CN104329868A - Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof - Google Patents
Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof Download PDFInfo
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- CN104329868A CN104329868A CN201410123561.0A CN201410123561A CN104329868A CN 104329868 A CN104329868 A CN 104329868A CN 201410123561 A CN201410123561 A CN 201410123561A CN 104329868 A CN104329868 A CN 104329868A
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- hot junction
- exchanger rig
- heat exchange
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 84
- 238000005057 refrigeration Methods 0.000 title claims abstract description 67
- 230000017525 heat dissipation Effects 0.000 claims description 53
- 239000007788 liquid Substances 0.000 claims description 36
- 238000012546 transfer Methods 0.000 claims description 35
- 230000005855 radiation Effects 0.000 claims description 27
- 230000007704 transition Effects 0.000 claims description 20
- 238000005452 bending Methods 0.000 claims description 10
- 239000000428 dust Substances 0.000 claims description 6
- 230000014759 maintenance of location Effects 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 230000008014 freezing Effects 0.000 claims description 2
- 238000007710 freezing Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 description 24
- 238000010586 diagram Methods 0.000 description 14
- 230000005484 gravity Effects 0.000 description 11
- 238000009833 condensation Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000002360 explosive Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/003—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with respect to movable containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a semiconductor refrigeration refrigerator and a cold-end heat exchange device of the semiconductor refrigeration refrigerator. The cold-end heat exchange device comprises a cold-end heat conduction plate and a plurality of refrigeration annular heat pipes; the cold-end heat conduction plate is provided with a heat exchange face connected with a refrigeration source; the refrigeration annular heat pipes are sequentially arranged in a plane parallel to the heat exchange face at intervals in the radial direction. The upper portion of each refrigeration annular heat pipe is in contact with the cold-end heat conduction plate to carry out heat exchange, and the refrigeration annular heat pipes are arranged downwards along the plane parallel to the heat exchange face. According to the technical scheme, heat transmitted by the cold-end heat conduction plate is effectively conducted through the refrigeration annular heat pipes in the cold-end heat exchange device; the occupied space is small, and therefore the cold-end heat exchange device can be matched with a refrigerator structure well.
Description
Technical field
The present invention relates to refrigeration plant, particularly relate to semiconductor freezer and cold junction heat-exchanger rig thereof.
Background technology
Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to realize refrigeration by the double-deck heat pipe heat radiation of highly effective ring and conduction technique and automatic pressure-transforming Variable flow control technology, without the need to refrigeration working medium and mechanical moving element, solve the application problem of traditional mechanical refrigerator such as medium pollution and mechanical oscillation.
But, semiconductor freezer needs effectively by indoor between the temperature conduction of semiconductor chilling plate cold junction to refrigerator storing, prior art generally adopts fin forced convertion, fin is by directly contacting with semiconductor chilling plate cold junction, and and between storing room carry out heat exchange, heat conduction heat exchange efficiency between this solid is low, be unfavorable for the performance of semiconductor optimum performance, and radiating fin volume is larger, take refrigerator space, after coordinating fan, noise can be caused to increase, and fan continuous operation, reliability is poor.
Summary of the invention
An object of the present invention is to provide the cold junction heat-exchanger rig that a kind of heat exchange efficiency is high, take up room little.
The present invention's further object cold junction heat-exchanger rig will be made to produce and assembly technology is simple, it is reliable and stable to coordinate with refrigerator body.
According to an aspect of the present invention, a kind of cold junction heat-exchanger rig for semiconductor freezer is provided.This cold junction heat-exchanger rig comprises: cold junction heat-conducting plate, and it has the hot linked heat-transfer surface with refrigeration source; Many refrigeration annular heat pipes, are radially spaced successively in the plane parallel with heat-transfer surface, wherein the top of every root refrigeration annular heat pipe and cold junction heat-conducting plate contact heat-exchanging, and the edge plane parallel with heat-transfer surface is arranged downwards.
Alternatively, every root refrigeration annular heat pipe is with the axisymmetric polygon of the longitudinal centre line of cold junction heat-conducting plate, and it forms two limits of drift angle or a part for its top margin and cold junction heat-conducting plate contact heat-exchanging.
Alternatively, every root refrigeration annular heat pipe is rounded square, its top at least partially with cold junction heat-conducting plate contact heat-exchanging, two side is along the straight down extension parallel with heat-transfer surface.
Alternatively, the tube chamber inside of refrigeration annular heat pipe has the metal dust structure of sintering.
Alternatively, every root refrigeration annular heat pipe is rhombus, and its first group of diagonal is vertically arranged, and second group of diagonal is horizontally disposed with, form first group of cornerwise top drift angle and formed top drift angle adjacent side at least partially with cold junction heat-conducting plate contact heat-exchanging.
