CN110958818B - Single-phase immersion type liquid cooling cabinet and single-phase immersion type liquid cooling system - Google Patents
Single-phase immersion type liquid cooling cabinet and single-phase immersion type liquid cooling system Download PDFInfo
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- CN110958818B CN110958818B CN201911267611.1A CN201911267611A CN110958818B CN 110958818 B CN110958818 B CN 110958818B CN 201911267611 A CN201911267611 A CN 201911267611A CN 110958818 B CN110958818 B CN 110958818B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of heat dissipation of electronic information equipment, and discloses a single-phase immersed liquid cooling cabinet and a single-phase immersed liquid cooling system, wherein the single-phase immersed liquid cooling cabinet comprises a cabinet body, the cabinet body is provided with a liquid inlet pipeline, a liquid outlet pipeline and a space for containing cooling liquid and electronic information equipment, and the electronic information equipment comprises a main heating element and a secondary heating element; further comprising: the radiator is arranged in the electronic information equipment and used for radiating heat for the main heating element, the radiator is attached to the surface of the main heating element and is provided with a cooling liquid flow channel; the liquid inlet of the radiator is communicated with the liquid supply pipeline, and the liquid outlet of the radiator is communicated with the internal space of the electronic information equipment; or the liquid inlet of the radiator is communicated with the inner space of the electronic information equipment, and the liquid outlet of the radiator is communicated with the liquid return pipeline. In the above embodiment, the primary heating element and the secondary heating element are respectively cooled, so that the heat dissipation effect is improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic information equipment, in particular to a single-phase immersed liquid cooling cabinet and a single-phase immersed liquid cooling system.
Background
With the technological progress and the vigorous development of big data technology, the performance requirements of electronic information equipment are higher and higher, the performance improvement inevitably brings great increase of the heat productivity and the heat flux density of electronic elements, if the heat produced by the electronic elements during working is not taken away in time, the internal temperature of the elements is rapidly increased, the working reliability of the electronic elements is very sensitive to the temperature, which brings a serious challenge to the traditional low-efficiency air cooling technology, and therefore the liquid cooling technology gradually becomes a hot spot for the research of the heat dissipation technology of the high-density electronic information equipment.
When the single-phase immersion type liquid cooling technology is generally applied, the cooling liquid is only driven to flow in from the liquid inlet end of the electronic information equipment and flow out from the liquid outlet end of the electronic information equipment, and when the cooling liquid flows through the inside of the whole electronic information equipment, the cooling liquid exchanges heat with the main heating element and the secondary heating element at the same time, and the main heating element and the secondary heating element are not distinguished, so that the cooling capacity supply is not accurate enough, and certain cooling capacity waste exists. In addition, because the inside circulation sectional area of electronic information equipment is great and heating element arranges in a jumble and shelter from each other, this makes the actual velocity of flow of coolant liquid lower, can't effectively fully carry out the heat transfer with main heating element.
Disclosure of Invention
The invention provides a single-phase immersion type liquid cooling cabinet and a single-phase immersion type liquid cooling system, which are used for improving the heat exchange effect of cooling liquid and a main heating element, realizing accurate supply of the cooling liquid and reducing the waste of cooling capacity.
The embodiment of the invention provides a single-phase immersed liquid cooling cabinet, which comprises a cabinet body, wherein the cabinet body is provided with a liquid inlet pipeline, a liquid outlet pipeline and a space for containing cooling liquid and electronic information equipment, wherein the electronic information equipment comprises a main heating element and a secondary heating element; further comprising:
the radiator is arranged in the electronic information equipment and used for radiating heat for the main heating element, is attached to the surface of the main heating element and is provided with a cooling liquid flow channel;
the liquid inlet of the radiator is communicated with the liquid supply pipeline, and the liquid outlet of the radiator is communicated with the internal space of the electronic information equipment; or the liquid inlet of the radiator is communicated with the inner space of the electronic information equipment, and the liquid outlet of the radiator is communicated with the liquid return pipeline.
