CN104329857B - Refrigerator - Google Patents
Refrigerator Download PDFInfo
- Publication number
- CN104329857B CN104329857B CN201410123544.7A CN201410123544A CN104329857B CN 104329857 B CN104329857 B CN 104329857B CN 201410123544 A CN201410123544 A CN 201410123544A CN 104329857 B CN104329857 B CN 104329857B
- Authority
- CN
- China
- Prior art keywords
- cold
- semiconductor chilling
- chilling plate
- producing medium
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 167
- 238000005057 refrigeration Methods 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 239000003507 refrigerant Substances 0.000 claims description 74
- 230000007704 transition Effects 0.000 claims description 18
- 238000013461 design Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- 238000007710 freezing Methods 0.000 claims description 9
- 230000008014 freezing Effects 0.000 claims description 9
- 230000014759 maintenance of location Effects 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 239000012071 phase Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 230000006641 stabilisation Effects 0.000 description 4
- 238000011105 stabilization Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
- F25D11/025—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures using primary and secondary refrigeration systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/003—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with respect to movable containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/003—Arrangement or mounting of control or safety devices for movable devices
Abstract
The invention provides a kind of refrigerator, comprising: the first semiconductor chilling plate, there is the first cold junction face producing cold and the first face, hot junction producing heat; Second semiconductor chilling plate, has the second cold junction face producing cold and the second face, hot junction producing heat; First heat exchanger, is configured to the cold in described first cold junction face to be delivered in the refrigerating chamber of described refrigerator; Second heat exchanger, is configured to a part of cold in described second cold junction face to be delivered in the refrigerating chamber of described refrigerator, and disappears to the heat in described first face, hot junction by all the other colds in described second cold junction face; 3rd heat exchanger, is configured to the heat in described second face, hot junction to be dispersed in surrounding environment.Refrigerator of the present invention carries out abundant radiating and cooling due to the cold junction of the second semiconductor chilling plate to the hot junction of the first semiconductor chilling plate, therefore can improve the radiating efficiency in the hot junction of the first semiconductor chilling plate, thus improves the refrigeration of its cold junction.
Description
Technical field
The present invention relates to refrigeration plant, particularly relate to a kind of semiconductor freezer.
Background technology
Semiconductor freezer has environmental protection and plot ratio high, is extensively received by the market.But by the restriction of semiconductor chilling plate characteristic, the object of refrigeration can only be reached, do not reach freezing standard, application is very restricted.Comprise in the semiconductor freezer of refrigerating chamber and refrigerating chamber in prior art, usual employing compression-type refrigerating system and semiconductor refrigeration system carry out hybrid refrigeration, and the hot junction of semiconductor chilling plate or hot-side heat dissipation device are configured to directly contact with the compressor evaporimeter of compression-type refrigerating system usually.The cold that compressor-type evaporimeter produces conducts to the hot junction of semiconductor chilling plate, carries out radiating and cooling to it.The solution process that radiating and cooling is carried out in the mode contacting conduction in this hot junction to semiconductor chilling plate is complicated, cost is higher.In addition, compression-type refrigerating system volume is large, takies the storage space of refrigerator; And noise is large during work.
Summary of the invention
One object of the present invention is intended to overcome at least one defect with the semiconductor freezer of refrigerating chamber and refrigerating chamber in prior art, provide a kind of can the refrigerator with refrigerating function of highly effective refrigeration.
The present invention's further object to make the operating noise of refrigerator little, and storage space is large.
For this reason, the invention provides a kind of refrigerator, comprising:
First semiconductor chilling plate, has the first cold junction face producing cold and the first face, hot junction producing heat;
Second semiconductor chilling plate, has the second cold junction face producing cold and the second face, hot junction producing heat;
First heat exchanger, is configured to the cold in described first cold junction face to be delivered in the refrigerating chamber of described refrigerator;
Second heat exchanger, is configured to a part of cold in described second cold junction face to be delivered in the refrigerating chamber of described refrigerator, and disappears to the heat in described first face, hot junction by all the other colds in described second cold junction face;
3rd heat exchanger, is configured to the heat in described second face, hot junction to be dispersed in surrounding environment.
Alternatively, described 3rd heat exchanger comprises:
3rd cold-producing medium casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it;
3rd refrigerant line, with the inner space of described 3rd cold-producing medium casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it;
Heat bridge, its upper end inner surface and described second hot junction thermal contact, the inner surface thermo-contact of lower end outside surface and described 3rd cold-producing medium casing, with the partial heat going down produced in described second face, hot junction to described 3rd cold-producing medium casing.
Alternatively, described 3rd heat exchanger also comprises:
Top radiating fin, is arranged on the upper end outer surface of described heat bridge.
Alternatively, described 3rd heat exchanger also comprises:
Top cooling fan, is fixed on the outside of described top radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described top radiating fin from described second face, hot junction.
Alternatively, described 3rd heat exchanger also comprises:
Bottom radiating fin, is arranged on the outer surface of described 3rd cold-producing medium casing.
Alternatively, described 3rd heat exchanger also comprises:
Bottom cooling fan, is fixed on the outside of described bottom radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described bottom radiating fin from described second face, hot junction.
Alternatively, described first heat exchanger comprises:
First cold-producing medium casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it, described first cold-producing medium casing and described first cold junction thermal contact; And
First refrigerant line, with the inner space of described first cold-producing medium casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it.
Alternatively, described second heat exchanger comprises:
Second refrigerant casing, be limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and be configured to allow cold-producing medium to undergo phase transition heat exchange within it, the relative surface of two of described second refrigerant casing respectively with described first face, hot junction and the second cold junction thermal contact; And
Second refrigerant pipeline, with the inner space of described second refrigerant casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it.