Alternatively, the annular heat pipe that freezes is light pipe heat pipe.
Alternatively, the outer surface of every root refrigeration annular heat pipe is flat square.
According to another aspect of the present invention, a kind of semiconductor freezer is additionally provided.This semiconductor freezer comprises: inner bag, is limited with room between storing in it; Shell, is arranged at the outside of inner bag, and it includes U shell and back, and the back of shell and the rear wall of inner bag are limited with installing space; Semiconductor chilling plate; Alternatively, any one the cold junction heat-exchanger rig more than introduced, all be arranged in installing space with semiconductor chilling plate, cold junction heat-exchanger rig is installed into makes the cold junction of its heat-transfer surface and semiconductor chilling plate thermally coupled, and make the reclining with the outer surface of inner bag at least partially, so that the cold from cold junction is reached room between storing of its every root refrigeration annular heat pipe.
Alternatively, above-mentioned semiconductor freezer also comprises: hot junction heat-exchanger rig, thermally coupled with the hot junction of semiconductor chilling plate, is distributed to surrounding environment for the heat produced in hot junction.
Alternatively, hot junction heat-exchanger rig comprises: hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; And heat dissipation pipeline, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of heat dissipation pipeline and the second end are all communicated to the top of the inner chamber of hot junction heat exchange box, heat dissipation pipeline is tilted to Shangdi bending from its first end and the second end respectively and extends to common extreme higher position.
Alternatively, hot junction heat-exchanger rig comprises: hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; With many heat dissipation pipelines, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root heat dissipation pipeline is communicated to the top of the inner chamber of hot junction heat exchange box, every root heat dissipation pipeline from its first end be tilted to Shangdi bending extend, end in the second end that it is formed as blind end.
Alternatively, hot junction heat-exchanger rig comprises: hot junction heat-conducting plate, and itself and hot junction are thermally coupled; With many heat radiation annular heat pipes, a part for every root heat radiation annular heat pipe and hot junction heat-conducting plate contact heat-exchanging, the contact internal walls heat exchange of the shell of another part and semiconductor freezer.
Alternatively, hot junction heat-exchanger rig comprises: hot junction heat-conducting plate, and itself and hot junction are thermally coupled; Many heat radiation heat pipes, one end of every root heat radiation heat pipe and hot junction heat-conducting plate contact heat-exchanging; Radiating fin, is arranged on many heat radiation heat pipes; And blower fan, be fixed on radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin from many heat radiation heat pipes.
Alternatively, hot junction heat-exchanger rig comprises: hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; Many heat dissipation pipelines, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root heat dissipation pipeline is communicated to the top of the inner chamber of hot junction heat exchange box, every root heat dissipation pipeline from its first end be tilted to Shangdi bending extend, end in the second end that it is formed as blind end; Radiating fin, is arranged on many heat dissipation pipelines; And blower fan, be fixed on radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin from many heat dissipation pipelines.
In cold junction heat-exchanger rig of the present invention, the temperature that cold junction heat-conducting plate transmits effectively is conducted by many refrigeration annular heat pipes, takes up room little, contributes to and the coordinating of refrigerator structure.
Further, semiconductor freezer of the present invention, makes reclining with the outer surface of inner bag at least partially of cold junction heat-exchanger rig, utilizes inner bag to carry out heat conduction, make full use of refrigerator structure, take up room little.
Further, semiconductor freezer of the present invention can adopt the hot junction heat-exchanger rig of various ways timely and effectively the heat that semiconductor chilling plate hot junction produces to be distributed to surrounding enviroment, flexible configuration, ensure that the reliably working of refrigerator.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is according to an embodiment of the invention for the schematic diagram of the cold junction heat-exchanger rig of semiconductor freezer;
Fig. 2 is according to an embodiment of the invention for the schematic diagram of the another kind refrigeration annular heat pipe of the cold junction heat-exchanger rig of semiconductor freezer;
Fig. 3 is according to an embodiment of the invention for the schematic diagram of the another kind refrigeration annular heat pipe of the cold junction heat-exchanger rig of semiconductor freezer;
Fig. 4 is the schematic explosive view of a kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention;
Fig. 5 is the schematic explosive view of the another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention;
Fig. 6 is the schematic diagram of the another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention;
Fig. 7 is the schematic diagram of the another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention;
Fig. 8 is the schematic diagram of the another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention
Fig. 9 is the schematic diagram of the another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention; And
Figure 10 is that the B of the another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention is to sectional view.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, is exemplary below by the embodiment be described with reference to the drawings, and only for explaining the present invention, and can not be interpreted as limitation of the present invention.In describing the invention, term " on ", the orientation of the instruction such as D score, "front", "rear" or position relationship be based on orientation shown in the drawings or position relationship, be only the present invention for convenience of description instead of require that the present invention with specific azimuth configuration and operation, therefore must can not be interpreted as limitation of the present invention.