In the embodiment, the cooling liquid is forcibly and intensively introduced into the radiator to cool the main heating element, and the cooling liquid is introduced into the electronic information equipment to cool the secondary heating element, so that the main heating element and the secondary heating element are respectively cooled, the heat exchange effect of the cooling liquid and the main heating element is effectively enhanced, and the cooling performance of the single-phase immersion type liquid cooling system is enhanced; meanwhile, the supply of cooling liquid can be controlled according to the heating quantity of the main heating element, the waste of cooling capacity is effectively reduced, and the cooling effect is improved.
Optionally, when the liquid inlet of the heat sink is communicated with the liquid supply pipeline, the liquid outlet of the heat sink is arranged close to the liquid inlet end of the electronic information device;
when the liquid outlet of the radiator is communicated with the liquid return pipeline, the liquid inlet of the radiator is arranged close to the liquid outlet end of the electronic information equipment.
Optionally, the heat sink includes one or more liquid-cooled plates, and a flow channel is provided in each liquid-cooled plate, and a first branch and a second branch are provided and communicated with the flow channel;
when the quantity of liquid cooling board is a plurality of, between two adjacent liquid cooling boards, the first branch road of the last liquid cooling board communicates with the second branch road of the preceding liquid cooling board.
Optionally, the number of the radiators is multiple, and the radiators are connected in parallel.
Optionally, an interface heat conduction material is arranged between the liquid cooling plate and the corresponding main heating element.
Optionally, the liquid cooling plate is further provided with a first branch pipe and a second branch pipe, which are communicated with the flow channel, and the first branch pipe and the second branch pipe are flexible pipelines.
Optionally, the internal flow channel of the liquid cooling plate is provided with a plurality of bending portions. The design can increase the area of contact of coolant liquid and liquid cooling board like this, improves the heat transfer effect of coolant liquid and liquid cooling board.
Optionally, a plurality of rows of cross-arranged turbulence columns are arranged in the internal flow channel of the liquid cooling plate. The design can increase the disturbance when the coolant liquid flows, improves the heat transfer effect of coolant liquid and liquid cooling board.
The embodiment of the invention also provides a single-phase immersion type liquid cooling system, which comprises the single-phase immersion type liquid cooling cabinet in any one of the technical schemes, and further comprises a cooling device arranged outside the cabinet body, wherein the liquid inlet pipeline and the liquid outlet pipeline are respectively communicated with the cooling device.
In the above embodiment, the cooling liquid may be first introduced into the heat sink to absorb heat generated by the primary heating element, and the cooling liquid flows out of the heat sink and enters the electronic information device to absorb heat generated by the secondary heating element, or the cooling liquid may be first introduced into the electronic information device to absorb heat generated by the secondary heating element, and then enters the heat sink to absorb heat generated by the primary heating element, so that the primary heating element and the secondary heating element are cooled separately; the cooling liquid absorbs the heat generated by the main heating element and the secondary heating element, the temperature rises, the high-temperature cooling liquid enters the cooling device through the liquid outlet pipeline to release heat, and the cooling liquid with the lowered temperature returns to the cabinet body through the liquid inlet pipeline again to complete one circulation.
Optionally, the cooling device is any one of an air cooler, a cooling tower, a heat exchanger and an air conditioner external unit.
Optionally, a circulation pump is arranged on the liquid supply pipeline or the liquid return pipeline.
Drawings
Fig. 1 is a schematic diagram illustrating a single-phase immersion liquid cooling system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another single-phase immersion liquid cooling system according to an embodiment of the present invention;
fig. 3 is a schematic connection diagram of a heat sink disposed in an electronic information device according to an embodiment of the present invention;
fig. 4 is a schematic connection diagram of a heat sink provided in another electronic information device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a liquid cooling plate according to an embodiment of the present invention.