Alternatively, described refrigerator also comprises:
First temperature sensor, is configured to the temperature of the refrigerating chamber detecting described refrigerator;
Second temperature sensor, is configured to the temperature of the refrigerating chamber detecting described refrigerator; And
Controller, be configured to the cold controlling described first semiconductor chilling plate and described second semiconductor chilling plate generation according to the temperature of described refrigerating chamber and the temperature of refrigerating chamber, make the refrigerating chamber of described refrigerator and refrigerating chamber remain on refrigeration design temperature and freezing design temperature respectively.
Alternatively, described controller is configured to further: when the temperature of described refrigerating chamber higher than the temperature of described refrigeration design temperature and/or described refrigerating chamber higher than described freezing design temperature time, control described first semiconductor chilling plate and described second semiconductor chilling plate produces maximum cold respectively; Wherein, the maximum cold that described second semiconductor chilling plate produces is greater than the maximum cold that the first semiconductor chilling plate produces.
The refrigeration radiating system of refrigerator of the present invention adopts twin-stage semiconductor refrigerating technology, relative to traditional compression-type refrigeration, instead of the cabin of compressor and placement compressor, makes the space that effectively utilizes of refrigerator become large.In addition, refrigerator inside is without air channel, evaporimeter cover plate, and external cooling pipeline all attaches inside the shell, attractive appearance, and neatly generous, space availability ratio promotes greatly.
Refrigerator of the present invention carries out abundant radiating and cooling due to the cold junction of the second semiconductor chilling plate to the hot junction of the first semiconductor chilling plate, therefore can improve the radiating efficiency in the hot junction of the first semiconductor chilling plate, thus improves the refrigeration of cold junction.
Further, in refrigerator of the present invention, being provided with the radiating fin for dispelling the heat to the hot junction of the second semiconductor chilling plate, cooling fan and refrigerant line, effectively can reducing the temperature difference of hot junction and environment temperature, improve the refrigerating capacity of cold junction.When refrigerator load is lower, suitably can close cooling fan, noise and the energy consumption of refrigerator can be effectively reduced like this, make its overall operation more safe and reliable.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic diagram of refrigerator according to an embodiment of the invention;
Fig. 2 is the schematic diagram of the first heat exchanger shown in Fig. 1;
Fig. 3 is the schematic diagram of the 3rd heat exchanger shown in Fig. 1;
Fig. 4 is the supply voltage of semiconductor chilling plate according to an embodiment of the invention and the example graph of refrigerating efficiency and refrigerating capacity relation.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, is exemplary below by the embodiment be described with reference to the drawings, and only for explaining the present invention, and can not be interpreted as limitation of the present invention.In describing the invention, term " on ", D score, the orientation of the instruction such as "front", "rear" " interior " " outward " or position relationship be based on orientation shown in the drawings or position relationship, be only the present invention for convenience of description instead of require that the present invention with specific azimuth configuration and operation, therefore must can not be interpreted as limitation of the present invention.
Fig. 1 is the schematic diagram of heat-exchange device according to an embodiment of the invention.Refrigerator of the present invention can comprise casing 10, is limited form refrigerating chamber 11 and refrigerating chamber 12 two chambers in casing 10 by inner bag.In one embodiment, refrigerating chamber 12 is positioned at the top of casing 10, and refrigerating chamber 11 is positioned at the below of casing 10.The sidewall of casing 10 or backboard are provided with the first semiconductor chilling plate 21, second semiconductor chilling plate 22, first heat exchanger 310, second heat exchanger 320 and the 3rd heat exchanger 330.Wherein, the first semiconductor chilling plate 21 has the first cold junction face producing cold and the first face, hot junction producing heat.First heat exchanger 310 is configured to the cold in described first cold junction face to be delivered in the refrigerating chamber 11 of described refrigerator.In one embodiment, a part and the described first cold junction face of the first heat exchanger 310 are thermally coupled, and the refrigerating chamber 11 of another part and described refrigerator is thermally coupled, to realize the cold in described first cold junction face to be delivered in the refrigerating chamber 11 of described refrigerator.Second semiconductor chilling plate 22 has the second cold junction face producing cold and the second face, hot junction producing heat.Second heat exchanger 320 is configured to a part of cold in described second cold junction face to be delivered in the refrigerating chamber 12 of described refrigerator, and disappears all the other colds in described second cold junction face to the heat in the first face, hot junction of the first semiconductor chilling plate 21.Such as by make a part for the second heat exchanger 320 and described second cold junction face thermally coupled, the refrigerating chamber 12 of another part and described refrigerator is thermally coupled to be realized.3rd heat exchanger 330 is configured to the heat in the second face, hot junction of the second semiconductor chilling plate 22 to be dispersed in surrounding environment.Such as by make a part for the 3rd heat exchanger 330 and described second face, hot junction thermally coupled, the heat in the second face, hot junction is dispersed in surrounding environment by another part.Because the second semiconductor chilling plate 22 is except undertaking the refrigeration to refrigerating chamber 12, also will absorb the heat from the first semiconductor chilling plate 21 first radiating end, therefore, the second semiconductor chilling plate 22 should have stronger refrigerating capacity.Due to the temperature-difference refrigerating device that semiconductor chilling plate is application thermoelectric effect, this scheme can improve the refrigeration in the first cold junction face of the first semiconductor chilling plate 21 and the second cold junction face of the second semiconductor chilling plate 22, thus realizes the highly effective refrigeration to refrigerator.