Fig. 1 is according to an embodiment of the invention for the schematic diagram of the cold junction heat-exchanger rig 100 of semiconductor freezer.This cold junction heat-exchanger rig 100 can comprise in general manner: cold junction heat-conducting plate 110 and Duo Gen refrigeration annular heat pipe 120.Wherein, cold junction heat-conducting plate 110 has the heat-transfer surface with refrigeration source (cold junction of such as semiconductor chilling plate) heat exchange; Many refrigeration annular heat pipes 120 are radially spaced successively in the plane parallel with heat-transfer surface, and the top of every root refrigeration annular heat pipe 120 and cold junction heat-conducting plate 110 contact heat-exchanging, arrange downwards along the plane parallel with heat-transfer surface.Many refrigeration annular heat pipes 120 are radially spaced successively, form the structure of big ring sleeve little ring, between be spaced a distance.
When cold junction heat-exchanger rig 100 works, cold junction heat-conducting plate 110 temperature declines, temperature is passed to the refrigeration annular heat pipe 120 be in contact with it, refrigeration annular heat pipe 120 manages interior temperature when declining, and in it, liquid refrigerant is caught a cold condensation, is converted into liquid state, by the suction-operated of self gravitation and sintered powder, lower portion flows, the temperature of the object that refrigeration annular heat pipe 120 bottom reclines with it, thus reduces the temperature of surrounding enviroment.The refrigerants vaporize absorbing heat becomes gaseous state, rises to the top of refrigeration annular heat pipe 120, reuptake the temperature of cold junction heat-conducting plate 110, be condensed into liquid state, thus periodic duty under the promotion of thermal source power.
For ensureing the heat exchanger effectiveness of cold junction heat-conducting plate 110 and refrigeration source, the heat-transfer surface of cold junction heat-conducting plate 110 can have heat-conducting layer, and this heat-conducting layer is formed by the heat-conducting silicone grease be coated on heat-transfer surface (graphite or other media)." thermally coupled " or " thermo-contact " in the present embodiment can be originally direct abutting contact, adopts heat conducting mode to conduct heat.If abutting contact face coated with thermally conductive silicone grease (graphite or other media), can be thought the part on abutting contact face, as the heat-conducting layer improving thermally coupled (or thermo-contact).
Refrigeration annular heat pipe 120 can the annular of choice for use various shape, consider processing technology and refrigeration, every root refrigeration annular heat pipe 120 be with the axisymmetric polygon of the longitudinal centre line of cold junction heat-conducting plate, its formation two limits of drift angle or a part for its top margin and cold junction heat-conducting plate contact heat-exchanging.Refrigeration annular heat pipe 120 shown in Fig. 1 is hexagon, and the part of two adjacent sides of an one drift angle and this drift angle is as condenser, and with cold junction heat-conducting plate 110 contact heat-exchanging, other parts of refrigeration annular heat pipe 120 are as evaporimeter.
Fig. 2 is according to an embodiment of the invention for the schematic diagram of the another kind refrigeration annular heat pipe of the cold junction heat-exchanger rig 100 of semiconductor freezer, every root refrigeration annular heat pipe 120 is rounded square, its top at least partially with cold junction heat-conducting plate 110 contact heat-exchanging as condenser, two side is along the straight down extension parallel with heat-transfer surface.Refrigeration annular heat pipe 120 adopts tube chamber inside to have the heat pipe of the metal dust structure of sintering.
Following and two sides of rounded square refrigeration annular heat pipe 120 (such as the latter half) is at least partially as evaporimeter, when the cold-producing medium of liquid state is positioned at the horizontal component of top, liquid cold-producing medium cannot rely on separately gravity dirty, the capillary force that the metal dust of sintering can be relied on to produce, absorbs heat sink region by liquid refrigerant.