Reference numerals:
01-cabinet body
011-liquid supply pipeline 012-liquid return pipeline
02-electronic information device
021 primary heating element 022 secondary heating element
023-liquid inlet end 024-liquid outlet end
03-Cooling device
04-liquid cooling plate 041-runner 0411-bending part 042-turbulence column
05-first branch pipe 06-second branch pipe
07-circulation pump
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a single-phase immersed liquid cooling cabinet, which is characterized in that cooling liquid is forcibly and intensively introduced into a radiator to cool a main heating element, and the cooling liquid is introduced into electronic information equipment to cool a secondary heating element, so that the main heating element and the secondary heating element are respectively cooled, and the heat dissipation effect is improved.
The single-phase immersed liquid cooling cabinet comprises a cabinet body, wherein the cabinet body is provided with a liquid inlet pipeline, a liquid outlet pipeline and a space for containing cooling liquid and electronic information equipment, wherein the electronic information equipment comprises a main heating element and a secondary heating element; further comprising:
the radiator is arranged in the electronic information equipment and used for radiating heat for the main heating element, the radiator is attached to the surface of the main heating element and is provided with a cooling liquid flow channel;
the liquid inlet of the radiator is communicated with the liquid supply pipeline, and the liquid outlet of the radiator is communicated with the internal space of the electronic information equipment; or the liquid inlet of the radiator is communicated with the inner space of the electronic information equipment, and the liquid outlet of the radiator is communicated with the liquid return pipeline.
In the above embodiment, the low-temperature cooling liquid may be preferentially introduced into the radiator, the low-temperature cooling liquid absorbs heat generated by the primary heating element, flows out of the radiator, and enters the cabinet, in which the cooling liquid flows through other areas in the electronic information device to cool the secondary heating element, or the low-temperature cooling liquid may be preferentially introduced into the electronic information device, and the low-temperature cooling liquid exchanges heat with the secondary heating element on the electronic information device, and enters the radiator after being converged to cool the primary heating device; therefore, the cooling liquid is introduced into the radiator in a forced and integrated manner, so that forced convection can be formed between the cooling liquid and the radiator, the heat exchange effect of the cooling liquid and the main heating element is effectively enhanced, and the cooling performance of the single-phase immersed liquid cooling system is enhanced.
For a clearer understanding of the composition and the working principle of the single-phase immersion liquid cooling system provided by the embodiment of the present invention, reference will now be made to the following detailed description taken in conjunction with the accompanying drawings.
As shown in fig. 1 and 2, the single-phase immersion type liquid cooling cabinet includes a cabinet body 01, and the cabinet body 01 is provided with a liquid supply pipeline 011, a liquid return pipeline 012, and a space for accommodating a cooling liquid and a plurality of electronic information devices 02, wherein the liquid supply pipeline 011 is used for supplying a low-temperature cooling liquid to the inside of the cabinet body 01, and the liquid return pipeline 012 is used for outputting a high-temperature cooling liquid that absorbs heat of the electronic information devices 02 in the cabinet body 01. The electronic information device 02 includes a housing and various electrical components disposed inside the housing, and may be divided into a primary heating element 021 and a secondary heating element 022, where the primary heating element 021 refers to a device on the electronic information device that generates a larger amount of heat or has a higher heat flow density, and the secondary heating element 022 refers to another device on the electronic information device that generates a smaller amount of heat and has a lower heat flow density. The electronic information devices 02 are partially or completely immersed in the cooling liquid, each electronic information device 02 is provided with a liquid inlet 023 and a liquid outlet 024, and the liquid inlet 023 and the liquid outlet 024 of the electronic information devices 02 are relative to the flow direction of the cooling liquid and are not particularly specified to one end of the electronic information device 02; structurally, the electronic information device 02 is generally a rectangular parallelepiped structure, and includes a front end and a rear end, where the front end refers to an end provided with a suspension loop and a power on/off button, the rear end is an end opposite to the front end, and both the front end and the rear end have openings, when a cooling liquid enters from the front end of the electronic information device 02, passes through an internal space of the electronic information device 02, and flows out from the rear end, the front end is a liquid inlet 023 and the rear end is a liquid outlet 024, otherwise, when the cooling liquid enters from the rear end of the electronic information device 02, and flows out from the front end, the rear end is a liquid inlet 023 and the front end is a liquid outlet 024 of the electronic information device 02.