In some embodiments of the invention, the first heat exchanger 310, second heat exchanger 320 and the 3rd heat exchanger 330 can comprise cold-producing medium casing and refrigerant line respectively.Wherein, cold-producing medium casing is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it.The inner space of refrigerant line and described cold-producing medium casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it.During interchanger work, cold-producing medium box house fills the cold-producing medium that gas-liquid two-phase coexists.When cold-producing medium casing contacts heat exchange with thermal source or low-temperature receiver, cold-producing medium carries out heat transfer by there is gas-liquid phase transition in cold-producing medium casing and refrigerant line.The cold-producing medium poured in cold-producing medium casing and refrigerant line can be carbon dioxide or other refrigeration working mediums, and the groundwater increment of cold-producing medium can draw by by experimental test.Refrigerant line can select copper pipe, stainless steel tube, aluminum pipe etc., is preferably copper pipe.
" thermally coupled " or " thermo-contact " in the embodiment of the present invention, the most direct embodiment that those skilled in the art can know is direct abutting contact, adopts heat conducting mode to conduct heat.If abutting contact face coated with thermally conductive silicone grease (graphite or other media), can be thought the part on abutting contact face, as the heat-conducting layer improving thermally coupled (or thermo-contact).
Fig. 2 shows the structural representation of the first heat exchanger of one embodiment of the invention.As shown in Figure 2, the first heat exchanger 310 can comprise the first cold-producing medium casing 312, and the first refrigerant line 311.First refrigerant line 311 from its first end (upper right side as the first refrigerant line 311 Fig. 2) being formed as openend vertically to after downward-extension down bending extend to its extreme lower position, then up bend extension, then extend to its second end being formed as openend (left upper end as the first refrigerant line 311 in Fig. 2) straight up.Down bending extends all needs to ensure that liquid cold-producing medium can rely on the flowing wherein of free gravity with the pipeline up bending extension.The first end being formed as openend of the first refrigerant line 311 is communicated with the bottom of the first cold-producing medium casing 312 respectively with the second end.In one embodiment, first cold-producing medium casing 312 can be flat rectangular body shape, the forward direction sidewall that it is oppositely arranged and the area of backward sidewall are greater than the area in other faces, and the outer surface of backward sidewall is used as to contact with the first cold junction of the first semiconductor chilling plate 21 heat-transfer surface reclined.In one embodiment, the forward direction sidewall of the first cold-producing medium casing 312 extends a mounting flange 313 in both sides to the left and right respectively, each mounting flange 313 is provided with one or more installing hole 314, is fixed on the casing 10 of refrigerator to utilize securing member to be installed by the first cold-producing medium casing 312.In one embodiment, the first heat exchanger 310 also can comprise two refrigerant lines, and the first end of two refrigerant lines is openend, and the second end is blind end, and its first end is communicated with the bottom of refrigerant case intracoelomic cavity respectively.Two refrigerant lines bend extension inclined downward more respectively after its first end extends straight down, end in the second end that it is formed as blind end.
Second heat exchanger 320 of the present invention comprises second refrigerant casing and second refrigerant pipeline 321.Second refrigerant pipeline 321 from the first end that it is formed as openend bend inclined downward extend to extreme lower position after be tilted to Shangdi bending again and extend to the second end that it is formed as openend, down bending extends and the pipeline that up bends extension all needs to ensure that liquid cold-producing medium can rely on the flowing wherein of free gravity.The first end being formed as openend of second refrigerant pipeline 321 is communicated with the bottom of second refrigerant casing respectively with the second end.In one embodiment, the second heat exchanger 320 also can comprise two refrigerant lines, and the first end of two refrigerant lines is openend, and the second end is blind end, and its first end is communicated with the bottom of refrigerant case intracoelomic cavity respectively.Two refrigerant lines bend extension inclined downward from its first end respectively, end in the second end that it is formed as blind end.
Fig. 3 shows the structural representation of the 3rd heat exchanger 330 of the embodiment of the present invention.3rd heat exchanger 330 also comprises the 3rd cold-producing medium casing 338 and two the 3rd refrigerant lines 331.The first end (lower ends as two the 3rd refrigerant lines 331 Fig. 3) that two the 3rd refrigerant lines 331 are formed as openend from it respectively upwards bends extension, ends in its second end being formed as blind end (upper ends as two the 3rd refrigerant lines 331 in Fig. 3); The first end being formed as openend of two the 3rd refrigerant lines 331 is communicated with the top of the inner chamber of the 3rd cold-producing medium casing 338 respectively.3rd heat exchanger 330 also can comprise three-way device 339, it has the first end, the second end and the 3rd end that are interconnected, the wherein first end of three-way device 339 and the inner space of the 3rd cold-producing medium casing 338, its second end is connected with the first end being formed as openend of the 3rd refrigerant line 331, and the 3rd end is the normal-closed end being configured to operationally open to receive the cold-producing medium injected from outside.Utilize three-way device 339 reduce perfusion refrigerant process difficulty, and for maintenance provide convenience.In one embodiment, the 3rd heat exchanger 330 also can comprise a refrigerant line, and first end and second end of refrigerant line are openend, and its first end is communicated with the top of refrigerant case intracoelomic cavity respectively with the second end.Refrigerant line respectively from its first end be tilted to Shangdi bending extend to extreme higher position after more inclined downward bending extend to its second end.