Fig. 3 is according to an embodiment of the invention for the schematic diagram of the another kind refrigeration annular heat pipe of the cold junction heat-exchanger rig 100 of semiconductor freezer, every root refrigeration annular heat pipe 120 is rhombus, its first group of diagonal is vertically arranged, second group of diagonal is horizontally disposed with, form first group of cornerwise top drift angle and formed top drift angle adjacent side at least partially with cold junction heat-conducting plate 110 contact heat-exchanging, form condenser.Refrigeration annular heat pipe 120 is positioned at part outside cold junction heat-conducting plate 110 as evaporimeter, because rhombus does not exist horizontal component, therefore, the liquid refrigerant on gravity top is relied on just can automatically to flow downward, heat absorption evaporation, the annular heat pipe 120 that therefore freezes can adopt light pipe heat pipe.
The refrigeration annular heat pipe 120 of various shape can be directly embedded in cold junction heat-conducting plate 110 or with cold junction heat-conducting plate 110 and is welded and fixed above, and for convenience of being connected with miscellaneous part, the annular heat pipe 120 that freezes can select flat structure, enlarge active surface.
Embodiments of the invention additionally provide a kind of semiconductor freezer that make use of above cold junction heat-exchanger rig 100, and semiconductor freezer can comprise in general manner: inner bag, shell, semiconductor chilling plate and cold junction heat-exchanger rig 100.Wherein the inner bag of refrigerator is limited with room between storing, and shell generally exists two kinds of structures, a kind of be pin-connected panel, be namely assembled into a complete casing by top cover, left side plate, postnotum, lower shoe etc.Another kind is monoblock type, by top cover and left side plate on request rolling become one to fall " U " font, be called U shell, be that postnotum, lower shoe point is welded into casing.The semiconductor freezer of the embodiment of the present invention preferably uses monoblock type shell, and namely shell includes U shell and back, and wherein U shell is arranged at the sidewall of inner bag and the outside of roof, and the back of shell and the rear wall of inner bag are limited with installing space.Cold junction heat-exchanger rig 100 and semiconductor chilling plate can be installed in this installing space, concrete arrangement is that the cold junction of the heat-transfer surface of cold junction heat-exchanger rig 100 and semiconductor chilling plate is thermally coupled, and make the reclining with the outer surface of inner bag at least partially, so that the cold from cold junction is reached room between storing of its every root refrigeration annular heat pipe 120.
When using the refrigeration annular heat pipe 120 of rounded square, the cold junction of semiconductor refrigeration chip contacts fixing with cold junction heat transfer plate 110, can smear Heat Conduction Material for strengthening heat-transfer effect at contact surface.The top of refrigeration annular heat pipe 120 contact with cold junction heat transfer plate 110 heat transfer plate, and the annular heat pipe 120 that freezes is by be embedded in cold junction heat transfer plate 110 or the two makes it have good contact face by the mode of welding.
Refrigeration annular heat pipe 120 inwall has the metal dust structure of sintering, this structure produces capillarity.Refrigeration annular heat pipe 120 inside is filled with cold-producing medium working medium, application of vacuum will be carried out in pipe before filling, after vacuum fills, opposite heat tube seals, under normality, refrigeration annular heat pipe 120 inside is the gas-liquid two-phase coexisting state of cold-producing medium, most liquid state is in the lower position in pipe due to self gravitation and is attracted to sintered powder inside, and most gaseous state is positioned at pipe middle and upper part, space.When semiconductor freezer works, the heat that semiconductor refrigeration chip cold junction produces passes to cold junction heat transfer plate 110 by heat transfer, cold junction heat transfer plate 110 transfers heat to the refrigeration annular heat pipe 120 be in contact with it again, gaseous refrigerant in pipe is caught a cold condensation, be converted into liquid state, liquid cold-producing medium is due to the capillary force effect of the gravity heating tube of self, flow downward, in the part of the lumen contact with semiconductor freezer, absorb the heat of inner chamber, be heated vaporization, the refrigerants vaporize absorbing heat becomes gaseous state, the top of heat pipe is risen under the promotion of thermal source power, again the temperature condensation of cold junction heat transfer plate 110 is relied on, periodic duty thus.The cooled annular heat pipe 120 of heat of refrigerator inner cavity is taken away, thus reduces the temperature of room between storing.When the cold-producing medium of liquid state is positioned at the horizontal component of top or bottom, the gravity of self cannot cause the backflow of cold-producing medium herein, but the sintered powder of refrigeration annular heat pipe 120 inside has capillarity, can produce capillary force, liquid refrigerant is drawn onto heat affected zone.
This semiconductor freezer adopts the mode of phase transformation to carry out the transmission of heat, high relative to traditional conductive heat transfer efficiency, and refrigeration annular heat pipe 120 can be made flat, conveniently coordinates with refrigerator inner cavity.Additionally do not take refrigerator space, good looking appearance.And this system need not be extra blower fan forced convertion, quiet, friction, safe and reliable.
