CN104329850A - Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof - Google Patents
Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof Download PDFInfo
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- CN104329850A CN104329850A CN201410124194.6A CN201410124194A CN104329850A CN 104329850 A CN104329850 A CN 104329850A CN 201410124194 A CN201410124194 A CN 201410124194A CN 104329850 A CN104329850 A CN 104329850A
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- heat
- cold
- heat exchange
- cold junction
- exchanger rig
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 86
- 238000005057 refrigeration Methods 0.000 title claims abstract description 41
- 238000001816 cooling Methods 0.000 claims abstract description 40
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 claims description 73
- 239000003507 refrigerant Substances 0.000 claims description 52
- 230000007704 transition Effects 0.000 claims description 35
- 238000001704 evaporation Methods 0.000 claims description 27
- 230000008020 evaporation Effects 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000037237 body shape Effects 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 12
- 239000012530 fluid Substances 0.000 abstract 5
- 239000012071 phase Substances 0.000 description 37
- 239000002360 explosive Substances 0.000 description 16
- 238000009833 condensation Methods 0.000 description 14
- 230000005494 condensation Effects 0.000 description 14
- 230000005484 gravity Effects 0.000 description 12
- 230000007423 decrease Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000010412 perfusion Effects 0.000 description 5
- 230000009466 transformation Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000003673 groundwater Substances 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000010358 mechanical oscillation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
The invention provides a semiconductor refrigeration refrigerator and a hot-end heat exchange device of the semiconductor refrigeration refrigerator. The hot-end heat exchange device comprises a hot-end heat exchange box, a plurality of cooling pipelines, cooling fins and a cooling fan. An inner cavity for containing gas and liquid two-phase coexisting refrigerating fluid is limited by the hot-end heat exchange box and is configured to allow phase change heat exchange to be carried out on the refrigerating fluid inside the cavity; the cooling pipelines are configured to allow the refrigerating fluid to flow inside and allow phase change heat exchange to happen to the refrigerating fluid; the first end, used as the opening end, of each cooling pipeline is communicated to the upper portion of the inner cavity of the hot-end heat exchange box; each cooling pipeline extends upwards from the first end of the cooling pipeline and is ended at the second end, used as the closed end, of the cooling pipeline; the cooling fins are arranged on the cooling pipelines; the cooling fan is fixed to the cooling fins through a fastening mechanism, and forced convection cooling is carried out on heat transmitted to the cooling fins from the cooling pipelines. According to the technical scheme, phase change circular heat exchange of the refrigerating fluid in the hot-end heat exchange box and the cooling pipelines is utilized or effectively cooling a hot end; the structure is simple, and the occupied space is small.
Description
Technical field
The present invention relates to refrigeration plant, particularly relate to semiconductor freezer and hot junction heat-exchanger rig thereof.
Background technology
Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to realize refrigeration by the double-deck heat pipe heat radiation of highly effective ring and conduction technique and automatic pressure-transforming Variable flow control technology, without the need to refrigeration working medium and mechanical moving element, solve the application problem of traditional mechanical refrigerator such as medium pollution and mechanical oscillation.
But, the cold junction of semiconductor chilling plate is while refrigeration, a large amount of heats can be produced in its hot junction, for ensureing that semiconductor chilling plate reliably carries out work constantly, need to dispel the heat to hot junction in time, but generally using the mode of fin and surrounding enviroment to carry out heat exchange for the hot-side heat dissipation of semiconductor chilling plate in prior art, this mode radiating efficiency is low, limits the development of semiconductor freezer.And this province of radiating fin volume is comparatively large, cause refrigerator to take up room greatly, exposed radiating fin also have impact on refrigerator outward appearance.
Summary of the invention
An object of the present invention is to provide the hot junction heat-exchanger rig that a kind of radiating efficiency is high, take up room little.
The present invention's further object hot junction heat-exchanger rig will be made to produce and assembly technology is simple, it is reliable and stable to coordinate with refrigerator body.
According to an aspect of the present invention, the invention provides a kind of hot junction heat-exchanger rig for semiconductor freezer.
This hot junction heat-exchanger rig comprises: hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; Many heat dissipation pipelines, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root heat dissipation pipeline is communicated to the top of the inner chamber of hot junction heat exchange box, upwards extending from its first end of every root heat dissipation pipeline, ends in the second end that it is formed as blind end; Radiating fin, is arranged on many heat dissipation pipelines; And cooling fan, be fixed on radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin from many heat dissipation pipelines.
Alternatively, hot junction heat exchange box is flat rectangular body shape, and the area of its antetheca be oppositely arranged and rear wall is greater than the area in other faces, and the outer surface of rear wall is used as heat-transfer surface hot linked with pyrotoxin.
Alternatively, the casing extension edge of hot junction heat exchange box is provided with multiple installing hole, is fixed in described semiconductor freezer to utilize securing member to be installed by hot junction heat-exchanger rig.
Alternatively, many heat dissipation pipelines comprise: the first heat dissipation pipeline be disposed in order in the plane parallel with rear wall, the second heat dissipation pipeline and the 3rd heat dissipation pipeline, and, first heat dissipation pipeline, the second heat dissipation pipeline and the 3rd heat dissipation pipeline comprise respectively: inner chamber tube connector, with inner space and to extend upwardly to hot junction heat exchange box outside; Extension of section, upwards extends from the upper end of inner chamber tube connector, for arranging radiating fin.
