CN206073496U - A kind of water cooling radiator for semiconductor - Google Patents
A kind of water cooling radiator for semiconductor Download PDFInfo
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- CN206073496U CN206073496U CN201621073677.9U CN201621073677U CN206073496U CN 206073496 U CN206073496 U CN 206073496U CN 201621073677 U CN201621073677 U CN 201621073677U CN 206073496 U CN206073496 U CN 206073496U
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Abstract
This utility model is related to a kind of water cooling radiator for semiconductor, mainly adopts water cooling and semiconductor heat-dissipating technology, can apply to the closed compartment of lorry, the radiating of high power battery cabinet.It is characterized in that：Using two-stage radiation, water cooling part is used to heat exchange directly to be carried out with equipment, and semiconductor refrigerating part is then by carrying out heat exchange with water cooling part, reaching indirectly the purpose of radiating；In semiconductor refrigeration system, mainly include semiconductor cooling device and heat abstractor, blower fan（5）Accelerate heat exchange；In water cooling system, used as power, heat abstractor and semiconductor cooling device heat exchange, load is heat exchanger to water pump, and for carrying out heat exchange with equipment, secondary water tank is then the water in stocking system.Two-stage system collectively forms cooling system of the present utility model by cleverly connecting, and this still falls within relatively new design in current similar radiator.
Description
Technical field
This utility model is related to semiconductor chilling plate field of radiating, mainly adopts water cooling and semiconductor heat-dissipating technology, can
To be applied to a kind of water cooling radiator for semiconductor of the closed compartment of lorry, high power battery cabinet.
Background technology
At present, the radiating mode of equipment is mainly air cooling, air blast cooling and water-cooling, although these radiating modes
It is simple structure, with low cost, in many cases can be with the heat dissipation problem of effectively solving relevant device, but when the caloric value of equipment
Than larger, or need efficiently, when quickly radiating, these traditional radiating modes suffer from certain limitation.
Semiconductor refrigerating technology is a kind of new refrigeration radiating technology of comparison.Semiconductor chilling plate, is also thermoelectric module,
It is a kind of heat pump.Using the peltier effect of semi-conducting material, when unidirectional current is connected into by two kinds of different semi-conducting materials
During galvanic couple, heat can be absorbed respectively at the two ends of galvanic couple and release heat, it is possible to achieve the purpose of refrigeration.It is a kind of generation
The Refrigeration Technique of negative thermal resistance, is characterized in movement-less part, and reliability is also higher.
The advantage of semiconductor chilling plate refrigeration radiating is no slide unit, applies and is restricted in some spaces, reliable
Property have high demands, without cold-producing medium pollution occasion.Accordingly, it is considered to demand of the high-power, Sealing Arrangement to high efficiency and heat radiation is arrived, design one
Money can fully meet its requirement using the radiator radiated by semiconductor chilling plate refrigeration radiating technology.
Utility model content
High efficiency and heat radiation problem of this utility model for the confined space, it is therefore intended that provide a kind of using semiconductor refrigerating skill
Efficient, the light water cooling radiator for semiconductor of art.
This utility model proposes a kind of new from this New Refrigerating material of semiconductor chilling plate, from ultimate principle
Radiator pattern.Compared with traditional heat sinks, the semiconductor cooling device mechanical motion that this utility model is used, nothing are made an uproar
Sound, takes up room little, and the response time is fast, particularly significant for the equipment of fast-refrigerating radiating is needed.In addition, this practicality is new
Type also uses water cooling cooling system in addition to using semiconductor refrigerating technology, and the two passes through cleverly to connect, common structure
Into cooling system of the present utility model, this still falls within relatively new design in current similar radiator.
This utility model utilizes semiconductor refrigerating technology, adopts the following technical scheme that：
Water cooling radiator for semiconductor, by semiconductor refrigeration system and water cooling system, semiconductor refrigeration system is by partly leading
System device for cooling 3, the second heat abstractor 4 and blower fan 5 are constituted, and the two ends of semiconductor cooling device 3 connect the second radiating dress respectively
4 two ends are put, 4 side of the second heat abstractor is provided with blower fan 5；Water cooling system is by water pump 1, heat exchanger 6, secondary water tank 7 and the
One heat abstractor 2 is constituted, and the first heat abstractor 2 is located in semiconductor cooling device 3, and one end of the first heat abstractor 2 leads to successively
The other end of piping connection heat exchanger 6, secondary water tank 7, water pump 1 and the second heat abstractor 2；The two of semiconductor cooling device 3
End connection power supply；Water pump 1 makes current flow as power, the first heat abstractor 2 and 3 heat exchange of semiconductor cooling device.