The single-phase immersed liquid cooling cabinet also comprises a radiator which is arranged inside the electronic information equipment 02 and used for radiating heat for the main heating element 021, the radiator is attached to the surface of the main heating element 021 and is provided with a cooling liquid flow channel, the main heating element 021 firstly exchanges heat with the radiator, the radiator transfers the absorbed heat to cooling liquid passing through the inside, and in order to improve the heat radiating effect, an interface heat conduction material is arranged between the radiator and the main heating element 021; when the electronic information equipment is specifically connected, a liquid inlet of the radiator can be communicated with the liquid supply pipeline 011, a liquid outlet of the radiator is communicated with the internal space of the electronic information equipment 02, at the moment, low-temperature cooling liquid preferentially enters the radiator through the liquid supply pipeline 011, the cooling liquid absorbs heat generated by the primary heating element 021, then flows out of the radiator and enters the cabinet body 01, the cooling liquid absorbs heat generated by the secondary heating element 022 again in the cabinet body 01, the heat-absorbed cooling liquid flows out of a liquid outlet end 024 of the electronic information equipment 02 and returns to a cooling device 03 arranged outside the cabinet body 01 through a liquid return pipeline 012 to release heat, namely, the cooling liquid preferentially cools the primary heating element 021 and then cools the secondary heating element 022; or, the liquid inlet of the radiator may be communicated with the liquid return pipeline 012, and the liquid outlet of the radiator may be communicated with the liquid return pipeline 012, at this time, the low-temperature cooling liquid enters the cabinet 01 through the liquid supply pipeline 011, and then preferentially enters the electronic information device 02 through the liquid inlet port 023 of the electronic information device 02, in the electronic information device 02, the cooling liquid enters the radiator after absorbing the heat generated by the secondary heating element 022, and further absorbs the heat generated by the primary heating element 021 in the radiator, and the cooling liquid after absorbing the heat returns to the cooling device 03 through the liquid return pipeline 012 to release the heat, that is, the cooling liquid preferentially cools the secondary heating element 022, and then cools the primary heating element 021. In this way, the cooling liquid is forcibly and intensively introduced into the radiator to cool the primary heating element 021, and the cooling liquid is introduced into the electronic information device 02 to cool the secondary heating element 022, so that the primary heating element 021 and the secondary heating element 022 are cooled respectively, the supply of the cooling liquid can be controlled according to the heating amount of the primary heating element 021, the waste of cooling capacity is effectively reduced, and the cooling effect is improved; meanwhile, when the cooling liquid flows through the radiator, forced convection is formed between the cooling liquid and the radiator, so that the heat exchange effect of the cooling liquid and the main heating element 021 is effectively enhanced, and the cooling performance of the single-phase immersed liquid cooling system is enhanced.
In order to ensure that the cooling liquid can exchange heat with all secondary heating elements 022 on the electronic information equipment 02 in the flowing process, specifically, when the liquid inlet of the radiator is communicated with the liquid supply pipeline 011, the liquid outlet of the radiator is arranged close to the liquid inlet end 023 of the electronic information equipment 02, so that the cooling liquid flowing out of the radiator can flow from the liquid inlet end 023 to the liquid outlet end 024 of the electronic information equipment 02, and the cooling liquid exchanges heat with the secondary heating elements 022 in the flowing process, so that the heat exchange effect is enhanced, and a circulation dead zone is prevented from being formed in the electronic information equipment 02; similarly, when the liquid outlet of the heat sink is communicated with the liquid return pipeline 012, the liquid inlet of the heat sink is close to the liquid outlet 024 of the electronic information device 02, so that the heat exchange between the cooling liquid entering the heat sink and all the secondary heating elements 022 in the electronic information device 02 is ensured, the cooling effect of the secondary heating elements 022 is improved, and the formation of a circulation dead zone in the electronic information device 02 is avoided.