The structure of refrigerator of the present invention for convenience of description, in the present invention, the side of contiguous inner container of icebox rear wall can be described as inner side, and the side away from inner container of icebox rear wall can be described as outside.In the embodiment shown in fig. 1, the inner surface of the first cold-producing medium casing 312 is arranged on the backboard top of refrigerator body 10 by securing member, the first cold junction face of the first semiconductor chilling plate 21 and the outer surface thermo-contact of the first cold-producing medium casing 312.At least part of pipeline of the bending extension of the first refrigerant line 311 contacts with the outer surface of liner forming refrigerating chamber 11 and reclines.The inner surface of second refrigerant casing and the first hot junction thermal contact of the first semiconductor chilling plate 21, the second cold junction thermal contact of its outer surface and the second semiconductor chilling plate 22.At least part of pipeline of second refrigerant pipeline 321 contacts with the outer surface of liner forming refrigerating chamber 12 and reclines.3rd cold-producing medium casing 338 is supported on the backboard near middle (such as the top of refrigerating chamber 11) of refrigerator body 10 by working of plastics 337.3rd refrigerant line 331 contacts with the inner surface of outer cover of refrigerator and reclines.3rd heat exchanger 330 also can comprise heat bridge 332, its upper end inner surface and described second hot junction thermal contact, the inner surface thermo-contact of lower end outside surface and the 3rd cold-producing medium casing 338, with the partial heat going down produced in described second face, hot junction to the 3rd cold-producing medium casing 338.For ensureing heat-conducting silicone grease (graphite or other media) can be adopted to contact between each attaching parts of heat transfer efficiency.
Refrigerator of the present invention can have three kinds of duties: refrigerating chamber 12 separate refrigeration, refrigerating chamber 11 separate refrigeration and refrigerating chamber 12 and refrigerating chamber 11 freeze simultaneously.
When refrigerating chamber 12 separate refrigeration, the first semiconductor chilling plate 21 no power, the second semiconductor chilling plate 22 is energized separately work.Now the second semiconductor chilling plate 22 is only responsible for refrigerating chamber 12 and freezes and do not dispel the heat to the first semiconductor chilling plate 21.After second semiconductor chilling plate 22 is energized, its the second cold junction surface temperature declines, by the conduction of second refrigerant cabinet wall, condensation is undergone phase transition when cold-producing medium of gaseous state is met cold in it, change becomes the liquid refrigerant of low temperature, liquid cold-producing medium can lean on gravity dirty along second refrigerant pipeline 321 inwall, and the dirty cold-producing medium of condensation is because the heat absorbing refrigerating chamber 12 inside is heated phase transformation evaporation in second refrigerant pipeline 321, and change becomes gaseous state.Gaseous steam can rise under the promotion of thermal source pressure, and gaseous refrigerant rises to second refrigerant casing place and continues condensation, thus circularly cooling, to be reached in refrigerating chamber 12 by the cold of the part from the second semiconductor chilling plate 22 cold junction.
When refrigerating chamber 11 separate refrigeration, the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 are all energized work, and now the second semiconductor chilling plate 22 is only for the first hot end-face heat sinking for the first semiconductor chilling plate 21.Can be freezed by second refrigerant pipeline 321 pairs of refrigerating chambers 12 while working for preventing the second semiconductor chilling plate 22 and cause waste, controlled stop valve can be set at second refrigerant pipeline 321 and the junction of second refrigerant casing, when refrigerating chamber 11 separate refrigeration, close this stop valve, to make the second semiconductor chilling plate 22 not freeze to refrigerating chamber 12, realize working independently of refrigerating chamber 11 thus.After respectively to the first semiconductor chilling plate 21 and the energising of the second semiconductor chilling plate 22, the first cold junction surface temperature of the first semiconductor chilling plate 21 declines, and its first hot junction surface temperature rises; Meanwhile, the second cold junction surface temperature of the second semiconductor chilling plate 22 declines, and its second hot junction surface temperature rises.Than the first semiconductor chilling plate 21, there is larger refrigerating capacity because the second semiconductor chilling plate 22 has, along with the second cold junction surface temperature of the second semiconductor chilling plate 22 declines, the corresponding decline of second refrigerant spin manifold temperature, by the conduction of second refrigerant cabinet wall, first hot junction surface temperature of the first semiconductor chilling plate 21 declines, and correspondingly, the temperature in its first cold junction face declines, thus pass to the more cold of refrigerating chamber 11, the temperature of refrigerating chamber 11 is satisfied the demand.By the conduction of the first cold-producing medium casing 312 inwall, the corresponding decline of first cold-producing medium casing 312 temperature, condensation is undergone phase transition when cold-producing medium of gaseous state is met cold in it, change becomes the liquid refrigerant of low temperature, liquid cold-producing medium can lean on gravity dirty along the first refrigerant line 311 inwall, the dirty cold-producing medium of condensation is because the heat of inside, absorption refrigerating room 11 is heated phase transformation evaporation in the first refrigerant line 311, and change becomes gaseous state.Gaseous steam can rise under the promotion of thermal source pressure, and gaseous refrigerant rises to the first cold-producing medium casing 312 place and continues condensation, thus circularly cooling, to be reached in refrigerating chamber 11 by the cold from the first semiconductor chilling plate 21 cold junction.