The refrigeration annular heat pipe 120 of rhombus is similar to the operation principle of the refrigeration annular heat pipe 120 of rounded square, only owing to there is not horizontal component, therefore can use light pipe.The operation principle that the corresponding employing of other polygonal refrigeration annular heat pipes is similar is arranged.
For solving the heat dissipation problem in semiconductor chilling plate hot junction, the semiconductor freezer of the present embodiment can also comprise: hot junction heat-exchanger rig, thermally coupled with the hot junction of semiconductor chilling plate, is distributed to surrounding environment for the heat produced in hot junction.Be introduced below in conjunction with the hot junction heat-exchanger rig of accompanying drawing to the semiconductor freezer of the present embodiment.
Fig. 4 is the schematic explosive view of a kind of hot junction heat-exchanger rig 200 that can be used for semiconductor freezer of the present invention.This hot junction heat-exchanger rig 200 comprises: hot junction heat exchange box 210 and heat dissipation pipeline 220.Hot junction heat exchange box 210 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it.Heat dissipation pipeline 220 is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of heat dissipation pipeline 200 and the second end are all communicated to the top of the inner chamber of hot junction heat exchange box 210, heat dissipation pipeline 220 is tilted to Shangdi bending from its first end and the second end respectively and extends to common extreme higher position.
Heat dissipation pipeline 220 can abut on the shell 230 of refrigerator, utilizes shell 230 that heat is distributed to surrounding enviroment.Perfusion cold-producing medium in hot junction heat exchange case 210 inside can be water or other cold-producing mediums, and its state is gas-liquid two-phase coexisting state, and during semiconductor chilling plate energising work, its hot-side temperature raises.Face, hot junction and hot junction heat exchange box 210 carry out heat exchange, hot junction heat exchange box 210 forms evaporimeter, be changed to gaseous state, the cold-producing medium of gaseous state can rise along refrigerant line under thermal source pressure, transfers heat to outcase of refrigerator 230, then space outerpace is transferred heat to by free convection, refrigerant line 220 forms condenser, becomes liquid after condensation of refrigerant heat release, relies on gravity reflux to hot junction heat exchange box 210, reuptake hot junction heat to evaporate, form thermal cycle.
When using this hot junction heat-exchanger rig 200 to assemble with the cold junction heat-exchanger rig 100 of above embodiment introduction, its structure can be: semiconductor chilling plate is arranged in the space between the rear wall of inner container of icebox 130 and outcase of refrigerator rear wall, the rear wall 112 of the cold junction heat exchange box 110 of cold junction heat-exchanger rig 100 is thermally coupled with the cold junction of semiconductor chilling plate, refrigerant line 120 abuts on inner container of icebox, for freezing to storing inner chamber.The hot junction of semiconductor chilling plate by a heat bridge device arranged straight down by the heat conduction in hot junction to lower position, the upper end of heat bridge device is connected with the hot junction of semiconductor chilling plate, the hot junction heat exchange case 210 of hot junction heat-exchanger rig 200 can be thermally coupled by the hot junction of the lower end of heat bridge device and semiconductor chilling plate, thus provide the larger space upwards extended for heat dissipation pipeline 220.
Fig. 5 is the schematic explosive view of the another kind of hot junction heat-exchanger rig 300 that can be used for semiconductor freezer of the present invention.This hot junction heat-exchanger rig 300 comprises: hot junction heat exchange box 310 and Duo Gen heat dissipation pipeline 320.Hot junction heat exchange box 310 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it.Many heat dissipation pipelines 320, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root heat dissipation pipeline 320 is communicated to the top of the inner chamber of hot junction heat exchange box 310, every root heat dissipation pipeline 320 from its first end be tilted to Shangdi bending extend, end in the second end that it is formed as blind end.
Hot junction heat-exchanger rig 300 shown in Fig. 5 is similar to the operation principle of the hot junction heat-exchanger rig 200 shown in Fig. 4, but difference be, adopt many one end close heat dissipation pipeline 320, and and the heat dissipation pipeline 220 of non-formation loop.Face, hot junction and hot junction heat exchange box 310 carry out heat exchange, hot junction heat exchange box 310 forms evaporimeter, be changed to gaseous state, the cold-producing medium of gaseous state can rise along refrigerant line 320 under thermal source pressure, transfers heat to outcase of refrigerator 230, then space outerpace is transferred heat to by free convection, refrigerant line 320 forms condenser, becomes liquid after condensation of refrigerant heat release, relies on gravity reflux to hot junction heat exchange box 310, reuptake hot junction heat to evaporate, form thermal cycle.Adopt the heat dissipation pipeline of this disconnection, production technology is comparatively simple, and can better and the shell 230 of refrigerator assemble.