Specifically, the heat sink may include one or more liquid-cooled plates 04, each liquid-cooled plate 04 is provided with a flow channel 041, a first branch pipe 05 and a second branch pipe 06 communicated with the flow channel 041, and for the liquid-cooled plate 04, the first branch pipe 05 is a liquid inlet pipeline, the second branch pipe 06 is a liquid outlet pipeline, each liquid-cooled plate 04 is attached to a surface of one main heating element 021, and for the case of one liquid-cooled plate 04, as shown in fig. 1, the liquid-cooled plate 04 is communicated with a liquid supply pipeline 011 through the first branch pipe 05 and is communicated with an internal space of the electronic information device 02 through the second branch pipe 06, and a liquid outlet of the second branch pipe 06 is disposed near a liquid inlet port 023 of the electronic information device 02; alternatively, as shown in fig. 2, the liquid cooling plate 04 is communicated with the internal space of the electronic information device 02 through a first branch pipe 05, the liquid inlet of the first branch pipe 05 is disposed near the liquid outlet 024 of the electronic information device 02, and the liquid cooling plate 04 is communicated with the liquid return pipe 012 through a second branch pipe 06.
For the situation of a plurality of liquid cooling plates 04, the liquid cooling plates 04 are connected in series, when the liquid cooling plates are connected in series, the first branch pipe 05 of the next liquid cooling plate 04 is communicated with the second branch pipe 06 of the previous liquid cooling plate 04, so that after the liquid cooling plates are connected in series, the group of liquid cooling plates 04 can be communicated with the liquid supply pipeline 011 through the first branch pipe 05 positioned at one end and communicated with the inner space of the electronic information equipment 02 through the second branch pipe 06 positioned at the other end, and the liquid outlet of the second branch pipe 06 is arranged close to the liquid inlet end 023 of the electronic information equipment 02; alternatively, the set of liquid cooling plates 04 may also be communicated with the internal space of the electronic information device 02 through the first branch pipe 05 located at one end, and communicated with the liquid return pipe 012 through the second branch pipe 06 located at the other end, and the liquid inlet of the first branch pipe 05 is disposed near the liquid outlet 024 of the electronic information device 02.
The number of the radiators in the electronic information device 02 can be set according to the number of the main heating elements 021, when a plurality of radiators are arranged in each electronic information device 02, the radiators are connected in parallel, and the number of the liquid cooling plates 04 in each radiator is specifically set according to needs. As shown in fig. 3, two radiators are provided in the electronic information device 02, each radiator includes one liquid-cooled plate 04, and each liquid-cooled plate 04 is communicated with the liquid supply line 011 through a first branch pipe 05 and is communicated with the internal space of the electronic information device 02 through a second branch pipe 06; in another structure, as shown in fig. 4, a heat sink is provided in the electronic information device 02, and the heat sink includes two liquid-cooled plates 04 connected in series, and the two liquid-cooled plates 04 connected in series are connected to the liquid supply line 011 through a first branch pipe 05 at one end and connected to the internal space of the electronic information device through a second branch pipe 06 at the other end. Because the internal structure of the electronic information equipment 02 is complex, the first branch pipe 05 and the second branch pipe 06 can adopt flexible pipes, the flexible pipes are convenient to connect, and the pipes are not easy to interfere with other electronic elements on the electronic information equipment 02.
