CN2906522Y - Heat pipe apparatus of electronic refrigerator - Google Patents
Heat pipe apparatus of electronic refrigerator Download PDFInfo
- Publication number
- CN2906522Y CN2906522Y CNU2006200597117U CN200620059711U CN2906522Y CN 2906522 Y CN2906522 Y CN 2906522Y CN U2006200597117 U CNU2006200597117 U CN U2006200597117U CN 200620059711 U CN200620059711 U CN 200620059711U CN 2906522 Y CN2906522 Y CN 2906522Y
- Authority
- CN
- China
- Prior art keywords
- pipe
- heat
- pedestal
- liquid storage
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 230000008020 evaporation Effects 0.000 claims abstract description 31
- 238000001704 evaporation Methods 0.000 claims abstract description 31
- 238000003860 storage Methods 0.000 claims abstract description 25
- 238000005057 refrigeration Methods 0.000 claims abstract description 23
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 230000005494 condensation Effects 0.000 claims abstract description 4
- 238000009833 condensation Methods 0.000 claims abstract description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 45
- 238000005452 bending Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat tube device of electronic refrigerator, which comprises a heat tube arranged on hot end of a refrigeration semiconductor, the heat tube is provided with fins, the heat tube is connected with the hot end of the semiconductor through a base structure with refrigeration working medium, the base structure comprises a base back cap, a liquid storage tube and a base front cover, the base front cover is connected with the hot end of the refrigeration semiconductor. The base back cap and the base front cover are arranged in parallel and the liquid storage tube is ring structure. The base back cap and the liquid storage tube as well as the liquid storage tube and the base front cover are welded through the annular welding seam. The heat tube comprises an evaporation coil used for evaporation of refrigeration working medium and a return liquid tube used for condensation of refrigeration working medium, the evaporation coil and the return liquid tube are arranged in pairs, one end of the evaporation coil and the return liquid tube is extended into the back cap of the base structure and opened separately in the liquid storage cavity formed by the back cap of the base structure, the liquid storage tube and the front cover of the base structure, the opening position of evaporation coil is higher than the return liquid tube. The utility model has the advantages of simple and rational structure, high production efficiency, low costs and best sealing property.
Description
Technical field
The utility model relates to the heat-pipe apparatus of a kind of electronic refrigerator, particularly a kind of electronic refrigerator.
Background technology
The heat pipe of common electronic refrigerator fits by a reservoir chamber and refrigeration semiconductor hot junction, the practice of this reservoir chamber is varied, wherein have kind of reservoir chamber's structure be directly on copper or the aluminum substrate drawing go out cavity, this manufacture craft and structure are all relatively simple, but yield rate is lower, the also bad control of quality makes the user not too satisfied.
The utility model content
The purpose of this utility model be to provide a kind of simple and reasonable, production efficiency is high, cost of manufacture is low, the heat-pipe apparatus of the electronic refrigerator of good seal performance, to overcome weak point of the prior art.
Press the heat-pipe apparatus of a kind of electronic refrigerator of this purpose design, comprise the heat pipe that is arranged on the refrigeration semiconductor hot junction, heat pipe is provided with fin, pedestal and semiconductor hot junction that its architectural feature is a heat pipe by a ccontaining refrigeration working medium join, this pedestal comprises pedestal bonnet, liquid storage pipe and pedestal protecgulum, and pedestal protecgulum and refrigeration semiconductor hot junction join.
Above-mentioned pedestal bonnet and pedestal protecgulum are and are arranged in parallel, and liquid storage pipe is a circulus.
Above-mentioned liquid storage pipe is a round tube shape structure.
Above-mentioned pedestal bonnet and liquid storage pipe, liquid storage pipe and pedestal protecgulum are by the ring-type weld seam at its faying face place.
Above-mentioned heat pipe comprises evaporation tube that is used for the refrigeration working medium evaporation and the liquid back pipe that is used for the refrigeration working medium condensation, evaporation tube and liquid back pipe are provided with in pairs, one end of evaporation tube and liquid back pipe stretches into the pedestal bonnet, be opened on respectively in the reservoir chamber that pedestal bonnet, liquid storage pipe and pedestal protecgulum surround, the aperture position of evaporation tube is than the height of liquid back pipe.
Above-mentioned evaporation tube that is connected with reservoir and liquid back pipe occur in pairs.
Above-mentioned evaporation tube and liquid back pipe are respectively two pairs, are arranged side by side respectively.
The bending forward earlier of above-mentioned evaporation tube extends to the top then obliquely, the downward coiling of Qing Xieing again, and last and liquid back pipe joins.
