CN210015419U

CN210015419U - Semiconductor device heat abstractor and data center computer lab

Info

Publication number: CN210015419U
Application number: CN201921201709.2U
Authority: CN
Inventors: 李越峰; 袁竹; 张娣
Original assignee: Sichuan Jia Gang Technology Co Ltd; Sichuan Changhong Air Conditioner Co Ltd
Current assignee: Sichuan Jia Gang Technology Co Ltd; Sichuan Changhong Air Conditioner Co Ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-02-04
Anticipated expiration: 2029-07-29

Abstract

The utility model discloses a semiconductor device heat dissipation device and a data center machine room, which comprises a condenser and at least two groups of loop heat pipes which are respectively contacted with different semiconductor devices; the outlet ends of the two groups of loop heat pipes are communicated with the inlet end of the condenser after being communicated with each other, and the outlet ends of the condenser are respectively communicated with the inlet ends of the loop heat pipes after being shunted by the shunt part. The utility model discloses a loop heat pipe utilizes the phase transition of inside working medium to absorb heat and dispel the heat, dispose respective loop heat pipe to different semiconductor device, utilize loop heat pipe and semiconductor device to carry out heat exchange and realize the heat dissipation, and adjust the flow ratio of condenser according to different semiconductor device's heat dissipation capacity through the reposition of redundant personnel part, make the liquid working medium flow in the different loop heat pipes and semiconductor device's calorific capacity phase-match, realize the nimble distribution to heat dissipation resource, make the radiating efficiency higher, reach better radiating effect, can not cause the waste of resource.

Description

Semiconductor device heat abstractor and data center computer lab

Technical Field

The utility model belongs to the technical field of the semiconductor cooling system technique and specifically relates to a semiconductor device heat abstractor and data center computer lab.

Background

Semiconductor devices are electronic devices that have electrical conductivity between a good electrical conductor and an insulator, and that use the special electrical properties of the semiconductor material to perform specific functions, which can be used to generate, control, receive, convert, amplify signals, and perform energy conversion. Semiconductor devices are widely used in various fields of engineering, especially in the application of semiconductor chips. At present, applications of semiconductor chips are represented by computer CPUs, IPMs of air conditioners, and power components of PFC circuits, and also lasers and display chips in laser projectors. These semiconductor devices generate a large amount of heat in applications accompanied by their high-performance operation, and in order to prevent a malfunction that may occur in electronic equipment due to a temperature rise of these semiconductor devices, it is necessary to improve the heat dissipation of the semiconductor devices so that the generated heat can be satisfactorily released to the outside.

At present, the heat dissipation of the semiconductor device mainly adopts the following modes: 1. the aluminum profile radiator and the fan are integrated, the heat-conducting silicone grease and the semiconductor heating object are fastened together, and the aluminum profile radiator conducts heat out through the operation of the fan and exhausts the heat to the outside of the machine body, so that the cooling function is realized; 2. one end of the gravity heat pipe is fixedly connected with the semiconductor heating device, heat is conducted to the aluminum profile radiator with the fan, and the heat is discharged to the outside of the machine body through air flowing through the aluminum profile, so that cooling is realized; 3. by utilizing the refrigeration cycle, a compressor is generally adopted, the cold end and the heating semiconductor are fastened and connected to cool, and the refrigeration cycle is utilized to transfer heat to the outside of the machine body.

The heat dissipation scheme for the semiconductor device only guides the heat of the heating device to the nearby air through the heat conduction structure, and for the semiconductor device with large heating value, the heat is still concentrated around the heating device, and the semiconductor device still fails due to overhigh heat over time. The applicant has previously proposed a patent application of a semiconductor heat dissipation device for performing long-distance heat transfer on a heating semiconductor device by using a loop heat pipe, but in view of the fact that the existing equipment often has a plurality of semiconductor device heating sources with different powers, which have different heating values and different requirements for heat dissipation capacity, if heat dissipation resources are not reasonably distributed, resources are wasted, and the heat dissipation effect is also affected.

