, while liquid reflux is hindered. The required liquid circulation amount is increased, when the liquid backflow cannot meet the increase of the circulation amount, the evaporation section is burnt out, the carrying phenomenon is limited by the heat transfer capacity of the traditional heat pipe, the power of a single heat pipe can only reach 50W, and therefore improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a not enough to prior art exists, the utility model aims at providing a heat abstractor of ring form only sets up the capillary body in the evaporating pipe, reduces the use of copper powder by a wide margin, reduces manufacturing cost, need not external drive refrigerating fluid, and the radiating efficiency is high, and the energy consumption is low.

In order to realize the purpose, the utility model discloses the technical scheme who adopts is: the utility model provides a heat abstractor of ring form, includes heat radiation fin subassembly, radiating seat and a plurality of heat pipe of pouring into the refrigerant liquid into, each heat pipe fixed mounting is on the radiating seat, and the welding of heat radiation fin subassembly is on the outer wall of each heat pipe, its characterized in that: the heat pipe includes condenser pipe and evaporating pipe, the annular pipe of bending of condenser pipe for having the breach, the one end of condenser pipe is the evaporating end, the other end is the condensing end, the evaporating pipe is located the breach department of condenser pipe, both ends weld with the evaporating end and the condensing end of condenser pipe respectively about the evaporating pipe, form an annular heat pipe, the inside of evaporating pipe is provided with the capillary, the capillary is located the inner wall of evaporating pipe and with evaporating pipe fixed connection, the toper through-hole has been seted up to the inside of capillary, both ends are outflow end and reflux end respectively about the toper through-hole, outflow end and evaporating end intercommunication, reflux end and condensing end intercommunication, the diameter of outflow end is greater than the diameter of reflux end.

In a further technical scheme, the diameter of the condensing pipe is smaller than that of the evaporating pipe, and the evaporating pipe is positioned at the bottom of the heat pipe.

Among the further technical scheme, the radiating seat includes bottom plate and connecting plate, a plurality of and condenser pipe assorted condensation mounting groove have been seted up at the top surface interval of bottom plate, each heat pipe fixed mounting is in corresponding condensation mounting groove, the installing port that runs through the bottom plate is seted up to the evaporating pipe on the projection position of bottom plate, the connecting plate inlays to be established in the installing port, a plurality of and evaporating pipe assorted evaporation mounting groove have been seted up at the top surface interval of connecting plate, each evaporating pipe fixed mounting is in corresponding evaporation mounting groove, the bottom protrusion of connecting plate is in the bottom surface of bottom plate, the length of evaporating pipe is less than or equal to the width of connecting plate.

In a further technical scheme, the heat radiation fin assembly comprises an upper fin group, a middle fin group and a lower fin group from top to bottom, the upper fin group is fixedly connected to the upper portion of the heat pipe, the middle fin group is fixedly connected to the middle portion of the heat pipe, the lower fin group is fixedly connected to the lower portion of the heat pipe, a plurality of lower grooves matched with the outer wall of the heat pipe are formed in the bottom of the lower fin group at intervals, a plurality of middle grooves matched with the outer wall of the heat pipe are formed in the top of the middle fin group at intervals, the lower grooves are welded to the inner side wall of the bottom of the heat pipe and welded to the inner side wall of the top of the heat pipe, a plurality of upper grooves matched with the outer wall of the heat pipe are formed in the bottom of the upper fin group at intervals, the upper grooves are welded to the outer side wall of the top of the heat pipe, and the upper grooves and the middle grooves are closed to form a through hole for the condenser pipe to pass through.

In a further technical scheme, the upper fin group comprises a first upper substrate and a plurality of upper fins integrally formed on the bottom surface of the upper substrate, the upper fins are arranged in parallel at intervals, and the bottom of each upper fin is provided with an upper groove;

the middle fin group comprises a second upper substrate and a first lower substrate, a plurality of middle fins are integrally formed between the second upper substrate and the first lower substrate, the middle fins are arranged in parallel at intervals, and the middle groove is formed in the top surface of the second upper substrate;

the lower fin group comprises a third upper substrate and a second lower substrate, a plurality of lower fins are arranged between the third upper substrate and the second lower substrate, the lower fins are arranged in parallel at intervals, and the lower grooves are formed in the bottom surface of the second lower substrate.