In the heat dissipation process, heat generated by the main heating element 021 of the electronic information device 02 is first transferred to the liquid-cooling plate 04 in a heat conduction manner, and the cooling liquid carries away most of the heat when flowing through the liquid-cooling plate 04. In order to enhance the heat conduction process, the liquid cooling plate 04 is made of a material with high heat conductivity, which may be, but not limited to, copper or aluminum, and the like, and meanwhile, in order to reduce the contact thermal resistance between the main heating element 021 and the liquid cooling plate 04, the liquid cooling plate 04 needs to be tightly attached to the surface of the main heating element 021, the contact surfaces of the main heating element 021 and the liquid cooling plate 04 need to be flat, an interface heat conduction material may be filled in a gap between the contact surfaces, the interface heat conduction material may be, but not limited to, an indium sheet or heat conduction silicone grease, and the type and filling size requirements of the material may be. After the liquid cooling plate 04 absorbs heat of the main heating element 021, the liquid cooling plate 04 transfers the main heat to cooling liquid inside the liquid cooling plate 04 in a convection heat exchange mode, in order to enhance a convection heat exchange coefficient between the cooling liquid and the liquid cooling plate 04, the contact area between the liquid cooling plate 04 and the cooling liquid can be increased through structural design, and the disturbance when the cooling liquid flows through the inside of the liquid cooling plate 04 is enhanced. The liquid cooling plate 04 may be, but not limited to, a microchannel liquid cooling plate, and the overall size, the internal flow channel size, the turn-back times of the flow channel, and the dimensions of the spoiler column of the microchannel liquid cooling plate are obtained by optimizing the physical parameters of the cooling liquid and the heating condition of the main heating element 021 in the electronic information device 02.
Referring to fig. 1 and fig. 2 together, an embodiment of the present invention further provides a single-phase immersion liquid cooling system, including any one of the single-phase immersion liquid cooling cabinets according to the above technical solutions, and further including a cooling device 03 disposed outside the cabinet 01, the cabinet 01 is respectively communicated with the cooling device 03 through a liquid inlet pipe 011 and a liquid outlet pipe 012, and a circulation pump 07 is disposed on the liquid supply pipe 011 or the liquid return pipe 012. After the cooling liquid in the cabinet 01 absorbs heat generated by the primary heating element 021 and the secondary heating element 022 inside the electronic information device 02, the temperature rises, the high-temperature cooling liquid enters the cooling device 03 through the liquid outlet pipe 012 to release heat, and the cooling liquid with the lowered temperature returns to the cabinet 01 through the liquid inlet pipe 011 again to complete one cycle.
The cold-side medium of the cooling device 03 may be, but is not limited to, air, water, etc., and the cooling device 03 may take various forms depending on the cold-side medium, and may be, but is not limited to, an air cooler directly using air cooling, a cooling tower using an evaporative cooling method, an outdoor unit of an air conditioner using a vapor compression refrigeration technology, a heat exchanger using chilled water or cooling water for cooling, etc.
In the single-phase immersed liquid cooling system, the cooling liquid is a liquid, has the characteristics of insulation, safety, stability and the like, and has no phase change within the range of the working temperature. Typical substances that can be used as cooling fluids are: aliphatic compounds, or fatty hydrocarbons, include primarily petroleum hydrocarbon radicals or isoparaffinic hydrocarbon radicals, such as mineral oil, synthetic oil, and the like. A silicone-based material; silicone-based materials include dimethyl siloxane and methyl siloxane, also known as silicone oils; fluorocarbon compounds mainly refer to organic compounds or polymers in which fluorine is substituted for the corresponding carbon chain hydrogen atoms, including perfluoroalkanes, perfluoroamines, hydrofluoroethers, perfluoroketones, hydrofluorocarbons, and the like.