Alternatively, the extension of section of the second heat dissipation pipeline is the straight shape section vertically arranged; The extension of section of the first heat dissipation pipeline and the 3rd heat dissipation pipeline comprises respectively: bending tube section, is communicated with the upper end of inner chamber tube connector, and upwards extends deviously along the direction away from the second heat dissipation pipeline; Straight shape pipeline section, is communicated with the upper end of bending tube section, and continues to extend upwardly to the second end.
Alternatively, above-mentioned hot junction heat-exchanger rig also comprises: three-way device, be arranged in a heat dissipation pipeline, the first end of three-way device is connected with inner space or with tube connector as tube connector, its second end is connected with extension of section, and its 3rd end is the normal-closed end being configured to operationally open to receive the cold-producing medium injected from outside.
Alternatively, the both sides of cooling fan are provided with anchorage bar; The opposing side in heat-transfer surface of radiating fin has the draw-in groove with hook formation; Wherein anchorage bar is installed in draw-in groove, to be fixed on radiating fin by cooling fan.
According to another aspect of the present invention, a kind of semiconductor freezer is additionally provided.This semiconductor freezer comprises: semiconductor chilling plate; Inner bag, is limited with room between storing in it; Shell, includes U shell and back, is arranged at the outside of inner bag, and the back of shell and the rear wall of inner bag are limited with installing space; Any one hot junction heat-exchanger rig above-mentioned, it is installed into makes the hot junction of the outer surface of the rear wall of its hot junction heat exchange box and semiconductor chilling plate thermally coupled, and is arranged in together with semiconductor chilling plate in installing space, and the direction of cooling fan is towards the back of shell.
Alternatively, above-mentioned semiconductor freezer also comprises: cold junction heat-exchanger rig, thermally coupled with the cold junction of described semiconductor chilling plate, for the temperature conduction of described cold junction is extremely indoor between described storing.
Alternatively, cold junction heat-exchanger rig comprises: cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; And refrigerant line, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of refrigerant line and the second end are all communicated to the bottom of the inner chamber of cold junction heat exchange box, refrigerant line bends inclined downward from its first end and the second end respectively and extends to common extreme lower position, and the reclining with the outer surface of inner bag at least partially of refrigerant line.
Alternatively, cold junction heat-exchanger rig comprises: cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; With many refrigerant lines, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root refrigerant line is communicated to the bottom of described inner chamber, every root refrigerant line bends extension inclined downward from its first end, end in the second end that it is formed as blind end, and the reclining with the outer surface of inner bag at least partially of every root refrigerant line.
Alternatively, cold junction heat-exchanger rig comprises: cold junction heat-conducting plate, and itself and cold junction are thermally coupled; With many annular heat pipes, a part for every root annular heat pipe and cold junction heat-conducting plate contact heat-exchanging, the wall contacts heat exchange of the inner chamber of another part and semiconductor freezer.
Alternatively, described cold junction heat-exchanger rig comprises: cold junction heat-conducting plate, and itself and cold junction are thermally coupled; Many heat pipes, a part for every root heat pipe and cold junction heat-conducting plate contact heat-exchanging, with to its another part transition temperature; Cold scattering fin, is arranged on another part of many heat pipes, and exposed between storing in room by the opening on inner chamber; Cold scattering blower fan, for generating the air-flow through cold scattering fin in the lumen.
Alternatively, cold junction heat-exchanger rig comprises: cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; First tube connector and the second tube connector, stretch out from the inner chamber bottom of cold junction heat exchange box respectively, and stretch into room between storing by the opening of inner bag; Inflation type evaporator, comprise evaporation plate and be arranged at the refrigeration pipe that evaporation plate is formed by inflation mode, the inwall of evaporation plate and inner bag reclines, the first end being formed as openend of refrigeration pipe is communicated with the second tube connector with the first tube connector respectively with the second end, to be communicated with the inner chamber of cold junction heat exchange box, refrigeration pipe extends downward common extreme lower position respectively from its first end and the second end.
Alternatively, cold junction heat-exchanger rig comprises: cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; First tube connector and the second tube connector, stretch out from the inner chamber bottom of cold junction heat exchange box respectively; Tube-in-sheet evaporator, comprise evaporation plate and be posted by the refrigeration pipe in evaporation plate one side, the another side of evaporation plate and the outer wall of inner bag recline, the first end being formed as openend of refrigeration pipe is communicated with the second tube connector with the first tube connector respectively with the second end, to be communicated with the inner chamber of cold junction heat exchange box, refrigeration pipe bends inclined downward from its first end and the second end respectively and extends to common extreme lower position.
In the heat-exchanger rig of hot junction of the present invention, hot junction heat exchange box is as evaporimeter, heat dissipation pipeline is as condenser, utilize cold-producing medium phase transformation cycle heat exchange in hot junction heat exchange box and Duo Gen heat dissipation pipeline, use radiating fin to add area of dissipation simultaneously, and adopt cooling fan to carry out forced convertion, effectively dispel the heat to the hot junction of semiconductor chilling plate, structure is simple, takes up room little.