The hot junction heat-exchanger rig 300 of the present embodiment, also can adopt the mode that is connected with heat bridge by location arrangements in lower position, thus provide the larger space upwards extended for heat dissipation pipeline 320, to have larger area of dissipation.
Fig. 6 is the schematic diagram of the another kind of hot junction heat-exchanger rig 400 that can be used for semiconductor freezer of the present invention.This hot junction heat-exchanger rig 400 comprises: hot junction heat-conducting plate 410 and Duo Gen heat radiation annular heat pipe 420.Hot junction heat-conducting plate 410 is thermally coupled with hot junction.A part for every root heat radiation annular heat pipe 420 and hot junction heat-conducting plate 410 contact heat-exchanging, the outer casing inner wall contact heat-exchanging of another part and semiconductor freezer.
The contact surface that hot junction heat-conducting plate 410 contacts with the hot junction of semiconductor chip is coated with Heat Conduction Material, to strengthen heat-transfer effect.Many heat radiation annular heat pipes 420 are directly embedded in heat-conducting plate 410 or with heat-conducting plate 410 and are welded and fixed, and for convenience of being connected with miscellaneous part, the annular heat pipe 420 that dispels the heat can select flat structure, enlarge active surface.
Heat radiation annular heat pipe 420 inwall can have the metal dust structure of sintering by choice for use, and this structure produces capillarity.Under normality, heat radiation annular heat pipe 420 inside is the gas-liquid two-phase coexisting state of cold-producing medium, and most liquid state is in the lower position in pipe due to self gravitation and is attracted to sintered powder inside, and most gaseous state is positioned at pipe middle and upper part, space.
When the system is operating, the heat that semiconductor chip hot junction produces passes to hot junction heat-conducting plate 410 by heat transfer, hot junction heat-conducting plate 410 transfers heat to the heat radiation annular heat pipe 420 be in contact with it again, when the annular heat pipe 420 that dispels the heat is heated, liquid refrigerant in pipe is heated vaporization, the refrigerants vaporize absorbing heat becomes gaseous state, the top of heat heat radiation annular heat pipe 420 is risen under the promotion of thermal source power, heat convection is carried out again by outcase of refrigerator housing and space outerpace, again re-condenses back into liquid form, liquid cold-producing medium flows back to the bottom of heat radiation annular heat pipe 4200 again due to the capillary force effect of the gravity heating tube of self, then heat absorption vaporization is continued, periodic duty thus.
The shape of every root annular heat pipe 420 can be square or rhombus, wherein, position horizontal part on the lower and heat-conducting plate 410 thermo-contact in square heat pipe 420, the horizontal part that square heat pipe 420 position is top and vertical portion and outcase of refrigerator inwall are fitted, when the cold-producing medium of liquid state is positioned at heat pipe 420 horizontal component, the gravity of self cannot cause the backflow of cold-producing medium herein, but the sintered powder of square heat pipe 420 inside has capillarity, can capillary force be produced, liquid refrigerant is drawn onto heat affected zone.
One group of diagonal of rhombus annular heat pipe 420 is vertically arranged, and another group diagonal is horizontally disposed with, and a part and the heat-conducting plate 410 of position one group of adjacent side are on the lower fixed.There is no horizontal component pipeline in rhombus pipeline 420, therefore, the sintered powder structure of pipe inside can be removed yet, adopt common light-pipe structure, when liquid refrigerant is dirty, rely on the gravity of self completely.This kind of hot end heat sink 400 without the need to additionally taking refrigerator space, good looking appearance, and blower fan forced convertion that need not be extra, quiet, friction, safe and reliable.
Fig. 7 is the schematic diagram of the another kind of hot junction heat-exchanger rig 500 that can be used for semiconductor freezer of the present invention.This hot junction heat-exchanger rig 500 comprises: hot junction heat-conducting plate 510, heat exchange many heat pipes 520, radiating fin 530 and blower fan 540.Hot junction heat-conducting plate 510 is thermally coupled with hot junction.One end of every root heat pipe 520 and hot junction heat-conducting plate 510 contact heat-exchanging.Radiating fin 530 is arranged in many heat 520.Blower fan 540 is fixed on radiating fin 530 by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin 530 from many heat pipes 520.For ensureing to adopt heat-conducting silicone grease (graphite or other media) to contact between each attaching parts of heat transfer efficiency.This kind of hot junction heat-exchanger rig 500, is conducted heat by heat pipe fin, carries out forced convertion by fan, and radiating effect is fast, and structure is simple, easy to maintenance, concise production process.