In a further technical scheme, a partition plate is further arranged between the middle fin group and the lower fin group, a plurality of tin filling grooves are formed in the top surface of the partition plate or the first lower substrate at intervals, the top surface of the partition plate is fixedly connected with the bottom surfaces of the middle fins, a plurality of connecting pieces are fixedly mounted on the bottom surface of the bottom plate and located on the periphery of the connecting plate, and therefore the heat dissipation device is fixedly mounted on the mainboard.

In a further technical scheme, the bottom plate is made of aluminum, the connecting plate is made of copper, the partition plate is made of aluminum, the radiating fin assemblies are made of aluminum, and the heat pipes are made of copper.

In a further technical scheme, the refrigerant liquid adopts a refrigerant with the model number of R134 a.

After the structure is adopted, compared with the prior art, the utility model the advantage that has is: through the capillary body in the evaporating pipe, make the refrigerant liquid reflux end stop the gas inflow with capillary force, the evaporating pipe absorbs the liquid state of refrigerant liquid behind the heat and becomes the gaseous state, and high-temperature region flows toward the low temperature district simultaneously, takes the heat to pass through the heat dissipation fin group heat dissipation through the air-cooled heat pipe, becomes liquid behind the gas release heat to this constantly does the monocycle in the ring duct, need not water pump drive refrigerant liquid circulation, need not the power consumption, noiselessness and vibration. The method only needs to perform powder filling high-temperature sintering in the evaporation tube, and Mao Xiti only exists in the evaporation tube, so that the powder filling high-temperature sintering of the whole heat tube is not needed, the consumption of copper powder is small, the manufacturing cost is reduced, the weight of the heat tube is reduced, and the molecular weight of a gas state formed after heating under high pressure is higher than that of a lighter circulation speed due to the separation of condensation and evaporation, so that the power decomposed by a single heat tube can reach 200W, and the heat dissipation efficiency is high.

Drawings

The present invention will be further described with reference to the accompanying drawings and examples.

FIG. 1 is a schematic view of the present invention;

fig. 2 is an exploded elevation view of the present invention;

fig. 3 is a side exploded view of the present invention;

fig. 4 is a cross-sectional view of the present invention;

FIG. 5 is a cross-sectional view of a heat pipe of the present invention;

fig. 6 is an enlarged view of a portion a of fig. 5 according to the present invention.

In the figure:

1, a heat radiation fin assembly, 11 upper fin group, 111 upper groove, 112 first upper substrate, 113 upper fin, 12 middle fin group, 121 middle groove, 122 second upper substrate, 123 first lower substrate, 124 middle fin, 13 lower fin group, 131 lower groove, 132 third upper substrate, 133 second lower substrate, 134 lower fin, 14 partition board, 141 tin filling groove;

2, a heat radiation seat, a 21 bottom plate, a 211 condensation installation groove, a 212 installation opening, a 22 connecting plate, a 221 evaporation installation groove and a 23 connecting piece;

3 heat pipes, 31 condensation pipes, 311 evaporation ends, 312 condensation ends, 32 evaporation pipes, 321 outflow ends, 322 reflux ends, 33 Mao Xiti and 331 taper through holes.

Detailed Description

The following are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby.

The utility model provides a heat abstractor of ring form, as shown in fig. 1 to 6, includes heat radiation fin assembly 1, radiating seat 2 and a plurality of heat pipe 3 of pouring into the refrigerant liquid into, and 3 fixed mounting of each heat pipe are on radiating seat 2, and heat radiation fin assembly 1 welds on the outer wall of each heat pipe 3, its characterized in that: the heat pipe 3 comprises a condensation pipe 31 and an evaporation pipe 32, the condensation pipe 31 is an annular bent pipe with a notch, one end of the condensation pipe 31 is an evaporation end 311, the other end of the condensation pipe 31 is a condensation end 312, the evaporation pipe 32 is located at the notch of the condensation pipe 31, the left end and the right end of the evaporation pipe 32 are respectively welded with the evaporation end 311 and the condensation end 312 of the condensation pipe 31 to form the annular heat pipe 3, a capillary 33 is arranged inside the evaporation pipe 32, mao Xiti is located on the inner wall of the evaporation pipe 32 and fixedly connected with the evaporation pipe 32, a conical through hole 331 is formed inside the capillary 33, the left end and the right end of the conical through hole 331 are respectively an outflow end 321 and a backflow end 322, the outflow end 321 is communicated with the evaporation end 311, the backflow end 322 is communicated with the condensation end 312, and the diameter of the outflow end 321 is larger than that of the backflow end 322.