Further, semiconductor freezer of the present invention can adopt the cold junction heat-exchanger rig of various ways timely and effectively the cold of semiconductor chilling plate cold junction to be conducted to chamber interior between storing, and flexible configuration, refrigerating efficiency are high.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is according to an embodiment of the invention for the schematic explosive view of the hot junction heat-exchanger rig 100 of semiconductor freezer;
Fig. 2 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention;
Fig. 3 is the schematic rear view of semiconductor freezer according to an embodiment of the invention;
Fig. 4 is that the A of the back of semiconductor freezer is according to an embodiment of the invention to sectional view;
Fig. 5 is the schematic explosive view of a kind of cold junction heat-exchanger rig of the semiconductor freezer that can be used for the embodiment of the present invention;
Fig. 6 is the schematic explosive view of the another kind of cold junction heat-exchanger rig of the semiconductor freezer that can be used for the embodiment of the present invention;
Fig. 7 is the schematic explosive view of the another kind of cold junction heat-exchanger rig of the semiconductor freezer that can be used for the embodiment of the present invention;
Fig. 8 is the schematic explosive view of the another kind of cold junction heat-exchanger rig of the semiconductor freezer that can be used for the embodiment of the present invention;
Fig. 9 is the schematic explosive view of the another kind of cold junction heat-exchanger rig of the semiconductor freezer that can be used for the embodiment of the present invention; And
Figure 10 is the schematic explosive view of the another kind of cold junction heat-exchanger rig of the semiconductor freezer that can be used for the embodiment of the present invention.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, is exemplary below by the embodiment be described with reference to the drawings, and only for explaining the present invention, and can not be interpreted as limitation of the present invention.In describing the invention, term " on ", the orientation of the instruction such as D score, "front", "rear" or position relationship be based on orientation shown in the drawings or position relationship, be only the present invention for convenience of description instead of require that the present invention with specific azimuth configuration and operation, therefore must can not be interpreted as limitation of the present invention.
Fig. 1 is according to an embodiment of the invention for the schematic explosive view of the hot junction heat-exchanger rig 100 of semiconductor freezer.This hot junction heat-exchanger rig 100 can comprise in general manner: hot junction heat exchange box 110, many heat dissipation pipelines 120, radiating fin 130 and cooling fans 140.
Wherein hot junction heat exchange box 110 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; Many heat dissipation pipelines 120 are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of every root heat dissipation pipeline 120 is communicated to the top of the inner chamber of hot junction heat exchange box 110, upwards extending from its first end of every root heat dissipation pipeline 120, ends in the second end that it is formed as blind end; Radiating fin 130 is arranged on many heat dissipation pipelines 120; Cooling fan 140 is fixed on radiating fin 130 by retention mechanism, to carry out forced convertion heat radiation to the heat reaching radiating fin 130 from many heat dissipation pipelines 120.
In hot junction heat exchange box 110 and heat dissipation pipeline 120, the cold-producing medium of perfusion can be water or other refrigeration working mediums, and the groundwater increment of cold-producing medium can draw by by experimental test.The structure that every root heat dissipation pipeline 120 up bends extension needs to ensure that liquid cold-producing medium can rely on flowing in pipeline of free gravity.When the hot junction heat-exchanger rig 100 of the present embodiment works, cold-producing medium carries out gas-liquid phase transition in hot junction heat exchange box 110 and heat dissipation pipeline 120, carries out thermal cycle.
Hot junction heat exchange box 110 can be flat rectangular body shape, and the area of its antetheca be oppositely arranged and rear wall is greater than the area in other faces, and the outer surface of rear wall is used as and pyrotoxin (hot junction of the semiconductor chilling plate in such as semiconductor freezer) hot linked heat-transfer surface.Hot linked mode can be comprised this outer surface and directly contact with pyrotoxin and recline or contacted by heat-conducting layer, and wherein heat-conducting layer can for being coated on heat conductive silica gel between outer surface and pyrotoxin or graphite etc." thermally coupled " or " thermo-contact " in the present embodiment can be originally direct abutting contact, adopts heat conducting mode to conduct heat.If abutting contact face coated with thermally conductive silicone grease (graphite or other media), can be thought the part on abutting contact face, as the heat-conducting layer improving thermally coupled (or thermo-contact).
Such as, during semiconductor chilling plate energising work, hot junction distribute heat, the corresponding rising of temperature of hot linked hot junction heat exchange box 110 with it, evaporation is undergone phase transition during liquid refrigerant heat in hot junction heat exchange box 110, change becomes gaseous state, the cold-producing medium of gaseous state can rise along heat dissipation pipeline 120 under thermal source pressure, heat is passed to hot linked radiating fin 130 with it, the heat of radiating fin 130 by the air-flow of cooling fan 140 until surrounding enviroment, again liquid state is become mutually after condensation of refrigerant heat release, rely on gravity automatic back flow in hot junction heat exchange box 110 inner chamber, again absorb the heat distributed in hot junction to evaporate, carry out circulating phase-change heat thus, effectively reduce hot-side temperature.
The casing extension edge of hot junction heat exchange box 110 is provided with multiple installing hole 113, is fixed in semiconductor freezer to utilize securing member to be installed by hot junction heat-exchanger rig 100.