The data center machine room is an important application area of semiconductor devices, a large number of servers are generally placed in the data center machine room, the servers contain a large number of semiconductor devices with different specifications, the heat productivity of the servers is large, a heat dissipation system adopted by the existing data center machine room mainly adopts two modes of wind cooling and liquid cooling, the air-cooled machine room heat dissipation system mainly depends on a machine room air conditioner to reduce the indoor air temperature of the machine room, and then air flow is organized through fans and channels arranged in a machine cabinet of the servers to enable indoor cold air to enter the machine cabinet to be subjected to heat exchange with the servers, the heat dissipation technology is developed more mature, but a large amount of energy is consumed, and the organized air flow can increase the heat exchange temperature difference between the servers and the cold air, so that local overheating is; the development of a liquid-cooled machine room heat dissipation system is late, various forms such as water-cooled heat dissipation at the tail end of the existing machine room air conditioner combination, soaking heat dissipation and the like exist, but the technical problems that the liquid leakage easily causes circuit failure, component corrosion and the like exist.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: a heat sink for semiconductor device is provided, which can flexibly distribute heat dissipation resources by using loop heat pipe to satisfy the heat dissipation requirement of multiple different semiconductor devices

For solving the technical problem the utility model discloses the technical scheme who adopts is: the semiconductor device heat dissipation device comprises a condenser and at least two groups of loop heat pipes which are respectively contacted with different semiconductor devices; the outlet ends of the two groups of loop heat pipes are communicated with the inlet end of the condenser after being communicated with each other, and the outlet ends of the condenser are respectively communicated with the inlet ends of the loop heat pipes after being shunted by the shunt part.

Further, the method comprises the following steps: the loop heat pipe comprises an evaporator, a steam pipeline and a liquid pipeline, wherein the evaporator is in contact with the surface of the semiconductor device; the outlet end of the evaporator is communicated with the inlet end of the condenser through a steam pipeline, and the outlet end of the condenser is communicated with the inlet end of the evaporator through a liquid pipeline; the condenser and the vapor line are located at a height greater than the evaporator and the liquid line.

Further, the method comprises the following steps: a liquid storage device is arranged in the evaporator, a steam pipeline and a liquid pipeline of the liquid storage device are communicated, and a liquid working medium is arranged in the liquid storage device.

Further, the method comprises the following steps: the loop heat pipe comprises an evaporator, a steam pipeline and a liquid pipeline, wherein the evaporator is in contact with the surface of the semiconductor device; the outlet end of the evaporator is communicated with the inlet end of the condenser through a steam pipeline, and the outlet end of the condenser is communicated with the inlet end of the evaporator through a liquid pipeline;

further, the method comprises the following steps: a liquid storage device and a capillary structure are arranged in the evaporator, a liquid working medium is filled in the liquid storage device, and the liquid storage device is arranged at the inlet end of the evaporator; the capillary structure is in communication with the reservoir and extends toward the outlet end of the evaporator.

Further, the method comprises the following steps: the loop heat pipe also comprises an initiator arranged at the inlet end of the evaporator, and the initiator is connected in series in the steam pipeline.

Further, the method comprises the following steps: at least one semiconductor connecting piece is arranged on the steam pipeline.

Further, the method comprises the following steps: the surface of the evaporator, which is in contact with the surface of the semiconductor device, is a flat surface; and a heat-conducting medium is filled between the evaporator and the surface of the semiconductor device.

The utility model also discloses a data center computer lab of including above-mentioned semiconductor device heat abstractor.

The utility model has the advantages that: the utility model discloses a loop heat pipe utilizes the phase transition of inside working medium to carry out heat absorption and heat dissipation, dispose respective loop heat pipe to different semiconductor device, utilize loop heat pipe and semiconductor device to carry out heat exchange and realize the heat dissipation, and adjust the flow ratio of condenser according to the heat dissipation capacity of different semiconductor device through the reposition of redundant personnel part, make the liquid working medium flow in the different loop heat pipes and the calorific capacity phase-match of semiconductor device, realize the nimble distribution to the heat dissipation resource, make the radiating efficiency higher, reach better radiating effect, can not cause the waste of resource; the data center machine room adopting the semiconductor device heat dissipation device can effectively reduce energy consumption, improve the heat dissipation effect on the server and have small influence on the environment.

Drawings

Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;

fig. 2 is a schematic structural diagram of a second embodiment of the present invention;

fig. 3 is a schematic structural diagram of a third embodiment of the present invention;

FIG. 4 is a schematic diagram of a first embodiment of a data center room;

FIG. 5 is a schematic diagram of a second embodiment of a data center room;

labeled as: the system comprises a semiconductor device 1, a condenser 2, a shunt part 3, an evaporator 4, a steam pipeline 5, a liquid pipeline 6, a liquid storage 7, a capillary structure 8, a semiconductor connecting piece 9, a machine room 11 and a server 12.

Detailed Description

In order to facilitate understanding of the present invention, the following description is further provided with reference to the accompanying drawings.