As can be seen from the above description, in the single-phase immersion type liquid cooling system provided in the embodiment of the present invention, the cooling liquid is forcibly introduced into the radiator in a centralized manner, so that the cooling liquid absorbs heat generated by the main heating element, thereby effectively enhancing the heat exchange effect between the cooling liquid and the main heating element, and enhancing the cooling performance of the single-phase immersion type liquid cooling system; meanwhile, the main heating element and the secondary heating element are respectively cooled, so that the supply of cooling liquid can be adjusted according to the heat productivity of the main heating element, the waste of cold energy is effectively reduced, and the cooling effect is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A single-phase immersed liquid cooling cabinet comprises a cabinet body, wherein the cabinet body is provided with a liquid inlet pipeline, a liquid outlet pipeline and a space for containing cooling liquid and electronic information equipment, wherein the electronic information equipment comprises a main heating element and a secondary heating element; it is characterized by also comprising:
the radiator is arranged in the electronic information equipment and used for radiating heat for the main heating element, is attached to the surface of the main heating element and is provided with a cooling liquid flow channel;
the liquid inlet of the radiator is communicated with a liquid supply pipeline, and the liquid outlet of the radiator is communicated with the internal space of the electronic information equipment; the low-temperature cooling liquid enters the radiator through the liquid supply pipeline, the cooling liquid absorbs heat generated by the main heating element and then flows out of the radiator and enters the electronic information equipment, the cooling liquid absorbs heat generated by the secondary heating element again in the electronic information equipment, and the cooling liquid after absorbing heat flows out of the liquid outlet end of the electronic information equipment and returns to a cooling device arranged outside the cabinet body through a liquid return pipeline to release heat;
or the liquid inlet of the radiator is communicated with the inner space of the electronic information equipment, and the liquid outlet of the radiator is communicated with the liquid return pipeline; low-temperature cooling liquid gets into through the liquid feed pipeline behind the cabinet body, the warp the inlet liquor end entering of electronic information equipment inside the electronic information equipment, in the electronic information equipment, the coolant liquid absorbs get into behind the heat that secondary heating element produced in the radiator, and absorb once more in the radiator the heat that main heating element produced, the coolant liquid after the heat absorption passes through return liquid pipeline gets back the setting and is in heat release is carried out in the external cooling device of cabinet.
2. The single-phase immersion liquid-cooled cabinet of claim 1, wherein when the inlet of the heat sink is in communication with the liquid supply line, the outlet of the heat sink is disposed proximate to the inlet of the electronic information device;
when the liquid outlet of the radiator is communicated with the liquid return pipeline, the liquid inlet of the radiator is arranged close to the liquid outlet end of the electronic information equipment.
3. The single-phase immersion liquid-cooled cabinet of claim 1, wherein the heat sink comprises one or more liquid-cooled panels, and wherein the liquid-cooled panels have flow channels therein and first and second branches in communication with the flow channels;
when the quantity of liquid cooling board is a plurality of, between two adjacent liquid cooling boards, the first branch road of the last liquid cooling board communicates with the second branch road of the preceding liquid cooling board.
4. The single-phase immersion liquid-cooled cabinet of claim 1, wherein the number of the heat sinks is plural, and a plurality of the heat sinks are connected in parallel.
5. The single-phase immersion liquid-cooled cabinet of claim 3, wherein an interface thermally conductive material is disposed between the liquid-cooled plate and the corresponding primary heating element.
6. The single-phase immersion liquid cooled cabinet of claim 3, wherein the first branch and the second branch are flexible tubing.
7. The single-phase immersion liquid cooled cabinet of claim 3 wherein the flow path inside the liquid cooled panel is provided with a plurality of bends.
8. The single-phase immersion liquid-cooled cabinet of claim 7, wherein the flow passages within the liquid-cooled plate have a plurality of rows of cross-aligned turbulators.
9. A single-phase immersion liquid cooling system, comprising the single-phase immersion liquid cooling cabinet of any one of claims 1 to 8, and further comprising a cooling device disposed outside the cabinet body, wherein the liquid inlet pipeline and the liquid outlet pipeline are respectively communicated with the cooling device.