In this course of work, when the second semiconductor chilling plate 22 is the first hot end-face heat sinking of the first semiconductor chilling plate 21, the temperature in the second cold junction face of the second semiconductor chilling plate 22 is higher than the temperature in the first cold junction face of the first semiconductor chilling plate 21; And then cause the temperature in the second face, hot junction of the second semiconductor chilling plate 22 higher.3rd cold-producing medium casing 338 is owing to carrying out heat exchange by the second face, hot junction of heat bridge and the second semiconductor chilling plate 22, itself and the second face, hot junction are carried out heat exchange and are formed evaporimeter, undergo phase transition evaporation during its interior liquid cold-producing medium heat, change becomes the cold-producing medium of the gaseous state of high temperature.The cold-producing medium of gaseous state can rise along the 3rd refrigerant line 331 under thermal source pressure, transfer heat to outcase of refrigerator, then space outerpace is transferred heat to by free convection, now the 3rd refrigerant line 331 forms condenser, become liquid after condensation of refrigerant heat release, rely on gravity to be back to the 3rd cold-producing medium casing 338 downwards, reuptake hot junction heat and evaporate, form thermal cycle.
When refrigerating chamber 12 freezes with refrigerating chamber 11 simultaneously, first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 are all energized work, because the second semiconductor chilling plate 22 had both needed to freeze to refrigerating box 12, also to absorb the heat that the first semiconductor chilling plate 21 produces simultaneously, therefore compare when refrigerating chamber 11 separate refrigeration, it needs it to produce more cold, and it also can produce more heat accordingly.Now, along with the second cold junction surface temperature of the second semiconductor chilling plate 22 declines, the corresponding decline of second refrigerant spin manifold temperature, the stop valve conducting on second refrigerant pipeline 321, freezes to refrigerating chamber 12.Meanwhile, the first cold-producing medium casing 312 pairs of refrigerating chambers 11 freeze.3rd cold-producing medium casing 338 and the 3rd refrigerant line are to the second hot end-face heat sinking of the second semiconductor chilling plate 22.Wherein, to refrigerating chamber 11 freeze process and can see the situation of refrigerating chamber 11 separate refrigeration to the process of the second hot end-face heat sinking.
Seen from the above description, because the second semiconductor chilling plate 22 is except undertaking the refrigeration to refrigerating chamber 12, the heat from the first semiconductor chilling plate 21 first radiating end also to be absorbed, therefore, second semiconductor chilling plate 22 refrigerating capacity is very large, and corresponding will produce a lot of heats.If can not dispel the heat to these heats well, the refrigerating efficiency of two semiconductor chilling plates can be reduced significantly, make the cold junction of two semiconductor chilling plates be difficult to reach lower cryogenic temperature, thus be difficult to ensure that the temperature in refrigerating chamber 12 and refrigerating chamber 11 reaches refrigeration design temperature and freezing design temperature respectively.
In one embodiment, in order to dispel the heat to the second face, hot junction better, the upper end outer surface of heat bridge 332 can arrange top radiating fin 333.Top radiating fin 333 can increase area of dissipation significantly, is conducive to dispelling the heat to the second face, hot junction quickly.In a further embodiment, 3rd heat exchanger 330 also can comprise top cooling fan (or top radiator fan) 334, be fixed on top radiating fin 333 by retention mechanism, to carry out forced convertion heat radiation to the heat reaching top radiating fin 333 from described second face, hot junction.Quickly the heat in the second face, hot junction can be dispersed in surrounding environment like this.In one embodiment, the air-out position of top cooling fan 334 can be arranged in the face of top radiating fin 333.In a still further embodiment, the 3rd heat exchanger 330 also can comprise the bottom radiating fin 335 be arranged on the 3rd cold-producing medium casing 338 outer surface.In a further preferred embodiment, 3rd heat exchanger 330 also can comprise bottom cooling fan (or bottom radiator fan) 336, be fixed on bottom radiating fin 335 by retention mechanism, to carry out forced convertion heat radiation to the heat reaching bottom radiating fin 335 from described second face, hot junction.In one embodiment, the air-out position of bottom cooling fan 336 can be arranged in the face of described bottom radiating fin 335.
In a preferred embodiment of the invention, for the heat dissipation problem in the second face, hot junction of the second semiconductor chilling plate 22, the 3rd cold-producing medium casing 338 that the 3rd heat exchanger 330 comprises and the 3rd refrigerant line 331 effectively can reduce the heat flow density in the second face, hot junction of the second semiconductor chilling plate 22; Be separately positioned on radiating fin on the upper end outer surface of heat bridge and the 3rd cold-producing medium casing 338 outer surface and the heat of generation can be expelled to space outerpace by cooling fan (or radiator fan) effectively.Because the 3rd heat exchanger 330 can fall apart the heat in the second face, hot junction in external environment condition in time, even if when the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 are all in the duty producing maximum cooling capacity, also the second hot junction surface temperature can be avoided too high, thus avoid burning out the second semiconductor chilling plate 22, effectively ensure that the stable operation of refrigerator.
When refrigerator load less (article stored in such as refrigerating chamber 12 and/or refrigerating chamber 11 are less), first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 are all in the duty of the less refrigerating capacity of generation, the heat that second face, hot junction of the second semiconductor chilling plate 22 produces is less, now can close one of them cooling fan (or radiator fan), even by 2 cooling fan (or radiator fan) Close Alls, only rely on the 3rd cold-producing medium casing 338, 3rd refrigerant line 331, top radiating fin 333 and bottom radiating fin 335 dispel the heat, noise and the energy consumption of refrigerator can be effectively reduced like this, avoid the phenomenon occurring low load with strong power.