In this utility model, the first heat abstractor 2 is multilamellar curved tube structure.
In this utility model, semiconductor cooling device 3 is flake structure.
In this utility model, power supply flows through semiconductor cooling device two ends by electric current and transmits heat, will between two ends
Heat transfer is produced, heat will be transferred to the other end from one end, cold and hot end is formed so as to produce the temperature difference, realize refrigeration；Water-cooled
But system is then that the exchange of heat is realized by water flow pipes, current in device interior migration everywhere, the heat that absorption equipment is distributed,
When reaching the cold end of semiconductor refrigeration system, heat transfer is gone over, the transfer of heat is realized；Two systems cooperation, just
Efficiently the heat of device interior can be come out.
In this utility model, the described semiconductor refrigeration system heat that direct absorption equipment is not distributed, but with
Water cooling system carries out heat exchange, and then further by the second heat abstractor 4, heat is distributed by blower fan 5, indirectly
Reduce the function of device interior heat.
In this utility model, described semiconductor chilling plate has certain difference with general cooling piece, its cold end
For flake, contact with the first heat abstractor of water cooling system, facilitate heat exchange, hot junction to be radiating tubulose, area of dissipation
It is larger, it is convenient to radiate.
In this utility model, described semiconductor chilling plate reduces the temperature in hot junction, then by the way of blower fan 5 is air-cooled
The temperature of cold end can be reduced simultaneously, increase radiating effect.
In this utility model, the water in water pipe is transported to system as the power source of water cooling system by described water pump 1
Various pieces.
In this utility model, described secondary water tank 7 is used for water unnecessary in reservoir conduit, in system stalls, can
To be changed to the water in pipeline by secondary water tank 7, it is ensured that system can be run in the state of preferably.
In this utility model, described heat exchanger 6 uses multiple structure, and the water in pipeline is in longer scope
Outside heat exchange can be carried out, can both increase caloric receptivity, the water yield in pipeline can be increased again, prevented in high-power feelings
Under condition, excessively there is the situation of cooling boiling water in heat.
In this utility model, the pipeline of described water cooling system improves cooling system due to easily designing
Motility, can according to equipment situation design layout of beam line.
In this utility model, described water cooling radiator for semiconductor adopts two-stage radiation system, dissipates with other single-stages
Hot systems are beyond one's reach advantage.Water cooling system can be easily installed in heat dissipation equipment everywhere, can equably absorb each
Partial heat, it is to avoid the uneven and situation of local lesion of radiating occur；Semiconductor refrigeration system then has cooling fast, temperature
Stable the characteristics of, being stably maintained in equipment can be stablized in adjustable scope, heat dispersal situations are controllable, in addition, half
Conductor refrigeration system is actually an electronic circuit system, and simple structure is installed maintenance and very facilitated.
Description of the drawings
Fig. 1 is structure principle chart of the present utility model.
Label in figure：1 is water pump, and 2 is the first heat abstractor, and 3 is semiconductor cooling device, and 4 is the second heat abstractor, 5
For blower fan, 6 is heat exchanger, and 7 are secondary water tank.
Specific embodiment
Realization is further detailed to this utility model with reference to Figure of description.
Embodiment 1：As shown in figure 1, water cooling radiator for semiconductor is distinctly divided into two parts, water cooling part is used for
Heat exchange is carried out with equipment directly, semiconductor refrigerating part is then by carrying out heat exchange with water cooling part, reaching indirectly
The purpose of radiating.There was only the first heat abstractor 2 and semiconductor cooling device 3 in the coupling part of two parts, although contact portion
It is fewer, but because the first heat abstractor 2 of water cooling system is multilamellar curved tube structure, semiconductor cooling device 3 is thin slice knot
Structure, the two can combine as closely as possible, carry out sufficient heat exchange, and two systems extremely can cooperate in harmony.