Heat dissipation pipeline 120 can select copper pipe, stainless steel tube, aluminum pipe etc., is preferably copper pipe.Heat dissipation pipeline 120 can comprise: the first heat dissipation pipeline 121, second heat dissipation pipeline 122 be disposed in order in the plane parallel with rear wall and the 3rd heat dissipation pipeline 123, thus the first heat dissipation pipeline 121 and the 3rd heat dissipation pipeline 123 are positioned at the both sides of the second heat dissipation pipeline 122.And the first heat dissipation pipeline 121, second heat dissipation pipeline 122 and the 3rd heat dissipation pipeline 123 comprise respectively: inner chamber tube connector 124 and extension of section.The inner space of inner chamber tube connector and hot junction heat exchange box 110 and to extend upwardly to hot junction heat exchange box 110 outside; Extension of section upwards extends from the upper end of inner chamber tube connector, for arranging radiating fin 130.
The extension of section of the second heat dissipation pipeline 122 is the straight shape section vertically arranged; The extension of section of the first heat dissipation pipeline 121 and the 3rd heat dissipation pipeline 123 comprises respectively: bending tube section 125 and straight shape pipeline section (be placed in radiating fin 130 in figure inner, cannot illustrate).Bending tube section 125 is communicated with the upper end of inner chamber tube connector 124, and upwards extends deviously along the direction away from the second heat dissipation pipeline 122; Straight shape pipeline section is communicated with the upper end of bending tube section 124, and continues the second end extending upwardly to heat dissipation pipeline 120.By bending tube section 125, heat dissipation pipeline 120 can be arranged, and the area of radiating fin 130 is larger.
Hot junction heat-exchanger rig 100 can also arrange the perfusion of three-way device 160 for cold-producing medium.This three-way device 160 is arranged at a heat dissipation pipeline 120 and is arranged between the tube connector 124 of a heat dissipation pipeline 120 and extension of section, its first end is connected with tube connector, second end is connected with extension of section, and the 3rd end is the normal-closed end being configured to operationally open to receive the cold-producing medium injected from outside.Utilize three-way device 125 to reduce the difficulty of perfusion refrigerant process, and provide means for maintenance.
In the present embodiment, the another kind of this three heat dissipation pipelines exchange device 125 arranges form and is: using three-way device 125 first end directly as the tube connector 124 of this root heat dissipation pipeline 120, second end is connected with extension of section, and its 3rd end is the normal-closed end being configured to operationally open to receive the cold-producing medium injected from outside.Namely three-way device 125 can be used as the connecting portion of connection hot junction heat exchange box 110 inner chamber of heat dissipation pipeline 120.
Cooling fan 140 and the fastening of radiating fin 130 can be realized by following structure: the both sides of cooling fan 140 are provided with anchorage bar 141; The opposing side in heat-transfer surface of radiating fin 130 has the draw-in groove 131 with hook formation; Wherein anchorage bar 141 is installed in draw-in groove 131, to be fixed on radiating fin 130 by cooling fan 140.
Embodiments of the invention additionally provide a kind of semiconductor freezer that make use of above hot junction heat-exchanger rig 100, and the body structure of refrigerator generally also comprises: shell, inner bag, chamber door and heat insulation layer.Generally there are two kinds of structures in outcase of refrigerator, a kind of be pin-connected panel, be namely assembled into a complete casing by top cover, left side plate, postnotum, lower shoe etc.Another kind is monoblock type, by top cover and left side plate on request rolling become one to fall " U " font, be called U shell, be that postnotum, lower shoe point is welded into casing.The semiconductor freezer of the embodiment of the present invention preferably uses monoblock type shell.
Fig. 2 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention; Fig. 3 is the schematic rear view of semiconductor freezer according to an embodiment of the invention; Fig. 4 is that the A of the back of semiconductor freezer is according to an embodiment of the invention to sectional view.The semiconductor freezer of this embodiment can comprise in general manner: any one the hot junction heat-exchanger rig 100 introduced in inner bag (not shown), shell, semiconductor chilling plate (not shown), above-described embodiment.Room between storing is limited with in inner bag.Shell adopts monoblock type shell, includes U shell and back 220, is arranged at the outside of inner bag, and the back 220 of shell is limited with installing space with the rear wall of inner bag.Hot junction heat-exchanger rig 100, be installed into and make the hot junction of the outer surface of the rear wall of its hot junction heat exchange box 110 and semiconductor chilling plate thermally coupled, and be arranged in together with semiconductor chilling plate in installing space, the direction of cooling fan 140 is towards the back 220 of shell, and by the opening on back 220, to the air-supply of refrigerator outside.
For solving the heat dissipation problem in semiconductor chilling plate hot junction, the semiconductor freezer of the present embodiment can also comprise: cold junction heat-exchanger rig, thermally coupled with the cold junction of semiconductor chilling plate, for by indoor between the temperature conduction of cold junction to storing, thus semiconductor chilling plate is utilized to freeze to room between storing.Be introduced below in conjunction with the cold junction heat-exchanger rig of accompanying drawing to the semiconductor freezer of the present embodiment.
Fig. 5 is the schematic explosive view of a kind of cold junction heat-exchanger rig 400 of the semiconductor freezer that can be used for the embodiment of the present invention, and this cold junction heat-exchanger rig 400 can comprise in general manner: cold junction heat exchange box 410 and refrigerant line 420.Wherein cold junction heat exchange box 410 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it.Refrigerant line 420, be configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and the first end being formed as openend of refrigerant line 420 and the second end are all communicated to the bottom of the inner chamber of cold junction heat exchange box, refrigerant line 420 bends inclined downward from its first end and the second end respectively and extends to common extreme lower position, and the reclining with the outer surface of inner bag at least partially of refrigerant line 420.Refrigerant line 420 has continuous print for the free-pouring tube chamber of cold-producing medium.Reclining with the outer surface of inner bag at least partially of every root refrigerant line 420, indoor the cold from cold junction is reached between storing.