In certain embodiments, refrigerator of the present invention also can comprise the first temperature sensor, the second temperature sensor and controller.First temperature sensor is configured to the temperature of the refrigerating chamber 12 detecting refrigerator; Second temperature sensor is configured to the temperature of the refrigerating chamber 11 detecting refrigerator.First temperature sensor and the second temperature sensor can be arranged on the refrigerating chamber 12 of described refrigerator and the inwall of refrigerating chamber 11.Controller is electrically connected with the first temperature sensor, the second temperature sensor, the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 respectively, described controller receives temperature of refrigerating chamber and the freezer temperature of the first temperature sensor and the transmission of the second temperature sensor, and the cold of the first semiconductor chilling plate 21 and the generation of the second semiconductor chilling plate 22 is controlled according to temperature of refrigerating chamber and freezer temperature, make the refrigerating chamber 12 of refrigerator and refrigerating chamber 11 remain on refrigeration design temperature and freezing design temperature respectively.In one embodiment, controller is by controlling the size of the supply voltage of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 respectively and then controlling its cold size (refrigerating capacity) produced respectively.
Fig. 4 is the supply voltage of semiconductor chilling plate according to an embodiment of the invention and the example graph of refrigerating efficiency and refrigerating capacity relation.In an embodiment of the present invention, according to the requirement to semiconductor freezer refrigerating efficiency, voltage U
m1and voltage U
m2the maximum (U in corresponding diagram 4 experimentally determining the first semiconductor chilling plate 21 used and the second semiconductor chilling plate 22 supply voltage respectively
m); Voltage U
s1and voltage U
s2the minimum of a value (U in corresponding diagram 4 experimentally determining the first semiconductor chilling plate 21 used and the second semiconductor chilling plate 22 supply voltage respectively
s).The supply voltage of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 lays respectively at U
s1-U
m1and U
s2-U
m2in the voltage range limited.As seen from Figure 4, when the operating voltage of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 lays respectively at U
s1, U
s2time, the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 have maximum refrigerating efficiency P respectively
s1, P
s2, its refrigerating capacity is respectively Q
cs1and Q
cs2.Not corresponding generation maximum cooling capacity when semiconductor visual cooling piece is operated in its maximum refrigerating efficiency, and its refrigerating capacity (U in the power supply voltage range experimentally determined
s-U
mbetween) minimum.When the operating voltage of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 lays respectively at U
m1, U
m2time, the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 have maximum refrigerating capacity Q respectively
cm1and Q
cm2, its refrigerating efficiency P
m1, P
m2in the power supply voltage range experimentally determined, (supply voltage of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 is respectively at U
s1-U
m1between and U
s2-U
m2between) minimum.
In refrigerator of the present invention, for the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22, its duty is mainly divided into stable operation stage and drop-down Restoration stage.Wherein, the temperature in stabilization sub stage and refrigerating chamber 12 and refrigerating chamber 11 is within the scope of refrigeration design temperature and freezing design temperature respectively.Such as, refrigeration design temperature and freezing design temperature are respectively 5 DEG C and-18 DEG C, and when environment temperature is 25 DEG C, steady-state process is that refrigerating chamber 12 maintains 5 DEG C, and refrigerating chamber 11 maintains-18 DEG C of temperature-resistant processes.Drop-down recovery process is that in refrigerating chamber 12, temperature from ambient temperature 25 DEG C is down to 5 DEG C, and in refrigerating chamber 11, temperature from ambient temperature 25 DEG C is down to the process of-18 DEG C; Or the temperature causing refrigerating chamber 12 and refrigerating chamber 11 owing to open the door etc. is respectively from higher than the temperature return to 5 DEG C of 5 DEG C and-18 DEG C and the process of-18 DEG C.
When the first temperature sensor, the second temperature sensor detect that the temperature of refrigerating chamber 12 and refrigerating chamber 11 is respectively 5 DEG C and-18 DEG C, now, refrigerator is in the stabilization sub stage.In the present invention, preferably when carrying out design selection to the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22, making it meet in the stabilization sub stage as far as possible, making chip have the highest refrigerating efficiency or the highest close refrigerating efficiency.It is as shown in table 1 that refrigerator is in the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 parameter under the running status of stabilization sub stage.
Table 1
| Voltage | Electric current | Power | Chip cold | Chip heat | |
| First semiconductor chilling plate | U s1 | I s1 | P s1 | Q cs1 | Q hs1 |
| Second semiconductor chilling plate | U s2 | I s2 | P s2 | Q cs2 | Q hs2 |
For keeping the temperature reaching refrigerating chamber 12 to be 5 DEG C, the temperature of refrigerating chamber 11 is the stable state of-18 DEG C, under controller specifies that the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 operate in the running parameter of table 1 correspondence, now the voltage and current of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 is not its maximum, power is also non-maximum, the cold that two semiconductor chilling plates produce is non-the highest, but the cold that can meet required for steady-state operation, now the refrigerating efficiency of two semiconductor chilling plates is optimum value or is a certain high value close to optimum value.
Now, the voltage of the first semiconductor chilling plate 21 is U
s1, electric current is I
s1, input power is P
s1, the cold of generation is Q
cs1, freeze because the first semiconductor chilling plate 21 is responsible for refrigerating chamber 11, therefore, the cold Q that the first semiconductor chilling plate 21 produces
cs1the thermic load or refrigeration requirement Q that are not less than refrigerating chamber need be met
d, inevitably there is heat loss because cold is passed to refrigerating chamber 11 space from the first semiconductor chilling plate 21 cold junction, therefore, Q
cs1be greater than Q
d, general Q
cs1be the Q of 1.5 to 2 times
d, the heat that the first hot junction of the first semiconductor chilling plate 21 produces is Q
hs1, Q
hs1=P
s1+ Q
cs1.