The utility model is welded as a whole the liquid storage pipe of pipe shape with the pedestal bonnet and the pedestal protecgulum that are arranged in parallel, on the basis of guaranteeing reservoir chamber's favorable sealing property, production efficiency and yield rate have been improved greatly, reduced manufacturing cost, because whole welding process can adopt automatic boxing equipment to carry out, and is simple and easy to do.Extend to the top obliquely, after the evaporation tube structure of the downward coiling of Qing Xieing makes the distribute heat that refrigeration working medium can maximum possible again, be condensed into liquid again and be back in the reservoir chamber; Refrigeration working medium is with the rising of gaseous form, utilizes himself gravity to flow by downward-sloping pipeline in its decline process, and do not need external force to promote, and saved the energy.Side by side and the evaporation tube that is provided with in pairs and the liquid back pipe space that effectively utilized product, improved heat dispersion.
The utility model is simple and reasonable, production efficiency height, low, the good seal performance of cost of manufacture.
Description of drawings
Fig. 1 is the utility model one embodiment assembly structure structural representation.
Fig. 2 is the utility model one embodiment master's TV structure schematic diagram.
Fig. 3 is the backsight structural representation of Fig. 2.
Fig. 4 is the A-A sectional structure schematic diagram of Fig. 3.
Fig. 5 is a B place structure for amplifying schematic diagram among Fig. 4.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described.
Referring to Fig. 1-Fig. 5, the heat-pipe apparatus of this electronic refrigerator, comprise the heat pipe that is arranged on the refrigeration semiconductor hot junction, heat pipe is provided with fin 1, heat pipe joins by the pedestal and the semiconductor hot junction of a ccontaining refrigeration working medium, fin 1 is provided with installs location-plate 7, and this installation location-plate 7 is arranged on the homonymy of pedestal.Pedestal comprises pedestal bonnet 4 and the pedestal protecgulum 6 that is arranged in parallel, round tube shape structure liquid storage pipe 5 is arranged between pedestal bonnet 4 and the pedestal protecgulum 6, pedestal bonnet 4 and liquid storage pipe 5, liquid storage pipe 5 and pedestal protecgulum 6 are combined as a whole by the ring-type weld seam at its faying face place, weld seam 5.1 and 5.2 is arranged on the inboard of liquid storage pipe 5 and pedestal protecgulum 6, pedestal bonnet 4 junctions, see Fig. 5, section of weld joint is a triangular structure.Pedestal protecgulum 6 joins with the refrigeration semiconductor hot junction.
Heat pipe comprises evaporation tube 2 that is used for refrigeration working medium evaporation and the liquid back pipe 3 that is used for the refrigeration working medium condensation, and evaporation tube 2 that is connected with reservoir 5 and liquid back pipe 3 occur in pairs, as is 2,4,6,8 or the like.Evaporation tube 2 and liquid back pipe 3 are provided with in pairs, and an end of evaporation tube 2 and liquid back pipe 3 stretches into pedestal bonnet 4, are opened on respectively in the reservoir chamber that pedestal bonnet 4, liquid storage pipe 5 and pedestal protecgulum 6 surround, and the aperture position of evaporation tube 2 is than the height of liquid back pipe 3.Evaporation tube 2 and liquid back pipe 3 are respectively two pairs, are arranged side by side respectively.Evaporation tube 2 bendings forward earlier extend to the top then obliquely, the downward coiling of Qing Xieing again, and last and liquid back pipe 3 joins.Be provided with four on the pedestal bonnet 4 and be symmetrical arranged pilot hole 4.1.
Claims (10)
1. the heat-pipe apparatus of an electronic refrigerator, comprise the heat pipe that is arranged on the refrigeration semiconductor hot junction, heat pipe is provided with fin (1), it is characterized in that described heat pipe joins by the pedestal and the semiconductor hot junction of a ccontaining refrigeration working medium, this pedestal comprises pedestal bonnet (4), liquid storage pipe (5) and pedestal protecgulum (6), and pedestal protecgulum and refrigeration semiconductor hot junction join.
2. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that described pedestal bonnet (4) and pedestal protecgulum (6) are to be arranged in parallel that liquid storage pipe (5) is a circulus.
3. the heat-pipe apparatus of electronic refrigerator according to claim 2 is characterized in that described liquid storage pipe (5) is a round tube shape structure.
4. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that described pedestal bonnet (4) and liquid storage pipe (5), liquid storage pipe and pedestal protecgulum (6) the ring-type weld seam by its faying face place; Weld seam is arranged on the inboard of liquid storage pipe and pedestal protecgulum, pedestal bonnet junction; Section of weld joint is a triangular structure.