In cold junction heat exchange box 410 and refrigerant line 420, the cold-producing medium of perfusion can be carbon dioxide or other refrigeration working mediums, and the groundwater increment of cold-producing medium can draw by by experimental test.Every root refrigerant line 420 down bends to extend to be needed to ensure that liquid cold-producing medium can rely on flowing in pipeline of free gravity.When the cold junction heat-exchanger rig 400 of the present embodiment works, cold-producing medium carries out gas-liquid phase transition in cold junction heat exchange box 410 and refrigerant line 420, carries out thermal cycle.
The antetheca of cold junction heat exchange box 410 is relative with the rear wall of inner bag, and the distance that preferred interval is certain, to ensure that the heat in the hot junction when power failure or operation troubles can not conduct to inner bag.Refrigerant line 420 can extend downward the left and right sidewall of inner bag from the rear wall of inner bag, be communicated with after then bending back rear wall, forms loop.During semiconductor refrigerator work, cold junction temperature declines, by conduction, the corresponding decline of cold junction heat exchange box 410 temperature, undergo phase transition condensation when the cold-producing medium of gaseous state is met cold in casing, change becomes the liquid refrigerant of low temperature, liquid cold-producing medium can lean on gravity dirty along refrigerant pipe 420 tube chamber, in condensation downflow processes, the heat absorbing inner bag is gradually heated phase transformation evaporation, and change becomes gaseous state.Gaseous steam can rise under the promotion of thermal source pressure, and gaseous refrigerant rises to cold junction heat exchange box 110 place and continues condensation, thus circularly cooling, causes the temperature causing room between storing to decline and realizes cooling.
Fig. 6 is the schematic explosive view of the another kind of cold junction heat-exchanger rig 500 of the semiconductor freezer that can be used for the embodiment of the present invention, cold junction heat-exchanger rig 500 can comprise in general manner: cold junction heat exchange box 510 and refrigerant line 520, wherein cold junction heat exchange box 510 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; Many refrigerant lines 520 are many, are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it.The first end being formed as openend of every root refrigerant line 520 is communicated to the bottom of inner chamber, and every root refrigerant line 520 bends extension inclined downward from its first end, ends in the second end that it is formed as blind end.
In cold junction heat exchange box 510 and refrigerant line 520, the cold-producing medium of perfusion can be carbon dioxide or other refrigeration working mediums, and the groundwater increment of cold-producing medium can draw by by experimental test.Every root refrigerant line 520 down bends to extend to be needed to ensure that liquid cold-producing medium can rely on flowing in pipeline of free gravity.When the cold junction heat-exchanger rig 500 of the present embodiment works, cold-producing medium carries out gas-liquid phase transition in cold junction heat exchange box 510 and refrigerant line 520, carries out thermal cycle.
Cold junction heat exchange box 510 can be flat rectangular body shape, and the outer surface of its rear wall is used as heat-transfer surface hot linked with semiconductor chilling plate cold junction.During semiconductor chilling plate energising work, cold junction temperature declines, by conduction, the corresponding decline of cold junction heat exchange box 510 temperature, undergo phase transition condensation when the cold-producing medium of gaseous state is met cold in casing, change becomes the liquid refrigerant of low temperature, and liquid cold-producing medium can lean on gravity dirty along refrigerant line 520 tube chamber, the dirty cold-producing medium of condensation is because the heat absorbing refrigerator inside is heated phase transformation evaporation in refrigerant line 520, and change becomes gaseous state.Gaseous steam can rise under the promotion of thermal source pressure, and gaseous refrigerant rises to cold junction heat exchange box 510 place and continues condensation, thus circularly cooling, causes the temperature causing room between storing to decline and realizes cooling.
This cold junction heat-exchanger rig 500 is similar to the operation principle of above-mentioned cold junction heat-exchanger rig 400, but difference be, adopt many one end close heat dissipation pipeline 520, and and the heat dissipation pipeline 420 of non-formation loop.Adopt the heat dissipation pipeline 520 of this disconnection, production technology is comparatively simple, and can better and the shell of refrigerator assemble, avoid carrying out bending in multiple plane and require connection, reducing the strict demand to processing technology.
Fig. 7 is the schematic explosive view of the another kind of cold junction heat-exchanger rig 600 of the semiconductor freezer that can be used for the embodiment of the present invention, and cold junction heat-exchanger rig 600 can comprise in general manner: cold junction heat-conducting plate 610 and Duo Gen annular heat pipe 620.Cold junction heat-conducting plate 610 is thermally coupled with semiconductor chilling plate cold junction.A part for every root annular heat pipe 620 and cold junction heat-conducting plate contact heat-exchanging, the wall contacts heat exchange of the inner chamber of another part and semiconductor freezer.
The contact surface that cold junction heat-conducting plate 610 contacts with the cold junction of semiconductor chip is coated with Heat Conduction Material, to strengthen heat-transfer effect.Many annular heat pipes 620 are directly embedded in heat-conducting plate 610 or with heat-conducting plate 610 and are welded and fixed, and for convenience of being connected with miscellaneous part, annular heat pipe 620 can select flat structure, enlarge active surface.