The voltage of the second semiconductor chilling plate 22 is U
s2, electric current is I
s2, input power is P
s2, the cold of generation is Q
cs2, freeze because the second semiconductor chilling plate 22 is not only responsible for refrigerating chamber 12, and the heat that responsible absorption first semiconductor chilling plate 21 first hot junction produces, therefore, the cold Q that the second semiconductor chilling plate 22 produces
cs2the refrigeration requirement Q being not less than refrigerating chamber 12 need be met
cwith the heat Q in the first hot junction of the first semiconductor chilling plate 21
hs1sum, due to cold from the second semiconductor chilling plate 22 reach refrigerating chamber 12 and absorb the first semiconductor chilling plate 21 heat process inevitably there is loss, therefore Q
cs2be greater than Q
cwith Q
hs1sum, generally desirable, Q
cs2for Q
cwith Q
hs11.5 to 2 times of sum, the heat that the second semiconductor chilling plate 22 hot junction produces is Q
hs2, Q
hs2=Q
cs2+ P
s2.
When refrigerator is in drop-down Restoration stage, for the temperature reaching refrigerating chamber 12 is as early as possible 5 DEG C, the temperature of refrigerating chamber 11 is the stable state of-18 DEG C, under controller specifies that the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 operate in the running parameter of table 2 correspondence, now the voltage and current of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 is maximum, power is maximum, the cold that first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 produce is far away higher than the refrigeration requirement of refrigerator, but the now efficiency of the first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 nonoptimal value, the cold that first semiconductor chilling plate 21 and the second semiconductor chilling plate 22 produce is maximum.The maximum cold that second semiconductor chilling plate 22 produces is greater than the maximum cold that the first semiconductor chilling plate 21 produces.
Table 2
Now, the voltage of the first semiconductor chilling plate 21 is U
m1, electric current is I
m1, input power is P
m1, the cold of generation is Q
cm1, it is far away higher than the refrigeration requirement Q of refrigerating chamber
d, the heat that the first semiconductor chilling plate 21 first hot junction produces is Q
hm1, Q
hm1=P
m1+ Q
cm1.
The voltage of the second semiconductor chilling plate 22 is U
m2, electric current is I
m2, input power is P
m2, the cold of generation is Q
cm2, it is far away higher than the refrigeration requirement Q of refrigerating chamber
cwith the first hot junction heat Q of the first semiconductor chilling plate 21
hm1sum, the heat that the second hot junction of the second semiconductor chilling plate 22 produces is Q
hm2, Q
hm2=Q
cm2+ P
m2.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. a refrigerator, comprising:
First semiconductor chilling plate, has the first cold junction face producing cold and the first face, hot junction producing heat;
Second semiconductor chilling plate, has the second cold junction face producing cold and the second face, hot junction producing heat;
First heat exchanger, is configured to the cold in described first cold junction face to be delivered in the refrigerating chamber of described refrigerator;
Second heat exchanger, is configured to a part of cold in described second cold junction face to be delivered in the refrigerating chamber of described refrigerator, and disappears to the heat in described first face, hot junction by all the other colds in described second cold junction face;
3rd heat exchanger, is configured to the heat in described second face, hot junction to be dispersed in surrounding environment.
2. refrigerator according to claim 1, is characterized in that
Described 3rd heat exchanger comprises:
3rd cold-producing medium casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it;
3rd refrigerant line, with the inner space of described 3rd cold-producing medium casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it;
Heat bridge, its upper end inner surface and described second hot junction thermal contact, the inner surface thermo-contact of lower end outside surface and described 3rd cold-producing medium casing, with the partial heat going down produced in described second face, hot junction to described 3rd cold-producing medium casing.
3. refrigerator according to claim 2, is characterized in that
Described 3rd heat exchanger also comprises:
Top radiating fin, is arranged on the upper end outer surface of described heat bridge.
4. refrigerator according to claim 3, is characterized in that
Described 3rd heat exchanger also comprises:
Top cooling fan, is fixed on the outside of described top radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described top radiating fin from described second face, hot junction.
5. refrigerator according to claim 4, is characterized in that
Described 3rd heat exchanger also comprises:
Bottom radiating fin, is arranged on the outer surface of described 3rd cold-producing medium casing.
6. refrigerator according to claim 5, is characterized in that
Described 3rd heat exchanger also comprises:
Bottom cooling fan, is fixed on the outside of described bottom radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described bottom radiating fin from described second face, hot junction.
7. refrigerator according to claim 1, is characterized in that
Described first heat exchanger comprises:
First cold-producing medium casing, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it, described first cold-producing medium casing and described first cold junction thermal contact; And
First refrigerant line, with the inner space of described first cold-producing medium casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it.
8. refrigerator according to claim 1, is characterized in that
Described second heat exchanger comprises:
Second refrigerant casing, be limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and be configured to allow cold-producing medium to undergo phase transition heat exchange within it, the relative surface of two of described second refrigerant casing respectively with described first face, hot junction and the second cold junction thermal contact; And
Second refrigerant pipeline, with the inner space of described second refrigerant casing, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it.
9. the refrigerator according to any one of claim 1-8, is characterized in that
Described refrigerator also comprises:
First temperature sensor, is configured to the temperature of the refrigerating chamber detecting described refrigerator;
Second temperature sensor, is configured to the temperature of the refrigerating chamber detecting described refrigerator; And
Controller, be configured to the cold controlling described first semiconductor chilling plate and described second semiconductor chilling plate generation according to the temperature of described refrigerating chamber and the temperature of refrigerating chamber, make the refrigerating chamber of described refrigerator and refrigerating chamber remain on refrigeration design temperature and freezing design temperature respectively.