10. The single-phase submerged liquid cooling system of claim 9, wherein the cooling device is any one of an air cooler, a cooling tower, a heat exchanger, and an outdoor unit of an air conditioner.
11. The single-phase immersion liquid cooling system of claim 9, wherein a circulation pump is disposed on the liquid supply line or the liquid return line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911267611.1A CN110958818B (en) | 2019-12-11 | 2019-12-11 | Single-phase immersion type liquid cooling cabinet and single-phase immersion type liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911267611.1A CN110958818B (en) | 2019-12-11 | 2019-12-11 | Single-phase immersion type liquid cooling cabinet and single-phase immersion type liquid cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110958818A CN110958818A (en) | 2020-04-03 |
| CN110958818B true CN110958818B (en) | 2021-06-04 |
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| CN113301766B (en) * | 2020-07-24 | 2023-07-18 | 阿里巴巴集团控股有限公司 | Single-phase immersed liquid cooling system |
| CN113038807B (en) * | 2021-03-31 | 2022-12-09 | 上海鹄恩信息科技有限公司 | Control method of liquid-cooled electric energy system, liquid-cooled electric energy system and storage medium |
| CN115248623A (en) * | 2021-04-28 | 2022-10-28 | 华为云计算技术有限公司 | Cooling device and server including the same |
| CN115371473A (en) * | 2021-05-20 | 2022-11-22 | 北京鲲鹏凌昊智能技术有限公司 | Device for ensuring coolant steam purity through gas storage cavity |
| CN114756110A (en) * | 2022-06-16 | 2022-07-15 | 天津提尔科技有限公司 | Low-voltage direct-current power supply immersion liquid cooling calculation server |
| CN116528572B (en) * | 2023-06-21 | 2023-09-12 | 苏州浪潮智能科技有限公司 | Single-phase cold plate type liquid cooling system, control method thereof and electronic equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839904A (en) * | 2012-11-21 | 2014-06-04 | 三菱电机株式会社 | Electric power converter |
| CN108811472A (en) * | 2018-08-15 | 2018-11-13 | 北京百度网讯科技有限公司 | Liquid cooling server apparatus, server and liquid cooling apparatus |
| CN109664796A (en) * | 2017-10-17 | 2019-04-23 | 福特全球技术公司 | Fluid circuit fill assembly and fill method |
| CN109952003A (en) * | 2019-04-11 | 2019-06-28 | 苏州浪潮智能科技有限公司 | A kind of data center's liquid cooling system |
| CN209489058U (en) * | 2018-11-06 | 2019-10-11 | 北京丰联奥睿科技有限公司 | A kind of heat pipe exchanging type electronic equipment liquid cooling system |
| CN110475459A (en) * | 2014-09-26 | 2019-11-19 | 液体冷却解决方案公司 | The cooling means of heat-generating electronic elements and the electronic system of liquid-immersed cooling |
-
2019
- 2019-12-11 CN CN201911267611.1A patent/CN110958818B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839904A (en) * | 2012-11-21 | 2014-06-04 | 三菱电机株式会社 | Electric power converter |
| CN110475459A (en) * | 2014-09-26 | 2019-11-19 | 液体冷却解决方案公司 | The cooling means of heat-generating electronic elements and the electronic system of liquid-immersed cooling |
| CN109664796A (en) * | 2017-10-17 | 2019-04-23 | 福特全球技术公司 | Fluid circuit fill assembly and fill method |
| CN108811472A (en) * | 2018-08-15 | 2018-11-13 | 北京百度网讯科技有限公司 | Liquid cooling server apparatus, server and liquid cooling apparatus |
| CN209489058U (en) * | 2018-11-06 | 2019-10-11 | 北京丰联奥睿科技有限公司 | A kind of heat pipe exchanging type electronic equipment liquid cooling system |
| CN109952003A (en) * | 2019-04-11 | 2019-06-28 | 苏州浪潮智能科技有限公司 | A kind of data center's liquid cooling system |
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