The lumen wall of annular heat pipe 620 can have the metal dust structure of sintering by choice for use, and this structure produces capillarity.Under normality, annular heat pipe 620 inside is the gas-liquid two-phase coexisting state of cold-producing medium, and most liquid state is in the lower position in pipe due to self gravitation and is attracted to sintered powder inside, and most gaseous state is positioned at pipe middle and upper part, space.
When the system is operating, semiconductor chip cold junction temperature passes to cold junction heat-conducting plate 610, cold junction heat-conducting plate 610 transfers heat to the heat pipe 620 be in contact with it again, when heat pipe 620 manage interior temperature decline time, in it, liquid refrigerant is caught a cold condensation, be converted into liquid state, by the suction-operated of self gravitation and sintered powder, lower portion flows, and heat pipe 620 bottom contacts with refrigerator inner cavity 220, absorb the temperature of inner chamber 220, thus reduce the temperature of room between storing.The refrigerants vaporize absorbing heat becomes gaseous state, rises to the top of heat pipe 620 under the promotion of thermal source power, reuptakes the temperature of cold junction heat-conducting plate 610, is condensed into liquid state, thus periodic duty.
The shape of every root annular heat pipe 620 can be square or rhombus, wherein, when using square heat pipe, the horizontal part that in square heat pipe 620, position is top and cold junction heat-conducting plate 610 thermo-contact, the back 212 of square heat pipe 620 position horizontal part on the lower and vertical portion and outcase of refrigerator is fitted.When the cold-producing medium of liquid state is positioned at heat pipe 620 horizontal component, the gravity of self cannot cause the backflow of cold-producing medium herein, but the sintered powder of heat pipe 620 inside has capillarity, can produce capillary force, liquid refrigerant is drawn onto heat affected zone.
When using the heat pipe of rhombus, one group of diagonal of rhombus annular heat pipe 620 is vertically arranged, another group diagonal is horizontally disposed with, and a part and the heat-conducting plate 610 of one group of adjacent side that position is top are fixed, and a part for one group of adjacent side that position is top and the back 212 of outcase of refrigerator are fitted.Therefore, also the sintered powder structure of pipe inside can be removed, adopt common light-pipe structure, when liquid refrigerant is dirty, rely on the gravity of self completely.This kind of cold junction heat abstractor 600 without the need to additionally taking refrigerator space, good looking appearance, quiet, friction, safe and reliable.
Fig. 8 is the schematic explosive view of the another kind of cold junction heat-exchanger rig 700 of the semiconductor freezer that can be used for the embodiment of the present invention, cold junction heat-exchanger rig 700 can comprise in general manner: cold junction heat-conducting plate 710, many heat pipe (not shown)s, cold scattering fin 730 and cold scattering blower fans 740, wherein cold junction heat-conducting plate 710 is thermally coupled with semiconductor chilling plate cold junction, ensures can be coated with between heat transfer efficiency to be marked with heat-conducting silicone grease (graphite or other media).A part for every root heat pipe and cold junction heat-conducting plate contact heat-exchanging, with to its another part transition temperature; Cold scattering fin 730 is arranged on another part of many heat pipes, and exposed between storing in room by the opening on inner container of icebox 220; Cold scattering blower fan 740 is for generating the air-flow by fin 730 in room between storing.This kind of cold junction heat-exchanger rig 700, is conducted heat by heat pipe fin, carries out forced convertion by blower fan, and radiating effect is fast, and structure is simple, easy to maintenance, concise production process.
Fig. 9 is the schematic explosive view of the another kind of cold junction heat-exchanger rig 800 of the semiconductor freezer that can be used for the embodiment of the present invention, cold junction heat-exchanger rig 800 can comprise in general manner: cold junction heat exchange box 810, first tube connector 811, second tube connector 812, inflation type evaporator 820, wherein inflation type evaporator 820 comprises evaporation plate 821 and is arranged at the refrigeration pipe 822 that evaporation plate 821 is formed by inflation mode.
Cold junction heat exchange box 810 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; First tube connector 811 and the second tube connector 812, stretches out from the inner chamber bottom of cold junction heat exchange box respectively, and stretches into room between storing by the opening of inner bag; Inflation type evaporator 820 is arranged at chamber interior between storing, its evaporation plate 821 can recline with the inwall of inner container of icebox 822, first end and second end of refrigeration pipe 822 are openend, and be communicated with the second tube connector 812 respectively at the first tube connector 811, to ensure the inner space of refrigeration pipe 822 and cold junction heat exchange box 810, form heat radiation loop.Refrigeration pipe 822 extends downward common extreme lower position respectively from its first end and the second end, refrigeration pipe 822 needs to ensure that liquid cold-producing medium can rely on flowing in pipeline of free gravity, wherein a kind of version of refrigeration pipe 822 is, refrigeration pipe 822 extends to the second end after extending downward minimum point from the snakelike bending of first end straight up.