Fig. 8 is the schematic diagram of the another kind of hot junction heat-exchanger rig 600 that can be used for semiconductor freezer of the present invention.This hot junction heat-exchanger rig 600 comprises: hot junction heat exchange box 610, many heat dissipation pipelines 620, radiating fin 630 and blower fans 640.Hot junction heat exchange box 610 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it.Many heat dissipation pipelines 620 are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root heat dissipation pipeline 620 is communicated to the top of the inner chamber of hot junction heat exchange box 610, every root heat dissipation pipeline 620 from its first end be tilted to Shangdi bending extend, end in the second end that it is formed as blind end.Radiating fin 630 is arranged on many heat dissipation pipelines 620.Blower fan 640 is fixed on radiating fin 630 by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin 630 from many heat dissipation pipelines 620.
This kind of hot junction heat-exchanger rig 600 is when semiconductor chilling plate energising work, face, hot junction and hot junction heat exchange box 610 carry out heat exchange, hot junction heat exchange box 610 forms evaporimeter, be changed to gaseous state, the cold-producing medium of gaseous state can rise along refrigerant line 620 under thermal source pressure, transfer heat to fin 630, then space outerpace is transferred heat to by convection current, refrigerant line 620 forms condenser, become liquid after condensation of refrigerant heat release, rely on gravity reflux to hot junction heat exchange box 610, reuptake hot junction heat to evaporate, form thermal cycle, fin 630 and blower fan 640 improve the condensation rate of refrigerant line 620.Heat conduction on fin 630, is improved the radiating efficiency of fin by refrigerant line 620 further by blower fan 640.
Fig. 9 is the schematic diagram of the another kind of hot junction heat-exchanger rig 700 that can be used for semiconductor freezer of the present invention, and Figure 10 is that the B of the another kind of hot junction heat-exchanger rig 700 that can be used for semiconductor freezer of the present invention is to sectional view.This hot junction heat-exchanger rig 700 can comprise in general manner: hot junction heat exchange box 710, many heat dissipation pipelines 720 and multiple palisade fiber tube radiating surface 730.Wherein, hot junction heat exchange box 710 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; Many heat dissipation pipelines 720 are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and after often root heat dissipation pipeline 720 extends upwardly to peak from the roof of hot junction heat exchange box 710, the bottom of the sidewall of hot junction heat exchange box 710 is extended downward along the bending of different perpendiculars, the tube chamber of every root heat dissipation pipeline 720 and the inner space of hot junction heat exchange box 710, form heat radiation loop; Recline the respectively side that is arranged at heat dissipation pipeline 720 or recline of multiple palisade fiber tube radiating surface 730 is arranged between two adjacent heat dissipation pipelines 720.
A kind of alternate configurations of hot junction heat-exchanger rig 700 is: initial upwards its extension of two tube connectors that two heat dissipation pipelines 720 stretch out from hot junction heat exchange box 710 top, and tiltedly peak is extended to an inclination after extending to certain altitude, then snakelike to downward-extension in two perpendiculars respectively, the tube connector eventually through the bottom of the sidewall of hot junction heat exchange box 710 is communicated with the inner chamber of hot junction heat exchange box 710.Palisade fiber tube radiating surface 730 has the setting of many group heat radiation fiber tube parallel interval to form, and comprises three groups, is affixed on side and the midfeather place of two heat dissipation pipelines 720 respectively.When after the refrigerant heats evaporation in hot junction heat exchange box 710, rise along heat dissipation pipeline 720, temperature is distributed to surrounding enviroment, be then condensed into liquid gradually along snakelike pipeline, return hot junction heat exchange box 710 under gravity.Palisade fiber tube increases area of dissipation, improves radiating efficiency.Heat dissipation pipeline 720 also can be provided with the three-way device for pouring into cold-producing medium.
The cold junction heat-exchanger rig introduced by above embodiment and various forms of hot junctions heat-exchanger rig are assembled, and constitute the refrigeration system of semiconductor freezer, reliably can ensure the normal work of semiconductor chilling plate, and improve heat exchange efficiency.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (14)
1., for a cold junction heat-exchanger rig for semiconductor freezer, comprising:
Cold junction heat-conducting plate, it has the hot linked heat-transfer surface with refrigeration source;
Many refrigeration annular heat pipes, are radially spaced in the plane parallel with described heat-transfer surface, wherein successively
Freeze described in every root the top of annular heat pipe and described cold junction heat-conducting plate contact heat-exchanging, arranges downwards along the plane parallel with described heat-transfer surface.