Traditional heat abstractor need be with the help of the refrigerant fluid circulation in the water pump helping hand heat pipe 3, the energy consumption is high, the noise is big, certain vibration has, poor stability, and the utility model discloses a Mao Xiti in the evaporating pipe 32, make the refrigerant fluid block the gas inflow at return end 322 with capillary force, refrigerant fluid becomes the gaseous state from liquid after evaporating pipe 32 absorbs the heat, high temperature region flows toward the low temperature region simultaneously, take the heat to pass through cooling fin subassembly 1 heat dissipation through air-cooled heat pipe 3, become liquid behind the gas release heat, constantly do the monocycle with this in annular heat pipe 3, need not water pump drive refrigerant fluid circulation, need not to consume energy, noiselessness and vibration.

The conventional heat pipe 3 needs to be filled with copper powder, and then the copper powder is sintered at a high temperature to form Mao Xiti in the entire heat pipe 3, so that a large amount of copper powder is needed, which results in high manufacturing cost and complex process, and the conventional heat pipe 3 is limited in the use direction and length in the gravity field, and when the evaporation section is located above the condensation section, the operation of the heat pipe 3 is adversely affected, because the capillary body 33 may not provide enough capillary pressure to overcome the gravity to make the condensed refrigerant liquid flow back to the evaporation section, i.e. the antigravity capability of the conventional heat pipe 3 is very poor, and because the vapor and the liquid in the heat pipe 3 are in direct contact and opposite flow directions, the vapor applies a shearing force to the return liquid in the capillary body 33. When the vapor flow rate is high, liquid at the gas-liquid interface may be carried back to the condensation section in the form of droplets, while liquid reflux is hindered. The required liquid circulation amount is increased, when the liquid backflow cannot meet the increase of the circulation amount, the evaporation section is burnt, the carrying phenomenon is that the heat transfer capacity of the traditional heat pipe is limited, and the solution power of a single heat pipe 3 can only reach 50W. And the utility model discloses only need fill powder high temperature sintering in the evaporating pipe 32, mao Xiti only exists in evaporating pipe 32, need not to fill powder high temperature sintering to whole heat pipe 3, and the use amount of copper powder is little, has reduced manufacturing cost, has alleviateed heat pipe 3's weight, because condensation and evaporation are separately, it is fast to form gaseous state molecular weight ratio lighter circulation speed behind the high pressure of being heated, therefore the power that single heat pipe solved can reach 200W, and the radiating efficiency is high.

Specifically, the diameter of the condensation pipe 31 is smaller than that of the evaporation pipe 32, and the evaporation pipe 32 is located at the bottom of the heat pipe 3. The evaporating tube 32 needs to be filled with copper powder and sintered to Mao Xiti at high temperature, so the diameter of the evaporating tube 32 is larger than that of the condensing tube 31, preferably, the diameter of the evaporating tube 32 is 10mm, and the diameter of the condensing tube 31 is 8mm. Mao Xiti 33 is a capillary 33 formed by selecting copper powder with the specification of 60-100 meshes to screen copper powder with the granularity of 100-150 meshes, enabling the loose density of the copper powder to reach 1.75g/cm < 3 >, controlling the powder filling thickness to be 1.3mm through a central rod, sintering the copper powder in a bell jar furnace to 980 ℃, and keeping the temperature for 3 hours.