5. the heat-pipe apparatus of electronic refrigerator according to claim 1, it is characterized in that described heat pipe comprises evaporation tube (2) that is used for the refrigeration working medium evaporation and the liquid back pipe (3) that is used for the refrigeration working medium condensation, evaporation tube and liquid back pipe are provided with in pairs, one end of evaporation tube and liquid back pipe stretches into pedestal bonnet (4), be opened on respectively in the reservoir chamber that pedestal bonnet, liquid storage pipe (5) and pedestal protecgulum (6) surround, the aperture position of evaporation tube is than the height of liquid back pipe.
6. the heat-pipe apparatus of electronic refrigerator according to claim 5 is characterized in that described evaporation tube (2) that is connected with reservoir (5) and liquid back pipe (3) are provided with in pairs.
7. the heat-pipe apparatus of electronic refrigerator according to claim 6 is characterized in that described evaporation tube (2) and liquid back pipe (3) are respectively two pairs, are arranged side by side respectively.
8. the heat-pipe apparatus of electronic refrigerator according to claim 5 is characterized in that described evaporation tube (2) bending forward earlier, extends to the top then obliquely, the downward coiling of Qing Xieing again, and last and liquid back pipe (3) joins.
9. the heat-pipe apparatus of electronic refrigerator according to claim 1 is characterized in that described pedestal bonnet (4) is provided with two to six pilot holes (4.1).
10. the heat-pipe apparatus of electronic refrigerator according to claim 8 is characterized in that described pilot hole (4.1) is symmetrical arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200597117U CN2906522Y (en) | 2006-05-27 | 2006-05-27 | Heat pipe apparatus of electronic refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2006200597117U CN2906522Y (en) | 2006-05-27 | 2006-05-27 | Heat pipe apparatus of electronic refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2906522Y true CN2906522Y (en) | 2007-05-30 |
Family
ID=38115160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2006200597117U Expired - Lifetime CN2906522Y (en) | 2006-05-27 | 2006-05-27 | Heat pipe apparatus of electronic refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2906522Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881567A (en) * | 2010-07-01 | 2010-11-10 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
| CN102790022A (en) * | 2012-07-05 | 2012-11-21 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| CN104329868A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
| CN104329869A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN104329870A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
| CN104329850A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329829A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329832A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN104534781A (en) * | 2014-12-15 | 2015-04-22 | 青岛海尔股份有限公司 | Cold end heat exchanging device and semiconductor refrigeration freezer |
| CN107676985A (en) * | 2017-09-30 | 2018-02-09 | 苏州苏净安发空调有限公司 | Antifreezing hot water heater device |
-
2006
- 2006-05-27 CN CNU2006200597117U patent/CN2906522Y/en not_active Expired - Lifetime
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101881567A (en) * | 2010-07-01 | 2010-11-10 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
| CN101881567B (en) * | 2010-07-01 | 2013-03-20 | 郭琛 | Cylindrical evaporation chamber specially used for semiconductor electronic freezing device and manufacture method thereof |
| CN102790022A (en) * | 2012-07-05 | 2012-11-21 | 常州天诺电子科技有限公司 | Radiator for semi-conductor refrigeration |
| CN104329832A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN104329868B (en) * | 2014-03-28 | 2017-01-18 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
| CN104329870A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
| CN104329850A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329829A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329868A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
| CN104329832B (en) * | 2014-03-28 | 2017-04-26 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN104329869A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| CN104329870B (en) * | 2014-03-28 | 2017-01-18 | 海尔集团公司 | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator |
| CN104329869B (en) * | 2014-03-28 | 2017-01-18 | 海尔集团公司 | Heat exchange device and semiconductor refrigerator with heat exchange device |
| WO2016095587A1 (en) * | 2014-12-15 | 2016-06-23 | 青岛海尔股份有限公司 | Cold end heat exchanging device and semiconductor refrigerator |
| CN104534781A (en) * | 2014-12-15 | 2015-04-22 | 青岛海尔股份有限公司 | Cold end heat exchanging device and semiconductor refrigeration freezer |
| US10197309B2 (en) | 2014-12-15 | 2019-02-05 | Qingdao Haier Joint Stock Co., Ltd | Cold end heat exchanging device and semiconductor refrigerator |
| CN107676985A (en) * | 2017-09-30 | 2018-02-09 | 苏州苏净安发空调有限公司 | Antifreezing hot water heater device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070530 |
|
| EXPY | Termination of patent right or utility model |