During semiconductor refrigerator work, cold junction temperature declines, by conduction, the corresponding decline of cold junction heat exchange box 810 temperature, undergo phase transition condensation when the cold-producing medium of gaseous state is met cold in casing, change becomes the liquid refrigerant of low temperature, liquid cold-producing medium can lean on gravity by the first tube connector 811 and the second tube connector 812 dirty along refrigerator pipes 822 tube chamber, in condensation downflow processes, absorb the heat of evaporation plate 821 gradually and to be heated phase transformation evaporation, change becomes gaseous state.Gaseous steam can rise under the promotion of thermal source pressure, and gaseous refrigerant rises to cold junction heat exchange box 810 place and continues condensation, thus circularly cooling, and the temperature of evaporation plate 821 declines and causes the temperature decline causing room between storing to realize cooling.
Figure 10 is the schematic explosive view of the another kind of cold junction heat-exchanger rig 900 of the semiconductor freezer that can be used for the embodiment of the present invention, cold junction heat-exchanger rig 900 can comprise in general manner: cold junction heat exchange box 910, first tube connector 911, second tube connector 912, tube-in-sheet evaporator 920, wherein tube-in-sheet evaporator 820 comprises evaporation plate 821 and is posted by the refrigeration pipe 922 in evaporation plate 921 one side.
Cold junction heat exchange box 910 is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; First tube connector 911 and the second tube connector 912 are as the connecting portion of cold junction heat exchange box 910 and refrigeration pipe 922, and one end is stretched out from the inner chamber bottom of cold junction heat exchange box 910, and the other end connects first end and second end of refrigeration pipe 922 respectively.The tube chamber of refrigeration pipe 922 and the inner space of cold junction heat exchange box 910, cold-producing medium can between refrigeration pipe 922 and cold junction heat exchange box 910 circulating phase-change.Evaporation plate 921 one side has reclined refrigeration pipe 922, and another side directly abuts in the outside of inner container of icebox 220, by inner bag to room refrigeration between storing.
Refrigeration pipe 922 bends inclined downward from its first end and the second end respectively and extends to common extreme lower position.Refrigeration pipe 922 needs to ensure that liquid cold-producing medium can rely on flowing in pipeline of free gravity, wherein a kind of version of refrigeration pipe 922 is, refrigeration pipe 922 extends to the second end after extending downward minimum point from the snakelike bending of first end straight up.
During semiconductor refrigerator work, cold junction temperature declines, by conduction, the corresponding decline of cold junction heat exchange box 910 temperature, undergo phase transition condensation when the cold-producing medium of gaseous state is met cold in casing, change becomes the liquid refrigerant of low temperature, liquid cold-producing medium can lean on gravity by the first tube connector 911 and the second tube connector 912 dirty along the tube chamber of refrigerator pipes 922, in condensation downflow processes, absorb the heat of evaporation plate 921 gradually and to be heated phase transformation evaporation, change becomes gaseous state.Gaseous steam can rise under the promotion of thermal source pressure, and gaseous refrigerant rises to cold junction heat exchange box 910 place and continues condensation, thus circularly cooling, and evaporation plate 921 and inner container of icebox 220 recline, and transmits cold by inner bag 220 to room between storing.
The hot junction heat-exchanger rig introduced by above embodiment and various forms of cold junction heat-exchanger rig are assembled, and constitute the refrigeration system of semiconductor freezer, reliably can ensure the normal work of semiconductor chilling plate, and improve heat exchange efficiency.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (15)
1., for a hot junction heat-exchanger rig for semiconductor freezer, comprising:
Hot junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it;
Many heat dissipation pipelines, are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and
Described in every root, the first end being formed as openend of heat dissipation pipeline is communicated to the top of the inner chamber of described hot junction heat exchange box,
Upwards extending from its first end of heat dissipation pipeline described in every root, ends in the second end that it is formed as blind end;
Radiating fin, is arranged on described many heat dissipation pipelines; With
Cooling fan, is fixed on described radiating fin by retention mechanism, to carry out forced convertion heat radiation to the heat reaching described radiating fin from described many heat dissipation pipelines.
2. hot junction according to claim 1 heat-exchanger rig, wherein
Described hot junction heat exchange box is flat rectangular body shape, and the area of its antetheca be oppositely arranged and rear wall is greater than the area in other faces, and the outer surface of described rear wall is used as heat-transfer surface hot linked with pyrotoxin.
3. hot junction according to claim 2 heat-exchanger rig, wherein
The casing extension edge of described hot junction heat exchange box is provided with multiple installing hole, is fixed in described semiconductor freezer to utilize securing member to be installed by described hot junction heat-exchanger rig.
4. hot junction according to claim 2 heat-exchanger rig, wherein said many heat dissipation pipelines comprise:
The first heat dissipation pipeline be disposed in order in the plane parallel with described rear wall, the second heat dissipation pipeline and the 3rd heat dissipation pipeline, and,
Described first heat dissipation pipeline, described second heat dissipation pipeline and described 3rd heat dissipation pipeline comprise respectively:
Inner chamber tube connector, with described inner space and to extend upwardly to described hot junction heat exchange box outside;
Extension of section, upwards extends from the upper end of described inner chamber tube connector, for arranging described radiating fin.
5. hot junction according to claim 4 heat-exchanger rig, wherein
The extension of section of described second heat dissipation pipeline is the straight shape section vertically arranged;
The extension of section of described first heat dissipation pipeline and described 3rd heat dissipation pipeline comprises respectively:
Bending tube section, is communicated with the upper end of inner chamber tube connector, and upwards extends deviously along the direction away from described second heat dissipation pipeline;
Straight shape pipeline section, is communicated with the upper end of described bending tube section, and continues to extend upwardly to described second end.