Semiconductor device heat abstractor carry out the heat exchange with semiconductor device through the loop heat pipe, the utility model discloses the heat dissipation capacity demand of different semiconductor devices is satisfied to two sets of or multiunit loop heat pipes of accessible. In the embodiment shown in fig. 1 to 3, two groups of loop heat pipes are used, the two groups of loop heat pipes are communicated with the same condenser 2, each group of loop heat pipes is respectively contacted with one semiconductor device 1 for heat exchange, the outlet ends of the two groups of loop heat pipes are communicated with the inlet end of the condenser 2 after being communicated with each other, and the outlet end of the condenser 2 is divided by the dividing component 3 and then is respectively communicated with the inlet ends of the loop heat pipes; the specific structure of the loop heat pipe comprises an evaporator 4, a steam pipeline 5 and a liquid pipeline 6, wherein the steam pipeline 5 and the liquid pipeline 6 are both in copper pipe structures, the outlet end of the evaporator 4 of the loop heat pipe is communicated with the inlet end of a condenser 2 through the steam pipeline 5, the outlet end of the condenser 2 is communicated with the inlet end of the evaporator 4 through the liquid pipeline 6, the steam pipelines 5 of the two groups of loop heat pipes are communicated with each other and then communicated with the condenser 2, and the liquid pipeline 6 at the outlet end of the condenser 2 is branched into two branches through a flow dividing component 3 and then is respectively communicated with the evaporators 4 of the two groups of loop heat pipes; the flow dividing component 3 is generally a flow regulating valve with wide applicability.

In the utility model, the condenser 2 adopts a tubular structure, the evaporator 4 can adopt a tubular structure or a cuboid structure, and in order to improve the heat transfer area, the surface of the evaporator 4 contacted with the surface of the semiconductor device 1 is preferably a flat surface, namely the evaporator 4 adopts a semi-circular tubular structure; in addition, because the machining process cannot process an ideal flat surface, there will be small gaps on the contact surface between the evaporator 4 and the semiconductor device 1, the gaps are filled with air, and the thermal resistance of the air is high, in order to reduce the thermal resistance and improve the heat dissipation performance, a heat-conducting medium is filled between the evaporator 4 and the semiconductor device 1, and the heat-conducting medium can be selected from heat-conducting silica gel, heat-conducting silicone grease or graphite gaskets.

The utility model discloses carry out the heat exchange between well evaporimeter 4 and semiconductor device 1, and the heat exchange relies on reservoir 7 in evaporimeter 4 to realize, as shown in fig. 1 to fig. 3, reservoir 7 sets up in evaporimeter 4, is equipped with liquid working medium in the reservoir 7, and liquid working medium generally chooses for use the cooling water commonly used. When the utility model works, because the surface of the evaporator 4 is tightly attached to the semiconductor device 1, the semiconductor device 1 generates heat and transmits the heat to the evaporator 4, the liquid working medium in the liquid storage device 7 absorbs heat and gasifies, and the gasified steam working medium in the two loop heat pipes is transmitted to the condenser 2 through the steam pipeline 5; the condenser 2 radiates heat through an air duct, the working medium in a steam state is converted into a liquid working medium after releasing heat, and then the liquid working medium is discharged into a liquid pipeline 6 through the condenser 2, when the working medium passes through the flow dividing part 3, the flow dividing part 3 performs flow distribution on the liquid working medium according to a preset flow dividing amount according to the heat radiation amount required by the semiconductor device 1 corresponding to the two loop heat pipes, so that the liquid working mediums with different flow ratios respectively enter the two loop heat pipes and then flow back to respective liquid reservoirs 7, and the flow distribution and the cyclic utilization of the liquid working medium are realized; if the required heat dissipation capacity of the semiconductor devices 1 corresponding to the two loop heat pipes is the same, the shunt part 3 is adjusted to enable the preset shunt capacity to be the same.

In addition, the utility model provides a loop heat pipe can adopt two kinds of implementation modes of gravity type loop heat pipe and capillary core type loop heat pipe, when adopting gravity type loop heat pipe, reservoir 7 in the evaporimeter 4 directly communicates with steam pipe 5, liquid pipeline 6, and condenser 2 and steam pipe 5 are located the height and are higher than the height that locates of evaporimeter 4 and liquid pipeline 6, this kind of implementation mode is through the difference in height of condenser 2 and evaporimeter 4, and the density is low after the gasification is heated according to liquid working medium, the high characteristics of density realize the circulation in the loop heat pipe after the condensation liquefaction, do not need to adopt other auxiliary structure; the capillary core type loop heat pipe utilizes a capillary structure 8, the capillary structure 8 is a tubular structure with a plurality of capillary holes distributed on the surface, the capillary structure 8 is communicated with the liquid storage device 7 and extends towards the outlet end of the evaporator 4, liquid working media in the liquid storage device 7 are continuously conveyed to a heat absorption section of the evaporator 4 through the capillary structure 8 by utilizing a capillary phenomenon for heat absorption, the heat-absorbed and gasified steam working media are discharged from the capillary holes of the capillary structure 8 and are discharged into the condenser 2 under the action of pressure difference between the steam pipeline 5 and the liquid pipeline 6.