2. cold junction heat-exchanger rig according to claim 1, wherein
The annular heat pipe that freezes described in every root is the axisymmetric polygon of longitudinal centre line with described cold junction heat-conducting plate, and it forms two limits of drift angle or a part for its top margin and described cold junction heat-conducting plate contact heat-exchanging.
3. cold junction heat-exchanger rig according to claim 2, wherein
The annular heat pipe that freezes described in every root is rounded square, its top at least partially with described cold junction heat-conducting plate contact heat-exchanging, two side is along the straight down extension parallel with described heat-transfer surface.
4. cold junction heat-exchanger rig according to claim 3, wherein
The tube chamber inside of described refrigeration annular heat pipe has the metal dust structure of sintering.
5. cold junction heat-exchanger rig according to claim 2, wherein
The annular heat pipe that freezes described in every root is rhombus, its first group of diagonal is vertically arranged, second group of diagonal is horizontally disposed with, form described first group of cornerwise top drift angle and formed described top drift angle adjacent side at least partially with described cold junction heat-conducting plate contact heat-exchanging.
6. cold junction heat-exchanger rig according to claim 5, wherein
Described refrigeration annular heat pipe is light pipe heat pipe.
7. cold junction heat-exchanger rig according to claim 1, wherein
The outer surface of annular heat pipe of freezing described in every root is flat square.
8. a semiconductor freezer, comprising:
Inner bag, is limited with room between storing in it;
Shell, is arranged at the outside of described inner bag, and it includes U shell and back, and the back of described shell and the rear wall of described inner bag are limited with installing space;
Semiconductor chilling plate;
Cold junction heat-exchanger rig according to any one of claim 1 to 7, itself and described semiconductor chilling plate are all arranged in described installing space,
Described cold junction heat-exchanger rig is installed into makes the cold junction of its heat-transfer surface and described semiconductor chilling plate thermally coupled, and make the reclining with the outer surface of described inner bag at least partially, so that the cold from described cold junction is reached room between described storing of its every root refrigeration annular heat pipe.
9. semiconductor freezer according to claim 8, also comprises:
Hot junction heat-exchanger rig, thermally coupled with the hot junction of described semiconductor chilling plate, be distributed to surrounding environment for the heat produced in described hot junction.
10. semiconductor freezer according to claim 9, wherein
Described hot junction heat-exchanger rig comprises:
Hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; With
Heat dissipation pipeline, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and
The first end being formed as openend of described heat dissipation pipeline and the second end are all communicated to the top of the inner chamber of described hot junction heat exchange box,
Described heat dissipation pipeline is tilted to Shangdi bending from its first end and the second end respectively and extends to common extreme higher position.
11. semiconductor freezers according to claim 9, wherein
Described hot junction heat-exchanger rig comprises:
Hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; With
Many heat dissipation pipelines, are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and
Described in every root, the first end being formed as openend of heat dissipation pipeline is communicated to the top of the inner chamber of described hot junction heat exchange box,
Heat dissipation pipeline described in every root from its first end be tilted to Shangdi bending extend, end in the second end that it is formed as blind end.
12. semiconductor freezers according to claim 9, wherein
Described hot junction heat-exchanger rig comprises:
Hot junction heat-conducting plate, itself and described hot junction are thermally coupled; With
Many heat radiation annular heat pipes, a part for the annular heat pipe that dispels the heat described in every root and described hot junction heat-conducting plate contact heat-exchanging, the contact internal walls heat exchange of the shell of another part and described semiconductor freezer.
13. semiconductor freezers according to claim 9, wherein
Described hot junction heat-exchanger rig comprises:
Hot junction heat-conducting plate, itself and described hot junction are thermally coupled;
Many heat radiation heat pipes, the one end of the heat pipe that dispels the heat described in every root and described hot junction heat-conducting plate contact heat-exchanging;
Radiating fin, is arranged on described many heat radiation heat pipes; With
Blower fan, is fixed on described radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described radiating fin from described many heat radiation heat pipes.
14. semiconductor freezers according to claim 9, wherein
Described hot junction heat-exchanger rig comprises:
Hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it;
Many heat dissipation pipelines, are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and
Described in every root, the first end being formed as openend of heat dissipation pipeline is communicated to the top of the inner chamber of described hot junction heat exchange box,
Heat dissipation pipeline described in every root from its first end be tilted to Shangdi bending extend, end in the second end that it is formed as blind end;
Radiating fin, is arranged on described many heat dissipation pipelines; With
Blower fan, is fixed on described radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described radiating fin from described many heat dissipation pipelines.
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| CN201410123561.0A CN104329868B (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
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| CN201410123561.0A CN104329868B (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
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