Specifically, as shown in fig. 2 and 3, heat sink 2 includes a bottom plate 21 and a connecting plate 22, a plurality of condensation mounting grooves 211 matched with condenser tubes 31 are opened at the top surface interval of bottom plate 21, each heat pipe 3 is fixedly mounted in corresponding condensation mounting groove 211, an installation opening 212 penetrating through bottom plate 21 is opened at the projection position of bottom plate 21 for evaporator tube 32, connecting plate 22 is embedded in installation opening 212, a plurality of evaporation mounting grooves 221 matched with evaporator tubes 32 are opened at the top surface interval of connecting plate 22, each evaporator tubes 32 is fixedly mounted in corresponding evaporation mounting grooves 221, bottom of connecting plate 22 protrudes out of the bottom surface of bottom plate 21, and the length of evaporator tubes 32 is less than or equal to the width of connecting plate 22. The evaporating pipe 32 is a copper pipe with the diameter of 10mm and the length of 50mm, and the condensing pipe 31 is a copper pipe with the diameter of 8mm. The condensation installation groove 211 and the evaporation installation groove 221 are formed to enable the condensation tube 31 and the evaporation tube 32 to be in contact with the bottom plate 21 and the connecting plate 22 to the maximum extent, the contact area is increased, the heat conduction efficiency is improved, the bottom surface of the connecting plate 22 is smooth, the connecting plate 22 is pressed against a chip, heat-conducting silicone grease is coated between the connecting plate 22 and the chip, when the chip generates heat, the heat is conducted to the connecting plate 22 through the heat-conducting silicone grease, the evaporation tube 32 in contact with the connecting plate 22 is subjected to heating load, refrigerant liquid evaporates on the outer surface of the capillary 33, generated vapor flows out of a vapor channel of the capillary 33 into the conical through hole 331, then enters the condensation tube 31 from the outflow end 321 through the condensation end 311 to be condensed into liquid and supercooled, the returned refrigerant liquid flows back to the evaporation tube 32 from the evaporation end 312 through the backflow end 322, the diameter of the backflow end 322 is smaller than that of the outflow end 321, the returned refrigerant liquid supplies the capillary 33, the refrigerant liquid is evaporated from the outer surface again, and the circulation is carried out, the direction indicated by an arrow shown in fig. 5 is the flow direction of the refrigerant liquid, the capillary 33 is driven by capillary pressure in the capillary 32, and no power source is further added.

Specifically, as shown in fig. 2 to 4, the heat dissipating fin assembly 1 includes, from top to bottom, an upper fin group 11, a middle fin group 12 and a lower fin group 13, the upper fin group 11 is fixedly connected to the upper portion of the heat pipe 3, the middle fin group 12 is fixedly connected to the middle portion of the heat pipe 3, the lower fin group 13 is fixedly connected to the lower portion of the heat pipe 3, the bottom of the lower fin group 13 is provided with a plurality of lower grooves 131 at intervals, which are matched with the outer wall of the heat pipe 3, the top of the middle fin group 12 is provided with a plurality of middle grooves 121 at intervals, which are matched with the outer wall of the heat pipe 3, the lower grooves 131 are welded to the inner side wall of the bottom of the heat pipe 3, the middle grooves 121 are welded to the inner side wall of the top of the heat pipe 3, the bottom of the upper fin group 11 is provided with a plurality of upper grooves 111 at intervals, which are matched with the outer wall of the heat pipe 3, the upper grooves 111 are welded to the outer side wall of the top of the heat pipe 3, and the upper grooves 111 and the middle grooves 121 are closed to form a through hole for the condenser pipe 31 to pass through. The liquefied refrigerant liquid needs to be cooled down fast after entering the condenser pipe 31, and on conducting the heat to the cooling fin assembly 1 through the cooling fin assembly 1, the increase of low groove 131, middle groove 121 and upper groove 111 maximize and the area of contact of condenser pipe 31 improve heat conduction efficiency, and wrap up the condenser pipe 31 completely through last fin group 11, middle fin group 12 and lower fin group 13, and the volume and the quantity of cooling fin assembly 1 are big, and the radiating effect is good. Preferably, a fan is installed on the heat dissipation fin assembly 1, and the heat on the heat dissipation fin assembly 1 is taken away by the fan, so that the heat dissipation efficiency is further improved.

Specifically, the upper fin group 11 includes a first upper substrate 112 and a plurality of upper fins 113 integrally formed on the bottom surface of the upper substrate, each upper fin 113 is arranged in parallel at intervals, and the bottom of each upper fin 113 is provided with an upper groove 111; the middle fin group 12 includes a second upper substrate 122 and a first lower substrate 123, a plurality of middle fins 124 are integrally formed between the second upper substrate 122 and the first lower substrate 123, each middle fin 124 is arranged in parallel at intervals, and the middle groove 121 is opened on the top surface of the second upper substrate 122; the lower fin group 13 includes a third upper substrate 132 and a second lower substrate 133, a plurality of lower fins 134 are disposed between the third upper substrate 132 and the second lower substrate 133, each of the lower fins 134 is disposed in parallel at intervals, and the lower groove 131 is disposed on the bottom surface of the second lower substrate 133. The upper fins 113, the middle fins 124 and the lower fins 134 arranged in parallel at intervals reduce the weight of the heat dissipation fin assembly 1, facilitate the wind to pass through and take away heat, and have better heat dissipation effect.

Specifically, a partition 14 is further disposed between the middle fin group 12 and the lower fin group 13, a plurality of tin filling grooves 141 are spaced apart from the top surface of the partition 14 or the first lower substrate 123, the top surface of the partition 14 is fixedly connected with the bottom surfaces of the middle fins 124, a plurality of connecting members 23 are fixedly mounted on the bottom surface of the bottom plate 21, and the connecting members 23 are located on the periphery of the connecting plate 22, so as to fixedly mount the heat dissipation device on the motherboard. The middle fin group 12 and the lower fin group 13 are connected through the partition plate 14, so that the overall strength is increased, deformation and collapse are prevented, and the reliability is improved.

Specifically, the bottom plate 21 is a bottom plate 21 made of aluminum, the connecting plate 22 is a connecting plate 22 made of copper, the partition 14 is a partition 14 made of aluminum, the heat radiation fin assembly 1 is a heat radiation fin assembly 1 made of aluminum, and the heat pipe 3 is a heat pipe 3 made of copper. Because copper has better heat-conducting property but higher cost, the large-area bottom plate 21, the partition plate 14 and the heat-radiating fin assembly 1 are made of aluminum, and the connecting plate 22 and the heat pipe 3 which are in direct contact with the chip are made of copper, so that the manufacturing cost is reduced under the condition of ensuring the heat-radiating effect.

Specifically, the refrigerant liquid is R134a refrigerant. The refrigerant has low boiling point, high density of driving fast heat flow and strong temperature uniformity when being saturated by hot steam, thereby obtaining better heat dissipation effect.

Temperature sensing lines are respectively adhered to a condensation end 311 and an evaporation end 312 of a condensation pipe 31, the temperature difference of the condensation pipe 31 is detected, the gas state is in liquid reflux after being exchanged through the condensation phase, the temperature of the evaporation end 312 is higher than that of the condensation end 311, steam in a heat pipe 3 is in a saturated state, and pressure drop of the saturated steam flowing from the evaporation end 312 to the condensation end 311 is small, so that the heat pipe 3 has excellent isothermality, a fan is installed on a heat dissipation fin assembly 1, the air volume of the fan is adjusted to be 250CFM, when a connecting plate 22 is heated by 1000W, the temperature of a chip is kept at 67.3 ℃, the thermal resistance is reduced to 0.0411 ℃/W, under the condition that the number of the heat pipes 3 is not increased, the heat dissipation effect is greatly improved, and the stability of the chip under high-load operation is ensured.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims (8)

1. The utility model provides a heat abstractor of ring form, includes heat radiation fin subassembly (1), radiating seat (2) and a plurality of heat pipe (3) of pouring into the refrigerant fluid into, and each heat pipe (3) fixed mounting is on radiating seat (2), and the welding of heat radiation fin subassembly (1) is on the outer wall of each heat pipe (3), its characterized in that: the heat pipe (3) comprises a condensation pipe (31) and an evaporation pipe (32), the condensation pipe (31) is an annular bending pipe with a notch, one end of the condensation pipe (31) is an evaporation end (311), the other end of the condensation pipe is a condensation end (312), the evaporation pipe (32) is located at the notch of the condensation pipe (31), the left end and the right end of the evaporation pipe (32) are respectively welded with the evaporation end (311) and the condensation end (312) of the condensation pipe (31), an annular heat pipe (3) is formed, a capillary body (33) is arranged inside the evaporation pipe (32), the capillary body (33) is located on the inner wall of the evaporation pipe (32) and is fixedly connected with the evaporation pipe (32), a conical through hole (331) is formed inside the capillary body (33), the left end and the right end of the conical through hole (331) are respectively an outflow end (321) and a backflow end (322), the outflow end (321) is communicated with the evaporation end (311), the backflow end (322) is communicated with the condensation end (312), and the diameter of the outflow end (321) is larger than that of the backflow end (322).

2. The heat dissipating device in the form of a ring as set forth in claim 1, wherein: the diameter of the condensation pipe (31) is smaller than that of the evaporation pipe (32), and the evaporation pipe (32) is positioned at the bottom of the heat pipe (3).

3. The heat dissipating device in the form of a ring as set forth in claim 1, wherein: radiating seat (2) include bottom plate (21) and connecting plate (22), the top surface interval of bottom plate (21) seted up a plurality of with condenser pipe (31) assorted condensation mounting groove (211), each heat pipe (3) fixed mounting is in corresponding condensation mounting groove (211), installing port (212) that run through bottom plate (21) are seted up to evaporating pipe (32) on the projection position of bottom plate (21), and connecting plate (22) are inlayed and are established in installing port (212), and a plurality of and evaporating pipe (32) assorted evaporation mounting groove (221) are seted up to the top surface interval of connecting plate (22), and each evaporating pipe (32) fixed mounting is in corresponding evaporation mounting groove (221), and the bottom protrusion of connecting plate (22) is in the bottom surface of bottom plate (21), and the length of evaporating pipe (32) is less than or equal to the width of connecting plate (22).

4. The heat dissipating device in the form of a ring as set forth in claim 3, wherein: the radiating fin assembly (1) comprises an upper fin group (11), a middle fin group (12) and a lower fin group (13) from top to bottom, the upper fin group (11) is fixedly connected to the upper portion of the heat pipe (3), the middle fin group (12) is fixedly connected to the middle portion of the heat pipe (3), the lower fin group (13) is fixedly connected to the lower portion of the heat pipe (3), a plurality of lower grooves (131) matched with the outer wall of the heat pipe (3) are formed in the bottom of the lower fin group (13) at intervals, a plurality of middle grooves (121) matched with the outer wall of the heat pipe (3) are formed in the top of the middle fin group (12) at intervals, the lower grooves (131) are welded to the inner side wall of the bottom of the heat pipe (3), the middle grooves (121) are welded to the inner side wall of the top of the heat pipe (3), a plurality of upper grooves (111) matched with the outer wall of the heat pipe (3) are formed in the bottom of the upper fin group (11) at intervals, the upper grooves (111) are welded to the outer side wall of the top of the heat pipe (3), and the upper grooves (111) and the middle grooves (121) are closed to form a through hole for the condenser pipe (31) to pass through.

5. The heat dissipating device in the form of a ring as set forth in claim 4, wherein: the upper fin group (11) comprises a first upper substrate (112) and a plurality of upper fins (113) integrally formed on the bottom surface of the upper substrate, the upper fins (113) are arranged in parallel at intervals, and the bottom of each upper fin (113) is provided with one upper groove (111);

the middle fin group (12) comprises a second upper substrate (122) and a first lower substrate (123), a plurality of middle fins (124) are integrally formed between the second upper substrate (122) and the first lower substrate (123), each middle fin (124) is arranged in parallel at intervals, and the middle groove (121) is formed in the top surface of the second upper substrate (122);

the lower fin group (13) comprises a third upper substrate (132) and a second lower substrate (133), a plurality of lower fins (134) are arranged between the third upper substrate (132) and the second lower substrate (133), the lower fins (134) are arranged in parallel at intervals, and the lower grooves (131) are arranged on the bottom surface of the second lower substrate (133).

6. The heat dissipating device in the form of a ring as set forth in claim 5, wherein: a partition plate (14) is further arranged between the middle fin group (12) and the lower fin group (13), a plurality of tin filling grooves (141) are formed in the top surface of the partition plate (14) or the first lower substrate (123) at intervals, the top surface of the partition plate (14) is fixedly connected with the bottom surface of the middle fin (124), a plurality of connecting pieces (23) are fixedly installed on the bottom surface of the bottom plate (21), and the connecting pieces (23) are located on the periphery of the connecting plate (22) so as to achieve the purpose that the heat dissipation device is fixedly installed on the main plate.

7. The heat dissipating device in the form of a ring as set forth in claim 6, wherein: the bottom plate (21) is bottom plate (21) that aluminium made, connecting plate (22) are connecting plate (22) that the copper made, baffle (14) are baffle (14) that the aluminium made, heat radiation fin subassembly (1) are heat radiation fin subassembly (1) that the aluminium made, heat pipe (3) are heat pipe (3) that the copper made.

8. The heat dissipating device in the form of a ring as set forth in claim 1, wherein: the refrigerant liquid adopts a refrigerant with the model number of R134 a.

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