In order to make the semiconductor device heat dissipating device of the present invention have a better starting effect, a starter may be further disposed near the inlet end of the evaporator 4, the starter is connected in series in the steam pipeline 5, and the heat power is provided to the loop heat pipe through the starter.

In order to make full use of the heat dissipation working medium in the loop heat pipe, the utility model discloses still increased the heat dissipation surplus that utilizes the loop heat pipe and come to some powers to be less than the miniwatt semiconductor device of above-mentioned semiconductor device 1 and carry out radiating function, as shown in fig. 1 to 3, be equipped with at least one semiconductor connecting piece 9 that is used for connecting the miniwatt semiconductor device on steam pipe 5, semiconductor connecting piece 9 can adopt buckle structure or suit structure to be connected the miniwatt semiconductor device to the loop heat pipe, make these different miniwatt semiconductor devices contact with steam pipe 5. The small power semiconductor devices are in contact with the steam pipeline 5 of the copper pipe structure, so that heat can be transferred to the steam pipeline 5, and then the heat is transferred to the condenser 2 through the heat dissipation circulation of the loop heat pipe. The arrangement position of the semiconductor connecting piece 9 can be reasonably selected according to the position, the number and the heat productivity of the low-power semiconductor devices needing to generate heat in the equipment, and as shown in fig. 1, the semiconductor connecting piece 9 can be arranged at the non-flow-closing sections of the steam pipelines 5 corresponding to different loop heat pipes; can also be arranged at the confluence section of the steam pipeline 5 as shown in FIG. 2; of course, as shown in fig. 3, the semiconductor connecting members 9 may be provided at both the non-flow-joining section and the flow-joining section of the steam line 5. The utility model discloses a semiconductor connecting piece 9 that sets up is connected to other miniwatt semiconductor device in the heat dissipation loop of loop heat pipe, has realized just satisfying all the heat dissipation demands that generate heat semiconductor device in the equipment with a condenser 2 in same heat abstractor.

The heat dissipation device for the semiconductor device continuously transfers the heat of the semiconductor device to the outside through the cyclic utilization of the liquid working medium in the loop heat pipe, does not need an external mechanical device to provide power, and can transfer more heat to a longer distance and avoid heat concentration compared with the existing heat dissipation device and a fan; compared with the existing gravity heat pipe radiating structure, the transmission efficiency is higher, and the cost is lower; compared with a cooling mode by applying a refrigerating system, the cooling system has low energy consumption and strong reliability; and the utility model is suitable for a different calorific capacity semiconductor device dispels the heat, certainly also be applicable to the same different semiconductor device of calorific capacity, under the condition of the radiating efficiency of heat dissipation loop that does not waste, utilize flow control valve to carry out nimble flow distribution to the liquid working medium after 2 cooling through the condenser, make the liquid working medium flow that gets into in the different loop heat pipes and the calorific capacity phase-match that corresponds separately, realized the rational distribution to the resource, the waste of resource has been reduced, radiating effect and radiating efficiency have been improved.

Semiconductor device heat abstractor can be applied to in the most has a plurality of semiconductor device's equipment, and data center computer lab is then typical application ground, data center computer lab is owing to placed a large amount of servers, install a large amount of semiconductor device on the server, the semiconductor device of server during operation generates heat and can make the temperature obviously rise in the data center computer lab, adopt above-mentioned semiconductor device heat abstractor can effectively improve the radiating effect of data center computer lab, when setting up semiconductor device heat abstractor in the data center computer lab, set up the condenser outdoor at the data center computer lab, it can to contact with the semiconductor device on the server in the loop heat pipe and the computer lab, indoor loop heat pipe can adopt parallelly connected or the form of establishing ties to connect the server of difference. As shown in fig. 4 and 5, for the servers 12 stacked in the same server cabinet in the same machine room 11, all the servers 12 in a single cabinet can be connected in series on the loop heat pipe in a serpentine pipe arrangement, and then the loop heat pipe is communicated with the outdoor condenser 2; when a plurality of server cabinets exist indoors, the loop heat pipes of each server cabinet can be connected in parallel and then communicated with the outdoor condenser 2. A plurality of cabinets can be arranged in the machine room 11, a plurality of layers of electronic equipment are arranged on the cabinets, one or more semiconductor devices are arranged in each layer of electronic equipment, a heat dissipation matrix formed by the cabinets can be formed by adopting parallel cabinets and semiconductor devices in the electronic equipment in series connection, can also be formed by adopting series cabinets and semiconductor devices in the electronic equipment in parallel connection, can also be formed by adopting parallel cabinets and series electronic equipment in parallel connection, and then the semiconductor devices in the electronic equipment in parallel connection are alternately connected in series and parallel to realize the communication between the loop heat pipe and a server in the machine room and a condenser outside the machine room, and then the flow distribution of liquid working media is carried out through a flow distribution part. Adopt the utility model discloses in behind the semiconductor device heat abstractor, the semiconductor device of server directly carries out the heat transfer with outdoor environment and condenser in the data center computer lab, need not initiative refrigeration cycle, utilizes the phase transition process of working medium to carry out heat transfer in the loop heat pipe, does not have extra energy resource consumption, also does not have unnecessary heat production, and is less to the influence of environment, and the radiating effect of server is excellent in the computer lab, and the efficiency is than higher.

Semiconductor device heat abstractor also can be applied to air condensing units class equipment, if be applied to air condensing units, condenser 2 can set up in the wind channel of off-premises station, the fan side at the air condensing units baffle is fixed in the installation. The condenser 2 can be selected from heat exchangers of existing air conditioners, refrigerators or vehicle air conditioners, such as fin heat exchangers, microchannel heat exchangers, tube-plate heat exchangers, wire-tube heat exchangers or rotary fin heat exchangers.

Claims

1. The heat sink of the semiconductor device, characterized by: comprises a condenser (2) and at least two groups of loop heat pipes which are respectively contacted with different semiconductor devices (1); the outlet ends of the loop heat pipes of all groups are communicated with the inlet end of the condenser (2), and the outlet ends of the condenser (2) are respectively communicated with the inlet ends of the loop heat pipes after being shunted by the shunting part (3).

2. The heat dissipating device for a semiconductor device as claimed in claim 1, wherein: the loop heat pipe comprises an evaporator (4), a vapor pipeline (5) and a liquid pipeline (6), wherein the evaporator (4) is in contact with the surface of the semiconductor device (1); the outlet end of the evaporator (4) is communicated with the inlet end of the condenser (2) through a steam pipeline (5), and the outlet end of the condenser (2) is communicated with the inlet end of the evaporator (4) through a liquid pipeline (6); the condenser (2) and the steam pipeline (5) are higher than the evaporator (4) and the liquid pipeline (6).

3. The heat dissipating device for a semiconductor device as claimed in claim 2, wherein: a liquid storage device (7) is arranged in the evaporator (4), the liquid storage device (7) is communicated with the steam pipeline (5) and the liquid pipeline (6), and a liquid working medium is arranged in the liquid storage device (7).

4. The heat dissipating device for a semiconductor device as claimed in claim 1, wherein: the loop heat pipe comprises an evaporator (4), a vapor pipeline (5) and a liquid pipeline (6), wherein the evaporator (4) is in contact with the surface of the semiconductor device (1); the outlet end of the evaporator (4) is communicated with the inlet end of the condenser (2) through a steam pipeline (5), and the outlet end of the condenser (2) is communicated with the inlet end of the evaporator (4) through a liquid pipeline (6).

5. The heat dissipating device for a semiconductor device as claimed in claim 4, wherein: a liquid storage device (7) and a capillary structure (8) are arranged in the evaporator (4), a liquid working medium is filled in the liquid storage device (7), and the liquid storage device (7) is arranged at the inlet end of the evaporator (4); the capillary structure (8) is in communication with the reservoir (7) and extends towards the outlet end of the evaporator (4).

6. The heat dissipating device for semiconductor devices as claimed in any one of claims 2 to 5, wherein: the loop heat pipe also comprises an initiator arranged at the inlet end of the evaporator (4), and the initiator is connected in series in the steam pipeline (5).

7. The heat dissipating device for a semiconductor device as claimed in claim 6, wherein: the steam pipeline (5) is provided with at least one semiconductor connecting piece (9).

8. The semiconductor device heat sink of claim 7, wherein: the surface of the evaporator (4) in contact with the surface of the semiconductor device (1) is a flat surface; and a heat-conducting medium is filled between the evaporator (4) and the surface of the semiconductor device (1).

9. Data center computer lab, its characterized in that: comprising the semiconductor device heat sink of claim 8.