6. hot junction according to claim 4 heat-exchanger rig, also comprises:
Three-way device, be arranged in a described heat dissipation pipeline, the first end of described three-way device is connected with described inner space or with described tube connector as described tube connector, its second end is connected with described extension of section, and its 3rd end is the normal-closed end being configured to operationally open to receive the cold-producing medium injected from outside.
7. hot junction according to claim 2 heat-exchanger rig, wherein
The both sides of described cooling fan are provided with anchorage bar;
The opposing side in described heat-transfer surface of described radiating fin has the draw-in groove with hook formation; Wherein
Described anchorage bar is installed in described draw-in groove, to be fixed on described radiating fin by described cooling fan.
8. a semiconductor freezer, comprising:
Semiconductor chilling plate;
Inner bag, is limited with room between storing in it;
Shell, includes U shell and back, is arranged at the outside of described inner bag, and the back of described shell and the rear wall of described inner bag are limited with installing space;
Hot junction according to any one of claim 1 to 7 heat-exchanger rig, it is installed into makes the hot junction of the outer surface of the rear wall of its hot junction heat exchange box and described semiconductor chilling plate thermally coupled, and be arranged in together with described semiconductor chilling plate in described installing space, the direction of described cooling fan is towards the back of described shell.
9. semiconductor freezer according to claim 8, also comprises:
Cold junction heat-exchanger rig, thermally coupled with the cold junction of described semiconductor chilling plate, for the temperature conduction of described cold junction is extremely indoor between described storing.
10. semiconductor freezer according to claim 9, wherein
Described cold junction heat-exchanger rig comprises:
Cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; With
Refrigerant line, is configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and
The first end being formed as openend of described refrigerant line and the second end are all communicated to the bottom of the inner chamber of described cold junction heat exchange box,
Described refrigerant line bends inclined downward from its first end and the second end respectively and extends to common extreme lower position, and the reclining with the outer surface of described inner bag at least partially of described refrigerant line.
11. semiconductor freezers according to claim 9, wherein
Described cold junction heat-exchanger rig comprises:
Cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it; With
Many refrigerant lines, are configured to allow cold-producing medium flow and undergo phase transition heat exchange within it, and
Described in every root, the first end being formed as openend of refrigerant line is communicated to the bottom of described inner chamber,
Described in every root, refrigerant line bends extension inclined downward from its first end, ends in the second end that it is formed as blind end, and the reclining with the outer surface of described inner bag at least partially of refrigerant line described in every root.
12. semiconductor freezers according to claim 9, wherein
Described cold junction heat-exchanger rig comprises:
Cold junction heat-conducting plate, itself and described cold junction are thermally coupled; With
Many annular heat pipes, a part for annular heat pipe described in every root and described cold junction heat-conducting plate contact heat-exchanging, the wall contacts heat exchange of the inner chamber of another part and described semiconductor freezer.
13. semiconductor freezers according to claim 9, wherein
Described cold junction heat-exchanger rig comprises:
Cold junction heat-conducting plate, itself and described cold junction are thermally coupled;
Many heat pipes, a part for heat pipe described in every root and described cold junction heat-conducting plate contact heat-exchanging, with to its another part transition temperature;
Cold scattering fin, is arranged on another part of described many heat pipes, and exposed between described storing in room by the opening on described inner chamber;
Cold scattering blower fan, for generating the air-flow through described cold scattering fin in described inner chamber.
14. semiconductor freezers according to claim 9, wherein
Described cold junction heat-exchanger rig comprises:
Cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it;
First tube connector and the second tube connector, stretch out from the inner chamber bottom of described cold junction heat exchange box respectively, and stretch into room between described storing by the opening of described inner bag;
Inflation type evaporator, comprises evaporation plate and is arranged at the refrigeration pipe that evaporation plate is formed by inflation mode,
The inwall of described evaporation plate and described inner bag reclines,
The first end being formed as openend of described refrigeration pipe is communicated with described second tube connector with described first tube connector respectively with the second end, to be communicated with the inner chamber of described cold junction heat exchange box,
Described refrigeration pipe extends downward common extreme lower position respectively from its first end and the second end.
15. semiconductor freezers according to claim 9, wherein
Described cold junction heat-exchanger rig comprises:
Cold junction heat exchange box, is limited with the inner chamber for being installed in the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow cold-producing medium to undergo phase transition heat exchange within it;
First tube connector and the second tube connector, stretch out from the inner chamber bottom of described cold junction heat exchange box respectively;
Tube-in-sheet evaporator, comprises evaporation plate and is posted by the refrigeration pipe in described evaporation plate one side,
The another side of described evaporation plate and the outer wall of described inner bag recline,
The first end being formed as openend of described refrigeration pipe is communicated with the second tube connector with described first tube connector respectively with described second end, to be communicated with the inner chamber of described cold junction heat exchange box,
Described refrigeration pipe bends inclined downward from its first end and the second end respectively and extends to common extreme lower position.
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| CN106595165B (en) * | 2016-11-10 | 2021-10-22 | 青岛海尔智能技术研发有限公司 | A kind of refrigerator |
| CN114111209A (en) * | 2021-11-05 | 2022-03-01 | 浙江汉恒热电科技有限公司 | Semiconductor electronic cooling and heating box capable of being cooled rapidly based on phase change heat dissipation |
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