Water cooling radiator for semiconductor each equipment carries out certain installation connection could normal work.Secondary water tank 7 is water
The storage facilities of cooling system working medium, and the beginning of cycle of operation, are connected with water pump 1 by pipeline afterwards, and water pump 1 is water-cooled
But the power source of system, by it by each place of water pump to pipeline, the somewhere before the pipeline has the first heat abstractor 2
It is connected with the cold end of semiconductor refrigeration system, transfers heat away from system, also having in pipeline carries out heat exchange between equipment
Heat exchanger 6, the longer path of its presence can allow working medium that the heat exchange of abundance is carried out with equipment, complete above work
Afterwards, working medium can return secondary water tank, that is, complete water cooling circulation.The cold end of semiconductor chilling plate is the work of semiconductor refrigeration system
Starting position, after the heat for having absorbed water cooling system, the hot junction second that heat takes cooling piece to can be radiated dress by electric current
Put at 4, subsequently distribute heat in extraneous air, hot-side temperature can be reduced by blower fan 5, it is synchronous also to reduce cold end temperature
Degree, after completing heat transfer, electric current returns to cold end, completes one cycle.Two systems are constantly as above circulated, you can real
The radiating requirements of existing relevant device.
Water cooling radiator for semiconductor is due to carrying out heat using cold end and the water of two-stage radiation system, semiconductor heat-dissipating system
Exchange, its heat exchange will not excessively acutely, and cooling piece can reach maximum temperature difference quickly, commonly reach maximum temperature difference when
Between within 60s.
The water pipe line of water cooling radiator for semiconductor is that one section of a section is installed out, therefore its pipeline is fixed
Shape, needs are designed according to the size in equipment cooling space, with higher motility.
Water cooling radiator for semiconductor has larger temperature range, and convenient use person is adjusted according to equipment practical situation
It is whole.
The working medium of water cooling radiator for semiconductor water cooling system is water, and the working medium of semiconductor refrigeration system is electronics.
Water cooling radiator for semiconductor size can be standardized design, modularized production according to device type.
Claims (3)
1. water cooling radiator for semiconductor, it is characterised in that by semiconductor refrigeration system and water cooling system, semiconductor refrigerating system
System is by semiconductor cooling device（3）, the second heat abstractor（4）And blower fan（5）Composition, semiconductor cooling device（3）Two ends point
Do not connect the second heat abstractor（4）Two ends, the second heat abstractor（4）Side is provided with blower fan（5）；Water cooling system is by water pump
（1）, heat exchanger（6）, secondary water tank（7）With the first heat abstractor（2）Composition, the first heat abstractor（2）Positioned at semiconductor refrigerating
Device（3）It is interior, the first heat abstractor（2）One end pass sequentially through pipeline connection heat exchanger（6）, secondary water tank（7）, water pump（1）
With the second heat abstractor（2）The other end；Semiconductor cooling device（3）Two ends connection power supply；Water pump 1 makes current as power
Flowing, the first heat abstractor（2）With 3 heat exchange of semiconductor cooling device.
2. water cooling radiator for semiconductor according to claim 1, it is characterised in that the first heat abstractor（2）It is that multilamellar is bent
Tubular construction.
3. water cooling radiator for semiconductor according to claim 1, it is characterised in that semiconductor cooling device（3）It is thin slice
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621073677.9U CN206073496U (en) | 2016-09-23 | 2016-09-23 | A kind of water cooling radiator for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621073677.9U CN206073496U (en) | 2016-09-23 | 2016-09-23 | A kind of water cooling radiator for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206073496U true CN206073496U (en) | 2017-04-05 |
Family
ID=58440033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621073677.9U Active CN206073496U (en) | 2016-09-23 | 2016-09-23 | A kind of water cooling radiator for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206073496U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN110108061A (en) * | 2019-05-23 | 2019-08-09 | 哈尔滨工业大学 | A kind of small-power multichip semiconductor grade low-temp refrigerating plant |
-
2016
- 2016-09-23 CN CN201621073677.9U patent/CN206073496U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550475A (en) * | 2018-06-27 | 2018-09-18 | 安徽盛美金属科技有限公司 | A kind of circulating refrigerating device of thin film capacitor production radiator |
| CN108550475B (en) * | 2018-06-27 | 2020-07-03 | 安徽盛美金属科技有限公司 | Film capacitor production is with heat abstractor's circulating refrigeration device |
| CN110108061A (en) * | 2019-05-23 | 2019-08-09 | 哈尔滨工业大学 | A kind of small-power multichip semiconductor grade low-temp refrigerating plant |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180531 Address after: 241000 1208, room 4, Service Outsourcing Industrial Park, 717 Zhongshan South Road, Yijiang District, Wuhu, Anhui. Patentee after: Wuhu Chu Rui Intelligent Technology Co., Ltd. Address before: 201203 room 1101, 238 lane, road, Pudong New Area, Shanghai. Patentee before: Zhang Huai |
|
| TR01 | Transfer of patent right |