10. refrigerator according to claim 9, is characterized in that
Described controller is configured to further: when the temperature of described refrigerating chamber higher than the temperature of described refrigeration design temperature and/or described refrigerating chamber higher than described freezing design temperature time, control described first semiconductor chilling plate and described second semiconductor chilling plate produces maximum cold respectively; Wherein, the maximum cold that described second semiconductor chilling plate produces is greater than the maximum cold that the first semiconductor chilling plate produces.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410123544.7A CN104329857B (en) | 2014-03-28 | 2014-03-28 | Refrigerator |
| PCT/CN2015/075169 WO2015144080A1 (en) | 2014-03-28 | 2015-03-26 | Refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410123544.7A CN104329857B (en) | 2014-03-28 | 2014-03-28 | Refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104329857A CN104329857A (en) | 2015-02-04 |
| CN104329857B true CN104329857B (en) | 2016-04-27 |
Family
ID=52404628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123544.7A Active CN104329857B (en) | 2014-03-28 | 2014-03-28 | Refrigerator |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104329857B (en) |
| WO (1) | WO2015144080A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329857B (en) * | 2014-03-28 | 2016-04-27 | 海尔集团公司 | Refrigerator |
| CN106679230A (en) * | 2016-12-08 | 2017-05-17 | 青岛海尔股份有限公司 | Semiconductor refrigeration device |
| CN106766348A (en) * | 2017-01-17 | 2017-05-31 | 中国科学院深圳先进技术研究院 | A kind of semiconductor freezer |
| US10718558B2 (en) * | 2017-12-11 | 2020-07-21 | Global Cooling, Inc. | Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls |
| CN108759238A (en) * | 2018-08-28 | 2018-11-06 | 浙江聚珖科技股份有限公司 | Semiconductor refrigerating vacuum refrigerator |
| KR20210001074A (en) * | 2019-06-26 | 2021-01-06 | 엘지전자 주식회사 | Thermoelectric module and refrigerator having the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101382374A (en) * | 2008-10-23 | 2009-03-11 | 王志平 | Thermoelectric double temperature double control refrigerator |
| CN202267296U (en) * | 2011-08-18 | 2012-06-06 | 蔡平 | Semiconductor double-refrigerating cabinet |
| CN202915625U (en) * | 2012-10-21 | 2013-05-01 | 谢相孔 | Semiconductor electronic refrigerator |
| CN203810826U (en) * | 2014-03-28 | 2014-09-03 | 海尔集团公司 | Refrigerator |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100326096A1 (en) * | 2008-11-10 | 2010-12-30 | Brent Alden Junge | Control sytem for bottom freezer refrigerator with ice maker in upper door |
| CN201348413Y (en) * | 2008-11-21 | 2009-11-18 | 珠海熙玛电子科技有限公司 | Deep cold and hot refrigerator |
| CN104329857B (en) * | 2014-03-28 | 2016-04-27 | 海尔集团公司 | Refrigerator |
-
2014
- 2014-03-28 CN CN201410123544.7A patent/CN104329857B/en active Active
-
2015
- 2015-03-26 WO PCT/CN2015/075169 patent/WO2015144080A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101382374A (en) * | 2008-10-23 | 2009-03-11 | 王志平 | Thermoelectric double temperature double control refrigerator |
| CN202267296U (en) * | 2011-08-18 | 2012-06-06 | 蔡平 | Semiconductor double-refrigerating cabinet |
| CN202915625U (en) * | 2012-10-21 | 2013-05-01 | 谢相孔 | Semiconductor electronic refrigerator |
| CN203810826U (en) * | 2014-03-28 | 2014-09-03 | 海尔集团公司 | Refrigerator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015144080A1 (en) | 2015-10-01 |
| CN104329857A (en) | 2015-02-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203810826U (en) | Refrigerator | |
| CN104329857B (en) | Refrigerator | |
| CN104329871B (en) | Semi-conductor refrigeration refrigerator and cold end heat exchanging device thereof | |
| CN104329858A (en) | Mixed refrigeration refrigerator with cold storage and refrigeration functions | |
| CN104329850B (en) | Semiconductor freezer and its hot junction heat-exchanger rig | |
| WO2016095587A1 (en) | Cold end heat exchanging device and semiconductor refrigerator | |
| WO2016095589A1 (en) | Semiconductor refrigerator | |
| CN104329828A (en) | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof | |
| CN104344642A (en) | Semiconductor cooling refrigerator and hot-end heat exchange device for same | |
| CN106766484A (en) | A kind of refrigerator with semiconductor air cooling room | |
| CN202282922U (en) | Energy saving heat radiation cabinet | |
| CN104329868A (en) | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof | |
| CN219889932U (en) | Heat radiating device and refrigerator | |
| CN102252385A (en) | Dual-circuit air-conditioning system | |
| CN201897275U (en) | Energy-saving cabinet air conditioner | |
| CN217952747U (en) | Heat exchange system for semiconductor refrigeration sheet | |
| CN203454320U (en) | Refrigerating/heating system | |
| CN216291978U (en) | Integrated cabinet air conditioner | |
| CN105318596A (en) | Separated heat pipe room-temperature magnetic refrigeration device | |
| CN104534727A (en) | Hot end heat exchanger and semiconductor refrigerator | |
| CN104329829A (en) | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof | |
| CN201204786Y (en) | Liquid cooling radiating device | |
| CN104329866A (en) | Semiconductor refrigeration refrigerator and cold end heat exchange device thereof | |
| CN104329827B (en) | Heat exchange device and semiconductor refrigerator | |
| CN210241857U (en) | Gravity heat pipe type cold and hot air storage conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |